Anti-conduction structure, wafer boat and semiconductor process equipment

Abstract

The embodiment of the present application provides a kind of anti-conducting structure, wafer boat and semiconductor process equipment, the anti-conducting structure includes: insulating block, with the through hole for connecting rod to pass through, the side of the insulating block has at least one first positioning part;At least two isolators, each isolator has the second positioning part matched with the first positioning part, so that the isolator can be detachably fixed to the insulating block, when the isolator is fixed to the insulating block, each isolator is mutually fitted to form the accommodating space matched with the insulating block to be arranged around the insulating block, a plurality of fins are formed on each isolator, recess is formed between adjacent two fins.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more specifically to an anti-conduction structure for electrode boats, a wafer boat, and semiconductor process equipment. Background Technology

[0002] Plasma-enhanced chemical vapor deposition (PECVD) is widely used in semiconductor manufacturing technologies such as photovoltaics. A silicon wafer is placed on a graphite boat, which acts as an electrode. When an electric current is applied to the boat, plasma is generated between the two boats. Ionized atoms gradually deposit onto the silicon wafer surface, resulting in the desired thin film. A graphite boat consists of multiple graphite sheets, and ceramic rings are installed between the sheets to prevent electrical conductivity. However, when PECVD needs to deposit conductive films such as polycrystalline silicon films, the deposition of the polycrystalline silicon film on the ceramic rings can cause electrical conductivity between the graphite sheets, preventing normal operation.

[0003] To avoid the conductivity problem of the graphite flakes, a non-conduction structure has been proposed in related technologies, which forms multiple grooves 1 on the surface of the ceramic ring between the graphite flakes, such as... Figure 1 As shown, since it is difficult for gas to enter the groove 1 for deposition, the thin film 2 formed by the vapor deposition process can only be formed on the top of the fins between adjacent grooves 1 and on the outside of the groove 1. In other words, the thin film 2 is broken at the part corresponding to the groove 1 and cannot form a continuous thin film that can connect the two graphite boats, thereby suppressing the conductivity problem between the graphite boats.

[0004] However, this type of anti-conduction structure still has certain shortcomings in terms of daily maintenance. After a period of use, the anti-conduction structure of the graphite boat needs to be cleaned or replaced. This requires disassembling the entire graphite boat, which not only consumes a lot of time and effort, but also frequently disassembling the graphite boat can easily lead to deformation, significantly increasing the breakage rate in the automated wafer insertion process. Summary of the Invention

[0005] In view of this, embodiments of the present invention provide an anti-conduction structure for electrode boats, a wafer boat, and semiconductor process equipment to solve the problem that in the prior art, the anti-conduction structure requires disassembling the entire wafer boat when cleaning or replacement, which causes deformation of the wafer boat.

[0006] According to a first aspect, embodiments of the present invention provide an anti-conduction structure for electrode boats, comprising: an insulating block having a through hole for a connecting rod to pass through, the insulating block having at least one first positioning portion on its side; at least two isolation members, each of the isolation members having a second positioning portion adapted to the first positioning portion, such that the isolation member can be detachably fixed to the insulating block, wherein when the isolation member is fixed to the insulating block, the isolation members are assembled with each other to form an accommodating space adapted to the insulating block to surround the insulating block, and a plurality of fins are formed on each of the isolation members, with a groove formed between two adjacent fins.

[0007] Optionally, the insulating block is a multifaceted prism or cylinder; and / or the shape of the through hole is adapted to the connecting rod, and the through hole is non-circular.

[0008] Optionally, one of the first positioning part and the second positioning part is a positioning recess, and the other of the first positioning part and the second positioning part is a positioning protrusion. The positioning recess is adapted to cooperate with the positioning protrusion to achieve a detachable connection.

[0009] Optionally, the first positioning part is a positioning recess, and the second positioning part is a positioning protrusion; the positioning protrusion includes a connecting part and a snap-fit ​​part, one side of the connecting part is connected to the side of the isolator facing the insulating block, and the snap-fit ​​part is connected to the other side of the connecting part, and the length of the snap-fit ​​part in the direction perpendicular to the axial direction of the through hole is greater than that of the connecting part; the positioning recess includes a first groove, a first opening, and a second opening, the first groove is used to allow the snap-fit ​​part to slide in the first groove along the axial direction of the through hole, the first opening is adapted to the shape of the snap-fit ​​part, the second opening is adapted to the shape of the connecting part, the first opening and the second opening are connected, and the second opening extends along the axial direction of the through hole.

[0010] Optionally, the width of the separator in the axial direction of the through hole is greater than the sum of the widths of the first opening and the second opening in the axial direction of the through hole.

[0011] Optionally, the first positioning part includes a second sliding groove and a first positioning protrusion disposed in the second sliding groove, the second positioning part including the second positioning protrusion; the second sliding groove extends in a direction perpendicular to the axial direction of the through hole; when the isolation member is fixed to the insulating block, the second positioning protrusion slides in the second sliding groove and is positioned and engaged with the first positioning protrusion.

[0012] Optionally, there are two isolation members, each of which is a semi-frame structure. Each isolation member has a second positioning protrusion formed at both ends. The second sliding grooves are formed on opposite sides of the insulating block, and each second sliding groove has two first positioning protrusions. When the isolation member is fixed to the insulating block, the second positioning protrusions of the two isolation members are confined between the two first positioning protrusions.

[0013] Optionally, at least one of the main body of the insulating block, the first positioning part, the main body of the isolator, and the second positioning part is made of an elastic material; and / or at least one of the main body of the insulating block, the first positioning part, the main body of the isolator, and the second positioning part includes carbon fiber material or carbon fiber ceramic composite material; and / or the width of the isolator in the axial direction of the through hole is greater than the width of the second groove in the axial direction of the through hole.

[0014] According to a second aspect, embodiments of the present invention provide an anti-conduction structure for electrode boats, comprising: at least one pair of isolators, wherein each isolator is joined together to form a through hole for a connecting rod to pass through; each isolator has a plurality of fins formed thereon, and a groove is formed between two adjacent fins; each isolator has a rod-shaped portion on one side facing the through hole, and one end of the rod-shaped portion is provided with a snap-fit ​​structure, wherein when the isolators are assembled, the snap-fit ​​structures of a pair of isolators engage with each other.

[0015] Optionally, the shape of the through hole is adapted to the connecting rod, and a through hole is formed on the connecting rod. The axial direction of the through hole is perpendicular to the axial direction of the through hole. When the isolation member is assembled, the rod-shaped portions of a pair of isolation members pass through the through hole of the connecting rod, and the snap-fit ​​structures of the pair of isolation members are engaged with each other in the through hole.

[0016] Optionally, the anti-conduction structure further includes: isolation pads disposed on both sides of the through hole formed by the isolation member in the axial direction.

[0017] Optionally, the isolation pad includes at least two isolation sub-pads, each of which interlocks with the other to form a through hole through which the connecting rod passes.

[0018] Optionally, the isolation pad is integrally formed with the isolation component.

[0019] Optionally, the separator further includes a shielding layer formed on the outside of the fin and disposed around the fin to shield the groove.

[0020] Optionally, the extending direction of the shielding layer is perpendicular to the extending direction of the fin.

[0021] Optionally, the fins extend radially along the through hole; the length of the outermost fin in the axial direction of the through hole is greater than the length of the other fins; there are two shielding layers, each shielding layer is connected to the top of the outermost fin in the axial direction of the through hole, and the two shielding layers extend towards each other in the axial direction of the through hole, with a gap forming between the two shielding layers around the fin.

[0022] Optionally, the fins extend along the axial direction of the through hole; the length of the outermost fin in the radial direction of the through hole is greater than the length of the other fins; there are two shielding layers, each shielding layer is connected to the top of the outermost fin in the radial direction of the through hole, and each shielding layer extends toward the through hole in the radial direction of the through hole, and a gap is formed between each shielding layer and the main body of the isolation member constituting the through hole, surrounding the fins.

[0023] According to a third aspect, embodiments of the present invention provide a wafer boat, comprising: at least two electrode boats; an anti-conduction structure as described in any one of the first or second aspects, disposed between two adjacent electrode boats; and a connecting rod passing through the electrode boats and the anti-conduction structure to fix the electrode boats.

[0024] According to a fourth aspect, embodiments of the present invention provide a semiconductor process apparatus, comprising: a process cavity; a wafer boat as described in the third aspect, disposed within the process cavity; and a support mechanism disposed within the process cavity to support the wafer boat.

[0025] According to embodiments of the present invention, the anti-conduction structure between electrode boats, the wafer boat, and the semiconductor process equipment, since the isolation member and the insulating block are connected in a detachable manner, or the isolation members are connected in a detachable manner, when the wafer boat needs to be cleaned or replaced after a period of use, the isolation member can be removed from the wafer boat for cleaning or replacement separately, without disassembling the entire wafer boat. This avoids deformation of the wafer boat caused by disassembling it, increases the service life of the entire wafer boat, and reduces the maintenance cost of the wafer boat. Attached Figure Description

[0026] The features and advantages of the invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the invention in any way. In the drawings:

[0027] Figure 1 A schematic diagram of an anti-conduction structure in the prior art is shown;

[0028] Figure 2A perspective view of an anti-conduction structure according to an embodiment of the present invention is shown;

[0029] Figure 3 A perspective view of an anti-conduction structure according to another embodiment of the present invention is shown;

[0030] Figure 4 A side view of the anti-conduction structure according to an embodiment of the present invention is shown;

[0031] Figure 5 A disassembled perspective view of the anti-conduction structure according to an embodiment of the present invention is shown;

[0032] Figure 6 It shows along Figure 5 A three-dimensional diagram of the disassembly as seen from the opposite direction;

[0033] Figure 7 It shows Figure 5 A top view of the assembled anti-conduction structure;

[0034] Figure 8 It shows Figure 7 Enlarged view within the dashed box;

[0035] Figure 9 A perspective view of the anti-conduction structure according to another embodiment of the present invention in an unassembled state is shown;

[0036] Figure 10 It shows Figure 9 A schematic cross-sectional view of the anti-conduction structure in the assembled state;

[0037] Figure 11 A perspective view of an anti-conduction structure according to another embodiment of the present invention is shown;

[0038] Figure 12 It shows Figure 11 A three-dimensional schematic diagram of the central anti-conduction structure;

[0039] Figure 13 Disassembly section shown Figure 11 A three-dimensional schematic diagram of the wafer boat after the anti-conduction structure is installed;

[0040] Figure 14 It shows Figure 11 A cross-sectional schematic diagram;

[0041] Figure 15 A perspective view of an anti-conduction structure according to another embodiment of the present invention is shown;

[0042] Figure 16 It shows Figure 15 A three-dimensional schematic diagram of the central anti-conduction structure;

[0043] Figure 17 It shows Figure 15 A cross-sectional schematic diagram;

[0044] Figure 18 A perspective view of an anti-conduction structure according to another embodiment of the present invention is shown;

[0045] Figure 19 It shows Figure 18 A three-dimensional schematic diagram of the central anti-conduction structure;

[0046] Figure 20 It shows Figure 18 A cross-sectional schematic diagram;

[0047] Figure 21 A perspective view of an anti-conduction structure according to another embodiment of the present invention is shown;

[0048] Figure 22 It shows Figure 21 A three-dimensional schematic diagram of the central anti-conduction structure;

[0049] Figure 23 It shows Figure 21 A cross-sectional schematic diagram;

[0050] Figure 24 A schematic diagram of a wafer boat according to an embodiment of the present invention is shown;

[0051] Figure 25 It shows Figure 24 Enlarged schematic diagram of region A in the middle;

[0052] Figure 26 A schematic diagram of a semiconductor process apparatus according to an embodiment of the present invention is shown. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0054] Figures 2 to 4 A schematic diagram of an anti-conduction structure between electrode boats according to an embodiment of the present invention is shown, such as... Figures 2 to 4As shown, an anti-conduction structure 11 is disposed between two electrode boats 12 to prevent conduction between the electrode boats 12. The electrode boats 12, for example, can be made of graphite material and are used to carry the wafer and load radio frequency power. When radio frequency power is loaded onto the electrode boats 12, the reactive gas between two adjacent electrode boats 12 is ionized to form plasma, thereby enabling deposition or etching processes on the wafer carried by the electrode boats 12. Although not shown in the figure, those skilled in the art will understand that... Figures 2 to 4 The wafer boat shown may include multiple electrode boats 12, and an anti-conduction structure 11 is provided between each adjacent electrode boat 12 to prevent short circuits between adjacent electrode boats 12. This invention does not limit the shape of the anti-conduction structure 11; the anti-conduction structure 11 can be as follows: Figure 2 The polyhedron shown (such as a square prism) can also be as follows: Figure 3 The cylinder shown can also be any other shape.

[0055] like Figures 5 to 8 As shown, taking the anti-conduction structure 11 as a square prism as an example, the anti-conduction structure 11 may include an insulating block 111 and two isolating members 112a and 112b. Figures 5 to 8 The example shows two isolation elements 112. Those skilled in the art should understand that more isolation elements are also feasible. For example, when the insulating block 111 is a square prism, four isolation elements 112 can be provided; when the insulating block 111 is an n-sided prism, n isolation elements 112 can be provided; and when the insulating block 111 is a cylinder, any number of isolation elements 112 can be provided. In this embodiment of the invention, the insulating block 111 and the isolation elements 112 can be made of insulating materials, such as ceramic materials; the insulating block 111 and the isolation elements 112 can also be made of any material with an insulating layer deposited on its surface. For example, to make the insulating block 111 and the isolation elements 112 easy to process, easily machinable metal materials can be used to manufacture the insulating block 111 and the isolation elements 112, and one or more insulating layers can be deposited on the surface of the metal material.

[0056] Continue as Figures 5 to 8As shown, the insulating block 111 has a through hole 113 through which the connecting rod 13 passes. The connecting rod 13 is used to pass through the insulating block 111 and the electrode boat 12 to fix the electrode boat 12. For example, all the electrode boats 12 can be fixed with nuts at both ends of the connecting rod 13. The connecting rod 13 can be made of insulating materials such as ceramic. The connecting rod 13 is columnar, and its cross-section can be circular or non-circular. The shape of the through hole 113 on the insulating block 111 is adapted to the shape of the connecting rod 13. In an alternative embodiment, the cross-section of the connecting rod 13 is non-circular, such as elliptical or rectangular, which can prevent the anti-conduction structure 11 from rotating, thereby making the assembled wafer boat more stable. As mentioned above, the shape of the insulating block 111 can be other polyhedral prisms, cylinders, or any other shape.

[0057] Furthermore, the insulating block 111 has at least one first positioning portion 114 on its side. Each isolator 112 has a second positioning portion 115 adapted to the first positioning portion 114, so that the isolator 112 can be detachably fixed to the insulating block 111. In one alternative embodiment, each isolator 112 has one second positioning portion 115, and the number of first positioning portions on the side of the insulating block 111 is the same as the number of isolators 112, so that each isolator 112 can be detachably fixed to the insulating block 111 in a one-to-one correspondence. In other alternative embodiments, each isolator 112 may have multiple second positioning portions 115, then the number of first positioning portions on the side of the insulating block 111 is the same as the sum of the number of second positioning portions 115 of the multiple isolators 112, so that each isolator 112 can be detachably fixed to the insulating block 111 in a one-to-one correspondence. When the spacers 112 are fixed to the insulating block 111, the spacers 112 are assembled to form an accommodating space adapted to the insulating block 111 and arranged around the insulating block 111. Multiple fins 116 are formed on each spacer 112, and a groove 117 is formed between adjacent fins 116. When the wafer boat is fed into the semiconductor process equipment for vapor deposition, the groove 117 prevents gas from entering and depositing within the groove, allowing it to deposit only on the fins 116 of the anti-conduction structure 11. The film deposited on the surface of the anti-conduction structure 11 by the vapor deposition process is broken at the location corresponding to the groove 117, preventing the formation of a continuous film that connects the two electrode boats. This suppresses conduction between the electrode boats 12, thereby ensuring stable operation of the semiconductor process equipment. In this embodiment, the groove 117 extends radially along the through hole 113. Those skilled in the art should understand that the invention is not limited to this. The purpose of the groove 117 is to prevent the deposition of a continuous thin film connecting the two electrode tabs on the surface of the anti-conduction structure 11 during the vapor deposition process. Therefore, those skilled in the art can arbitrarily set the extension direction of the groove according to actual conditions, and the groove can be formed on any side of the insulating member 112 that does not contact the insulating block 111. Those skilled in the art should also understand that the groove 117 does not necessarily have to be straight; it can also be serrated, wedge-shaped, or labyrinthine to further increase the path for gas diffusion into the bottom of the groove, thereby further increasing the anti-conduction capability.

[0058] In the anti-conduction structure of this invention embodiment, since the isolator 112 and the insulating block 111 are connected in a detachable manner, when the wafer boat needs to be cleaned or replaced after a period of use, the isolator 112 can be removed from the wafer boat for cleaning or replacement separately, without disassembling the entire wafer boat. This avoids deformation of the wafer boat caused by disassembling it, increases the service life of the entire wafer boat, and reduces the maintenance cost of the wafer boat.

[0059] In some optional embodiments of the present invention, one of the first positioning part 114 and the second positioning part 115 is a positioning recess, and the other of the first positioning part 114 and the second positioning part 115 is a positioning protrusion. The positioning recess is adapted to cooperate with the positioning protrusion to achieve a detachable connection. Figure 5 and Figure 6 In the example, the first positioning portion 114 is a positioning recess, and the second positioning portion 115 can be a positioning protrusion. Those skilled in the art should understand that the reverse is also possible, that is, the first positioning portion 114 can be a positioning protrusion, and the second positioning portion 115 can be a positioning recess. Of course, since it is desirable to make the depth-to-width ratio of the groove 117 on the spacer 112 sufficiently large, as a preferred embodiment, the positioning recess should not be provided on the spacer 112. Therefore, the first positioning portion 114 is a positioning recess, and the second positioning portion 115 is a positioning protrusion.

[0060] Specifically, the positioning protrusion 115 includes a connecting portion 115a and a snap-fit ​​portion 115b. One side of the connecting portion 115a is connected to the side of the insulating member 112 facing the insulating block 111, and the snap-fit ​​portion 115b is connected to the other side of the connecting portion 115a. The length of the snap-fit ​​portion 115b in the direction perpendicular to the axial direction of the through hole 113 is greater than that of the connecting portion 115b. Figure 5 and Figure 6 In the example, the positioning protrusion 115 is T-shaped, the connecting part 115a is the vertical part of the T-shape, and the snap-fit ​​part 115b is the horizontal part of the T-shape. Correspondingly, the positioning recess 114 includes a first groove 114a, a first opening 114b, and a second opening 114c. The first groove 114a allows the engaging portion 115b to slide within the first groove 114a along the axial direction of the through hole 113. The first opening 114b is adapted to the shape of the engaging portion 115b, allowing the engaging portion 115b of the positioning protrusion 115 to enter the first groove 114a through the first opening 114b. The second opening 114c is adapted to the shape of the connecting portion 115a. The first opening 114b and the second opening 114c are connected. The second opening 114c extends along the axial direction of the through hole 113 to limit the engaging portion 115b of the positioning protrusion 115 to slide along the second opening 114c within the first groove 114a along the axial direction of the through hole 113. Figure 5 and Figure 6 In the example, the first opening 114b and the second opening 114c form a T-shape, with the first opening 114b being the horizontal part of the T-shape and the second opening 114c being the vertical part of the T-shape.

[0061] When the spacer 112 needs to be assembled onto the insulating block 111, the snap-fit ​​portion 115b first enters the first groove 114a through the first opening 114b and slides along the second opening 114c within the first groove 114a in the axial direction of the through hole 113. Since the length of the second opening 114c in the axial direction perpendicular to the through hole 113 is less than that of the snap-fit ​​portion 115b, the spacer 112 can be fixed onto the insulating block 111. When the spacer 112 needs to be removed from the insulating block 111, the snap-fit ​​portion 115b first slides along the second opening 114c within the first groove 114a in the axial direction of the through hole 113 into the first opening 114b. Since the shape of the first opening 114b is adapted to the snap-fit ​​portion 115b, the snap-fit ​​portion 115b can be removed through the first opening 114b, thereby achieving the removal of the spacer 112.

[0062] In some optional embodiments of the present invention, the width of the isolator 112 in the axial direction of the through hole 113 is greater than the sum of the widths of the first opening 114b and the second opening 114c in the axial direction of the through hole 113. Therefore, when the isolator 112 is assembled onto the insulating block 111, the width of the isolator 112 is sufficient to block the first opening 114b and the second opening 114c, preventing gas from entering the first opening 114b and the second opening 114c to form a film during the vapor deposition process, thus preventing blockage of the first groove 114a and preventing the isolator 112 from being easily disassembled.

[0063] In other optional embodiments of the present invention, such as Figure 9 and Figure 10 As shown, the first positioning part 114 includes a second sliding groove 114d and a first positioning protrusion 114e disposed within the second sliding groove 114d, and the second positioning part includes a second positioning protrusion 115. The second sliding groove 114d extends in a direction perpendicular to the axial direction of the through hole 113; when the spacer 112 is fixed to the insulating block 111, the second positioning protrusion 115 slides within the second sliding groove 114d and engages with the first positioning protrusion 114e in a positioning engagement.

[0064] More specifically, there are two spacers 112, each with a semi-frame structure. Each spacer 112 has a second positioning protrusion 115 formed at both ends. Second sliding grooves 114d are formed on opposite sides of the insulating block 111, and each second sliding groove 114d contains two first positioning protrusions 114e. When the spacers 112 are fixed to the insulating block 111, the second positioning protrusions 115 of the two spacers 112 are confined between the two first positioning protrusions 114e. When the spacers 112 need to be assembled onto the insulating block 111, the two spacers 112 are pushed towards the insulating block 111, and the second positioning protrusions 115 of the two spacers 112 slide along the second sliding grooves 114d, passing over the first positioning protrusions 114e of the insulating block 111, thus being confined between the two first positioning protrusions 114e. When it is necessary to remove the isolator 112 from the insulating block 111, the isolator 112 is pulled away from the insulating block 111. The second positioning protrusions 115 of each isolator 112 pass over the first positioning protrusions 114e of the insulating block 111 from opposite directions, thereby achieving unlocking and locking.

[0065] In some optional embodiments of this example, at least one of the main body of the insulating block 111, the first positioning portion 114e, the main body of the isolator 112, and the second positioning portion 115 is made of an elastic material. This allows the elastic material to undergo elastic deformation under external force during the assembly and disassembly of the isolator 112. Consequently, the second positioning protrusion 115 of the isolator 112 can pass over the first positioning protrusion 114e of the insulating block 111 to achieve engagement or disengagement. Specifically, at least one of the main body of the insulating block 111, the first positioning portion 114e, the main body of the isolator 112, and the second positioning portion 115 comprises carbon fiber material or carbon fiber ceramic composite material.

[0066] In some optional embodiments of this example, the width of the spacer 112 in the axial direction of the through hole 113 is greater than the width of the second groove 114d in the axial direction of the through hole 113. Therefore, when the spacer 112 is assembled onto the insulating block 111, the width of the spacer 112 is sufficient to block the second groove 114d, preventing gas from entering the second groove 114d to form a film during the vapor deposition process, thus preventing blockage of the second groove 114d and hindering the smooth disassembly of the spacer 112.

[0067] like Figures 11 to 14 As shown, in another embodiment of the present invention, in an anti-conduction structure for electrode boats, the anti-conduction structure includes at least a pair of isolation members 112, which are joined together to form a through hole 14 for a connecting rod 13 to pass through. Figures 11 to 14The example shows only one pair of isolators 112. Those skilled in the art will understand that two, three, or even more pairs of isolators 112 are also feasible. Two isolators 112a and 112b are joined together to form the through-hole 14. Multiple fins 116 are formed on each isolator 112, and a groove 117 is formed between two adjacent fins 116. When the wafer boat is fed into the semiconductor process equipment for vapor deposition, the groove 117 makes it difficult for gas to enter the groove for deposition. It can only be deposited on the fins 116 of the anti-conduction structure 11. The film deposited by the vapor deposition process on the surface of the anti-conduction structure 11 is broken at the location corresponding to the groove 117, and a continuous film that can connect the two electrode boats cannot be formed, thereby suppressing the conduction between the electrode boats 12, and thus making the semiconductor process equipment work stably. In this embodiment, the groove 117 extends radially along the through hole 14. Those skilled in the art should understand that the invention is not limited to this. The purpose of the groove 117 is to prevent the deposition of a continuous thin film connecting the two electrode tabs on the surface of the anti-conduction structure 11 during the vapor deposition process. Therefore, those skilled in the art can arbitrarily set the extension direction of the groove according to actual conditions, and the groove can be formed on any side of the separator 112 that does not contact the connecting rod 13. Those skilled in the art should also understand that the groove 117 does not necessarily have to be straight; it can also be serrated, wedge-shaped, or labyrinthine to further increase the path for gas diffusion into the bottom of the groove, thereby further increasing the anti-conduction capability.

[0068] Continue as Figures 11 to 14 As shown, each spacer 112 has a rod-shaped portion 115c on the side facing the through hole 14. One end of the rod-shaped portion 115c is provided with a snap-fit ​​structure 115d. When the spacers 112 are assembled, the snap-fit ​​structures 115d of a pair of spacers 112a and 112b engage with each other. The rod-shaped portion 115c can be welded to the spacer 112, for example, by brazing, to ensure the connection strength between the rod-shaped portion 115c and the spacer 112. The rod-shaped portion 115c can be made of an elastic material, thereby facilitating the engagement and disengagement of the snap-fit ​​structures 115d. This elastic material can, for example, include metal materials, carbon fiber materials, or carbon fiber ceramic composite materials.

[0069] In the anti-conduction structure of this invention embodiment, since the various isolation components 112 are assembled in a detachable manner, when the anti-conduction structure needs to be cleaned or replaced after the wafer boat has been used for a period of time, the isolation component 112 can be removed from the wafer boat for cleaning or replacement separately, without disassembling the entire wafer boat. This avoids deformation of the wafer boat caused by disassembling it, increases the service life of the entire wafer boat, and reduces the maintenance cost of the wafer boat.

[0070] In some optional embodiments of this example, the shape of the through hole 14 is adapted to the connecting rod 13, that is, the spacer 112 is directly assembled onto the connecting rod 13. A through hole 131 is formed on the connecting rod 13, the axial direction of the through hole 131 being perpendicular to the axial direction of the through hole 14. When the spacer 112 is assembled, the rod-shaped portions 115c of a pair of spacers 112 pass through the through hole 131 of the connecting rod 13, and the snap-fit ​​structures 115d of a pair of spacers 112 engage with each other within the through hole 131. In this embodiment, since the spacer 112 is assembled onto the connecting rod 13 by passing through the rod-shaped portions 115c and snap-fit ​​structures 115d of the connecting rod 13, rotation of the spacer 112 relative to the connecting rod 13 or movement along the axial direction of the connecting rod 13 can be avoided, making the assembled wafer boat more stable. Figures 11 to 14 In the example, the through hole 14 and the connecting rod 13 are cylindrical in shape. However, the present invention is not limited to this. The through hole 14 and the connecting rod 13 can also be multifaceted cylindrical or any other shape.

[0071] Furthermore, the anti-conduction structure of this embodiment may also include isolation gaskets 15, which are disposed on both sides of the through hole 14 formed by the isolation member 112 in the axial direction. In this embodiment, the isolation gaskets 15 may be integrally disposed with the isolation member 112 or separately disposed with the isolation member 112. When the isolation gaskets 15 are separately disposed from the isolation member 112, preferably, the isolation gaskets 15 may include at least two isolation sub-gaskets, each isolation sub-gasket interlocking with each other to form a through hole through which the connecting rod 13 passes. Thus, when cleaning or replacing the anti-conduction structure, the isolation gaskets 15 can also be disassembled. Those skilled in the art should understand that the isolation gaskets 15 are not mandatory, and the isolation member 112 may also directly contact the electrode boat 12 at both ends of the through hole 14 in the axial direction.

[0072] Unlike the embodiments described above where the fins 116 and grooves 117 extend radially along the through-hole or connecting rod 13, in another embodiment of the present invention, in the anti-conduction structure between electrode boats, such as Figures 15 to 17As shown, the fins 116 and grooves 117 extend along the axial direction of the through-hole. More specifically, the fins 116 are formed on both sides of each isolation member 112 along the axial direction of the through-hole. Furthermore, in this embodiment, the isolation pad 15 is integrally disposed with the isolation member 112. When the wafer boat is fed into the semiconductor process equipment for vapor deposition, the grooves 117 also make it difficult for gas to enter the groove for deposition, and it can only be deposited on the fins 116 of the anti-conduction structure 11. The film deposited by the vapor deposition process on the surface of the anti-conduction structure 11 is broken at the location corresponding to the grooves 117, and a continuous film that can connect the two electrode boats cannot be formed, thereby suppressing the conduction between the electrode boats 12, and thus making the semiconductor process equipment work stably.

[0073] In this embodiment and the embodiments described above, the groove 117 extends along the radial or axial direction of the through hole or connecting rod 13. Those skilled in the art should understand that the present invention is not limited thereto. The purpose of the groove 117 is to prevent the vapor deposition process from depositing a continuous thin film connecting the two electrode boats on the surface of the anti-conduction structure 11. Therefore, those skilled in the art can arbitrarily set the extension direction of the groove 117 according to the actual situation. The groove 117 does not have to be straight. The groove 117 can also be serrated, wedge-shaped or labyrinth-shaped to further increase the path of gas diffusion into the bottom of the groove, thereby further increasing the anti-conduction capability.

[0074] During the PECVD process, the temperature inside the semiconductor process equipment's process chamber can reach 500°C. When the process gas includes silane, silane will undergo thermal decomposition at temperatures exceeding 450°C. Under low pressure conditions in the process recipe, the molecular free path is large. Although the anti-conduction structure in this embodiment has a large groove depth-to-width ratio, amorphous silicon deposition may still occur, thereby reducing the anti-conduction capability. In an optional embodiment of this invention, such as... Figures 18 to 20 As shown, a shielding layer 16 is added to the isolation member 112 of the anti-conduction structure described in the above embodiment. The shielding layer 16 is formed on the outside of the fin 116 and surrounds the fin 116 to shield the groove 117. The extending direction of the shielding layer 16 is perpendicular to the extending direction of the fin 116. More specifically, continuing as... Figures 18 to 20As shown, the fins 116 extend radially along the through-hole 14 or the connecting rod 13; the length of the outermost fin in the axial direction of the through-hole 14 is greater than the length of the other fins. There can be two shielding layers 16, each connected to the top of the outermost fin in the axial direction of the through-hole 14. Various methods can be used to connect the shielding layers 16 to the fins 116, such as welding or riveting. In some alternative embodiments, the shielding layers 16 and the fins 116 are integrally formed. The two shielding layers 16 extend towards each other in the axial direction of the through-hole 14, and a gap 17 is formed between the two shielding layers 16 surrounding the fin. Thus, the shielding layers 16 block most of the groove, and the gap 17 is small enough that very little gas can enter the gap 17, and even less can deposit into the groove 117, thereby further enhancing the anti-conduction capability of the anti-conduction structure. In this embodiment, the shielding layer 16 can be made of an insulating material or an easily machinable material such as metal. Even when the shielding layer 16 is made of an easily machinable material such as metal, an insulating layer still needs to be formed on the surface of the shielding layer 16 to ensure its insulating properties. In this embodiment, the snap-fit ​​structure used to assemble each spacer 112 onto the wafer boat can be referred to the corresponding description in the above embodiments, and will not be repeated here.

[0075] In other optional embodiments of the present invention, such as Figures 21 to 23 As shown, a shielding layer 16 is added to the anti-conduction structure described in the previous embodiment. The fins 116 extend along the axial direction of the through hole 14; the length of the outermost fin in the radial direction of the through hole 14 is greater than the length of the other fins. There are two shielding layers 16, and the two shielding layers 16 are respectively connected to the top of the outermost fin in the radial direction of the through hole 14, for example, by welding, riveting, etc. In some alternative embodiments, the shielding layer 16 is integrally formed with the fin. The two shielding layers 16 extend toward the through hole 14 in the radial direction of the through hole, and the two shielding layers 16 form a gap 17 around the fin with the main body of the isolation member constituting the through hole. Thus, the shielding layer 16 shields most of the groove, and the gap 17 is small enough to further improve the anti-conduction capability of the anti-conduction structure. In this embodiment, the snap-fit ​​structure for assembling each isolation member 112 onto the wafer boat can also refer to the corresponding description in the previous embodiment, and will not be repeated here.

[0076] Accordingly, such as Figure 24 and Figure 25As shown, this embodiment of the invention also provides a wafer boat, which may include at least two electrode boats 12, an anti-conduction structure 11 disposed between two adjacent electrode boats, and a connecting rod 13. The connecting rod 13 passes through each electrode boat 12 and the anti-conduction structure 11 to fix the electrode boat 12. For example, nuts can be used to fix the connecting rod 13 at both ends. The anti-conduction structure 11 can be, for example, the anti-conduction structure in the above embodiment. The electrode boats 12 of the wafer boat can be made of graphite material, hence the wafer boat is also referred to in the art as a graphite boat. Each electrode boat 12 can carry multiple wafers.

[0077] like Figure 26 As shown, this embodiment of the invention also provides a semiconductor process apparatus, which may include: a process cavity 21, a wafer boat 22, and a support mechanism 23. The wafer boat 22 and the support mechanism 23 are disposed within the process cavity 21. The support mechanism 23 is configured to support the wafer boat 22, and the support mechanism 23 may include, for example, at least two support rods to support the wafer boat 22. The wafer boat 22 may, for example, be the wafer boat described in the above embodiment.

[0078] Furthermore, the semiconductor process equipment may also include radio frequency electrodes 24 to apply radio frequency power between two adjacent electrode boats, causing the reactive gas between the two adjacent electrode boats to be ionized to form plasma, thereby enabling deposition or etching processes on the wafer carried by the electrode boats. In an alternative embodiment, the semiconductor process equipment may be, for example, a tubular PECVD equipment.

[0079] For specific details regarding the aforementioned wafer boats and semiconductor process equipment, please refer to the relevant references. Figures 2 to 23 The relevant descriptions and effects in the illustrated embodiments are for understanding purposes only and will not be repeated here.

[0080] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A structure for preventing conduction between electrode boats, characterized in that, include: An insulating block having a through hole for a connecting rod to pass through, the side of the insulating block having at least one first positioning portion; At least two isolation members, each of the isolation members having a second positioning part adapted to the first positioning part, so that the isolation member can be detachably fixed to the insulating block. When the isolation member is fixed to the insulating block, the isolation members are assembled with each other to form an accommodating space adapted to the insulating block to surround the insulating block. Each isolation member has a plurality of fins formed on it, and a groove is formed between two adjacent fins. The first positioning part is a positioning recess, and the second positioning part is a positioning protrusion. The positioning recess is adapted to cooperate with the positioning protrusion to achieve a detachable connection. The positioning protrusion includes a connecting portion and a snap-fit ​​portion. One side of the connecting portion is connected to the side of the isolator facing the insulating block, and the snap-fit ​​portion is connected to the other side of the connecting portion. The length of the snap-fit ​​portion in the direction perpendicular to the axial direction of the through hole is greater than that of the connecting portion. The positioning recess includes a first groove, a first opening, and a second opening. The first groove is used to allow the snap-fit ​​portion to slide within the first groove along the axial direction of the through hole. The first opening is adapted to the shape of the snap-fit ​​portion, and the second opening is adapted to the shape of the connecting portion. The first opening and the second opening are connected, and the second opening extends along the axial direction of the through hole.

2. The anti-conduction structure according to claim 1, characterized in that, The insulating block is a multifaceted prism or a cylinder; and / or The shape of the through hole is adapted to the connecting rod, and the through hole is non-circular.

3. The anti-conduction structure according to claim 1, characterized in that, The width of the separator in the axial direction of the through hole is greater than the sum of the widths of the first opening and the second opening in the axial direction of the through hole.

4. A structure for preventing conduction between electrode boats, characterized in that, include: An insulating block having a through hole for a connecting rod to pass through, the side of the insulating block having at least one first positioning portion; At least two isolation members, each of the isolation members having a second positioning part adapted to the first positioning part, so that the isolation member can be detachably fixed to the insulating block. When the isolation member is fixed to the insulating block, the isolation members are assembled with each other to form an accommodating space adapted to the insulating block to surround the insulating block. Each isolation member has a plurality of fins formed on it, and a groove is formed between two adjacent fins. The first positioning part includes a second slide groove and a first positioning protrusion disposed in the second slide groove; the second positioning part includes a second positioning protrusion. The second groove extends in a direction perpendicular to the axial direction of the through hole; when the isolator is fixed to the insulating block, the second positioning protrusion slides in the second groove and engages with the first positioning protrusion.

5. The anti-conduction structure according to claim 4, characterized in that, There are two isolation members, and the two isolation members are semi-frame structures. The second positioning protrusion is formed at both ends of each isolation member. The second grooves are respectively formed on opposite sides of the insulating block, and two first positioning protrusions are formed in each second groove. When the isolation member is fixed to the insulating block, the second positioning protrusions of the two isolation members are limited between the two first positioning protrusions.

6. The anti-conduction structure according to claim 4, characterized in that, At least one of the main body of the insulating block, the first positioning portion, the main body of the insulating member, and the second positioning portion is made of an elastic material; and / or At least one of the main body of the insulating block, the first positioning part, the main body of the insulating member, and the second positioning part comprises carbon fiber material or carbon fiber ceramic composite material; and / or The width of the isolation member in the axial direction of the through hole is greater than the width of the second groove in the axial direction of the through hole.

7. A structure for preventing conduction between electrode boats, characterized in that, include: At least one pair of spacers, each spacer being joined together to form a through hole for the connecting rod to pass through; each spacer having a plurality of fins, with a groove formed between two adjacent fins; The isolating member has a rod-shaped portion on the side facing the through hole, and one end of the rod-shaped portion is provided with a snap-fit ​​structure. When the isolating member is assembled, the snap-fit ​​structures of a pair of isolating members engage with each other. The shape of the through hole is adapted to the connecting rod, and a through hole is formed on the connecting rod. The axial direction of the through hole is perpendicular to the axial direction of the through hole. When the isolation member is assembled, the rod-shaped portions of a pair of isolation members are used to pass through the through hole of the connecting rod, and the snap-fit ​​structures of a pair of isolation members are engaged with each other in the through hole.

8. The anti-conduction structure according to claim 7, characterized in that, Also includes: An isolation gasket is disposed on both sides of the through hole formed by the isolation member in the axial direction.

9. The anti-conduction structure according to claim 8, characterized in that, The isolation pad includes at least two isolation sub-pads, each of which interlocks to form a through hole through which the connecting rod passes.

10. The anti-conduction structure according to claim 8, characterized in that, The isolation pad is integrally formed with the isolation component.

11. The anti-conduction structure according to any one of claims 1 to 10, characterized in that, The isolation element also includes: A shielding layer is formed on the outside of the fins and disposed around the fins to shield the grooves.

12. The anti-conduction structure according to claim 11, characterized in that, The extension direction of the shielding layer is perpendicular to the extension direction of the fins.

13. The anti-conduction structure according to claim 12, characterized in that, The fins extend radially along the through-hole; the outermost fin in the axial direction of the through-hole has a longer length than the other fins. There are two shielding layers, each connected to the top of the outermost fin in the axial direction of the through hole, and the two shielding layers extend towards each other in the axial direction of the through hole, with a gap forming between the two shielding layers around the fin.

14. The anti-conduction structure according to claim 12, characterized in that, The fins extend along the axial direction of the through hole; the outermost fin in the radial direction of the through hole has a longer length than the other fins. There are two shielding layers. The two shielding layers are respectively connected to the top of the outermost fin in the radial direction of the through hole, and the two shielding layers extend toward the through hole in the radial direction of the through hole. A gap is formed between the two shielding layers and the main body of the isolation member constituting the through hole, surrounding the fin.

15. A wafer boat, characterized in that, include: At least two electrode boats; The anti-conduction structure according to any one of claims 1-14 is disposed between two adjacent electrode boats; A connecting rod passes through the electrode boat and the anti-conduction structure to fix the electrode boat.

16. A semiconductor process apparatus, characterized in that, include: Process cavity; The wafer boat of claim 15 is disposed within the process cavity; A support mechanism is disposed within the process cavity to support the wafer boat.

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