A device and process for collecting wafer id information of a recycled silicon wafer

Abstract

The application discloses a kind of regenerative silicon wafer Wafer ID information collection device and collection process, including support base, the support base upper end is equipped with the bearing device for placing silicon wafer, the bearing device one side is equipped with detection device, the bearing device includes bearing base and cover, the bearing base and cover time form containing interval, the containing interval inside rotation is connected with the adsorption platform for adsorbing silicon wafer, the bearing device inside is equipped with electric control device for driving adsorption platform directional rotation, the bearing device is located close to detection device one side and is opened observation window, and opposite side is opened feeding opening.The application can improve the accuracy of silicon wafer information entry, and prevent pollution source diffusion on the side of detection.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer inspection technology, and in particular to a device and process for collecting wafer ID information from reclaimed silicon wafers. Background Technology

[0002] With the development of integrated circuits, wafer surface treatment processes are becoming increasingly complex, and the components used are becoming more diverse. Currently, wafer surfaces in semiconductor manufacturing can be broadly classified into Baer, ​​oxide, nitride, poly, metal, organic film (resistance), pattern film, and Higk-K surface states. Processing routes are also differentiated between copper and non-copper lines. Classifying and sorting these states is particularly important in the recycling industry. Semiconductor factories often use a type of test wafer to simulate real products and test whether equipment and processes are operating normally. After different processes and multiple uses, these test wafers become contaminated and damaged, rendering the silicon wafers unusable. To reduce costs, these test wafers are recycled, processed to meet standards, and then reused in semiconductor factories—this is the wafer recycling process.

[0003] Currently, wafer ID collection is done after wafer separation. The product needs to pass through the measuring machine to measure the incoming wafer parameters while the wafer ID is being collected. However, the product has already entered the machine and the cleanroom, so we cannot effectively intercept contaminated wafer sources (copper). The contaminants it carries will spread during the detection process. After environmental pollution, it takes about a week to clean up the environment to meet the production environment requirements, which seriously affects the production flow of the production line. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a device and process for collecting wafer ID information from recycled silicon wafers, which can improve the accuracy of silicon wafer information recording and prevent contamination sources from spreading to the detection side.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A device for collecting wafer ID information of recycled silicon wafers includes a support base, a carrier device for placing silicon wafers is installed on the upper end of the support base, a detection device is provided on one side of the carrier device, the carrier device includes a carrier base and a cover, the carrier base and the cover form a receiving area, an adsorption platform for adsorbing silicon wafers is rotatably connected inside the receiving area, an electronic control device is provided inside the carrier device for driving the adsorption platform to rotate in an orientation, an observation window is opened on the side of the carrier device near the detection device, and a feeding opening is opened on the opposite side, a feeding device is provided on one side of the feeding opening, a sealing baffle adapted to the size of the feeding opening is provided at the end of the feeding device, an air vent is provided on one side of the observation window, and an air suction connector is provided on the side wall of the sealing baffle.

[0006] Preferably, the vertical position of the air intake connector corresponds to the vertical position of the adsorption platform, and there are multiple air outlets that are linearly distributed along the length of the observation window, forming a circulating airflow through the silicon wafer between the air outlets and the air intake connector.

[0007] Preferably, the feeding device includes a feeding base, a rotating joint is provided on the surface of the feeding base, a lifting joint is provided at the end of the rotating joint, a transfer hand is fixedly connected to the lifting end of the lifting joint, and the sealing baffle is fixedly connected to the transfer hand.

[0008] Preferably, the bottom of the support base is provided with a recessed area adapted to the transfer hand, and a sensing device for detecting position is provided between the sealing baffle and the support device.

[0009] Preferably, the carrier device is provided with a cleaning device, which includes a cleaning end, and the cleaning end is controlled to be in a predetermined position to achieve continuous cleaning of the edge portion of the silicon wafer.

[0010] Preferably, the cleaning device further includes a limiting body for installing the cleaning end and a control rod for controlling the rotation of the cleaning end. The cleaning end includes a limiting post and a cleaning post. The top end of the limiting post and the top end of the cleaning post are fixedly connected by a connecting workpiece. The limiting post is rotatably connected to the limiting body and is provided with a torsional elastic element. The end of the control rod passes through the limiting body and is fixedly connected to the limiting post.

[0011] Preferably, the limiting body includes a limiting cylinder, and a control piston is slidably connected to the inner wall of the limiting cylinder. The upper end of the control piston is provided with a first connecting rod fixedly connected to the limiting post, and the lower end is provided with a second connecting rod fixedly connected to the control rod. The control piston and the limiting cylinder form a control chamber, and an air control device is connected outside the control chamber to drive the control piston to move up and down.

[0012] A process for collecting wafer ID information from recycled silicon wafers includes the following steps: S1. Silicon Wafer Loading: The silicon wafers in the material box are transferred to the adsorption platform in the carrier device by the loading device. The adsorption platform adsorbs and fixes the silicon wafers, thus completing the silicon wafer loading. S2, Inspection Preparation: After the silicon wafer is loaded in S1, a circulating airflow is formed between the air outlet and the air intake connector, passing through the silicon wafer, thus completing the inspection preparation. S3. Imaging and Inspection: After the inspection preparation in S2 is completed, the silicon wafer is oriented and rotated by the adsorption platform, and the silicon wafer is imaged and inspected by the inspection device.

[0013] Preferably, after the silicon wafer has been adsorbed by the adsorption platform, the transfer hand is controlled to descend vertically by the lifting joint, so that the transfer hand is offset from the silicon wafer by a predetermined distance.

[0014] Preferably, during the process of controlling the rotation of the silicon wafer by the adsorption platform, the cleaning column is pressed against the surface of the silicon wafer to complete the continuous cleaning of the sidewalls of the silicon wafer.

[0015] Compared with the prior art, the beneficial effects of this invention are as follows: 1. By setting up a carrier device, silicon wafers can be placed in a relatively isolated area for information detection and collection. An observation window is opened on the side of the carrier device close to the detection device, which removes the light transmission barrier, increases the light transmittance, and improves the accuracy of information collection. Furthermore, by setting up vent holes and suction connectors, directional circulation of gas can be achieved within the carrier device, preventing contaminants carried by the carrier device from leaking from the observation window side, protecting the detection environment, and improving the production capacity of the detection line.

[0016] 2. By setting up a cleaning device, the edges of rotating silicon wafers can be cleaned, enabling continuous cleaning of the wafer edges during information entry and removing residual materials, thus improving the accuracy of silicon wafer information entry. Furthermore, by controlling the limiting posts, connecting workpieces, and cleaning posts, the cleaning posts can be positioned at different locations, enabling adaptation testing of silicon wafers of different sizes. Controlling the up-and-down movement of the cleaning posts allows different positions of the posts to contact the silicon wafers, increasing the cleaning capacity of the posts in a single pass, reducing replacement cycles, improving the efficiency of information detection and entry, and further increasing production line capacity. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of a regenerated silicon wafer ID information collection device proposed in this invention; Figure 2 This is a schematic diagram of the main structure of a regenerated silicon wafer ID information collection device proposed in this invention; Figure 3 This is a side view of the structure of a regenerated silicon wafer ID information collection device proposed in this invention; Figure 4 This is a top view schematic diagram of a regenerated silicon wafer ID information collection device proposed in this invention; Figure 5 This is an exploded structural diagram of the support device for a regenerated silicon wafer ID information collection device proposed in this invention; Figure 6 This invention proposes a device for collecting wafer ID information from recycled silicon wafers. Figure 5 Front view structural diagram; Figure 7 This invention proposes a device for collecting wafer ID information from recycled silicon wafers. Figure 6 A magnified structural diagram at point A.

[0018] In the diagram: 100, Support base; 200, Bearing device; 210, Bearing base; 211, Adsorption platform; 212, Sinking area; 213, Air outlet; 220, Cover; 230, Observation window; 300, Detection device; 400, Feeding device; 410, Rotating joint; 420, Lifting joint; 430, Transfer hand; 500, Sealing baffle; 510, Suction connector; 600, Cleaning device; 610, Control rod; 620, Limiting body; 621, Limiting cylinder; 622, First connecting rod; 623, Control piston; 624, Second connecting rod; 630, Cleaning end; 631, Limiting post; 632, Connecting workpiece; 633, Cleaning post; 700, Sensing device; 800, Silicon wafer. Implementation

[0019] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0021] Reference Figures 1-7 A regenerated silicon wafer ID information collection device includes a support base 100, a carrier device 200 for placing a silicon wafer 800 is installed on the upper end of the support base 100, and a detection device 300 is provided on one side of the carrier device 200. The silicon wafer 800 is placed inside the carrier device 200, and the position of the detection device 300 corresponds to the position of the silicon wafer 800. By controlling the rotation of the silicon wafer 800 and detecting the surface of the silicon wafer 800 through the detection device 300 on one side, the information collection process is completed.

[0022] The carrier device 200 includes a carrier base 210 and a cover 220. The carrier base 210 and the cover 220 form a receiving area. An adsorption platform 211 for adsorbing silicon wafers 800 is rotatably connected inside the receiving area. An electronic control device is installed inside the carrier device 200 to drive the adsorption platform 211 to rotate in an directional manner. A negative pressure suction cup is provided on the surface of the adsorption platform 211. The silicon wafer 800 is placed on a predetermined position on the surface of the adsorption platform 211 so that the axes of the two coincide. The adsorption platform 211 is controlled by the electronic control device to drive the silicon wafer 800 to rotate in an directional manner, so that each position of the side wall of the silicon wafer 800 rotates to one side of the detection device 300, thus completing the detection process of each position of the silicon wafer 800 in the circumferential direction.

[0023] To protect the surrounding testing environment and prevent internal contaminants from leaking and affecting it, and to overcome the problems associated with transparent testing windows, an observation window 230 is provided on the side of the carrier device 200 closest to the testing device 300. The opening of the observation window 230 corresponds to the position of the testing device 300, allowing the outer testing device 300 to directly image and inspect the internal silicon wafer 800 through the observation window 230. A loading opening is provided on the opposite side, and a loading device 400 is installed on one side of the loading opening. The loading process of silicon wafer 800 is completed by placing the silicon wafer 800 at a predetermined position on the surface of the adsorption platform 211. The loading device 400 is equipped with a sealing baffle 500 that matches the size of the loading opening. The size of the sealing baffle 500 is the same as that of the loading opening. When the two overlap, the sealing baffle 500 can seal the loading opening, so that the internal accommodating area of ​​the carrier device 200 forms a relatively isolated chamber, further preventing the leakage of contaminants carried by the silicon wafer 800 and reducing the impact on the testing environment.

[0024] It should be noted that the loading device 400 and the detection device 300 of the silicon wafer 800 are located in two relatively isolated detection rooms, which realizes the isolation control process and avoids the spread of surface contaminants of the silicon wafer 800 during the loading process.

[0025] Furthermore, an air outlet 213 is provided on one side of the observation window 230, and an air intake connector 510 is provided on the side wall of the sealing baffle 500. Gas can be blown out through the air outlet 213 and gas can be drawn in through the air intake connector 510. A circulation system with a filter device can be set between the two to allow the circulating air to flow in a directional manner, passing through the silicon wafer 800 from the side of the air outlet 213 to the side of the air intake connector 510, thus realizing the circulation process. Through the above arrangement, the contaminants carried by the silicon wafer 800 are collected as the circulating air flows in a directional manner, preventing them from leaking from the open observation window 230 side and avoiding any impact on the testing environment.

[0026] Preferably, the vertical position of the suction connector 510 corresponds to the vertical position of the adsorption platform 211. There are multiple air outlets 213, which are linearly distributed along the length of the observation window 230. The length of the multiple air outlets 213 corresponds to the length of the observation window 230. A circulating airflow is formed between the air outlets 213 and the suction connector 510, which passes through the silicon wafer 800. The circulating airflow passes through the silicon wafer 800 from the top and bottom sides, carrying away contaminants on the surface of the silicon wafer 800, avoiding contaminant leakage and affecting the surrounding detection environment.

[0027] Please refer to the appendix for details. Figure 2 The feeding device 400 includes a feeding base with a rotating joint 410 on its surface and a lifting joint 420 at the end of the rotating joint 410. A transfer hand 430 is fixedly connected to the lifting end of the lifting joint 420. A sealing baffle 500 is fixedly connected to the transfer hand 430. By setting the rotating joint 410, the transfer hand 430 can be controlled to move to different positions to transport the silicon wafer 800, transferring the silicon wafer 800 in the material box to the adsorption platform 211 for the inspection process of the silicon wafer 800. The lifting joint 420 can control the up and down movement of the transfer hand 430. After the silicon wafer 800 is placed, the transfer hand 430 and the silicon wafer 800 are staggered. At this time, the adsorption platform 211 is used to adsorb the silicon wafer 800, realizing the transfer and facilitating the subsequent rotation inspection of the silicon wafer 800. The sealing baffle 500 moves synchronously with the transfer hand 430, and can move to one side of the carrier device 200 to abut against the feeding opening side to complete the sealing process.

[0028] Furthermore, a recessed area 212 adapted to the transfer hand 430 is provided at the bottom of the support base 210. A sensing device 700 for detecting position is provided between the sealing baffle 500 and the support device 200. The sensing device 700 can sense the vertical position of the sealing baffle 500. By setting the recessed area 212, the end of the transfer hand 430 can be lowered and offset from the silicon wafer 800. This can prevent the transfer hand 430 from blocking the circulating airflow below and hindering the discharge of pollutants. It should be noted that both the recessed area 212 and the transfer hand 430 are U-shaped. After the transfer hand 430 places the silicon wafer 800 in the predetermined position, the transfer hand 430 is located on the horizontal projection surface of the recessed area 212. The sensing device 700 can be a touch sensor switch or a laser sensor switch. When the sealing baffle 500 is lowered by a predetermined distance and offset from the silicon wafer 800, the transfer hand 430 and the silicon wafer 800 are offset from each other, and the transfer hand 430 is accommodated in the recessed area 212.

[0029] A cleaning device 600 is provided inside the carrier device 200. The cleaning device 600 includes a cleaning end 630. By controlling the cleaning end 630 to be in a predetermined position, continuous cleaning of the edge of the silicon wafer 800 can be achieved. By continuously cleaning the edge of the silicon wafer 800, residual substances on its surface are removed, which can better detect and capture the engraving information and defect information at the edge of the silicon wafer 800, so as to achieve accurate detection and information entry of the silicon wafer 800 and realize an efficient detection process.

[0030] Please refer to the appendix for details. Figure 5 -Appendix Figure 7As a preferred cleaning method, the cleaning device 600 further includes a limiting body 620 for mounting the cleaning end 630 and a control rod 610 for controlling the rotation of the cleaning end 630. The cleaning end 630 includes a limiting post 631 and a cleaning post 633. The top end of the limiting post 631 and the top end of the cleaning post 633 are fixedly connected by a connecting workpiece 632. The limiting post 631 is rotatably connected to the limiting body 620 and is provided with a torsional elastic element, such as a torsional spring. The end of the control rod 610 passes through the limiting body 620 and is fixedly connected to the limiting post 631. The control rod 610 can control the rotation of the limiting post 631 of the cleaning end 630. There is a gap between the 31 and the cleaning column 633 and they are connected by the connecting workpiece 632. By controlling the rotation of the limiting column 631, the cleaning column 633 can be placed in different positions, so that the cleaning column 633 abuts against the edge of the silicon wafer 800 to realize the inspection process. By rotating the limiting column 631 to place the cleaning column 633 in different positions, the cleaning column 633 can abut against the edge of the silicon wafer 800 of different sizes to realize the appropriate inspection process. The surface of the cleaning column 633 can be bonded with a cleaning sleeve, which cleans the edge of the silicon wafer 800, removes the contamination residue on the edge, and exposes the engraving code and defects, thereby improving the accuracy of information entry.

[0031] It should be noted that the torsion elastic element keeps the cleaning column 633 in a normally open state, that is, the cleaning column 633 is on the side away from the silicon wafer 800. The control rod 610 controls the cleaning column 633 to rotate inward to a predetermined position, so as to abut against the edge of the silicon wafer 800 and realize the cleaning process. By setting the torsion elastic element to keep the whole in a normally open state, it is possible to avoid mutual interference between the silicon wafer 800 and the equipment during the process of moving the equipment up and down, and to avoid damage to the equipment and the silicon wafer 800 during the information collection process, thus avoiding economic losses.

[0032] Please refer to the appendix for details. Figure 7The limiting body 620 includes a limiting cylinder 621. A control piston 623 is slidably connected to the inner wall of the limiting cylinder 621. The upper end of the control piston 623 is provided with a first connecting rod 622 fixedly connected to the limiting post 631, and the lower end is provided with a second connecting rod 624 fixedly connected to the control rod 610. Both sides are fixedly connected. The control piston 623 and the limiting cylinder 621 form a control chamber. Two sealed control chambers can be selected. An external pneumatic control device is connected to the control chamber to drive the control piston 623 to move up and down reciprocally. The aforementioned pneumatic control device can be two pneumatic control pipes connected to the control chamber. By alternately controlling the gas flow, the position of the control piston 623 is driven and controlled, allowing it to be in different positions, thereby controlling the position of the end cleaning column 633. By placing the cleaning column 633 in different positions, different parts of the cleaning sleeve can come into contact with the silicon wafer 800, improving the cleaning efficiency of the cleaning sleeve. It can clean multiple silicon wafers 800 at once. Similarly, during the cleaning process, the cleaning sleeve can be controlled to be in different positions to apply cleaning force to the side of the silicon wafer 800, improving the cleaning effect of the silicon wafer 800 and improving the accuracy of information collection and entry.

[0033] A process for collecting wafer ID information from recycled silicon wafers includes the following steps: S1. Silicon wafer loading: The silicon wafer 800 in the material box is transferred to the adsorption platform 211 in the carrier device 200 by the loading device 400. The adsorption platform 211 adsorbs and fixes the silicon wafer 800, thus completing the silicon wafer loading. The silicon wafer 800 is placed at a predetermined position above the adsorption platform 211. The adsorption platform 211 uses the suction cup assembly at the top to adsorb the silicon wafer 800, so that the silicon wafer 800 is aligned with the rotation axis of the adsorption platform 211.

[0034] S2, Test Preparation: After the silicon wafer is loaded in S1, control the vent 213 to blow out gas, and the suction connector 510 to absorb the gas. A circulating airflow through the silicon wafer 800 is formed between the vent 213 and the suction connector 510, completing the test preparation. At this time, a directional airflow circulation is formed, and the pollutants flow in a directional direction toward the suction connector 510 and are absorbed and filtered, minimizing the leakage of the pollution source and ensuring that the test environment meets the test requirements.

[0035] S3. Imaging and Inspection: After the inspection preparation in S2 is completed, the silicon wafer 800 is oriented and rotated by the adsorption platform 211, and the silicon wafer 800 is imaged and inspected by the inspection device 300. During the rotation of the silicon wafer 800, the inspection device 300 on one side of the silicon wafer 800 can continuously image and inspect the edge part of the silicon wafer 800 to realize the detection and input of information. Then, the information obtained from the inspection is compared with the information in the database for judgment.

[0036] After the adsorption platform 211 has adsorbed the silicon wafer 800, the lifting joint 420 controls the transfer hand 430 to descend vertically, so that the transfer hand 430 is offset from the silicon wafer 800 by a predetermined distance. At this time, the transfer hand 430 sinks into the sinking area 212 and is offset from the silicon wafer 800. This avoids affecting the detection of the rotation information of the silicon wafer 800, while reducing the resistance to the air circulation, allowing the pollutants to be absorbed and filtered by the air intake joint 510 to the greatest extent, thus optimizing the internal detection environment.

[0037] Furthermore, during the process of controlling the rotation of the silicon wafer 800 by the adsorption platform 211, the cleaning column 633 is pressed against the surface of the silicon wafer 800 to complete the continuous cleaning of the sidewall of the silicon wafer 800. During the rotation of the silicon wafer 800, the cleaning column 633 can clean the surface of the silicon wafer 800, remove residual contaminants at the edges, and improve the accuracy of information entry.

[0038] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A device for collecting wafer ID information of recycled silicon wafers, comprising a support base (100), wherein a carrier device (200) for placing silicon wafers (800) is mounted on the upper end of the support base (100), and a detection device (300) is provided on one side of the carrier device (200), characterized in that: The carrier device (200) includes a carrier base (210) and a cover (220). A receiving area is formed between the carrier base (210) and the cover (220). An adsorption platform (211) for adsorbing silicon wafers (800) is rotatably connected inside the receiving area. An electrical control device is provided inside the carrier device (200) to drive the adsorption platform (211) to rotate in an orientation. An observation window (230) is opened on the side of the carrier device (200) close to the detection device (300), and a feeding opening is opened on the opposite side. A feeding device (400) is provided on one side of the feeding opening. A sealing baffle (500) adapted to the size of the feeding opening is provided at the end of the feeding device (400). An air outlet (213) is provided on one side of the observation window (230), and an air suction connector (510) is provided on the side wall of the sealing baffle (500). The vertical position of the air intake connector (510) corresponds to the vertical position of the adsorption platform (211). There are multiple air outlets (213) that are linearly distributed along the length of the observation window (230). A circulating airflow through the silicon wafer (800) is formed between the air outlets (213) and the air intake connector (510).

2. The device for collecting wafer ID information of recycled silicon wafers according to claim 1, characterized in that, The feeding device (400) includes a feeding base, a rotating joint (410) is provided on the surface of the feeding base, a lifting joint (420) is provided at the end of the rotating joint (410), a transfer hand (430) is fixedly connected to the lifting end of the lifting joint (420), and the sealing baffle (500) is fixedly connected to the transfer hand (430).

3. The device for collecting wafer ID information of recycled silicon wafers according to claim 2, characterized in that, The bottom of the support base (210) is provided with a sinking area (212) adapted to the transfer hand (430), and a sensing device (700) for detecting position is provided between the sealing baffle (500) and the support device (200).

4. The device for collecting wafer ID information of recycled silicon wafers according to claim 1, characterized in that, The carrier device (200) is provided with a cleaning device (600), which includes a cleaning end (630). The cleaning end (630) is controlled to be in a predetermined position to achieve continuous cleaning of the edge portion of the silicon wafer (800).

5. The device for collecting wafer ID information of recycled silicon wafers according to claim 4, characterized in that, The cleaning device (600) further includes a limiting body (620) for installing the cleaning end (630) and a control rod (610) for controlling the rotation of the cleaning end (630). The cleaning end (630) includes a limiting post (631) and a cleaning post (633). The top end of the limiting post (631) and the top end of the cleaning post (633) are fixedly connected by a connecting workpiece (632). The limiting post (631) is rotatably connected to the limiting body (620) and is provided with a torsional elastic element. The end of the control rod (610) passes through the limiting body (620) and is fixedly connected to the limiting post (631).

6. The device for collecting wafer ID information of recycled silicon wafers according to claim 5, characterized in that, The limiting body (620) includes a limiting cylinder (621), and a control piston (623) is slidably connected to the inner wall of the limiting cylinder (621). The upper end of the control piston (623) is provided with a first connecting rod (622) fixedly connected to the limiting post (631), and the lower end is provided with a second connecting rod (624) fixedly connected to the control rod (610). The control piston (623) and the limiting cylinder (621) form a control chamber. An air control device is connected outside the control chamber to drive the control piston (623) to move up and down.

7. A process for collecting wafer ID information from recycled silicon wafers, characterized in that, Using the recycled silicon wafer ID information collection device according to any one of claims 1-6, the method includes the following steps: S1. Silicon wafer loading: The silicon wafer (800) in the material box is transferred to the adsorption platform (211) in the carrier device (200) by the loading device (400). The silicon wafer (800) is adsorbed and fixed by the adsorption platform (211) to complete the silicon wafer loading. S2, Inspection Preparation: After the silicon wafer is loaded in S1, a circulating airflow through the silicon wafer (800) is formed between the air outlet (213) and the air intake connector (510) to complete the inspection preparation; S3, Imaging and Inspection: After the inspection preparation in S2 is completed, the silicon wafer (800) is oriented and rotated by the adsorption platform (211), and the silicon wafer (800) is imaged and inspected by the inspection device (300).

8. The process for collecting wafer ID information from recycled silicon wafers according to claim 7, characterized in that, After the silicon wafer (800) is adsorbed on the adsorption platform (211), the transfer hand (430) is controlled to descend vertically by the lifting joint (420) so that the transfer hand (430) and the silicon wafer (800) are staggered by a predetermined distance.

9. The process for collecting wafer ID information from recycled silicon wafers according to claim 7, characterized in that, During the process of the adsorption platform (211) controlling the rotation of the silicon wafer (800), the cleaning column (633) is pressed against the surface of the silicon wafer (800) to complete the continuous cleaning of the sidewall of the silicon wafer (800).

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