Display unit, method of manufacturing the same and display device

Abstract

The application relates to a display unit, a manufacturing method thereof and a display device. The display unit comprises a display panel and a circuit board. The display panel comprises a substrate, a driving structure layer and an LED light-emitting layer arranged in sequence, a plurality of through holes are formed in the substrate, a connecting piece is arranged in each through hole, the driving structure layer is provided with a plurality of first driving lines, and each first driving line is electrically connected to one end of at least one connecting piece. The circuit board is provided with a plurality of second driving lines and a plurality of connecting areas, each second driving line is electrically connected to at least one connecting area, the plurality of connecting areas are electrically connected to the other ends of the plurality of connecting pieces one by one, and the thickness of the second driving line is greater than the thickness of the first driving line. The display unit arranges the thicker second driving line on the circuit board, the copper thickness is considered, the problem that the driving line on the substrate is too thick is avoided, and the problem that a serious voltage drop exists on the driving line on the substrate is improved or solved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display unit, its manufacturing method, and a display device. Background Technology

[0002] COG (Chip On Glass) is one of the solutions for Mini / Micro LED display technology. It fixes the chip on the glass and uses the flip chip conduction method to directly align the chip with the electrodes on the glass substrate. It uses anisotropic conductive film material as the bonding material to make the electrodes of the two bonded objects conduct in the perpendicular direction.

[0003] The COG (Chip-on-Glass) solution's driving method and precision can meet the requirements of high resolution. The maximum brightness required for a single Mini / Micro LED display unit is 10uA to 100uA, necessitating a driving line thickness of tens of micrometers. However, this design leads to inconsistent pad thickness, easily causing chip soldering defects and poor contact. Therefore, the driving line cannot be made tens of micrometers thick, but this results in a severe voltage drop (IR drop) problem on the driving line. Summary of the Invention

[0004] Therefore, it is necessary to provide a display unit, its manufacturing method, and a display device to address the problem of severe resistance voltage drop on the drive lines of the drive circuit.

[0005] A display unit, comprising:

[0006] The display panel includes a substrate, a driving structure layer, and an LED light-emitting layer arranged sequentially. The substrate has multiple through-holes, each containing a connector. The driving structure layer has multiple first driving lines, each electrically connected to one end of at least one of the connectors.

[0007] The circuit board has multiple second drive lines and multiple connection areas. Each second drive line is electrically connected to at least one of the connection areas. The multiple connection areas are electrically connected to the other ends of multiple connectors in a one-to-one correspondence. The thickness of the second drive line is greater than the thickness of the first drive line.

[0008] In one embodiment, the plurality of first driving lines include drain driving lines and source driving lines, the source driving lines being electrically connected to the LED light-emitting layer, and all the drain driving lines and all the source driving lines being arranged in layers.

[0009] In one embodiment, the driving structure layer includes a first line layer, a first isolation layer, a second line layer, a second isolation layer, and a thin film transistor layer arranged sequentially. All the drain driving lines are formed on the first line layer and electrically connected to the thin film transistor layer through vias. All the source driving lines are formed on the second line layer and electrically connected to the LED light-emitting layer and the connector through vias.

[0010] In one embodiment, the display unit further includes:

[0011] Multiple data lines, each electrically connected to the driving structure layer, and extending along one side of the substrate to the back side of the substrate; and

[0012] Multiple wires, one end of each wire is bonded to one end of a data line located on the back of the substrate, and the other end of each wire is electrically connected to the circuit board.

[0013] In one embodiment, the side of the substrate for the data line routing protrudes from the same side of the circuit board.

[0014] A method for manufacturing a display unit, comprising:

[0015] Multiple through holes are formed on the substrate, and a connector is provided in each of the through holes;

[0016] A driving structure layer is provided on the front side of the substrate, wherein the driving structure layer has a plurality of first driving lines, and each first driving line is electrically connected to one end of at least one of the connectors.

[0017] An LED light-emitting layer is disposed on the driving structure layer; and

[0018] The front side of the circuit board is attached to the back side of the substrate, so that multiple connection areas on the front side of the circuit board are electrically connected to the other ends of multiple connectors one by one. The circuit board has multiple second drive lines, each of which is electrically connected to at least one of the connection areas. The thickness of the second drive line is greater than the thickness of the first drive line.

[0019] In one embodiment, the plurality of first drive lines include drain drive lines and source drive lines;

[0020] The step of forming a driving structure layer on the front side of the substrate includes:

[0021] A metal layer is disposed on the front side of the substrate, and the metal layer is processed to form a first line layer having multiple drain drive lines;

[0022] A first insulating layer is provided on the first line layer, and a via is provided on the first insulating layer;

[0023] Another metal layer is disposed on the first isolation layer and the metal layer is processed to form a second line layer having multiple source drive lines, each of the source drive lines being electrically connected to one end of at least one of the connectors through a via on the first isolation layer.

[0024] A second insulating layer is disposed on the second line layer, and a via is disposed on the second insulating layer; and

[0025] A thin-film transistor layer is disposed on the second isolation layer, and the thin-film transistor layer is electrically connected to all the drain drive lines in sequence through vias on the second isolation layer and the first isolation layer.

[0026] In one embodiment, after the step of setting the LED light-emitting layer on the driving structure layer and before the step of attaching the front side of the circuit board to the back side of the substrate, the manufacturing method further includes:

[0027] Multiple data lines are fabricated, each of which is electrically connected to the driving structure layer and extends along one side of the substrate to the back side of the substrate.

[0028] In one embodiment, after the step of attaching the front side of the circuit board to the back side of the substrate, the manufacturing method further includes:

[0029] A wire is bonded to one end of each data line on the back side of the substrate, and the other end of the wire is electrically connected to the circuit board.

[0030] A display device, comprising:

[0031] Installation structure; and

[0032] The display unit is a display unit as described above, and at least one of the display units is disposed on the mounting structure.

[0033] The aforementioned display unit, its manufacturing method, and display device, by providing connectors in multiple through holes of the substrate, with the connectors connecting between the drive structure layer of the display panel and the connection area of ​​the circuit board, connect the second drive line of the circuit board to the first drive line of the drive structure layer. The thickness of the second drive line is greater than the thickness of the first drive line, thereby setting the thicker second drive line on the circuit board, taking into account the copper thickness and avoiding the first drive line on the substrate being too thick, thus improving or solving the problem of severe voltage drop on the drive line on the substrate. Attached Figure Description

[0034] Figure 1This is a partial cross-sectional view of the display unit in one embodiment of this application.

[0035] Figure 2 for Figure 1 A layout diagram of the first drive line and connectors of the display panel of the display unit.

[0036] Figure 3 for Figure 1 A layout diagram of the second drive line and connection area of ​​the circuit board of the display unit.

[0037] Figure 4 This is a partial cross-sectional view of the display unit in another embodiment of this application.

[0038] Figure 5 for Figure 4 A layout diagram of the first drive line and connectors of the display panel of the display unit.

[0039] Figure 6 for Figure 4 A layout diagram of the second drive line and connection area of ​​the circuit board of the display unit.

[0040] Figure 7 This is a flowchart of a method for manufacturing a display unit according to one embodiment of this application.

[0041] Figure 8 for Figure 7 A process diagram illustrating the manufacturing method of the display unit.

[0042] Figure 9 This is a process diagram of a method for manufacturing a display unit according to another embodiment of this application.

[0043] Figure 10 This is a front view of a display device according to an embodiment of this application.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100. Display unit;

[0046] 200, Display panel; 210, Substrate; 212, Through-hole; 214, Connector; 220, Driving structure layer; 221, First driving line; Vdd, Drain driving line; Vss, Source driving line; 222, Metal line layer; 223, First line layer; 224, Insulating layer; 225, First isolation layer; 226, Second line layer; 227, Second isolation layer; 228, Thin film transistor layer; 230, LED light-emitting layer; 240, Data line; 242, Wire;

[0047] 300. Circuit board; 310. Second drive line; 320. Connection area; 330. Input connector; 332. Data connector;

[0048] 400. Display device; 410. Mounting structure. Detailed Implementation

[0049] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0050] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0051] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0052] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0053] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0054] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0055] Please see Figures 1 to 3 , Figure 1 A partial cross-sectional view of the display unit in one embodiment of this application is shown. Figure 2 It shows Figure 1 A layout diagram of the first drive line and connectors of the display panel of the central display unit. Figure 3 It shows Figure 1 The layout diagram of the second driving lines and connection areas of the circuit board of the display unit is shown in one embodiment of this application. The display unit 100 includes a display panel 200 and a circuit board 300. The display panel 200 includes a substrate 210, a driving structure layer 220 and an LED light-emitting layer 230 arranged sequentially. The substrate 210 has a plurality of through holes 212, and a connector 214 is provided in each through hole 212. The driving structure layer 220 has a plurality of first driving lines 221, and each first driving line 221 is electrically connected to one end of at least one connector 214. The circuit board 300 has a plurality of second driving lines 310 and a plurality of connection areas 320, and each second driving line 310 is electrically connected to at least one connection area 320. The plurality of connection areas 320 are electrically connected to the other ends of the plurality of connectors 214 one by one, and the thickness of the second driving line 310 is greater than the thickness of the first driving line 221.

[0056] By providing connectors 214 in multiple through holes 212 of the substrate 210, the connectors 214 are connected between the driving structure layer 220 of the display panel 200 and the connection area 320 of the circuit board 300, and the second driving line 310 of the circuit board 300 is connected to the first driving line 221 of the driving structure layer 220. The thickness of the second driving line 310 is greater than the thickness of the first driving line 221. Thus, the thicker second driving line 310 is set on the circuit board 300, which takes into account the copper thickness and avoids the first driving line 221 on the substrate 210 being set too thick, thereby improving or solving the problem of severe voltage drop on the driving line on the substrate 210.

[0057] In this embodiment, the substrate 210 is a glass substrate. However, the material of the substrate 210 is not limited to glass and can be changed according to actual needs.

[0058] In this embodiment, the multiple first driving lines 221 of the driving structure layer 220 include drain driving lines Vdd and source driving lines Vss. The source driving lines Vss are electrically connected to the LED light-emitting layer 230, and all drain driving lines Vdd and all source driving lines Vss are arranged in the same layer.

[0059] Furthermore, the driving structure layer 220 includes a metal line layer 222, an insulating layer 224, and a thin-film transistor layer 228 arranged sequentially. Multiple first driving lines 221 form the metal line layer 222, that is, the drain driving line Vdd and the source driving line Vss on the same layer together form the metal line layer 222. Among them, all drain driving lines Vdd are electrically connected to the thin-film transistor layer 228 through vias, and all source driving lines Vss are electrically connected to the LED light-emitting layer 230 through vias.

[0060] In this embodiment, multiple drain drive lines Vdd and multiple source drive lines Vss are arranged alternately, that is, one drain drive line Vdd and one source drive line Vss are arranged adjacent to each other with intervals, such as... Figure 2 As shown. Furthermore, each drain drive line Vdd is connected to multiple connectors 214 vias 212, and each source drive line Vss is connected to multiple connectors 214 vias 212. The connectors 214 connected to each drain drive line Vdd correspond one-to-one with the connectors 214 connected to each source drive line Vss. The same type of drive lines are arranged in a straight line. This design allows for the routing of the drain drive line Vdd and the source drive line Vss in a single layer. The multiple vias 212 on the substrate 210 provide multiple input channels for Vdd and Vss, reducing IR drop.

[0061] It should be noted that the number of drain drive lines Vdd and source drive lines Vss can be set according to the actual situation. Similarly, the number of connectors 214 corresponding to each drain drive line Vdd / each source drive line Vss can also be adjusted according to the actual situation.

[0062] In this embodiment, the LED light-emitting layer 230 includes chip pads (not shown), an LED chip (not shown), and an encapsulating layer (not shown). The chip pads are disposed on the thin-film transistor layer 228 and are used for signal connection, and are fabricated using a glass-based process. The LED chip is transferred and soldered onto the chip pads by a transfer method (mass transfer). The encapsulating layer is fabricated by a lamination method to cover and seal the LED chip, providing protection. The negative electrode pad of the LED chip is electrically connected to the source drive line Vss of the metal line layer 222 through a via.

[0063] In this embodiment, the display unit 100 further includes multiple data lines 240 and multiple wires 242. Each data line 240 is electrically connected to the driving structure layer 220 and extends along one side of the substrate 210 to the back side of the substrate 210. One end of each wire 242 is bonded to the end of a data line 240 located on the back side of the substrate 210, and the other end of each wire 242 is electrically connected to the circuit board 300. The side-running data lines 240 meet the requirement of seamless splicing between display units 100.

[0064] Furthermore, the side of the substrate 210 where the data line 240 is routed protrudes from the same side of the circuit board 300, providing clearance for the bonding of the wires 242. Therefore, the size of the circuit board 300 needs to be smaller than the size of the substrate 210. The other three sides of the circuit board 300 can be flush with the substrate 210, and the side corresponding to the side routing needs to be smaller than the same side of the substrate 210. In this embodiment, the side of the circuit board 300 corresponding to the side routing is 5cm smaller than the same side of the substrate 210, but it is not limited to this value and can be adjusted according to actual needs.

[0065] The back of the circuit board 300 is provided with an input connector 330 and multiple data connectors 332. The input connector 330 is electrically connected to multiple second drive lines 310 and multiple data connectors 332. Each data connector 332 is connected to a data line 240 via a wire 242. The input connector 330 is used to input drive signals and data signals. The drive signals are transmitted to the drive structure layer 220 of the display panel 200 through the second drive lines 310, and the data signals are transmitted to the data lines 240 through the data connectors 332. Therefore, the Vdd and Vss drive signals (power signals) and data signals are all input to the display unit 100 through the input connector 330. The Vdd and Vss drive signals are transmitted to the drain drive line Vdd and the source drive line Vss on the substrate 210 through the connector 214 in the through hole 212, and the data signals are transmitted to the data connector 332 and output to the display panel 200 through the wire 242.

[0066] Furthermore, the front side of the circuit board 300 is bonded to the back side of the substrate 210, and the bonding method of the circuit board 300 can be soldering, ACF (Anisotropic Conductive Film) bonding, or conductive silver paste bonding, etc. The wire 242 is a flexible flat cable, which adopts COF (Chip On Flex) bonding. One end is bonded to the back side of the substrate 210 and electrically connected to the data line 240, and the other end is inserted into the data connector 332.

[0067] Combination Figure 3 In this embodiment, the circuit board 300 is designed as a double-layer board, which has a relatively low cost. The upper layer is provided with a second driving line 310 and a connection area 320. The connection area 320 is the connection pad. A portion of the second driving line 310 is connected to the Vdd driving signal, corresponding to multiple drain driving lines Vdd. The other portion of the second driving line 310 is connected to the Vss driving signal, corresponding to multiple source driving lines Vss. Each second driving line 310 corresponds to multiple connection pads and is electrically connected to them. These multiple connection pads correspond one-to-one with multiple vias 212 on the substrate 210, satisfying the electrical connection requirements. It should be noted that in other embodiments, the number of connectors 214 between each second driving line 310 and the corresponding first driving line 221 can be set according to actual needs. For example, electrical connection can be achieved through one or two connectors 214, reducing the number of connectors 214.

[0068] Please see Figures 4 to 6 , Figure 4 A partial cross-sectional view of the display unit in another embodiment of this application is shown. Figure 5 It shows Figure 4A layout diagram of the first drive line and connectors of the display panel of the central display unit. Figure 6 It shows Figure 4 The layout diagram of the second driving lines and connection area of ​​the circuit board of the display unit differs from the previous embodiment where all the first driving lines 221 of the display unit 100 are arranged on the same layer. In this embodiment, the first driving lines 221 of the display unit 100 are arranged in layers, that is, all drain driving lines Vdd and all source driving lines Vss are arranged in layers. In other words, all drain driving lines Vdd are located on the same layer, and all source driving lines Vss are located on another layer. Since the drain driving lines Vdd and source driving lines Vss are not on the same layer but can overlap, this design can increase the trace area and further reduce IR drop.

[0069] In this embodiment, the source driving line Vss is located on the upper layer relative to the substrate 210, and the projections of the drain driving line Vdd and the source driving line Vss on the substrate 210 are arranged in a crisscross pattern, such as... Figure 5 As shown. Each drain drive line Vdd is configured with multiple vias 212 and connected to multiple connectors 214. Each source drive line Vss is configured with multiple vias 212 and connected to multiple connectors 214. The multiple connectors 214 connected to each drain drive line Vdd are staggered from the multiple connectors 214 connected to each source drive line Vss.

[0070] Furthermore, the driving structure layer 220 includes a first line layer 223, a first insulating layer 225, a second line layer 226, a second insulating layer 227, and a thin-film transistor layer 228 arranged sequentially. All drain driving lines Vdd form the first line layer 223 and are electrically connected to the thin-film transistor layer 228 through vias. All source driving lines Vss form the second line layer 226 and are electrically connected to the LED light-emitting layer 230 and the connector 214 through vias.

[0071] In this embodiment, all the second driving lines 310 of the circuit board 300 are arranged side by side in the same direction. A portion of the second driving line 310 is connected to the Vdd driving signal, corresponding to multiple drain driving lines Vdd. The other portion of the second driving line 310 is connected to the Vss driving signal, corresponding to multiple source driving lines Vss. Figure 6 As shown. Each second drive line 310 corresponds to multiple connection pads and is electrically connected to multiple connection pads. In turn, the multiple connection pads are configured one-to-one with multiple through holes 212 on the substrate 210 to meet the requirements of electrical connection.

[0072] As for the other aspects of the display unit 100 in this embodiment, they are basically the same as the other aspects of the display unit 100 in the above embodiments. The specific content can be referred to the description of the above embodiments, and will not be repeated here.

[0073] Please see Figure 7 and Figure 8 Combined Figure 3 , Figure 7 A flowchart illustrating a method for manufacturing a display unit according to an embodiment of this application is shown. Figure 8 It shows Figure 7 A process diagram of a method for manufacturing a display unit is provided in one embodiment of this application, comprising the following steps:

[0074] S100. A plurality of through holes 212 are formed on the substrate 210, and a connector 214 is provided in each through hole 212;

[0075] S200. A driving structure layer 220 is provided on the front side of the substrate 210, wherein the driving structure layer 220 has a plurality of first driving lines 221, and each first driving line 221 is electrically connected to one end of at least one connector 214.

[0076] S300, An LED light-emitting layer 230 is disposed on the driving structure layer 220; and

[0077] S400, the front side of the circuit board 300 is attached to the back side of the substrate 210, so that the multiple connection areas 320 provided on the front side of the circuit board 300 are electrically connected to the other ends of the multiple connectors 214 one by one. The circuit board 300 has multiple second driving lines 310, each second driving line 310 is electrically connected to at least one connection area 320, and the thickness of the second driving line 310 is greater than the thickness of the first driving line 221.

[0078] By providing connectors 214 in multiple through holes 212 of the substrate 210, the connectors 214 are connected between the driving structure layer 220 of the display panel 200 and the connection area 320 of the circuit board 300, and the second driving line 310 of the circuit board 300 is connected to the first driving line 221 of the driving structure layer 220. The thickness of the second driving line 310 is greater than the thickness of the first driving line 221. Thus, the thicker second driving line 310 is set on the circuit board 300, which takes into account the copper thickness and avoids the first driving line 221 on the substrate 210 being set too thick, thereby improving or solving the problem of severe voltage drop on the driving line on the substrate 210.

[0079] In this embodiment, step S100 specifically includes:

[0080] S100, Provide substrate 210, which may be, but is not limited to, a glass substrate;

[0081] S102, A through-hole 212 is formed on the substrate 210, wherein the forming method is drilling or etching; and

[0082] S104. A connector 214 is prepared in each through hole 212. The material of the connector 214 may be, but is not limited to, copper, and its preparation method may be, but is not limited to, embedding or electroplating.

[0083] In this embodiment, step S200 specifically includes:

[0084] S202, A metal layer is formed on the front side of the substrate 210; wherein, the metal layer can be formed on the front side of the substrate 210 by sputtering based on a glass substrate;

[0085] S204. Process the metal layer to form a metal line layer 222 having multiple first driving lines 221, the multiple first driving lines 221 including multiple drain driving lines Vdd and multiple source driving lines Vss; wherein, the metal line layer 222 can be prepared by processing the metal layer using a general glass substrate process (photolithography and etching);

[0086] S206. An insulating layer 224 is formed on the metal line layer 222, and vias are formed on the insulating layer 224; wherein the insulating layer 224 and the vias thereon can be fabricated using common glass-based processes (sputtering, photolithography, and etching); and

[0087] S208. A thin-film transistor layer 228 is disposed on the insulating layer 224. The thin-film transistor layer 228 is electrically connected to the drain driving line Vdd through a via. The thin-film transistor layer 228 and the vias thereon can be fabricated using general glass substrate processes (sputtering, photolithography and etching).

[0088] In this embodiment, step S300 specifically includes:

[0089] S302. A metal layer is disposed on the thin film transistor layer 228, and the metal layer is processed to form a chip pad; wherein, the chip pad can be made by processing the metal layer using a common glass substrate process (sputtering, photolithography and etching), and the negative electrode chip pad is electrically connected to the source drive line Vss through a via.

[0090] S304. The LED chip is transferred and soldered onto the pads by a transfer method;

[0091] S306. The sealant is applied to all LED chips by pressing to form a sealing layer.

[0092] In this embodiment, after step S300 and before step S400, the manufacturing method of the display unit further includes:

[0093] S310: Fabricate multiple data lines 240, each data line 240 being electrically connected to the driving structure layer 220 and extending along one side of the substrate 210 to the back side of the substrate 210. The side traces are formed using sputtering or vapor deposition to meet the requirements of seamless splicing.

[0094] In this embodiment, in step S400, the circuit board 300 is designed as a double-layer board, which has a relatively low cost. The upper layer is provided with a second driving line 310 and a connection area 320. The connection area 320 is the connection pad. A portion of the second driving line 310 is connected to the Vdd driving signal, corresponding to multiple drain driving lines Vdd. The other portion of the second driving line 310 is connected to the Vss driving signal, corresponding to multiple source driving lines Vss. Each second driving line 310 corresponds to multiple connection pads and is electrically connected to them. These multiple connection pads correspond one-to-one with multiple vias 212 on the substrate 210, satisfying the electrical connection requirements.

[0095] Furthermore, the bonding method of the circuit board 300 can be soldering, ACF (Anisotropic Conductive Film) bonding, or conductive silver paste bonding, etc. Taking soldering as an example, solder paste is applied to all the connection pads of the circuit board 300, and the front side of the circuit board 300 is bonded to the back side of the substrate 210, so that multiple connection pads are connected to multiple connectors 214 one by one. Then, a soldering process is performed to fix the connection pads and connectors 214 with solder paste.

[0096] In this embodiment, the back of the circuit board 300 is provided with an input connector 330 and multiple data connectors 332. The input connector 330 is electrically connected to multiple second drive lines 310 and multiple data connectors 332. Each data connector 332 is connected to a data line 240 via a wire 242. The input connector 330 is used to input drive signals and data signals. The drive signals are transmitted to the drive structure layer 220 of the display panel 200 through the second drive lines 310, and the data signals are transmitted to the data line 240 through the data connectors 332. Therefore, the Vdd and Vss drive signals (power signals) and data signals are all input to the display unit 100 through the input connector 330. The Vdd and Vss drive signals are transmitted to the drain drive line Vdd and the source drive line Vss on the substrate 210 through the connector 214 in the through hole 212, and the data signals are transmitted to the data connector 332 and output to the display panel 200 through the wire 242.

[0097] In this embodiment, after step S400, the manufacturing method of the display unit 100 further includes:

[0098] S500: A wire 242 is bonded to one end of each data line 240 on the back side of the substrate 210, and the other end of the wire 242 is electrically connected to the circuit board 300. The wire 242 is a flexible flat cable, using COF (Chip On Flex) bonding, with one end bonded to the back side of the substrate 210 and electrically connected to the data line 240, and the other end inserted into the data connector 332.

[0099] Furthermore, the side of the substrate 210 where the data line 240 is routed protrudes from the same side of the circuit board 300, providing clearance for the bonding of the wires 242. Therefore, the size of the circuit board 300 needs to be smaller than the size of the substrate 210. The other three sides of the circuit board 300 can be flush with the substrate 210, and the side corresponding to the side routing needs to be smaller than the same side of the substrate 210. In this embodiment, the side of the circuit board 300 corresponding to the side routing is 5cm smaller than the same side of the substrate 210, but it is not limited to this value and can be adjusted according to actual needs.

[0100] Therefore, the manufacturing method of the display unit in this embodiment can produce the display unit 100 disposed on the same layer as the first driving line 221 in the above embodiment.

[0101] Please see Figure 9 Combined Figures 4 to 6 , Figure 9 A process diagram of a manufacturing method for a display unit according to another embodiment of this application is shown. Unlike the manufacturing method of the display unit in the above embodiment, which forms all the first driving lines 221 in the same layer, the manufacturing method of the display unit in this embodiment sets the first driving lines 221 in different layers. Step S200 specifically includes:

[0102] S212. A metal layer is formed on the front side of the substrate 210, and the metal layer is processed to form a first line layer 223 with multiple drain driving lines Vdd; wherein, the first line layer 223 can be formed by using general glass substrate processes (sputtering, photolithography and etching);

[0103] S214. A first insulating layer 225 is formed on the first line layer 223, and vias are formed on the first insulating layer 225; wherein, the first insulating layer 225 and the vias thereon can be formed by general glass-based processes (sputtering, photolithography and etching);

[0104] S216. Another metal layer is disposed on the first insulating layer 225 and the metal layer is processed to form a second line layer 226 having multiple source drive lines Vss. Each source drive line Vss is electrically connected to one end of at least one connector 214 through a via. The second line layer 226 can be fabricated using common glass substrate processes (sputtering, photolithography and etching).

[0105] S218. A second insulating layer 227 is formed on the second insulating layer 226, and vias are formed on the second insulating layer 227; wherein the second insulating layer 227 and the vias thereon can be fabricated using general glass-based processes (sputtering, photolithography, and etching); and

[0106] S220. A thin-film transistor layer 228 is disposed on the second insulating layer 227. The thin-film transistor layer 228 is electrically connected to all drain drive lines Vdd through vias. The thin-film transistor layer 228 and the vias thereon can be fabricated using general glass substrate processes (sputtering, photolithography and etching).

[0107] The second line layer 226 and the first line layer 223 are arranged on top of each other, so that all drain drive lines Vdd and all source drive lines Vss are not on the same layer and can be arranged in an overlapping manner. This design can increase the trace area and further reduce IRDrop.

[0108] The other aspects of the manufacturing method of the display unit in this embodiment are basically the same as those in the manufacturing method of the display unit in the above embodiments, and their specific contents can be referred to the description of the above embodiments, which will not be repeated here. Therefore, the manufacturing method of the display unit in this embodiment can produce the display unit 100 in the above embodiments with the first driving line 221 layered.

[0109] Please see Figure 10 , Figure 10 A schematic diagram of a display device according to an embodiment of this application is shown. The display device 400 provided in this embodiment includes a display unit 100 and a mounting structure 410, with at least one display unit 100 disposed on the mounting structure 410. The specific structure of the display unit 100 is as described in the above embodiments. Since the display device 400 in this embodiment adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0110] In this embodiment, the mounting structure 410 is a mounting frame, and four display units 100 are spliced ​​together on one side of the mounting frame to form the display surface of the display device 400. Obviously, in other embodiments, the mounting structure 410 may be provided with one display unit 100, two spliced ​​display units 100, six spliced ​​display units 100, or more spliced ​​display units 100.

[0111] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0112] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display unit, characterized in that, include: The display panel includes a substrate, a driving structure layer, and an LED light-emitting layer arranged sequentially. The substrate has multiple through-holes, each containing a connector. The driving structure layer has multiple first driving lines, each electrically connected to one end of at least one of the connectors. The circuit board has multiple second drive lines and multiple connection areas. Each second drive line is electrically connected to at least one of the connection areas. The multiple connection areas are electrically connected to the other ends of multiple connectors in a one-to-one correspondence. The thickness of the second drive line is greater than the thickness of the first drive line.

2. The display unit according to claim 1, characterized in that, The multiple first driving lines include drain driving lines and source driving lines. The source driving lines are electrically connected to the LED light-emitting layer. All the drain driving lines and all the source driving lines are arranged in layers.

3. The display unit according to claim 2, characterized in that, The driving structure layer includes a first line layer, a first isolation layer, a second line layer, a second isolation layer, and a thin film transistor layer arranged sequentially. All the drain driving lines are formed on the first line layer and electrically connected to the thin film transistor layer through vias. All the source driving lines are formed on the second line layer and electrically connected to the LED light-emitting layer and the connector through vias.

4. The display unit according to any one of claims 1 to 3, characterized in that, Also includes: Multiple data lines, each of which is electrically connected to the driving structure layer and extends along one side of the substrate to the back side of the substrate; and Multiple wires, one end of each wire is bonded to one end of a data line located on the back of the substrate, and the other end of each wire is electrically connected to the circuit board.

5. The display unit according to claim 4, characterized in that, The side of the substrate for the data line routing protrudes from the same side of the circuit board.

6. A method for manufacturing a display unit, characterized in that, include: Multiple through holes are formed on the substrate, and a connector is provided in each of the through holes; A driving structure layer is provided on the front side of the substrate, wherein the driving structure layer has a plurality of first driving lines, and each first driving line is electrically connected to one end of at least one of the connectors. An LED light-emitting layer is disposed on the driving structure layer; and The front side of the circuit board is attached to the back side of the substrate, so that multiple connection areas on the front side of the circuit board are electrically connected to the other ends of multiple connectors one by one. The circuit board has multiple second drive lines, each of which is electrically connected to at least one of the connection areas. The thickness of the second drive line is greater than the thickness of the first drive line.

7. The manufacturing method according to claim 6, characterized in that, The multiple first drive lines include drain drive lines and source drive lines; The step of forming a driving structure layer on the front side of the substrate includes: A metal layer is disposed on the front side of the substrate, and the metal layer is processed to form a first line layer having multiple drain drive lines; A first insulating layer is provided on the first line layer, and a via is provided on the first insulating layer; Another metal layer is disposed on the first isolation layer and the metal layer is processed to form a second line layer having multiple source drive lines, each of the source drive lines being electrically connected to one end of at least one of the connectors through a via on the first isolation layer. A second insulating layer is disposed on the second line layer, and a via is disposed on the second insulating layer; and A thin-film transistor layer is disposed on the second isolation layer, and the thin-film transistor layer is electrically connected to all the drain drive lines in sequence through vias on the second isolation layer and the first isolation layer.

8. The manufacturing method according to claim 6, characterized in that, After the step of setting the LED light-emitting layer on the driving structure layer and before the step of attaching the front side of the circuit board to the back side of the substrate, the manufacturing method further includes: Multiple data lines are fabricated, each of which is electrically connected to the driving structure layer and extends along one side of the substrate to the back side of the substrate.

9. The manufacturing method according to claim 8, characterized in that, After the step of attaching the front side of the circuit board to the back side of the substrate, the manufacturing method further includes: A wire is bonded to one end of each data line on the back side of the substrate, and the other end of the wire is electrically connected to the circuit board.

10. A display device, characterized in that, include: Installation structure; and The display unit is the display unit according to any one of claims 1 to 5, and at least one of the display units is disposed on the mounting structure.

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