connector

Abstract

A connector includes a housing and a plurality of terminals. Each of the plurality of terminals includes a plating portion covered with a base material coating film and a non-plating portion not covered with the base material coating film. The non-plating portion is disposed in the housing. A portion of the non-plating portion is exposed from a surface of the housing. The housing includes a partition wall protruding from the surface of the housing between two terminals adjacent to each other among the plurality of terminals.

Description

Technical Field

[0001] This invention relates to connectors having multiple terminals. Background Technology

[0002] Japanese Patent Application Publication No. 2014-209836 discloses a power conversion device mounted on a vehicle. In the power conversion device, multiple terminals are arranged with spacing between them. Summary of the Invention

[0003] In the aforementioned technologies, condensation sometimes occurs around the terminals, depending on the vehicle's condition and environment. To improve corrosion resistance, each of the multiple terminals undergoes an electroplating process with a coating. However, in the terminal manufacturing process, a process is sometimes used to form non-electroplated portions on the terminal surface without a coating. In this case, if condensation adheres to the non-electroplated portions of two adjacent terminals, erosion caused by electro-corrosion may occur in the non-electroplated portions.

[0004] The present invention provides a technique for suppressing the occurrence of electro-corrosion in multiple terminals having non-electroplated portions.

[0005] The connector of the first aspect of the present invention comprises: a base; and a plurality of terminals held in the base, protruding from the surface of the base and arranged spaced apart from each other, each of the plurality of terminals comprising: an electroplated portion of the substrate covered by a film; and an electroplated portion of the substrate not covered by the film, the electroplated portion being disposed within the base, a portion of the electroplated portion being exposed from the surface of the base, the base comprising a partition wall protruding from the surface of the base between two adjacent terminals of the plurality of terminals.

[0006] According to a first aspect of the present invention, the unplated portions of two adjacent terminals can be separated by a partition wall. As a result, even if condensation adheres to the surface of the base, the partition wall extending from the surface of the base can prevent condensation from adhering to the unplated portions of the two adjacent terminals. Thus, electro-corrosion in the unplated portions can be suppressed.

[0007] In a first aspect of the invention, the height of the partition wall from the surface of the base can be greater than the distance between two adjacent terminals.

[0008] According to a first aspect of the invention, when condensation adheres to the surface of the base, the condensation sometimes forms a hemispherical shape. By making the height of the partition wall greater than the distance between adjacent terminals, it is possible to prevent the condensation from crossing the partition wall and contacting both adjacent connectors.

[0009] In a first aspect of the invention, the front end of the partition wall may be formed by a curved surface.

[0010] According to the first aspect of the invention, condensation can be prevented from accumulating at the upper end of the partition wall.

[0011] In the first aspect of the present invention, a resin-made covering portion may also be provided, which is disposed on the surface of the base and covers the portion of the non-electroplated portion exposed from the surface of the base.

[0012] According to a first aspect of the present invention, contact between condensation and the non-electroplated portion can be suppressed. Therefore, erosion on the non-electroplated portion can be suppressed.

[0013] In a first aspect of the present invention, in each of the plurality of terminals, the electroplated portion may be tilted downward at a portion further away from the base than the unplated portion.

[0014] In the first aspect of the present invention, the electroplated portions of the plurality of terminals may extend obliquely relative to the base.

[0015] The connector of the second aspect of the present invention comprises: a base; and a plurality of terminals held in the base, protruding from the surface of the base and arranged spaced apart from each other, each of the plurality of terminals comprising: an electroplated portion of the substrate covered by a film; and a non-electroplated portion of the substrate not covered by the film, the non-electroplated portion being arranged away from the base.

[0016] According to a second aspect of the present invention, it is possible to suppress the contact between condensation adhering to the surface of the base and the non-electroplated portion. As a result, condensation adhering to the non-electroplated portions of two adjacent terminals is avoided. Thus, electro-corrosion of the non-electroplated portion can be suppressed.

[0017] In a second aspect of the present invention, the distance from the surface of the base to the non-electroplated portion can be greater than the distance between the non-electroplated portions of two adjacent terminals.

[0018] According to a second aspect of the present invention, when condensation adheres to the surface of the base, the condensation sometimes forms a hemispherical shape. By making the distance from the surface of the base to the unplated portion greater than the distance between adjacent terminals, it is possible to suppress the condensation adhering to the surface of the base from contacting the unplated portion.

[0019] In a second aspect of the invention, in each of the plurality of terminals, the electroplated portion may be tilted downward at a portion further away from the base than the unplated portion.

[0020] According to a second aspect of the invention, it is possible to promote the movement of condensation adhering to the electroplated portion along the downwardly inclined electroplated portion to the opposite side from the non-electroplated portion.

[0021] In a second aspect of the present invention, the electroplated portions of the plurality of terminals may extend obliquely relative to the base. Attached Figure Description

[0022] The features, advantages, and technical and industrial significance of exemplary embodiments of the present invention will now be described with reference to the accompanying drawings, in which the same reference numerals denote the same elements.

[0023] Figure 1 This is a top view of the connector of the first embodiment.

[0024] Figure 2 yes Figure 1 An enlarged view of region II.

[0025] Figure 3 This is an enlarged view of region II in the connector of the second embodiment.

[0026] Figure 4 This is an enlarged view of region II in the connector of the third embodiment.

[0027] Figure 5 This is a top view of the connector in the fourth embodiment.

[0028] Figure 6 yes Figure 5 A magnified view of region VI.

[0029] Figure 7 This is an enlarged view of region II in the connector of the fifth embodiment. Detailed Implementation

[0030] The technical elements of the connector according to the present invention are listed below. Furthermore, each of the following technical elements is useful independently.

[0031] First Embodiment

[0032] like Figure 1 As shown, the connector 10 in this embodiment is used for electrical connections of devices mounted in an electric vehicle. For example, the connector 10 is configured in a charger (i.e., an EV charger) for filling the battery mounted in an electric vehicle, and is a connector for connecting the in-vehicle wiring for supplying power from an external power source to the charger. Furthermore, the connector 10 can also be used for devices other than those for electric vehicles.

[0033] Connector 10 is disposed in a device (not shown). Connector 10 includes a cover 12, a plurality of terminals 14, and a base 20. Furthermore, hereinafter, when referring to the plurality of terminals 14 collectively, it will be called "a plurality of terminals 14," and when referring to any one of the plurality of terminals 14, it will be called "terminal 14." The plurality of terminals 14 have identical structures. The plurality of terminals 14 are arranged at equal intervals. The terminals 14 are made of a conductive metal, such as a copper alloy. The terminals 14 extend in a straight line. The plurality of terminals 14 are connected to a substrate (not shown) while held in the base 20. The base 20 is made of insulating resin. The plurality of terminals 14 are pressed into the base 20 and thus fixed.

[0034] Multiple terminals 14 and base 20 are covered by cover 12. A portion of the front end of the multiple terminals 14 protrudes from cover 12. Cover 12 is mounted on a device equipped with connector 10.

[0035] Figure 2 An enlarged view of the periphery of the surface 20a of the base 20 of three terminals 14a, 14b, and 14c out of a plurality of terminals 14 is shown. Furthermore, in the following description of each terminal 14 of the plurality of terminals 14, it will be referred to as "terminal 14," and when a specific one of terminals 14a, 14b, and 14c is described, it will be referred to as "terminal 14a," "terminal 14b," and "terminal 14c." The terminal 14 includes an electroplated portion 30 and a non-electroplated portion 32. The non-electroplated portion 32 is positioned at the center of the longitudinal direction of the terminal 14. Furthermore, "center" refers to the position along the longitudinal direction of the terminal 14 (i.e.,...). Figure 2 The left and right directions do not include the positions at both ends.

[0036] Electroplated portions 30 are respectively disposed at both ends of the non-electroplated portion 32 along the long side of the terminal 14. The electroplated portions 30 extend in a straight line. The non-electroplated portion 32 has a shape wider than the electroplated portion 30. The outer surface of the electroplated portion 30 is covered with a corrosion-resistant film over its entire surface. The film covering the electroplated portion 30 is made of a highly corrosion-resistant material such as gold (Au) or nickel (Ni). Furthermore, the material of the electroplated portion 30 can be different depending on the non-electroplated portion 32. For example, the portion of the electroplated portion 30 exposed from the surface 20a of the base 20 can be covered with a gold (Au) film, while the portion embedded in the base 20 can be covered with a nickel (Ni) film.

[0037] On the other hand, the non-plated portion 32, except for the short side direction perpendicular to the long side direction located at terminal 14 (i.e., Figure 2 Except for the two end faces 32a, 32a in the vertical direction, the terminal 14 is covered with a corrosion-resistant film in the same way as the electroplated part 30. The end faces 32a, 32a are not covered with a film, and the substrate of the terminal 14 is exposed.

[0038] Next, the manufacturing method of terminal 14 will be described. First, a flat plate is cut by stamping. Multiple terminals 14, after stamping, are arranged in a row along their short sides and connected to adjacent terminals 14 at the non-plated portion 32. Then, with the multiple terminals 14 connected, an electroplating process is performed. Next, the non-plated portions 32 between adjacent terminals 14 are cut parallel to each other along their long sides. Thus, terminal 14 is manufactured. In this manufacturing method, since the non-plated portions 32 are cut after the electroplating process, the end faces 32a, 32a of the non-plated portions 32 are not electroplated, and the material of terminal 14 is exposed.

[0039] like Figure 2 As shown, a portion of the end face 32a is exposed from the surface 20a of the base 20.

[0040] Between adjacent terminals 14a and 14b, a partition wall 22a protrudes, extending from the surface 20a of the base 20 along the terminals 14a and 14b. The partition wall 22a is positioned at the center of the gap between terminals 14a and 14b. The partition wall 22a is integrally formed with the base 20. The partition wall 22a is located in a specific direction perpendicular to the long and short sides of the terminals 14a (i.e.,...). Figure 2 It maintains its shape in the vertical direction of the paper surface while extending in a straight line in a specific direction. The partition wall 22a extends in a specific direction across the section in which the terminals 14a and 14b are arranged.

[0041] In the partition wall 22a, the width in the short side direction gradually narrows as it moves away from the base 20 along the long side direction of the terminal 14. The front end of the partition wall 22a is formed by a curved surface and does not have a planar portion. The height H in the long side direction of the partition wall 22a is greater than or equal to the distance L between the terminals 14a and 14b. Furthermore, the height H may, for example, be greater than or equal to 1.0 mm.

[0042] A partition wall 22b, identical to that of partition wall 22a, is disposed between terminal 14b and terminal 14c. For example... Figure 1 As shown, a partition wall 22, identical to the partition wall 22a, is disposed between two adjacent terminals 14 of the plurality of terminals 14. That is, a plurality of partition walls 22 protruding from the surface 20a are disposed in the base 20.

[0043] Depending on the usage and surrounding environment, condensation may form on the connector 10. For example, moisture absorbed by the substrate to which multiple terminals 14 are connected may be released from the substrate as the substrate temperature rises, resulting in condensation. If condensation occurs, it may sometimes adhere to the surface 20a of the base 20. If condensation adheres to the surface 20a, the end face 32a of the non-plated portion 32 is exposed to the condensation. A partition wall 22 is provided in the connector 10. With this structure, it is possible to prevent the end faces 32a of adjacent terminals 14 (e.g., terminals 14a and 14b) from becoming conductive due to condensed moisture. This prevents corrosion caused by electro-corrosion from occurring on the terminals 14.

[0044] The height H of the partition wall 22 is greater than the distance L between adjacent terminals 14. This structure prevents condensed water droplets adhering to the surface 20a from crossing the partition wall 22. For example, if the water droplets adhering to the surface 20a are hemispherical, the maximum height of the droplet is L / 2, with a diameter equal to the distance (i.e., distance L) between adjacent partition walls 22. Therefore, by making the partition wall 22 more than twice the maximum height of the water droplet, it is possible to reliably prevent water droplets from crossing the partition wall 22.

[0045] The front end of the partition wall 22 is formed by a curved surface. This structure can prevent moisture caused by condensation from accumulating at the front end of the partition wall 22.

[0046] Outside the base 20, the multiple partition walls 22 are separated from each other and not connected. As a result, it is possible to suppress the accumulation of moisture between adjacent partition walls 22, 22.

[0047] Second Embodiment

[0048] like Figure 3 As shown, in the connector of this embodiment, a cover portion 50 covering each of the non-plated portions 32 of the plurality of terminals 14 is disposed on the surface 20a of the base 20. The other structures of the connector 10 are the same as those of the connector 10 of the first embodiment. The cover portion 50 is made of a resin material such as polybutylene terephthalate (PBT). The cover portion 50 may also be made of, for example, a resin material such as polybutylene terephthalate (PBT). Figure 2 The state shown is such that the non-plated portions 32 of the multiple terminals 14 are covered by potting to form a cover portion 50.

[0049] According to the aforementioned structure, the same effect as the connector 10 of the first embodiment can be obtained. Furthermore, according to this structure, the non-plated portion 32 can be prevented from being exposed outside the connector 10 by the cover portion 50. This prevents corrosion of the non-plated portion 32.

[0050] Furthermore, in a modified example, the cover 50 may be provided on the first terminal 14 of two adjacent terminals 14, while the cover 50 may not be provided on the second terminal 14, with the cover 50 provided on the first terminal 14 and not on the second terminal 14. In this configuration, terminals 14 with and without covers 50 may be alternately arranged along the arrangement direction of the plurality of terminals 14. According to this configuration, it is possible to prevent the unplated portions 32 of two adjacent terminals 14 from becoming conductive due to condensation.

[0051] Third Embodiment

[0052] like Figure 4 As shown, in this embodiment of the connector, compared to the connector of the second embodiment, multiple terminals 114 are provided instead of multiple terminals 14. Each terminal 114 includes: a non-plated portion 32 similar to that of the terminal 14; and plating portions 130 extending from both ends of the terminal 114 along its long side direction from the non-plated portion 32. The plating portions 130 extend obliquely relative to the base 20. Figure 4 In the electroplated portion 130, the portion further away from the base 20 than the unplated portion 32 tilts downwards as it moves away from the unplated portion 32. All terminals 114, including terminals 114a, 114b, and 114c, disposed in the connector have the same structure as each other. Other structures are the same as those of the connector 10 in the second embodiment.

[0053] According to this structure, the same effect as the connector of the second embodiment can be obtained. Furthermore, according to this structure, it is possible to promote the movement of condensed water droplets C adhering to the electroplated portion 130 in a direction away from the non-electroplated portion 32. Thus, it is possible to suppress the adhesion of moisture around the non-electroplated portion 32.

[0054] Fourth embodiment

[0055] The main difference from the first embodiment is explained. For example... Figure 5 As shown, the connector 410 of this embodiment includes a cover 412, a plurality of terminals 414, and a base 420. The cover 412 has the same structure as the cover 12.

[0056] Multiple terminals 414 have the same structure as each other. The multiple terminals 414 are arranged at equal intervals. Terminals 414, like terminals 14, have an electroplated portion 430 similar to the electroplated portion 30, and a non-electroplated portion 432 similar to the non-electroplated portion 32. However, the position of the non-electroplated portion 432 of the electroplated portion 430 relative to the long side direction of terminal 414 differs from the position of the non-electroplated portion 32 of the electroplated portion 30 relative to the long side direction of terminal 14. The base 420 differs from the base 20 in that it does not have multiple partition walls 22; otherwise, the structure of the base 420 is the same as that of the base 20.

[0057] Multiple terminals 414 are connected to a substrate (not shown) while held in the base 420. The multiple terminals 414 are pressed into the base 420 and thus secured.

[0058] Figure 6 An enlarged view of the periphery of the surface 420a of the base 420 of three terminals 414a, 414b, and 414c among the plurality of terminals 414 is shown. Furthermore, in the following description of the plurality of terminals 414, each terminal 414 will be referred to as "terminal 414", and in the case of a specific description of one of terminals 414a, 414b, and 414c, it will be referred to as "terminal 414a", "terminal 414b", and "terminal 414c".

[0059] The non-electroplated portion 432 is positioned at a distance D from the surface 420a of the base 420. The entire non-electroplated portion 432 is exposed from the base 420. Therefore, both end faces 432a, 432a of the non-electroplated portion 432 are completely exposed from the base 420. The distance D is greater than the interval L.

[0060] According to the structure, even if water droplets caused by condensation adhere to the surface 420a of the base 420, it is possible to prevent the water droplets from reaching the non-electroplated part 432.

[0061] Furthermore, even when the condensed water droplets C adhering to surface 420a have a hemispherical shape with a diameter of L, the distance D from the non-electroplated portion 432 to surface 420a is more than twice the maximum height of the water droplets C. This prevents the water droplets from contacting the non-electroplated portion 432.

[0062] Fifth embodiment

[0063] like Figure 7 As shown, in this embodiment of the connector, compared to the connector of the fourth embodiment, multiple terminals 514 are provided instead of multiple terminals 414. Each terminal 514 includes: a non-plated portion 432 similar to the terminal 414, and plating portions 530 extending from both ends of the terminal 514 in the longitudinal direction of the non-plated portion 432. The plating portions 530 extend obliquely relative to the base 420. Figure 7 In the electroplated portion 530, the portion further away from the base 420 than the unplated portion 432 tilts downwards as it moves away from the unplated portion 432. The same applies to all terminals 514, including terminals 514a, 514b, and 514c, disposed on the connector. Other structures are the same as those of the connector in the fourth embodiment.

[0064] According to this structure, the same effect as the connector of the fourth embodiment can be obtained. Furthermore, according to this structure, similarly to the connector of the third embodiment, it is possible to promote the movement of condensed moisture adhering to the electroplated portion 530 in a direction away from the non-electroplated portion 432. Thus, it is possible to suppress the adhering of moisture around the non-electroplated portion 432.

[0065] The specific examples of the present invention have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The technology described in the claims includes various modifications and alterations to the specific examples described above.

[0066] For example, in the fourth and fifth embodiments, the distances from the surface 420a of the base 420 of two adjacent terminals (e.g., terminals 414a and 414b) can be different. According to this structure, the distance between the unplated portions of two adjacent terminals can be reduced. For example, terminal 414a can also be embedded in the base 420 with a portion of its unplated portion 432, similar to terminal 14a.

[0067] In the first to third embodiments, the partition wall 22 of the base 20 may not be configured.

[0068] In the third embodiment, the cover portion 50 may not be configured.

[0069] Furthermore, the technical elements described in this invention or the accompanying drawings exert their usefulness individually or in various combinations, and are not limited to the combinations recorded in the claims at the time of application. Additionally, the techniques illustrated in this invention or the accompanying drawings can achieve multiple objectives simultaneously, and achieving one of these objectives is itself a useful technical achievement.

Claims

1. A connector, characterized in that, have: Base; and Multiple terminals, which are held in the base, protrude from the surface of the base, and are arranged spaced apart from each other, Each of the plurality of terminals has: The electroplated portion of the substrate is covered by a coating; and The non-electroplated portion of the substrate not covered by the coating The non-electroplated portion is disposed within the base. A portion of the non-electroplated portion is exposed from the surface of the base. The base has a partition wall that protrudes from the surface of the base between two adjacent terminals of the plurality of terminals. The height of the partition wall from the surface of the base is greater than the distance between two adjacent terminals.

2. The connector according to claim 1, characterized in that, The front end of the partition wall is formed by a curved surface.

3. The connector according to claim 1, characterized in that, It also has: A resin-made cover is disposed on the surface of the base, covering the portion of the unplated portion exposed from the surface of the base.

4. The connector according to any one of claims 1 to 3, characterized in that, In each of the plurality of terminals, the electroplated portion is inclined downward in a portion further away from the base than the unplated portion.

5. The connector according to any one of claims 1 to 3, characterized in that, The electroplated portions of the plurality of terminals extend at an angle relative to the base.

6. A connector, characterized in that, have: Base; and Multiple terminals, which are held in the base, protrude from the surface of the base, and are arranged spaced apart from each other, Each of the plurality of terminals includes: The electroplated portion of the substrate is covered by a coating; and The non-electroplated portion of the substrate not covered by the coating The non-electroplated portion is positioned away from the base. The distance from the surface of the base to the unplated portion is greater than or equal to the distance between the unplated portions of the two adjacent terminals.

7. The connector according to claim 6, characterized in that, In each of the plurality of terminals, the electroplated portion is inclined downward in a portion further away from the base than the unplated portion.

8. The connector according to claim 6, characterized in that, The electroplated portions of the plurality of terminals extend at an angle relative to the base.

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