高频模块和通信装置
By configuring a metal shielding plate on the high-frequency module substrate, the signal interference problem in dual uplink scenarios is solved, the isolation between transmission paths is improved, and more efficient signal transmission is achieved.
CN116615868BActive Publication Date: 2026-07-17MURATA MFG CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MURATA MFG CO LTD
- Filing Date
- 2021-10-28
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing high-frequency front-end modules, the isolation between the first and second transmission paths is insufficient when there are dual uplinks, leading to signal interference problems.
Method used
A metal shielding plate is configured on the module substrate to cover key components on the first and second transmission paths, thereby improving isolation through electromagnetic field shielding. This includes the layout design of components such as power amplifiers, transmission filters, and switching circuits.
Benefits of technology
It effectively suppresses signal interference between the first and second transmission paths, improves isolation in dual uplink scenarios, and ensures the independence and quality of signal transmission.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116615868B_ABST
Abstract
高频模块(1A)能够执行频段A的发送信号与频段C的发送的双上行链路，具备模块基板(91)、配置于主面(91a)的金属屏蔽板(86)、功率放大器(51及52)、频段A的发送滤波器(31T)以及频段C的发送滤波器(43T)，在俯视模块基板(91)的情况下，金属屏蔽板(86)配置于第一发送部件与第二发送部件之间，第一发送部件是功率放大器(51)、发送滤波器(31T)、开关电路(21)、配置于第一发送路径的第一电感器以及第一电容器中的任意部件，第二发送部件是功率放大器(52)、发送滤波器(43T)、开关电路(22)、配置于第二发送路径的第二电感器以及第二电容器中的任意部件。
Need to check novelty before this filing date? Find Prior Art