A method for preparing surface secondary structures

Abstract

This invention relates to the field of surface thermal functional structure fabrication, specifically a method for fabricating secondary surface structures. The method utilizes a wedge-shaped cutting tool with an array of microtextured side edges. The wedge-shaped tool is used to carve microgrooves onto a substrate surface, and simultaneously, the microtextured side edges are used to extrude and plastically shape the groove surface material, thus fabricating the secondary structure on the microgroove surface. In this method, the secondary microstructure is fabricated simultaneously with the microgroove carving process, allowing the entire process to be completed in one step without any additional processing steps, significantly improving processing efficiency. It offers advantages such as one-step forming, high efficiency, low cost, high precision, and suitability for large-area carving.

Description

Technical Field

[0001] This invention relates to the field of surface thermal functional structure preparation, and more specifically to a method for preparing surface secondary structures. Background Technology

[0002] Surface thermal functional structures typically refer to special structures created on the surface of materials, composed of a combination of microstructures, nanostructures, porous structures, ordered structures, layered structures, etc., giving them excellent performance in terms of heat transfer, thermal resistance, thermal radiation, and thermal diffusion. Research has found that secondary structures can further enhance the heat transfer performance of channel-type surface thermal functional structures.

[0003] However, the fabrication of secondary structures is a challenge. Currently, primary micro-pits, micro-grooves, and micro-protrusions can be fabricated using machining, electrochemical methods, and other techniques. Secondary microstructures are typically obtained by combining primary microstructures with other fabrication methods after the primary microstructures have been formed.

[0004] Since secondary microstructures are usually prepared after the formation of primary microstructures, the process is complex, costly, and time-consuming, and inevitably has certain side effects on the surface quality of the original primary microstructures. Summary of the Invention

[0005] To address the aforementioned issues, this invention proposes a method for preparing secondary surface structures. This method utilizes a scribing tool with a special array of microtextures on its side edges to prepare secondary structures, resulting in high forming efficiency and suitability for large-area scribing.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] A method for preparing a surface secondary structure involves using a wedge-shaped engraving tool with an array of side edge microtextures on its side edge surface. The wedge-shaped engraving tool is used to engrave and form microgrooves, and at the same time, the side edge microtextures are used to extrude and plastically shape the groove surface material to prepare the secondary structure on the groove surface.

[0008] Preferably, the wedge is made of cemented carbide, ceramic, diamond, PCD, high-speed steel, or sapphire.

[0009] Preferably, the preparation method of the side edge microtexture includes laser processing, wire electrical discharge machining, ultra-precision cutting, or electrolytic machining.

[0010] Preferably, when using a wedge cutter to carve microgrooves, the wedge cutter maintains a fixed pitch angle.

[0011] Preferably, the side edge microtexture is an extension structure formed along the side edge surface of the wedge cutter, and when using the wedge cutter to carve microgrooves, the extension direction of the side edge microtexture is consistent with the carving direction.

[0012] Preferably, the extension direction of the extension structure is consistent with the extension direction and pitch angle of the wedge-shaped engraving tool body.

[0013] Preferably, the included angle between the two side surfaces of the cutting tool is the tip angle, and the tip angle satisfies the formula...

[0014]

[0015] In the formula: β is the tool tip angle A, θ is the tool back angle, α is the pitch angle B during engraving, and ρ is the final groove angle.

[0016] As a preferred embodiment, the processing method of the side edge microtexture is as follows: taking the tool feed direction at a certain pitch angle as the Z-axis, adjusting the wedge cutting tool angle so that the angle between the main cutting edge and the Z-axis is the pitch angle, the processing equipment parallel to the feed direction performs side edge microtexture cutting processing through servo control in the X-axis and Y-axis directions.

[0017] The beneficial effects of using this invention are:

[0018] In the surface secondary structure preparation method of this invention, the secondary microstructure on the groove surface is processed simultaneously during the microgroove carving process using a wedge-shaped engraving tool. This allows the entire process to be completed in one step during the engraving process, eliminating the need for any additional processing steps and greatly improving processing efficiency. It has the advantages of one-time forming, high efficiency, low cost, high precision, and suitability for large-area engraving. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the surface secondary structure preparation method of the present invention.

[0020] Figure 2 This is a schematic diagram showing the relationship between the tip angle of the wedge tool used in the surface secondary structure preparation method of the present invention and the pitch angle and the angle of the groove formed during tool processing.

[0021] Figure 3 This is a schematic diagram of the etching direction for the surface secondary structure preparation method of the present invention.

[0022] Figure 4 This is a schematic diagram of the processing platform used in the surface secondary structure preparation method of the present invention.

[0023] Figure 5 This is a schematic diagram of the wedge-shaped engraving tool used in the surface secondary structure preparation method of the present invention.

[0024] Figure 6This is a schematic diagram of a wedge-shaped engraving tool with a 60° tip angle, which is used to prepare the surface secondary structure according to the present invention.

[0025] Figure 7 This image shows the effect of a wedge-shaped engraving tool used in the surface secondary structure preparation method of this invention.

[0026] The reference numerals in the figures include:

[0027] 1-Substrate, 2-Wedge engraving tool, 21-Side edge microtexture, 3-Forming groove, 31-Microgroove, 4-Position control tool holder, 5-Tool holder fixing plate, 6-Feed platform, 7-Electrode wire;

[0028] A - Knife tip angle; B - Pitch angle; C - Back chamfer angle. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this technical solution clearer, the following detailed description, in conjunction with specific embodiments, further illustrates this technical solution. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this technical solution.

[0030] like Figure 1 As shown, the present invention proposes a method for preparing a secondary structure on a surface. Specifically, a wedge cutter 2 is used, the side edge surface of which has an array of side edge microtextures 21. The wedge cutter 2 is used to cut and form microgrooves 31 on a substrate 1, and at the same time, the side edge microtextures 21 are used to extrude and plastically form the groove surface material to prepare the secondary structure on the surface of the microgrooves 31.

[0031] Preferably, the wedge-shaped engraving tool 2 is made of cemented carbide, diamond, PCD, high-speed steel, or sapphire, and the materials of the wedge-shaped engraving tool 2 include, but are not limited to, the materials mentioned above. The side-edge microtexture 21 is prepared by methods including laser processing, wire electrical discharge machining, ultra-precision cutting, or electrolytic machining, and the methods of preparing the side-edge microtexture 21 include, but are not limited to, the methods mentioned above. The material being processed is a ductile metal, including copper, aluminum, alloys, etc., widely used in the heat exchange field.

[0032] like Figure 2 As shown, this invention uses materials such as cemented carbide and PCD to prepare the front and rear cutting surfaces of the engraving body of the wedge engraving tool 2. The size of its tip angle A is related to the pitch angle B during the processing of the wedge engraving tool 2 and the angle of the formed groove 3. Among them, the pitch angle B is the angle between the extension direction of the main body and the horizontal direction when the wedge engraving tool 2 is fed in, the tip angle A is the angle between the two cutting edges of the lower part of the wedge engraving tool 2, and the back chamfer C is shown in the figure.

[0033] like Figure 3As shown, when using the wedge cutter 2 to carve the microgroove 31, the wedge cutter 2 maintains a fixed pitch angle B. The side edge microtexture 21 is an extension structure formed along the side edge surface of the wedge cutter 2. When using the wedge cutter 2 to carve the microgroove 31, the extension direction of the side edge microtexture 21 is consistent with the carving direction. The extension direction of the extension structure is consistent with the extension direction of the wedge cutter 2 body and the pitch angle B. The array of side edge microtextures 21 on the rake face of the tool is prepared by wire cutting, laser processing, etc., keeping the direction of the side edge microtexture 21 consistent with the carving direction (feed direction). The number, size, and spacing of the side edge microtextures 21 can be set according to actual needs.

[0034] like Figure 4 As shown, a scribing platform is used for scribing and shaping, ultimately forming microgrooves 31 with secondary structures on the material surface. In this embodiment, the scribing platform includes a tool holder fixing plate 5, with a posture control tool holder 4 mounted below the tool holder fixing plate 5. The posture control tool holder 4 adjusts the position and orientation of the wedge-shaped scribing tool 2 according to a predetermined process, such as adjusting the pitch angle B. The wedge-shaped scribing tool 2 is fixed below the posture control tool holder 4, with its cutting edge facing downwards. A feed platform 6 is provided below the wedge-shaped scribing tool 2. The feed platform 6 has a clamp to hold the substrate 1 to be processed. The function of the feed platform 6 is to carry the clamped substrate 1 and feed it in a predetermined direction. The wedge-shaped scribing tool 2 etchs and slides on the surface of the substrate 1 to form a forming groove 3, while simultaneously processing the microgrooves 31 through the side edge microtexture 21 on the edge face of the wedge-shaped scribing tool 2.

[0035] This embodiment takes the case where the final groove angle is 60° as an example. The calculation formula for the tip angle A at different pitch angles B is as follows.

[0036]

[0037] In the formula: β is the tool tip angle A, θ is the tool back angle, and α is the pitch angle B during marking.

[0038] like Figure 6 As shown, in this embodiment, wire electrical discharge machining is selected as an example to prepare the side edge microtexture 21 of the tool. The tool feed direction at a certain pitch angle B is taken as the Z-axis. The angle of the wedge cutter 2 is adjusted so that when the angle between the main cutting edge and the Z-axis is the pitch angle B, the electrode wire 7 parallel to the feed direction can perform microtextured wire electrical discharge machining through servo control in the X-axis and Y-axis directions. Figure 5 As shown. Taking the case where the final groove angle is 60° and the pitch angle B is 6° as an example, the projection angle of the tip angle A of the wedge cutter 2 along the feed direction is 60°. When the projection shape is determined, the movement trajectory of the electrode wire 7 during wire EDM can be programmed based on the projection contour.

[0039] The final secondary structure is as follows Figure 7 As shown, the secondary microstructure effect of the final formed groove 3 is directly related to the morphology of the side edge microtexture 21 of the wedge engraving tool 2. In this embodiment, the semi-circular side edge microtexture 21 is taken as an example.

[0040] The above content is only a preferred embodiment of the present invention. For those skilled in the art, many changes can be made in the specific implementation and application scope based on the ideas of the present invention. As long as these changes do not depart from the concept of the present invention, they all fall within the protection scope of this patent.

Claims

1. A method for preparing surface secondary structures, characterized in that: Using a wedge-shaped engraving tool with an array of side edge microtextures, microgrooves are engraved on the surface of a substrate, and the groove material is extruded and plastically shaped through the side edge microtextures during engraving to prepare a secondary structure on the surface of the microgrooves. When using a wedge cutter to carve microgrooves, the wedge cutter should maintain a fixed pitch angle. The side edge microtexture is an extension structure formed along the side edge surface of the wedge cutter. When using the wedge cutter to carve microgrooves, the extension direction of the side edge microtexture is consistent with the carving direction.

2. The method for preparing surface secondary structures according to claim 1, characterized in that: The wedge-shaped engraving tool is made of cemented carbide, diamond, PCD, high-speed steel, or sapphire.

3. The method for preparing surface secondary structures according to claim 1, characterized in that: The side-edge microtextures can be prepared by laser processing, wire electrical discharge machining, ultra-precision cutting, or electrolytic machining.

4. The method for preparing surface secondary structures according to claim 1, characterized in that: The extension direction of the extension structure is consistent with the extension direction and pitch angle of the wedge-shaped engraving tool body.

5. The method for preparing surface secondary structures according to claim 1, characterized in that: The included angle between the two side edges of the wedge is the tip angle, and the tip angle satisfies the formula: ； In the formula: Let A be the cutting tip angle of the tool. The back angle of the tool. B is the pitch angle during the marking process, and ρ is the final groove angle.

6. The method for preparing surface secondary structures according to claim 1, characterized in that: The processing method of the side edge microtexture is as follows: the feed direction of the wedge cutter at a certain pitch angle is taken as the Z-axis. The angle of the wedge cutter is adjusted so that the angle between the main cutting edge and the Z-axis is the pitch angle. The processing equipment parallel to the feed direction performs side edge microtexture cutting processing through servo control in the X-axis and Y-axis directions.

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