Pad carrier for use in a polishing or cleaning process

Abstract

A pad carrier assembly including a coupling base and a pad carrier coupled to the coupling base, the coupling base and pad carrier configured to support a polishing pad by a mechanical clamping mechanism.

Description

Technical Field

[0001] The embodiments described herein generally relate to equipment used in the manufacture of electronic devices, and more specifically to a horizontal pre-cleaning (HPC) module that can be used to clean the surface of a substrate in a semiconductor device manufacturing process. Background Technology

[0002] Chemical mechanical polishing (CMP) is commonly used in the fabrication of high-density integrated circuits to planarize or polish material layers deposited on a substrate. In the horizontal pre-clean (HPC) module used in CMP processes, a rotating polishing pad is pressed against the material layer on the substrate surface, and material is removed across the entire material layer through a combination of chemical and mechanical activity provided by the polishing slurry and the relative movement of the polishing pad and the substrate. Polishing pads made of polyvinyl alcohol (PVA) offer higher shear forces for chemical and mechanical polishing due to their mechanical strength and abrasion resistance compared to conventional polishing pads made of materials such as porous materials or filled or unfilled polymers. In addition to being inherently thicker and larger than conventional materials, PVA is also absorbent, soft, and elastic. Furthermore, the larger polishing pad improves performance and reduces polishing time in chemical mechanical cleaning. However, due to their inherent thickness and larger size, polishing pads made of PVA may sag when supported by a pad carrier.

[0003] Therefore, there is a need for systems and methods to support large and thick absorbent polishing pads while preventing the polishing pads from sagging. Summary of the Invention

[0004] Embodiments of this disclosure also provide a pad carrier assembly for use in a horizontal pre-cleaning module. A pad carrier assembly includes: a coupling base and a pad carrier coupled to the coupling base. The coupling base and the pad carrier are configured to support a polishing pad via a mechanical clamping mechanism.

[0005] Embodiments of this disclosure also provide a method for supporting a polishing pad in a horizontal pre-cleaning module. The method includes: mechanically clamping the polishing pad onto its peripheral edge via a lip portion of a coupling base and a tapered portion of a pad carrier, wherein the coupling base and the pad carrier are coupled and disposed in the horizontal pre-cleaning module, and supporting the polishing pad and preventing sagging by using one or more pad retaining features.

[0006] Embodiments of this disclosure may further provide a pad carrier for use in polishing or cleaning processes, the pad carrier comprising: a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm; and a support plate including a support body. The pad carrier assembly includes a clamping plate including a clamping body comprising: one or more ferromagnetic or paramagnetic material elements disposed within the clamping body; and a first retaining surface disposed on a first side of the clamping body. The support body of the support plate includes: a second retaining surface disposed on the first side of the support body; and a plurality of support plate retaining features. Each support plate retaining feature is configured to receive a pad retaining feature formed in the polishing pad when a lip portion of the polishing pad is positioned between the first retaining surface and the second retaining surface. The pad carrier may further include a coupling base, the coupling base including a coupling base body, the coupling base body including one or more ferromagnetic or paramagnetic material elements disposed within the body, wherein each of the one or more ferromagnetic or paramagnetic material elements within the coupling base body of the coupling base is configured to face each of the one or more ferromagnetic or paramagnetic material elements within the support body of the support plate when the coupling base is positioned above a second side of the support body of the support plate, and the second side of the support body of the support plate faces the first side. The one or more ferromagnetic or paramagnetic material elements in the coupling base or clamping plate may include ferromagnetic or paramagnetic elements formed in annular shape.

[0007] Embodiments of this disclosure may further provide a pad carrier for use in polishing or cleaning processes, the pad carrier including a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm. The pad carrier assembly includes: a coupling base including a coupling base body; and a support plate including a support body. The coupling base body of the coupling base includes: a magnet array; and a first retaining surface disposed on a first side of the coupling base body. The support body of the support plate includes: a magnet array disposed within the support body; a second retaining surface disposed on a first side of the support body; and a plurality of support plate retaining features. Each support plate retaining feature is configured to receive a pad retaining feature formed in the polishing pad when a lip portion of the polishing pad is positioned between the first retaining surface and the second retaining surface.

[0008] Embodiments of this disclosure may further provide a pad carrier for use in polishing or cleaning processes, the pad carrier including a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm. The pad carrier assembly includes: a clamping plate including a clamping body; and a support plate including a support body. The clamping body of the clamping plate includes: one or more magnets disposed within the clamping body; and a first retaining surface disposed on a first side of the clamping body. The support body of the support plate includes: a second retaining surface disposed on a first side of the support body; and a plurality of support plate retaining features. Each support plate retaining feature is configured to receive a pad retaining feature formed in the polishing pad when a lip portion of the polishing pad is positioned between the first retaining surface and the second retaining surface.

[0009] Embodiments of this disclosure may further provide a pad carrier for use in polishing or cleaning processes, the pad carrier including a pad carrier assembly configured to be coupled to a first end of a pad carrier positioning arm. The pad carrier assembly includes: a coupling base including a first retaining surface disposed on a first side of a coupling base body; and a support plate including a support body including a second retaining surface disposed on the first side of the support body. The support plate has a plurality of support plate retaining features, wherein each support plate retaining feature is configured to receive a pad retaining feature formed in the polishing pad when a lip portion of the polishing pad is positioned between the first retaining surface and the second retaining surface. Attached Figure Description

[0010] To gain a more detailed understanding of the features of this disclosure, a more specific description of the disclosure briefly summarized above can be obtained by referring to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings only show typical embodiments of this disclosure and should therefore not be considered as limiting its scope, as other equivalent embodiments are permissible.

[0011] Figure 1A This is a schematic plan view of an exemplary chemical mechanical polishing (CMP) treatment system according to one or more embodiments, the CMP treatment system using the horizontal pre-cleaning (HPC) module described herein.

[0012] Figure 1B It is possible to correspond to one or more embodiments. Figure 1A The schematic diagram shows a top isometric view of an exemplary CMP processing system.

[0013] Figure 1C It is possible to correspond to one or more embodiments. Figure 1A The schematic diagram shown Figure 1B A top-down front view of the CMP processing system.

[0014] Figure 2A It is a top isometric view of one side of an exemplary HPC module according to one or more embodiments.

[0015] Figure 2B This is a side cross-sectional view of an exemplary pad carrier positioning arm according to one or more embodiments.

[0016] Figures 3A to 3D Each is a side cross-sectional view of the coupling base and pad carrier according to one or more embodiments.

[0017] Figure 3E It is a top isometric view of a pad carrier according to one or more embodiments.

[0018] Figure 3F This is an exploded top side view of a component within a pad carrier according to one or more embodiments.

[0019] Figure 4A This is a side cross-sectional view of an exemplary coupling base and pad carrier according to one or more embodiments.

[0020] Figure 4B and Figure 4C These are plan views and side cross-sectional views of a pad carrier according to one or more embodiments.

[0021] Figure 4D This is a side cross-sectional view of a pad carrier according to one or more embodiments.

[0022] Figure 4E and Figure 4F This is a top view of a polishing pad according to one or more embodiments.

[0023] For ease of understanding, the same reference numerals have been used as much as possible to indicate common elements in the figures. It is contemplated that elements and features of one embodiment may be advantageously combined in other embodiments without further explanation. Detailed Implementation

[0024] The embodiments described herein generally relate to equipment used in the manufacture of electronic devices, and more specifically to a horizontal pre-cleaning (HPC) module that can be used to clean the surface of a substrate during a portion of a semiconductor device manufacturing process sequence.

[0025] During the cleaning process, polishing pads formed from polyvinyl alcohol (PVA) provide high shear force on the surface of the substrate to be cleaned. Due to the material's mechanical strength and abrasion resistance, this is used to remove residues from the substrate surface. However, in addition to being inherently thicker and larger than conventional pad materials, PVA is also absorbent, soft, and elastic, and therefore polishing pads formed from PVA may sag when supported by a pad carrier.

[0026] In the embodiments described herein, the pad carrier supports a large and thick absorbent polishing pad while preventing the polishing pad from sagging during the chemical mechanical cleaning process through the use of mechanical clamping mechanisms, interlocking features, magnetic clamping mechanisms, and / or suction clamping mechanisms.

[0027] Figure 1A This is a schematic plan view of an exemplary chemical mechanical polishing (CMP) treatment system 100 according to one or more embodiments, the CMP treatment system 100 using the horizontal pre-cleaning (HPC) module described herein. Figure 1B It is possible to correspond to one or more embodiments. Figure 1A The schematic diagram shows a top isometric view of an exemplary CMP processing system 100. Figure 1C It is possible to correspond to one or more embodiments. Figure 1A The schematic diagram shown Figure 1B A top-down front view of the CMP processing system 100. Figure 1B and Figure 1C In this diagram, certain parts of the housing and some other internal and external components are omitted to more clearly show the HPC module within the CMP processing system 100. Here, the CMP processing system 100 includes a first portion 105 and a second portion 106 coupled to and integrated with the first portion 105. The first portion 105 is a substrate polishing section characterized by multiple polishing stations (not shown).

[0028] The second part 106 includes one or more CMP post-cleaning systems 110, multiple system loading stations 130, one or more substrate transporters (e.g., a first robot 124 and a second robot 150), one or more metering stations 140, one or more position-specific polishing (LSP) modules 142, one or more HPC modules 200, and one or more drying units 170. The HPC modules 200 are configured to process substrates 120 arranged in a substantially horizontal orientation (i.e., in the xy plane). In some embodiments, the second part 106 may optionally include one or more vertical cleaning modules 112 configured to process substrates 120 arranged in a substantially vertical orientation (i.e., in the zy plane).

[0029] Each LSP module 142 is typically configured to polish only a portion of the substrate surface using a polishing member (not shown) having a smaller surface area than the substrate 120 to be polished. The LSP module 142 is typically used after the substrate 120 has been polished with a polishing module to finish (e.g., remove additional material) a relatively small portion of the substrate.

[0030] Metering station 140 is used to measure the thickness of the material layer disposed on substrate 120 before and / or after polishing, to inspect substrate 120 after polishing to determine whether the material layer has been removed from the field surface of substrate 120, and / or to inspect the substrate surface for defects before and / or after polishing. In those embodiments, based on the measurement or surface inspection results obtained using metering station 140, substrate 120 may be returned to the LSP module for further polishing and / or directed to a different substrate processing module or station (such as the polishing module within first section 105) or LSP module 142. Figure 1A As shown, metering station 140 and LSP module 142 are located in the area of ​​the second part 106, which is above (in the Z direction) a portion of one of the CMP post-cleaning systems 110.

[0031] A first robot 124 is positioned to transport substrate 120 in and out of multiple system loading stations 130, for example, between the multiple system loading stations 130 and a second robot 150 and / or between a CMP post-cleaning system 110 and the multiple system loading stations 130. In some embodiments, the first robot 124 is positioned to transport substrate 120 between any of the system loading stations 130 and a processing system located near said system loading station 130. For example, in some embodiments, the first robot 124 may be used to transport substrate 120 between one of the system loading stations 130 and a metering station 140.

[0032] The second robot 150 is used to transfer the substrate 120 between the first section 105 and the second section 106. For example, here, the second robot 150 is positioned to transfer the substrate 120 to be polished, received from the first robot 124, to the first section 105 for polishing therein. The second robot 150 is then used to transfer the polished substrate 120 from the first section 105 (e.g., from a transfer station (not shown) within the first section 105) to one of the HPC modules 200 and / or between different stations and modules located within the second section 106. Alternatively, the second robot 150 transfers the substrate 120 from a transfer station within the first section 105 to one of the LSP module 142 or the metering station 140. The second robot 150 may also transfer the substrate 120 from either the LSP module 142 or the metering station 140 to the first section 105 for further polishing therein.

[0033] Figure 1A The CMP treatment system 100 is characterized by two CMP post-cleaning systems 110 disposed on either side of the second robot 150. Figure 1A In this configuration, at least some modules of one of the CMP post-cleaning systems 110 (e.g., one or more vertical cleaning modules 112) are located below the metering station 140 and the LSP module 142 (in the Z direction) and are therefore not shown. The metering station 140 and the LSP module 142 are not shown. Figure 1C As shown in the figure. In some other embodiments, the CMP processing system 100 is characterized by having only one CMP post-cleaning system 110. Here, each of the CMP post-cleaning systems 110 includes an HPC module 200, one or more vertical cleaning modules 112 (e.g., brush cassettes or spray boxes), a drying unit 170, and a substrate transporter 180 for transferring the substrate 120 between the two. Here, each HPC module 200 is located within the second portion 106 near the first portion 105.

[0034] Typically, HPC module 200 receives polished substrate 120 from second robot 150 through a first opening (not shown) formed in a side panel of HPC module 200 (e.g., through a door or slit valve provided in the side panel). Substrate 120 is received by HPC module 200 in a horizontal orientation for positioning on a substrate support surface disposed therein. Then, HPC module 200 performs a pre-cleaning process, such as a polishing process, on substrate 120 before transferring substrate 120 from HPC module 200 using substrate transporter 180.

[0035] The substrate 120 passes through the second opening (here, opening 224). Figure 1B The substrate 120 is transferred from the HPC module 200. The second opening is typically a horizontal slot disposed through a second side panel of the HPC module 200, which can be closed with a door (e.g., a slit valve). Therefore, when the substrate 120 is transferred from the HPC module 200, the substrate 120 remains in a horizontal orientation. After the substrate 120 is transferred from the HPC module 200, the substrate transporter 180 swings the substrate 120 to a vertical position for further processing in the vertical cleaning module 112 of the CMP post-cleaning system 110.

[0036] In this example, HPC module 200 has a first end 202 facing a first portion 105 of CMP processing system 100, a second end 204 away from the first end 202, a first side 206 facing a second robot 150, and a second side 208 away from the first side 206. The first side 206 and the second side 208 extend orthogonally between the first end 202 and the second end 204.

[0037] Multiple vertical cleaning modules 112 are located within the second section 106. One or more vertical cleaning modules 112 are any or a combination of contact and non-contact cleaning systems for removing polishing byproducts from the surface of a substrate, such as spray boxes and / or brush cassettes.

[0038] The drying unit 170 is used to dry the substrate 120 after it has been processed by the vertical cleaning module 112 and before it is transferred to the system loading station 130 by the first robot 124. Here, the drying unit 170 is a horizontal drying unit, such that the drying unit 170 is configured to receive the substrate 120 through an opening (not shown) when the substrate 120 is set in a horizontal orientation.

[0039] In this document, substrate 120 is moved between HPC module 200 and vertical cleaning module 112, between each other in vertical cleaning module 112, and between vertical cleaning module 112 and drying unit 170 using substrate transporter 180.

[0040] In the embodiments described herein, the operation of the CMP processing system 100, including the substrate transporter 180, is directed by a system controller 160. The system controller 160 includes a programmable central processing unit (CPU) 161, which operates in conjunction with memory 162 (e.g., non-volatile memory) and support circuitry 163. The support circuitry 163 is conventionally coupled to the CPU 161 and includes caches, clock circuitry, input / output subsystems, power supplies, and combinations thereof coupled to various components of the CMP processing system 100 to facilitate control of the various components of the CMP processing system 100. The CPU 161 is one of any form of general-purpose computer processor used in an industrial environment (such as a programmable logic controller (PLC)) for controlling the various components and subprocessors of the processing system. The memory 162 coupled to the CPU 161 is non-transitory and is typically one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), floppy disk drives, hard disks, or any other form of local or remote digital storage.

[0041] Typically, memory 162 is in the form of a non-transitory computer-readable storage medium (e.g., non-volatile memory) containing instructions that, when executed by CPU 161, facilitate the operation of CMP processing system 100. The instructions in memory 162 are in the form of a program product, such as a program implementing the methods of this disclosure. Program code may conform to any of many different programming languages. In one example, this disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program product(s) define the functionality of embodiments (including the methods described herein).

[0042] Illustrative non-transitory computer-readable storage media include, but are not limited to: (i) non-writable storage media on which information can be permanently stored (e.g., read-only memory devices within a computer, such as CD-ROM discs readable by a CD-ROM drive, flash memory, ROM chips, or any type of solid-state non-volatile semiconductor memory device, such as a solid-state drive (SSD)); and (ii) writable storage media on which changeable information is stored (e.g., floppy disks or any type of solid-state random access semiconductor memory within a disk drive or hard disk drive). Such computer-readable storage media are embodiments of this disclosure when implementing computer-readable instructions that guide the functionality of the methods described herein. In some embodiments, the methods or portions thereof described herein are performed by one or more application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other types of hardware implementations. In some other embodiments, the substrate handling and / or transport methods described herein are performed by a combination of software routines, ASICs, FPGAs, and / or other types of hardware implementations. One or more system controllers 160 may be used with one or any combination of the various modular polishing systems described herein and / or individual polishing modules of the modular polishing systems.

[0043] Figure 2A This is a top isometric view of the second side 208 of an exemplary HPC module 200 that can be used in the CMP processing system 100 described herein. Figure 2A The maintenance access panel has been omitted to more clearly show the internal components of the HPC module 200.

[0044] Typically, HPC module 200 includes a chamber 210, a basin 214, and a cover 216 formed by a plurality of side panels that commonly define a processing area 212.

[0045] A first side panel 218 is formed on a first side 206 of the HPC module 200 facing the second robot 150 and includes a first substrate transporter inlet / outlet (not shown) for positioning the substrate 120 on the rotatable vacuum stage 230 by the second robot 150. A second side panel 222 is formed on a second end 204 of the HPC module 200 opposite to the first portion 105. The second side panel 222 includes a second substrate transporter inlet / outlet opening 224 for removing the substrate 120 from the rotatable vacuum stage 230 by a substrate transporter 180. A third side panel 226 is formed on a second side 208 of the HPC module 200. The third side panel 226 includes a maintenance access panel opening 228. The symmetry of the first substrate transporter inlet / outlet and the maintenance access panel opening 228 formed on the opposite side panels of the HPC module 200 advantageously provides a horizontal polishing module that can be mounted on either side of the processing system 100, such as... Figure 1C As shown.

[0046] The HPC module 200, located within the processing area 212, further includes a rotatable vacuum stage 230 for vacuum clamping the substrate 120, an annular substrate lifting mechanism 270 disposed radially outside the rotatable vacuum stage 230, a pad adjustment station 280 disposed near the rotatable vacuum stage 230, and a pad carrier positioning arm 300 movable between a first position on the rotatable vacuum stage 230 and a second position on the pad adjustment station 280. The rotatable vacuum stage 230, the annular substrate lifting mechanism 270, the pad adjustment station 280, and the pad carrier positioning arm 300 are each independently mounted to the basin 214.

[0047] Figure 2B It can be used Figure 2A A side cross-sectional view of an exemplary pad carrier positioning arm 300 in the HPC module 200. The pad carrier positioning arm 300 is positioned close to the rotatable vacuum stage 230 and the pad adjustment station 280. Figure 2A The distal end 302 of the pad carrier positioning arm 300 includes a vertically movable pad carrier assembly 304 for supporting a polishing pad 306 at its lower end. The pad carrier assembly 304 includes a head motor 308 for rotating the polishing pad 306 about an axis c2 substantially aligned in the direction of gravity. The pad carrier assembly 304 includes a coupling base 310 coupled to the head motor 308 via a shaft 311 and also coupled to the head motor 308. In some embodiments, the pad carrier 314 is sized to support a polishing pad 306 having a diameter between about 40 mm and 150 mm, such as between about 70 mm and 150 mm, such as about 134 mm, which is larger than that of conventional polishing pads used in similar cleaning modules. In some embodiments, the pad carrier positioning arm 300 of this disclosure supports a larger polishing pad 306 compared to a conventional pre-cleaning module.

[0048] During processing in HPC module 200, substrate 120 is transported through an opening formed in first side panel 226 by a second robot 150 and positioned on a plurality of lifting rods within lifting rod assembly 203, thereby positioning the substrate on a rotatable vacuum stage 230. Lifting rod assembly 203 includes a plurality of lifting rods that can be raised and lowered using lifting rod actuators (not shown) to allow positioning and removal of substrate 120 from the surface of rotatable vacuum stage 230. A vacuum is then created between substrate 120 and the opening formed in the surface of rotatable vacuum stage 230 using pump 219. Rotary polishing pad 306 is then brought into contact with the surface of substrate using head motor 308 and actuator assembly 217. In some embodiments, rotatable vacuum stage 230 and substrate 120 are also rotated during processing using rotatable actuator 227. The rotary polishing pad 306 can then be translated across the surface of the substrate 120 using a rotatable actuator 213 in an oscillating arc motion. In some embodiments, the rotatable actuator 213 can oscillate the rotary polishing pad 306 in a rotational motion covering an angle less than the entire 360 ​​degrees. As the rotary polishing pad 306 translates across the surface of the substrate 120, a first processing fluid (such as DI water and / or one or more first cleaning fluids) can be applied from a fluid source 221 to the surface of the substrate 120. After processing has reached a desired time period, processing is stopped, and the substrate is removed from the HPC module 200 by performing the steps mentioned above in reverse order. However, as will be explained below, the substrate can be advantageously removed from the HPC module 200 through the opening 209 using a second robot 150 or a third robot (not shown).

[0049] Figure 3A An embodiment of this disclosure is available. Figure 2AThe image shows a side cross-sectional view of the pad carrier 314 used in the pad carrier assembly 304. The pad carrier 314 includes a coupling base 310, a support plate 315, and a polishing pad 306. In some embodiments, the coupling base 310 and the support plate 315 are coupled together via magnetic attraction generated by a plurality of magnets 318 disposed within the support plate 315 and a plurality of magnets 316 disposed within the coupling base 310. The plurality of magnets 318 disposed within the support plate 315 and the plurality of magnets 316 disposed together with the coupling base 310 are also configured to supply a clamping force between the coupling base 310 and the support plate 315 for compressing the lip portion 306A of the polishing pad 306. In some embodiments, the coupling base 310 is a flexible element configured to receive the support plate 315. In some embodiments, the magnet 316 in the coupling base 310 is an electromagnet that receives power from an external power source (not shown), which is connected to the electromagnet in the coupling base 310 via a slip ring coupled to the rotating shaft 311 of the head motor 308. In some embodiments, the magnet 318 or magnet 316 may be replaced with a ferromagnetic material or even some paramagnetic material, which is attracted by a relative magnet (such as magnet 316 or magnet 318 respectively). In some embodiments, magnets 316 and 318 are similarly positioned around the central axis of the pad carrier 314 (e.g., with...). Figure 2B The array is distributed with axes (c2 and the axis of the magnetic field) coinciding with the axis shown. In some embodiments, the magnet array 316 or magnet array 318 is replaced by a ring element that is ferromagnetic or paramagnetic and has a central axis coinciding with the central axis of the pad carrier 314. Alternatively, as Figure 3B As shown, the support plate 315 includes a threaded hole 363 in its top surface. The coupling base 310 and the support plate 315 are coupled together by a plurality of fasteners 320 and threaded holes 363, which are also configured to provide a clamping force between the coupling base 310 and the support plate 315, the clamping force being used to compress the lip portion 306A of the polishing pad 306. In some embodiments, both the magnet and the fasteners are used to couple the support plate 315 to the coupling base 310. In one embodiment, the coupling base 310 can be connected to a shaft 311 (e.g., ...) via a quick-release attachment (not shown). Figure 2B As shown), the pad carrier 314 can be easily removed to replace the polishing pad 306 on the pad carrier 314, and then the pad carrier 314 can be quickly reinstalled on the shaft 311.

[0050] In some embodiments, such as Figures 3C to 3D As shown, the pad carrier 314 includes the components described above. Figure 3A and Figure 3BThe described coupling base 310 and support plate 315, and further include clamping plate 312, and as combined, these components are configured to clamp and retain the lip portion 306A of the polishing pad 306. Figure 3E A top isometric view of one embodiment of a clamping plate 312 coupled to a polishing pad 306 is further shown. The clamping plate 312 includes a body 312E, which includes an array of enclosed regions 312F, each enclosed region 312F including a magnet 318, a countersunk hole region 312C, a groove 312D, and a surface 312A. Reference Figure 3C , Figure 3D and Figure 3E The coupling base 310, clamping plate 312, and support plate 315 can be positioned, coupled, and aligned relative to each other using positioning elements 312B and / or mating elements (such as the groove 312D of the clamping plate 312 and the mating element 310B of the coupling base 310) located in the central region. In some embodiments, the mating element in the central region is formed in a non-cylindrical or non-circular shape in the XY plane, such as rectangular, elliptical, or even star-shaped, to allow the mating element to transmit torque between the coupling base 310 and the clamping plate 312. In some embodiments, such as Figure 3C As shown, the coupling base 310 and the clamping plate 312 are coupled via magnetic attraction generated by a plurality of magnets 318 disposed within the clamping plate 312 and a plurality of magnets 316 disposed together with the coupling base 310. Alternatively, in such Figure 3D In one embodiment shown, the clamping plate 312 includes a plurality of countersunk threaded holes 362, each countersunk threaded hole 362 being configured to receive a fastener 320. The engagement of the coupling base 310 and the clamping plate 312 is coupled via the plurality of fasteners 320 and the threaded holes 362. In some embodiments, both magnets and fasteners are used to couple the clamping plate 312 to the coupling base 310.

[0051] Figure 3FAn exploded view of one embodiment of the support plate 315 and the polishing pad 306 is shown. The support plate 315 includes a plurality of support plate retaining features 315C, a surface 315A, and may optionally include a plurality of threaded features configured to receive part of a fastener 320. In some embodiments, the support plate 315 further includes a plurality of enclosed regions (not shown), each enclosed region containing a magnet 318, as discussed similarly above. In some embodiments, the support plate 315 further includes one or more interlocking features, such as a recess 315D at a peripheral edge in the support plate 315. The recess 315D is provided to further improve the retention of the lip portion 306A of the polishing pad 306 between the support plate 315 and the coupling base 310, or in some embodiments, between the support plate 315 and the clamping plate 312. In some embodiments, the polishing pad 306 is overmolded onto the support plate 315 such that they are inseparable components.

[0052] In some embodiments, the polishing pad 306 is formed of polyvinyl alcohol (PVA) material. PVA material is hydrophilic and absorbs and retains water. When wetted, PVA material is elastic, flexible, and soft, possessing mechanical strength and abrasion resistance. Compared to conventional materials used as polishing pads (such as porous materials or filled or unfilled polymer materials), PVA material provides high shear strength for chemical and mechanical cleaning. The polishing pad 306 formed of PVA material has a diameter greater than 70 mm, which is larger than the diameter of a typical polishing pad formed of conventional materials with a diameter of approximately 67 mm. The larger polishing pad improves performance and reduces polishing time in chemical-mechanical cleaning. Furthermore, the polishing pad 306 formed of PVA material is thicker than a typical polishing pad formed of conventional materials. The pad carrier 314 is designed to support the large and thick absorbent polishing pad 306 while preventing sagging of the polishing pad 306 by mechanical clamping and support mechanisms.

[0053] In one embodiment, reference Figure 3A When positioned against the coupling base 310 and ready to perform the polishing process, the lip portion 306A of the polishing pad 306 is compressed between the corresponding two surfaces 310A and 315A of the coupling base 310 and the support plate 315. Magnetic attraction generated between the magnet 318 of the support plate 315 and the magnet 316 of the coupling base 310 generates a force that compresses the lip portion 306A of the polishing pad 306 between the surface 315A of the support plate 315 and the surface 310A of the coupling base 310. In one embodiment, the two surfaces 310A and 315A are substantially parallel to each other. In some embodiments, the opposing surfaces of the surface 315A and / or the lip portion 306A include one or more interlocking features, such as... Figure 3FThe recess 315D in the support plate 315 is shown. An interlocking feature is provided to further improve the retention of the lip portion 306A of the polishing pad 306 between surfaces 310A and 315A. In some embodiments, the clamping areas of surfaces 310A and 315A (where the lip portion 306A is disposed during processing) are oriented such that they are perpendicular to the direction in which magnets 318 and 316 are aligned (i.e., the Z direction) and / or parallel to the polishing surface 306D of the polishing pad 306 (e.g., the XY plane). In some embodiments, as... Figure 3B , Figure 3C and Figure 3D As shown, a plurality of fasteners 320 are configured to supply clamping force for compressing the lip portion 306A of the polishing pad 306. In some embodiments, the fasteners 320 may include one or more locating pins. In any configuration of magnets 316 and 318 or fasteners 320, the material within the lip portion 306A may be compressed to between about 5% and 95% of its uncompressed state, such as between about 20% and about 80% of the original thickness of the material (e.g., PVA) of the lip portion 306A of the polishing pad 306, or between about 40% and about 60%.

[0054] refer to Figures 3A to 3D and Figure 3F In some embodiments, the pad carrier 314 includes a plurality of retaining features 335, wherein a pad retaining feature 306C of the polishing pad 306 engages with a support plate retaining feature 315C of the support plate 315. The retaining features 335 form part of a mechanical clamping mechanism and are used to position and retain the polishing pad 306 relative to the support plate 315 during processing, and thus to position and retain the polishing pad 306 relative to the support plate 315 after the polishing pad 306 has been impregnated with processing chemicals and / or while various shear and compressive loads are applied during processing. The retaining features 335 also serve to prevent portions of the polishing pad 306 from sagging relative to the support plate 315. Sagging of the polishing pad 306 may undesirably cause the sagging portion of the polishing pad 306 to contact the surface of the substrate when the substrate is moved relative to the pad carrier 314 before or after a polishing process is performed on the substrate.

[0055] refer to Figure 3FIn some embodiments, the polishing pad 306 and the support plate 315 each include a pad retaining feature 306C and a support plate retaining feature 315C, respectively, which are patterned to minimize or prevent sagging of the polishing pad 306 and mechanically clamp the pad 306 to the support plate to reliably handle loads applied to the polishing pad 306 during processing. In some embodiments, a retaining feature 335 may be formed such that the pad retaining feature 306C and the support plate retaining feature 315C form an overlapping fit and / or interference fit capable of substantially fixing the position of the polishing pad 306 relative to the support plate 315. Figures 3A to 3D As shown, the pad retaining feature 306C may be formed in an inverted conical shape, and the support plate retaining feature 315C may be formed in a countersunk hole configuration such that the topmost portion of the pad retaining feature 306C overlaps with the lower portion of the support plate retaining feature 315C. In some embodiments, the pad retaining feature 306C and the support plate retaining feature 315C of each of the plurality of retaining features 335 are formed in a circular, elliptical, spiral, or grooved configuration. In some configurations, the array or pattern of retaining features 335 includes two or more different retaining feature shapes.

[0056] Figure 4A This is a side sectional view of an exemplary pad carrier 314, which includes components suitable for use with... Figure 2B The pad carrier assembly 304 includes a coupling base 310 and a support plate 315. In some embodiments, the coupling base 310 includes a magnet 316, and the support plate 315 includes a magnet 318, such that the coupling base 310 and the pad carrier 314 are magnetically coupled. In some embodiments, the magnets 316 and 318 are similarly positioned around the central axis of the pad carrier 314 (e.g., with...). Figure 2B The array of magnets 316 and 318 is distributed in an array (the axes coinciding with axis c2 shown). In one embodiment, magnets 316 and 318 comprise ferromagnetic or paramagnetic materials. In some embodiments, the magnet array 316 or 318 is replaced by a ring element that is ferromagnetic or paramagnetic and has a central axis coinciding with the central axis of the pad carrier 314. The coupling base 310 and the support plate 315 are aligned via fasteners 320. In some embodiments, fasteners 320 may include screws and bolts. In an alternative embodiment, the coupling base 310 and the support plate 315 are aligned via alignment pins or locating pins.

[0057] The pad carrier 314 may also include a lip ring 321 having a peripheral lip ring portion 322 on its peripheral edge. The support plate 315 includes a tapered portion 324 on its peripheral edge, the tapered portion 324 tapering from the bottom surface of the support plate 315 toward the top surface of the support plate 315 facing the coupling base 310, such that the tapered portion 324 is substantially parallel to the inner surface of the peripheral lip ring portion 322 of the lip ring 321. The peripheral lip ring portion 322 of the lip ring 321 and the tapered portion 324 of the support plate 315 together mechanically clamp the polishing pad 306 along the peripheral edge of the polishing pad lip portion 306A. The support plate 315 has a diameter on its bottom surface between about 70 mm and 150 mm, such as about 128 mm, and a thickness between about 2 mm and 10 mm, or between about 3 mm and 7 mm, such as about 4.2 mm. In some embodiments, the diameter of the support plate 315 on the top surface is between about 1 mm and about 5 mm smaller than the diameter of the support plate 315.

[0058] Figure 4B and Figure 4C These are plan views and side cross-sectional views of a pad carrier 314 according to one embodiment. Figure 4C The image also shows a portion of a lip ring 321, a support plate 315, and a polishing pad 306. In some embodiments, the pad carrier 314 includes a plurality of retaining features 335, wherein a pad retaining feature 306C of the polishing pad 306 engages with a support plate retaining feature 315C of the support plate 315. The support plate 315 includes a support plate retaining feature 315C, through which the pad retaining feature 306C is pushed. The support plate retaining feature 315C is a circular through-hole having a diameter between about 10 mm and about 25 mm, such as about 15 mm, and tapers negatively from the surface facing the coupling base 310 toward the surface facing the polishing pad 306 (i.e., the diameter at the surface facing the coupling base 310 is larger than the diameter at the surface facing the polishing pad 306). The pad retaining feature 306C is cylindrical in shape, with a diameter slightly larger than that of the support plate retaining feature 315C, such that the pad retaining feature 306C is compressed when inserted into the support plate retaining feature 315C. The coupling base 310, lip ring 321, and support plate 315 can be formed of plastic or polymer (such as polyetheretherketone (PEEK)). A mechanical clamping mechanism can be used to securely support the polishing pad 306, the mechanical clamping mechanism including a peripheral lip portion 322 of the lip ring 321, a tapered portion 324 at the peripheral edge of the support plate 315, and the support plate retaining feature 315C and the pad retaining feature 306C. Figure 4B and Figure 4C The image shows a circular support plate retaining feature 315C and a cylindrical pad retaining feature 306C. However, as... Figure 3FAs shown, the support plate 315 may have a plurality of support plate retaining features 315C, each support plate retaining feature 315C receiving a pad retaining feature 306C to generate a retaining force 314 that holds the polishing pad 306 in position relative to the pad carrier. The pad retaining feature 306C may be of any protruding shape, and the support plate retaining feature 315C has a shape that matches the shape of the pad retaining feature 306C, such that the pad retaining feature 306C and the support plate retaining feature 315C form an overlapping fit and / or interference fit for holding the polishing pad 306.

[0059] Figure 4D This is a side cross-sectional view of a pad carrier 314 according to another embodiment. The pad carrier 314 includes a central support plate retaining feature 315C, through which a pad retaining feature 306C is pushed into the support plate retaining feature 315C, as shown in... Figure 4C As shown in the illustrated embodiment. In this embodiment, a backing 330 that contacts the polishing pad 306 is disposed on the surface of the polishing pad 306. The backing 330 may be disposed on the surface of the polishing pad 306 facing the support plate 315. The backing 330 may be formed of plastic and increases the rigidity of the polishing pad 306, thereby further preventing the polishing pad 306 from sagging. In some embodiments, the raised pad retaining feature 306C may include a cavity or hole 327 in the top surface of the pad retaining feature 306C, and a disc 328 that matches the shape of the hole 327 may be inserted into the hole 327. The pad hole may be of any shape, preferably a shape that matches the shape of the pad retaining feature 306C, and the disc 328 has a shape that matches the shape of the hole 327 but is slightly wider in diameter, such that the hole 327 in the pad retaining feature 306C and the disc 328 form an overlapping fit and / or interference fit for further creating an enhanced pressure fit between the pad retaining feature 306C and the support plate retaining feature 315C. In this embodiment, the disk 328 may be formed of plastic or polymer, such as polyetheretherketone (PEEK), or other solid chemical-resistant materials, such as ceramic, aluminum, or stainless steel.

[0060] Figure 4E and Figure 4F This is a top view of a polishing pad 306 according to other embodiments. In these embodiments, the polishing pad 306 has raised pad retaining features 306C formed on the surface of the polishing pad 306 facing the support plate 315, and the support plate 315 has a plurality of support plate retaining features 315C, one of which engages with each of the plurality of support plate retaining features 315C. The pad retaining features 306C of the polishing pad 306 are arranged to be inserted into the support plate retaining features 315C of the support plate 315 in an overlapping contact manner, thereby generating a retaining force to hold the polishing pad 306 against the pad carrier 314. Figure 4EIn this configuration, multiple raised pad retaining features 306C are cylindrical in shape, and each of the pad retaining features 306C engages in a matching support plate retaining feature 315C of the support plate 315. Figure 4F In the middle, the pad holding feature 306C includes a column-shaped central pad holding feature 306C, which engages in a circular support plate holding feature 315C that matches the column shape, and the pad holding feature 306C also includes radial spokes, each of which engages in a rectangular groove-shaped support plate holding feature 315C that matches the shape of the radial spokes.

[0061] In the embodiments described herein, a pad carrier supports a large, thick, absorbent polishing pad (such as a polishing pad made of polyvinyl alcohol (PVA) material), while a mechanical clamping mechanism prevents the polishing pad from sagging during chemical-mechanical cleaning. Polishing pads made of PVA material provide high shear forces for chemical and mechanical polishing due to their mechanical strength and abrasion resistance. The large size of the polishing pad provides improved cleaning performance.

[0062] Embodiments of this disclosure may also provide a horizontal pre-cleaning module. The horizontal pre-cleaning module includes: a chamber including a basin and a lid that collectively define a processing area; a rotatable vacuum stage disposed in the processing area, the rotatable vacuum stage including a substrate receiving surface; a pad adjustment station disposed adjacent to the rotatable vacuum stage; a pad carrier positioning arm having a first end and a second end remote from the first end; a pad carrier assembly coupled to the first end of the pad carrier positioning arm; and an actuator coupled to the second end of the pad carrier positioning arm and configured to oscillate the pad carrier assembly between a first position on the rotatable vacuum stage and a second position on the pad adjustment station. The pad carrier assembly includes a coupling base and a pad carrier coupled to the coupling base, the coupling base and the pad carrier being configured to support a polishing pad via a mechanical clamping mechanism.

[0063] While the foregoing describes embodiments of this disclosure, other and further embodiments of this disclosure may be conceived without departing from its basic scope, and the scope of this disclosure is defined by the appended claims.

Claims

1. A pad carrier for use in polishing or cleaning processes, characterized in that, The pad carrier includes: A pad carrier assembly, configured to be coupled to a first end of a pad carrier positioning arm, wherein the pad carrier assembly includes: A clamping plate, the clamping plate including a clamping body, the clamping body including: One or more ferromagnetic or paramagnetic material elements, said one or more ferromagnetic or paramagnetic material elements being disposed within the clamping body; and A first retaining surface is disposed on a first side of the clamping body; and The support plate includes a support body, which includes: A second retaining surface is disposed on the first side of the support body; and Multiple support plates maintain their characteristics. Each support plate retaining feature is configured to receive a pad retaining feature formed in the polishing pad when the lip portion of the polishing pad is positioned between the first retaining surface and the second retaining surface.

2. The pad carrier as described in claim 1, characterized in that, The pad carrier further includes a coupling base, the coupling base including a coupling base body, the coupling base body including one or more ferromagnetic or paramagnetic material elements disposed within the coupling base body, wherein... Each of the one or more ferromagnetic or paramagnetic material elements within the coupling base body of the coupling base is configured to be opposite each of the one or more ferromagnetic or paramagnetic material elements within the clamping body of the clamping plate when the coupling base is positioned above the second side of the clamping body of the clamping plate, and The second side of the clamping body of the clamping plate is opposite to the first side.

3. The pad carrier as described in claim 2, characterized in that, The one or more ferromagnetic or paramagnetic material elements in the coupling base or the clamping plate include ferromagnetic or paramagnetic elements formed in annular shape.

4. The pad carrier as described in claim 1, characterized in that, The one or more ferromagnetic or paramagnetic material elements comprise an array of magnetic ferromagnetic elements.

5. The pad carrier as described in claim 1, characterized in that, The one or more ferromagnetic or paramagnetic material elements include ferromagnetic or paramagnetic elements formed in a ring shape.

6. The pad carrier as described in claim 1, characterized in that, The support plate further includes one or more interlocking features at the peripheral edge of the second retaining surface.

7. The pad carrier as described in claim 1, characterized in that, The pad holding feature is formed in an inverted conical shape, and the support plate holding feature is formed in a countersunk hole configuration, such that the topmost portion of the pad holding feature overlaps with the lower portion of the support plate holding feature.

8. A pad carrier for use in polishing or cleaning processes, characterized in that, The pad carrier includes: A pad carrier assembly, configured to be coupled to a first end of a pad carrier positioning arm, wherein the pad carrier assembly includes: Coupling base, the coupling base including a coupling base body, the coupling base body including: A magnet array, wherein the magnet array is disposed within the coupling base body; and A first retaining surface is disposed on a first side of the coupling base body; The support plate includes a support body, which includes: A magnet array, wherein the magnet array is disposed within the support body; and A second retaining surface is disposed on the first side of the support body; and Multiple support plates maintain their characteristics. Each support plate retaining feature is configured to receive a pad retaining feature formed in the polishing pad when the lip portion of the polishing pad is positioned between a first retaining surface and a second retaining surface, and wherein the pad retaining feature is formed in a solid inverted conical shape, and the support plate retaining feature is formed in a countersunk hole configuration such that the topmost portion of each of the pad retaining features overlaps with the lower portion of each of the support plate retaining features.

9. The pad carrier as described in claim 8, characterized in that, Each magnet in the magnet array within the coupling base body of the coupling base is configured to be opposite to each magnet in the magnet array within the support body of the support plate when the coupling base is positioned above the second side of the support body of the support plate, and The second side of the support body of the support plate is opposite to the first side.

10. The pad carrier as described in claim 8, characterized in that, The magnet array within the coupling base body of the coupling base or the magnet within the support body of the support plate includes ferromagnetic or paramagnetic elements.

11. The pad carrier as described in claim 8, characterized in that, The magnet array within the coupling base body of the coupling base and the magnet array within the support body of the support plate are formed in a ring shape.

12. A pad carrier for use in polishing or cleaning processes, characterized in that, The pad carrier includes: A pad carrier assembly, configured to be coupled to a first end of a pad carrier positioning arm, wherein the pad carrier assembly includes: A clamping plate, the clamping plate including a clamping body, the clamping body including: A magnet array, wherein the magnet array is disposed within the clamping body; and A first retaining surface is disposed on a first side of the clamping body; and The support plate includes a support body, which includes: A second retaining surface is disposed on the first side of the support body; and Multiple support plates maintain their characteristics. Each support plate retaining feature is configured to receive a pad retaining feature formed in the polishing pad when the lip portion of the polishing pad is positioned between the first retaining surface and the second retaining surface.

13. The pad carrier as described in claim 12, characterized in that, The pad carrier further includes a coupling base, the coupling base including a coupling base body, the coupling base body including a magnet array disposed within the coupling base body, wherein... Each magnet of the magnet array within the coupling base body is configured to be opposite to each of the magnets in the magnet array within the clamping body of the clamping plate when the coupling base is positioned above the second side of the clamping body of the clamping plate, and The second side of the clamping body of the clamping plate is opposite to the first side.

14. The pad carrier as described in claim 13, characterized in that, The magnet array within the coupling base body of the coupling base or the magnet within the support body of the support plate includes ferromagnetic or paramagnetic elements.

15. The pad carrier as described in claim 13, characterized in that, The magnet array within the coupling base body of the coupling base and the magnet array within the support body of the support plate are formed in a ring shape.

16. The pad carrier as described in claim 12, characterized in that, The pad holding feature is formed in an inverted conical shape, and the support plate holding feature is formed in a countersunk hole configuration, such that the topmost portion of each of the pad holding features overlaps with the lower portion of each of the support plate holding features.

17. A pad carrier for use in polishing or cleaning processes, characterized in that, The pad carrier includes: A pad carrier assembly, configured to be coupled to a first end of a pad carrier positioning arm, wherein the pad carrier assembly includes: Coupling base, the coupling base including a coupling base body, the coupling base body including: A first retaining surface is disposed on a first side of the coupling base body; and The support plate includes a support body, which includes: A second retaining surface is disposed on the first side of the support body; and Multiple support plates maintain their characteristics. Each support plate retaining feature is configured to receive a pad retaining feature formed in the polishing pad when the lip portion of the polishing pad is positioned between a first retaining surface and a second retaining surface, and wherein the pad retaining feature is formed in a solid inverted conical shape, and the support plate retaining feature is formed in a countersunk hole configuration such that the topmost portion of each of the pad retaining features overlaps with the lower portion of each of the support plate retaining features.

18. The pad carrier as described in claim 17, characterized in that, The plurality of holes provided in the support body are plurality of countersunk threaded holes, each threaded hole being configured to receive a fastener, and the support body being configured to be coupled to the coupling base via the plurality of fasteners and the countersunk threaded holes.

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