A composite membrane electroplating system and method

Abstract

The application provides a composite film electroplating system, which comprises an electroplating tank, a conductive base film conveying device and a current adjusting mechanism, and further comprises an online film thickness detection device, the online film thickness detection device comprises film thickness detection mechanisms arranged at the input end and the output end of the electroplating tank respectively, and is used for detecting the film surface parameters of the composite film before and after electroplating respectively, and a main salt supplement device is connected with the electroplating tank. The electroplating system of the application can realize automatic detection of the film thickness through the rotation of the roller surface and the film, and can realize real-time understanding of the sheet resistance related state of the film along with the time elapse. Meanwhile, the main salt supplement device is used for supplementing the metal ions in the electroplating tank, and a jet device is used for extracting the plating solution in the electroplating tank and spraying the plating solution into the electroplating tank along the advancing direction of the composite film, so as to reduce the speed difference between the flow rate of the plating solution and the advancing speed of the plated piece, reduce the longitudinal tension of the plated piece, and thus reduce the viscosity of the plating solution and improve the production efficiency.

Description

Technical Field

[0001] This invention relates to the field of copper film electroplating technology, and more specifically to a composite film electroplating system and method. Background Technology

[0002] In the copper plating process of composite copper film, in order to produce composite copper film that meets the requirements, it is necessary to set the corresponding current density for each area of ​​the copper foil. Existing technology generally relies on engineers to input the settings through calculation and experience. However, when the incoming material condition changes, the incoming material condition can only be detected offline and the current density of each area can be reset. Since this adjustment method can only be done point by point, it not only makes parameter setting inconvenient, but also often results in unreasonable parameter settings and makes it impossible to accurately control the current magnitude. At the same time, as the electroplating process proceeds, harmful impurities will be formed in the plating solution. In addition, as the production speed and the width of the composite film increase, the existing composite film electroplating system will experience increased resistance due to increased liquid viscosity, which will cause the composite film to be easily deformed or even broken. Summary of the Invention

[0003] This invention provides an online electroplating system for detecting the sheet resistance of composite films. The system automatically detects film thickness by rotating the roller surface and the film, and monitors the sheet resistance status of the film in real time over time, achieving online automatic detection. Simultaneously, a main salt replenishment device replenishes the metal ions in the electroplating tank that have decreased in concentration, and a jetting device extracts the plating solution from the electroplating tank and sprays it into the tank along the direction of composite film movement. This reduces the speed difference between the plating solution flow rate and the workpiece's forward speed, decreasing the longitudinal tension on the workpiece and thus reducing the impact of plating solution viscosity on the composite film, thereby improving production efficiency.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a composite film electroplating system, including an electroplating tank, a conductive base film conveying device, and a current adjustment mechanism, further comprising: an online film thickness detection device, the online film thickness detection device including film thickness detection mechanisms respectively disposed at the input end and the output end of the electroplating tank, used for online detection of the film surface parameters of the composite film before and after electroplating; a main salt replenishment device, the main salt replenishment device being connected to the electroplating tank, used for replenishing metal ions into the electroplating tank; and a jetting device, the jetting device being connected to the electroplating tank, used for drawing plating solution from the electroplating tank and spraying it into the electroplating tank along the direction of composite film advancement.

[0005] Preferably, the current adjustment mechanism includes multiple sets of control units distributed along the composite film production direction. Each control unit includes a power supply and multiple anodes distributed along the composite film production direction, with adjacent anodes separated by an insulating medium.

[0006] Preferably, one of the power sources is electrically connected to at least one anode.

[0007] Preferably, the online film thickness detection device includes a contact measurement component, which includes a fixed shaft perpendicular to the direction of composite film advance, a movable shaft rotatably disposed on the outer wall of the fixed shaft, a fixed cam fixedly disposed on the fixed shaft, a movable cam embedded inside the movable shaft and rotatably disposed on the outer wall of the fixed cam, and a probe slidably disposed on the movable cam and capable of extending radially along the movable cam under the drive of the fixed cam to contact the composite film.

[0008] Preferably, the fixed cam has a track groove, the track groove includes a movable part concentrically arranged with the fixed cam and an extended part extending radially outward from the movable part, and the probe has a movable column at one end near the center of the fixed shaft that matches the movable part and the extended part.

[0009] Preferably, the main salt replenishment device includes an auxiliary tank connected to the electroplating tank and a dissolving mechanism connected to the auxiliary tank. The output end of the dissolving mechanism is connected to the electroplating tank, and the dissolving mechanism includes a dissolving and filtering section and an electrolysis section connected to the dissolving and filtering section.

[0010] Preferably, the dissolving and filtering section includes a feeding zone and a dissolving and filtering zone forming multiple filter sub-zones through a partition. The top sidewall of the partition is provided with an overflow port, and a filter bag device is installed inside the overflow port. The pore size of the filter bag device gradually decreases along the flow direction of the plating solution. The electrolysis section includes a feeding and mixing zone, an electrolysis zone, and a reflux zone connected to the auxiliary tank, arranged sequentially along the flow direction of the plating solution.

[0011] Preferably, the plating spray mechanism is connected to the auxiliary tank.

[0012] Preferably, the electroplating tank is further provided with an anode box, which includes a U-shaped outer tank, two inner tanks disposed opposite each other inside the outer tank, and a diaphragm frame disposed between the inner tanks, wherein the diaphragm frame is provided with a diaphragm.

[0013] Preferably, the electroplating tank is further provided with a clamp that cooperates with the composite film. The clamp includes a mounting base and a mounting plate disposed on the mounting base. The mounting plate is provided with two sets of clamping components disposed at the same horizontal height. One set of clamping components has a clamping part at the bottom for flexibly clamping the copper foil and being able to move relative to the copper foil along the production direction. The other set of clamping components has a conductive part at the bottom for conducting the copper foil and engaging with the copper foil.

[0014] A composite film electroplating method, comprising the aforementioned composite film electroplating system, includes the following steps: S10: Parameter detection of the incoming composite film surface: The sheet resistance and width of the front and back of the incoming composite film surface are detected, and the composite film is divided into multiple control units according to the film width; S20: Setting the production line speed: The production line speed is the transmission speed of the incoming film; S30: Determining the coefficients: The incoming composite film is classified according to the range of sheet resistance of the front and back of the incoming film surface, and the coefficients of the front and back of the incoming film are determined; S40: Current calculation and distribution: The total current of the front and back of the incoming film is calculated according to the parameters of the incoming composite film surface, and the total current is distributed to the corresponding control unit according to the proportion coefficient of each control unit; S50: Current feedback adjustment: The parameters of the composite film surface after electroplating are detected and fed back, and the current is adjusted.

[0015] Preferably, the composite film electroplating method further includes the following steps: S60: when the metal ion concentration in the electroplating tank is lower than the set value, metal ions are added to the electroplating tank through the main salt replenishment device; S70: during the composite film electroplating process, the plating solution is sprayed out along the direction of composite film advance through the spray device.

[0016] As can be seen from the above technical solutions, the present invention has the following beneficial effects: In the present invention, a control unit is located in the transverse direction of a composite film production direction. The control unit includes a power supply and an anode component. The control unit can adjust the total output of the power supply according to the sheet resistance distribution of the composite film detected by the online film thickness detection device, and distribute the total output to each sub-region of the control unit according to the set coefficient. Thus, the current magnitude can be adjusted according to the film thickness in different regions to improve the uniformity of electroplating. At the same time, during the electroplating process of the composite film in the electroplating tank, when the concentration of metal ions in the electroplating tank decreases and needs to be replenished, the main salt replenishment device can be used to form a circulation in the electroplating tank to transport the metal ions to be replenished into the electroplating tank. In addition, the jetting device can also form a circulation with the electroplating tank, and the jetting device can spray the plating solution into the electroplating tank along the direction of composite film movement, thereby reducing the speed difference between the flow rate of the plating solution and the speed of the workpiece movement, reducing the longitudinal tension of the workpiece, creating a controllable flow rate for the overall plating solution, thereby improving production efficiency. Attached Figure Description

[0017] Figure 1 This is a top view of the present invention;

[0018] Figure 2 for Figure 1 Schematic diagram of section AA;

[0019] Figure 3 This is a side view of the connection between the composite membrane and the online film thickness detection device;

[0020] Figure 4 for Figure 3Top view;

[0021] Figure 5 Logic diagram for automatic current adjustment;

[0022] Figure 6 This is a schematic diagram of a contact measurement component;

[0023] Figure 7 for Figure 6 Schematic diagram of the EE section;

[0024] Figure 8 for Figure 7 A schematic diagram of the FF cross section;

[0025] Figure 9 A schematic diagram showing the connection between the main salt replenishment device and the electroplating tank;

[0026] Figure 10 This is a schematic diagram of the dissolution and filtration section;

[0027] Figure 11 This is a schematic diagram showing the connection between the jetting device and the electroplating tank.

[0028] Figure 12 This is a schematic diagram of the control unit;

[0029] Figure 13 for Figure 11 A partial view;

[0030] Figure 14 for Figure 13 A partial view;

[0031] Figure 15 This is a schematic diagram of the fixture in this invention;

[0032] Figure 16 for Figure 15 A schematic diagram of a clamping assembly including a clamping part;

[0033] Figure 17 for Figure 15 A schematic diagram of a clamping assembly containing conductive parts;

[0034] Figure 18 This is one embodiment of the current adjustment mechanism in production.

[0035] In the diagram: 10. Electroplating tank; 210. Control unit; 220. Power supply; 230. Anode; 30. Online film thickness detection device; 310. Fixed shaft; 311. Moving shaft; 320. Fixed cam; 321. Track groove; 330. Moving cam; 340. Probe; 40. Main salt replenishment device; 410. Auxiliary tank; 420. Dissolving and filtering section; 421. Feeding area; 422. Filtering sub-area; 423. Dissolving and filtering area; 430. Electrolysis section; 431. Feeding and mixing area; 432. Electrolysis area; 433. Reflux area; 50. Spraying device; 510. Spraying mechanism for plated parts; 520. Anode spraying mechanism. ; 521, Anode connecting pipe; 522, Anode jet pipe; 530, Upper anode; 540, Lower anode; 551, Upper connecting pipe; 552, Upper jet pipe; 561, Lower connecting pipe; 562, Lower jet pipe; 570, Anode box; 571, Outer tank; 572, Inner tank; 573, Diaphragm frame; 610, Mounting base; 620, Mounting plate; 630, Clamping assembly; 631, Fixed arm; 632, Moving arm; 640, Clamping part; 641, First chuck; 642, Second chuck; 650, Conductive part; 651, First conductive head; 652, Second conductive head; 653, Waveform protrusion. Detailed Implementation

[0036] A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings.

[0037] Reference Figure 1 , Figure 2A composite film electroplating system includes an electroplating tank 10, a conductive base film conveying device, and a current adjustment mechanism. It also includes an online film thickness detection device 30, a main salt replenishment device 40, and a jetting device 50. The online film thickness detection device includes film thickness detection mechanisms respectively installed at the input and output ends of the electroplating tank 10, used for online detection of the film surface parameters of the composite film before and after electroplating. The main salt replenishment device is connected to the electroplating tank and is used to replenish metal ions into the electroplating tank. The jetting device is connected to the electroplating tank and is used to extract plating solution from the electroplating tank and spray it into the electroplating tank along the composite film's forward direction. In use, the online film thickness detection device detects the sheet resistance and surface width of the incoming film on both sides, and divides the composite film into multiple control units 210 according to the film surface width. The multiple control units 210 form a control system. It should be noted that a composite film production... The transverse direction of production is a control unit, which includes a power supply 220 and an anode 230. The control unit can adjust the total output of the power supply according to the sheet resistance distribution of the composite film detected by the online film thickness detection device, and distribute the total output to each sub-area of ​​the control unit according to the set coefficient. At the same time, during the electroplating of the composite film through the electroplating tank 10, when the concentration of metal ions in the electroplating tank 10 decreases and needs to be replenished, the main salt replenishment device can be used to form a circulation in the electroplating tank 10 to transport the metal ions to be replenished into the electroplating tank. In addition, the jetting device can also form a circulation with the electroplating tank 10, and the jetting device can spray the plating solution into the electroplating tank along the direction of composite film movement, thereby reducing the speed difference between the plating solution flow rate and the speed of the workpiece movement, reducing the longitudinal tension of the workpiece, creating a controllable flow rate for the overall plating solution, thereby improving production efficiency.

[0038] Reference Figure 3 , Figure 4 , Figure 5 , Figure 18 As a preferred technical solution of the present invention, please refer to the following: Figure 4 The number of anodes 230 in a control unit 210 is multiple, and the anodes 230 are spliced ​​together. Adjacent anodes 230 are separated by an insulating medium. A power supply 220 is electrically connected to at least one anode 230, that is, one power supply can control one anode 230 or one power supply can control multiple anodes 230.

[0039] Reference Figure 6 , Figure 7 , Figure 8As a preferred technical solution of the present invention, the online film thickness detection device 30 includes a contact measurement component, which includes a fixed shaft 310, a movable shaft 311, a fixed cam 320, a movable cam 330, and a probe 340. The fixed shaft 310 is arranged perpendicular to the forward direction of the composite film. The movable shaft 311 is rotatably disposed on the outer wall of the fixed shaft 310. The fixed cam 320 is fixedly disposed on the fixed shaft 310. The movable cam 330 is embedded inside the movable shaft 311 and rotatably disposed on the outer wall of the fixed cam 320. The probe 340 is slidably disposed on the movable cam 330 and can extend radially along the movable cam 330 under the drive of the fixed cam 320 to contact the composite film, thereby measuring the sheet resistance of the film during the contact with the composite film. In order to realize the telescopic movement of the probe 340 along the movable cam 330, a trajectory groove 321 is provided on the fixed cam 320. Further, the trajectory groove 321 includes a moving part and an extending part. The moving part is concentrically disposed with the fixed cam 320, and the extending part is self-moving. The moving part extends radially outward. It should be noted that the moving part and the protruding part are formed on the fixed cam 320, and the moving part is specifically annular, and the protruding part is also annular, and the diameter of the protruding part is larger than that of the moving part. Furthermore, the probe 340 has a moving column that matches the moving part and the protruding part at one end near the axis of the fixed shaft 310. In use, it is fixed by both ends of the fixed shaft 310, the moving shaft 311 is the measuring part, the composite film is in contact with the moving shaft 311 and the moving cam 330, and when the composite film moves along the electroplating forward direction, the moving cam 330 rotates one revolution. When the moving column on the probe 340 moves along the moving part, the probe 340 does not protrude from the moving cam. When the moving column on the probe 340 moves on the protruding part, since the size of the protruding part is larger than that of the moving part, the probe 340 protrudes from the moving cam. This realizes the ejection and retraction of the probe. When the probe protrudes from the surface of the moving cam to contact the composite film, it achieves relative stillness to measure sheet resistance, and transmits the measured value to the control terminal through a wireless signal.

[0040] It should be noted that the moving shaft 311 and the fixed shaft 310 are connected by bearings. During operation, the moving shaft 311 rotates while the fixed shaft 310 remains stationary. The moving shaft 311 can also be driven by belts, gears, or other means.

[0041] Reference Figure 12 In the diagram, the areas corresponding to numbers 1-9 are anode components. The sheet resistance of the corresponding area is measured using an online film thickness detection device. The control terminal calculates the corresponding current based on the sheet resistance and electrochemical equivalent, and automatically distributes the current proportionally to the power supply corresponding to areas 1-9. As the composite film moves, when area A reaches the area corresponding to anode component 1, the control terminal adjusts the corresponding current of area A in anode component 1. When area A leaves and area B enters, the control terminal automatically adjusts the corresponding current of area B in anode component 1 and monitors the voltage of each power supply in real time, allowing the control terminal to make fine adjustments within a certain range.

[0042] Reference Figure 9 , Figure 10 As a preferred technical solution of the present invention, the main salt replenishment device 40 includes an auxiliary tank 410 and a dissolving mechanism. The auxiliary tank 410 is connected to the electroplating tank 10, and the dissolving mechanism is connected to the auxiliary tank 410. The output end of the dissolving mechanism is connected to the electroplating tank 10, and the dissolving mechanism includes a dissolving and filtering section 420 and an electrolysis section 430 connected to the dissolving and filtering section 420. In this way, a cycle is formed between the auxiliary tank 410 and the dissolving mechanism and the auxiliary tank 410. The replenished metal ion plating solution is then transported into the electroplating tank 10 through the auxiliary tank 410. In the specific working process, the plating solution in the auxiliary tank 410 is extracted by a filter or a circulating pump, and the temperature is controlled by a heat exchanger. Then, the plating solution is sent to the dissolving and filtering section 420 for dissolution and filtration, and then enters the electrolysis section 430 for electrolysis. Finally, it flows back to the auxiliary tank, thus completing the dissolution of the metal ions to be added.

[0043] Furthermore, the dissolving and filtering section 420 includes a feeding area 421 and a dissolving and filtering area 423. Specifically, the dissolving and filtering area 423 is formed into multiple filtering sub-areas 422 by a partition, and an overflow port is provided on the top side wall of the partition. A filter bag device is installed inside the overflow port. The pore size of the filter bag device gradually decreases along the flow direction of the plating solution. By setting multiple filtering sub-areas 422 and connecting adjacent filtering sub-areas by overflow, the filtration time for harmful impurities can be increased, and the dissolution effect of copper powder and plating solution can be improved while the filtration effect for harmful impurities is also improved.

[0044] Furthermore, the electrolysis unit 430 includes a feeding and mixing zone 431, an electrolysis zone 432, and a reflux zone 433 connected to the auxiliary tank 410, arranged sequentially along the flow direction of the plating solution. In use, the plating solution mixed with metal ion powder flows into the feeding and mixing zone 431. Additives are added to the plating solution after it has been mixed with and filtered with metal ion powder in the feeding and mixing zone to improve the performance of the plating solution and the quality of the plating layer. Subsequently, the plating solution is electrolytically matured by low-current electrolysis in the electrolysis zone 432 to effectively remove harmful impurities in the plating solution and ensure the quality of the plating solution. In addition, a pipe is connected to the outside of the reflux zone 433. The end of the pipe away from the reflux zone 433 is connected to the auxiliary tank 410. After electrolysis, the plating solution enters the reflux zone 433 and flows back to the auxiliary tank 410 through the pipe under the action of gravity to complete the dissolution. Then, the dissolved plating solution is transported to the electroplating tank 10 by a circulation pump to replenish the metal ions and other components in the copper plating solution.

[0045] It should be noted that the specific process can be achieved through computer-based statistics on ampere-hours. The computer automatically calculates the losses of metal ions, additives, etc., and pre-adds materials based on theoretical losses. When the concentration is lower than the set value, the system sets an automatic feeding interval and adds an appropriate amount of additives in conjunction with an automatic feeding pump to reduce changes in the plating solution. This ensures that the process composition in the electroplating tank remains stable after a period of production, thereby improving the production manager's control over the production process.

[0046] Reference Figure 11 , Figure 13 , Figure 14 As a preferred embodiment of the present invention, the spraying device 50 includes a plating spraying mechanism 510 and an anode spraying mechanism 520. The plating spraying mechanism 510 is connected to the auxiliary tank 410 and is positioned on both sides of the composite film along the width direction of the composite film. The plating spraying mechanism 510 can spray plating solution into the electroplating tank 10 along the forward direction of the composite film. The anode spraying mechanism 520 is positioned parallel to the length direction of the composite film and below the anode. It should be noted that the electroplating tank 10 in this invention also includes an upper anode 530 and a lower anode 540. Furthermore, the plating spraying mechanism... The flow mechanism 510 includes an upper jet assembly disposed above the composite membrane and between it and the upper anode 530, and a lower jet assembly disposed below the composite membrane and between it and the lower anode 540. The upper jet assembly includes an upper connecting pipe 551 connected to the auxiliary tank 410, an upper jet pipe 552 disposed along the width direction of the composite membrane and connected to the upper connecting pipe 551, and a Venturi tube disposed from the upper jet pipe 552 along the moving direction of the composite membrane. The lower jet assembly includes a lower connecting pipe 561 connected to the auxiliary tank 410, and a lower jet pipe 552 disposed along the width direction of the composite membrane and connected to the lower connecting pipe 540. The lower spray pipe 562 connected to 61 and the Venturi tube arranged from the lower spray pipe 562 along the direction of composite film movement are used in this process. During use, the plating solution enters the upper spray pipe 552 through the upper connecting pipe 551 and finally enters the electroplating tank 10 through the Venturi tube. Since the Venturi tube on the upper spray pipe 552 discharges the plating solution in the same direction as the composite film movement, the speed difference between the plating solution flow rate and the forward speed of the workpiece can be reduced, thus reducing the longitudinal tension of the workpiece, thereby reducing the viscosity of the plating solution and improving production efficiency. Simultaneously, the plating solution enters the lower spray pipe 562 through the lower connecting pipe 561. The solution flows into the electroplating tank 10 via the Venturi tube on the lower jet pipe 562. Since the Venturi tube also discharges the plating solution in the same direction as the composite film, it can also reduce the speed difference between the plating solution flow rate and the composite film forward speed, thereby reducing the longitudinal tension of the composite film, reducing the viscosity of the plating solution, and improving production efficiency. In addition, since the lower jet assembly is located between the composite film and the lower anode 540, the Venturi tube of the lower jet assembly will simultaneously impact the lower anode when it sprays outward, so as to remove the oxygen from the lower anode surface as quickly as possible.

[0047] Furthermore, the anode jetting mechanism 520 includes an anode connecting pipe 521 and an anode jetting pipe. The anode connecting pipe 521 is connected to the auxiliary tank 410, and the anode jetting pipe is arranged along the length of the anode connecting pipe. It should be noted that the anode jetting mechanism 520 is located below the lower anode 540, and there are multiple anode jetting pipes, which are equally spaced along the length of the anode connecting pipe. In this way, the plating solution is sprayed outward through the anode jetting pipe on the anode connecting pipe 521, which promotes the oxygen evolution of the lower anode 540 to leave the surface of the lower anode 540 as soon as possible, and ensures the effective surface area for discharge.

[0048] As a preferred technical solution of the present invention, the electroplating tank 10 is provided with an anode box 570. The anode box (570) includes an outer tank body 571, an inner tank body 572, and a diaphragm frame 573. Specifically, the outer tank body 571 is U-shaped, and there are two inner tank bodies 572, which are arranged opposite to each other inside the outer tank body 571. The diaphragm frame 573 is arranged between the inner tank bodies 572. The diaphragm frame 573 is provided with a diaphragm. Furthermore, the anode used in the present invention is an insoluble anode. The electrochemical reaction that occurs at the anode is an oxygen evolution reaction, so fine oxygen will be generated on the anode surface. By setting a diaphragm on the diaphragm frame 573, and the diaphragm material is a material with good hydrophilicity and stable performance after long-term immersion, such as woven fabric, non-woven fabric, or porous membrane, water forms a water film on the diaphragm surface. The surface tension between water and air is used to separate the gas and liquid.

[0049] Reference Figure 15 , Figure 16 , Figure 17 As a preferred technical solution of the present invention, the electroplating tank 10 is further provided with a clamp that cooperates with the composite film. The clamp includes a mounting base 610 and a mounting plate 620 disposed on the mounting base 610. The mounting plate 620 is provided with two sets of clamping components 630 disposed at the same horizontal height. One set of clamping components 630 has a clamping part 640 at the bottom for flexibly clamping copper foil and being able to move relative to the copper foil along the production direction. The other set of clamping components 630 has a conductive part 650 at the bottom for conducting copper foil and engaging with the copper foil. Further, the clamping components include a fixed arm 631 and a movable arm 632 fixedly disposed on the mounting plate 620. The movable arm 632 is movably connected to the fixed arm 631 through a chain clamp. Specifically, the movable arm 632 can move up and down when rotating relative to the fixed arm 631. In this way, the clamping part 640 and the conductive part 650 at the bottom of the two sets of clamping components 630 can respectively achieve the clamping and conductive effects on the composite film.

[0050] Furthermore, the clamping part 640 includes a first chuck 641 and a second chuck 642 that extend horizontally from the bottom of the fixed arm 631 and the movable arm 632 respectively to form a mating joint. The opposing clamping surfaces of the first chuck 641 and the second chuck 642 are covered with a soft material, which can be natural rubber, EPDM or fluororubber. The soft material can prevent damage to the copper foil and improve the production speed of the copper foil. In addition, in actual use, the clamps located below the plating solution and 2 cm above the liquid surface should be coated with insulating and anti-corrosion adhesive. The adhesive material can be green hook rubber, butadiene rubber, natural rubber, fluororubber, etc., and the material type can be determined according to the usage environment and service life.

[0051] Furthermore, the conductive part 650 includes a first conductive head 651 and a second conductive head 652 extending horizontally from the bottom of the fixed arm 631 and the movable arm 632 respectively, forming a mating structure. The opposing surfaces of the first conductive head 651 and the second conductive head 652 are provided with a wave-shaped protrusion 653. When the movable arm 632 moves downward relative to the fixed arm 631, the second conductive head 652 moves toward the first conductive head 651 and clamps the composite film. The first conductive head 651 and the second conductive head 652 will contact the composite film through the wave-shaped protrusion 653. At this time, the composite film can achieve conductivity by adhering to the first conductive head 651 and the second conductive head 652 through its own tension. In addition, the clamping fixture is also coated with insulating and anti-corrosion adhesive at the locations below the plating solution and 2 cm above the liquid surface. However, the conductive parts, namely the first conductive head 651 and the second conductive head 652, are not coated with adhesive. In terms of process, the adhesive can be removed after coating.

[0052] The present invention also provides a composite film electroplating method, including the aforementioned composite film electroplating system, specifically including the following steps:

[0053] Specifically, the sheet resistance of the front and back sides of the incoming composite membrane is detected by an online membrane thickness detection device, and the membrane width is measured at the same time. Based on the measured membrane width, the composite membrane is divided into multiple control units. It should be noted that the transverse direction of one composite membrane production direction is one control unit.

[0054] S20: Production line speed setting: This production line speed is the conveying speed of the incoming film.

[0055] Specifically, the production line speed is the conveying speed of the incoming film. The production line speed needs to be adjusted according to different types of composite films and input through the human-machine interface at the control end.

[0056] S30: Determination of coefficients. Based on the range of sheet resistance on both sides of the incoming composite film, the incoming composite film is classified and the coefficients on both sides of the incoming film are determined.

[0057] Specifically, the incoming film is classified according to the range of sheet resistance on both sides of the incoming film, and the coefficients of the front and back sides of the incoming film are determined. In this invention, the above coefficients are directly related to the sheet resistance of the film and need to be determined according to the sheet resistance.

[0058] S40: Current Calculation and Distribution: Calculate the total current on both sides of the incoming composite film based on the parameters of the incoming film, and distribute the total current to the corresponding control unit according to the proportion coefficient of each control unit.

[0059] Specifically, in this invention, the first electroplating process calculates the total current (the system's preset current) based on the sheet resistance of the incoming material, known product requirements, production speed, actual electroplating time (production line length), electroplating process, and the electrochemical equivalent of the electroplated metal. The current values ​​on the front and back sides of the incoming film are calculated according to the following current calculation function: Total current = Production line speed × Product width × Coefficient. Based on the proportion coefficient of each control unit, the total current is distributed to each control unit according to the corresponding proportion coefficient, and then distributed to the corresponding anode by the power supply.

[0060] S50: Current feedback adjustment: The parameters of the composite film surface after electroplating are detected and fed back to adjust the current.

[0061] Specifically, the online film thickness detection device also measures the parameters of the electroplated composite film and feeds back the detected film thickness and other parameters to the control terminal for current adjustment, forming a closed-loop control process, improving the accuracy of current control of each control unit, and improving the electroplating uniformity of the composite film.

[0062] As a preferred technical solution of the present invention, the composite film electroplating method further includes the following steps: S60: when the metal ion concentration in the electroplating tank is lower than the set value, metal ions are added to the electroplating tank through the main salt replenishment device.

[0063] Specifically, as the electroplating process proceeds, metal is continuously deposited at the cathode, causing the metal ion content in the plating solution to continuously decrease. Furthermore, as production continues, some plating solution is carried out of the electroplating tank, resulting in a decrease in the content of various components in the plating solution. If the metal ion concentration in the electroplating tank is detected to be lower than the set value, a main salt replenishment device can be used to replenish the decreased metal ions in the electroplating tank. Specifically, this can be achieved through computer-based statistics using ampere-hours. The computer automatically calculates the losses of metal ions, additives, etc., and pre-adds materials based on theoretical losses. When the concentration is lower than the set value, the system sets an automatic feeding interval and, in conjunction with an automatic feeding pump, adds an appropriate amount of additives to reduce changes in the plating solution. This ensures that the process composition in the electroplating tank remains stable even after a period of production, improving the production manager's control over the production process.

[0064] S70: During the electroplating process of composite film, the plating solution is sprayed out along the direction of the composite film through a jetting device.

[0065] Specifically, the plating solution contains a large amount of inorganic salts, acids, alkalis, and other substances, and has a relatively high viscosity. During the operation of the composite membrane, the resistance and pulling of the liquid on the composite membrane due to the viscosity of the liquid prevents the production speed from being increased. At this time, a jetting device can be used to spray the plating solution into the electroplating tank along the direction of the composite membrane's movement. This jetting allows the liquid in the plating solution to flow in the direction of the composite membrane's movement, reducing the relative speed between the composite membrane and the plating solution, thereby improving production efficiency.

[0066] The above-described embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A composite film electroplating system, comprising an electroplating tank (10), a conductive base film conveying device, and a current adjustment mechanism, characterized in that, Also includes: An online film thickness detection device (30) includes film thickness detection mechanisms respectively installed at the input and output ends of the electroplating tank (10) for online detection of film surface parameters of the composite film before and after electroplating; a main salt replenishment device (40) connected to the electroplating tank for replenishing metal ions into the electroplating tank, the main salt replenishment device (40) including an auxiliary tank (410) connected to the electroplating tank (10) and a dissolution mechanism connected to the auxiliary tank (410); and a jetting device (50) including a plating part jetting mechanism (510) connected to the auxiliary tank (410) and positioned on both sides of the composite film along the width direction of the composite film and spraying plating solution into the electroplating tank (10) along the forward direction of the composite film, and a plating part jetting mechanism (510) positioned parallel to the length direction of the composite film and positioned at the anode. The lower anode spraying mechanism (520) includes an upper spraying assembly disposed above the composite film and between the upper anode (530) and a lower spraying assembly disposed below the composite film and between the lower anode (540). The upper spraying assembly includes an upper connecting pipe (551) connected to the auxiliary tank (410), an upper spraying pipe (552) disposed along the width direction of the composite film and connected to the upper connecting pipe (551), and a Venturi tube disposed from the upper spraying pipe (552) along the moving direction of the composite film. The lower spraying assembly includes a lower connecting pipe (561) connected to the auxiliary tank (410), a lower spraying pipe (562) disposed along the width direction of the composite film and connected to the lower connecting pipe (561), and a Venturi tube disposed from the lower spraying pipe (562) along the moving direction of the composite film.

2. The composite film electroplating system according to claim 1, characterized in that, The current adjustment mechanism includes multiple sets of control units (210) distributed along the composite film production direction. Each control unit includes a power supply (220) and multiple anodes (230) distributed along the composite film production direction. Adjacent anodes are separated by an insulating medium.

3. The composite film electroplating system according to claim 2, characterized in that, One of the power sources (220) is electrically connected to at least one anode (230).

4. The composite film electroplating system according to claim 1, characterized in that, The online film thickness detection device (30) includes a contact measurement component, which includes a fixed shaft (310) perpendicular to the forward direction of the composite film, a movable shaft (311) rotatably disposed on the outer wall of the fixed shaft (310), a fixed cam (320) fixedly disposed on the fixed shaft (310), a movable cam (330) embedded inside the movable shaft (311) and rotatably disposed on the outer wall of the fixed cam (320), and a probe (340) slidably disposed on the movable cam (330) and capable of extending radially along the movable cam (330) under the drive of the fixed cam (320) to contact the composite film.

5. The composite film electroplating system according to claim 4, characterized in that, The fixed cam (320) is provided with a track groove (321). The track groove (321) includes a moving part that is concentrically arranged with the fixed cam (320) and an extension part that extends radially outward from the moving part. The probe (340) is provided with a moving column that matches the moving part and the extension part at one end near the axis of the fixed shaft (310).

6. The composite film electroplating system according to claim 5, characterized in that, The output end of the dissolving mechanism is connected to the electroplating tank (10), and the dissolving mechanism includes a dissolving filter section (420) and an electrolysis section (430) connected to the dissolving filter section (420).

7. The composite film electroplating system according to claim 6, characterized in that, The dissolution and filtration section (420) includes a feeding zone (421) and a dissolution and filtration section (423) that forms multiple filtration sub-zones (422) through a partition. The top side wall of the partition is provided with an overflow port. A filter bag device is installed inside the overflow port, and the pore size of the filter bag device gradually decreases along the flow direction of the plating solution. The electrolysis section (430) includes a feeding and mixing zone (431), an electrolysis zone (432), and a reflux zone (433) that is connected to the auxiliary tank (410) arranged sequentially along the flow direction of the plating solution.

8. The composite film electroplating system according to claim 7, characterized in that, The electroplating tank (10) is provided with an anode box (570). The anode box (570) includes a U-shaped outer tank body (571), two inner tank bodies (572) arranged opposite to each other inside the outer tank body (571), and a diaphragm frame (573) arranged between the inner tank bodies (572). The diaphragm frame (573) is provided with a diaphragm.

9. The composite film electroplating system according to claim 8, characterized in that, The electroplating tank (10) is also provided with a clamp that cooperates with the composite film. The clamp includes a mounting base (610) and a mounting plate (620) set on the mounting base (610). The mounting plate (620) is provided with two sets of clamping components (630) set at the same horizontal height. One set of clamping components (630) has a clamping part (640) at the bottom for flexibly clamping the copper foil and being able to move relative to the copper foil in the production direction. The other set of clamping components (630) has a conductive part (650) at the bottom for conducting the copper foil and engaging with the copper foil.

10. A composite film electroplating method, characterized in that, Including the composite film electroplating system according to any one of claims 1-9, The process includes the following steps: S10: Parameter detection of the incoming composite film surface: The sheet resistance and width of the incoming composite film surface on both sides are detected, and the composite film is divided into multiple control units according to the film width; S20: Setting the production line speed: The production line speed is the transmission speed of the incoming film; S30: Determining the coefficients: The incoming composite film is classified according to the range of sheet resistance on both sides of the incoming film surface, and the coefficients for the front and back sides of the incoming film are determined; S40: Current calculation and distribution: The total current of the front and back sides of the incoming film is calculated based on the parameters of the incoming composite film surface, and the total current is distributed to the corresponding control unit according to the proportion coefficient of each control unit; S50: Current feedback adjustment: The parameters of the composite film surface after electroplating are detected and fed back, and the current is adjusted.

11. The composite film electroplating method according to claim 10, characterized in that, The composite film electroplating method further includes the following steps: S60: when the metal ion concentration in the electroplating tank is lower than the set value, metal ions are added to the electroplating tank through the main salt replenishment device; S70: during the composite film electroplating process, the plating solution is sprayed out along the direction of composite film advance through the spray device.

Images