物理量传感器、电子设备和移动体
By introducing support components and cross wiring design into the vibration-type gyroscope sensor, the influence of thermal stress on the detection signal is resolved, the detection accuracy and signal stability are improved, and a higher noise cancellation effect is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SEIKO EPSON CORP
- Filing Date
- 2019-03-28
- Publication Date
- 2026-07-17
AI Technical Summary
In existing vibration-type gyroscope sensors, the vibrating plate is directly fixed on the packaging base, which causes stress such as thermal stress to be transmitted to the vibrating plate, affecting the stability of the zero-point output of the detection signal and reducing the detection accuracy.
A support component is used between the package and the sensor element. Thermal stress transmission is reduced through a relay substrate. The drive signal wiring and the detection signal wiring are designed to be cross-configured, and the wiring capacitance difference is optimized to improve the signal isolation effect.
It effectively reduces the impact of packaging thermal stress on sensor elements, improves detection accuracy and signal stability, enhances noise cancellation capability, and improves the detection performance of physical quantity sensors.
Smart Images
Figure CN116625342B_ABST