Electronic device and method of manufacturing the same

Abstract

An electronic device and a method of manufacturing the same are disclosed. The electronic device includes a first contact pad, a first detection contact pad, a second contact pad, and an electronic element. The first detection contact pad is spaced apart from the first contact pad. The electronic element includes a first electrode and a second electrode. The first electrode is connected to the first contact pad and the first detection contact pad, and the second electrode is connected to the second contact pad.

Description

Technical Field

[0001] This invention relates to an electronic device and a method of manufacturing the same, and more particularly to an electronic device and a method of manufacturing the same that can use detection pads to detect whether electronic components are normal or abnormal. Background Technology

[0002] Current display technologies, such as microLED technology, often require transferring a large number of tiny light-emitting diode chips to a driver substrate. After the transfer, the driver circuit must be activated for testing. Only then, based on the test results, can a repair process be performed to complete the display's functionality.

[0003] The above process requires multiple LED elements to emit light, and necessitates the use of a fixture to transmit electronic signals and an optical system to receive the light emitted by the display. This allows it to determine which LED elements are malfunctioning and to repair them. Therefore, the detection system is highly complex. A suitable solution to improve the detection system and process remains lacking in the art. Summary of the Invention

[0004] An embodiment of the present invention provides an electronic device including a first pad, a first detection pad, a second pad, and an electronic component. The first detection pad is spaced apart from the first pad. The electronic component includes a first electrode and a second electrode, wherein the first electrode is coupled to the first pad and the first detection pad, and the second electrode is coupled to the second pad.

[0005] Another embodiment of the present invention provides a method for manufacturing an electronic device, comprising providing a substrate; forming a first pad, a first detection pad and a second pad on the substrate, the first detection pad and the first pad being separated from each other; transferring an electronic component onto the substrate, the electronic component including a first electrode and a second electrode; bonding the first electrode to the first pad and the first detection pad; and bonding the second electrode to the second pad. Attached Figure Description

[0006] Figure 1 This is a top view of the electronic device in the embodiment.

[0007] Figure 2 for Figure 1 A cross-sectional view of an electronic device.

[0008] Figure 3 In another embodiment, a top view of the electronic device

[0009] Figure 4 for Figure 3 A cross-sectional view of an electronic device.

[0010] Figure 5 This is a cross-sectional view of the electronic device in another embodiment.

[0011] Figure 6 This is a schematic diagram of an electronic device in another embodiment.

[0012] Figure 7 This is a schematic diagram of an electronic device in another embodiment.

[0013] Figure 8 This is a flowchart of a method for manufacturing an electronic device, as shown in the embodiment.

[0014] Figure 9 In another embodiment, a flowchart of a method for manufacturing an electronic device is provided.

[0015] Figure 10 This is a schematic diagram of the measuring electronic device in the embodiment.

[0016] Explanation of reference numerals: 100, 300, 500, 600, 700 - Electronic device; 105 - Substrate; 110 - First pad; 115 - First detection pad; 120 - Second pad; 125 - Second detection pad; 130 - Electronic component; 131, 231 - Light-emitting unit; 132 - First electrode; 134 - Second electrode; 165 - Conductive material; 210 - Third spare pad; 215 - Third detection pad; 220 - Fourth spare pad; 232 - Third electrode; 234 - Fourth electrode; 710 - Signal line; 800, 900 - Manufacturing method; 810, 820, 825, 830, 840, 850, 860, 870, 880 - Steps; fuse1 - First fuse; fuse2 - Second fuse; I1 - Current; PTH - Path; V1, V2 - Voltage; VH - High voltage; VL - Low voltage; VLL - External voltage. Detailed Implementation

[0017] Throughout this specification and claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same elements. This document is not intended to distinguish between elements that have the same function but different names. In the following specification and claims, words such as "having" and "comprising" are open-ended terms and should therefore be interpreted as "including but not limited to...".

[0018] It should be understood that when an element or membrane is defined as being disposed "on" or "connected" to another element or membrane, it can be directly on or directly connected to the other element or membrane, or there may be other inserted elements or membranes (indirect contact) between them. Conversely, when an element is defined as being "directly" on or "directly connected" to another element or membrane, there are no inserted elements or membranes between them.

[0019] The terms “approximately,” “roughly,” “substantially,” or “essentially the same” typically mean falling within 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0020] Although terms such as first, second, and third can be used to describe different constituent elements, these constituent elements are not limited by these terms. These terms are only used to distinguish constituent elements in the specification from other constituent elements. Claims may not use the same terms, but may use terms such as first, second, and third to indicate the order in which the elements are defined. Therefore, in the following description, a first constituent element may be a second constituent element in a claim.

[0021] It should be understood that the technical features of several different embodiments can be replaced, reorganized, or mixed to complete other embodiments without departing from the spirit or conflict of the present invention.

[0022] In this invention, the electronic device may include a display device, a backlight device, an antenna device, a sensing device, or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-emissive display device or a self-emissive display device. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device. The sensing device may be a sensing device that senses capacitance, light, heat, or ultrasound, but is not limited thereto. Electronic components may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes or photodiodes. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any arrangement and combination of the foregoing, but is not limited thereto. The present invention will be described below using display devices as electronic devices or splicing devices, but the present invention is not limited thereto.

[0023] Figure 1 This is a top view of the electronic device 100 in the embodiment. Figure 2 for Figure 1 A cross-sectional view of the electronic device 100 along tangent 2-2'. (See figure) Figure 1 and Figure 2 As shown, the electronic device 100 may include a first pad 110, a first detection pad 115, a second pad 120, and an electronic component 130. The first detection pad 115 and the first pad 110 may be separated from each other. The electronic component 130 may include a light-emitting unit 131, a first electrode 132, and a second electrode 134. The first electrode 132 may be coupled to the first pad 110 and the first detection pad 115, and the second electrode 134 may be coupled to the second pad 120.

[0024] like Figure 1 and Figure 2 As shown, the first pad 110, the first detection pad 115, and the second pad 120 may be pads located on the substrate 105. According to the embodiment, the electronic component 130 may be a component with light-emitting function, sensing function, or other functional functions, such as a microLED component, a miniLED component, a laser diode, a photodiode, a capacitor, or a transistor, but is not limited thereto.

[0025] According to the embodiment, electronic component 130 is bonded to first pad 110, first detection pad 115, and second pad 120. If electronic component 130 is properly bonded, first pad 110, first electrode 132 and first detection pad 115 can be electrically connected to each other. Therefore, first detection pad 115 can be measured to detect whether electronic component 130 is properly bonded.

[0026] According to the embodiment, the electronic component 130 is bonded to the first pad 110, the first detection pad 115, and the second pad 120. The first pad 110 can be used to transmit the drive signal required to drive the electronic component 130. If the drive signal can be detected at the first detection pad 115, it indicates that the first pad 110, the first electrode 132, and the first detection pad 115 are electrically connected to each other, so it can be determined that the electronic component 130 is properly bonded.

[0027] Conversely, electronic component 130 is bonded to the first pad 110, the first detection pad 115, and the second pad 120. If a drive signal cannot be detected at the first detection pad 115, it indicates that the first pad 110, the first electrode 132, and the first detection pad 115 are not electrically connected to each other, and it can be determined that the electronic component 130 is abnormally bonded.

[0028] Figure 3 This is a top view of electronic device 300 in another embodiment. Figure 4 for Figure 3 The electronic device 300 is shown in cross section 4-4'. Compared to the electronic device 100, the electronic device 300 also includes a second detection pad 125, which is separated from the second pad 120, and the second electrode 134 can also be connected to the second detection pad 125.

[0029] Similar to the detection method of electronic device 100, in electronic device 300, in addition to using the first detection pad 115 to detect whether the connection between electronic component 130 and the first pad 110 is normal, the second detection pad 125 can also be used to detect whether the connection between electronic component 130 and the second pad 120 is normal.

[0030] According to the embodiment, electronic component 130 is bonded to the first pad 110, the first detection pad 115, the second detection pad 125, and the second pad 120. The second pad 120 can be used to transmit the drive signal required to drive electronic component 130. If a drive signal can be detected at the second detection pad 125, it indicates that the second pad 120, the second electrode 134, and the second detection pad 125 are electrically connected to each other, so it can be determined that electronic component 130 is properly bonded.

[0031] Conversely, electronic component 130 is bonded to the first pad 110, the first detection pad 115, the second detection pad 125, and the second pad 120. If a drive signal cannot be detected at the second detection pad 125, it indicates that the second pad 120, the second electrode 134, and the second detection pad 125 are not electrically connected to each other, and it can be determined that the electronic component 130 is abnormally bonded.

[0032] Figure 5 This is a cross-sectional view of electronic device 500 in another embodiment. Electronic device 500 may be similar to electronic device 100, but further includes conductive material 165. Conductive material 165 may be, for example, at least one of conductive adhesive, conductive film, low-melting-point metal, or alloy. During manufacturing, conductive material 165 may be placed on at least one of first pad 110 and first detection pad 115 and on second pad 120. When electronic component 130 is bonded, at least one of pressure and temperature may soften and deform conductive material 165 to fill the space between first pad 110, first electrode 132 and first detection pad 115, and between second pad 120 and second electrode 134, to form a suitable conductive structure.

[0033] According to the embodiment, the conductive material 165, the first pad 110, the first electrode 132 and the first detection pad 115, and the conductive material 165, the second pad 120 and the second electrode 134 may not necessarily have the same characteristics as described above. Figure 5The layered structure is shown. For example, if the conductive material 165, the electrode, and the pad are fused together, an intermetallic compound (IMC) may be formed, which does not have a layered structure, and this is also within the scope of the embodiments.

[0034] According to an embodiment, when electronic component 130 is detected as abnormal, backup electronic component 230 can be used. Figure 6 This is a schematic diagram of electronic device 600 in another embodiment. Compared to electronic device 100, electronic device 600 further includes a third spare pad 210, a fourth spare pad 220, a third detection pad 215, and a backup electronic component 230. Similar to electronic component 130, backup electronic component 230 may include a light-emitting unit 231, a third electrode 232, and a fourth electrode 234. According to an embodiment, the third spare pad 210 and the third detection pad 215 are separated, the third electrode 232 is bonded to the third spare pad 210 and the third detection pad 215, and the fourth electrode 234 is bonded to the fourth spare pad 220.

[0035] According to the embodiments, such as Figure 6 As shown, the electronic device 600 may also include a first fuse 1 and a second fuse 2. The first fuse 1 is electrically connected to the first pad 110, and the second fuse 2 is electrically connected to the first detection pad 115 and the third detection pad 215.

[0036] According to the embodiment, the current withstand capability of the first fuse 1 may be less than that of the second fuse 2. If the first element 130 is detected as abnormal, a high voltage VH can be applied to the first pad 110 to burn out the first fuse 1, thereby eliminating the use of the first element 130 and instead driving and using the backup electronic component 230.

[0037] If the first fuse 1 cannot be burned out, the current can flow along the path PTH through the second fuse 2 to burn out the second fuse 2, which can cut off the path PTH, avoid a short circuit between the high voltage VH and the low voltage VL, and thus reduce the possibility of the electronic device 600 failing due to a short circuit.

[0038] According to the embodiments, such as Figure 6 As shown, the second pad 120 and the third spare pad 210 can be used to receive low voltage VL.

[0039] According to an embodiment, when either the first fuse 1 or the second fuse 2 is burned out, the first element 130 can be omitted, and the backup electronic element 230 can be driven and used instead. According to an embodiment, either the first fuse 1 or the second fuse 2 may include multiple fuse wires connected in series, and when one of the fuse wires is burned out, the fuse can be burned out.

[0040] Figure 7 This is a schematic diagram of electronic device 700 in another embodiment. The similarities between electronic device 700 and electronic device 600 will not be repeated. Compared to electronic device 600, electronic device 700 may further include a signal line 710 electrically connected to the node between the second fuse 2 and the third detection pad 215. Signal line 710 can be used to receive an external voltage VLL, wherein the level of the external voltage VLL can be lower than the low voltage VL. Therefore, the voltage difference across the first fuse 1 and the second fuse 2 can be increased to improve the success rate of blowing both fuse 1 and fuse 2.

[0041] According to the embodiments, such as Figure 6 and Figure 7 As shown, electronic component 130 can be a main electronic component, and backup electronic component 230 can be a slave electronic component. When the main electronic component is detected as malfunctioning, the slave electronic component can be used as a repair mechanism. Taking a display as an example, if electronic component 130 malfunctions, backup electronic component 230 can be used to emit light.

[0042] For example, Figure 6 and Figure 7 In this embodiment, the first electrode 132 and the second electrode 134 can be the P-terminal and N-terminal of the electronic component 130, respectively. The third electrode 232 and the fourth electrode 234 can be the P-terminal and N-terminal of the electronic component 230, respectively. However, the scope of the embodiment is not limited thereto. According to the embodiment, the configuration can be adjusted according to actual needs.

[0043] Figure 8 This is a flowchart of a manufacturing method 800 for an electronic device, as described in the embodiment. For example, manufacturing method 800 can be used to manufacture electronic device 100, electronic device 300, and electronic device 500. Figure 8 As shown, manufacturing method 800 may include the following steps:

[0044] Step 810: Provide substrate 105;

[0045] Step 820: Form a first pad 110, a first detection pad 115 and a second pad 120 on the substrate 105, wherein the first detection pad 115 and the first pad 110 are separated from each other.

[0046] Step 830: Transfer electronic component 130 onto substrate 105. Electronic component 130 includes a first electrode 132 and a second electrode 134.

[0047] Step 840: Connect the first electrode 132 to the first pad 110 and the first detection pad 105 and connect the second electrode 134 to the second pad 120.

[0048] Figure 9 This is a flowchart of a method for manufacturing an electronic device 900, as shown in another embodiment. For example, manufacturing method 900 can be used to manufacture electronic device 600 and electronic device 700. Figure 9 As shown, manufacturing method 900 may include the following steps:

[0049] Step 810: Provide substrate 105;

[0050] Step 820: Form a first pad 110, a first detection pad 115 and a second pad 120 on the substrate 105, wherein the first detection pad 115 and the first pad 110 are separated from each other.

[0051] Step 825: Form a third spare pad 210, a fourth spare pad 220, a third detection pad 215, a first fuse 1, and a second fuse 2 on the substrate 105. The third spare pad 210 and the third detection pad 215 are separated. The first fuse 1 is electrically connected to the first pad 110, and the second fuse 2 is electrically connected to the first detection pad 115 and the third detection pad 215.

[0052] Step 830: Transfer electronic component 130 onto substrate 105. Electronic component 130 includes a first electrode 132 and a second electrode 134.

[0053] Step 840: Connect the first electrode 132 to the first pad 110 and the first detection pad 105 and connect the second electrode 134 to the second pad 120;

[0054] Step 860: Check whether electronic component 130 is normal or abnormal;

[0055] Step 870: If electronic component 130 malfunctions, transfer backup electronic component 230 to substrate 105; and

[0056] Step 880: Connect the backup electronic component 230 to the third backup pad 210, the fourth backup pad 220 and the third detection pad 215.

[0057] Figure 9 In manufacturing method 900, if the electronic device is such Figure 7As shown, when the signal line 710 is available to receive the external voltage VLL, the external voltage VLL can be selectively provided to the node between the second fuse 2 and the third detection pad 215 to increase the voltage difference between the first fuse 1 and the second fuse 2, thereby increasing the success rate of burning out the first fuse 1 and the second fuse 2.

[0058] Figure 10 This is a schematic diagram of the measuring electronic device in the embodiment. Figure 10 Electronic devices, can Figure 3 Taking electronic device 300 as an example. According to an embodiment, such as Figure 10 As shown, measurements can be performed using a four-point probe. Figure 10 As shown, a current I1 can be input to the first pad 110, and the second pad 120 can be connected to a fixed voltage (e.g., ground). Voltage V1 is measured at the first detection pad 115, and voltage V2 is measured at the second detection pad 125. This four-point probe method allows for the measurement of the electrical properties of the electronic device, reducing interference from traces. The measurement results can be used to perform characteristic corrections on the electronic device (e.g., a light-emitting diode device), for example, by feeding back to the chip or driver circuit for uniformity compensation. For instance, it can be used for demura correction.

[0059] In summary, the electronic device and its manufacturing method provided in the embodiments can reduce the need for complex systems such as optical systems for light collection. According to the embodiments, a feedback circuit can be formed using detection pads to detect whether the electronic components are functioning correctly or abnormally after they have been installed. The embodiments provide a complete solution where slave electronic components can be used for repair when the main electronic component malfunctions. The embodiments provide a complete measurement scheme to facilitate measurement and calibration. Therefore, the complexity of the system and processes can be reduced. This is helpful in addressing the challenges in the art.

[0060] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Those skilled in the art will recognize that the present invention can have various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An electronic device, characterized in that, include: First, the first pad; A first detection pad, which is separated from the first detection pad; First, second pad; An electronic component includes a first electrode and a second electrode, wherein the first electrode is coupled to a first pad and a first detection pad, and the second electrode is coupled to the second pad; A third spare pad; A fourth spare pad; A third test pad, which is separated from the third spare pad; A backup electronic component includes a third electrode and a fourth electrode, the third electrode being connected to a third spare pad and a third detection pad, and the fourth electrode being connected to the fourth spare pad. A first fuse is electrically connected to the first pad; as well as A second fuse is electrically connected to the first detection pad and the third detection pad; The current withstand capability of the first fuse is less than that of the second fuse.

2. The electronic device as claimed in claim 1, characterized in that, It also includes a second detection pad, which is separated from the second detection pad, and the second electrode is also connected to the second detection pad.

3. The electronic device as claimed in claim 1, characterized in that, It also includes a signal line electrically connected to the node between the second fuse and the third detection pad.

4. A method for manufacturing an electronic device, characterized in that, include: Provide a substrate; A first pad, a first detection pad, and a second pad are formed on the substrate, wherein the first detection pad and the first pad are separated from each other. A third spare pad, a fourth spare pad, a third detection pad, a first fuse and a second fuse are formed on the substrate. The third spare pad is separated from the third detection pad. The first fuse is electrically connected to the first pad, and the second fuse is electrically connected to the first detection pad and the third detection pad. An electronic component is transferred onto the substrate, the electronic component including a first electrode and a second electrode; The first electrode is bonded to the first pad and the first detection pad; The second electrode is then attached to the second pad; The electronic component was tested to determine whether it was functioning normally or malfunctioning. If the electronic component malfunctions, a backup electronic component is transferred to the substrate; and The backup electronic component is connected to the third backup pad, the fourth backup pad, and the third detection pad; The current withstand capability of the first fuse is less than that of the second fuse.

5. The manufacturing method as described in claim 4, characterized in that, It also includes providing an external voltage to the node between the second fuse and the third detection pad.

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