Battery connection module

Abstract

This disclosure discloses a battery connection module, which includes a tray, multiple busbars, a circuit board, and a temperature sensing component. The multiple busbars are mounted on the tray for connecting multiple batteries. The circuit board is connected to the multiple busbars. The temperature sensing component includes a first thermal pad and a second thermal pad, multiple first thermal vias, a temperature sensor, and a bridging piece. The first thermal pad and the second thermal pad are respectively disposed on the upper and lower surfaces of the circuit board. The first thermal vias penetrate the first thermal pad, the second thermal pad, and the circuit board. The temperature sensor is disposed on the upper or lower surface of the circuit board and adjacent to the first or second thermal pad. The bridging piece connects a busbar to the first or second thermal pad.

Description

Technical Field

[0001] This disclosure relates to the field of battery technology, and more particularly to a battery connection module. Background Technology

[0002] Chinese patent application CN111435723A discloses a battery connection module in which a temperature sensing element is located in the opening at the first end of the temperature sensing element and the other end of the temperature sensing element is connected to a busbar.

[0003] However, the current collector disclosed in the aforementioned patent application connects to the battery electrodes, and the heat generated by the battery is directly transferred to the current collector. The heat on the current collector is then transferred to the temperature sensor at the other end via the temperature sensor plate. There is only one heat transfer path. Moreover, the temperature sensor is located on the upper surface of the circuit board and is separated from the battery below by the circuit board, which makes the heat transfer path long. This results in low accuracy of the temperature information collected by the temperature sensor and a long temperature response time, leading to poor sensitivity of temperature information collection. Summary of the Invention

[0004] A primary objective of this disclosure is to overcome at least one of the deficiencies of the prior art described above, and to provide a battery connection module with a shorter heat transfer path between the temperature sensor and the opposite surface of the circuit board.

[0005] To achieve the above objectives, the present disclosure adopts the following technical solution: According to one aspect of this disclosure, a battery connection module is provided for connecting multiple batteries. The battery connection module includes a tray, multiple busbars, a circuit board, and a temperature sensing component. The multiple busbars are mounted on the tray for connecting the multiple batteries. The circuit board is connected to the multiple busbars. The temperature sensing component includes a first thermal pad and a second thermal pad, multiple first thermal vias, a temperature sensor, and a bridging piece. The first thermal pad and the second thermal pad are respectively disposed on the upper and lower surfaces of the circuit board. The first thermal vias penetrate the first thermal pad, the second thermal pad, and the circuit board. The temperature sensor is disposed on the upper or lower surface of the circuit board and adjacent to the first thermal pad or the second thermal pad. The bridging piece connects one of the busbars to the first thermal pad or the second thermal pad.

[0006] According to one embodiment of this disclosure, the temperature sensor is disposed on the upper surface of the circuit board and adjacent to the first thermal pad, the first end of the bridging piece is connected to the first thermal pad, and the second end of the bridging piece is connected to a busbar.

[0007] According to one embodiment of this disclosure, the temperature sensing component further includes a cover; the cover is disposed on the upper surface of the circuit board for encapsulating at least a portion of the first thermal pad, the temperature sensor, and the first end of the bridging piece.

[0008] According to one embodiment of this disclosure, the first thermal pad is provided with a first receiving opening, and the first end of the bridging piece is provided with a second receiving opening, the positions of the first receiving opening and the second receiving opening being opposite; wherein, the temperature sensor is at least partially located within the range of the first receiving opening and the second receiving opening.

[0009] According to one embodiment of this disclosure, the temperature sensor is disposed on the lower surface of the circuit board and adjacent to the second thermal pad, the first end of the bridging piece is connected to the first thermal pad, and the second end of the bridging piece is connected to a busbar.

[0010] According to one embodiment of this disclosure, the temperature sensing component further includes a cover; the cover is disposed on the lower surface of the circuit board for encapsulating at least a portion of the second thermal pad, the temperature sensor, and the plurality of first thermal vias.

[0011] According to one embodiment of this disclosure, the second thermal pad is provided with a third receiving opening; wherein the temperature sensor is at least partially located within the range of the third receiving opening.

[0012] According to one embodiment of this disclosure, the circuit board is provided with an electrical contact, and the temperature sensor is mounted on the electrical contact; wherein, the temperature measuring component further includes a second thermally conductive via; the second thermally conductive via passes through the electrical contact and the circuit board.

[0013] According to one embodiment of this disclosure, the electrical contact is a solder pad, and the temperature sensor is mounted on the solder pad by soldering; wherein, the temperature measuring component further includes a third thermal pad; one of the third thermal pad and the solder pad is disposed on the upper surface of the circuit board, and the other is disposed on the lower surface of the circuit board; wherein, the second thermal via also penetrates the third thermal pad.

[0014] According to one embodiment of this disclosure, the tray has an opening that corresponds to the position of the second thermal pad and the temperature sensor.

[0015] As can be seen from the above technical solution, the advantages and positive effects of the battery connection module proposed in this disclosure are as follows: The battery connection module disclosed herein includes a tray, multiple busbars, a circuit board, and a temperature sensing component. The temperature sensing component includes a first thermal pad and a second thermal pad, multiple first thermal vias, a temperature sensor, and a bridging piece. The first and second thermal pads are respectively disposed on the upper and lower surfaces of the circuit board. The first thermal vias penetrate the first thermal pad, the second thermal pad, and the circuit board. The temperature sensor is disposed on the upper or lower surface of the circuit board, adjacent to the first or second thermal pad. Through the above design, this disclosure enables heat from the side of the circuit board opposite to the temperature sensor to be transferred to the temperature sensor via the first thermal pad, the second thermal pad, and the first thermal vias, shortening the heat transfer path, improving the accuracy of temperature acquisition by the temperature sensor, and shortening the temperature response time, thereby improving the sensitivity of temperature information acquisition. Attached Figure Description

[0016] The various objectives, features, and advantages of this disclosure will become more apparent from the following detailed description of preferred embodiments of the disclosure taken in conjunction with the accompanying drawings. The drawings are merely illustrative of the present disclosure and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar parts. Wherein: Figure 1 This is an exploded view of a battery module according to an exemplary embodiment; Figure 2 yes Figure 1 An exploded view of the battery connection module is shown. Figure 3 yes Figure 1 The diagram shown is a partially enlarged view of the battery connection module and the battery module during battery assembly. Figure 4 yes Figure 3 A schematic diagram of the decomposition process; Figure 5 yes Figure 3 An enlarged schematic diagram of part A in the diagram; Figure 6 yes Figure 5 A schematic diagram of the decomposition process; Figure 7 yes Figure 3 A partial bottom view; Figure 8 This is a partially enlarged schematic diagram of the battery connection module in another exemplary embodiment; Figure 9 yes Figure 8 A schematic diagram of the decomposition process; Figure 10 yes Figure 8 Another perspective of the decomposed diagram; Figure 11 yes Figure 8 A partial sectional view.

[0017] The annotations in the attached figures are explained as follows: 100. Battery connection module; 110. Pallet; 111. Opening; 120. Busbar; 130. Circuit board; 141. First thermal pad; 1411. First receiving opening; 142. Second thermal pad; 1421. Third receiving opening; 143. First thermal via; 144. Temperature sensor; 145. Bridging plate; 145a. First end; 145b. Second end; 145c. Perforation; 1451. Second receiving opening; 146. Capping; 147. Second thermal via; 148. Solder pad; 149. Third thermal pad; 200. Battery; 300. End plate; S1. Upper surface; S2. Lower surface. Detailed Implementation

[0018] Typical embodiments embodying the features and advantages of this disclosure will be described in detail in the following description. It should be understood that this disclosure can have various variations in different embodiments without departing from the scope of this disclosure, and the descriptions and drawings therein are illustrative in nature and not intended to limit this disclosure.

[0019] In the following description of various exemplary embodiments of this disclosure, reference is made to the accompanying drawings, which form part of this disclosure, and which illustrate by way of example different exemplary structures, systems, and steps that can implement various aspects of this disclosure. It should be understood that other specific embodiments of the components, structures, exemplary devices, systems, and steps may be used, and structural and functional modifications may be made without departing from the scope of this disclosure. Furthermore, while the terms “above,” “between,” “within,” etc., may be used in this specification to describe different exemplary features and elements of this disclosure, these terms are used herein only for convenience, such as the orientation according to the examples described in the accompanying drawings. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of the structure to fall within the scope of this disclosure.

[0020] See Figure 1 The diagram illustrates, in a representative manner, an exploded view of the battery module proposed in this disclosure. In this exemplary embodiment, the battery connection module 100 proposed in this disclosure is described as an example of its application to a battery module. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, deletions, or other changes may be made to the specific embodiments described below to apply the relevant designs of this disclosure to other types of energy storage devices; these changes shall still be within the scope of the principles of the battery connection module 100 proposed in this disclosure.

[0021] like Figure 1 As shown, in this embodiment, the battery connection module 100 proposed in this disclosure is disposed on the battery of the battery module, and the battery connection module 100 is used to connect multiple batteries 200. (See also...) Figures 2 to 7 , Figure 2 An exploded view of the battery connection module 100 is shown in the figure. Figure 3 The diagram shows a partially enlarged view of the battery connection module 100 and the battery module during battery assembly. Figure 4 China representatively shows Figure 3 A schematic diagram of the decomposition process; Figure 5 China representatively shows Figure 3 An enlarged schematic diagram of part A in the diagram; Figure 6 China representatively shows Figure 5 A schematic diagram of the decomposition process; Figure 7 China representatively shows Figure 3 A partial bottom view. The structure, connection method, and functional relationship of the main components of the battery connection module 100 proposed in this disclosure will be described in detail below with reference to the above-mentioned figures.

[0022] like Figures 1 to 7As shown, in one embodiment of this disclosure, the battery connection module 100 includes a tray 110, multiple busbars 120, a circuit board 130, and a temperature sensing component. Specifically, the multiple busbars 120 are mounted on the tray 110 and are used to connect multiple batteries 200. Each busbar 120 is connected to the voltage acquisition line of the circuit board 130 via a bridging piece 145. The temperature sensing component includes a first thermal pad 141 and a second thermal pad 142, multiple first thermal vias 143, a temperature sensor 144, and a bridging piece 145. The first thermal pads 141 and 142 are respectively disposed on the upper surface S1 and lower surface S2 of the circuit board 130. The first thermal vias 143 penetrate the first thermal pads 141, the second thermal pads 142, and the circuit board 130. A temperature sensor 144 is disposed on the upper surface S1 of the circuit board 130 and adjacent to the first thermal pad 141. A bridging piece 145 connects a bus 120 to the first thermal pad 141. Through the above design, this disclosure enables heat from the side of the circuit board 130 opposite to the temperature sensor 144 to be transferred to the temperature sensor 144 via the first thermal pad 141, the second thermal pad 142, and the first thermal via 143, shortening the heat transfer path, improving the accuracy of temperature acquisition by the temperature sensor, and shortening the temperature response time, thereby improving the sensitivity of temperature information acquisition.

[0023] like Figure 3 and Figure 6 As shown, based on the design of the temperature sensor 144 being disposed on the upper surface S1 of the circuit board 130 and adjacent to the first thermal pad 141, in one embodiment of this disclosure, the first end 145a of the bridging piece 145 is connected to the first thermal pad 141, and the second end 145b of the bridging piece 145 is connected to a busbar 120.

[0024] like Figures 3 to 6As shown, in one embodiment of this disclosure, the first end 145a of the bridging piece 145 connects to the first thermal pad 141 and covers each of the first thermal vias 143. The temperature sensing assembly also includes a cover 146. The cover 146 is disposed on the upper surface S1 of the circuit board 130 to encapsulate the first thermal pad 141, the temperature sensor 144, and the first end 145a of the bridging piece 145, and to provide thermal conductivity and protection. In some embodiments, in a configuration where not all of the multiple first thermal vias 143 are covered by the first end 145a of the bridging piece 145, the cover 146 may also cover other first thermal vias 143 exposed outside the first end 145a of the bridging piece 145. In some embodiments, when the temperature sensor 144 is disposed on the upper surface S1 of the circuit board 130 and the temperature measuring component includes a cover 146, the cover 146 may also encapsulate a portion of the first thermal pad 141. In other words, in various possible embodiments that conform to the design concept of this disclosure, when the temperature sensor 144 is disposed on the upper surface S1 of the circuit board 130 and the temperature measuring component includes a cover 146, the cover 146 may encapsulate at least a portion of the first thermal pad 141.

[0025] Based on the design of the temperature sensing component including a cover 146, in one embodiment of this disclosure, the material of the cover 146 can be thermally conductive adhesive, antioxidant protective adhesive, or a combination thereof, such as silicone, epoxy resin, etc.

[0026] like Figure 6 As shown, in one embodiment of this disclosure, the first thermal pad 141 has a first receiving opening 1411, and the first end 145a of the bridging piece 145 has a second receiving opening 1451, with the first receiving opening 1411 and the second receiving opening 1451 corresponding in position. Based on this, the temperature sensor 144 is partially located within the range of the first receiving opening 1411 and the second receiving opening 1451. In some embodiments, the temperature sensor 144 may also be entirely located within the range of the first receiving opening 1411 and the second receiving opening 1451. In other words, in various possible embodiments conforming to the design concept of this disclosure, when the temperature sensor 144 is disposed on the upper surface S1 of the circuit board 130 and the first thermal pad 141 has the first receiving opening 1411, the temperature sensor 144 is at least partially located within the range of the first receiving opening 1411 and the second receiving opening 1451.

[0027] like Figure 6 and Figure 7As shown, based on the design of the first thermal pad 141 having a first receiving opening 1411 and the first end 145a of the bridging piece 145 having a second receiving opening 1451, in one embodiment of this disclosure, the first receiving opening 1411 is located on one side of the first thermal pad 141. Based on this, the second receiving opening 1451 is located on one side of the first end 145a of the bridging piece 145. In some embodiments, when the first receiving opening 1411 is located on one side of the first thermal pad 141, the second receiving opening 1451 can also be located in the middle of the bridging piece 145, that is, the second receiving opening 1451 can be a closed opening structure. Furthermore, the first receiving opening 1411 can also be located in the middle of the first thermal pad 141, that is, the first receiving opening 1411 can be a closed opening structure. Based on this, the second receiving opening 1451 can be located on one side or in the middle of the first end 145a of the bridging piece 145, and is not limited thereto. In addition, when the first receiving opening 1411 is a closed opening structure, the temperature sensor 144 is entirely located within the range of the first receiving opening 1411.

[0028] In one embodiment of this disclosure, the wall of the first thermally conductive via 143 may be coated with a metal plating layer, and the material of the metal plating layer may be copper or a copper alloy.

[0029] In one embodiment of this disclosure, the material of the first thermal pad 141 may be the same as the material of the conductive traces on the circuit board 130, such as, but not limited to, copper.

[0030] In one embodiment of this disclosure, the material of the second thermal pad 142 may be the same as the material of the conductive traces on the circuit board 130, such as, but not limited to, copper.

[0031] See Figures 8 to 11 As shown, Figure 8 The diagram shows a partially enlarged schematic of the battery connection module 100 in another exemplary embodiment; Figure 9 China representatively shows Figure 8 A schematic diagram of the decomposition process; Figure 10 China representatively shows Figure 8 Another perspective of the decomposed diagram; Figure 11 China representatively shows Figure 8 A partial sectional view.

[0032] like Figures 8 to 11As shown, in one embodiment of this disclosure, the temperature sensor 144 may also be disposed on the lower surface S2 of the circuit board 130 and adjacent to the second thermal pad 142. Based on this, the first end 145a of the bridging piece 145 is connected to the first thermal pad 141, and the second end 145b of the bridging piece 145 is connected to a busbar 120. In other words, in various possible embodiments conforming to the design concept of this disclosure, the temperature sensor 144 may be disposed on the upper surface S1 or the lower surface S2 of the circuit board 130 and adjacent to the first thermal pad 141 or the second thermal pad 142. Based on this, the bridging piece 145 may connect a busbar 120 to the first thermal pad 141 or the second thermal pad 142.

[0033] like Figure 10 and Figure 11 As shown, in one embodiment of this disclosure, the temperature sensing component further includes a cover 146. The cover 146 is disposed on the lower surface S2 of the circuit board 130 to encapsulate a portion of the second thermal pad 142, each of the first thermal vias 143, and the temperature sensor 144, and provides thermal conductivity and protection. In some embodiments, when the temperature sensor 144 is disposed on the lower surface S2 of the circuit board 130 and the temperature sensing component includes the cover 146, the cover 146 may also encapsulate all of the second thermal pad 142 and each of the first thermal vias 143. In other words, in various possible embodiments conforming to the design concept of this disclosure, when the temperature sensor 144 is disposed on the lower surface S2 of the circuit board 130 and the temperature sensing component includes the cover 146, the cover 146 may encapsulate at least a portion of the second thermal pad 142 and each of the first thermal vias 143.

[0034] like Figure 10 and Figure 11 As shown, in one embodiment of this disclosure, the second thermal pad 142 is provided with a third receiving opening 1421. Based on this, the temperature sensor 144 is entirely located within the area of ​​the third receiving opening 1421. In some embodiments, the temperature sensor 144 may also be partially located within the area of ​​the third receiving opening 1421. In other words, in various possible embodiments conforming to the design concept of this disclosure, when the temperature sensor 144 is disposed on the lower surface S2 of the circuit board 130 and the second thermal pad 142 is provided with the third receiving opening 1421, the temperature sensor 144 is at least partially located within the area of ​​the third receiving opening 1421.

[0035] like Figure 10 and Figure 11As shown, based on the design of the second thermal pad 142 having a third receiving opening 1421, in one embodiment of this disclosure, the third receiving opening 1421 is located in the middle of the second thermal pad 142, that is, the third receiving opening 1421 is a closed opening structure, and the temperature sensor 144 is entirely located within the range of the third receiving opening 1421. In some embodiments, the third receiving opening 1421 may also be located on one side of the second thermal pad 142, that is, the third receiving opening 1421 is an opening structure with one side open, and is not limited thereto. In addition, when the third receiving opening 1421 is an open opening structure, the temperature sensor 144 is at least partially located within the range of the third receiving opening 1421.

[0036] It should be noted that the above-described embodiments are all illustrated with the bridging piece 145 connected to the first thermal pad 141 as an example. In some embodiments, regardless of whether the temperature sensor 144 is located on the upper surface S1 or the lower surface S2 of the circuit board 130, the bridging piece 145 can connect the second thermal pad 142 and a bus 120, and is not limited thereto.

[0037] like Figure 6 and Figure 9 As shown, in one embodiment of this disclosure, the first thermal pad 141 can be connected to the voltage acquisition line on the circuit board 130. In addition to realizing the electrical connection function between the circuit board 130 and the battery 200, the bridging piece 145 can also transfer heat. Through the above design, this disclosure can make the heat transferred by the bridging piece 145 and the heat transferred through the through first thermal via 143 more quickly transferred to the temperature sensor 144.

[0038] like Figure 6 and Figure 9 As shown, in one embodiment of this disclosure, the temperature sensing component includes a plurality of first thermally conductive vias 143. Through the above design, this disclosure can increase heat conduction through the plurality of first thermally conductive vias 143. Furthermore, when the bridging piece 145 is also penetrated by the first thermally conductive vias 143, depending on the shape difference between the bridging piece 145 and the first thermally conductive pad 141 or the second thermally conductive pad 142, some of the first thermally conductive vias 143 can penetrate the bridging piece 145, the first thermally conductive pad 141, the second thermally conductive pad 142, and the circuit board 130, while the remaining first thermally conductive vias 143 only penetrate the first thermally conductive pad 141, the second thermally conductive pad 142, and the circuit board 130.

[0039] like Figure 6 and Figure 11As shown, in one embodiment of this disclosure, the circuit board 130 is provided with electrical contacts, and the temperature sensor 144 is mounted on the electrical contacts. In addition, the temperature sensing component further includes a second thermally conductive via 147. The second thermally conductive via 147 penetrates the electrical contacts and the circuit board 130. Through the above design, in addition to fulfilling the function of mounting the temperature sensing component and electrically connecting it to the conductive trace of the circuit board 130, the electrical contacts can also serve as a heat conductor, and the second thermally conductive via 147 can shorten the heat transfer path at this location.

[0040] like Figure 7 and Figure 8 As shown, based on the design of the circuit board 130 having electrical contacts, in one embodiment of this disclosure, two electrical contacts are solder pads 148. The temperature sensor 144 is mounted on the solder pads 148 by soldering, and the solder pads 148 are connected to the temperature acquisition lines on the circuit board 130. In addition, the temperature sensing assembly also includes a third thermal pad 149. Figure 7 In the illustrated embodiment, solder pad 148 is disposed on the upper surface S1 of circuit board 130, and third thermal pad 149 is disposed on the lower surface S2 of circuit board 130. Figure 8 In the illustrated embodiment, the third thermal pad 149 is disposed on the upper surface S1 of the circuit board 130, and the solder pad 148 is disposed on the lower surface S2 of the circuit board 130. Furthermore, the second thermal via 147 penetrates both the solder pad 148 and the third thermal pad 149. In other words, in various possible embodiments conforming to the design concept of this disclosure, when the temperature sensing component further includes the third thermal pad 149, one of the solder pad 148 and the third thermal pad 149 is disposed on the upper surface S1 of the circuit board 130, and the other is disposed on the lower surface S2 of the circuit board 130, and the second thermal via 147 penetrates both the solder pad 148 and the third thermal pad 149.

[0041] In one embodiment of this disclosure, the wall of the second thermally conductive via 147 may be coated with a metal plating layer, and the material of the metal plating layer may be copper or a copper alloy.

[0042] In one embodiment of this disclosure, the material of the third thermal pad 149 may be the same as the material of the conductive traces on the circuit board 130, such as, but not limited to, copper.

[0043] like Figure 4As shown, in one embodiment of this disclosure, the tray 110 has an opening 111 located between the lower surface S2 of the circuit board 130 and the upper surface of the battery 200. Accordingly, when the temperature sensor 144 is located on the lower surface S2 of the circuit board 130, the opening 111 corresponds to the position of the temperature sensor 144, and the opening 111 of the tray 110 allows the temperature sensor 144 to face the battery 200 in a downward direction, thereby directly sensing the heat of the battery 200. When the temperature sensor 144 is located on the upper surface S1 of the circuit board 130, the opening 111 corresponds to the position of the second thermal pad 142 on the lower surface S2, and the opening 111 of the tray 110 allows the second thermal pad 142, the third thermal pad 149, and the first thermal via 143 on the lower surface S2 to directly face the battery 200 in a downward direction, thereby directly receiving heat to react to the heat of the battery 200 and transferring heat to the temperature sensor 144 on the upper surface S1.

[0044] It should be noted that the battery connection modules shown in the accompanying drawings and described in this specification are merely a few examples among many battery connection modules capable of employing the principles of this disclosure. It should be clearly understood that the principles of this disclosure are by no means limited to any detail or component of the battery connection modules shown in the accompanying drawings or described in this specification.

[0045] For example: In one embodiment of this disclosure, the circuit board 130 may be a rigid printed circuit board (PCB).

[0046] In one embodiment of this disclosure, the temperature sensor 144 may be an NTC thermistor (Negative Temperature Coefficient thermistor).

[0047] In one embodiment of this disclosure, the bridging piece 145 may be made of nickel.

[0048] In one embodiment of this disclosure, the first end 145a of the bridging piece 145 can be connected to the first thermal pad 141 on the circuit board 130 by surface welding, and the through hole 145c on the first end 145a of the bridging piece 145 serves as a welding reinforcement function. The second end 145b of the bridging piece 145 can be connected to the busbar 120 by ultrasonic welding.

[0049] In one embodiment of this disclosure, the busbar 120 may be made of metal materials such as aluminum or copper, or may be a multilayer stacked structure of a single type or multiple types of metals or a combination thereof.

[0050] Based on the detailed description of several exemplary embodiments of the battery connection module 100 proposed in this disclosure above, an exemplary embodiment of the battery module proposed in this disclosure will be described below.

[0051] like Figure 1 As shown, in one embodiment of this disclosure, the battery module proposed in this disclosure includes the battery connection module 100 proposed in this disclosure and described in detail in the above embodiments. The battery connection module 100 is disposed on the battery 200 of the battery module, and the battery 200 has end plates 300 and other frame structures and structures at both ends.

[0052] It should be noted that the battery modules shown in the accompanying drawings and described in this specification are merely a few examples among many battery modules capable of employing the principles of this disclosure. It should be clearly understood that the principles of this disclosure are by no means limited to any detail or component of the battery modules shown in the accompanying drawings or described in this specification.

[0053] In summary, the battery connection module proposed in this disclosure includes a tray, multiple busbars, a circuit board, and a temperature sensing component. The temperature sensing component includes a first thermal pad and a second thermal pad, multiple first thermal vias, a temperature sensor, and a bridging piece. The first and second thermal pads are respectively disposed on the upper and lower surfaces of the circuit board. The first thermal vias penetrate the first thermal pad, the second thermal pad, and the circuit board. The temperature sensor is disposed on the upper or lower surface of the circuit board, adjacent to the first or second thermal pad. Through the above design, this disclosure enables heat from the side of the circuit board opposite to the temperature sensor to be transferred to the temperature sensor via the first thermal pad, the second thermal pad, and the first thermal vias, shortening the heat transfer path, improving the accuracy of temperature acquisition by the temperature sensor, and shortening the temperature response time, thereby improving the sensitivity of temperature information acquisition.

[0054] The exemplary embodiments of the battery connection module proposed in this disclosure have been described and / or illustrated in detail above. However, the embodiments of this disclosure are not limited to the specific embodiments described herein; rather, components and / or steps of each embodiment may be used independently and separately from other components and / or steps described herein. Each component and / or step of one embodiment may also be used in combination with other components and / or steps of other embodiments. In describing the elements / components / etc. described and / or illustrated herein, the terms "a," "an," and "the above" are used to indicate the presence of one or more elements / components / etc. The terms "comprising," "including," and "having" are used to indicate an open-ended inclusion and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc. Furthermore, the terms "first" and "second," etc., in the claims and specification are used only as illustrative marks and are not intended to limit the numerical scope of the subject matter.

[0055] Although the battery connection module proposed in this disclosure has been described according to different specific embodiments, those skilled in the art will recognize that modifications may be made to the implementation of this disclosure within the spirit and scope of the claims.

Claims

1. A battery connection module for connecting multiple batteries, the battery connection module comprising: One tray; Multiple busbars are mounted on the tray for connecting the multiple batteries; A circuit board connected to the plurality of busbars; and A temperature sensing component, comprising: A first thermal pad and a second thermal pad are provided, wherein the first thermal pad is disposed on the upper surface of the circuit board and the second thermal pad is disposed on the lower surface of the circuit board; Multiple first thermally conductive vias penetrate the first thermally conductive pad, the second thermally conductive pad, and the circuit board; A temperature sensor is disposed on the upper surface of the circuit board and adjacent to the first thermal pad; and A bridging piece, wherein a first end of the bridging piece is connected to the first thermal pad and covers at least a portion of the first thermal vias, and a second end of the bridging piece is connected to a busbar; the first thermal pad is connected to a voltage acquisition line on the circuit board; in addition to realizing the electrical connection between the busbar and the circuit board, the bridging piece is also used to transfer the heat of the busbar to the first thermal pad.

2. The battery connection module according to claim 1, wherein, The temperature measuring component also includes: A cap is disposed on the upper surface of the circuit board to encapsulate at least a portion of the first thermal pad, the temperature sensor, and the first end of the bridging piece.

3. The battery connection module according to claim 1 or 2, wherein, The first thermal pad has a first receiving opening, and the first end of the bridging piece has a second receiving opening, with the first receiving opening and the second receiving opening being positioned opposite each other; wherein the temperature sensor is at least partially located within the range of the first receiving opening and the second receiving opening.

4. The battery connection module according to claim 1, wherein, The circuit board is provided with electrical contacts, and the temperature sensor is mounted on the electrical contacts; wherein, the temperature measuring component further includes: The second thermal via penetrates the electrical contact and the circuit board.

5. The battery connection module according to claim 4, wherein, The electrical contact is a solder pad, and the temperature sensor is mounted on the solder pad by soldering; wherein, the temperature measuring component further includes: The third thermal pad is disposed on the lower surface of the circuit board, and the solder pad is disposed on the upper surface of the circuit board; The second thermally conductive via also penetrates the third thermally conductive pad.

6. The battery connection module according to claim 1, wherein, The tray has an opening that corresponds to the position of the second thermal pad.

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