Printable silicone compositions and methods of making and using the same

CN116635755BActive Publication Date: 2026-08-28DOW SILICONES CORP
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Patent Information

Application Number
CN202280008749.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-02-02
Filing Date
2022-01-11
Publication Date
2026-08-28
Estimated Expiration
2042-01-11

AI Technical Summary

Technical Problem

然而，这些方法在制造更薄的(光)电子装置方面具有局限性，因为难以实现具有≤50μm的厚度的层

Benefits of technology

[0017]任选地(H)硅氢加成反应抑制剂，基于起始材料(A)、起始材料(B)、起始材料(C)、起始材料(D)、起始材料(E)、起始材料(F)、起始材料(G)和起始材料(H)的组合量，该硅氢加成反应抑制剂的量为按质量计0ppm至10,000ppm。

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Abstract

A curable silicone composition having a viscosity of ≤ 100 mPa-s at 25°C is disclosed. The composition is suitable for use in printing methods. The composition can be cured by hydrosilylation to form a silicone adhesive suitable for use in the field of (opto)electronic device manufacturing.
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Citation Information

Patent Citations

  • Hydrosilylation reactions activated through radiation

    CN101925608B

  • Curing Method For Curing Organosilicone Composition

    CN104031602A

  • Method for preparing a particulate material comprising a platinum-containing hydrosilylation catalyst and a silicone resin.

    EP0347895A2

  • Radiation activated hydrosilation reaction

    EP0398701B1

  • Silicone pressure-sensitive adhesive composition and layered product

    EP3757186A1