布线基板和其裁切方法、以及多层布线板
By introducing a tortuous insulating boundary region in the wiring substrate to separate the device area and the surrounding area, the cracking problem during the cutting process is solved, the mechanical strength and water resistance are improved, and the feasibility of electrical testing and the product yield are realized.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MITSUI MINING & SMELTING CO LTD
- Filing Date
- 2021-12-10
- Publication Date
- 2026-07-17
AI Technical Summary
When using metal foil with a carrier to form a wiring substrate, cracks are easily generated during the cutting process, leading to insulation damage and corrosion. Furthermore, it is difficult to perform electrical testing before cutting, which affects the product yield.
An insulating boundary region is introduced into the wiring substrate. The zigzag-shaped insulating boundary region is separated from the device area and the surrounding area. The mechanical strength and water resistance are improved by alternately cutting the virtual wiring pattern and insulating layer with imaginary straight lines, and electrical independence is ensured.
It effectively prevents cracking during cutting and subsequent moisture penetration, improves the mechanical strength and moisture resistance after cutting, ensures the feasibility of electrical testing, and increases the product yield.
Smart Images
Figure CN116635979B_ABST