Wire cutting control method

Abstract

The embodiment of the application discloses a wire cutting control method. The wire cutting control method is applied to a wire cutting device, the wire cutting device is provided with a cutting mechanism capable of multi-axis linkage and a material loading platform, the control method comprises the following steps: determining the running track of each axis linkage according to the curved surface machining target of a material to be machined; controlling the movement of each axis according to the running track to realize the complex curved surface machining of the material to be machined; wherein the multi-axis linkage at least comprises translation in the X-axis direction, translation in the Y-axis direction, translation in the Z-axis direction, rotation around the B-axis and rotation around the C-axis; the axial directions of the X-axis, the Y-axis and the Z-axis are perpendicular to each other, the axial direction of the B-axis is parallel to the axial direction of the Y-axis, and the axial directions of the C-axis and the B-axis are perpendicular. After the scheme of the embodiment of the application is adopted, the application scene of the diamond wire cutting is effectively expanded, the multi-axis linkage efficient machining of the space curved surface can be realized, and the machining efficiency and the machining quality are improved.

Description

Technical Field

[0001] This application relates to the field of diamond wire cutting technology, and more specifically, to a wire cutting control method. Background Technology

[0002] Currently, in the fields of spatial curved surfaces and CNC machining, milling is one of the most commonly used machining methods for machining spatial curved surface parts. However, when using CNC machine tools to mill spatial curved surfaces, the tool needs to remove the material to be machined layer by layer from the outermost layer to the inside according to the machining path to obtain the surface contour. This process has low machining efficiency.

[0003] In the fields of photovoltaic crystalline silicon and semiconductor cutting, cutting heads with single-wire or multi-wire diamond wires are often used to cut, squared, and slice silicon materials, which has high processing efficiency. However, the cutting heads in this solution generally only have a single feed direction, which can meet the processing needs of silicon materials, but it is difficult to meet the requirements when applied to the processing of parts with spatial curved surfaces.

[0004] How to integrate the advantages of different solutions at the technical level to achieve rapid and efficient processing of spatial curved surfaces is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, this application provides a wire cutting control method to facilitate the removal of material using diamond wire cutting and achieve efficient multi-axis linkage machining of spatial curved surfaces.

[0006] The wire EDM control method of this application embodiment is applied to a wire EDM device, which has a multi-axis linkage cutting mechanism and a material loading platform. The control method includes: determining the running trajectory of each axis linkage according to the surface machining target of the material to be processed; controlling the movement of each axis according to the running trajectory to realize the surface machining of the material to be processed; wherein, the multi-axis linkage includes at least translation around the X-axis, translation around the Y-axis, translation around the Z-axis, rotation around the B-axis, and rotation around the C-axis; the axial directions of the X-axis and Y-axis are perpendicular, the Z-axis is perpendicular to the axial directions of the X-axis and Y-axis respectively, the B-axis is parallel to the axial direction of the Y-axis, and the C-axis is perpendicular to the axial direction of the B-axis. The surface motion is realized by the linkage of the X-axis and Y-axis, the B-axis is used to realize the spatial surface shape, and the C-axis is used to realize surface machining and maintain tangent point tracking.

[0007] Furthermore, the loading platform has the function of linkage of X-axis, Y-axis, B-axis and C-axis.

[0008] Furthermore, in the wire cutting device, the material carrier platform includes an X-axis platform mounted on a base, a Y-axis platform mounted on the X-axis platform, a B-axis turntable mounted on the Y-axis platform, and a C-axis turntable mounted on the B-axis turntable, wherein the C-axis turntable is used to support and clamp the material to be processed.

[0009] Furthermore, the cutting mechanism has a Z-axis linkage function, which is used to adjust the workpiece cutting point to be located at the midpoint of the effective cutting line segment.

[0010] Furthermore, in the wire cutting device, a column is mounted on a base, and a Z-axis groove is provided on the column. The cutting mechanism slides in cooperation with the Z-axis groove via a sliding plate.

[0011] Furthermore, the wire cutting device also includes a lifting adjustment mechanism disposed between the column and the slide plate; in the control method, the movement of the Z-axis is controlled by controlling the state of the lifting adjustment mechanism.

[0012] Furthermore, the loading platform also includes a working platform, which is disposed on the Y-axis platform. The B-axis turntable includes a fixed part and a rotating part connected to each other. The fixed part is disposed on the working platform, and the C-axis turntable is disposed on the rotating part.

[0013] Furthermore, the top of the X-axis platform is provided with a first slide rail, and the bottom of the Y-axis platform is provided with a first slider portion, the first slider portion slidingly engaging with the first slide rail.

[0014] Furthermore, a second slide rail is provided at the top of the Y-axis platform, and a second slider is provided at the bottom of the working platform, with the second slider slidingly engaging with the second slide rail.

[0015] Furthermore, the loading platform also includes an X-axis drive mechanism disposed between the X-axis platform and the Y-axis platform, a Y-axis drive mechanism disposed between the Y-axis platform and the working platform, a B-axis rotation mechanism disposed between the working platform and the B-axis turntable, and a C-axis rotation mechanism disposed between the B-axis turntable and the C-axis turntable; in the control method, the movement of the X-axis, Y-axis, B-axis, and C-axis is controlled by controlling the states of the X-axis drive mechanism, the Y-axis drive mechanism, the B-axis rotation mechanism, and the C-axis rotation mechanism, respectively.

[0016] By adopting the solution of this application embodiment, the applicable scenarios of the original diamond wire cutting are effectively expanded, that is, it is possible to realize multi-axis linkage (including at least X-axis, Y-axis, Z-axis, B-axis, and C-axis) machining of spatial curved surfaces. Moreover, this solution uses diamond wire to directly cut into the material to be processed without removing it layer by layer. Finally, the desired machining surface is obtained by using a specific tool path, which significantly improves the machining efficiency and machining quality. When the X-axis, Y-axis, and Z-axis are linked to the set position and cut into the workpiece, the machining of cylindrical curved surfaces can be realized by the rotational motion of the B-axis and C-axis, so that the machining surface is closed and better machining accuracy can be obtained. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0018] Figure 1 A schematic diagram of the core part of a wire cutting device provided in an embodiment of this application;

[0019] Figure 2 for Figure 1 A structural diagram from another perspective;

[0020] Figure 3 for Figure 1 Another structural diagram from a different perspective;

[0021] Figure 4 A schematic diagram illustrating the processing principle of the wire EDM control method provided in the embodiments of this application;

[0022] Figure 5 This is a schematic diagram of the overall structure of the wire cutting device;

[0023] Figure 6 This is a structural schematic diagram of the cutting mechanism and its lifting and adjusting mechanism;

[0024] Figure 7 This is a schematic diagram of the overall structure of the material loading platform.

[0025] Figure label:

[0026] 100 material loading platform

[0027] 200 materials to be processed

[0028] 300 cutting mechanism

[0029] 400 columns

[0030] 500 bases

[0031] 101 Work Platform

[0032] 102Y axis platform

[0033] 103X-axis platform

[0034] 104 tooling

[0035] 105C axis rotary table

[0036] 106 Fixing Part

[0037] 107 Rotating Part

[0038] 301 Installation Frame

[0039] 302 skateboard

[0040] 303 First Cutting Wheel

[0041] 304 Second Cutting Wheel

[0042] 305 tension wheel

[0043] 306 drive wheels

[0044] 401Z axis slide groove Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other.

[0046] The following is combined Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The wire cutting control method and wire cutting apparatus of the embodiments of this application will be described in detail. For ease of explanation and description, the overall composition of the wire cutting apparatus will be described first. As shown in the figure, the wire cutting apparatus may include a material carrier platform 100, a cutting mechanism 300, a column 400, and a base 500. The column 400 is disposed at a first position on the base 500, the cutting mechanism 300 is disposed on the column 400, and the material carrier platform 100 is disposed at a second position on the base 500.

[0047] The material loading platform 100 may include a work platform 101, a Y-axis platform 102, an X-axis platform 103, a C-axis rotary table 105, and a B-axis rotary table. The bottom of the X-axis platform 103 is located at a second position on the base 500. The Y-axis platform 102 is movably mounted on the X-axis platform 103, and the work platform 101 is movably mounted on the Y-axis platform 102. The B-axis rotary table includes a fixed part 106 and a rotating part 107. The rotating part 107 is rotatably mounted on the fixed part 106, which is mounted on the work platform 101. The C-axis rotary table 105 is mounted on the rotating part 107 and is used to support and clamp the material 200 to be processed. Additionally, the cutting mechanism 300 has a Z-axis linkage function, meaning it can rise and fall on the column 400 to achieve linkage with other axes. The X and Y axes are perpendicular to each other, the Z axis is perpendicular to both the X and Y axes, the B axis is parallel to the Y axis, and the C axis is perpendicular to the Z axis. In practice, a fixture 104 can be installed on the C-axis rotary table 105 to facilitate the carrying and clamping of the material 200 to be processed.

[0048] It is worth noting that, for the sake of clarity of the embodiments, the specific directions of the X-axis, Y-axis, Z-axis, B-axis and C-axis are given in the accompanying drawings. However, according to the design spirit of this application, it is not actually limited to the direction of each axis being consistent with that in the embodiments. As long as the X-axis, Y-axis and Z-axis are translation axes and their axes are perpendicular to each other, and the B-axis and C-axis are rotation axes and their axes are perpendicular to each other, it is acceptable.

[0049] During the operation, the position of the work platform 101 on the Y-axis platform 102 and the X-axis platform 103 can be adjusted, as well as the rotation state of the B-axis turntable and the C-axis turntable 105 can be adjusted, so that the material to be processed 200 on the C-axis turntable 105 approaches the diamond wire cutting part of the cutting mechanism 300 with a predetermined feed path and angle, thereby realizing the irregular curved surface processing of the material to be processed 200. In specific implementation, the workpiece (corresponding to the material to be processed 200) can move relative to the diamond wire of the cutting mechanism under the linkage drive of the X and Y axes. With the Z-axis movement of the cutting mechanism, the X, Y, Z, B, and C axes can be linked simultaneously to achieve multi-axis linkage. This multi-axis linkage includes at least translation in the X-axis direction, translation in the Y-axis direction, and rotation around the C-axis, or at least translation in the X-axis direction, translation in the Y-axis direction, translation in the Z-axis direction, rotation around the B-axis, and rotation around the C-axis, thereby achieving the movement of the planned cutting path. The processing of irregular curved surfaces can be achieved through path planning of the effective cutting segment of the diamond wire. During the entire cutting process, the diamond wire moves on the wheel system plane of the cutting mechanism to obtain the line movement relative to the workpiece (corresponding to the material to be processed 200). When the workpiece moves relative to the effective cutting segment of the diamond wire, the diamond wire removes the workpiece material to achieve the cutting of the irregular surface according to the planned path.

[0050] The wire cutting control method of this application embodiment is used in the wire cutting device having a cutting mechanism 300 and a material loading platform 100. The cutting mechanism 300 and the material loading platform 100 have multi-axis linkage function. The control method includes the following steps: determining the running trajectory of each axis linkage according to the surface machining target of the material to be processed 200; controlling the movement of each axis according to the running trajectory to realize the complex surface machining of the material to be processed; wherein, the X-axis and Y-axis linkage realize the surface movement, the B-axis is used to realize the spatial surface shape, and the C-axis is based on the B-axis to realize surface machining and maintain the tangent tracking. During the cutting process, based on the desired surface curvature of the finished product, the linear and rotary axes of the material platform 100 are coordinated with the linear axis of the diamond wire cutting mechanism 300 to adjust parameters such as the contact position, contact angle, feed position, feed angle, and feed stroke between the material being cut and the diamond wire cutting mechanism 300. This ensures that the direction of travel of each contact cutting point between the material being cut and the diamond wire is always consistent with the tangent direction of the curved surface at that position, thereby achieving precise cutting of the three-dimensional curved surface while controlling the direction and size of the diamond wire bow.

[0051] Based on the foregoing and existing technology, it is clear that current methods for machining irregular curved surfaces using CNC machine tools are inefficient. When machining a large surface into a very small one, the workpiece needs to be removed layer by layer. Compared to traditional CNC machine tool machining, the solution in this application uses a diamond wire cutting mechanism as the cutting tool. This mechanism can perform interpolation motion through two-axis linkage, using the diamond wire to cut the curved workpiece and remove excess material without layer-by-layer removal. Finally, the desired machined surface is obtained using a specific toolpath. When using diamond wire cutting, for more complex surfaces, the cutting mechanism performs multiple passes to contour machining and refine the curved surface. Simple curved surfaces can be cut into shape in one go, significantly improving processing efficiency and quality. Compared with flexible processing methods that do not use C-axis function, the solution of this application embodiment is more flexible in motion, especially suitable for processing two-dimensional curved surfaces of rotation. Specifically, although X / Y linkage can process the semi-circular surfaces on both sides of the cutter head, the cylindrical surface cannot be closed because the cutter head cannot pass through the support fixture under the workpiece. However, after adding the C-axis, when the X-axis and Y-axis are linked to the set position and cut into the workpiece, the cylindrical surface can be processed directly by the C-axis rotation. The processed surface is closed and better processing accuracy can be obtained. Furthermore, the C-axis rotation is achieved by moving along the B-axis rotation axis. The B-axis can swing within a range of 0-90° in both positive and negative directions, while the C-axis can rotate 0-360° around its own axis, enabling continuous rotation in both directions. To avoid interference between the diamond wire and the rotary table during machining, a fixture 104 can be installed above the rotary table. The workpiece is placed above the fixture, and the workpiece, along with the fixture, is mounted on the C-axis of the rotary table. The workpiece, fixture, and C-axis of the table are coaxially arranged, ensuring that the workpiece rotates coaxially during C-axis rotation, thereby achieving linkage between the rotary axis and the linear axis. In addition, the solution of this application effectively expands the applicable scenarios for diamond wire cutting.

[0052] It should be noted that in the foregoing embodiments, the multi-axis linkage function of the cutting mechanism 300 and the loading platform 100 means that both the cutting mechanism 300 and the loading platform 100 have a multi-axis linkage function overall, that is, they have multiple axial motion degrees of freedom during processing, and can implement different axial motion degrees of freedom according to processing needs, thereby completing the predetermined processing trajectory as a whole. As can be seen from the foregoing embodiments, in the multi-axis linkage function, for example, when it has a five-axis linkage function of XYZBC, the cutting mechanism 300 has a Z-axis function, while the loading platform has XYBC axis functions; however, in other embodiments, it is not limited to this, and the cutting mechanism 300 may have multiple axis functions, while the loading platform may have one or more of the remaining types of axis functions.

[0053] By adopting the solution of this application embodiment, during cutting, the cutting tool or the material being cut will automatically rotate and adjust its travel angle according to the curve changes of the surface, ensuring that the direction of each cutting point of the diamond wire travels is consistent with the tangent direction of the surface at that position, thereby maintaining a fixed cutting wire bow and achieving controllable direction and size of the wire bow. In traditional cutting methods, the diamond wire cutting tool remains stationary, while the material being cut moves along the X and Y axes under the control of a CNC program, forming a motion curve through two linkages to achieve surface cutting. In traditional cutting methods, during two-axis linkage cutting, the diamond wire experiences resistance from the material being cut, resulting in a wire bow along the tangent direction of the curve at the cutting point. Since the cutting tool remains stationary, the centerline of the cutting wheel groove will deviate from the bending direction of the wire bow at an angle. As the curve shape changes, the magnitude and direction of the resistance experienced by the diamond wire change, and the bending direction and size of the wire bow also change accordingly, making the magnitude and direction of the deviation angle inconsistent, thus causing inaccurate cutting trajectories. The solution of this application embodiment addresses the above problems by adding a rotation axis in addition to the X and Y axes, achieving high-precision surface cutting of the diamond wire through the rotation of the material being cut. During cutting, the material being cut will automatically rotate and adjust its travel angle according to the curve changes of the surface, so that the direction of each cutting point of the diamond wire is consistent with the tangent direction of the surface at that position, thereby maintaining a fixed cutting wire bow. This allows for controllable direction and size of the wire bow, avoiding the problem of the theoretical cutting pattern not matching the actual cutting pattern due to the diamond wire bow, and achieving high-precision surface cutting with diamond wire.

[0054] In specific implementation, to better realize the motion performance of the X-axis platform 103 and the Y-axis platform 102, a first slide rail can be set at the top of the X-axis platform 103, and a first slider part can be set at the bottom of the Y-axis platform 102, which slides in cooperation with the first slide rail. Additionally, a second slide rail can be set at the top of the Y-axis platform 102, and a second slider part can be set at the bottom of the working platform 101, which slides in cooperation with the second slide rail. To realize the adjustment and control of the X-axis and Y-axis motions and the rotation control of the C-axis platform, the loading platform can also include an X-axis drive mechanism set between the X-axis platform 103 and the Y-axis platform 102, a Y-axis drive mechanism set between the Y-axis platform 102 and the working platform 101, a B-axis rotation mechanism set between the working platform and the B-axis turntable, and a C-axis rotation mechanism set between the working platform 101 and the C-axis turntable 105. The axial drive mechanisms can be implemented using a lead screw and nut mechanism, while the B-axis rotation mechanism and the C-axis rotation mechanism can be implemented using a motor drive mechanism. In the cutting control method, the movement of the X-axis, Y-axis, B-axis, and C-axis is controlled by controlling the state of the X-axis drive mechanism, Y-axis drive mechanism, B-axis rotation mechanism, and C-axis rotation mechanism, respectively.

[0055] Based on this, to further improve the processing performance and flexibility of the wire EDM device, it is preferable that the cutting mechanism 300 has a Z-axis linkage function. Specifically, a Z-axis groove 401 can be opened on the column 400, and the cutting mechanism 300 (the mounting frame 301) slides with the Z-axis groove 401 through a sliding plate 302 (in other embodiments, it can also be a slider and guide rail). A lifting adjustment mechanism (not shown in the figure) is also provided between the column 400 and the sliding plate 302 to realize the Z-axis axial lifting of the cutting mechanism 300 on the column 400. The lifting adjustment mechanism can be driven by a servo motor to drive a high-precision ball screw, which works in conjunction with a high-precision linear guide rail to enable the cutting mechanism to move precisely in the Z-axis direction. With this solution, the cutting mechanism 300 can be adjusted along the Z-axis through Z-axis movement without the need for multiple tooling fixtures. The processing height can be flexibly adjusted to match the processing position to the maximum extent and minimize the impact of the wire bow on the processing accuracy.

[0056] With the Z-axis function, the cutting mechanism in the wire cutting control method can use the Z-axis to adjust the workpiece cutting point to be located at the midpoint of the effective cutting line segment. Controlling the movement of the Z-axis can be achieved by controlling the state of the lifting and adjusting mechanism. That is, the control method of this embodiment can realize five-axis spatial multi-axis linkage machining. The five axes are X-axis, Y-axis, Z-axis, B-axis, and C-axis. The B-axis rotates around the Y-axis, and the C-axis rotates around the Z-axis. Taking a circular wire as an example, a CNC system is used to realize NC-based circular diamond wire cutting trajectory planning and CAM-based machining path programming. The horizontal X-axis and Y-axis orthogonal slides, linked by two axes, enable surface motion. Building upon this, two additional rotational axes, B and C, are added. The C-axis is built upon the B-axis, which has an open swing mechanism to achieve spatial surface shapes. The C-axis rotates and can reciprocate 360° or overlap rotations to perform surface machining and ensure tangent tracking. Combined with the Z-axis tool feed, which adjusts the workpiece tangent to the midpoint of the effective cutting line segment, the five-axis system, based on NC-based annular diamond wire cutting trajectory planning and CAM-based machining path programming, enables the machining of complex surfaces.

[0057] Furthermore, in traditional cutting methods, during two-axis simultaneous cutting, the diamond wire encounters resistance from the material being cut, causing it to arch along the tangent direction of the cutting point. When machining curved surfaces, the diamond wire is prone to jumping out of the groove due to lateral force when the Y-axis coordinates with the X-axis feed motion, resulting in skipped lines. Even without skipped lines, the wire will coil when the force direction reverses, causing abnormal marks on the cut surface and affecting the quality of the cut surface. During the cutting process, the diamond wire and the workpiece are in a very unstable positional relationship, leading to skipped lines and poor surface quality. Therefore, a better method is to keep the cutter head oscillating along the feed direction, ensuring the diamond wire is always pressed against the tool path for cutting—a cutting point tracking method. The solution in this application allows the diamond wire to always be pressed against the tool path for cutting. In this state, the groove has the best holding force on the wire, improving both machining accuracy and quality. Moreover, the five-axis spatial multi-axis linkage allows for the machining of three-dimensional complex curved surfaces, such as two-dimensional curves and surfaces, and three-dimensional cylinders, cones, and other shapes.

[0058] Furthermore, in specific implementation, the cutting mechanism 300 can adopt different cutter head schemes. As an example, as shown in the figure, the cutting mechanism 300 may include a mounting frame 301, a first cutting wheel 303, a second cutting wheel 304, a tension wheel 305, a drive wheel 306, and diamond wire (not shown). The first cutting wheel 303, the second cutting wheel 304, the tension wheel 305, and the drive wheel 306 are sequentially and spaced apart on the mounting frame 301. The diamond wire passes around the edges of each wheel sequentially to form a loop. The mounting frame 301 is mounted on the column 400 via a sliding plate 302. During use, the drive wheel 306 provides power to the cutting wire mesh, driving the diamond wire to move and thus providing cutting force. The first cutting wheel 303 and the second cutting wheel 304 support the diamond wire cutting the workpiece along the feed direction. The segment of the diamond wire between the two cutting wheels is the effective cutting wire length. The tension wheel 305 ensures the wire mesh is tensioned and maintains stable cutting tension.

[0059] In addition, during implementation, machining can be performed simultaneously and in a coordinated manner under the control of a Computer Numerical Control (CNC) system. The tool axis vector, which displays the entire cutting trajectory process in multi-axis linkage, can be changed as needed. The B and C axes are controlled by the X, Y, and Z trajectory control axes, thereby removing material layer by layer and ultimately achieving spatial surface machining. For horizontal X-axis and Y-axis orthogonal slides and B-axis and C-axis rotary tables, four-axis linkage can achieve surface motion. For schemes with a Z-axis, a tool feed Z-axis can be added to adjust the workpiece cutting point to be located at the midpoint of the effective cutting line segment, thus achieving five-axis linkage machining with a more optimized wire cutting position.

[0060] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0061] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A wire cutting control method, applied to a wire cutting device, characterized in that, The wire cutting device is equipped with a multi-axis linkage cutting mechanism and a material loading platform, and the control method includes: Based on the surface machining target of the material to be processed, determine the running trajectory of each axis linkage; The movement of each axis is controlled according to the running trajectory to realize the surface processing of the material to be processed; The multi-axis linkage includes at least translation around the X-axis, translation around the Y-axis, translation around the Z-axis, rotation around the B-axis, and rotation around the C-axis; the axial directions of the X-axis and Y-axis are perpendicular, the Z-axis is perpendicular to the axial directions of the X-axis and Y-axis respectively, the B-axis is parallel to the axial direction of the Y-axis, and the C-axis is perpendicular to the axial direction of the B-axis. The loading platform has the function of linkage of X-axis, Y-axis, B-axis and C-axis; In the wire cutting device, the material carrier platform includes an X-axis platform mounted on a base, a Y-axis platform mounted on the X-axis platform, a B-axis turntable mounted on the Y-axis platform, and a C-axis turntable mounted on the B-axis turntable. The C-axis turntable is used to support and clamp the material to be processed. A fixture is provided above the C-axis rotary table, and the material to be processed is placed above the fixture. The material to be processed, the fixture, and the C-axis rotary table are coaxially arranged to avoid interference between the diamond wire and the C-axis rotary table during processing. The cutting mechanism has a Z-axis linkage function, which is used to adjust the workpiece cutting point to be located at the midpoint of the effective cutting line segment. The loading platform also includes a working platform, which is disposed on the Y-axis platform. The B-axis turntable includes a fixed part and a rotating part connected to each other. The fixed part is disposed on the working platform, and the C-axis turntable is disposed on the rotating part. The loading platform further includes an X-axis drive mechanism disposed between the X-axis platform and the Y-axis platform, a Y-axis drive mechanism disposed between the Y-axis platform and the working platform, a B-axis rotation mechanism disposed between the working platform and the B-axis turntable, and a C-axis rotation mechanism disposed between the B-axis turntable and the C-axis turntable. In the control method, the movement of the X-axis, Y-axis, B-axis, and C-axis is controlled by controlling the states of the X-axis drive mechanism, the Y-axis drive mechanism, the B-axis rotation mechanism, and the C-axis rotation mechanism, respectively. Furthermore, controlling the movement of the C-axis is also used to ensure that the direction of each cutting point of the diamond wire travel is consistent with the tangent direction of the surface at that position, thereby maintaining a fixed cutting wire bow.

2. The wire cutting control method as described in claim 1, characterized in that, In the wire cutting device, a column is mounted on a base, and a Z-axis groove is provided on the column. The cutting mechanism slides in cooperation with the Z-axis groove via a sliding plate.

3. The wire cutting control method as described in claim 2, characterized in that, The wire cutting device also includes a lifting adjustment mechanism disposed between the column and the slide plate; in the control method, the movement of the Z-axis is controlled by controlling the state of the lifting adjustment mechanism.

4. The wire cutting control method as described in claim 1, characterized in that, The top of the X-axis platform is provided with a first slide rail, and the bottom of the Y-axis platform is provided with a first slider, which slides in conjunction with the first slide rail.

5. The wire cutting control method according to claim 4, characterized in that, The top of the Y-axis platform is provided with a second slide rail, and the bottom of the working platform is provided with a second slider, which slides in conjunction with the second slide rail.

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