Silicon wafer packaging apparatus and silicon wafer packaging system

Abstract

The application discloses a kind of silicon wafer packaging equipment and silicon wafer packaging system, the silicon wafer packaging equipment includes rack, carousel and banding device, the carousel includes carousel body and at least one supporting component arranged on the carousel body;The carousel body is rotatably arranged on the rack, so that the supporting component is switched between the first material placing position for placing the first protective layer, the silicon wafer placing position for placing the silicon wafer and the second material placing position for placing the second protective layer;The banding device is arranged downstream of the carousel, and the banding device is used to bundle the layered assembly including the first protective layer, the silicon wafer and the second protective layer.The silicon wafer packaging equipment of the embodiment of the application has the advantages of high yield rate of silicon wafer.

Description

Technical Field

[0001] This invention relates to the field of solar cell manufacturing technology, and more specifically to a silicon wafer packaging equipment and a silicon wafer packaging system. Background Technology

[0002] Silicon wafers are fragile and require packaging to prevent damage during transportation. In related technologies, multiple silicon wafers are often stacked together to form a stack, which is then encapsulated in plastic. During stacking, an air cushion effect exists between the newly placed wafers, causing misalignment between the upper and lower layers. When the stack is encapsulated, stress is generated between these misaligned wafers, leading to problems such as breakage and chipped corners, severely impacting the yield rate. Summary of the Invention

[0003] The present invention aims to at least partially solve one of the technical problems in the related art.

[0004] Therefore, embodiments of the present invention provide a silicon wafer packaging device to improve the yield of silicon wafers.

[0005] The silicon wafer packaging equipment of this invention includes a frame, a turntable, and a strapping device. The turntable includes a turntable body and at least one support component disposed on the turntable body. The turntable body is rotatably disposed on the frame so that the support component can switch between a first feeding position for placing a first protective layer, a silicon wafer feeding position for placing silicon wafers, and a second feeding position for placing a second protective layer. The strapping device is disposed downstream of the turntable and is used to strap the stacked assembly including the first protective layer, the silicon wafer, and the second protective layer.

[0006] In some embodiments, the silicon wafer packaging equipment further includes a first robotic arm, a second robotic arm, a third robotic arm, and a fourth robotic arm. The first robotic arm and the second robotic arm are movably mounted on the frame. The first robotic arm has a first gripping part for gripping the first protective layer, and the second robotic arm has a second gripping part for gripping the second protective layer. The third robotic arm and the fourth robotic arm are movably mounted on the frame. The third robotic arm has a third gripper for gripping the silicon wafer, and the fourth robotic arm has a fourth gripper for gripping the stacked assembly.

[0007] In some embodiments, the first robotic arm includes a first mounting plate and a first suction cup, the first suction cup being connected to the first mounting plate and forming the first gripping portion; the second robotic arm includes a second mounting plate and a second suction cup, the second suction cup being connected to the second mounting plate and forming the second gripping portion; the third robotic arm includes a third mounting plate and a plurality of third grippers, the plurality of third grippers being movably disposed on the third mounting plate, the third grippers including a first clamping portion for clamping the silicon wafer and a first supporting portion for supporting the silicon wafer; the fourth robotic arm includes a fourth mounting plate and a plurality of fourth grippers, the plurality of fourth grippers being movably disposed on the fourth mounting plate, the fourth grippers including a second clamping portion for clamping the stacked assembly and a second supporting portion for supporting the stacked assembly.

[0008] In some embodiments, the support assembly includes a carrier and a plurality of stops. The carrier is disposed on the turntable and has a carrier surface for carrying the silicon wafer. The plurality of stops are circumferentially spaced along the carrier and have a stop surface facing the carrier. The stops are movable between a centered position holding the silicon wafer and a removable position releasing the silicon wafer. In the centered position, the stop surfaces of the plurality of stops abut against the side of the silicon wafer. In the removable position, the stop surfaces of the plurality of stops are all away from the silicon wafer, so that the third gripper of the third robotic arm or the fourth robotic arm can grasp the stacked assembly.

[0009] In some embodiments, the silicon wafer clamping device includes two stop assemblies, each stop assembly including at least one stop member;

[0010] The bearing surface is rectangular, and two stop components are spaced apart along the long side of the bearing surface so that a clearance opening is formed between the two stop components to avoid the third gripper or the fourth gripper.

[0011] In some embodiments, the silicon wafer packaging equipment further includes a first feeding assembly and a second feeding assembly. The first feeding assembly has at least one first feeding section for storing the first protective layer. The first feeding assembly is movably disposed on the frame and located on one side of the turntable. The first feeding section switches between a first working position near the first discharge position and a first clearance position away from the first discharge position. The second feeding assembly has at least one second feeding section for storing the second protective layer. The second feeding assembly is movably disposed on the frame and located on the other side of the turntable. The second feeding section switches between a second working position near the second discharge position and a second clearance position away from the second discharge position. The first robotic arm moves between the first working position and the first discharge position, and the second robotic arm moves between the second working position and the second discharge position.

[0012] In some embodiments, there are multiple first feeding sections, such that when a portion of the first feeding sections are in the first discharge position, another portion of the first feeding sections are in the first clearance position; there are multiple second feeding sections, such that when a portion of the second feeding sections are in the second discharge position, another portion of the second feeding sections are in the second clearance position.

[0013] In some embodiments, the first feeding section includes a first feeding plate, at least a first baffle, and at least one first air blowing device, wherein the first baffle and the first feeding plate form a first receiving cavity for storing the first protective layer, and at least one of the first baffles is provided with a first air hole facing the first receiving cavity, and the first air blowing device communicates with the first air hole; and / or, the second feeding section includes a second feeding plate, at least one second baffle, and at least one second air blowing device, wherein the second baffle and the second feeding plate form a second receiving cavity for storing the second protective layer, and at least one of the second baffles is provided with a second air hole facing the second receiving cavity, and the second air blowing device communicates with the second air hole.

[0014] In some embodiments, the silicon wafer packaging equipment further includes a first conveying assembly and a second conveying assembly, both of which are located downstream of the turntable. The first conveying assembly and the second conveying assembly are spaced apart on the frame so that both ends of the stacked assembly are supported by the first conveying assembly and the second conveying assembly, respectively. A portion of the strapping device is located between the first conveying assembly and the second conveying assembly so that the strapping device can strap the middle of the stacked assembly.

[0015] In some embodiments, the strapping device is movable along the arrangement direction of the first conveying assembly and the second conveying assembly so that the strapping device can bind multiple straps to the middle of the stacked assembly; and / or, the silicon wafer packaging equipment further includes a lifting device disposed on the frame and connected to the strapping device to drive the strapping device to move up and down.

[0016] In some embodiments, the distance between the first conveying component and the second conveying component is greater than or equal to 90 mm.

[0017] In some embodiments, the silicon wafer packaging equipment further includes a silicon wafer clamping device located upstream of the turntable. The silicon wafer clamping device includes a base, a support member, and a plurality of limiting members. The base is disposed on the frame. The support member is disposed on the base and has a support surface for supporting the silicon wafer. The plurality of limiting members are circumferentially spaced along the support member. Each limiting member has a limiting surface facing the support member. The limiting members are movably connected to the base between a clamping position and a releasing position. The limiting members are movably connected to the base in a direction perpendicular to the support surface. In the clamping position, the limiting surfaces of the plurality of limiting members abut against the side of the silicon wafer. In the releasing position, the limiting surfaces of the plurality of limiting members are away from the silicon wafer.

[0018] In some embodiments, the base is movably disposed on the frame to allow the wafer clamping device to switch between an initial position and a detection position, and the base is rotatably connected to the frame; the wafer packaging equipment further includes a detection device disposed on the frame and located near the detection position, the detection device being used to detect the wafer on the wafer clamping device at the detection position.

[0019] Embodiments of the present invention also propose a silicon wafer packaging system.

[0020] The silicon wafer packaging system of this invention includes silicon wafer packaging equipment, sealing equipment, and / or boxing equipment. The silicon wafer packaging equipment is the silicon wafer packaging equipment described in any of the above embodiments. The sealing equipment is located downstream of the silicon wafer packaging equipment and is used to wrap the laminated assembly, which is bundled with cable ties, with a sealing film. The boxing equipment is located downstream of the silicon wafer packaging equipment and is used to pack the laminated assembly, which is bundled with cable ties, into a packaging box.

[0021] In operation, the silicon wafer packaging equipment of this invention first places a first protective layer on a support assembly at a first feeding position. Then, the turntable rotates, causing the support assembly with the first protective layer to rotate to the wafer feeding position, and placing the wafer on top of the first protective layer. Next, the turntable rotates, causing the support assembly with the first protective layer and the wafer to rotate to a second feeding position, and placing a second protective layer on top of the wafer. At this point, the first protective layer, the wafer, and the second protective layer form a stacked assembly, with the wafer positioned between the first and second protective layers. Then, the turntable rotates, causing the support assembly with the stacked assembly to rotate to a wafer picking position. Finally, the stacked assembly is removed from the support assembly at the wafer picking position and transferred to a strapping device. The strapping device then secures the stacked assembly with straps, forming a stable whole. This silicon wafer packaging equipment of the present invention can improve the automation level of the silicon wafer packaging process, thereby reducing packaging costs and increasing packaging efficiency. Attached Figure Description

[0022] Figure 1 This is a simplified structural diagram of a silicon wafer packaging device according to an embodiment of the present invention.

[0023] Figure 2 yes Figure 1 A partial structural diagram of the transfer disk.

[0024] Figure 3 yes Figure 1 A schematic diagram of the structure of the silicon wafer clamping device and the testing device.

[0025] Figure 4 yes Figure 3 A three-dimensional view of a silicon wafer clamping device.

[0026] Figure 5 yes Figure 4 Enlarged view of point A in the middle.

[0027] Figure 6 yes Figure 4 A top view of the silicon wafer clamping device, with the cover and support components hidden.

[0028] Figure 7 This is a schematic diagram of the structure of the third robotic arm of a silicon wafer packaging equipment according to an embodiment of the present invention.

[0029] Figure 8 yes Figure 1 A partial structural diagram of the first feeding component.

[0030] Figure 9 yes Figure 1 A partial structural diagram of the first conveying component, the second conveying component, and the belt harness.

[0031] Figure label:

[0032] 100. Silicon wafer packaging equipment;

[0033] 1. Rack;

[0034] 2. Turntable; 21. Turntable body; 22. Supporting component; 23. Bearing component; 231. Bearing surface; 24. Stopping component; 241. Stopping surface; 25. Mounting base; 26. Fixing base; 27. Clearance opening;

[0035] 3. Third robotic arm; 31. Third mounting plate; 32. Third gripper; 321. First clamping part; 322. First supporting part; 33. First linear module; 34. First electric cylinder; 35. Third lifting base;

[0036] 4. First feeding assembly; 41. First feeding section; 411. First feeding plate; 412. First baffle; 4121. First air hole; 413. First air blowing device; 42. First movable seat;

[0037] 5. Second feeding assembly; 51. Second feeding section;

[0038] 6. First conveying assembly;

[0039] 7. Second conveying assembly;

[0040] 8. Silicon wafer clamping device; 81. Base; 811. Base plate; 812. Cover; 82. Support component; 821. Support surface; 83. Limiting component; 831. Limiting surface; 832. Fourth guide part; 833. Connecting plate; 834. Limiting plate; 8301. First limiting assembly; 8302. Second limiting assembly; 84. Limiting drive assembly; 841. Rotating component; 842. Telescopic component; 843. Connecting rod; 85. Connecting seat; 851. Third guide part; 852. Main seat body; 853. Support body;

[0041] 9. Translation guide rail;

[0042] 10. Strapping device;

[0043] 20. Detection device. Detailed Implementation

[0044] Embodiments of the present invention are described in detail below, with examples of the embodiments illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0045] like Figures 1 to 9As shown, the silicon wafer packaging equipment 100 of this embodiment includes a frame 1, a turntable 2, and a strapping device 10. The turntable 2 includes a turntable body 21 and a support assembly 22 disposed on the turntable body 21. The turntable body 21 is rotatably disposed on the frame 1 so that the support assembly 22 can switch between a first feeding position for placing a first protective layer, a silicon wafer feeding position for placing silicon wafers, and a second feeding position for placing a second protective layer. The strapping device 10 is disposed downstream of the turntable 2 and is used to strap the stacked assembly including the first protective layer, silicon wafers, and the second protective layer.

[0046] When the silicon wafer packaging equipment 100 of this embodiment of the invention is working, firstly, the first protective layer is placed on the support component 22 at the first feeding position; then, the turntable body 21 rotates, causing the support component 22 with the first protective layer to rotate to the silicon wafer feeding position, and placing the silicon wafer on the upper side of the first protective layer; then, the turntable body 21 rotates, causing the support component 22 with the first protective layer and the silicon wafer to rotate to the second feeding position, and placing the second protective layer on the upper side of the silicon wafer. At this time, the first protective layer, the silicon wafer and the second protective layer form a stacked assembly, and the silicon wafer is located between the first protective layer and the second protective layer. Then, the stacked assembly can be transferred to the strapping device 10, and the strapping device is used to tie the stacked assembly with straps, so that the stacked assembly forms a stable whole, avoiding misalignment of the silicon wafer when it is plastic-encapsulated, thereby effectively improving the yield of silicon wafers.

[0047] Therefore, the silicon wafer packaging equipment 100 of the present invention has the advantages of high silicon wafer yield.

[0048] Optionally, the turntable 2 also includes a turntable motor, which is mounted on the frame 1 and is connected to the turntable body 21 for transmission, thereby driving the turntable body 21 to rotate. The turntable motor can be a stepper motor.

[0049] Optionally, the first and second protective layers can be foam sheets, coated paperboard, or corrugated paper, etc.

[0050] In some embodiments, the support component 22 can also be switched to the wafer pick-up position when the turntable body 21 rotates.

[0051] When the support assembly 22 rotates to the second feeding position, the second protective layer is placed on the upper side of the silicon wafer, so that the first protective layer, the silicon wafer and the second protective layer form a stacked assembly; then, the support assembly 22 with the stacked assembly is rotated to the silicon wafer picking position, so that the stacked assembly is transferred to the strapping device 10 on the support assembly 22 at the silicon wafer picking position.

[0052] The silicon wafer packaging equipment 100 also includes a first robotic arm, a second robotic arm, a third robotic arm 3, and a fourth robotic arm. The first and second robotic arms are movably mounted on the frame 1. The first robotic arm has a first gripping part for gripping a first protective layer, and the second robotic arm has a second gripping part for gripping a second protective layer. The third robotic arm 3 and the fourth robotic arm are both movably mounted on the frame 1. The third robotic arm 3 has a third gripper 32 for gripping silicon wafers, and the fourth robotic arm has a fourth gripper for gripping stacked assemblies.

[0053] For example, when the support assembly 22 is in the first feeding position, the first robot arm grabs the first protective layer and places the first protective layer on the support assembly 22; when the support assembly 22 is in the silicon wafer feeding position, the third robot arm 3 grabs the silicon wafer and places the silicon wafer on the upper side of the first protective layer; when the support assembly 22 is in the second feeding position, the second robot arm grabs the second protective layer and places the second protective layer on the upper side of the silicon wafer; when the support assembly 22 is in the silicon wafer removal position, the fourth robot arm grabs the stacked assembly and removes the stacked assembly from the support assembly 22.

[0054] By setting up a first robotic arm, a second robotic arm, a third robotic arm, and a fourth robotic arm, the automation level of the silicon wafer packaging equipment 100 is further improved, which is conducive to further reducing the packaging cost of silicon wafers and improving the packaging efficiency of silicon wafers.

[0055] Optionally, the first robotic arm includes a first mounting plate and a first suction cup, the first suction cup being disposed on the first mounting plate and forming a first gripping part.

[0056] By using the first suction cup to grasp the first protective layer, it is easy to keep the first protective layer in a flat state, which helps to further improve the packaging efficiency of silicon wafers.

[0057] Optionally, the first robotic arm includes a first lifting base and a first robotic arm. The first robotic arm is movably suspended on the frame 1 via the first lifting base, and a first mounting plate is connected to the first robotic arm. The first robotic arm is a telescopic arm.

[0058] For example, before grasping the first protective layer, the first robotic arm shortens to avoid other components on the frame 1; then, the first lifting seat moves the first suction cup, and after the first suction cup reaches above the first protective layer, the first robotic arm extends to grasp the first protective layer; then, the first robotic arm shortens to avoid other components on the frame 1; finally, the first lifting seat moves the first suction cup, and after the first suction cup reaches above the first discharge position, the first robotic arm extends and places the first protective layer on the support assembly 22 located at the first discharge position.

[0059] Optionally, the second robotic arm includes a second mounting plate and a second suction cup, the second suction cup being disposed on the second mounting plate and forming a second gripping part.

[0060] By using a second suction cup to grip the second protective layer, it is easier to keep the second protective layer in a flat state, which helps to further improve the packaging efficiency of silicon wafers.

[0061] Optionally, the second robotic arm includes a second lifting base and a second robotic arm. The second robotic arm is movably suspended on the frame 1 via the second lifting base, and a second mounting plate is connected to the second robotic arm. The second robotic arm is a telescopic arm.

[0062] For example, before grabbing the second protective layer, the second robotic arm shortens to avoid other components on the frame 1; then, the second lifting seat moves the second suction cup, and after the second suction cup reaches above the second protective layer, the second robotic arm extends to grab the second protective layer; then, the second robotic arm shortens to avoid other components on the frame 1; finally, the second lifting seat moves the second suction cup, and after the second suction cup reaches above the second discharge position, the second robotic arm extends and places the second protective layer on the support assembly 22 located at the second discharge position.

[0063] Optionally, such as Figure 7 As shown, the third robotic arm 3 includes a third mounting plate 31 and a plurality of third grippers 32. The plurality of third grippers 32 are movably disposed on the third mounting plate 31. The third grippers 32 include a first clamping part 321 for clamping the silicon wafer and a first supporting part 322 for supporting the silicon wafer.

[0064] For example, the first clamping part 321 is a vertical plate, and the first supporting part 322 is a flat plate. When the third jaw 32 clamps the silicon wafer, the first clamping parts 321 of the multiple third jaws 32 cooperate to clamp the silicon wafer, and the first supporting parts 322 of the multiple third jaws 32 support the bottom of the silicon wafer. The vertical plate is L-shaped, and the corner of the vertical plate has notches.

[0065] This effectively prevents silicon wafers from slipping off the third robotic arm 3, and the notch on the upright plate can prevent the upright plate from pinching the corners of the silicon wafers, improving the safety of the silicon wafer transfer process and helping to further improve the yield of packaged silicon wafers.

[0066] Optionally, such as Figure 7 As shown, a first linear module 33 is provided between the third mounting plate 31 and the third gripper 32. The first linear module 33 is used to drive the third gripper 32 to move relative to the third mounting plate 31.

[0067] Optionally, such as Figure 7 As shown, the third robotic arm 3 includes a third lifting base 35 and a third robotic arm. The third robotic arm is movably suspended on the frame 1 via the third lifting base 35, and the third mounting plate 31 is connected to the third robotic arm. The third robotic arm is a telescopic arm.

[0068] For example, before gripping the silicon wafer, the third robotic arm shortens to avoid other components on the rack 1; then, the third lifting seat 35 moves the third gripper 32, and after the third gripper 32 reaches above the silicon wafer, the third robotic arm extends to grip the silicon wafer; then, the third robotic arm shortens to avoid other components on the rack 1; finally, the third lifting seat 35 moves the third gripper 32, and after the third gripper 32 reaches above the silicon wafer placement position, the third robotic arm extends and places the silicon wafer on the support assembly 22 located at the silicon wafer placement position.

[0069] Optionally, such as Figure 7 As shown, the third robotic arm is the first electric cylinder 34.

[0070] Optionally, the fourth robotic arm includes a fourth mounting plate and a plurality of fourth grippers, the plurality of fourth grippers being movably disposed on the fourth mounting plate, the fourth grippers including a second clamping portion for clamping the silicon wafer and a second supporting portion for supporting the silicon wafer.

[0071] For example, the second clamping part is a vertical plate, and the second supporting part is a flat plate. When the fourth jaws clamp the silicon wafer, the second clamping parts of the multiple fourth jaws cooperate to clamp the silicon wafer tightly, and the second supporting parts of the multiple fourth jaws support the bottom of the silicon wafer. The vertical plate is L-shaped, and its corners have notches.

[0072] This effectively prevents silicon wafers from slipping off the fourth robotic arm, and the notch on the upright plate can prevent the upright plate from pinching the corners of the silicon wafers, improving the safety of the silicon wafer transfer process and helping to further improve the yield of packaged silicon wafers.

[0073] Optionally, a second linear module is provided between the fourth mounting plate and the fourth gripper, the second linear module being used to drive the fourth gripper to move relative to the fourth mounting plate.

[0074] Optionally, the fourth robotic arm includes a fourth lifting base and a fourth robotic arm. The fourth robotic arm is movably suspended on the frame 1 via the fourth lifting base, and a fourth mounting plate is connected to the fourth robotic arm. The fourth robotic arm is a telescopic arm.

[0075] For example, before gripping the silicon wafer, the fourth robotic arm shortens to avoid other components on the rack 1; then, the fourth lifting seat moves the fourth gripper, and after the fourth gripper reaches above the stacked assembly, the fourth robotic arm extends to grip the stacked assembly; then, the fourth robotic arm shortens to avoid other components on the rack 1; finally, the fourth lifting seat moves the fourth gripper, and after the fourth gripper reaches above the silicon wafer pick-up position, the fourth robotic arm extends and places the stacked assembly on the support assembly 22 located at the silicon wafer pick-up position.

[0076] Optionally, the fourth robotic arm is the second electric cylinder.

[0077] In some embodiments, such as Figure 2 As shown, the support assembly 22 includes a carrier 23 and a plurality of stops 24. The carrier 23 is disposed on a turntable and has a bearing surface 231 for bearing silicon wafers. The plurality of stops 24 are spaced apart circumferentially along the carrier 23, and each stop 24 has a stopping surface 241 facing the carrier 23. The plurality of stops 24 and the carrier 23 form a cavity for placing silicon wafers. The stops 24 are movably disposed on the turntable so that they can move between a centered position holding the silicon wafer and a removable position releasing the silicon wafer, and so that the cavity can accommodate silicon wafers of different sizes.

[0078] In this configuration, the stopping surfaces 241 of the multiple stoppers 24 in the aligned position abut against the side of the silicon wafer; the stopping surfaces 241 of the multiple stoppers 24 in the removed position are all away from the silicon wafer, so that the silicon wafer can be placed in the support assembly 22 in the silicon wafer placement position or the stacked assembly can be removed from the support assembly 22.

[0079] For example, a rectangular silicon wafer, such as Figure 2 As shown, the carrier 23 is a rectangular plate, and there are four stops 24, which are respectively disposed on different sides of the carrier 23. The carrier 23 and the four stops 24 form a cavity with a rectangular cross-section. By adjusting the distance between the stops 24 and the carrier 23, the size of the cavity cross-section can be adjusted, thereby allowing the cavity to accommodate silicon wafers of different sizes. The size matching between the cavity and the silicon wafer can be understood as follows: when the silicon wafer is placed on the bearing surface 231 of the carrier 23, the stopping surfaces 241 of the four stops 24 are in contact with the four sides of the silicon wafer, respectively.

[0080] Therefore, the support component 22 can be adapted to silicon wafers of different sizes, enabling the silicon wafer packaging equipment 100 to be used for packaging silicon wafers of different sizes, thus improving the versatility of the silicon wafer packaging equipment 100.

[0081] Optionally, the supporting component 22 includes two stop components arranged opposite each other along a preset direction, and each stop component includes at least one stop member 24. The bearing surface 231 is rectangular, and the two stop components are arranged at intervals along the long side of the bearing surface 231, forming a clearance opening 27 between the two stop components for avoiding the third or fourth gripper.

[0082] For example, such as Figure 2 As shown, there are four stop members 24, which are divided into two stop assemblies, namely the first stop assembly and the second stop assembly. The first stop assembly and the second stop assembly are arranged at intervals along the long side of the bearing surface 231, and a clearance opening 27 is formed between the first stop assembly and the second stop assembly to avoid the third or fourth gripper.

[0083] This provides a larger gripping space for the third and fourth grippers, making it easier for the third robotic arm to place the silicon wafer on the support assembly 22, and for the fourth robotic arm to remove the stacked assembly from the support assembly 22.

[0084] To make the technical solution of this application easier to understand, the following example illustrates the technical solution of this application by arranging two of the stop members 24 in the same direction as the front-back direction, and the other two stop members 24 in the same direction as the left-right direction. The front-back direction is as follows: Figure 2 As shown.

[0085] For example, such as Figure 2 As shown, each stop assembly includes two stop members 24, wherein two stop members 24 are arranged opposite each other in the front-to-back direction, and the other two stop members 24 are arranged opposite each other in the left-to-right direction. The two stop members 24 located on the front and right sides form a first stop assembly, and the two stop members 24 located on the rear and left sides form a second stop assembly.

[0086] like Figure 2 As shown, the support assembly 2 also includes a mounting base 25 and a fixed base 26. The fixed base 26 is fixedly connected to the turntable body 21, and the mounting base 25 is movably connected to the fixed base 26, thereby driving the stop member 24 to move through the mounting base 25.

[0087] Optionally, two stop members 24 within the same stop assembly are connected to the same mounting base 25, which is movably connected to a fixed base 26. This allows the same mounting base 25 to drive the two stop members 24 within the same stop assembly to move synchronously.

[0088] For example, one of the two mounting seats 25 is located on the left front side of the other mounting seat 25, the stop 24 located on the front and left sides is connected to the mounting seat 25 located on the left front side, and the stop 24 located on the rear and right sides is connected to the mounting seat 25 located on the right rear side.

[0089] Optionally, the turntable 2 further includes a stop drive assembly, which includes a rotating component, a drive cylinder, and two mounting rods. The rotating component is rotatably connected to the fixed base 26. The two ends of the drive cylinder are hinged to the fixed base 26 and the rotating component, respectively. One end of each of the two mounting rods is hinged to the rotating component, and the other end of each mounting rod is hinged to one of the two mounting bases 25, respectively.

[0090] For example, when the drive cylinder extends, the drive cylinder drives the rotating component to rotate around its rotation axis. The rotating component drives the two mounting rods to swing, and the two mounting rods drive the two mounting seats 25 to move respectively. Each mounting seat 25 drives the two stop components 24 to move respectively.

[0091] In some embodiments, the silicon wafer packaging equipment 100 further includes a silicon wafer clamping device 8, which is located upstream of the turntable 2. The silicon wafer clamping device 8 includes a base 81, a support member 82, and a plurality of limiting members 83. The base 81 is mounted on the frame 1. The support member 82 is mounted on the base 81 and has a support surface 821 for supporting the silicon wafer. The plurality of limiting members 83 are spaced apart circumferentially along the support member 82. Each limiting member 83 has a limiting surface 831 facing the support member 82. The limiting members 83 are movable between a clamping position and a releasing position, and are movably connected to the base 81 in a direction perpendicular to the support surface 821. Specifically, in the clamping position, the limiting surfaces 831 of the plurality of limiting members 83 abut against the side of the silicon wafer; in the releasing position, the limiting surfaces 831 of the plurality of limiting members 83 are away from the silicon wafer.

[0092] In use, the silicon wafer packaging equipment 100 of the present invention first places the silicon wafer on the support surface 821 of the support member 82; then, the limiting member 83 moves to the clamping position, and the limiting surfaces 831 of the multiple limiting members 83 abut against the side of the silicon wafer, thereby aligning the silicon wafer on the silicon wafer clamping device 8 and ensuring that the state of the silicon wafers placed on the silicon wafer clamping device 8 remains consistent. Afterwards, the limiting member 83 moves towards the side of the support surface 821 to prevent the limiting member 83 from obstructing the side of the silicon wafer. At this time, a robotic arm can be used to remove the silicon wafer from the silicon wafer clamping device 8 and place it on the support assembly 22 located at the silicon wafer placement position.

[0093] Therefore, the silicon wafers can be aligned before the robotic arm removes them, avoiding damage to the silicon wafers caused by accidental contact during the removal process, thus improving the reliability of the silicon wafer packaging equipment 100.

[0094] Optionally, the base 81 is movably mounted on the frame 1 to allow the silicon wafer clamping device 8 to switch between an initial position and a detection position. The base 81 is rotatably connected to the frame 1. The silicon wafer packaging equipment 100 also includes a detection device 20, which is mounted on the frame 1 and positioned close to the detection position to detect the silicon wafers at that position. The detection device 20 may be a camera.

[0095] In practical use, taking a polygonal silicon wafer as an example, the silicon wafer clamping device 8 is in its initial position. The silicon wafer is placed on the silicon wafer clamping device 8 and aligned using the silicon wafer clamping device 8. Then, the limiting member 83 moves towards the side of the supporting surface 821 to prevent the limiting member 83 from obstructing the side of the silicon wafer. The silicon wafer clamping device 8 is then moved to the detection position. At this time, the detection device 20 is facing one corner of the silicon wafer, and the detection device 20 is used to detect the corner of the silicon wafer. After that, the silicon wafer clamping device 8 is moved back to its initial position, rotated by a first preset angle, and moved to the detection position. At this time, the detection device 20 is facing another corner of the silicon wafer, and the detection device 20 is used to detect this corner of the silicon wafer. The above steps are repeated to complete the detection of each corner of the silicon wafer. Next, the silicon wafer clamping device 8 moves to the initial position, rotates the silicon wafer clamping device 8 by the second preset angle, and moves the silicon wafer clamping device 8 to the detection position. At this time, the detection device 20 is facing one edge of the silicon wafer, and the detection device 20 is used to detect that edge of the silicon wafer. Repeat the above steps to complete the detection of each edge of the silicon wafer.

[0096] When a defect is detected in the silicon wafer, the silicon wafer clamping device 8 moves to the initial position and transfers the silicon wafer into the waste box; when the silicon wafer is found to be qualified, the robot arm removes the silicon wafer in the detection position and places it on the support assembly 22 in the silicon wafer placement position.

[0097] On the one hand, before inspecting the silicon wafers, the silicon wafer clamping device 8 can be used to straighten the silicon wafers, thereby enabling automated inspection of the silicon wafers using the inspection device 20, further improving the packaging efficiency of the silicon wafers and reducing the packaging cost of the silicon wafers; on the other hand, inspecting the silicon wafers before they enter the turntable 2 can effectively improve the yield of the packaged silicon wafers.

[0098] Optionally, there may be multiple detection devices 20, which are respectively arranged on different sides of the silicon wafer clamping device 8.

[0099] For example, such as Figure 1 and Figure 3 As shown, there are two detection devices 20. When the silicon wafer is in the detection position, the two detection devices 20 can simultaneously detect different parts of the silicon wafer.

[0100] Taking a rectangular silicon wafer as an example, firstly, the silicon wafer clamping device 8 rotates 45° and moves to the detection position, using two detection devices 20 to detect two corners of the silicon wafer respectively; then, the silicon wafer clamping device 8 rotates 90° and moves to the detection position, using two detection devices 20 to detect the other two corners of the silicon wafer respectively; after that, the silicon wafer clamping device 8 rotates 45° again and moves to the detection position, using two detection devices 20 to detect two sides of the silicon wafer respectively; finally, the silicon wafer clamping device 8 rotates 90° again and moves to the detection position, using two detection devices 20 to detect the other two sides of the silicon wafer respectively.

[0101] By setting up multiple detection devices 20, the detection efficiency of silicon wafers can be improved, which in turn improves the packaging efficiency of silicon wafers.

[0102] To make the technical solution of this application easier to understand, the following description further illustrates the technical solution of this application by taking the arrangement direction of the silicon wafer clamping device 8, the turntable 2, and the tape-gluing device 10 as being consistent with the front-back direction. Wherein, the front-back direction is as follows... Figures 1 to 9 As shown.

[0103] For example, such as Figure 1 and Figure 3 As shown, the silicon wafer clamping device 8 is located in front of the turntable 2, and the turntable 2 is located in front of the strapping device 10. The base 81 is movably mounted on the frame 1 in the front-back direction. When the base 81 moves backward, it can switch from the initial position to the detection position; when the base 81 moves forward, it can switch from the detection position to the initial position.

[0104] Optionally, such as Figure 1 and Figure 3 As shown, the frame 1 is provided with a translation guide rail 9 extending in the front-to-back direction, and the base 81 is provided with a guide block, which is movable in the front-to-back direction and cooperates with the translation guide rail 9.

[0105] Therefore, when the base 81 switches between the initial position and the detection position, the cooperation between the guide block and the translation guide rail 9 can guide the movement of the base 81, prevent the base 81 from deviating from the preset path, and help improve the reliability of the silicon wafer packaging equipment 100.

[0106] Optionally, a rotating assembly is provided between the base 81 and the frame 1. The rotating assembly includes a rotary seat, a drive motor, a driving pulley, a driven pulley, and a transmission belt. The rotary seat is movably connected to the frame 1, and the base 81 is rotatably connected to the rotary seat. The drive motor is mounted on the rotary seat and is connected to the driving pulley for transmission. Both the driving pulley and the driven pulley are rotatably mounted on the rotary seat. The driven pulley is fixedly connected to the base 81, and the transmission belt is wound around the driving pulley and the driven pulley.

[0107] The swivel base moves relative to the swivel base, causing the silicon wafer clamping device 8 to move between the initial position and the detection position. The drive motor drives the drive pulley to rotate, and the drive pulley drives the driven pulley to rotate through the transmission belt. The driven pulley drives the base 81 to rotate relative to the swivel base, thereby causing the silicon wafer clamping device 8 to rotate.

[0108] In some embodiments, such as Figures 4 to 6 As shown, the base 81 includes a base 811 and a cover 812. The cover 812 is connected to the base 811, and a cavity is formed between the cover 812 and the base 811. The limit drive assembly 84 is disposed inside the cavity, while the support member 82 and multiple limit members 83 are disposed outside the cavity.

[0109] By placing the limit drive assembly 84 within the cavity formed by the cover 812 and the base 811, the cavity wall can be used to protect the limit drive assembly 84, thereby improving the safety of the limit drive assembly 84.

[0110] Optionally, the base 811 and the cover 812 are welded, bonded, or connected by fasteners, which may be bolts, screws, rivets, etc.

[0111] For example, the base 811 is located at the lower part of the cover 812, the limiting drive assembly 84 is located on the upper side of the base 811 and on the lower side of the cover 812, and the support member 82 and the limiting member 83 are both located on the upper side of the cover 812. The upper surface of the support member 82 forms a support surface 821.

[0112] In some embodiments, such as Figure 6 As shown, the limit drive assembly 84 includes a rotating member 841, a telescopic member 842, and a plurality of connecting rods 843. The rotating member 841 is rotatably connected to the base 81. The two ends of the telescopic member 842 are hinged to the base 81 and the rotating member 841, respectively. The two ends of each connecting rod 843 are connected to the rotating member 841 and the limit member 83, respectively, so as to drive the plurality of limit members 83 to move between a clamping position and a releasing position when the telescopic member 842 extends or retracts.

[0113] For example, such as Figure 6As shown, the rotating member 841 is rotatably connected to the base 811. The two ends of the telescopic member 842 are hinged to the base 811 and the rotating member 841, respectively. When the telescopic member 842 extends, it drives the rotating member 841 to rotate counterclockwise around its axis of rotation. The rotating member 841 causes the connecting rod 843 to swing, and the connecting rod 843 causes the limiting member 83 to move away from the support member 82, thus moving the limiting member 83 from the clamping position to the released position. When the telescopic member 842 retracts, it drives the rotating member 841 to rotate clockwise around its axis of rotation. The rotating member 841 causes the connecting rod 843 to swing, and the connecting rod 843 causes the limiting member 83 to move closer to the support member 82, thus moving the limiting member 83 from the released position to the clamping position.

[0114] Therefore, the limit drive component 84 can synchronously drive multiple limit components 83 to move between the clamping position and the releasing position. On the one hand, this is beneficial to improve the alignment efficiency of the silicon wafer clamping device 8 for the silicon wafer, and thus improve the detection efficiency of the silicon wafer. On the other hand, it is beneficial to reduce the number of limit drive components 84, thereby simplifying the overall structure of the silicon wafer clamping device 8 and reducing the cost of the silicon wafer clamping device 8.

[0115] Optionally, the rotating component 841 is connected to the base 811 via a bearing.

[0116] Optionally, the telescopic member 842 is connected to the base 81 and the rotating member 841 by a pin.

[0117] Optionally, the connecting rod 843 is connected to the rotating member 841 and the limiting member 83 by means of a pin.

[0118] Optionally, the silicon wafer clamping device 100 includes two limiting components, each including two limiting members 83, which are arranged opposite to each other along a first direction. One limiting member 83 in one limiting component is arranged opposite to one limiting member 83 in the other limiting component, and the other limiting member 83 in one limiting component is arranged opposite to the other limiting member 83 in the other limiting component.

[0119] For example, such as Figure 4 and Figure 6 As shown, there are four limiting members 83, which together form two limiting components. The two limiting components are the first limiting component 8301 and the second limiting component 8302.

[0120] For example, such as Figure 3 As shown, the first limiting component 8301 is disposed on the left front side of the second limiting component 8302, that is, among the four limiting members 83, two of which are arranged opposite each other in the front-back direction, and the other two are arranged opposite each other in the left-right direction.

[0121] In some embodiments, such as Figure 4 and Figure 6 As shown, the silicon wafer clamping device 8 also includes two connecting seats 85 arranged opposite each other along a first direction. The connecting seats 85 are movably connected to the base 81, and the limiting drive assembly 84 is connected to the connecting seats 85. There are two connecting rods 843, one end of which is hinged to the two connecting seats 85 respectively. In one limiting assembly, the two limiting members 83 are fixedly connected to one of the connecting seats 5, and in the other limiting assembly, the two limiting members 83 are fixedly connected to the other connecting seat 5. The limiting drive assembly 84 drives the limiting members 83 to move between the clamping position and the releasing position through the connecting seats 85.

[0122] Specifically, when the telescopic member 842 extends or retracts, the telescopic member 842 drives the rotating member 841 to rotate around its rotation axis. The rotating member 841 drives the connecting rod 843 to swing. The connecting rod 843 drives the connecting seat 85 to move. The connecting seat 85 drives the limiting member 83 connected to it to move between the clamping position and the releasing position.

[0123] For example, such as Figure 6 As shown, the angle between the first direction and both the front-back and left-right directions is 45°. There are two connecting seats 85 and two connecting rods 843. One connecting seat 85 is located on the left front side of the other connecting seat 85. The connecting seat 85 on the left front side is the first connecting seat, and the connecting seat 85 on the right rear side is the second connecting seat. The two limiting members 83 in the first limiting assembly 8301 are connected to the first connecting seat, and the two limiting members 83 in the second limiting assembly 8302 are connected to the second connecting seat. One connecting rod 843 is located on the front side of the other connecting rod 843. The connecting rod 843 on the front side is the first connecting rod, and the connecting rod 843 on the rear side is the second connecting rod. The first connecting rod is hinged to the first connecting seat, and the second connecting rod is hinged to the second connecting seat. Therefore, when the telescopic member 842 extends or retracts, the telescopic member 842 drives the rotating member 841 to rotate around its rotation axis. The rotating member 841 drives the first connecting rod and the second connecting rod to swing. The first connecting rod drives the first connecting seat to move. The first connecting seat drives the two limiting members 83 in the first limiting assembly 8301 to move. At the same time, the second connecting rod drives the second connecting seat to move. The second connecting seat drives the two limiting members 83 in the second limiting assembly 8302 to move.

[0124] This helps to further simplify the overall structure of the silicon wafer clamping device 8 and reduce its cost.

[0125] Of course, in other embodiments, the number of connecting rods 843 and limiting members 83 may also be equal, and multiple connecting rods 843 correspond one-to-one with multiple limiting members 83, with each connecting rod 843 hinged to the corresponding limiting member 83.

[0126] Optionally, the telescopic component 842 is a telescopic cylinder.

[0127] By setting the telescopic component 842 as a telescopic cylinder, it is beneficial to reduce the cost of the limit drive assembly 84, thereby further reducing the cost of the silicon wafer clamping device 8.

[0128] Of course, in other embodiments, the telescopic member 842 may also be configured as an electric push rod.

[0129] Optionally, such as Figure 2 As shown, the connecting seat 85 includes a main seat body 852 and two support bodies 853. One end of the connecting rod 843 is rotatably connected to the main seat body 852. The two support bodies 853 are spaced apart and both are connected to the main seat body 852. Two limiting members 83 in the same limiting assembly correspond one-to-one with the two support bodies 853, and the limiting members 83 are connected to the corresponding support bodies 853.

[0130] When connecting the connecting seat 85 to the limiting drive assembly 84 and the limiting member 83, it is only necessary to connect the connecting rod 843 of the limiting drive assembly 84 to the main body 852 and the limiting member 83 to the corresponding support body 853. This effectively avoids interference between the limiting drive assembly 84 and the limiting member 83, which helps improve the assembly efficiency of the silicon wafer clamping device 8 and reduces its assembly cost.

[0131] To make the technical solution of this application easier to understand, the following example illustrates the technical solution of this application by using four limiting members 83, with two of the limiting members 83 arranged in the same direction as the front-back direction and the other two in the same direction as the left-right direction. The left-right direction is as follows... Figures 4 to 6 As shown.

[0132] For example, such as Figure 5 and Figure 6 As shown, two limiting members 83 are arranged opposite each other in the front-to-back direction, and the other two limiting members 83 are arranged opposite each other in the left-to-right direction. The two limiting members 83 located on the front and left sides form a limiting assembly, and the two limiting members 83 located on the rear and right sides form another limiting assembly. One of the two support bodies 853 is located on the left front side of the other support body 853. In the limiting assembly and the corresponding connecting seat 85, the limiting members 83 located on the left and front sides are connected to the support body 853 located on the left front side, and the limiting members 83 located on the right and rear sides are connected to the support body 853 located on the right rear side.

[0133] Optionally, the base 81 is provided with a first guide portion extending in a first direction, and the connecting seat 85 is provided with a second guide portion, the second guide portion being movably guided and engaged with the first guide portion.

[0134] For example, the base 81 is provided with a first guide part, the extension direction of the first guide part is at 45° with the front-back direction and the left-right direction, and the second guide part is movable and guides the first guide part along the extension direction of the first guide part.

[0135] Therefore, when the connecting seat 85 moves relative to the base 81 in the first direction, the second guide part can be used to guide and cooperate with the first guide part to limit the movement of the connecting seat 85 from the preset path, which is beneficial to improving the reliability of the silicon wafer clamping device 8.

[0136] Optionally, the base 81 is provided with a first slide rail extending along a first direction, and the connecting seat 85 is provided with a first slider. The first slider has a first groove, which is movably guided and engaged with the first slide rail along the first direction. The first slide rail forms a first guide portion, and the first slider forms a second guide portion.

[0137] Optionally, the first slide rail is welded, bonded, or connected to the base 81 by fasteners, wherein the fasteners may be bolts, screws, rivets, etc.

[0138] Optionally, the first slider is welded, bonded, or connected to the connecting seat 85 by fasteners, wherein the fasteners may be bolts, screws, rivets, etc.

[0139] In some embodiments, the limiting member 83 is movably connected to the connecting seat 85 along a second direction. The silicon wafer clamping device 8 also includes a driving member disposed on the connecting seat 85 and connected to the limiting member 83 to drive the limiting member 83 to move along a second direction perpendicular to the support surface 821.

[0140] For example, such as Figure 4 and Figure 5 As shown, the second direction is consistent with the up-down direction. The limiting member 83 is movably connected to the connecting seat 85 in the up-down direction, and the driving member drives the limiting member 83 to move in the up-down direction.

[0141] Optionally, the connecting seat 85 is provided with a third guide portion 851 extending along the second direction, and the limiting member 83 is provided with a fourth guide portion 832. The fourth guide portion 832 is movably guided and engaged with the third guide portion 851 along the second direction. The second direction is perpendicular to the support surface 821.

[0142] For example, such as Figure 5 As shown, the connecting seat 85 is provided with a third guide portion 851 extending in the vertical direction, and a fourth guide portion 832 is movably guided and engaged with the third guide portion 851 in the vertical direction.

[0143] Therefore, when the limiting member 83 moves relative to the connecting seat 85 in the second direction, the fourth guide part 832 and the third guide part 851 can be used to guide and cooperate, limiting the movement of the limiting member 83 from the preset path, which is beneficial to improving the reliability of the silicon wafer clamping device 8.

[0144] Optionally, such as Figure 5 As shown, the connecting seat 85 is provided with a second slide rail extending in a second direction, and the limiting member 83 is provided with a second slider. The second slider has a second slide groove, which is movably guided and engaged with the second slide rail in the second direction. The second slide rail forms a third guide portion 851, and the second slider forms a fourth guide portion 832.

[0145] Optionally, the second slide rail is welded, bonded, or connected to the connecting seat 85 by fasteners, wherein the fasteners may be bolts, screws, rivets, etc.

[0146] Optionally, the second slider is welded, bonded, or connected to the limiting member 83 by a fastener, wherein the fastener may be a bolt, screw, rivet, etc.

[0147] Optionally, the driving component is a driving cylinder.

[0148] By setting the driving component as a driving cylinder, it is beneficial to reduce the cost of the driving component, which in turn helps to further reduce the cost of the silicon wafer clamping device 8.

[0149] Of course, in other embodiments, the drive element may also be an electric actuator.

[0150] Optionally, such as Figure 5 As shown, the fourth guide part 832 is provided on the connecting plate 833.

[0151] Optionally, the connecting plate 833 and the limiting plate 834 are connected by fasteners, which can be screws.

[0152] For example, the limiting plate 834 has a countersunk hole, the connecting plate 833 has a threaded hole, and the screw is inserted into the countersunk hole and threadedly connected to the threaded hole.

[0153] Optionally, such as Figure 1 and Figure 8As shown, the silicon wafer packaging equipment 100 also includes a first feeding assembly 4 and a second feeding assembly 5. The first feeding assembly 4 has at least one first feeding section 41 for storing a first protective layer. The first feeding assembly 4 is movably mounted on the frame 1 and located on one side of the turntable 2, so that the first feeding section 41 can switch between a first working position near the first discharge position and a first clearance position away from the first discharge position. The second feeding assembly 5 has at least one second feeding section 51 for storing a second protective layer. The second feeding assembly 5 is movably mounted on the frame 1 and located on the other side of the turntable 2, so that the second feeding section 51 can switch between a second working position near the second discharge position and a second clearance position away from the second discharge position. A first robotic arm moves between the first working position and the first discharge position, and a second robotic arm moves between the second working position and the second discharge position.

[0154] When the first feeding section 41 is in the first working position, the first robotic arm can be used to grab the first protective layer on the first feeding section 41. When the first feeding section 41 is in the first clearance position, the first protective layer can be added into the first feeding section 41. When the second feeding section 51 is in the second working position, the second robotic arm can be used to grab the second protective layer on the second feeding section 51. When the second feeding section 51 is in the second clearance position, the second protective layer can be added into the second feeding section 51.

[0155] This facilitates the addition of a first protective layer and a second protective layer to the first feeding section 41 and the second feeding section 51, respectively.

[0156] To make the technical solution of this application easier to understand, the following example illustrates the technical solution of this application by taking the arrangement direction of the first feeding component 4 and the second feeding component 5 as being consistent with the left and right directions, and the arrangement direction of the first working position and the first unloading position as being consistent with the front and back directions.

[0157] Optionally, there are multiple first feeding sections 41, such that when a portion of the first feeding sections 41 are in the first discharge position, another portion of the first feeding sections 41 are in the first clearance position. There are multiple second feeding sections 51, such that when a portion of the second feeding sections 51 are in the second discharge position, another portion of the second feeding sections 51 are in the second clearance position.

[0158] For example, such as Figure 1 and Figure 8As shown, the first feeding assembly 4 is located to the right of the second feeding assembly 5. There are two first feeding sections 41 and two second feeding sections 51, with the two first feeding sections 41 spaced apart in the front-to-back direction, and the two second feeding sections 51 also spaced apart in the front-to-back direction. By moving the first feeding assembly 4 in the front-to-back direction, when the first feeding section 41 located at the front is in the first working position, the first feeding section 41 located at the rear is in the first clearance position; and when the first feeding section 41 located at the front is in the first clearance position, the first feeding section 41 located at the rear is in the first working position. By moving the second feeding assembly 5 in the front-to-back direction, when the second feeding section 51 located at the front is in the second working position, the second feeding section 51 located at the rear is in the second clearance position; and when the second feeding section 51 located at the front is in the second clearance position, the second feeding section 51 located at the rear is in the second working position. The first robotic arm can only grab the first protective layer from the first feeding section 41 located at the first working position, and the second robotic arm can only grab the second protective layer from the second feeding section 51 located at the second working position.

[0159] Therefore, when one of the first feeding sections 41 is in the first working position, a first protective layer can be added to the first feeding section 41 in the first clearance position as a spare. When the first protective layer on the first feeding section 41 in the first working position is used up, the first feeding section 41 in the first clearance position can be moved to the first working position so that the first robotic arm can grasp the first protective layer therein; at the same time, the first feeding section 41 in the first working position is moved to the first clearance position to add a first protective layer for spare. Similarly, when one of the second feeding sections 51 is in the second working position, a second protective layer can be added to the second feeding section 51 in the second clearance position as a spare. When the second protective layer on the second feeding section 51 in the second working position is used up, the second feeding section 51 in the second clearance position can be moved to the second working position so that the second robotic arm can grasp the second protective layer therein; at the same time, the second feeding section 51 in the second working position is moved to the second clearance position to add a second protective layer for spare. This avoids affecting the packaging efficiency of silicon wafers due to the inability to replenish the first and second protective layers in a timely manner, thus further improving the packaging efficiency of silicon wafers.

[0160] Optionally, such as Figure 8 As shown, the first feeding section 41 includes a first feeding plate 411, at least a first baffle 412, and at least one first air blowing device 413. The first baffle 412 and the first feeding plate 411 form a first receiving cavity for accommodating the first protective layer. At least one first baffle 412 is provided with a first air hole 4121 facing the first receiving cavity, and the first air blowing device 413 communicates with the first air hole 4121.

[0161] At least one first baffle 412 is provided with a first air hole 4121 facing the first receiving cavity. This can be understood as: a portion of the first baffle 412 is provided with the first air hole 4121, while another portion of the first baffle 412 is not provided with the first air hole 4121; or, each first baffle 412 is provided with the first air hole 4121.

[0162] It is understandable that when the first suction cup is used to grab the first protective layer, adjacent protective layers may be attracted together due to the negative pressure of the first suction cup, resulting in the first suction cup grabbing multiple first protective layers at the same time, thus wasting the first protective layer.

[0163] By providing a first air hole 4121 facing the first receiving cavity on the first baffle 412, and having the first air blowing device 413 connected to the first air hole 4121, the first air blowing device 413 can blow air between adjacent first protective layers through the first air hole 4121. The adjacent first protective layers separate under the action of the gas, thereby preventing the first suction cup from grabbing multiple first protective layers at the same time and avoiding waste of the first protective layers.

[0164] Optionally, the second feeding section 51 includes a second feeding plate, at least one second baffle, and at least one second air blowing device, with the second baffle and the second feeding plate forming a second receiving cavity for accommodating the second protective layer. At least one second baffle has a second air hole facing the second receiving cavity, and the second air blowing device communicates with the second air hole.

[0165] At least one second baffle is provided with a second vent facing the second receiving cavity. This can be understood as: a portion of the second baffles are provided with a second vent, while the other portion of the second baffles are not provided with a second vent; or, each second baffle is provided with a second vent.

[0166] It is understandable that when the second suction cup is used to grab the second protective layer, adjacent protective layers may be attracted together due to the negative pressure of the second suction cup, resulting in the second suction cup grabbing multiple second protective layers at the same time, thus wasting the second protective layer.

[0167] By providing a second air hole facing the second receiving cavity on the second baffle, and having the second air blowing device connected to the second air hole, the second air blowing device can blow air between adjacent second protective layers through the second air hole. The adjacent second protective layers separate under the action of the gas, thereby preventing the second suction cup from grabbing multiple second protective layers at the same time and avoiding waste of the second protective layers.

[0168] Optionally, the first feeding position of the first feeding assembly 4 is arranged to the right of the first discharging position, and the first robotic arm moves in the left-right direction, so that the first robotic arm moves between the first feeding position and the first discharging position of the first feeding assembly 4. The second feeding position of the second feeding assembly 5 is arranged to the left of the second discharging position, and the second robotic arm moves in the left-right direction, so that the second robotic arm moves between the second feeding position and the second discharging position of the second feeding assembly 5.

[0169] Optionally, such as Figure 8 As shown, the first feeding assembly 4 includes a first movable seat 42, and a plurality of first feeding parts 41 are all disposed on the first movable seat 42. The frame 1 is provided with a first linear guide rail extending along the moving direction of the first feeding assembly 4. The first movable seat 42 is provided with a first guide block, and the first guide block is movably engaged with the first linear guide rail in the front-back direction.

[0170] Optionally, a first drive motor is provided on the frame 1. The first drive motor is connected to the first movable seat 42 for transmission. The first drive motor is used to drive the first movable seat 42 to move relative to the frame 1, thereby causing the first feeding component 4 to move relative to the frame 1.

[0171] Optionally, the second feeding assembly 5 includes a second movable seat, and a plurality of second feeding parts 51 are disposed on the second movable seat. The frame 1 is provided with a second linear guide rail extending along the moving direction of the second feeding assembly 5. The second movable seat is provided with a second guide block, and the second guide block is movably engaged with the second linear guide rail in the front-back direction.

[0172] Optionally, a second drive motor is provided on the frame 1. The second drive motor is connected to the second movable seat in a transmission manner. The second drive motor is used to drive the second movable seat to move relative to the frame 1, thereby causing the second feeding assembly 5 to move relative to the frame 1.

[0173] For example, the frame 1 includes a base frame and a top frame. The top frame is located on the upper side of the base frame. The turntable 2, the first feeding assembly 4, the second feeding assembly 5, the silicon wafer clamping device 8, and the strapping device 10 are all located on the base frame. The first robot arm and the second robot arm are both located on the top frame.

[0174] Optionally, the top frame is provided with a first guide rail and a second guide rail extending in the left-right direction. The first robot arm can move along the extension direction of the first guide rail, and the second robot arm can move along the extension direction of the second guide rail.

[0175] For example, the first lifting base is movable along the extension direction of the first guide rail, and the second lifting base is movable along the extension direction of the second guide rail.

[0176] Optionally, the top frame is equipped with a first cylinder and a second cylinder. The first cylinder is connected to the first lifting seat and is used to drive the first lifting seat to move along the first guide rail. The second cylinder is connected to the second lifting seat and is used to drive the second lifting seat to move along the second guide rail.

[0177] Optionally, the detection position of the silicon wafer clamping device 8 is set directly in front of the silicon wafer placement position, and the third robot arm 3 moves in the front-back direction, moving between the detection position of the silicon wafer clamping device 8 and the silicon wafer placement position. The strapping device 10 is set directly behind the silicon wafer picking position, and the fourth robot arm moves in the front-back direction, moving between the silicon wafer picking position and the strapping device 10.

[0178] For example, the third robotic arm 3 and the fourth robotic arm are both mounted on the top frame.

[0179] Optionally, the top frame is provided with a third guide rail and a fourth guide rail extending in the front-rear direction. The third robot arm can move along the extension direction of the third guide rail, and the fourth robot arm can move along the extension direction of the fourth guide rail.

[0180] For example, the third lifting seat 35 is movable along the extension direction of the third guide rail, and the fourth lifting seat is movable along the extension direction of the fourth guide rail.

[0181] Optionally, the top frame is equipped with a third cylinder and a fourth cylinder. The third cylinder is connected to the third lifting seat and is used to drive the third lifting seat 35 to move along the third guide rail. The fourth cylinder is connected to the fourth lifting seat and is used to drive the fourth lifting seat to move along the fourth guide rail.

[0182] In some embodiments, the silicon wafer packaging equipment 100 further includes a first conveying assembly 6 and a second conveying assembly 7, both of which are located downstream of the turntable 2. The first conveying assembly 6 and the second conveying assembly 7 are spaced apart on the frame 1 so that both ends of the stacked assembly are supported by the first conveying assembly 6 and the second conveying assembly 7, respectively. A portion of a strapping device 10 is located between the first conveying assembly 6 and the second conveying assembly 7 so that the strapping device 10 can strap the middle of the stacked assembly.

[0183] For example, such as Figure 9 As shown, the first conveying component 6 is disposed in front of the second conveying component 7, and there is a gap between the rear end of the first conveying component 6 and the front end of the second conveying component 7.

[0184] In practical use, a fourth robotic arm moves the stacked assembly between the first conveying assembly 6 and the second conveying assembly 7, with the front and rear ends of the stacked assembly positioned on the first and second conveying assemblies 6 and 7 respectively, leaving the middle portion of the stacked assembly suspended in the air corresponding to the aforementioned spacing. At this point, a strapping device 10 is used to secure the suspended portion of the stacked assembly with cable ties. Finally, the first and second conveying assemblies 6 and 7 drive the strapped stacked assembly downstream.

[0185] This facilitates the bundling of 10 pairs of stacked components with straps, further improving the packaging efficiency of silicon wafers.

[0186] Optionally, the strapping device 10 is movable along the arrangement direction of the first conveying assembly 6 and the second conveying assembly 7, so that the strapping device 10 can bind multiple straps to the middle of the stacked assembly. The strapping device 10 can move in either forward or backward.

[0187] For example, the strapping device 10 is movably connected to the frame 1 in the front-rear direction. First, a strap is tied to the front of the stacked assembly. Then, the strapping device 10 is moved backward and a strap is tied to the rear of the stacked assembly.

[0188] By bundling multiple cable ties onto the laminated assembly, the stability of the laminated assembly can be improved, which in turn improves the packaging reliability of the silicon wafer and reduces the risk of damage during silicon wafer transportation.

[0189] Optionally, both the first conveying component 6 and the second conveying component 7 are belt conveyors.

[0190] Optionally, the strapping device 10 is connected to the frame 1 via a guide seat, which is movably connected to the frame 1 in the front-to-back direction. The silicon wafer packaging equipment 100 also includes a device drive unit for driving the strapping device 10 to move relative to the frame 1 in the front-to-back direction. The device drive unit can be an electric push rod or a drive cylinder, etc.

[0191] When it is necessary to move the strapping device 10 in the front-back direction, the guide seat moves relative to the frame 1, which in turn moves the strapping device 10 relative to the frame.

[0192] Optionally, the distance between the first conveying component 6 and the second conveying component 7 is greater than or equal to 90 mm.

[0193] For example, such as Figure 9 As shown, the distance between the first conveying component 6 and the second conveying component 7 is d, where d is greater than or equal to 90 mm.

[0194] It is understandable that when the two sides of the stacked assembly are located on the first conveying assembly 6 and the second conveying assembly 7 respectively, if the distance between the first conveying assembly 6 and the second conveying assembly 7 is too large, the contact area between the silicon wafer and the first conveying assembly 6 and the second conveying assembly 7 will be small. Under the condition that the supporting force provided by the first conveying assembly 6 and the second conveying assembly 7 on the silicon wafer is constant, i.e., the weight of the silicon wafer is constant, there is a problem of excessive force on both sides of the silicon wafer, which can easily damage the silicon wafer. By setting the distance between the first conveying assembly 6 and the second conveying assembly 7 to be greater than or equal to 90mm, the problem of excessive force on both sides of the silicon wafer can be avoided, the risk of silicon wafer damage can be reduced, and the yield of silicon wafers can be further improved.

[0195] Optionally, the silicon wafer packaging equipment 100 also includes a lifting device, which is mounted on the frame 1, and the strapping device 10 is connected to the lifting device.

[0196] For example, the lifting device is fixed on the guide seat, and the top of the lifting device is connected to the belt device 10. The lifting device is used to drive the belt device 10 to rise and fall.

[0197] Before placing the silicon wafer on the first conveying assembly 6 and the second conveying assembly 7, the strapping device 10 can be lowered to a certain height to avoid interference between the strapping device 10 and the stacked assembly; after the stacked assembly is placed on the first conveying assembly 6 and the second conveying assembly 7, the strapping device 10 is raised and the stacked assembly is strapped.

[0198] This effectively prevents damage to the silicon wafers caused by the strapping device 10 accidentally touching the stacked components during the strapping process, further improving the reliability of the silicon wafer packaging equipment 100.

[0199] Optionally, the lifting device is a lifting cylinder.

[0200] Optionally, the silicon wafer packaging equipment 100 also includes a housing, which is mounted on the frame 1. The turntable 2, the first feeding assembly 4, the second feeding assembly 5, the first conveying assembly 6, the second conveying assembly 7, the silicon wafer clamping device 8, the belt-bearing device 10, the first robot arm, the second robot arm, the third robot arm 3, and the fourth robot arm are all disposed inside the housing.

[0201] Optionally, the housing is provided with an operating window that can be opened and closed.

[0202] The following is for reference. Figures 1 to 9 The following describes the method of using the silicon wafer packaging equipment 100 according to an embodiment of the present invention:

[0203] First, move the silicon wafer to the silicon wafer clamping device 8, and use the silicon wafer clamping device 8 to align the silicon wafer. Then, by moving and rotating the silicon wafer clamping device 8, and using the detection device 20 to detect the silicon wafer. When a defect is detected in the silicon wafer, the silicon wafer clamping device 8 moves to the initial position and transfers the silicon wafer to the waste bin. When the silicon wafer is detected to be qualified, use the third manipulator 3 to pick up the silicon wafer at the detection device 20 and place it on the support component 22 at the silicon wafer placement position. When the support component 22 is at the first feeding position, it has already used the first manipulator to grab and place the first protective layer on the first feeding part 41 at the first working position on the support component 22. After that, the support component 22 rotates to the second feeding position, and the second manipulator grabs and places the second protective layer on the second feeding part 51 at the second working position on the upper side of the silicon wafer. Then, the support component 22 rotates to the silicon wafer picking position, and use the fourth manipulator to pick up the stacked component from the support component 22 and place it on the first conveying component 6 and the second conveying component 7. Finally, use the bundling device 10 to bundle the stacked component with a binding tape, thus completing the binding tape operation of the silicon wafer.

[0204] In the silicon wafer packaging equipment 100 according to the embodiment of the present invention, the first manipulator, the second manipulator, the third manipulator 3 and the fourth manipulator are arranged above the turntable 2, the first feeding component 4, the second feeding component 5, the first conveying component 6, the second conveying component 7, the silicon wafer clamping device 8, the bundling device 10 and the detection device 20. The first manipulator, the second manipulator, the third manipulator 3 and the fourth manipulator are arranged symmetrically in pairs, and the first manipulator, the second manipulator, the third manipulator 3 and the fourth manipulator are located directly above the turntable 2. Each component is relatively independent and cooperates and alternates to achieve the equipment action process in an orderly and efficient manner, reasonably allocates the working time of each component, and effectively improves the packaging efficiency of the silicon wafer.

[0205] The silicon wafer packaging system according to the embodiment of the present invention includes a silicon wafer packaging equipment 100, a plastic encapsulation equipment and / or a packing equipment. The silicon wafer packaging equipment 100 is the silicon wafer packaging equipment 100 described in any of the above embodiments. The plastic encapsulation equipment is arranged downstream of the silicon wafer packaging equipment, and the plastic encapsulation equipment is used to wrap the plastic encapsulation film outside the stacked component bundled with the binding tape. The packing equipment is arranged downstream of the silicon wafer packaging equipment, and the packing equipment is used to load the stacked component bundled with the binding tape into the packing box.

[0206] When the silicon wafer packaging system includes only a sealing device, firstly, the silicon wafer packaging device 100 packages the silicon wafers into stacked assemblies bundled with cable ties; then, the sealing device seals the stacked assemblies bundled with cable ties. When the silicon wafer packaging system includes only a boxing device, firstly, the silicon wafer packaging device 100 packages the silicon wafers into stacked assemblies bundled with cable ties; then, the boxing device loads the stacked assemblies bundled with cable ties into a packaging box. When the silicon wafer packaging system includes both a sealing device and a boxing device, firstly, the silicon wafer packaging device 100 packages the silicon wafers into stacked assemblies bundled with cable ties; then, the sealing device seals the stacked assemblies bundled with cable ties; finally, the boxing device loads the stacked assemblies bundled with cable ties into a packaging box.

[0207] This can effectively improve the safety of silicon wafers and reduce the risk of damage during transportation.

[0208] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.

Claims

1. A silicon wafer packaging device, characterized in that, include: frame; A turntable, comprising a turntable body and at least one support assembly disposed on the turntable body; the turntable body is rotatably disposed on the frame such that the support assembly can switch between a first feeding position for placing a first protective layer, a silicon wafer feeding position for placing silicon wafers, and a second feeding position for placing a second protective layer; and A strapping device is disposed downstream of the turntable and is used to strap the laminated assembly including the first protective layer, the silicon wafer, and the second protective layer. A silicon wafer clamping device is located upstream of the turntable and is used to align silicon wafers. The silicon wafer clamping device has a support surface for supporting the silicon wafers. The silicon wafer clamping device includes a plurality of limiting members, which are movable in a direction parallel to the support surface to clamp or release the silicon wafers, and the limiting members are also movable in a direction perpendicular to the support surface. The silicon wafer packaging equipment also includes a detection device, which is mounted on the frame and positioned close to the detection position. The detection device is used to detect the silicon wafers on the silicon wafer clamping device at the detection position.

2. The silicon wafer packaging equipment according to claim 1, characterized in that, The silicon wafer packaging equipment also includes: A first robotic arm and a second robotic arm, both movably mounted on the frame, wherein the first robotic arm has a first gripping part for gripping the first protective layer, and the second robotic arm has a second gripping part for gripping the second protective layer; and A third robotic arm and a fourth robotic arm, both movably mounted on the frame, wherein the third robotic arm has a third gripper for gripping the silicon wafer and the fourth robotic arm has a fourth gripper for gripping the stacked assembly.

3. The silicon wafer packaging equipment according to claim 2, characterized in that, The first robotic arm includes a first mounting plate and a first suction cup, the first suction cup being connected to the first mounting plate and forming the first gripping part; The second robotic arm includes a second mounting plate and a second suction cup, the second suction cup being connected to the second mounting plate and forming the second gripping part; The third robotic arm includes a third mounting plate and a plurality of third grippers, the plurality of third grippers being movably disposed on the third mounting plate, and each third gripper including a first clamping portion for clamping the silicon wafer and a first supporting portion for supporting the silicon wafer; The fourth robotic arm includes a fourth mounting plate and a plurality of fourth grippers, which are movably disposed on the fourth mounting plate. Each fourth gripper includes a second clamping portion for clamping the stacked assembly and a second supporting portion for supporting the stacked assembly.

4. The silicon wafer packaging equipment according to claim 3, characterized in that, The support component includes: A carrier, disposed on the turntable, having a bearing surface for supporting the silicon wafer; and A plurality of stops are provided, the plurality of stops being arranged circumferentially spaced along the carrier, each stop having a stop surface facing the carrier, and the stops being movable between a calibrated position holding the silicon wafer and a removable position releasing the silicon wafer; In this configuration, the stopping surfaces of the plurality of stops located in the alignment position abut against the side of the silicon wafer; the stopping surfaces of the plurality of stops located in the removable position are all away from the silicon wafer, so that the third gripper of the third robotic arm can grasp the silicon wafer or the fourth robotic arm can grasp the stacked assembly.

5. The silicon wafer packaging equipment according to claim 4, characterized in that, The silicon wafer clamping device includes two stop components, and each stop component includes at least one stop element; The bearing surface is rectangular, and two stop components are spaced apart along the long side of the bearing surface so that a clearance opening is formed between the two stop components to avoid the third gripper or the fourth gripper.

6. The silicon wafer packaging equipment according to claim 2, characterized in that, The silicon wafer packaging equipment also includes: A first feeding assembly, having at least one first feeding section for storing the first protective layer, is movably mounted on the frame and located on one side of the turntable. The first feeding section switches between a first working position near the first discharge position and a first clearance position away from the first discharge position. The second feeding assembly has at least one second feeding section for storing the second protective layer. The second feeding assembly is movably disposed on the frame and on the other side of the turntable. The second feeding section switches between a second working position close to the second discharge position and a second clearance position away from the second discharge position. The first robotic arm moves between the first working position and the first unloading position, and the second robotic arm moves between the second working position and the second unloading position.

7. The silicon wafer packaging equipment according to claim 6, characterized in that, The number of first feeding sections is multiple, such that when one part of the first feeding sections is in the first discharging position, another part of the first feeding sections is in the first clearance position; The number of second feeding sections is multiple, such that when one part of the second feeding section is in the second feeding position, another part of the second feeding section is in the second clearance position.

8. The silicon wafer packaging equipment according to claim 6, characterized in that, The first feeding section includes a first feeding plate, at least one first baffle, and at least one first air blowing device. The first baffle and the first feeding plate form a first receiving cavity for storing the first protective layer. At least one first baffle is provided with a first air hole facing the first receiving cavity, and the first air blowing device communicates with the first air hole; and / or The second feeding section includes a second feeding plate, at least one second baffle and at least one second air blowing device. The second baffle and the second feeding plate form a second receiving cavity for storing the second protective layer. At least one second baffle is provided with a second air hole facing the second receiving cavity. The second air blowing device communicates with the second air hole.

9. The silicon wafer packaging equipment according to claim 1, characterized in that, The silicon wafer packaging equipment also includes: A first conveying assembly and a second conveying assembly are both located downstream of the turntable. The first conveying assembly and the second conveying assembly are spaced apart on the frame so that both ends of the stacked assembly are supported by the first conveying assembly and the second conveying assembly, respectively. A portion of the strapping device is disposed between the first conveying assembly and the second conveying assembly so that the strapping device can secure the middle portion of the stacked assembly with a strap.

10. The silicon wafer packaging equipment according to claim 9, characterized in that, The strapping device is movable along the arrangement direction of the first conveying assembly and the second conveying assembly, so that the strapping device can bind multiple straps to the middle of the stacked assembly; and / or The silicon wafer packaging equipment also includes a lifting device, which is mounted on the frame and connected to the strapping device to drive the strapping device to move up and down.

11. The silicon wafer packaging equipment according to claim 9, characterized in that, The distance between the first conveying component and the second conveying component is greater than or equal to 90 mm.

12. The silicon wafer packaging equipment according to claim 1, characterized in that, The silicon wafer clamping device includes: Base, the base being mounted on the frame; A support member, disposed on the base, the support member having a support surface for supporting the silicon wafer; and Multiple limiting members are provided, the multiple limiting members are arranged circumferentially along the support member, the limiting members have limiting surfaces facing the support member, the limiting members are movably connected to the base in a direction perpendicular to the support surface between a clamping position and a releasing position; In the clamping position, the limiting surfaces of the plurality of limiting members abut against the side of the silicon wafer; in the releasing position, the limiting surfaces of the plurality of limiting members move away from the silicon wafer.

13. The silicon wafer packaging equipment according to claim 12, characterized in that, The base is movably mounted on the frame so that the silicon wafer clamping device can switch between an initial position and a detection position, and the base is rotatably connected to the frame.

14. A silicon wafer packaging system, characterized in that, include: Silicon wafer packaging equipment, wherein the silicon wafer packaging equipment is the silicon wafer packaging equipment according to any one of claims 1-13; A molding compound, located downstream of the silicon wafer packaging equipment, is used to wrap a molding compound film over the laminated assembly secured with cable ties; and / or A boxing device is located downstream of the silicon wafer packaging device, and the boxing device is used to pack the stacked components, which are bundled with cable ties, into a box.

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