Multi-point gluing plane lens stress field quantitative characterization method

Abstract

The application provides a multi-point gluing plane lens stress field quantitative characterization method, which can quantitatively characterize the distribution characteristics of stress field point cloud data with a large amount of data. The method comprises the following steps: first, constructing a polar coordinate system in the lens; second, constructing a stress matrix of the lens stress point cloud; third, constructing a Zernike base matrix; fourth, fitting the stress matrix by using the Zernike base matrix to obtain stress field quantitative characterization parameters; fifth, calculating the stress field and the quantitative characterization parameters according to the value range of the assembly parameters; and sixth, screening the key quantitative characterization parameters of the stress field. The application realizes quantitative characterization of the multi-point gluing plane lens stress field, and the method is simple and can be applied to the simple and quantitative characterization of the distribution characteristics of lens stress field point cloud data of different sizes and different gluing assembly states. The application provides a quantitative basis for quantitative optimization of gluing assembly parameters of precision optical instruments and quantitative control of assembly quality.

Description

Technical Field

[0001] This invention belongs to the field of assembly technology, and in particular relates to a method for quantitative characterization of stress field in multi-point bonded planar lenses. Background Technology

[0002] Cementing is a primary assembly method for high-precision lenses, key optical components in precision optical systems. After cementing assembly, the bonding stress causes a non-uniform stress distribution within the lens, adversely affecting optical imaging quality. Currently, the lens stress field is mainly characterized visually using large amounts of point cloud data. While point cloud data clearly reflects the specific stress magnitude at each location, it is difficult to comprehensively characterize the stress field distribution across the entire lens area, severely restricting the optimization process of cemented lens assembly parameters. To quantitatively optimize bonding parameters and control lens assembly quality, a concise and quantitative characterization method for the lens stress field after multi-point cementing assembly is urgently needed. Summary of the Invention

[0003] In view of this, the present invention provides a method for quantitative characterization of the stress field of a multi-point bonded planar lens.

[0004] The technical solution adopted by this invention to solve the problem of quantitative characterization of stress field in multi-point bonded planar lenses is as follows:

[0005] A method for quantitative characterization of the stress field of a multi-point bonded planar lens, comprising the following steps:

[0006] The first step is to construct a polar coordinate system (ρ, θ) with the center of the lens as the origin.

[0007] The second step involves dividing the circular region of the lens into uniform square grids. Interpolation is then used to calculate the stress value at the center point of each grid. These stress values ​​are arranged according to their positions to construct a stress matrix S. The number of rows and columns of the square grid and the matrix are both M×M. The stress matrix S is denoted as:

[0008]

[0009] The inscribed circle of the matrix represents the lens region, and its element values ​​are the interpolated stress values. The circumscribed circle is defined as 0.

[0010] The third step is to construct the first K Zernike basis matrices Z1, Z2, ..., Zn based on the Zernike polynomials. K This forms a Zernike basis matrix family Z, where Z = [Z1, Z2, ..., Zn]. K ], where any k-th Zernike basis matrix Z k The calculation formula is as follows:

[0011]

[0012] In the formula, Let be the k-th Zernike polynomial, (ρ ij θ ij ) represents the polar coordinates of the element in the i-th row and j-th column of the matrix.

[0013] Fourth, using the Zernike basis matrix family Z, the stress matrix S is fitted to obtain the quantitative stress field characterization parameter QCP. The QCP calculation formula is as follows:

[0014] QCP = Z -1 S

[0015] The fifth step is to calculate the stress field of the plane lens for different bonding parameter values ​​within the range, and to calculate the stress field characterization parameter QCP for each bonding assembly stress field.

[0016] The sixth step is to analyze the distribution law and trend of the stress field characterization parameter QCP when the bonding parameters are different, and select several QCP elements that change significantly with the bonding parameters as the key stress field characterization parameters of the stress field of the multi-point bonded planar lens when the bonding parameters are different.

[0017] Preferably, the number of rows and columns M of the stress matrix can be 200.

[0018] Preferably, the number of Zernike basis matrix items K can be 500.

[0019] Preferably, the key stress field characterization parameters can be the 1st, 4th, 6th, 10th, 11th, 12th, 14th and 18th elements of the QCP.

[0020] The beneficial effects of this invention are as follows: This invention realizes the quantitative characterization of the stress field of multi-point bonded planar lenses. The characterization method is simple and applicable to the quantitative characterization of the stress field of planar lenses of different sizes and different bonding assembly states. It can be widely used in the research on quantitative optimization of bonding assembly parameters and quantitative control of assembly quality of precision optical instruments. Attached Figure Description

[0021] Figure 1 A flowchart illustrating the steps of the method for quantitative characterization of the stress field of a multi-point bonded planar lens.

[0022] Figure 2 This is a diagram showing the stress cloud map and grid division of the plane lens region.

[0023] Figure 3 The first 20 values ​​of the QCP parameter, which quantifies the stress field of a multi-point bonded planar lens, are distributed for different bonding parameter values. Detailed Implementation

[0024] The present invention will now be described in detail with reference to the accompanying drawings and embodiments:

[0025] This embodiment provides a method for quantitative characterization of the stress field of a multi-point bonded planar lens, as shown in the attached figure. Figure 1 As shown, the steps of this method are as follows:

[0026] The first step is to construct a polar coordinate system (ρ, θ) with the center of the lens as the origin, as shown in the attached diagram. Figure 2 As shown.

[0027] The second step is to divide the circular area of ​​a lens into a uniform 200×200 square grid, as shown in the attached diagram. Figure 2 As shown, interpolation is used to calculate the stress value at the center point of each grid. The stress values ​​at the center point of each grid are arranged according to their positions to form a stress matrix S.

[0028] The third step is to construct the first 500 Zernike basis matrices Z1, Z2, ..., Z based on the Zernike polynomials. K This forms a Zernike basis matrix family Z, where Z = [Z1, Z2, ..., Zn]. K ], where any k-th Zernike basis matrix Z k The calculation formula is as follows:

[0029]

[0030] In the formula, Let be the k-th Zernike polynomial, (ρ ij θ ij ) represents the polar coordinates of the element in the i-th row and j-th column of the matrix.

[0031] Fourth, using the Zernike basis matrix family Z, the stress matrix S is fitted to obtain the quantitative stress field characterization parameter QCP. The QCP calculation formula is as follows:

[0032] QCP = Z -1 S

[0033] The fifth step involves calculating the lens stress field when the bonding parameters are: the number of adhesive dots ranges from 2 to 24, the central angle subtended by the length of each adhesive dot ranges from 0.1 to 30°, and the bonding stress ranges from 0.1 to 10 MPa. The QCP (Quality, Capability, and Criterion) for each stress field is then described in the attached diagram. Figure 3 As shown.

[0034] Step 6: Analyze the distribution law and trend of the stress field characterization parameter QCP when different bonding parameter values ​​are taken, and select the attached... Figure 3The first eight QCP elements, namely the 1st, 4th, 6th, 10th, 11th, 12th, 14th and 18th elements of QCP, which show significant changes in peak position with varying bonding parameters, serve as key stress field quantification parameters for the stress field of multi-point bonded planar lenses when the bonding parameters are set.

[0035] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for quantitative characterization of the stress field of a multi-point bonded planar lens, characterized in that, The method includes the following steps: The first step is to construct a polar coordinate system (ρ, θ) with the center of the lens as the origin; The second step involves dividing the circular region of the lens into a uniform square grid. Interpolation is then used to calculate the stress value at the center point of each grid. These stress values ​​are arranged according to their positions to form a stress matrix S. The number of rows and columns of the square grid and the matrix are both M×M. The stress matrix S is denoted as: In this matrix, the inscribed circle represents the lens region, and its element values ​​are the interpolated stress values. The circumcircle is defined as 0. The third step is to construct the first K Zernike basis matrices Z1, Z2, ..., Zn based on the Zernike polynomials. K This forms a Zernike basis matrix family Z, where Z = [Z1, Z2, ..., Zn]. K ], where any k-th Zernike basis matrix Z k The calculation formula is as follows: In the formula, Let be the k-th Zernike polynomial, (ρ ij θ ij Let be the polar coordinates of the element in the i-th row and j-th column of the matrix; Fourth, using the Zernike basis matrix family Z, the stress matrix S is fitted to obtain the quantitative stress field characterization parameter QCP. The QCP calculation formula is as follows: QCP=Z -1 S The fifth step is to calculate the stress field of the plane lens when the bonding parameters are different within the range, and to calculate the stress field characterization parameter QCP for each bonding assembly stress field. The sixth step is to analyze the distribution law and trend of the stress field characterization parameter QCP when the bonding parameters are different, and select several QCP elements that change significantly with the bonding parameters as the key stress field characterization parameters of the stress field of the multi-point bonded planar lens when the bonding parameters are different.

2. The method for quantitative characterization of stress field in a multi-point bonded planar lens as described in claim 1, characterized in that, The number of rows and columns M of the stress matrix can be 200.

3. The method for quantitative characterization of stress field in a multi-point bonded planar lens as described in claim 1, characterized in that, The number of terms K in the Zernike basis matrix can be 500.

4. The method for quantitative characterization of stress field in a multi-point bonded planar lens as described in claim 1, characterized in that, The key stress field characterization parameters can be the 1st, 4th, 6th, 10th, 11th, 12th, 14th and 18th elements of the QCP.

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