Method for simulating a system and related electronic device

Abstract

An electronic device includes a storage element and a processor. The storage element includes program code and a database, where the database includes a plurality of printed circuit board and package combinations and a plurality of channel models. The processor is coupled to the storage element and configured to execute the program code to obtain a first combination of the plurality of printed circuit board and package combinations from the database, obtain a first channel model of the plurality of channel models from the database, where the first channel model is generated based on the first combination, determine first die information, and perform a simulation based on the first channel model and the first die information to generate a characteristic and a voltage drop of a power supply network of a system.

Description

Technical Field

[0001] This invention relates to a method for simulating a system. Background Technology

[0002] In current system design, which includes printed circuit boards, packages, and chips, determining whether the system's voltage drop meets specifications requires complete data—specifically, complete chip power-related models, package designs, and printed circuit board designs—only in the mid-to-late stages of the system design process is complete enough for simulation. However, if simulation results indicate that the system design fails to meet the targets, more time is needed to restart the design, increasing the designer's workload. Summary of the Invention

[0003] Therefore, this invention proposes a system simulation method that can evaluate the power delivery network (PDN) or voltage drop of a system through simple simulation in the early stages of chip power development, in order to determine whether the planned printed circuit board, package, and chip power model meet the standards, thereby solving the problems described in the prior art.

[0004] In an embodiment of the present invention, an electronic device is disclosed, comprising a storage element and a processor. The storage element includes program code and a database, wherein the database includes combinations of various printed circuit boards and packages, and multiple channel models. The processor is coupled to the storage element and is configured to execute the program code to perform the following operations: retrieve a first combination of the various combinations of printed circuit boards and packages from the database; retrieve a first channel model of the multiple channel models from the database, wherein the first channel model is generated based on the first combination; determine first die information; and perform simulation based on the first channel model and the first die information to generate the characteristics and voltage drop of the system's power supply network.

[0005] In an embodiment of the present invention, a method for simulating a system is disclosed, comprising the following steps: obtaining a first combination from a database of combinations of printed circuit boards and packages; obtaining a first channel model from a database of multiple channel models, wherein the first channel model is generated based on the first combination; determining first die information; and performing simulation based on the first channel model and the first die information to generate the characteristics and voltage drop of the power supply network of the system. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of an electronic device according to an embodiment of the present invention.

[0007] Figure 2 This is a flowchart for system simulation.

[0008] Figure 3 A schematic diagram to simulate the characteristics of a power supply network.

[0009] Figure 4 This is a schematic diagram to simulate the system voltage drop. Detailed Implementation

[0010] Figure 1 This is a schematic diagram of an electronic device 100 according to an embodiment of the present invention, wherein the electronic device 100 is used to simulate the power-related behavior of a system in the early stages of chip development. The system includes a printed circuit board, a package (chip package) and a die fabricated on the printed circuit board, and the electronic device 100 can be a desktop computer, a laptop computer, or any electronic device capable of simulating the system. Figure 1 As shown, the electronic device 100 includes a processor 110 and a storage element 120, wherein the storage element 120 can be any non-volatile storage element, and the storage element 120 stores at least program code 122 and a database 124. In this embodiment, the database 124 includes relevant content and simulation results from past system designs. Specifically, the database 124 can include various power supply types, such as core power, input / output power (IO power), central processing unit, etc.; the database 124 can include various combinations of printed circuit boards, packages, and capacitors; the database 124 can include different channel models, wherein the channel model is a characteristic of the power transmission path in a system, such as the impedance-frequency relationship of the power transmission path under various combinations of printed circuit boards, packages, and capacitors; the database 124 can include die-internal resistance and capacitance information, wherein the die-internal resistance and capacitance information can be simulated using an equivalent circuit model inside the die, such as the resistance and capacitance values ​​of the equivalent circuit inside the die, and the impedance-frequency relationship generated by the simulation; the database 124 may also include the die's current profile.

[0011] During the operation of electronic device 100, processor 110 reads program code 122 from storage element 120 and executes program code 122 to begin system simulation. The system simulation process can be found in [reference needed]. Figure 2 .exist Figure 2In the system simulation process, in step 200, the process begins, and the processor 110 has successfully executed program code 122, and a relevant user interface is displayed on the display element of the electronic device 100. In step 202, the user selects a power supply type from the database 124 using the user interface. In step 204, the user selects a combination of printed circuit boards, packages, and capacitors from the database using the user interface, where the user can select a combination of printed circuit boards, packages, and capacitors that is closest in overall design to the die, printed circuit board, and package currently required for design / planning. In step 206, the user selects a channel model, where the selected channel model can be generated based on the combination of printed circuit boards, packages, and capacitors selected in step 204, and the channel model can include equivalent resistance-inductance, S-parameters used to represent the behavior of the circuit at different frequencies, a Simulation Program with Integrated Circuit Emphasis (SPICE) model, or any information that can represent the impedance-frequency relationship of the combination of printed circuit boards, packages, and capacitors. In step 208, the user determines the die information through the user interface. The die information may include die internal resistance and capacitance information, and the user may input the data according to the actual design or select the closest die internal resistance and capacitance information from the database 124. On the other hand, the die information may also include current characteristics, and the current characteristics may be input by the user according to the actual design or selected by the user from the database 124.

[0012] In step 210, the processor 110 performs simulation calculations based on the printed circuit board, package and capacitor combination, channel model, die resistance and capacitance information, and current characteristics selected by the user in steps 204, 206, and 208, to obtain the characteristics of the power supply network and the system voltage drop. Specifically, refer to... Figure 3 As shown, the channel model can be the impedance-frequency relationship generated by the equivalent resistance and inductance of the printed circuit board and package, while the on-chip resistance and capacitance information can be expressed as an impedance-frequency relationship, and the processor 110 can generate the characteristics of the power supply network accordingly. Furthermore, refer to... Figure 4 The current characteristic can be the relationship between current and time, and the processor 110 can obtain the system's voltage waveform based on the channel model, internal resistance and capacitance information, and current characteristics, and calculate the input voltage value (e.g., Figure 4 The voltage drop of the system can be obtained by comparing the difference between the upper dashed line (the voltage waveform above the voltage waveform) and the minimum value of the voltage waveform.

[0013] In step 212, the processor 110 determines whether the characteristics and voltage drop of the system's power supply network meet the target, i.e., whether they conform to the expected standard. If yes, the process proceeds to step 214; otherwise, the process returns to steps 204, 206, or 208 to adjust another combination of printed circuit board, package, and capacitor, select another channel model, or determine another die internal resistance and capacitance information, or another current characteristic, and then performs simulation again in step 210. Specifically, another channel model can be selected and simulated with the currently used die information to generate the characteristics and voltage drop of the power supply network. The other channel model can be modified by the user or selected from the database 124 to correspond to another combination of printed circuit board, package, and capacitor; or another die information can be selected and simulated with the currently used channel model to generate the characteristics and voltage drop of the power supply network.

[0014] In step 214, the simulation ends, and the user can confirm that the combination of printed circuit board, package and capacitor selected in step 204 is a feasible design, and that the die resistance and capacitance information and current characteristics determined in step 208 can achieve the target.

[0015] In summary, this invention's system simulation method, by establishing relevant past system design data and simulation results in a database, allows designers to evaluate the characteristics or voltage drop of the system's power supply network through simple simulations in the early stages of power supply development, before the related printed circuit boards and packages are fully designed. This helps determine whether the selected printed circuit boards, packages, and die models meet standards. This invention enables designers to determine the characteristics or voltage drop of suitable printed circuit boards, packages, and related power supply networks early in chip power supply development, reducing the burden on subsequent overall system design.

[0016] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made in accordance with the claims of the present invention should be included within the scope of the present invention.

[0017] Figure Labels

[0018] 100: Electronic devices

[0019] 110: Processor

[0020] 120: Storage element

[0021] 122: Program Code

[0022] 124: Database

[0023] 200-214: Steps

Claims

1. An electronic device comprising: The storage element includes program code and a database, wherein the database includes a combination of various printed circuit boards and packages and multiple channel models; A processor, coupled to the storage element, is configured to execute the program code to perform the following operations: Retrieve a first combination from the various combinations of printed circuit boards and packages from the database; Obtain a first channel model from the plurality of channel models from the database, wherein the first channel model is generated based on the first combination; Determine the information of the first grain; as well as Simulations are performed based on the first channel model and the first grain information to generate the characteristics and voltage drop of the system's power supply network; The operation involves only the combination of printed circuit boards and packages, channel models, and die information. The electronic device is used to evaluate the characteristics and voltage drop of the system's power supply network in the early stages of power supply development and before the related printed circuit boards and packages have been fully designed.

2. The electronic device of claim 1, wherein the first grain information includes grain resistance and capacitance information and current characteristics.

3. The electronic device of claim 1, wherein the first channel model includes an equivalent resistance-inductance model, S-parameters representing the behavior of the first combination at different frequencies, or an integrated circuit simulation program model.

4. The electronic device of claim 1, wherein the processor executes the program code to additionally perform the following operations: Determine whether the characteristics of the power supply network and the voltage drop meet the standards; If the characteristics of the power supply network and the voltage drop do not meet the standards, a second channel model different from the first channel model is generated; and Simulations are performed based on the second channel model and the first grain information to generate the characteristics of the power supply network of the system and the voltage drop.

5. The electronic device of claim 1, wherein the processor executes the program code to additionally perform the following operations: Determine whether the characteristics of the power supply network and the voltage drop meet the standards; If the characteristics of the power supply network and the voltage drop do not meet the standard, obtain the second combination from the various combinations of printed circuit boards and packages in the database; Retrieve a second channel model from the plurality of channel models from the database, wherein the second channel model is generated based on the second combination; as well as Simulations are performed based on the second channel model and the first grain information to generate the characteristics of the power supply network of the system and the voltage drop.

6. The electronic device of claim 1, wherein the processor executes the program code to additionally perform the following operations: Determine whether the characteristics of the power supply network and the voltage drop meet the standards; If the characteristics of the power supply network and the voltage drop do not meet the criteria, determine the second grain information; and Simulations are performed based on the first channel model and the second grain information to generate the characteristics of the power supply network of the system and the voltage drop.

7. A method for simulating a system, comprising: Retrieve the first combination from a variety of printed circuit board and package combinations from the database; Obtain a first channel model from a plurality of channel models from the database, wherein the first channel model is generated based on the first combination; Determine the information of the first grain; as well as Simulations are performed based on the first channel model and the first grain information to generate the characteristics and voltage drop of the power supply network of the system. The method involves only the combination of printed circuit boards and packages, channel models, and die information to evaluate the characteristics and voltage drop of the system's power supply network in the early stages of power development and before the relevant printed circuit boards and packages have been fully designed.

8. The method of claim 7, wherein the first grain information includes grain internal resistance and capacitance information and current characteristics.

9. The method of claim 7, wherein the first channel model includes an equivalent resistance-inductance model, S-parameters representing the behavior of the first combination at different frequencies, or an integrated circuit simulation program model.

10. The method of claim 7, further comprising: Determine whether the characteristics of the power supply network and the voltage drop meet the standards; If the characteristics of the power supply network and the voltage drop do not meet the standard, a second channel model different from the first channel model is generated; as well as Simulations are performed based on the second channel model and the first grain information to generate the characteristics of the power supply network of the system and the voltage drop.

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