Multi-power system, power module and PCB power plane arrangement method and device

Abstract

This invention provides a multi-power supply system, a method and apparatus for power module and PCB power plane layout, belonging to the field of server power supply design technology. The system includes a backplane PCB and several controllers and power modules located on the backplane PCB; the layout direction of each power module and each controller is consistent; the power modules are divided into several groups, and the power modules of different groups are evenly and crosswise arranged along the layout direction; the backplane PCB is divided into several power domains; each controller is connected to each power module through a trace area on the backplane PCB, and the trace areas of the power modules in the same group are located in the same power domain of the backplane PCB; the number of power plane layers and ground plane layers on the backplane PCB are equal and they are crosswise arranged; the power plane layers where the trace areas of the same power domain are located are connected; the power plane layers of different power domains are isolated from each other. This invention achieves low impedance in the power domains, reduces voltage drop and current-driven temperature rise, and improves the redundancy and reliability of the power supply system.

Description

Technical Field

[0001] This invention belongs to the field of server power supply design technology, specifically relating to a multi-power supply system, power modules, and a method and apparatus for PCB power plane layout. Background Technology

[0002] Modern servers have high requirements for power stability, especially storage servers which have high requirements for data reliability. Therefore, dual / multi-controller or dual / multi-power supply systems are usually used to ensure power stability. When one or more controllers or power modules fail, at least one controller or power supply can still operate normally, thereby preventing data loss.

[0003] Traditional controller and power module redundancy mechanisms cannot prevent single-point failures in PCB power networks. The emergence of dual / multi-power domains can effectively solve this problem. Redundancy mechanisms are formed between two or more power domains. When any domain or PCB plane in the power domain fails, the others can still work normally, thereby increasing the reliability of the power supply and the whole system.

[0004] However, as the power supply of storage systems continues to increase, the existing simple redundant power domain approach will still experience power system voltage drops and PCB burn-out problems. Once the PCB has a short circuit or open circuit, it will inevitably cause the entire system to fail.

[0005] In summary, existing servers, especially storage servers, have high requirements for power stability. While dual / multi-controller or dual / multi-power supply systems can achieve redundancy and prevent data loss, they cannot prevent single-point failures in the PCB power network. Multi-power domain systems can create power domain redundancy to some extent, but they still cannot prevent system voltage drops and PCB burn-out issues. As a result, the reliability of server power supplies and the overall system remains relatively low.

[0006] Therefore, in order to address the above-mentioned deficiencies, it is essential to provide a multi-power supply system, power module, and PCB power plane layout method and device. Summary of the Invention

[0007] To address the high power stability requirements of existing servers, especially storage servers, dual / multi-controller or dual / multi-power supply systems can achieve redundancy and prevent data loss, but cannot prevent single-point failures in the PCB power network. While multi-power domain systems can achieve some degree of power domain redundancy, they still cannot prevent system voltage drops and PCB burn-out issues, resulting in relatively low reliability of server power supplies and the entire machine. This invention provides a multi-power supply system and a method and apparatus for arranging power modules and PCB power planes to solve the above-mentioned technical problems.

[0008] In a first aspect, the present invention provides a multi-power supply system, including a backplane PCB, a plurality of controllers and a plurality of power modules;

[0009] The arrangement direction of each power module is consistent with the arrangement direction of each controller;

[0010] The power modules are divided into several groups according to the number of controllers, and the power modules of different groups are evenly and crosswise arranged along the layout direction.

[0011] The backplane PCB is divided into several power domains;

[0012] Each controller is connected to each power module in each group through the routing area on the backplane PCB, and the routing areas corresponding to the power modules in the same group are located in the same power domain of the backplane PCB.

[0013] The number of power plane layers and ground plane layers on the backplane PCB are equal and they are arranged in a cross pattern.

[0014] Trace areas in the same power domain located on different power plane layers are connected by through-holes;

[0015] The power plane layers of different power domains are isolated from each other.

[0016] Furthermore, the controller and power module are located on opposite sides of the backplane PCB, and the power plane layer where the controller side routing area is located and the power plane layer where the power module side routing area is located are symmetrical along the horizontal central axis of the backplane PCB.

[0017] Furthermore, the controller and power module are located on the same side of the backplane PCB.

[0018] Furthermore, a predetermined number of ground vias are provided within the designated area of ​​the flow through-hole, and the ground vias connect to various ground plane layers. Both the flow through-hole and the ground vias are through-holes.

[0019] In a second aspect, the present invention provides a multi-power supply system, including a backplane PCB, several controllers and several power modules;

[0020] The controllers and power modules are divided into several groups according to their quantity. The arrangement direction of each power module in the same group is the same as the arrangement direction of each controller in the same group.

[0021] The backplane PCB is divided into several power domains;

[0022] Each controller in the same group is connected to each power module in the same group through the routing area on the backplane PCB, and the routing areas corresponding to the power modules in the same group are located in the same power domain of the backplane PCB.

[0023] The number of power plane layers and ground plane layers on the backplane PCB are equal and they are arranged in a cross pattern.

[0024] The routing areas of the same power domain are set on each power plane layer and connected by through-holes;

[0025] The routing areas of different power domains are isolated from each other.

[0026] Furthermore, the controller and power module are located on opposite sides of the backplane PCB.

[0027] Furthermore, the controller and power module are located on the same side of the backplane PCB.

[0028] Furthermore, a predetermined number of ground vias are provided within the designated area of ​​the flow through-hole, and the ground vias connect to various ground plane layers. Both the flow through-hole and the ground vias are through-holes.

[0029] Thirdly, the present invention provides a power module and PCB power plane arrangement method for a multi-power supply system, comprising the following steps:

[0030] S 1. On the backplane PCB, determine the arrangement direction of each power module according to the arrangement direction of each controller, and ensure that the arrangement directions of both are consistent;

[0031] S 2. Divide the power modules into several groups according to redundancy requirements, and arrange the power modules of each group in a cross pattern on the backplane PCB along the layout direction.

[0032] S 3. Set the number of power plane layers and ground plane layers on the backplane PCB to be equal and arranged in a cross pattern. Select power plane layers for routing areas of each power domain. Set the routing areas of the same power domain located on different power plane layers to be connected by through-holes, and isolate the routing areas of different power domains.

[0033] Furthermore, the specific steps of step S1 are as follows:

[0034] S 11. Obtain the layout direction of each controller along the backplane PCB;

[0035] When each controller is arranged horizontally along one side of the backplane PCB, proceed to step S12;

[0036] When each controller is arranged longitudinally along one side of the backplane PCB, proceed to step S13;

[0037] S12. Determine that each power module is arranged horizontally on the side of the backplane PCB opposite to the controller, and proceed to step S2;

[0038] S 13. Determine the vertical arrangement of each power module on the side of the backplane PCB opposite to the controller.

[0039] Furthermore, the specific steps of step S2 are as follows:

[0040] S 21. Obtain the number S of power modules;

[0041] S 22. Determine the number N of power supply modules to power each controller based on redundancy requirements;

[0042] S 23. Based on the number of power modules S and the number of power modules N that power each controller, calculate the number of power domains P that need to be set on the backplane PCB: P = S / N;

[0043] S 24. As needed, set the number of power domains to divide each power module into P groups, and set the power modules of each group to be evenly and crosswise arranged in sequence on the backplane PCB along the determined layout direction.

[0044] Furthermore, the specific steps of step S3 are as follows:

[0045] S 31. Calculate the minimum number of power plane layers L = P required by setting the number of power domains P as needed;

[0046] S 32. Set the number of ground plane layers to be equal to the number of power plane layers, and arrange the power plane layers and ground plane layers in a cross pattern on the backplane PCB;

[0047] S 33. Determine whether the number of power plane layers L is equal to P;

[0048] If so, allocate a power plane layer as a routing area for each power domain and isolate the routing areas of different power domains, then proceed to step S39.

[0049] If not, proceed to step S34;

[0050] S 34. Locate the power modules of a group, locate the outermost power plane layer from the power module side, and locate the outermost power plane layer from the controller side;

[0051] S 35. Routing areas are laid out on the two power plane layers of the location, and the two routing areas are connected by through-holes to form a power domain;

[0052] S 36. Connect each power module of the positioning group to the positioning power plane layer on the power module side, and connect each controller to the positioning power plane layer on the controller side;

[0053] S 37. Determine whether all power modules have been located;

[0054] If so, proceed to step S39;

[0055] If not, proceed to step S38;

[0056] S 38. Locate the power module of the next group, locate the next power plane layer from the power module side inward, and locate the next power plane layer from the controller side inward, then return to step S34;

[0057] S 39. Use ground vias to connect to each ground plane layer.

[0058] Fourthly, the present invention provides a method for arranging power modules and PCB power planes in a multi-power supply system, comprising the following steps:

[0059] S 1. Divide the power modules and controllers into several groups according to redundancy requirements, and set the arrangement direction of the controllers in the same group according to the arrangement direction of each power module in the same group to ensure that the two are consistent.

[0060] S 2. Set the number of power plane layers and ground plane layers of the backplane PCB to be equal and arranged in a cross pattern. On each power plane layer of the backplane PCB, set the routing area for the controller and power module of each power domain, and connect the routing areas of the same power domain as well as isolate the routing areas of different power domains.

[0061] Furthermore, the specific steps of step S1 are as follows:

[0062] S 11. Obtain the number of power modules S, the number of controllers M, and the number of power domains P that need to be set;

[0063] S 12. Calculate the number of power modules corresponding to each power domain as S / P, and the number of controllers corresponding to each power domain as M / P, and assign the corresponding number of power modules and the corresponding number of controllers to each power domain as a group;

[0064] S 13. Locate a group;

[0065] S 14. Obtain the layout direction of the positioning group's controller along the backplane PCB;

[0066] When each controller is arranged horizontally along one side of the backplane PCB, proceed to step S15;

[0067] When each controller is arranged longitudinally along one side of the backplane PCB, proceed to step S16;

[0068] S15. Determine the power modules of the positioning group to be arranged horizontally on the side of the back panel PCB opposite to the controller, and proceed to step S17;

[0069] S 16. Determine the vertical arrangement of each power module in the positioning group on the side of the back panel PCB opposite to the controller;

[0070] S 17. Determine whether each group has completed its positioning;

[0071] If so, proceed to step S2;

[0072] If not, locate the next group and return to step S14;

[0073] The specific steps for S2 are as follows:

[0074] S 21. Set the number of ground plane layers to be equal to the number of power plane layers, and arrange the power plane layers and ground plane layers in a cross pattern on the backplane PCB;

[0075] S 22. Divide each group into regions, and lay out wiring areas on each power plane layer within the divided regions;

[0076] S 23. The wiring area of ​​the power plane layer on the side of the power module of each group to connect the power module of that group, and the wiring area of ​​the power plane layer on the side of the controller of each group to connect the controller of that group.

[0077] S 24. Isolate power plane layers from different groups, and use through-holes to connect power plane layers from the same group;

[0078] S 25. Use vias to connect all ground plane layers.

[0079] Fifthly, the present invention provides a power module for a multi-power supply system and a PCB power plane layout device, comprising:

[0080] The power module layout direction determination unit is used to determine the layout direction of each power module on the backplane PCB according to the layout direction of each controller, so as to ensure that the layout directions of the two are consistent.

[0081] The power module layout unit is used to divide the power modules into several groups according to redundancy requirements, and arrange the power modules of each group in a cross pattern on the backplane PCB along the layout direction.

[0082] The first routing area setting unit is used to set the number of power plane layers and ground plane layers of the backplane PCB to be equal and arranged in a cross pattern, select power plane layers for routing areas of each power domain, set routing areas of the same power domain located on different power plane layers to be connected through current-passing vias, and isolate routing areas of different power domains.

[0083] Furthermore, the power module layout direction determination unit includes:

[0084] The controller layout direction acquisition subunit is used to acquire the layout direction of each controller along the backplane PCB;

[0085] The power module horizontal arrangement sub-unit is used to determine the horizontal arrangement of each power module on the side of the backplane PCB opposite to the controller when each controller is horizontally arranged along one side of the backplane PCB.

[0086] The power module vertical arrangement sub-unit is used to determine the vertical arrangement of each power module on the side of the backplane PCB opposite to the controller when each controller is arranged vertically along one side of the backplane PCB.

[0087] Furthermore, the power module layout unit includes:

[0088] The power module quantity acquisition subunit is used to acquire the quantity S of the power modules.

[0089] The sub-unit for determining the number of power supply modules for a single controller is used to determine the number N of power supply modules to supply power to each controller based on redundancy requirements.

[0090] The power domain quantity calculation subunit is used to calculate the number of power domains P = S / N that need to be set on the backplane PCB based on the number of power modules S and the number of power modules N that supply power to each controller.

[0091] The power module layout determination subunit is used to divide each power module into P groups as needed by setting the number of power domains, and to set the power modules of each group to be evenly and crosswise arranged in sequence on the backplane PCB along the determined layout direction.

[0092] Furthermore, the first unit of the wiring area includes:

[0093] The power plane layer number calculation subunit is used to calculate the minimum number of power plane layers L=P that needs to be set based on the number of power domains P as required.

[0094] The first sub-unit for power plane and ground plane is used to set the number of ground plane layers to be equal to the number of power plane layers, and to arrange the power plane layers and ground plane layers in a cross arrangement on the backplane PCB.

[0095] The power plane layer quantity determination sub-unit is used to determine whether the number of power plane layers L is equal to P.

[0096] The power plane layer is a unit cell, used when the number of power plane layers L is equal to P, to allocate a power plane layer as a routing area for each power domain and isolate the routing areas of different power domains.

[0097] The power module and outermost power plane layer positioning subunit is used to locate a group of power modules when the number of power plane layers L is greater than P, to locate the outermost power plane layer from the power module side, and to locate the outermost power plane layer from the controller side.

[0098] The routing area layout sub-unit is used to lay out the routing area on the two power plane layers of the location, and to connect the two routing areas as a power domain using a through-hole.

[0099] The module connection subunit of the power plane layer is used to connect each power module of the positioning group to the power module side positioning power plane layer, and to connect each controller to the controller side positioning power plane layer.

[0100] The power module positioning and judgment subunit is used to determine whether all groups of power modules have been positioned.

[0101] The next power module and corresponding power plane layer positioning subunit is used to position the next group of power modules when the positioning of each group of power modules is not completed, to position the next power plane layer from the power module side inward, and to position the next power plane layer from the controller side inward.

[0102] The ground plane layer connection sub-unit is used to connect various ground plane layers using ground vias.

[0103] Sixthly, the present invention provides a power module for a multi-power supply system and a PCB power plane layout device, comprising:

[0104] The power domain partitioning and power module layout unit is used to divide power modules and controllers into several groups according to redundancy requirements, and set the layout direction of controllers in the same group according to the layout direction of each power module in the same group to ensure that the two are consistent.

[0105] The second routing area setting unit is used to set the number of power plane layers and ground plane layers of the backplane PCB to be equal and arranged in a cross pattern. On each power plane layer of the backplane PCB, routing areas are set for the controller and power module of each power domain, and routing areas of the same power domain are connected, as well as routing areas of different power domains are isolated.

[0106] Furthermore, the power domain partitioning and power module layout unit includes:

[0107] The power module, controller, and power domain quantity acquisition subunit is used to acquire the number of power modules S, the number of controllers M, and the number of power domains P that need to be set.

[0108] The calculation and grouping of the number of power modules and controllers in a single power domain is used to calculate the number of power modules (S / P) and the number of controllers (M / P) in each power domain, and to assign a corresponding number of power modules and controllers to each power domain as a group.

[0109] Group positioning subunit, used to locate a group;

[0110] A single controller layout direction acquisition subunit is used to acquire the layout direction of the positioning group's controllers along the backplane PCB.

[0111] The power module horizontal layout determination subunit is used to determine the power modules of the horizontal layout positioning group on the side of the backplane PCB opposite to the controller when each controller is horizontally arranged along one side of the backplane PCB.

[0112] The power module longitudinal arrangement determination subunit is used to determine the positioning group of each power module in the longitudinal arrangement on the side of the backplane PCB opposite to the controller when each controller is arranged longitudinally along one side of the backplane PCB.

[0113] The group positioning completion judgment sub-unit is used to determine whether each group has been positioned.

[0114] The next set of positioning sub-units is used to position the next group when the previous group has not been positioned.

[0115] Furthermore, the second unit for the wiring area includes:

[0116] The second sub-unit for power plane and ground plane is used to set the number of ground plane layers to be equal to the number of power plane layers, and to arrange the power plane layers and ground plane layers in a cross arrangement on the backplane PCB.

[0117] A single-group routing area layout sub-unit is used to divide the area for each group, and routing areas are laid out on each power plane layer within the divided area;

[0118] A module connection subunit for a single power plane layer is used to connect the power modules of each group to the wiring area of ​​the power plane layer on the side of the power modules of that group, and to connect the controllers of each group to the wiring area of ​​the power plane layer on the side of the controllers of that group.

[0119] Connecting sub-units of the same group of power plane layers are used to isolate power plane layers of different groups, while power plane layers of the same group are connected using through-holes;

[0120] The ground plane layer connection sub-unit is used to connect all ground plane layers using ground vias.

[0121] The beneficial effects of this invention are as follows:

[0122] The multi-power supply system, power module, and PCB power plane layout method and device provided by this invention achieve low impedance in the power domain, effectively reduce voltage drop and current-driven temperature rise, thereby improving the redundancy and reliability of the whole power supply system, and are especially suitable for fields with high reliability requirements.

[0123] Furthermore, the design principle of this invention is reliable, the structure is simple, and it has a very wide range of application prospects.

[0124] Therefore, it is evident that the present invention has outstanding substantive features and significant progress compared with the prior art, and the beneficial effects of its implementation are also obvious. Attached Figure Description

[0125] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0126] Figure 1 This is a schematic diagram of the power domain structure of Embodiment 1 of the multi-power supply system of the present invention.

[0127] Figure 2 This is a schematic diagram of the power domain structure of Embodiment 2 of the multi-power supply system of the present invention.

[0128] Figure 3 This is a schematic flowchart of Embodiment 3 of the power module and PCB power plane layout method of the multi-power system of the present invention.

[0129] Figure 4 This is a schematic flowchart of Embodiment 4 of the power module and PCB power plane layout method of the multi-power system of the present invention.

[0130] Figure 5 This is a flowchart illustrating Embodiment 5 of the power module and PCB power plane layout method for the multi-power system of the present invention.

[0131] Figure 6 This is a schematic flowchart of Embodiment 6 of the power module and PCB power plane layout method of the multi-power system of the present invention.

[0132] Figure 7 This is a schematic diagram of embodiment 7 of the power module and PCB power plane layout device of the multi-power system of the present invention.

[0133] Figure 8 This is a schematic diagram of embodiment 8 of the power module and PCB power plane layout device of the multi-power system of the present invention.

[0134] Figure 9 This is a schematic diagram comparing the voltage drop, temperature rise, and current flow of the traditional power domain sequential arrangement scheme with the schemes in Embodiments 1 and 2 of this invention.

[0135] Wherein, 1-backplane PCB; 2-controller-side connector; 3-power-side connector; c1-first controller; c2-second controller; c m-1 - The (m-1)th controller; c m - The m-th controller; the first power supply module of group a1-a; the n-th power supply module of group an-a; the first power supply module of group b1-b; b n-b group, nth power module; s1-external power plane layer; s2-second power plane layer; s3-third power plane layer; s4-fourth power plane layer; g1-first ground plane layer; g2-second ground plane layer; g3-third ground plane layer; g4-external ground plane layer. Detailed Implementation

[0136] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0137] Example 1:

[0138] like Figure 1 As shown, the present invention provides a multi-power supply system, including a backplane PCB 1, several controllers and several power modules;

[0139] The arrangement direction of each power module is consistent with the arrangement direction of each controller;

[0140] For storage servers, the overall width is often much larger than the height, and the controllers are mostly arranged horizontally. Figure 1 As shown, at this time, each power module is also arranged horizontally on the backplane PCB 1. When each controller is arranged vertically on the backplane PCB 1, each power module is also arranged vertically on the backplane PCB 1. This can ensure that the power modules are evenly placed relative to the controllers, and can also avoid the worst case situation where one controller is too far away from all the power modules.

[0141] The power modules are divided into several groups according to the number of controllers, and the power modules of different groups are evenly and crosswise arranged along the layout direction.

[0142] The backplane PCB 1 is divided into several power domains;

[0143] The groups are divided to correspond to power domains; power domains are the different power traces on the backplane PCB 1, and there is redundancy between power domains; for example Figure 1 As shown, there are m controllers, the first controller c1, the second controller c2, ..., the (m-1)th controller c m-1 and the m-th controller c m Each controller is configured with two power domains. The first power domain corresponds to the first power module a1 in group a, ..., the nth power module an in group a. The second power domain corresponds to the first power module b1 in group b, ..., and the nth power module b in group b.n The controllers are arranged as c1, c2...c m -1 to c m The power modules are arranged as a1, b1…a n to b n Arranged in a staggered pattern; taking the first power domain as an example, assuming in the extreme case that the first power module a1 in group a only supplies power to the first controller c1, the nth power module a in group a... n Only give the (m-1)th controller c m-1 Power supply: Power modules placed in a uniform, staggered arrangement have a shorter path compared to those placed without staggering. Although in reality, the first power module a1 in group a will also supply power to the m-th controller c. m Power supply, nth power module a in group a n It also supplies power to the first controller C1, but the current always flows to the path of least impedance. The impedance of the power module relative to the remote controller is greater than that relative to the near controller, so the current flowing to the remote controller will be much smaller, and the impact on the voltage drop is small. Overall, the voltage drop of the evenly cross-placed power module is still better.

[0144] Compared to sequential arrangement, cross arrangement shortens the path of each power domain on the backplane PCB1, thereby reducing impedance and voltage drop. Moreover, the positions of an and bn should not be interchanged, that is, avoid the arrangement where the first power domain is at both ends and the second power domain is in the middle, such as the arrangement (a1a2, b1b2b(n-1)bn, a(n-1)an). The purpose is to prevent the extreme case where the first power module a1 of group a fails and the nth power module an of group a is too far from the first controller c1 to meet the voltage drop requirements.

[0145] Each controller is connected to each power module in each group through the routing area on the backplane PCB1, and the routing areas corresponding to the power modules in the same group are located in the same power domain of the backplane PCB1; the routing area of ​​the power domain enables the connection between the controller and the power module.

[0146] The number of power plane layers and ground plane layers on the backplane PCB1 are equal and they are arranged in a cross pattern. Taking an eight-layer board as an example, the first layer, i.e., the top layer, is the external power plane layer s1; the second layer is the first ground plane layer g1; the third layer is the second power plane layer s2; the fourth layer is the second ground plane layer g2; the fifth layer is the third power plane layer s3; the sixth layer is the third ground plane layer g3; the seventh layer is the fourth power plane layer s4; and the eighth layer, i.e., the bottom layer, is the external ground plane layer g4. The equal number of power plane layers and ground plane layers and their cross arrangement ensure that the power return path is sufficient and the shortest possible.

[0147] By symmetrically allocating the power plane layer and the ground plane layer, the current path length of two or more power domains can be made to be basically the same. Figure 1This is just an illustration; in reality, there are many through holes on the backplane PCB 1 to distribute current according to the actual impedance.

[0148] Unlike the cross-placement of power modules, the failure mode of the power plane layer is mainly short circuit. Basically, the entire domain is short-circuited, so there is no situation where the failure of the first power module a1 in group a requires the failure of the nth power module a1 in group a. n Since power supply continues, the first principle is symmetry to ensure that the current flow path is of equal length and area.

[0149] Each controller is mounted on the backplane PCB 1 via controller-side connector 2, and each power module is mounted on the backplane PCB 1 via power-side connector 3.

[0150] Power plane layers of different power domains are isolated from each other; power plane layers of the same power domain are interconnected through current-passing vias; power plane layers and vias of different power domains are not connected; a corresponding number of ground vias accompany the current-passing vias to connect the local plane layers.

[0151] The routing areas of the first power domain are set in the outer power plane layer s1 and the fourth power plane layer s4, and the first power module a1 and the nth power module a1 of group a are also included. n It is connected to the routing area on the external power plane layer s1 via the power side connector 3;

[0152] The routing area of ​​the second power domain is set in the second power plane layer s2 and the third power plane layer s3, and the first power module b1 and the nth power module b1 of group b. n It is connected to the wiring area on the third electrical plane layer s3 via the controller-side connector 2;

[0153] A predetermined number of ground vias are installed within the designated area of ​​the flow-through vias, and the ground vias connect to various ground plane layers. Both the flow-through vias and the ground vias are through-holes. Figure 1 To clearly illustrate the flow path, it is not drawn as a through hole. In fact, the flow via and the ground via are through holes, that is, they run from the outer power plane layer s1 through the outer ground plane layer g4. The via only connects with planes of the same attribute, and does not connect with planes of different attributes.

[0154] like Figure 1 The dual power domains shown double the power flow area on the backplane PCB 1, requiring sufficient area or layers to be reserved; at the same time, the number of power-side connectors doubles, requiring corresponding layout space to be reserved. Additionally, a sufficient number of through-holes should be placed near the power connectors according to the current magnitude. When there are multiple power domains, the backplane PCB needs to reserve more area, layers, and power-side connectors.

[0155] like Figure 1As shown, in Embodiment 1, the controller and the power module are located on opposite sides of the backplane PCB 1. That is, when each controller is located on the top layer of the backplane PCB 1, each power module is located on the bottom layer of the backplane PCB 1, and when each controller is located on the bottom layer of the backplane PCB 1, each power module is located on the top layer of the backplane PCB 1. In some embodiments, the power module and the controller may be located on the same side of the backplane PCB 1.

[0156] In Example 1, the power plane layer where the controller-side routing area and the power plane layer where the power module-side routing area are located in the same power domain are connected through a through-hole and are symmetrical along the transverse central axis of the backplane PCB 1; while in some embodiments, the same power domain may have only one side of the routing area, such as only the controller-side routing area or only the power module-side routing area.

[0157] In Example 1, the power modules are arranged in a cross pattern to ensure that the current path and area of ​​each power domain are similar, thereby improving redundancy reliability. However, if the redundancy requirement is not high, the power domains can be divided and arranged as in Example 2.

[0158] Example 2:

[0159] like Figure 2 As shown, the present invention provides a multi-power supply system, including a backplane PCB 1, several controllers and several power modules;

[0160] The controllers and power modules are divided into several groups according to their quantity. The arrangement direction of each power module in the same group is the same as the arrangement direction of each controller in the same group.

[0161] The backplane PCB 1 is divided into two power domains: the first power domain and the second power domain.

[0162] For example Figure 2 As shown, there are m controllers, the first controller c1, the second controller c2, ..., the (m-1)th controller c m-1 and the m-th controller c m Each controller is configured with two power domains. The first power domain corresponds to the first power module a1 in group a, ..., the nth power module an in group a. The second power domain corresponds to the first power module b1 in group b, ..., and the nth power module bn in group b. The controllers are arranged as c1, c2...c m -1 to c m The power modules are arranged as a1…an and then b1…bn;

[0163] The first power module a1 of the first power domain, ..., the nth power module an of the first power domain, controls the upper half of the controllers. The first power module b1 of the second power domain, ..., and the nth power module bn of the second power domain control the lower half of the controllers. In this way, no matter which power domain fails, it will not affect the normal operation of the controllers in the other power domain, thereby achieving the redundancy of the power supply.

[0164] Each controller in the same group is connected to each power module in the same group through the routing area on the backplane PCB1, and the routing areas of the power modules in the same group are located in the same power domain of the backplane PCB1.

[0165] The number of power plane layers and ground plane layers on the backplane PCB1 are equal and they are arranged in a cross pattern. Taking an eight-layer board as an example, the first layer, i.e., the top layer, is the external power plane layer s1; the second layer is the first ground plane layer g1; the third layer is the second power plane layer s2; the fourth layer is the second ground plane layer g2; the fifth layer is the third power plane layer s3; the sixth layer is the third ground plane layer g3; the seventh layer is the fourth power plane layer s4; and the eighth layer, i.e., the bottom layer, is the external ground plane layer g4. The equal number of power plane layers and ground plane layers and their cross arrangement ensure that the power return path is sufficient and the shortest possible.

[0166] Each controller is mounted on the backplane PCB1 via controller-side connector 2, and each power module is mounted on the backplane PCB1 via power-side connector 3.

[0167] The routing areas of the same power domain are set on each power plane layer and connected by through-holes;

[0168] The trace areas of each power plane layer belonging to the same power domain are equal in area and parallel to each other, while the trace areas of different power domains are isolated from each other.

[0169] A predetermined number of ground vias are installed within the designated area of ​​the flow-through vias, and the ground vias connect to various ground plane layers. Both the flow-through vias and the ground vias are through-holes.

[0170] like Figure 2 As shown, in Embodiment 2, the controller and power module are located on opposite sides of the backplane PCB 1. When the controllers of a group are located on the top layer of the backplane PCB 1, the power modules of that group are located on the bottom layer of the backplane PCB 1; conversely, when the controllers of a group are located on the bottom layer of the backplane PCB 1, the power modules of that group are located on the top layer of the backplane PCB 1. In some embodiments, the controller and power module may be located on the same side of the backplane PCB 1. Figure 2 As shown in Embodiment 2, the trace areas belonging to the same power domain in each power plane layer are equal in area and parallel to each other; while in some embodiments, the trace areas belonging to the same power domain may be in only one power plane layer.

[0171] The advantage of Example 2 is that each controller only needs to be connected to one power domain, making the power supply design simpler. Compared with Example 1, the number of power plane layers is doubled when the backplane PCB is on the same layer. The current path is shorter and the current area is larger, which is more conducive to reducing DC voltage drop and is more suitable for situations where the number of power plane layers is limited. The disadvantage of Example 2 compared with Example 1 is that if one power domain fails, half of the controllers will not work, while the controllers in the other power domain will not be affected. The redundancy is not as good as the solution in Example 1, but it still has advantages over the traditional solution.

[0172] The layout and transmission sequence of the multi-power supply system in Examples 1 and 2 are compared, and PCB current flow temperature rise simulation is performed. Figure 9 As shown, the sequential arrangement method has high voltage drop and temperature rise, which may cause power supply problems; the scheme of Example 1 has the highest reliability and the lowest voltage drop; Example 2 sacrifices some redundancy and reliability, but requires the smallest current flow area and has the lowest voltage drop.

[0173] The temperature zones of each type of backplane PCB arrangement are different. Designers adjust the system airflow according to the temperature map to ensure sufficient airflow in the high-temperature areas.

[0174] Example 3:

[0175] like Figure 3 As shown, the present invention provides a power module and PCB power plane layout method for a multi-power supply system, comprising the following steps:

[0176] S 1. On the backplane PCB, determine the arrangement direction of each power module according to the arrangement direction of each controller, and ensure that the arrangement directions of both are consistent;

[0177] S 2. Divide the power modules into several groups according to redundancy requirements, and arrange the power modules of each group in a cross pattern on the backplane PCB along the layout direction.

[0178] S 3. Set the number of power plane layers and ground plane layers on the backplane PCB to be equal and arranged in a cross pattern. Select power plane layers for routing areas of each power domain. Set the routing areas of the same power domain located on different power plane layers to be connected by through-holes, and isolate the routing areas of different power domains.

[0179] Example 4:

[0180] like Figure 4 As shown, the present invention provides a power module and PCB power plane layout method for a multi-power supply system, comprising the following steps:

[0181] S1. Determine the layout direction of each power module on the backplane PCB according to the layout direction of each controller, ensuring that the layout directions of both are consistent; the specific steps of step S1 are as follows:

[0182] S 11. Obtain the layout direction of each controller along the backplane PCB;

[0183] When each controller is arranged horizontally along one side of the backplane PCB, proceed to step S12;

[0184] When each controller is arranged longitudinally along one side of the backplane PCB, proceed to step S13;

[0185] S12. Determine that each power module is arranged horizontally on the side of the backplane PCB opposite to the controller, and proceed to step S2;

[0186] S 13. Determine the vertical arrangement of each power module on the side of the backplane PCB opposite to the controller;

[0187] S2. Divide the power modules into several groups according to redundancy requirements, and arrange the power modules of each group in a crisscross pattern on the backplane PCB along the layout direction; the specific steps of step S2 are as follows:

[0188] S 21. Obtain the number S of power modules;

[0189] S 22. Determine the number N of power supply modules to power each controller based on redundancy requirements;

[0190] S 23. Based on the number of power modules S and the number of power modules N that power each controller, calculate the number of power domains P that need to be set on the backplane PCB: P = S / N;

[0191] S 24. As needed, set the number of power domains to divide each power module into P groups, and set the power modules of each group to be evenly and crosswise arranged in sequence on the backplane PCB along the determined arrangement direction.

[0192] S3. Set the number of power plane layers and ground plane layers on the backplane PCB to be equal and arranged in a cross pattern. Select a power plane layer for routing in each power domain. Connect the routing areas of the same power domain located on different power plane layers through through-holes, and isolate the routing areas of different power domains. The specific steps of step S3 are as follows:

[0193] S 31. Calculate the minimum number of power plane layers L = P required by setting the number of power domains P as needed;

[0194] S 32. Set the number of ground plane layers to be equal to the number of power plane layers, and arrange the power plane layers and ground plane layers in a cross pattern on the backplane PCB;

[0195] S 33. Determine whether the number of power plane layers L is equal to P;

[0196] If so, allocate a power plane layer as a routing area for each power domain and isolate the routing areas of different power domains, then proceed to step S39.

[0197] If not, proceed to step S34;

[0198] S 34. Locate the power modules of a group, locate the outermost power plane layer from the power module side, and locate the outermost power plane layer from the controller side;

[0199] S 35. Routing areas are laid out on the two power plane layers of the location, and the two routing areas are connected by through-holes to form a power domain;

[0200] S 36. Connect each power module of the positioning group to the positioning power plane layer on the power module side, and connect each controller to the positioning power plane layer on the controller side;

[0201] S 37. Determine whether all power modules have been located;

[0202] If so, proceed to step S39;

[0203] If not, proceed to step S38;

[0204] S 38. Locate the power module of the next group, locate the next power plane layer from the power module side inward, and locate the next power plane layer from the controller side inward, then return to step S35;

[0205] S 39. Use ground vias to connect to each ground plane layer.

[0206] Example 5:

[0207] like Figure 5 As shown, the present invention provides a power module and PCB power plane layout method for a multi-power supply system, comprising the following steps:

[0208] S 1. Divide the power modules and controllers into several groups according to redundancy requirements, and set the arrangement direction of the controllers in the same group according to the arrangement direction of each power module in the same group to ensure that the two are consistent.

[0209] S 2. Set the number of power plane layers and ground plane layers of the backplane PCB to be equal and arranged in a cross pattern. On each power plane layer of the backplane PCB, set the routing area for the controller and power module of each power domain, and connect the routing areas of the same power domain as well as isolate the routing areas of different power domains.

[0210] Example 6:

[0211] like Figure 6 As shown, the present invention provides a power module and PCB power plane layout method for a multi-power supply system, comprising the following steps:

[0212] S1. Divide the power modules and controllers into several groups according to redundancy requirements. Set the arrangement direction of the controllers in the same group according to the arrangement direction of the power modules in the same group to ensure that the two are consistent. The specific steps of step S1 are as follows:

[0213] S 11. Obtain the number of power modules S, the number of controllers M, and the number of power domains P that need to be set;

[0214] S 12. Calculate the number of power modules corresponding to each power domain as S / P, and the number of controllers corresponding to each power domain as M / P, and assign the corresponding number of power modules and the corresponding number of controllers to each power domain as a group;

[0215] S 13. Locate a group;

[0216] S 14. Obtain the layout direction of the positioning group's controller along the backplane PCB;

[0217] When each controller is arranged horizontally along one side of the backplane PCB, proceed to step S15;

[0218] When each controller is arranged longitudinally along one side of the backplane PCB, proceed to step S16;

[0219] S15. Determine the power modules of the positioning group to be arranged horizontally on the side of the back panel PCB opposite to the controller, and proceed to step S17;

[0220] S 16. Determine the vertical arrangement of each power module in the positioning group on the side of the back panel PCB opposite to the controller;

[0221] S 17. Determine whether each group has completed its positioning;

[0222] If so, proceed to step S2;

[0223] If not, locate the next group and return to step S14;

[0224] S2. Set the number of power plane layers and ground plane layers on the backplane PCB to be equal and arranged in a cross pattern. On each power plane layer of the backplane PCB, set up routing areas for the controller and power module of each power domain, connect the routing areas of the same power domain, and isolate the routing areas of different power domains; the specific steps of S2 are as follows:

[0225] S 21. Set the number of ground plane layers to be equal to the number of power plane layers, and arrange the power plane layers and ground plane layers in a cross pattern on the backplane PCB;

[0226] S 22. Divide each group into regions, and lay out wiring areas on each power plane layer within the divided regions;

[0227] S 23. The wiring area of ​​the power plane layer on the side of the power module of each group to connect the power module of that group, and the wiring area of ​​the power plane layer on the side of the controller of each group to connect the controller of that group.

[0228] S 24. Isolate power plane layers from different groups, and use through-holes to connect power plane layers from the same group;

[0229] S 25. Use vias to connect all ground plane layers.

[0230] Example 7:

[0231] like Figure 7 As shown, the present invention provides a power module for a multi-power supply system and a PCB power plane layout device, comprising:

[0232] The power module layout direction determination unit is used to determine the layout direction of each power module on the backplane PCB based on the layout direction of each controller, ensuring that the layout directions of both are consistent. The power module layout direction determination unit includes:

[0233] The controller layout direction acquisition subunit is used to acquire the layout direction of each controller along the backplane PCB;

[0234] The power module horizontal arrangement sub-unit is used to determine the horizontal arrangement of each power module on the side of the backplane PCB opposite to the controller when each controller is horizontally arranged along one side of the backplane PCB.

[0235] The power module vertical arrangement sub-unit is used to determine the vertical arrangement of each power module on the side of the backplane PCB opposite to the controller when each controller is arranged vertically along one side of the backplane PCB.

[0236] A power module layout unit is used to divide power modules into several groups according to redundancy requirements, and to arrange the power modules of each group in a cross pattern along the layout direction on the backplane PCB; the power module layout unit includes:

[0237] The power module quantity acquisition subunit is used to acquire the quantity S of the power modules.

[0238] The sub-unit for determining the number of power supply modules for a single controller is used to determine the number N of power supply modules to supply power to each controller based on redundancy requirements.

[0239] The power domain quantity calculation subunit is used to calculate the number of power domains P = S / N that need to be set on the backplane PCB based on the number of power modules S and the number of power modules N that supply power to each controller.

[0240] The power module layout determination subunit is used to divide each power module into P groups as needed by setting the number of power domains, and to set the power modules of each group to be evenly and crosswise arranged in sequence on the backplane PCB along the determined layout direction.

[0241] The first routing area setting unit is used to ensure that the number of power plane layers and ground plane layers on the backplane PCB are equal and arranged in a cross pattern, to select a power plane layer for routing in each power domain, to connect routing areas of the same power domain located on different power plane layers through through-holes, and to isolate routing areas of different power domains; the first routing area setting unit includes:

[0242] The power plane layer number calculation subunit is used to calculate the minimum number of power plane layers L=P that needs to be set based on the number of power domains P as required.

[0243] The first sub-unit for power plane and ground plane is used to set the number of ground plane layers to be equal to the number of power plane layers, and to arrange the power plane layers and ground plane layers in a cross arrangement on the backplane PCB.

[0244] The power plane layer quantity determination sub-unit is used to determine whether the number of power plane layers L is equal to P.

[0245] The power plane layer is a unit cell, used when the number of power plane layers L is equal to P, to allocate a power plane layer as a routing area for each power domain and isolate the routing areas of different power domains.

[0246] The power module and outermost power plane layer positioning subunit is used to locate a group of power modules when the number of power plane layers L is greater than P, to locate the outermost power plane layer from the power module side, and to locate the outermost power plane layer from the controller side.

[0247] The routing area layout sub-unit is used to lay out the routing area on the two power plane layers of the location, and to connect the two routing areas as a power domain using a through-hole.

[0248] The module connection subunit of the power plane layer is used to connect each power module of the positioning group to the power module side positioning power plane layer, and to connect each controller to the controller side positioning power plane layer.

[0249] The power module positioning and judgment subunit is used to determine whether all groups of power modules have been positioned.

[0250] The next power module and corresponding power plane layer positioning subunit is used to position the next group of power modules when the positioning of each group of power modules is not completed, to position the next power plane layer from the power module side inward, and to position the next power plane layer from the controller side inward.

[0251] The ground plane layer connection sub-unit is used to connect various ground plane layers using ground vias.

[0252] Example 8:

[0253] like Figure 8 As shown, the present invention provides a power module for a multi-power supply system and a PCB power plane layout device, comprising:

[0254] The power domain partitioning and power module layout unit is used to divide power modules and controllers into several groups according to redundancy requirements, and to set the layout direction of controllers in the same group according to the layout direction of each power module in the same group, ensuring consistency between the two; the power domain partitioning and power module layout unit includes:

[0255] The power module, controller, and power domain quantity acquisition subunit is used to acquire the number of power modules S, the number of controllers M, and the number of power domains P that need to be set.

[0256] The calculation and grouping of the number of power modules and controllers in a single power domain is used to calculate the number of power modules (S / P) and the number of controllers (M / P) in each power domain, and to assign a corresponding number of power modules and controllers to each power domain as a group.

[0257] Group positioning subunit, used to locate a group;

[0258] A single controller layout direction acquisition subunit is used to acquire the layout direction of the positioning group's controllers along the backplane PCB.

[0259] The power module horizontal layout determination subunit is used to determine the power modules of the horizontal layout positioning group on the side of the backplane PCB opposite to the controller when each controller is horizontally arranged along one side of the backplane PCB.

[0260] The power module longitudinal arrangement determination subunit is used to determine the positioning group of each power module in the longitudinal arrangement on the side of the backplane PCB opposite to the controller when each controller is arranged longitudinally along one side of the backplane PCB.

[0261] The group positioning completion judgment sub-unit is used to determine whether each group has been positioned.

[0262] The next set of positioning sub-units is used to position the next group when the previous group has not been positioned;

[0263] The second routing area setting unit is used to set the number of power plane layers and ground plane layers of the backplane PCB to be equal and arranged in a cross pattern. On each power plane layer of the backplane PCB, routing areas are set for the controller and power module of each power domain, connecting routing areas within the same power domain and isolating routing areas between different power domains. The second routing area setting unit includes:

[0264] The second sub-unit for power plane and ground plane is used to set the number of ground plane layers to be equal to the number of power plane layers, and to arrange the power plane layers and ground plane layers in a cross arrangement on the backplane PCB.

[0265] A single-group routing area layout sub-unit is used to divide the area for each group, and routing areas are laid out on each power plane layer within the divided area;

[0266] A module connection subunit for a single power plane layer is used to connect the power modules of each group to the wiring area of ​​the power plane layer on the side of the power modules of that group, and to connect the controllers of each group to the wiring area of ​​the power plane layer on the side of the controllers of that group.

[0267] Connecting sub-units of the same group of power plane layers are used to isolate power plane layers of different groups, while power plane layers of the same group are connected using through-holes;

[0268] The ground plane layer connection sub-unit is used to connect all ground plane layers using ground vias.

[0269] Although the present invention has been described in detail with reference to the accompanying drawings and preferred embodiments, the invention is not limited thereto. Various equivalent modifications or substitutions can be made to the embodiments of the invention by those skilled in the art without departing from the spirit and essence of the invention, and such modifications or substitutions should all be within the scope of the invention. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the invention should also be covered within the protection scope of the invention. Therefore, the protection scope of the invention should be determined by the scope of the claims.

Claims

1. A multi-power supply system, characterized in that, Includes a backplane PCB, several controllers, and several power modules; The arrangement direction of each power module is consistent with the arrangement direction of each controller; The power modules are divided into several groups according to the number of controllers, and the power modules of different groups are evenly and crosswise arranged along the layout direction. The backplane PCB is divided into several power domains; Each controller is connected to each power module in each group through the routing area on the backplane PCB, and the routing areas corresponding to the power modules in the same group are located in the same power domain of the backplane PCB. The number of power plane layers and ground plane layers on the backplane PCB are equal and they are arranged in a cross pattern. Trace areas in the same power domain located on different power plane layers are connected by through-holes; The trace areas of each power plane layer belonging to the same power domain are equal in area and parallel to each other; The power plane layers of different power domains are isolated from each other.

2. A multi-power supply system, characterized in that, Includes a backplane PCB, several controllers, and several power modules; The controllers and power modules are divided into several groups according to their quantity. The arrangement direction of each power module in the same group is the same as the arrangement direction of each controller in the same group. The backplane PCB is divided into several power domains; Each controller in the same group is connected to each power module in the same group through the routing area on the backplane PCB, and the routing areas corresponding to the power modules in the same group are located in the same power domain of the backplane PCB. The number of power plane layers and ground plane layers on the backplane PCB are equal and they are arranged in a cross pattern. The routing areas of the same power domain are set on each power plane layer and connected by through-holes; The routing areas of different power domains are isolated from each other.

3. A method for arranging power modules and PCB power planes in a multi-power supply system as described in claim 1, characterized in that, Includes the following steps: S1. On the backplane PCB, determine the arrangement direction of each power module according to the arrangement direction of each controller, and ensure that the arrangement directions of both are consistent. S2. Divide the power modules into several groups according to redundancy requirements, and arrange the power modules of each group in a cross pattern on the backplane PCB along the layout direction. S3. Set the number of power plane layers and ground plane layers on the backplane PCB to be equal and arranged in a cross pattern. Select a power plane layer for each power domain to lay out the routing area. Set the routing areas of the same power domain located on different power plane layers to be connected through current-passing vias, and isolate the routing areas of different power domains.

4. The power module and PCB power plane layout method for a multi-power supply system as described in claim 3, characterized in that, The specific steps of step S1 are as follows: S11. Obtain the layout direction of each controller along the backplane PCB; When each controller is arranged horizontally along one side of the backplane PCB, proceed to step S12; When each controller is arranged longitudinally along one side of the backplane PCB, proceed to step S13; S12. Determine that each power module is arranged horizontally on the side of the backplane PCB opposite to the controller, and proceed to step S2; S13. Determine the vertical arrangement of each power module on the side of the backplane PCB opposite to the controller.

5. The power module and PCB power plane layout method for a multi-power supply system as described in claim 3, characterized in that, The specific steps of step S2 are as follows: S21. Obtain the number S of power modules; S22. Determine the number N of power supply modules to supply power to each controller based on redundancy requirements; S23. Based on the number of power modules S and the number of power modules N that supply power to each controller, calculate the number of power domains P that need to be set on the backplane PCB: P = S / N; S24. As needed, set the number of power domains to divide each power module into P groups, and set the power modules of each group to be evenly and crosswise arranged in sequence on the backplane PCB along the determined arrangement direction.

6. The power module and PCB power plane layout method for a multi-power supply system as described in claim 3, characterized in that, The specific steps of step S3 are as follows: S31. Calculate the minimum number of power plane layers L = P required by setting the number of power domains P as needed; S32. Set the number of ground plane layers to be equal to the number of power plane layers, and arrange the power plane layers and ground plane layers in a cross pattern on the backplane PCB; S33. Determine whether the number of power plane layers L is equal to P; If so, allocate a power plane layer as a routing area for each power domain and isolate the routing areas of different power domains, then proceed to step S39. If not, proceed to step S34; S34. Locate the power modules of a group, locate the outermost power plane layer from the power module side, and locate the outermost power plane layer from the controller side; S35. Routing areas are laid out on the two power plane layers of the location, and the two routing areas are connected by a current-through via to form a power domain; S36. Connect each power module of the positioning group to the positioning power plane layer on the power module side, and connect each controller to the positioning power plane layer on the controller side; S37. Determine whether all power modules have been located; If so, proceed to step S39; If not, proceed to step S38; S38. Locate the power module of the next group, locate the next power plane layer from the power module side inward, and locate the next power plane layer from the controller side inward, then return to step S35; S39. Use ground vias to connect to each local plane layer.

7. A power module and PCB power plane arrangement method for a multi-power supply system as described in claim 2, characterized in that, Includes the following steps: S1. Divide the power modules and controllers into several groups according to redundancy requirements, and set the arrangement direction of the controllers in the same group according to the arrangement direction of each power module in the same group to ensure that the two are consistent. S2. Set the number of power plane layers and ground plane layers of the backplane PCB to be equal and arranged in a cross pattern. On each power plane layer of the backplane PCB, set the routing area for the controller and power module of each power domain, connect the routing areas of the same power domain, and isolate the routing areas of different power domains.

8. The power module and PCB power plane layout method for a multi-power supply system as described in claim 7, characterized in that, The specific steps of step S1 are as follows: S11. Obtain the number of power modules S, the number of controllers M, and the number of power domains P that need to be set; S12. Calculate the number of power modules corresponding to each power domain as S / P, and the number of controllers corresponding to each power domain as M / P, and assign the corresponding number of power modules and the corresponding number of controllers to each power domain as a group; S13. Locate a group; S14. Obtain the layout direction of the positioning group's controller along the backplane PCB; When each controller is arranged horizontally along one side of the backplane PCB, proceed to step S15; When each controller is arranged longitudinally along one side of the backplane PCB, proceed to step S16; S15. Determine the power modules of the positioning group arranged horizontally on the side of the back panel PCB opposite to the controller, and proceed to step S17; S16. Determine the vertical arrangement of each power module in the positioning group on the side of the backplane PCB opposite to the controller; S17. Determine whether each group has completed its positioning; If so, proceed to step S2; If not, locate the next group and return to step S14; The specific steps for S2 are as follows: S21. Set the number of ground plane layers to be equal to the number of power plane layers, and arrange the power plane layers and ground plane layers in a cross pattern on the backplane PCB; S22. Divide each group into regions, and lay out routing areas on each power plane layer within each region; S23. The wiring area of ​​the power plane layer on the side of the power module of each group is connected to the power module of that group, and the wiring area of ​​the power plane layer on the side of the controller of each group is connected to the controller of that group. S24. Isolate power plane layers from different groups, and connect power plane layers from the same group using through-hole vias; S25. Use vias to connect all ground plane layers.

9. A power module and PCB power plane layout device for a multi-power supply system as described in claim 1, characterized in that, include: The power module layout direction determination unit is used to determine the layout direction of each power module on the backplane PCB according to the layout direction of each controller, so as to ensure that the layout directions of the two are consistent. The power module layout unit is used to divide the power modules into several groups according to redundancy requirements, and arrange the power modules of each group in a cross pattern on the backplane PCB along the layout direction. The first routing area setting unit is used to set the number of power plane layers and ground plane layers of the backplane PCB to be equal and arranged in a cross pattern, select power plane layers for routing areas of each power domain, set routing areas of the same power domain located on different power plane layers to be connected through current-passing vias, and isolate routing areas of different power domains.

10. A power module and PCB power plane layout device for a multi-power supply system as described in claim 2, characterized in that, include: The power domain partitioning and power module layout unit is used to divide power modules and controllers into several groups according to redundancy requirements, and set the layout direction of controllers in the same group according to the layout direction of each power module in the same group to ensure that the two are consistent. The second routing area setting unit is used to set the number of power plane layers and ground plane layers of the backplane PCB to be equal and arranged in a cross pattern. On each power plane layer of the backplane PCB, routing areas are set for the controller and power module of each power domain, and routing areas of the same power domain are connected, as well as routing areas of different power domains are isolated.

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