A server architecture

Abstract

The application discloses a kind of server architecture, it is related to server technical field.The server architecture includes first unit module, second unit module and third unit module in turn from front to back.The first unit module includes hard disk board, and the hard disk board is provided with fan module group and hard disk module group.The second unit module includes mainboard, and the mainboard is provided with M.2 module, memory and CPU module.The third unit module includes signal board, and the signal board is provided with PCIE card, OCP network card and SCM card.The hard disk board and mainboard are connected by first connecting assembly and first power connector, and the signal board and mainboard are connected by second connecting assembly and second power connector.PSU module is provided on the mainboard or AC / DC module is provided on the signal board.The server architecture adopts multi-section type board card architecture design, so that the conversion between different configurations is simpler and more convenient, and it is also beneficial to reduce maintenance cost.

Description

Technical Field

[0001] This invention relates to the field of server technology, and more specifically to a server architecture. Background Technology

[0002] Currently, mainstream 1U and 2U servers are equipped with a single motherboard, and other functions require expansion based on this motherboard. However, concentrating all functions on a single motherboard presents several problems:

[0003] First, if a function malfunctions, the entire motherboard must be replaced, resulting in high maintenance costs.

[0004] Secondly, it cannot easily switch server configurations according to customer needs. Summary of the Invention

[0005] To address the aforementioned issues, this application provides a server architecture that employs a multi-segment board architecture design, making the conversion between different configurations simpler and more convenient, while also helping to reduce maintenance costs.

[0006] The technical solution adopted by this invention to solve its technical problem is:

[0007] A server architecture, comprising, from front to back, a first unit module, a second unit module, and a third unit module;

[0008] The first unit module includes a hard disk board, on which a fan module and a hard disk module are provided;

[0009] The second unit module includes a motherboard, on which an M.2 module, memory, and a CPU module are mounted;

[0010] The third unit module includes a signal board, which is equipped with a PCIE card, an OCP network card, and an SCM card.

[0011] The hard disk board and the motherboard are connected via a first connecting component and a first power connector, and the signal board and the motherboard are connected via a second connecting component and a second power connector.

[0012] The motherboard is equipped with a PSU module or the signal board is equipped with an AC / DC module.

[0013] Furthermore, both the first and second connecting components employ high-density connectors.

[0014] Furthermore, several high-density connectors used to connect the motherboard and the hard drive board are arranged in a straight line along the width of the chassis, and several high-density connectors used to connect the motherboard and the signal board are also arranged in a straight line along the width of the chassis.

[0015] Furthermore, the motherboard is located above the hard disk board and the signal board, and the high-density connectors located between the hard disk board, the signal board and the motherboard are connected by an up-and-down plugging method.

[0016] Furthermore, a support column for supporting the motherboard is provided on the bottom surface of the chassis below the motherboard.

[0017] Furthermore, the chassis is provided with a disassembly aid, which includes a hinge block that is hinged to the chassis in the middle. The inner end of the hinge block extends to the bottom of the motherboard. When the motherboard needs to be disassembled, the outer end of the hinge block is pressed down, thereby causing the inner end of the hinge block to tilt upward and lift the motherboard, thus realizing the disassembly of the motherboard.

[0018] Furthermore, an operating plate is provided at the outer end of the hinge block, and the suspended end of the operating plate extends through the side wall of the chassis to the outside of the chassis. The side wall of the chassis is provided with a clearance hole for accommodating the operating plate.

[0019] Furthermore, the inner end of the hinge block is provided with an upwardly protruding lifting protrusion.

[0020] Furthermore, the hard disk board is connected to the backplane of the hard disk module via several high-density connectors.

[0021] Furthermore, the motherboard is optionally equipped with an OCP network card.

[0022] The beneficial effects of this invention are:

[0023] This application provides a server architecture that adopts a multi-segment board architecture design, enabling product modularization and interchangeability of functional area blocks, making the conversion between different server configurations simpler and more convenient. Furthermore, because the server architecture provided in this application adopts a multi-segment board architecture design, if one board is damaged, only that board needs to be replaced, eliminating the need to replace all boards and saving maintenance costs. Attached Figure Description

[0024] Figure 1 A top view of a server architecture provided in Embodiment 1 of this application;

[0025] Figure 2 A three-dimensional structural diagram of a server architecture provided in Embodiment 1 of this application;

[0026] Figure 3 This is a three-dimensional structural diagram of a server architecture after the chassis has been removed, as provided in Embodiment 1 of this application.

[0027] Figure 4 for Figure 3 A magnified structural diagram of part A in the middle;

[0028] Figure 5 for Figure 3 Exploded view;

[0029] Figure 6 This is a three-dimensional structural diagram of the signal board section;

[0030] Figure 7 This is an exploded view of the hard disk board section;

[0031] Figure 8 This is a three-dimensional structural diagram of the motherboard.

[0032] Figure 9 Schematic diagram of the installation structure for disassembling auxiliary components Figure 1 ;

[0033] Figure 10 Schematic diagram of the installation structure for disassembling auxiliary components Figure 2 ;

[0034] Figure 11 A three-dimensional structural diagram of the disassembly auxiliary components;

[0035] Figure 12 This is a three-dimensional structural diagram of a server architecture provided in Embodiment 2 of this application.

[0036] In the diagram: 1. First unit module; 11. Hard disk board; 12. Fan module; 13. Hard disk module; 131. Backplane; 1311. Male terminal of the third high-density connector; 14. Female terminal of the first high-density connector; 15. Male terminal of the first power connector; 16. Female terminal of the third high-density connector.

[0037] 2. Second unit module; 21. Motherboard; 22. M.2 module; 23. Memory; 24. CPU module; 25. First high-density connector male terminal; 26. Second high-density connector male terminal; 27. First power connector female terminal; 28. Second power connector female terminal; 29. ​​Second OCP network card;

[0038] 3. Third Unit Module; 31. Signal Board; 321. First PCIe Card; 322. Second PCIe Card; 323. Third PCIe Card; 324. Fourth PCIe Card; 33. First OCP Network Card; 34. SCM Card; 35. Second High-Density Connector Female Terminal; 36. Second Power Connector Male Terminal;

[0039] 41. PSU module; 42. AC / DC module;

[0040] 5. Chassis; 51. Clearance hole; 52. Hinge plate;

[0041] 6. Disassembly auxiliary parts; 61. Hinge block; 611. Operating panel; 6111. Horizontal part; 6112. Vertical part; 6113. Connecting part; 612. Lifting protrusion; 62. Hinge shaft;

[0042] 7. Support columns. Detailed Implementation

[0043] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be described in detail below with reference to the accompanying drawings. The described embodiments are merely a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort should fall within the protection scope of this application.

[0044] For ease of description, the coordinate system is defined as follows: Figure 2 As shown, the left and right directions are horizontal, the front and back directions are vertical, and the up and down directions are vertical.

[0045] Example 1

[0046] like Figure 1 , Figure 2 and Figure 3 As shown, a server architecture includes, from front to back, a first unit module 1, a second unit module 2, and a third unit module 3.

[0047] The first unit module 1 includes a hard disk drive 11, which is fixedly installed inside the chassis 5. The hard disk drive 11 is equipped with a fan module 12 and a hard disk module 13. The second unit module 2 includes a motherboard 21 fixedly installed inside the chassis 5. The motherboard 21 is equipped with an M.2 module 22, memory 23, and a CPU module 24. The third unit module 3 includes a signal board 31 fixedly installed inside the chassis 5. The signal board 31 is equipped with a PCIe card, an OCP network card, and an SCM card 34. The motherboard 21 is equipped with a PSU module 41, or the signal board 31 is equipped with an AC / DC module 42. Both the PSU module 41 and the AC / DC module 42 are used to convert external standard AC power into DC power.

[0048] In one specific implementation, the component used to convert external standard alternating current into direct current in this embodiment is an AC / DC module 42, which is mounted on the signal board 31.

[0049] The hard disk board 11 and the motherboard 21 are connected via a first connecting component and a first power connector. The first connecting component is used for signal interaction between the hard disk board 11 and the motherboard 21, thereby achieving heat dissipation and storage scheduling. The first power connector is used for power transmission between the hard disk board 11 and the motherboard 21.

[0050] The signal board 31 and the motherboard 21 are connected via a second connecting component and a second power connector. The second connecting component is used for signal interaction between the signal board 31 and the motherboard 21, thereby enabling information interaction between various network cards. The second power connector is used for power transmission between the signal board 31 and the motherboard 21.

[0051] This architecture enables the independence of different modules. If there is a need to change the configuration, modules with different functions can be directly replaced, which makes it convenient to switch between different configurations.

[0052] Furthermore, both the first and second connection components employ high-density connectors, meaning that the hard disk board 11 and the motherboard 21, as well as the motherboard 21 and the signal board 31, achieve signal interaction between them through high-density connectors.

[0053] By using high-density connectors between boards for interconnection, compared to external cable laying, the internal space of chassis 5 can be optimized. This solves the problems of excessive cables in chassis 5, which cause congestion and hinder assembly and later maintenance, as well as signal attenuation caused by excessive cable length.

[0054] Here, the first and second connecting components can also be installed using external cables.

[0055] As one specific implementation method, such as Figure 4 , Figure 5 and Figure 8 As shown, in this embodiment, the motherboard 21 is located above the hard disk board 11 and the signal board 31. The male and female ends of the high-density connector located between the hard disk board 11 and the motherboard 21 are connected by an up-and-down insertion method. The male and female ends of the high-density connector located between the signal board 31 and the motherboard 21 are connected by an up-and-down insertion method.

[0056] For ease of description, the high-density connector used to connect the hard disk board 11 and the motherboard 21 is defined as the first high-density connector, and the high-density connector used to connect the motherboard 21 and the signal board 31 is defined as the second high-density connector. For example, the first high-density connector includes a male terminal 25 and a female terminal 14. The male terminal 25 is located on the lower side of the motherboard 21 facing the hard disk board 11, and the female terminal 14, which mates with the male terminal 25, is located on the upper side of the hard disk board 11 facing the motherboard 21. The second high-density connector includes a male terminal 26 and a female terminal 35. The male terminal 26 is located on the lower side of the motherboard 21 facing the signal board 31, and the female terminal 35, which mates with the male terminal 26, is located on the upper side of the signal board 31 facing the motherboard 21.

[0057] Furthermore, several high-density connectors located between the motherboard 21 and the hard disk board 11 are arranged in a straight line along the width direction of the chassis 5; several high-density connectors located between the motherboard 21 and the signal board 31 are also arranged in a straight line along the width direction of the chassis 5. That is, several of the first high-density connectors are arranged in a straight line along the width direction of the chassis 5, and several of the second high-density connectors are arranged in a straight line along the width direction of the chassis 5.

[0058] Here, the number of high-density connectors needs to be designed according to the data transmission volume. In one specific embodiment, five high-density connectors are provided between the motherboard 21 and the hard disk board 11, and seven high-density connectors are provided between the motherboard 21 and the signal board 31.

[0059] For example, both the first power connector and the second power connector are located in the middle of the chassis 5 along its width. The first power connector includes a male terminal 15 and a female terminal 27. The male terminal 15 is disposed on the upper side of the hard disk board 11 facing the motherboard 21, and the female terminal 27 is disposed on the lower side of the motherboard 21 facing the hard disk board 11. The second power connector includes a male terminal 36 and a female terminal 28. The male terminal 36 is disposed on the upper side of the signal board 31 facing the motherboard 21, and the female terminal 28 is disposed on the lower side of the motherboard 21 facing the signal board 31.

[0060] like Figure 6As shown, a plurality of PCIe cards extending along the length of the chassis 5 are arranged on one end of the signal board 31 facing away from the motherboard 21. In one specific embodiment, the signal board 31 in this embodiment has four PCIe cards, and the four PCIe cards are evenly arranged along the width of the chassis 5.

[0061] For ease of description, the four PCIe cards are named, from left to right, as PCIe card 321, PCIe card 322, PCIe card 323, and PCIe card 324. The OCP network card is located between PCIe card 321 and PCIe card 322, the SCM card 34 is located between PCIe card 323 and PCIe card 324, and the AC / DC module 42 is located between PCIe card 322 and PCIe card 323.

[0062] like Figure 7 As shown, the hard disk board 11 is provided with a hard disk module 13 and a fan module 12 arranged sequentially from front to back, and the second high-density connector female end 35 is located on the rear side of the fan module 12.

[0063] Furthermore, the hard disk board 11 is connected to the backplane 131 of the hard disk module 13 via a plurality of high-density connectors, thereby realizing storage scheduling. For ease of description, the high-density connector used to connect the hard disk board 11 and the backplane 131 is defined as a third high-density connector, and the plurality of the third high-density connectors are arranged in a straight line along the width direction of the chassis 5. The third high-density connector includes a third high-density connector male end 1311 and a third high-density connector female end. The third high-density connector male end 1311 is disposed on the backplane 131 of the hard disk module 13, and the third high-density connector female end 16 is disposed on the front end of the hard disk board 11.

[0064] Furthermore, such as Figure 4 and Figure 8 As shown, a support column 7 for supporting the motherboard 21 is provided on the bottom surface of the chassis 5 below the motherboard 21. In one specific embodiment, the lower end of the support column 7 is fixedly connected to the bottom plate of the chassis 5 by anchoring.

[0065] Furthermore, the main board 21 is fixedly connected to the support column 7 by screws. The main board 21 is provided with a through hole for receiving the screws, and the upper end face of the support column 7 is provided with a threaded hole that mates with the screws.

[0066] Furthermore, for ease of disassembly, such as Figure 9 and Figure 10As shown, the chassis 5 is provided with a disassembly aid 6 for assisting in the disassembly of the motherboard 21.

[0067] like Figure 9 , Figure 10 and Figure 11 As shown, the disassembly aid 6 includes a hinge block 61. The middle part of the hinge block 61 is hinged to the chassis 5 via a hinge shaft 62. The inner end of the hinge block 61 (with the end closest to the inside of the chassis 5 as the inner end) extends to below the edge of the motherboard 21. An operation plate 611 is provided at the outer end of the hinge block 61, and the suspended end of the operation plate 611 extends through the side wall of the chassis 5 to the outside of the chassis 5. A clearance hole 51 for accommodating the operation plate 611 is provided on the side wall of the chassis 5. For example, the clearance hole 51 has a square structure.

[0068] When it is necessary to disassemble the motherboard 21, press down on the operating plate 611, causing the inner end of the hinge block 61 to tilt upwards. The lifting action of the inner end of the hinge block 61 pushes the motherboard 21 upwards, separating the high-density connectors between the motherboard 21 and the hard disk board 11 and the signal board 31, thus completing the disassembly of the motherboard 21. The disassembly aid 6, using a lever principle to lift the motherboard 21, solves the problem of the high-density connectors being difficult to remove.

[0069] In one specific embodiment, a hinge plate 52 is provided on the inner side of the side wall of the chassis 5, located in front of or behind the clearance hole 51. The hinge block 61 is rotatably connected to the hinge plate 52 via a hinge shaft 62. For example, one end of the hinge shaft 62 is fixedly connected to the hinge plate 52 by anchoring, and the mounting plate is located in front of the clearance hole 51.

[0070] Furthermore, such as Figure 9 and Figure 11 As shown, the inner end of the hinge block 61 is provided with an upwardly protruding lifting protrusion 612, and the upper end of the lifting protrusion 612 abuts against the lower side surface of the motherboard 21. By providing the lifting protrusion 612, the contact area between the hinge block 61 and the motherboard 21 can be reduced, thus preventing the hinge block 61 from damaging the components on the motherboard 21 during operation.

[0071] Furthermore, such as Figure 10 and Figure 11As shown, the operation panel 611 includes a horizontal portion 6111 extending outwards, and a vertical portion 6112 extending upwards perpendicularly to the horizontal portion 6111 at its suspended end. This allows the vertical portion 6112 of the operation panel 611 to be parallel to the side wall of the chassis 5, which helps to reduce the overall width of the server, making the overall shape more regular and facilitating packaging, transportation, and installation.

[0072] In one specific embodiment, the operation plate 611 in this embodiment further includes a connecting portion 6113 located at the outer end of the hinge and extending upward perpendicularly to the hinge block 61, and the inner end of the horizontal portion 6111 is connected to the upper end of the connecting portion 6113. This operation plate 611 exhibits a double-bent state.

[0073] Furthermore, such as Figure 5 As shown, the motherboard 21 is equipped with an OCP network card.

[0074] For ease of description, the OCP network card located on the signal board 31 is defined as the first OCP network card 33, and the OCP network card located on the motherboard 21 is defined as the second OCP network card 29.

[0075] In one specific implementation, the second OCP network card 29 described in this embodiment is disposed at the end of the motherboard 21 facing the signal board 31, and the second OCP network card 29 extends rearward between the third PCIe card 323 and the fourth PCIe card 324. Since the motherboard 21 and the signal board 31 are connected by a top-to-bottom plug-in method, with the motherboard 21 located above the signal board 31, there is a height difference between them. Thus, although the second OCP network card 29 extends above the signal board 31, it will not interfere with the components on the signal board 31, thereby fully utilizing the empty space above the signal board 31 and improving space utilization.

[0076] Here, the OCP network card on the motherboard 21 is optional and can be configured according to the customer's actual needs.

[0077] Example 2

[0078] like Figure 12 As shown, the component used to convert external standard AC power into DC power is a PSU module 41. The PSU module 41 is located at one end of the motherboard 21 facing the signal board 31, and the PSU module 41 extends rearward between the second PCIe card 322 and the third PCIe card 323.

[0079] The motherboard 21 does not have an OCP network card.

[0080] The rest of the structure is the same as in Example 1.

[0081] Example 3

[0082] Hinges 52 are provided on the inner side surface of the side wall of the chassis 5, both in front of and behind the clearance hole 51. The two ends of the hinge shaft 62 are detachably connected to the hinge plates 52. In one specific embodiment, the two ends of the hinge shaft 62 are fixedly connected to the hinge plates 52 by screws.

[0083] The rest of the structure is the same as in Example 1.

[0084] Example 4

[0085] The chassis 5 is provided with four disassembly aids 6, and the four disassembly aids 6 are respectively located at the four corners of the motherboard 21. That is, two disassembly aids 6 are provided on the left and right sides of the chassis 5, and the two disassembly aids 6 on the same side are respectively located at the front and rear ends of the motherboard 21.

[0086] The rest of the structure is the same as in Example 1.

[0087] Other embodiments obtained by those skilled in the art based on the embodiments provided in this application by combining, splitting, or reorganizing the embodiments of this application do not exceed the protection scope of this application.

[0088] The above detailed embodiments have provided a detailed explanation of the purpose, technical solutions, and beneficial effects of the embodiments of this application. The above are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. That is, any modifications, equivalent substitutions, improvements, etc., made on the basis of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A server architecture, characterized in that: From front to back, it includes the first unit module (1), the second unit module (2), and the third unit module (3). The first unit module (1) includes a hard disk board (11), on which a fan module (12) and a hard disk module (13) are provided. The second unit module (2) includes a motherboard (21), on which an M.2 module (22), a memory (23) and a CPU module (24) are provided. The third unit module (3) includes a signal board (31), on which a PCIE card, an OCP network card and an SCM card (34) are provided. The hard disk board (11) and the motherboard (21) are connected by a first connecting component and a first power connector, and the signal board (31) and the motherboard (21) are connected by a second connecting component and a second power connector. The motherboard (21) is provided with a PSU module (41) or the signal board (31) is provided with an AC / DC module (42). Both the first and second connecting components use high-density connectors. The motherboard (21) is located above the hard disk board (11) and the signal board (31), and the high-density connectors between the hard disk board (11), the signal board (31) and the motherboard (21) are connected by a top-to-bottom plugging method; The chassis (5) is provided with a disassembly aid (6). The disassembly aid (6) includes a hinge block (61) that is hinged to the chassis (5) in the middle. The inner end of the hinge block (61) extends to the bottom of the motherboard (21). When the motherboard (21) needs to be disassembled, the outer end of the hinge block (61) is pressed down, so that the inner end of the hinge block (61) is tilted up to lift the motherboard (21) and thus disassemble the motherboard (21).

2. The server architecture according to claim 1, characterized in that: Several high-density connectors for connecting the motherboard (21) and the hard disk board (11) are arranged in a straight line along the width direction of the chassis (5), and several high-density connectors for connecting the motherboard (21) and the signal board (31) are arranged in a straight line along the width direction of the chassis (5).

3. The server architecture according to claim 1, characterized in that: A support column (7) for supporting the motherboard (21) is provided on the bottom surface of the chassis (5) below the motherboard (21).

4. A server architecture according to claim 1, characterized in that: An operating plate (611) is provided at the outer end of the hinge block (61), and the suspended end of the operating plate (611) extends through the side wall of the chassis (5) to the outside of the chassis (5). A clearance hole (51) for accommodating the operating plate (611) is provided on the side wall of the chassis (5).

5. A server architecture according to claim 1, characterized in that: The inner end of the hinge block (61) is provided with an upwardly protruding lifting protrusion (612).

6. A server architecture according to claim 1, characterized in that: The hard disk board (11) is connected to the back plate (131) of the hard disk module (13) through a number of high-density connectors.

7. A server architecture according to claim 1, characterized in that: The motherboard (21) is equipped with an OCP network card.

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