带线结构、带线结构制作方法及其电子装置
By introducing additional ground layers or ground wires into the stripline structure, a multilayer structure with dielectric material isolation is formed, which solves the impact of voltage source noise on the signal transmission path and improves the reliability and stability of signal transmission.
CN116665983BActive Publication Date: 2026-07-17WISTRON CORP
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- WISTRON CORP
- Filing Date
- 2022-04-02
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
High-speed signal transmission paths on circuit boards are susceptible to voltage source noise, which reduces the reliability of signal transmission.
Method used
By introducing additional ground layers or ground wires into the stripline structure, a multilayer structure with dielectric material isolation is formed to reduce power supply noise coupling to the signal transmission path.
Benefits of technology
It improves the reliability of signal transmission, reduces the interference of power supply noise on the signal, and enhances the stability of signal transmission.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116665983B_ABST
Abstract
本发明公开了一种带线结构、带线结构制作方法及其电子装置，其中带线结构包含有一第一地层，形成于一第一层；一第二地层，形成于一第二层；一第一电源层，形成于该第一层，其中该第一地层及该第一电源层以一电介质材料相区隔；一带线，形成于一第三层，用于信号传输，其中该第三层在该第一层与该第二层之间；一地线，形成于该第三层，其中该地线及该带线以该电介质材料相区隔；一第一导孔，用来电性连接该第一地层及该第二地层；以及一第二导孔，用来电性连接该地线及该第二地层。本发明可以抑制电压源的电流传送路径耦合至高速信号传输路径的噪声。
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