Film-shaped adhesive, adhesive sheet, and semiconductor device and method for manufacturing the same

Abstract

Disclosed is a film-shaped adhesive for bonding a semiconductor element and a support member on which the semiconductor element is mounted. The film-shaped adhesive contains a thermosetting resin, a curing agent, and an elastomer. The elastomer includes an elastomer satisfying the following condition (i) and the following condition (ii). Condition (i): glass transition temperature is 12°C or higher; and condition (ii): weight average molecular weight is 800,000 or lower.

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