Quality improvement assisting apparatus

Abstract

A quality improvement assisting apparatus that assists in quality improvement of products manufactured by a manufacturing apparatus, characterized by having a display section that displays manufacturing condition information that is quality information related to the quality that occurs or is detected in a manufacturing process of the manufacturing apparatus, and manufacturing members or components included in the manufacturing apparatus, and is configured in a time series, in which the quality information associated with the manufacturing members or components included in the manufacturing apparatus is arranged in order of manufacturing the products, for each one or more of the products.

Description

Technical Field

[0001] This invention relates to a quality improvement auxiliary device for improving the quality of products such as printed circuit boards. Background Technology

[0002] In the past, as a management aid for analyzing the causes of defects and errors in manufacturing equipment used to manufacture printed circuit boards and the like, devices have been proposed that display defects and errors in various ways. For example, there are devices that only display inspection results or only display installation errors.

[0003] On the other hand, as a management aid that takes into account the passage of time, the device described in Patent Document 1 is proposed. Here, the time axis of each process is displayed vertically, and multiple processes performed sequentially are arranged from left to right so that the time axes of each process are parallel. Then, marks extending in the time axis direction with a width corresponding to the manufacturing start time and manufacturing end time of each process of a product are displayed on the time axis of each process. The manufacturing start time and manufacturing end time of consecutive processes are connected and displayed with line segments, and identification codes (pins) indicating errors that occur in each process are arranged on the time axis.

[0004] However, in this management aid, when multiple defects or errors occur, it is unknown whether they occur at the same time or on the same substrate. Furthermore, it is unknown whether the defects or errors occur continuously or sporadically, concentrated at specific times / on specific substrates. Also, it is unknown whether a particular defect or error occurred suddenly or if the process has already ended.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent No. 6287018 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] The present invention was made in view of the above-mentioned problems, and its object is to provide a technology that can perform cause analysis and countermeasure determination when multiple defects and errors occur in manufacturing equipment in a short time.

[0010] Methods for solving problems

[0011] The present invention, intended to address the aforementioned issues, is a quality improvement auxiliary device that assists in improving the quality of products manufactured by manufacturing equipment. The device is characterized by having a display unit that displays manufacturing status information. This manufacturing status information is generated by associating quality information related to the quality that occurs or is detected during the manufacturing process of the manufacturing equipment with manufacturing components or parts included in the manufacturing equipment. The quality information is configured in a time sequence, and for each unit product, the quality information is configured according to the order in which the product is manufactured. Each unit product is one or more of the aforementioned products.

[0012] According to the manufacturing status information of the present invention, since quality information is associated with each of one or more products (i.e., unit products) and arranged in the order of product manufacturing, it is possible to identify the temporal variation of quality information based on sequentially manufactured unit products, on a unit basis, for one or more products. Even in the event of multiple errors, the range of causes for these anomalies can be narrowed down based on the temporal variation of quality information associated with the manufacturing component or part and based on sequentially manufactured unit products. Furthermore, it is possible to grasp temporal trends such as suddenness and persistence. Therefore, even when multiple defects or errors occur, the causes influencing such temporal trends can be distinguished, enabling cause analysis and countermeasure decisions to be made in a short time.

[0013] Furthermore, in this invention, the quality information for the same unit product may be configured at the same position in the time series for each of the plurality of manufacturing components or parts associated with the unit product.

[0014] Therefore, it is possible not only to identify temporal variations in quality information based on sequentially manufactured unit products for each manufacturing component or part, but also to identify variations in quality information occurring within the same unit product during the manufacturing process, since multiple related manufacturing components or parts also place quality information for the same unit product at the same position in the time sequence. In the event of multiple errors, the cause of these anomalies can be identified as a result of an anomaly in a device upstream of the production line leading to an anomaly in a device downstream, narrowing down the range of devices that could be the cause of the anomalies. Therefore, it is possible to conduct root cause analysis and determine countermeasures when multiple defects or errors occur in a short period of time.

[0015] Here, when displaying quality information associated with multiple manufacturing components or parts, the multiple manufacturing components or parts can be configured according to the flow of a unit product in the manufacturing process, or they can be configured in summary according to each function of the manufacturing component or part.

[0016] Furthermore, in this invention, the quality information may also include multiple types of quality information, and the quality information may be displayed in different display methods according to each type.

[0017] Therefore, because it is possible to clearly identify the temporal changes in various quality information, it is possible to conduct more efficient cause analysis and countermeasure decisions when multiple defects and errors occur.

[0018] Furthermore, in this invention, event information representing an event occurring or being performed with respect to the manufactured component or part may be configured in a time sequence together with the quality information, based on the timing of the occurrence or execution of the event and the sequential relationship between the quality information occurring or being detected in association with the manufactured component or part.

[0019] Therefore, since events that may cause defects or errors, or that may reduce defects or errors, are also displayed along with quality information, it is possible to more efficiently analyze the causes and decide on countermeasures when multiple defects or errors occur.

[0020] Alternatively, in this invention, the quality information may be displayed in association with the markings by arranging the markings in the time axis direction specified for each of the manufactured components or parts associated with the quality information, representing one or more of the products.

[0021] Therefore, because it is possible to visually and clearly identify the relationship between manufacturing components or parts, one or more products and the manufacturing sequence, it is possible to distinguish the causes of the effects of temporal trends such as suddenness and persistence, and to more efficiently conduct cause analysis and countermeasure decisions when multiple defects and errors occur.

[0022] Furthermore, in this invention, the manufacturing status information may also include elapsed quality information configured according to a time sequence as the elapsed time within a specified period, the elapsed quality information being information about the quality that occurs or is detected in association with the manufactured component or part.

[0023] Therefore, since it is possible to identify changes in quality information based on time performance that differs from those based on the order of manufacturing units, it is possible to more efficiently analyze the causes and determine countermeasures when multiple defects or errors occur. This time-based quality information and the aforementioned manufacturing status information configured according to the manufacturing order for each unit product can be displayed on different screens of the display unit, or they can be displayed on the same screen. When this information is displayed on the same screen, by ensuring consistency in the time range, it is possible to more efficiently analyze the causes and determine countermeasures.

[0024] Furthermore, in this invention, the elapsed quality information, with the elapsed time within the specified period as the horizontal axis, may be arranged longitudinally for each of the plurality of manufacturing components or parts.

[0025] Therefore, since it is possible to identify changes in quality information that occur simultaneously during the manufacturing process, it is possible to narrow down the range of causes of changes that occur simultaneously in various manufacturing components or parts, thus enabling more efficient cause analysis and countermeasure decisions when multiple defects or errors occur.

[0026] Invention Effects

[0027] According to the present invention, it is possible to perform cause analysis and countermeasure determination when multiple defects and errors occur in manufacturing equipment in a short time. Attached Figure Description

[0028] Figure 1 This is a diagram illustrating a schematic structure of a manufacturing apparatus according to an embodiment of the present invention.

[0029] Figure 2 This is a functional block diagram of the management device according to an embodiment of the present invention.

[0030] Figure 3 This is a functional block diagram of a manager's terminal according to an embodiment of the present invention.

[0031] Figure 4 This is a functional block diagram of the operator terminal, installation / inspection machine, and program management server according to an embodiment of the present invention.

[0032] Figure 5 This is a schematic diagram illustrating the structure of a chip mounter according to an embodiment of the present invention.

[0033] Figure 6 This is a diagram illustrating an example of manufacturing log data according to an embodiment of the present invention.

[0034] Figure 7 This is a functional block diagram illustrating the relationship between the management device and the pick-and-place machine in an embodiment of the present invention.

[0035] Figure 8 This is a diagram showing an example of a production status graph displayed on a manager's terminal according to Embodiment 1 of the present invention.

[0036] Figure 9 This is a diagram showing an example of a production status diagram of Embodiment 1 of the present invention.

[0037] Figure 10 This is a display screen example showing the production status diagram of Embodiment 2 of the present invention.

[0038] Figure 11 This is a display screen example showing the production status diagram of Embodiment 3 of the present invention.

[0039] Figure 12 This is a display screen example showing the production status diagram of Embodiment 4 of the present invention.

[0040] Figure 13 This is a display screen example showing the production status diagram of Embodiment 5 of the present invention.

[0041] Figure 14 This is a display screen example showing the production status diagram of Embodiment 6 of the present invention.

[0042] Figure 15 This is a display screen example showing the production status diagram of Embodiment 7 of the present invention.

[0043] Figure 16 This is a display screen example showing the production status diagram of Embodiment 8 of the present invention.

[0044] Figure 17 This is a functional block diagram illustrating an application example of the present invention in the management device.

[0045] Figure 18 This is a schematic diagram illustrating the features of the present invention. Detailed Implementation

[0046] [Application Example]

[0047] Hereinafter, application examples of the present invention will be described with reference to the accompanying drawings.

[0048] Figure 17 A management system 1 applying the present invention is shown. The management system 1 includes a management device 100 and a manager terminal 10 and an operator terminal 20 connected to the management device 100 via a network in a communicable manner. Manufacturing equipment on a surface mount production line for printed circuit boards includes a pick-and-place machine X2, a post-mount inspection machine Y2, and post-reflow inspection machines Y3 and Y4, all connected to the management device 100 via a network in a communicable manner. Figure 1 As shown, the manufacturing equipment includes a printing press X1, a reflow oven X3, and a post-printing inspection machine Y1. As described later, the management device 100 of the present invention can also be connected to and used with these devices via a network; however, here, [the following is omitted as it is not part of the main text]. Figure 17 The management device 100 in the illustrated structure will be described. The manager terminal 10 corresponds to the quality improvement auxiliary device of the present invention. Furthermore, the manager terminal 10, which includes part or all of the management device 100, can also constitute the quality improvement auxiliary device of the present invention.

[0049] The installation information / inspection result collection unit 111 of the management device 100 collects installation information from the pick-and-place machine X2 and inspection results from the post-installation inspection machine Y2, the post-reflow inspection machine Y3, and Y4, and records them in the production information database (DB) 112.

[0050] The anomaly detection unit 113 performs statistical analysis and anomaly determination for each type of defect or error detected / occurring in the assembly machine and inspection machine based on information recorded in the production information database 112, detecting anomalies in any component among the components on the printed circuit board. Then, the cause analysis unit 114 analyzes the causes of the anomalies detected by the anomaly detection unit 113. The statistical results, anomaly determination results, and anomaly analysis results are recorded in the management database 116.

[0051] The work instruction generation unit 115 generates work instructions to eliminate the abnormality based on the cause of the abnormality determined by the cause analysis unit 114 and in accordance with the work instruction rule 119. Work instructions related to the pick-and-place machine X2 may include, for example, maintenance or replacement of nozzles, but are not limited to these.

[0052] The work instructions generated by the work instruction generation unit 115, along with the location and condition of the abnormality, are recorded in the management database 116. Furthermore, the work instructions generated by the work instruction generation unit 115 are sent to the operator's terminal 20 via the work instruction sending unit 117.

[0053] In the operator terminal 20, work information related to the response status to the sent work instruction information is input. Work sent and instructed to the operator terminal 20 may not necessarily be performed, and sometimes it may not be performed. Therefore, if the instructed work has been performed, the operator terminal 20 is informed that the work has been completed. If the operator terminal 20 is not informed that the work has been completed, it indicates that the work has not been performed. That is, as work information, implementation status information indicating whether the instructed work has been completed is sent from the operator terminal 20 to the work information receiving unit 120 of the management device 100.

[0054] The operation information received by the operation information receiving unit 120 is associated with the location of the abnormality corresponding to the operation content and recorded in the management database 116 by the operation information recording unit 121.

[0055] In the production status diagram generation unit 118, a production status diagram is generated based on the information recorded in the management database 116. Specifically, the production status diagram is the production status diagram display screen 70 displayed on the production status diagram display unit 12 of the manager's terminal 10 (see reference). Figure 8 (Data).

[0056] This production status chart displays statistical results and operational information for each type of defect / error detected / occurring in the installation and inspection machines, arranged in a time series. It can also display only the statistical results and operational information for each type of defect / error detected / occurring in the installation and inspection machines, or only one of these.

[0057] The production status display screen 70 includes a main section 71 and an annotation section 72. The upper left column 73 of the main section 71 displays the item names "Program" 731, "PCB ID" 732, and "Time" 733, and the upper right column 74 displays the information corresponding to each item.

[0058] The header column 75 in the lower left corner of the production status display screen shows the names of the mounting / inspection machines included in one production line. Here, header column 75 shows "CM-003-1" to "CM-003-6" as pick-and-place machines, "PREAOI-003" as a post-mount inspection machine, and "POSTAOI-003" and "AXI-003" as post-reflow inspection machines.

[0059] In the lower right column 76 of the main section 71 of the production status display screen 70, multiple vertically elongated rectangular markers are displayed. Here, one marker represents one substrate (hereinafter, the marker representing a substrate will also be referred to as a substrate). The substrates in the lower right column 76 of the same row as the devices shown in the title column 75 indicate that the substrates indicated by the marker are the objects to be installed by the device. The multiple substrates arranged in the same row are arranged in the order of installation. When looking at a specific device shown in the title column 75, such as the pick-and-place machine CM-003-1, the time axis Ta1 (time axis Ta1 is not shown) specified for the pick-and-place machine CM-003-1 extends in a time-right direction, and multiple substrates B1a, B2a, B3a... are arranged along the time axis Ta1. In addition, in the row direction, according to time, event information E1, etc., represented by rectangles with a width thinner than the substrate, are displayed together with the substrates processed by the device, representing the timing of events of 4M changes that occur in the device. Furthermore, the substrates arranged in the same column among the multiple substrates displayed in the lower right column 76 of the main part 71 of the production status display screen 70 represent the same substrate.

[0060] Using a cumulative bar chart for each type of error, etc., the number of defective or erroneous items that occurred or were detected on the substrate in the process of the device displayed in the same row as the title column 75 is displayed, overlapping the substrate displayed in the lower right column 76 of the main part 71 of the production status display screen 70.

[0061] An annotation is provided in the annotation section 72 below the main part 71 of the production status display screen 70. The annotation indicates the correspondence between the types of errors, defects, etc., displayed overlapping the substrate and the display mode.

[0062] exist Figure 8 In the text, the event information E1 located to the left of substrate B1a in the first row of the lower right column 76, corresponding to the pick-and-place machine CM-003-1, indicates a feeder replacement. For example, consider the following situation: because the parts are almost exhausted, a feeder with a new reel is prepared; because the parts on the reel of the already installed feeder are exhausted, it is replaced with the prepared feeder.

[0063] Furthermore, the cumulative bar chart displayed on substrate B1a, etc., which is positioned to the right of the event information E1 in the first row of the lower right column 76 of the production status display screen 70, shows the following: frequent component failure errors. Additionally, the cumulative bar chart displayed on substrates B1b, B1c, etc., which are positioned in the same row as the Preaio-003 post-installation inspection machine and the Postao-003 reflow soldering inspection machine, shows the following: frequent actual defects.

[0064] In response to this situation, event information E2 indicates the following: A work instruction was issued to confirm the installation status of the replaced feeder reel. Following this instruction, the feeder reel installed in the pick-and-place machine CM-003-1 was reinstalled. Thus, the situation improved; after the reel was reinstalled, no part failures or actual defects occurred.

[0065] In this way, in the production status display screen 70, by arranging the substrates B1a, etc., which are to be installed, along the time axis direction of each device constituting the printed circuit board mounting production line, the time sequence of each device is made consistent. By overlapping with the substrates B1a, etc., arranged in this way, statistical results of each error type are displayed in time sequence. This allows for narrowing down the range of causes of abnormalities based on simultaneously occurring defects and errors. Furthermore, since it is possible to grasp the time dependence of defects and errors—whether they occur simultaneously, consecutively, in clusters, or sporadically—it is possible to determine whether action is needed at the current point in time or not. Moreover, by arranging and displaying event information according to the time sequence of the substrates B1a, etc., the cause of the error and measures that can improve the situation can be identified. Thus, by using the production status display screen 70, cause analysis and countermeasure decisions can be made in a short time when multiple defects and errors occur or are detected.

[0066] Figure 18This is a schematic diagram illustrating the features of the present invention applied to a manager terminal 10 having a production status graph display unit 12 that displays the production status graph display screen 70 described above.

[0067] As described above, this diagram illustrates the relationship between the installation information and inspection results of the object of analysis in the cause analysis unit 114 of the management device 100 when analyzing the cause of an anomaly, and the time range of the analysis period and the range displayed on the production status display screen 70, etc.

[0068] exist Figure 18 In the diagram, mounting machines and inspection machines are arranged from top to bottom according to the mounting process in the printed circuit board (PCB) mounting production line. Assuming the analysis period is as shown by the dashed lines, the mounting time of each of the printers X1, pick-and-place machines 1-N (X2), and reflow oven X3 is advanced as indicated by the dashed arrows. Furthermore, the time when the PCB is mounted for inspection in the post-printing inspection machine Y1, post-mounting inspection machine Y2, and post-reflow inspection machines Y3 and Y4 (inspection time) is advanced as indicated by the dashed arrows. The solid arrows represent the mounting time and inspection time when the same PCB is used as a reference.

[0069] At this point, the following situation is known: when a certain time range enclosed by two dotted lines is set as the analysis period to analyze anomalies, the analysis period includes substrates whose processes from printing to post-reflow soldering inspection converge to the analysis period, and substrates whose processes are only partially included in the analysis period. That is, when the analysis period is set to a fixed time range, even if it is desired to assign inspection results to all substrates and components already installed on the mounting machine, installation information or a portion of the inspection results is lacking. Therefore, in this invention, as... Figure 8 As shown, by setting the analysis period to be displayed separately for each substrate, the analysis period can be made consistent on the same substrate. Therefore, compared to the case where the analysis period is consistent according to the time of each installation machine (displayed by time), it is possible to perform cause analysis and countermeasure decisions when multiple defects or errors occur or are detected in a shorter time. Of course, by also utilizing the production status diagrams of Examples 3-8 described later, cause analysis based on information from different time periods can be performed.

[0070] (Example 1)

[0071] Hereinafter, the management system including the administrator terminal of Embodiment 1 of the present invention will be described in more detail with the aid of the accompanying drawings.

[0072] (System Architecture)

[0073] Figure 1This illustration schematically shows a structural example of the manufacturing equipment on a surface mount production line for a printed circuit board according to this embodiment. Surface mount (SMT) refers to the technology of soldering electronic components onto the surface of a printed circuit board. A surface mount production line mainly consists of three processes: solder printing, component mounting, and reflow soldering (solder cladding).

[0074] like Figure 1 As shown, on a surface mount production line, as manufacturing equipment, a solder printing unit X1, a pick-and-place machine X2, and a reflow oven X3 are sequentially arranged from the upstream side. The solder printing unit X1 is a device that prints paste solder onto the electrode portions (called pads) of a printed circuit board using screen printing. The pick-and-place machine X2 is a device used to pick up electronic components to be mounted on the substrate and place them onto the corresponding solder paste; it is also called a chip mounter. The reflow oven X3 is a heating device used to heat and melt the solder paste, then cool it to solder the electronic components onto the substrate. When there are many or many types of electronic components mounted on the substrate, multiple pick-and-place machines X2 are sometimes installed on the surface mount production line.

[0075] In addition, the surface mount production line is equipped with a system that inspects the condition of the substrate at the exit of each process—from solder printing to component mounting to reflow soldering—and automatically detects defects or the possibility of defects. Besides automatically classifying good and defective products, this system also has the function of providing feedback to the actions of each manufacturing unit based on the inspection results and their analysis (e.g., changes to the installation procedure).

[0076] Solder printing inspection apparatus Y1 is used to inspect the solder paste printing status on a substrate transported from solder printing apparatus X1. In solder printing inspection apparatus Y1, the solder paste printed on the substrate is measured in two or three dimensions, and various inspection items are determined based on the measurement results to ensure they are within acceptable limits. Inspection items include, for example, the volume, area, height, positional offset, and shape of the solder. For two-dimensional measurement of the solder paste, an image sensor (camera) can be used; for three-dimensional measurement, laser displacement meters, phase-shift methods, spatial coding methods, and optical cut-off methods can be used.

[0077] Component inspection device Y2 is used to inspect the configuration of electronic components on a substrate transported from the pick-and-place machine X2. In component inspection device Y2, components (which may be the component body, electrodes, or other parts of the component) mounted on solder paste are measured in two or three dimensions. Based on the measurement results, various inspection items are determined to be within acceptable ranges. Inspection items include, for example, component positional offset, angular (rotational) offset, missing components, different components, different polarities (electrode polarities differ between the component side and the substrate side), reversed orientation (components are positioned facing the back), and component height. Similar to solder printing inspection, image sensors (cameras) can be used for two-dimensional measurement of electronic components, while laser displacement gauges, phase-shift methods, spatial coding methods, and optical cut-off methods can be used for three-dimensional measurement.

[0078] The visual inspection device Y3 is used to inspect the soldering quality of substrates transported from the reflow oven X3. In the visual inspection device Y3, two-dimensional or three-dimensional measurements are performed on the solder portion after reflow soldering, and various inspection items are judged to be within normal values ​​(allowable ranges) based on the measurement results. The inspection items include those similar to those for component inspection, as well as the quality of the solder joint shape. When measuring the shape of the solder, in addition to methods such as laser displacement meters, phase-shifting methods, spatial coding methods, and optical cut-off methods mentioned above, a so-called color highlighting method can also be used (a method that uses R, G, and B illumination at different incident angles to illuminate the solder surface, and detects the three-dimensional shape of the solder as two-dimensional color information by capturing the reflected light of each color using a top camera).

[0079] X-ray inspection apparatus Y4 is a device for inspecting the soldering condition of a substrate using X-ray imaging. For example, in the case of packaged components such as BGA (Ball Grid Array) and CSP (Chip Size Package), and multilayer substrates, the solder joints are hidden beneath the component or substrate, making it impossible to inspect the solder condition using visual inspection apparatus Y3 (i.e., visual imaging). X-ray inspection apparatus Y4 compensates for this weakness of visual inspection. Inspection items performed by X-ray inspection apparatus Y4 include, for example, component positional offset, solder height, solder volume, solder ball diameter, length of back solder pads, and solder joint quality. Furthermore, X-ray transmission images can be used as the X-ray image, but CT (Computed Tomography) images are preferred.

[0080] (Management device)

[0081] The manufacturing devices X1 to X3 and inspection devices Y1 to Y4 described above are connected to the management device 100 via a network (LAN). The management device 100 is a system responsible for managing and controlling the manufacturing devices X1 to X3 and the inspection devices Y1 to Y4. Although not shown in the diagram, it is composed of a general-purpose computer system having a CPU (processor), main storage device (memory), auxiliary storage device (hard disk, etc.), input devices (keyboard, mouse, controller, touch panel, etc.), and a display device. The functions of the management device 100, described later, are implemented by the CPU reading and executing programs stored in the auxiliary storage device.

[0082] Furthermore, the management device 100 can be composed of one computer or multiple computers. Alternatively, all or part of the functions of the management device 100 can be installed in the computer built into any of the manufacturing devices X1 to X3 or the inspection devices Y1 to Y4. Alternatively, part of the functions of the management device 100 can be implemented through a server on a network (such as a cloud server).

[0083] The administrator terminal 10, the operator terminal 20, and the program management server 40 are connected to the management device 100 via a network (LAN). Furthermore, the program management server 40 is a server that manages the inspection / installation program 50. The inspection / installation program 50 is actually a program that controls manufacturing devices X1-X3 and inspection devices Y1-Y4 respectively. It is stored in a designated storage area of ​​the program management server 40, and, as needed, is downloaded to manufacturing devices X1-X3 and inspection devices Y1-Y4, stored in the designated storage area of ​​each device, and executed in each device.

[0084] The management device 100 of this embodiment has a functional unit for performing the following functions: enabling managers of manufacturing equipment to efficiently maintain and manage the quality of the equipment. Figure 2 The diagram shows a block diagram of the functional units of the management device 100.

[0085] like Figure 2 As shown, the management device 100 includes an installation information / inspection result collection unit 111, a production information database 112, an anomaly detection unit 113, a cause analysis unit 114, a work instruction generation unit 115, a management database 116, a work instruction sending unit 117, a production status diagram generation unit 118, a work instruction rule 119, a work information receiving unit 120, and a work information recording unit 121.

[0086] The installation information / inspection result collection unit 111 collects installation information and inspection results from inspection devices Y1 to Y4. The installation information includes information related to components such as substrates, solders, and various electronic components used in manufacturing devices X1 to X3, as well as information related to various components and mechanisms constituting these manufacturing devices X1 to X3. In particular, information regarding cases of abnormality is collected as inspection results. Here, abnormality includes not only "actual defects" that are determined to be defective in inspection devices Y1 to Y4 and also visually defective, but also so-called "pass inspection" cases where products are determined to be defective in inspection devices Y1 to Y4 but are visually inspected as "good." Furthermore, this abnormality information is associated with installation information regarding the device components or parts where the abnormality occurred. In addition, the inspection results also include information on errors detected in each process of manufacturing devices X1 to X3. This error information is also associated with installation information regarding the device components or parts where errors occurred.

[0087] The production information database 112 is a database that records the installation information and inspection results collected by the installation information / inspection result collection unit 111 by establishing mutual associations regarding the same substrate, the same component, the same date and time, etc.

[0088] The anomaly detection unit 113 detects anomalies in any component on the printed circuit board based on information recorded in the production information database 112. For example, it detects the presence of anomalies based on the frequency and occurrence rate of actual defects.

[0089] The location and condition of the anomaly are recorded in the management database 116 in relation to the production status.

[0090] The cause analysis unit 114 analyzes the cause of the abnormality detected by the abnormality detection unit 113.

[0091] The work instruction generation unit 115 generates work instructions to eliminate the abnormality based on the cause of the abnormality determined by the cause analysis unit 114, according to work instruction rule 119. Examples of such work instructions, for the printing press X1, include mask cleaning, solder replenishment, and mask position change or correction. The content of the work instructions is not limited to these. Furthermore, the content of work instructions related to the pick-and-place machine will be described later.

[0092] The work instructions generated by the work instruction generation unit 115, along with the location and condition of the anomaly, are recorded in the management database 116. Furthermore, the work instructions generated by the work instruction generation unit 115 are sent via the work instruction sending unit 117 to at least one of the operator terminal 20, the installation / inspection machine 30, or the program management server 40, depending on their content. That is, if the work instruction is directed to the operator, it is sent to the operator terminal 20; if it is for device control, it is sent to the target device included in the installation / inspection machine 30; and if it is a parameter change instruction for the program, it is sent to the program management server 40. Here, the installation / inspection machine 30 is a collective term for manufacturing devices X1 to X3 and inspection devices Y1 to Y4; in practice, work instructions are sent to at least one of these devices.

[0093] The operator terminal 20, the installation / inspection machine 30, or the program management server 40 respectively send work information to the work information receiving unit 120 in response to the work instructions sent from the work instruction sending unit 117 to the operator terminal 20, the installation / inspection machine 30, or the program management server 40.

[0094] The tasks sent and instructed from the task instruction sending unit 117 to the operator's terminal 20, installation / inspection machine 30 or program management server 40 may not necessarily be carried out.

[0095] For example, although a work instruction is sent to the operator terminal 20, sometimes the operator does not have time and fails to see the work instruction. Furthermore, sometimes although the operator recognizes the work instruction received in the operator terminal 20, they do not have time to implement it. Additionally, sometimes the type of production equipment changes or is replaced due to production changes, and the object of the work instructed via the operator terminal 20 disappears.

[0096] Regarding the work instructions sent to the installation / inspection machine 30, sometimes the type of production equipment changes or is replaced due to production changeovers, and the object of the instructed work disappears. Furthermore, when a component ID is discontinued, sometimes the instructed work cannot be performed due to production reasons such as the lack of a substitute, production halting, or the reluctance to stop the production line. Additionally, sometimes the instructed work is rejected by the decision-making unit within the installation machine.

[0097] Regarding the job instructions sent to the program management server 40, sometimes the versions of the installer and component library that are the objects of the instructed job are inconsistent with the instructions. Furthermore, sometimes the installer and component library that are the objects of the instructed job are locked and cannot be modified. Additionally, sometimes the instructed job is rejected by the decision-making unit within the program management server.

[0098] The work information receiving unit 120 records the work information received by the work information receiving unit 120 from the operator terminal 20, the installation / inspection machine 30, or the program management server 40, respectively, and associates it with the location of the abnormality corresponding to the work content in the management database 116.

[0099] In the production status diagram generation unit 118, a production status diagram is generated based on the work instructions generated in the work instruction generation unit 115 and the information recorded in the management database 116. Specifically, the production status diagram is the data that constitutes the production status diagram display screen displayed on the production status diagram display unit 12 of the manager's terminal 10.

[0100] The production status diagram generated by the production status diagram generation unit 118 is sent and displayed on the administrator terminal 10.

[0101] (Administrator's terminal)

[0102] like Figure 3 As shown, the management terminal 10 includes a production status graph receiving unit 11 and a production status graph display unit 12. The management terminal 10 is composed of a general-purpose computer system having a CPU (processor), main storage device (memory), auxiliary storage device (hard disk, etc.), input device (keyboard, mouse, controller, touch panel, etc.), and display device (monitor). Each functional unit of the management terminal 10 is implemented by the CPU reading and executing programs stored in the auxiliary storage device.

[0103] The production status diagram receiving unit 11 receives the production status diagram generated by the production status diagram generating unit 118 of the management device 100.

[0104] The production status diagram display unit 12 displays the production status diagram received by the production status diagram receiving unit 11. Specifically, the production status diagram display unit 12 is composed of a display device such as a monitor, but it can also be used as an input device, such as a touch panel display.

[0105] (Operator's terminal)

[0106] Here, the operator instructs the operator to perform the task via terminal 20, and the operator executes the task.

[0107] like Figure 4As shown, the operator terminal 20 includes a work instruction receiving unit 21, a work instruction display unit 22, a work information input unit 23, and a work information sending unit 24. Specifically, depending on the operator and the work content, the operator terminal 20 corresponds to various devices such as inspection program generation terminals, installation program generation terminals, maintenance work terminals, and production line management terminals. Such an operator terminal 20 can be constructed from a general-purpose computer system having a CPU (processor), main storage device (memory), auxiliary storage device (hard disk, etc.), input device (keyboard, mouse, controller, touch panel, etc.), and display device. Alternatively, all or part of the functions of the operator terminal 20 can be installed in a computer built into any of the manufacturing devices X1 to X3 or inspection devices Y1 to Y4.

[0108] The work instruction receiving unit 21 receives the work instruction sent from the work instruction sending unit 117 of the management device 100.

[0109] The work instruction display unit 22 displays the work instructions received by the work instruction receiving unit 21. Specifically, the work instruction display unit 22 is composed of a display device such as a monitor, but it can also be used as an input device, such as a touch panel display.

[0110] The work information input unit 23 inputs work information corresponding to the work instruction. Specifically, the work information input unit 23 is composed of an input device capable of inputting work information corresponding to the work instruction displayed on the display device. However, it can also be used as a display device, such as a touch panel display.

[0111] The work information input by the work information input unit 23 is sent from the work information sending unit 24 to the work information receiving unit 120 of the management device 100.

[0112] (Installation machine / Inspection machine)

[0113] Here, the installation / inspection machine 30 automatically performs the instructed tasks.

[0114] like Figure 4 As shown, the installation / inspection machine 30 includes a work instruction receiving unit 31, a work execution unit 32, a work information recording unit 33, and a work information sending unit 34. As described above, the installation / inspection machine 30 is a collective term for manufacturing devices X1 to X3 and inspection devices Y1 to Y4, and in practice, it corresponds to at least one of them depending on the content of the work instruction.

[0115] The work instruction receiving unit 31 receives the work instruction sent from the work instruction sending unit 117 of the management device 100.

[0116] The work execution unit 32 performs work on the components and mechanisms constituting the device according to the work instruction received by the work instruction receiving unit 31.

[0117] The work information recording unit 33 records information related to the work performed by the work implementation unit 32, namely, work information.

[0118] The work information recorded by the work information recording unit 33 is sent from the work information sending unit 34 to the work information receiving unit 120 of the management device 100.

[0119] (Application Management Server)

[0120] Here, the program management server 40 automatically executes the instructed tasks.

[0121] like Figure 4 As shown, the program management server 40 has a job instruction receiving unit 41, a program modification unit 42, a job information recording unit 43, and a job information sending unit 44.

[0122] The work instruction receiving unit 41 receives the work instruction sent from the work instruction sending unit 117 of the management device 100.

[0123] The program modification unit 42 modifies the inspection / installation procedure 50 based on the work instruction received by the work instruction receiving unit.

[0124] The work information recording unit 43 records information related to changes in the program of the program change unit 42, namely work information.

[0125] The work information recorded by the work information recording unit 43 is sent from the work information sending unit 44 to the work information receiving unit 120 of the management device 100.

[0126] (Pick and place machine)

[0127] The following example, using a pick-and-place machine X2, details the operation of each functional unit of the management device 100, the manager terminal 10, and the operator terminal 20.

[0128] Figure 5This diagram schematically illustrates the structure of a pick-and-place machine X2. The pick-and-place machine X2 includes a worktable 60 for placing a substrate B, multiple feeders 61 for providing electronic components P, a movable head 62 for picking up the electronic components P, multiple nozzles 63 mounted on the head 62, and a vacuum pump 64 for controlling the air pressure of each nozzle. Electronic components P with different numbers are mounted on each row of feeders 61. Furthermore, the pick-and-place machine X2 includes an upper camera 65, a lower camera 66, a contact sensor 67 for measuring the contact pressure on the nozzle end face, and a pressure sensor 68 for measuring the air pressure of the nozzle, serving as an observation system for detecting abnormalities in the machine's operation. The control unit 69 is a block responsible for controlling, calculating, and processing information for each part of the pick-and-place machine X2, and includes a CPU (processor) and memory. It may also include an output device for outputting information. Regarding the coordinate system, the X and Y axes are taken parallel to the substrate surface, and the Z axis is taken perpendicular to the substrate surface.

[0129] When substrate B is placed onto worktable 60, control unit 69 controls each nozzle 63 according to the installation procedure to pick up / transfer the necessary electronic components P from feeder 61 and sequentially place them onto substrate B. When the placement (installation) of all electronic components P is completed, substrate B is transferred to the downstream process (inspection device Y2). In addition, as manufacturing information for substrate B, manufacturing log information is recorded in the memory of pick-and-place machine X2. This manufacturing log information includes substrate ID, component number of each component, circuit number, and manufacturing error information obtained by matching the information of the device components (nozzle ID, feeder ID) that processed each component.

[0130] Figure 6 This is an example of the manufacturing log information in the X2 pick-and-place machine. Each line is a manufacturing record for a single component, including substrate ID, component number, circuit number, nozzle ID, feeder ID, and manufacturing error information (number of image processing errors, number of component not picked up). By referring to the manufacturing log information, you can determine which device or component manufactured each component on the substrate.

[0131] Figure 7 This is a functional block diagram illustrating the management device 100 associated with the pick-and-place machine X2. (The last sentence appears to be incomplete and possibly refers to a different topic.) Figure 2 The same function blocks shown in the block diagram use the same labels and detailed descriptions are omitted. Here, "Check / Installation Program 50m" refers to the program related to the pick-and-place machine X2 in "Check / Installation Program 50".

[0132] The installation information / inspection result collection unit 111 collects information related to various electronic components, substrates, solders, and other components used in the production line; information related to various components and mechanisms constituting the manufacturing apparatus such as the pick-and-place machine X2; the aforementioned manufacturing log information from the pick-and-place machine X2 (including manufacturing anomaly information); and information on the inspection results of the installed substrates from the post-installation inspection machine Y2 (especially actual defects and over-inspection information). The timing of collecting this information is arbitrary; information can be obtained at predetermined times or frequencies, or based on requests from users. Information related to components can be collected, for example, when a new component is introduced into the production line, or when a component with a different manufacturing batch number from an existing component is introduced into the production line. Information related to various components and mechanisms can be collected, for example, when device components are replaced or maintained, or when new device components are introduced into the production line. Regarding manufacturing log information, for example, whenever the installation of a substrate in the pick-and-place machine X2 is completed, the control unit 69 of the pick-and-place machine X2 can send the manufacturing log information to the management device 100. Information about the inspection results, such as the inspection results information, can be collected whenever the inspection of the substrate is completed in the post-installation inspection machine Y2.

[0133] The anomaly detection unit 113 detects anomalies such as errors during component manufacturing and defects during inspection based on information collected and recorded in the production information database 112 by the installation information / inspection result collection unit 111.

[0134] The cause analysis unit analyzes the causes of the anomalies detected by the anomaly detection unit 113 and extracts the device components, part numbers, and program parameters that are estimated to be the causes of the anomalies. The timing and method of cause analysis are not particularly limited. For example, cause analysis can be performed according to each specified statistical period based on comparisons with the normal value of the number of anomalies occurring for each device component or part number, or comparisons of the number of anomalies occurring between different parts / parts of the same type.

[0135] The work instruction generation unit 115 generates work instructions based on the causes of the abnormality analyzed by the cause analysis unit 114 and the work instruction rules 119 pre-defined in order to eliminate the abnormality based on the causes of the abnormality.

[0136] Examples of work instructions include the following: For the pick-and-place machine X2, there are specific instructions to stop the use of the nozzle or feeder. Furthermore, for the program management server 40, work instructions related to the pick-and-place machine X2 include changes or corrections to mounting coordinates, changes to component dimensions or allowable ranges; work instructions related to the post-installation inspection machine Y2 include changes to inspection references. Work instructions given to the operator via the operator terminal 20 include nozzle, feeder, or head replacement or maintenance, and operations that cannot be automatically performed in the pick-and-place machine X2 or the post-installation inspection machine Y2. The content of the work instructions is not limited to these.

[0137] The production status diagram generated based on the information recorded in the management database 116 is sent from the production status diagram generation unit 118 to the manager's terminal 10 and displayed on the production status diagram display unit 12.

[0138] (The manager uses a screen (a production status display screen))

[0139] Figure 8 This example shows a production status graph display screen 70 displayed on the production status graph display unit 12 of the manager's terminal 10. Additionally, in Figure 8 In the text, dashed lines are used to represent the leader lines of the labels, in order to distinguish them from the display on the screen.

[0140] This production status chart displays the statistical results of each type of defect or error detected / occurring in the installation and inspection machines in a time series format.

[0141] The production status display screen 70 includes a main section 71 and an annotation section 72. The upper left column 73 of the main section 71 displays the item names "Program" 731, "PCB ID" 732, and "Time" 733, while the upper right column 74 displays information corresponding to each item. "Program" 731 represents the program name; for example, it displays a program name like "MPRG1501". "PCB ID" 732 represents the board ID that identifies the board; for example, it displays the board ID attached to the board shown in the production status display screen, such as "PCBA001", "PCBA021", "PCBA041", and "PCBA061". Because in... Figure 8The production status display screen 70 shows information for 58 substrates. Therefore, depending on the display space, a specified number of substrates (e.g., 20) are grouped together, with the substrate ID at the beginning of each group representing the substrate IDs of the substrates included in that group. Alternatively, the installation time from the initial pick-and-place machine can be used to group the substrates together every 5 minutes. Depending on the number of substrates, the substrate IDs of all substrates can also be displayed. "Time" 733 indicates the installation time of the substrate with the substrate ID displayed in the "PCB ID" section 732. Here, the device at the beginning of multiple devices represents the time when the substrate was inserted. In "Time" 733, for the "PCBA001" substrate, it shows "2020-10-15 08:36:58", for the "PCBA021" substrate, it shows "2020-10-15 09:03:02", and for the "PCB041" substrate, it shows "2020-10-15 09:27:07".

[0142] The header column 75 in the lower left corner of the production status display screen shows the names of the mounting / inspection machines included in one production line. Here, header column 75 displays “CM-003-1” to “CM-003-6” as pick-and-place machines, “PREAOI-003” as a post-mount inspection machine, and “POSTAOI-003” and “AXI-003” as a post-reflow inspection machine. Component IDs may also be displayed instead of the device names. The arrangement order of the device names in header column 75 can be appropriately set. Device names can be arranged from top to bottom in the header column 75 according to the process; however, here, pick-and-place machine 751 and inspection machine 752 are displayed separately, with inspection machine 752 shown as both a post-mount inspection machine and a post-reflow inspection machine. Here, the mounting / inspection machines displayed in header column 75 correspond to the manufacturing components of this invention.

[0143] In the lower right column 76 of the main section 71 of the production status display screen 70, multiple vertically elongated rectangular marks are displayed. Here, one mark represents one substrate (hereinafter, the mark representing a substrate will also be referred to as a substrate). The substrates arranged in the lower right column 76 of the same row as the devices shown in the title column 75 indicate that the substrate indicated by the mark is the object to be installed by the device. The multiple substrates arranged in the same row are arranged in the order of installation. That is, it is shown that multiple substrates are installed by the device at a later time as the process moves to the right. When looking at a specific device shown in the title column 75, such as the pick-and-place machine CM-003-1, the time axis Ta1 (time axis Ta1 is not shown) specified for the pick-and-place machine CM-003-1 extends in a way that moves to the right in time, and multiple substrates B1a, B2a, B3a... are arranged along the time axis Ta1. Multiple substrates B1a, B2a, B3a... arranged in the same row are equally arranged in the row direction, but only their temporal sequence is shown; the intervals between the processing times of each substrate B1a, B2a, B3a... are not shown. The representation of time is not limited to this; multiple substrates B1a, B2a, B3a... can also be arranged in the row direction at intervals corresponding to the processing times of each substrate. Furthermore, in the row direction, according to time, event information E1, etc., represented by rectangles narrower than the substrate, displays the timing of events that occur as 4M changes in the device, along with the substrates processed by the device. Additionally, substrates arranged in the same column among the multiple substrates displayed in the lower right column 76 of the main section 71 of the production status display screen 70 represent the same substrate. That is, multiple substrates arranged in the same column represent the same substrate that is installed in each process of the multiple devices displayed in the title column 75. For example, substrate B1a shown in the first column of the first row of the bottom right column 76, substrate B1b shown in the first column of the third row from the bottom, substrate B1c shown in the first column of the second row from the bottom, and substrate B1d shown in the first column of the bottom row represent the same substrate identified by the substrate ID of PCBA001. Here, the substrate corresponds to the product of the present invention (and so in the following embodiments). Furthermore, since the unit product of the present invention consists of one product, one rectangular mark corresponds to one substrate, but the unit product of the present invention can also be multiple products, therefore, one rectangular mark can also correspond to one or more substrates.

[0144] Furthermore, using cumulative bar charts for each type of error, etc., the number of defective or erroneous items that occurred or were detected on the substrate during the process of the device displayed in the same row as the title column 75 is displayed, overlapping the substrate shown in the lower right column 76 of the main part 71 of the production status display screen 70. For example, a bar chart Q1 is displayed overlapping on substrate B2a shown in the first row of the lower right column 76. This bar chart Q1 indicates the number of components with non-adhesion errors detected when substrate B2a is mounted in the pick-and-place machine CM-003-1. In addition, a bar chart Q2 is displayed on substrate B4a shown in the same first row. This bar chart Q2 indicates the number of image recognition errors detected when substrate B4a is mounted in the pick-and-place machine CM-003-1. Furthermore, on substrate B6a shown in the same first row, a cumulative histogram is displayed. This cumulative histogram is formed by accumulating the histogram Q3, which represents the number of components with non-adhesion errors detected during the assembly of substrate B6a, and the histogram Q4, which represents the number of components with image recognition errors. Cumulative histograms representing the number of defects or errors occurring or detected on the substrate during the inspection process are displayed overlaid on the substrate. For example, a histogram Q5 is displayed overlaid on substrate B6b inspected by the PREAOI-003 post-assembly inspection machine shown in the third-to-last row of header column 75. This histogram Q5 represents the actual number of defective components detected. Additionally, a histogram Q6 is displayed overlaid on substrate B8b in the same row. This histogram Q6 represents the number of over-inspected components detected during inspection by the PREAOI-003 post-assembly inspection machine.

[0145] Below the main section 71 of the production status display screen 70 is an annotation section 72, which includes annotations indicating the correspondence between the types and display methods of errors, defects, etc., superimposed on the substrate. Here, since the title bar 75 of the main section 71 of the production status display screen 70 displays the pick-and-place machine and the inspection machine, the types are distinguished by a grid-like shading method: image recognition errors 761 in the pick-and-place machine are displayed as upper-left slanted shadow lines, component non-adhesion errors 762 as upper-right slanted shadow lines, over-inspection errors 763 in the inspection machine are displayed as gray, and actual defects 764 as black. In reality, these defects, errors, etc., are displayed in different colors. The annotations also include displays explaining the following: the correspondence between the height of the bar graph indicating the number of errors and the number of components 766; the correspondence between the number of components mounted on the substrate and the display method of the substrate 767; and the correspondence between the type of event (e.g., reel mounting) and the display method of the rectangular event information 768. The correspondence between these display methods and the displayed content can also be set so that the display on the screen can be selected by clicking or touching, thereby displaying an explanation through a pop-up.

[0146] right Figure 8The production status shown in the production status diagram on screen 70 will be explained.

[0147] Here, the substrate B1a and others shown in the top row of the bottom right column 76 are only the mounting objects of pick-and-place machines CM-003-1 to CM-003-6 shown in the title column 75, and are not the mounting objects of pick-and-place machines CM-003-2 to CM-003-6. Therefore, no substrate is shown in the columns that are the same as the substrates B1a and others arranged in the first row, which are the same as the pick-and-place machines CM-003-2 to CM-003-6 in the title column 75.

[0148] exist Figure 8 In the text, the event information E1 located to the left of substrate B1a in the first row of the lower right column 76, corresponding to the pick-and-place machine CM-003-1, indicates a feeder replacement. For example, consider the following situation: because the parts are almost exhausted, a feeder with a new reel is prepared; because the parts on the reel of the already installed feeder are exhausted, it is replaced with the prepared feeder.

[0149] Furthermore, the cumulative bar chart displayed on substrate B1a, etc., which is positioned to the right of the event information E1 in the first row of the lower right column 76 of the production status display screen 70, shows the following: frequent component failure errors. Additionally, the cumulative bar chart displayed on substrates B1b, B1c, etc., which are positioned in the same row as the Preaio-003 post-installation inspection machine and the Postao-003 reflow soldering inspection machine, shows the following: frequent actual defects.

[0150] In response to this situation, event information E2 indicates the following: A work instruction was issued to confirm the installation status of the replaced feeder reel. Following this instruction, the feeder reel installed in the pick-and-place machine CM-003-1 was reinstalled. Thus, the situation improved; after the reel was reinstalled, no part failures or actual defects occurred.

[0151] In this way, in the production status display screen 70, by arranging the substrates B1a, etc., which are to be installed, along the time axis direction of each device constituting the printed circuit board mounting production line, the time sequence of each device is made consistent. By overlapping with the substrates B1a, etc., arranged in this way, the statistical results of each error type are displayed according to the time sequence. This allows for narrowing down the range of causes of abnormalities based on simultaneously occurring defects and errors. Furthermore, since it is possible to grasp the time dependence of defects and errors—whether they occur simultaneously, consecutively, in a concentrated manner, or sporadically—it is possible to determine whether action is needed at the current point in time or not. Moreover, by arranging and displaying event information according to the time sequence of the substrates B1a, etc., the cause of the error and measures that can improve the situation can be identified. Thus, by using the production status display screen 70, cause analysis and countermeasure decisions can be made in a short time when multiple defects and errors occur or are detected.

[0152] The devices displayed in the lower left column of the production status display screen are not limited to... Figure 8 The example shown. For example... Figure 9 As shown in (A), the apparatus constituting the printed circuit board mounting production line can also be arranged from top to bottom according to type. For example, the mounting machine and the inspection machine can be arranged from top to bottom. Furthermore, as mounting machines, they can be arranged from top to bottom in the order of printer PR-003, pick-and-place machines CM-003-1 to CM-003-4, and reflow oven OV-003. Furthermore, as inspection machines, they can be arranged from top to bottom in the order of post-printing inspection machine SPI-003, post-mount inspection machine PREAOI-003, and post-reflow inspection machine POSTAOI-003 and AXI-003.

[0153] In addition, such as Figure 9 As shown in (B), the devices displayed in the lower left column of the production status display screen can also be arranged in the order in which the substrates are fed into the printed circuit board mounting production line. For example, they can be arranged from top to bottom in the following order: printer PR-003, post-printing inspection machine SPI-003, pick-and-place machines CM-003-1 to CM-003-4, post-mount inspection machine PREAOI-003, reflow oven OV-003, post-reflow inspection machine POSTAOI-003, and AXI-003.

[0154] As Figure 8 The production status display screen 70 shows errors superimposed on substrate B1a, etc., and can also display the number of pieces with insufficient solder as errors related to the printing press. In addition, as errors related to the reflow oven, it can also display the number of pieces where the set temperature deviates from the measured value.

[0155] exist Figure 8The event information displayed in the lower right column 76 of the production status diagram 70, along with the substrate display, in a time sequence, is not limited to the above-mentioned content. Various 4M changes that occur during the printed circuit board assembly line are considered events.

[0156] Regarding the pick-and-place machine, events can be categorized into those related to the nozzle, feeder, head, and holder. For nozzle-related events, there is nozzle replacement. For feeder-related events, there are replacements such as replacing the reel with a new one due to parts running out, replacing with another feeder installed on a new reel, and inserting / removing the feeder when insertion into the pick-and-place machine is insufficient. For head and holder-related events, there is air path maintenance. Furthermore, among pick-and-place machine-related events, there are temporary stops caused by operator error and stops caused by certain errors.

[0157] As events related to the printing press, they can indicate solder replenishment, changes to installation parameters (printing pressure, squeegee strokes, squeegee speed, etc.), and maintenance.

[0158] In addition, as an event related to the reflow oven, changes in temperature distribution can be observed.

[0159] In addition, information related to production change, changes in installation procedures, and production interruptions can also be displayed as event information, overlapping with the substrate B1a in the lower right column 76 of the production status display screen 70.

[0160] In the production status display screen 70, besides Figure 8 In addition to the information shown, it can also display, along with the nozzle, feeder, head, and retainer, the implementation of maintenance during the fixed period, or the number of days elapsed after maintenance, and the number of installations. Furthermore, it can also display component dimensions and allowable ranges, number of terminals, component identification parameters such as component color / brightness, the model of the nozzle and feeder used in the installation, the mounting coordinates on the substrate in the installation procedure, rotation angle, and other information.

[0161] (Example 2)

[0162] Hereinafter, the management system of the administrator terminal 10, which includes Embodiment 2 of the present invention, will be described. Since everything is the same as in Embodiment 1 except for the production status graph display screen 80 displayed in the production status graph display unit 12, the same reference numerals will be used for structures that are the same as in Embodiment 1 and detailed descriptions will be omitted.

[0163] Figure 10 The production status diagram is displayed on screen 80. Additionally, in... Figure 10 In the text, dashed lines are used to represent the leader lines of the labels, in order to distinguish them from the display on the screen.

[0164] This production status chart displays the statistical results of each type of defect or error detected / occurring in the installation and inspection machines in a time series format.

[0165] The production status display screen 80 has an annotation section 81 at the top, which displays notes, and a main section 82 at the bottom, which displays statistical results such as errors in a time sequence.

[0166] The annotation section 81 displays the correspondence between the displayed quality variations and events and their display methods 83. Here, as quality variation information, information indicating actual defects, image recognition errors, component non-adhesion errors, and defect warnings is displayed. Actual defects 831 are displayed in black, image recognition errors 832 are displayed with a left-upper-diagonal shaded line, component non-adhesion errors 833 are displayed with a right-upper-diagonal shaded line, and defect warnings 834 are displayed with a grid shaded line. Furthermore, as event information, information indicating reel replacement and work instruction issuance is displayed. Reel replacement 835 is displayed with a vertical shaded line, and work instruction issuance 836 is displayed with a diagonal grid shaded line. The displayed quality variation information can be appropriately selected according to the component being improved. In addition, the displayed event information is not limited to this; various 4M variations can be appropriately selected as events. Furthermore, the display methods for quality variation information and event information are not limited to the above methods; they can also be displayed using different colors.

[0167] The annotation section 81 also displays a note indicating that the number of quality variations occurred was 84. In the main body section 82, a horizontally elongated rectangle represents the substrate, and a horizontally extending bar chart is displayed overlapping inside the rectangle. The length of the bar chart indicates the number of quality variations that occurred, and the lengths of the bar charts showing the number of quality variations per substrate as 1, 2, or 3 or more are shown.

[0168] The annotation 85 for the number of components mounted on the substrate is also shown in the annotation section 81. Here, the number of components mounted on the substrate is indicated by the length of the rectangle representing the horizontal length of the substrate. Here, the lengths of the rectangles indicating that there are 10, 20, or 100 or more components mounted on each substrate are shown.

[0169] The main section 82 includes: a header row 821 and a header column 822; and a main body 823, which is configured with multiple rectangular markings indicating substrates (hereinafter, the markings indicating substrates will also be referred to as substrates). The header column 822 displays the substrate mounting completion time. This substrate mounting completion time progresses from bottom to top, displaying "2020 / 6 / 1 10:40" for the bottommost substrate and "2020 / 6 / 1 11:58" for the topmost substrate. At the top of the header column 821, as the item names for each column, three items are displayed: "Improvement Target" 8211, "Corresponding Pick and Place Machine" 8212, and "Corresponding Production Line" 8213. The "Improvement Target" item 8211 displays the name of the component being improved; the "Corresponding Placement Machine" 8212 displays the name of the placement machine equipped with the component being improved; and the "Corresponding Production Line" item 8213 displays the name of the production line configured with the placement machine equipped with the component being improved. The second line of the title line 821 displays the name of the component being improved, "NOZZLE200340," the name of the corresponding placement machine, "CM-003-1," and the name of the corresponding production line, "Line-1." The display area for the item name and component name in the "Improvement Target" section of the title line 821 emphasizes the component being improved. Here, the display area is emphasized using a grid shadow, but it can also be set to a different background color than other display areas. Here, the improvement target, corresponding placement machine, and corresponding production line displayed in the title line 821 correspond to the manufacturing components of the present invention. Thus, the manufacturing components of the present invention are not limited to devices such as installation machines / inspection machines, but also include components that constitute these devices such as suction nozzles, and also include production lines composed of installation machines / inspection machines.

[0170] As described above, the substrates P1a and the like arranged in columns 8231 to 8233 of the main body 823 are displayed at the bottom, with an earlier installation completion time, and displayed at the top, with a later installation completion time. That is, among the substrates P1a to P12a arranged in the first column 8231 of the improvement object 8211, substrate P12a has the earliest installation completion time, and substrate P1a has the latest installation completion time. The same applies to substrates P1b to P12b arranged in the second column 8232 and substrates P1c to P12c arranged in the third column 8233. When focusing on the specific components, devices, and production lines shown in the title row 821, such as the nozzle NOZZLE200340, the time axis Ta2 (time axis Ta2 is not shown) defined for the nozzle NOZZLE200340 extends in a way that advances from bottom to top in time, and multiple substrates P12a to P3a, P2a, and P1a are arranged along this time axis. Furthermore, the substrates P1a and the like shown in the main body 823 are composed of multiple columns (three columns in this case) 8231 to 8233 in the horizontal direction, and multiple substrates arranged in the same row represent the same substrate. That is, substrates P1a, P1b, and P1c arranged in the same row represent the same substrate. The same applies to substrates P2a, P2b, and P2c arranged in other rows. The horizontal length of the rectangles representing the substrates displayed in each column is shown in the appendix 81, indicating the number of mounting components in one substrate.

[0171] A bar chart representing quality variations is overlaid on the substrate P1a and others shown in the main body 823. This bar chart is displayed according to the type of quality variation or event, as shown in the annotation section 81. For example, regarding the bottom-ranked substrates P12a, P12b, and P12c, if one actual defect is detected in each, black bars Q7, Q8, and Q9 extending horizontally are overlaid on the substrates P12a, P12b, and P12c, respectively, in columns 8231, 8232, and 8233, which correspond to the items to be improved (nipples, pick-and-place machines, and production lines).

[0172] In the corresponding production line 8213, between the bottom row substrate P12c and the second-to-last row substrate P11c in column 8233, a rectangular event message E3 with a diagonal grid shaded line indicates that a work instruction has been issued. This indicates that a work instruction has been issued between the installation of the bottom row substrate P12c and the installation of the second-to-last row substrate P11c. The same event message is not displayed in columns 8231 and 8232 of the improvement target 8211 and the corresponding pick-and-place machine 8212, indicating that a work instruction has been issued for a device in the equipment included in production line Line-1 that is different from the pick-and-place machine CM-003-1 equipped with the component NOZZLE200340 shown in column 1, which is the improvement target.

[0173] Furthermore, regarding substrates P10a, P10b, and P10c in the third-to-last row, a bar chart Q10, indicating a detected component non-adsorption error, is superimposed on substrate P10c shown in column 8233 of the corresponding production line 8213. This indicates that a component non-adsorption error occurred in a different pick-and-place machine than the one equipped with the component NOZZLE200340 shown in column 1, which is the target of improvement.

[0174] Regarding substrates P8a, P8b, and P8c in the fifth row from the bottom, a bar chart Q11 indicating detected actual defects is overlaid on substrate P8a shown in column 8231 of the improvement target 8211. On substrate P8c shown in column 8233 of the corresponding production line, a bar chart Q12 indicating actual defects and a bar chart Q13 indicating the occurrence of component non-adhesion are displayed side-by-side. Thus, in cases where multiple quality variations are detected / occurred, bar charts are displayed for each type. Multiple quality variations can also be displayed using cumulative bar charts.

[0175] exist Figure 10 In the example shown by event information E3, one event has occurred. However, when multiple events are mixed, the event information is displayed in a rectangular display area of ​​the same length as the horizontal length of the substrate, divided equally according to each event.

[0176] exist Figure 10 In the main body 823 of the production status display screen 80, multiple substrates arranged in the same column are equally arranged in the column direction. However, the arrangement of the substrates only shows their sequential relationship in time and does not show the interval between the processing times of each substrate. The representation of time is not limited to this; multiple substrates can also be arranged in the column direction at intervals corresponding to the intervals between processing times.

[0177] In this way, in the production status display screen 80, by arranging the substrates P1a, etc., which are to be installed, along the time axis according to each component, device, and production line constituting the printed circuit board mounting production line, the time sequence of each component, etc., is made consistent. By overlapping with the substrates P1a, etc., arranged in this way, the statistical results of each error category are displayed according to the time sequence. As a result, the range of causes of abnormalities can be narrowed down based on the simultaneous occurrence of defects and errors. Furthermore, since it is possible to grasp the time dependence of defects and errors, such as whether they occur simultaneously, continuously, in a concentrated manner, or sporadically, it is possible to determine whether measures need to be taken at the current point in time or whether measures are no longer necessary. In addition, by arranging and displaying event information according to the time sequence of the substrates P1a, etc., the cause of the error and measures with improvement effects can be identified. In this way, by using the production status display screen 80, the cause analysis and countermeasure decisions when multiple defects and errors occur or are detected can be performed in a short time.

[0178] (Example 3)

[0179] Hereinafter, the administrator terminal 10 of Embodiment 3 of the present invention will be described. Since it is the same as Embodiments 1 and 2 except for the production status graph display screen 90 displayed in the production status graph display unit 12, the same reference numerals will be used for the same structures as in Embodiments 1 and 2 and detailed descriptions will be omitted.

[0180] Figure 11 The production status chart display screen 90 shown illustrates an example where defects or errors occurring simultaneously in a printed circuit board assembly line are displayed on the same chart using a cumulative bar chart. This embodiment's production status chart display screen 90 displays statistical results for each type of defect or error occurring or detected in the assembly and inspection machines using a different time-based representation than the production status chart display screens 70 and 80 described in embodiments 1 and 2. By combining it with production status chart display screens 70 and 80, cause analysis and countermeasure decisions for multiple errors occurring simultaneously can be performed in a shorter time. The production status chart display screen 90 corresponds to the time-lapse quality information of this invention. Multiple production status chart display screens 90 for each assembly or inspection machine can also be displayed vertically.

[0181] exist Figure 11 In the graph, the horizontal axis represents the installation time in the printed circuit board assembly line, and the vertical axis represents the number of defective or incorrect units. The cumulative bar chart is a graph that shows the cumulative number of defects or errors detected within the plot width for each type. The plot width and the scale for installation time vary according to the displayed time width. Figure 11In the diagram, a slanted shading line in the upper right corner indicates a component not being properly attached; a slanted shading line in the upper left corner indicates an image recognition error; black indicates an actual defect; and a grid shading line indicates a potential defect. Here, the grid shading is used to differentiate between the types of defects and errors, but this is not the only method; different colors can actually be used. Figure 11 As shown, it can also be combined with cumulative columnar columns. Figure 1 The system displays notes indicating the correspondence between the display method of the bar chart and the types of errors, etc., and the correspondence between the height of the bar chart and the types of errors, etc. Here, the horizontal axis from 12:00 to 14:00 corresponds to the specified period of this invention, and defects or errors are arranged as quality information according to the passage of time.

[0182] (Example 4)

[0183] Hereinafter, the administrator terminal 10 of Embodiment 4 of the present invention will be described. Since it is the same as Embodiments 1 and 2 except for the production status graph display screen 91 displayed in the production status graph display unit 12, the same reference numerals will be used for the same structures as in Embodiments 1 and 2 and detailed descriptions will be omitted.

[0184] Figure 12 This example illustrates how simultaneously occurring defects or errors in a printed circuit board assembly line can be displayed on the same chart using a line graph. The production status display screen 91 of this embodiment displays statistical results for each type of defect or error occurring or detected in the assembly and inspection machines using a different time-based representation than the production status display screens 70 and 80 described in Examples 1 and 2. By using it in combination with production status display screens 70 and 80, cause analysis and countermeasure decisions for multiple errors occurring simultaneously can be performed in a shorter time. The production status display screen 91 corresponds to the time-lapse quality information of this invention. Multiple production status display screens 91 for each assembly or inspection machine can also be displayed vertically.

[0185] exist Figure 12 In the graph, the horizontal axis represents the installation time in the printed circuit board assembly line, and the vertical axis represents the number of defective or erroneous units. The line graph displays the sum of the number of defective or erroneous units detected within the plot width as a single plot point. The plot width and the scale for installation time vary according to the displayed time range. At the left end of the horizontal axis, the earliest date of the plot range is displayed as "08-31". Figure 12The line graph shown illustrates the actual number of defective items from 17:00 to 9:00. In addition to this, the line graph also displays image recognition errors, component mis-attachment errors, and defect precursors using different grid shading and color schemes. Here, the horizontal axis from 17:00 on August 31st to 09:00 on September 1st corresponds to the specified period of this invention, with defects or errors configured as quality information according to the elapsed time.

[0186] (Example 5)

[0187] Hereinafter, the administrator terminal 10 of Embodiment 5 of the present invention will be described. Since it is the same as Embodiments 1 and 2 except for the production status graph display screen 92 displayed in the production status graph display unit 12, the same reference numerals will be used for the same structures as in Embodiments 1 and 2 and detailed descriptions will be omitted.

[0188] Figure 13 For example, in a printed circuit board (PCB) assembly line, instead of summing up errors over a period, the number of errors per PCB is plotted using a bar chart. The production status display screen 92 of this embodiment displays statistical results for each type of defect or error occurring or detected in the assembly and inspection machines using a different time-based representation than the production status display screens 70 and 80 described in embodiments 1 and 2. By using it in combination with the production status display screens 70 and 80, cause analysis and countermeasure decisions can be made in a shorter time when multiple errors occur. The production status display screen 92 corresponds to the time-lapse quality information of this invention. Multiple production status display screens 92 for each assembly or inspection machine can also be displayed vertically.

[0189] exist Figure 13 In the diagram, the horizontal axis represents the installation time in the printed circuit board assembly line, and the vertical axis represents the number of defective or faulty units. Figure 13 The actual defects detected within the plot width are drawn using bar charts. The start time of the displayed period ("2020-08-31 17:00") and the end time ("2020-09-01 09:00") are displayed at the top left and right corners of the chart. Since the time on the horizontal axis may not be uniform, the start and end times are displayed in this way. Furthermore, the background band 921, represented by a diagonal grid of shaded lines, indicates the period during which the work instruction was notified (work instruction notification period). Here, since the instructed work was not performed within the displayed time range, the background 921 is displayed up to the end time. In addition... Figure 13In addition to the actual defects shown, image recognition errors, component non-adhesion errors, and defect precursors can also be indicated by bar charts using different display methods such as grid shadows and colors. Here, the period from 17:00 on August 31, 2020 to 09:00 on September 1, 2020 corresponds to the period specified in this invention, and defects or errors are configured as quality information according to the time elapsed.

[0190] (Example 6)

[0191] Hereinafter, the administrator terminal 10 of Embodiment 6 of the present invention will be described. Since it is the same as Embodiments 1 and 2 except for the production status graph display screen 93 displayed in the production status graph display unit 12, the same reference numerals will be used for the same structures as in Embodiments 1 and 2 and detailed descriptions will be omitted.

[0192] and Figure 13 same, Figure 14 For example, in a printed circuit board assembly line, instead of summing up errors during the period, the number of errors per board is plotted using a bar chart. The production status display screen 93 of this embodiment displays statistical results for each type of defect or error occurring or detected in the assembly and inspection machines using a different time-based representation than the production status display screens 70 and 80 described in embodiments 1 and 2. By using it in combination with the production status display screens 70 and 80, cause analysis and countermeasure decisions can be made in a shorter time when multiple errors occur. The production status display screen 93 corresponds to the time-based quality information of this invention. Multiple production status display screens 93 for each assembly or inspection machine can also be displayed vertically.

[0193] exist Figure 14 In the diagram, the horizontal axis represents the installation time in the printed circuit board assembly line, and the vertical axis represents the number of defective or faulty units. Figure 14 In the graph, image recognition errors and actual defects detected within the plot width are displayed by a bar chart. Image recognition errors are shown by a slanted shaded line in the upper left corner, and actual defects are shown in black. Furthermore, the band of background 931, indicated by the dotted shaded lines on the time axis scale, represents the period of the work instruction notification. Here, by displaying only a portion of the time axis's range of background 931, it is shown that the instructed work was performed at the moment the displayed range of background 931 ended. The display method of the background representing the work instruction notification period can also be made different depending on whether the instructed work was performed or not. In addition... Figure 14 In addition to image recognition errors and actual defects, different display methods such as grid shadows and colors can be used to show component non-adhesion errors and potential defects in bar charts. Figure 14In the chart, the start time of the displayed period, "2020-08-31 17:00", and the end time, "2020-09-01 09:00", are also displayed at the top left and right sides. Here, 2020-08-31 17:00 to 2020-09-01 09:00 correspond to the period specified in this invention.

[0194] (Example 7)

[0195] Hereinafter, the administrator terminal 10 of Embodiment 7 of the present invention will be described. Since it is the same as Embodiments 1 and 2 except for the production status graph display screen 94 displayed in the production status graph display unit 12, the same reference numerals will be used for the same structures as in Embodiments 1 and 2 and detailed descriptions will be omitted.

[0196] Figure 15 This is a chart that only plots frequently occurring errors, etc. The production status chart display screen 94 of this embodiment displays statistical results for each type of defect or error that occurs or is detected in the installation and inspection machines using a different time-based representation than the production status chart display screens 70 and 80 described in embodiments 1 and 2. By using it in combination with the production status chart display screens 70 and 80, it is possible to perform cause analysis and countermeasure decisions when multiple errors occur in a shorter time. The production status chart display screen 94 corresponds to the time-lapse quality information of this invention. Multiple production status chart display screens 94 for each installation or inspection machine can also be displayed vertically.

[0197] exist Figure 15 In the graph, the horizontal axis represents the moment when an anomaly is reported in the printed circuit board assembly line (anomaly notification moment), and the vertical axis represents the number of defective or erroneous items. Here, examples of multiple instances of actual defects are shown, displayed as black bars representing the number of actual defects. This bar chart only shows multiple instances of errors detected within the plot width. The moments represented by dashed lines 941 and 942 are the boundary moments of the monitoring period. Figure 15 In addition to errors, the chart also plots the occurrence times of events such as reel replacements, designated as event information 943. Event information 943 is displayed as thin, gray rectangles, unlike the bar chart. Besides... Figure 15 In addition to the actual defects shown, image recognition errors, component non-adhesion errors, and defect precursors can be indicated by bar charts using different grid shadows, colors, and other display methods. The number of errors, etc., that are set as frequently occurring and plotted can be, for example, three or more, but can be set appropriately. Here, the period from 12:00 on March 22, 2020 to 12:00 on March 24, 2020, between the dotted lines 941 and 942 corresponds to the period specified in this invention, and defects or errors are arranged as quality information according to the passage of time.

[0198] (Example 8)

[0199] Hereinafter, the administrator terminal 10 of Embodiment 8 of the present invention will be described. Since it is the same as Embodiments 1 and 2 except for the production status graph display screen 95 displayed in the production status graph display unit 12, the same reference numerals will be used for the same structures as in Embodiments 1 and 2 and detailed descriptions will be omitted.

[0200] Figure 16 This is a graph plotted using a line graph to show the trend of the number of abnormal detections of warning objects in past statistical results. The production status display screen 95 in this embodiment displays statistical results of defects and errors occurring or detected in the installation and inspection machines using a different time-based representation than the production status display screens 70 and 80 described in embodiments 1 and 2. By using it in combination with the production status display screens 70 and 80, it is possible to perform cause analysis and countermeasure decisions for multiple errors occurring in a shorter time. The production status display screen 95 corresponds to the time-based quality information of this invention. Multiple production status display screens 95 for each installation or inspection machine can also be displayed vertically.

[0201] exist Figure 16 In the diagram, the horizontal axis represents the moment when an anomaly is reported in the printed circuit board assembly line (anomaly notification time), and the vertical axis represents the number of defective or erroneous units. Figure 16 In this diagram, the anomaly detection count for all warnings in the latest notification is plotted. For all warnings included in the latest notification (Warning 1, Warning 2, and Warning 3), warnings notified at fixed intervals are traced back to the past, and the anomaly detection count from past notifications is plotted. The anomaly detection counts for Warning 1, Warning 2, and Warning 3 are displayed using solid lines, dashed lines, and single-dot lines, respectively. The vertical dotted lines represent boundary moments within the monitoring period. Errors such as actual defects, image recognition errors, component non-adhesion errors, and defect precursors are appropriately selected. Regarding pick-and-place machines, when plotting, the number of parts for multiple pick-and-place machines can be aggregated or separated. The display time interval can be appropriately changed by setting it. Here, the horizontal axis from 6:00 AM on March 22, 2020 to 12:00 PM on March 24, 2020 corresponds to the period specified in this invention, and defects or errors as quality information are configured according to the elapsed time.

[0202] <Postscript 1>

[0203] A quality improvement auxiliary device (10) assists in improving the quality of products manufactured by manufacturing equipment, characterized in that...

[0204] The equipment includes a display unit (12) that displays manufacturing status information (80, etc.). This manufacturing status information (80, etc.) is generated by associating quality information (Q1, etc.) related to the quality that occurs or is detected during the manufacturing process of the manufacturing equipment with the manufacturing components or parts included in the manufacturing equipment, and by arranging the quality information (Q1, etc.) in a time sequence.

[0205] In the manufacturing status information (80, etc.), the quality information (Q1, etc.) is configured according to the order in which the product (B1a, etc.) is manufactured, for each unit product (B1a, etc.), where the unit product is one or more of the products.

[0206] Label Explanation

[0207] 10: Management terminal; 12: Production status display unit; B, P: Substrate; Q: Defect or error; X1~X3, Y1~Y4: Manufacturing equipment.

Claims

1. A quality improvement auxiliary device for assisting in the quality improvement of products manufactured by manufacturing equipment, characterized in that, The device includes a display unit that displays manufacturing status information. This manufacturing status information is generated by associating quality information related to the quality that occurs or is detected during the manufacturing process of the manufacturing equipment with multiple manufacturing components included in the manufacturing equipment, and by configuring the quality information in a time sequence. The manufacturing component includes the manufacturing apparatus in the manufacturing equipment. In the manufacturing status information, the quality information is configured according to the manufacturing order of each unit product, where each unit product is one or more of the products. The quality information of the same unit product processed by multiple manufacturing devices associated with the unit product is positioned at the same location in the time series. Event information representing events occurring or performed by the manufacturing apparatus is configured together with the quality information according to the time sequence, based on the timing of the occurrence or execution of the event and the sequential relationship between the quality information occurring or detected in association with the manufacturing apparatus.

2. The quality improvement auxiliary device according to claim 1, characterized in that, The quality information includes multiple types of quality information. The quality information is displayed in a different manner for each of the aforementioned categories.

3. The quality improvement auxiliary device according to claim 1, characterized in that, The quality information is displayed in association with the markers representing the unit product, arranged in the order specified along the time axis for each of the manufactured components associated with the quality information.

4. The quality improvement auxiliary device according to claim 1, characterized in that, The manufacturing status information includes elapsed quality information configured according to a time sequence as a specified period of time, the elapsed quality information being information about the quality that occurs or is detected in association with the manufactured component.

5. The quality improvement auxiliary device according to claim 4, characterized in that, The elapsed quality information, with the elapsed time within the specified period as the horizontal axis, is arranged longitudinally for each of the plurality of manufacturing components.

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