Assembly apparatus and assembly method

Abstract

The application discloses an assembling device and method, which comprises a rack, a conveying device installed on the rack and connected with a first positioning assembly and a second positioning assembly, the first positioning assembly is used for positioning a first workpiece, and the second positioning assembly is used for positioning a second workpiece; the conveying device can drive the first positioning assembly and the second positioning assembly to move synchronously to a first work station and a second work station; a first adhering device is arranged at the first work station and used for obtaining a first object, and after the first positioning assembly and the second positioning assembly move synchronously to the first work station, the first object is adhered to the first workpiece; a second adhering device is arranged at the second work station and used for obtaining a second object, and after the first positioning assembly and the second positioning assembly move synchronously to the second work station, the second object is adhered to the second workpiece; and a first processing device is arranged at the second work station and used for processing the first workpiece to which the first object is adhered according to preset requirements. The application has low cost and high efficiency.

Description

Technical Field

[0001] This application relates to the field of automatic bonding technology, and more specifically, to an assembly apparatus. Furthermore, this application also relates to an assembly method. Background Technology

[0002] Mounting accessories onto designated areas of a workpiece is generally challenging due to the small size of the accessories. In existing technologies, the mounting process is typically done manually, which is difficult, labor-intensive, and costly. It also results in low mounting efficiency, poor workpiece consistency, and low product quality. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide an assembly device that can reduce the labor intensity of workers, reduce labor costs, and improve work efficiency and product quality.

[0004] Another objective of this application is to provide an assembly method that can reduce the labor intensity of workers, reduce labor costs, and improve work efficiency and product quality.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] An assembly apparatus, comprising:

[0007] frame;

[0008] A conveying device is installed on the frame and connected to a first positioning component and a second positioning component. The first positioning component is used to position a first workpiece, and the second positioning component is used to position a second workpiece. The conveying device is used to drive the first positioning component and the second positioning component to move synchronously to a first workstation and a second workstation.

[0009] A first bonding device is provided at the first workstation for acquiring a first object and bonding the first object to the first workpiece after the first positioning component and the second positioning component move synchronously to the first workstation.

[0010] A second bonding device, located at the second workstation, is used to acquire the second object and, after the first positioning component and the second positioning component move synchronously to the second workstation, bond the second object to the second workpiece; and

[0011] A first processing device is located at the second workstation and is used to process the first workpiece that has been attached to the first object according to preset requirements after the first positioning component and the second positioning component move synchronously to the second workstation.

[0012] Optionally, the first object includes a first bonding member, and the first bonding device includes:

[0013] A first transfer component is configured to acquire the first bonding member and transfer the first bonding member between a first position and a second position, wherein the first position is the position where the first transfer component acquires the first bonding member, and the second position is the position where the first transfer component moves the first bonding member to adhere to or remove it from the first workpiece; and

[0014] The first detection component is used to detect the pose of the first workpiece;

[0015] The assembly equipment further includes a control device, which is coupled to the first transfer component, the first detection component, and the first positioning component. The control device is used to control the first transfer component to adjust the position of the first bonding component or to control the first positioning component to adjust the position of the first workpiece according to the position of the first workpiece, so that the first bonding component transferred by the first transfer component is bonded to the first workpiece.

[0016] An assembly method is applied to an assembly device, the assembly device including a conveying device, a first bonding device, a second bonding device, and a first processing device. The conveying device is connected to a first positioning component and a second positioning component. The first positioning component is used to position a first workpiece, and the second positioning component is used to position a second workpiece. The assembly method includes:

[0017] The control device drives the first positioning component and the second positioning component to move synchronously to the first workstation;

[0018] The first bonding device is controlled to acquire the first object and to bond the first object to the first workpiece. The first bonding device is located at the first work station.

[0019] The control device drives the first positioning component and the second positioning component to move synchronously to the second workstation;

[0020] The second bonding device is controlled to acquire the second object and to bond the second object to the second workpiece. The second bonding device is located at the second work station.

[0021] The first processing device is controlled to process the first workpiece that has been attached to the first object according to preset requirements. The first processing device is located at the second work station.

[0022] The assembly equipment provided in this application, by setting a first positioning component and a second positioning component and making the two move synchronously, realizes the synchronous switching of the first workpiece and the second workpiece between different workstations. This setting method of synchronously conveying workpieces with dual positioning components makes the structure compact and improves work efficiency.

[0023] By using a first bonding device to bond a first object to a first workpiece at a first station, and a second bonding device to bond a second object to a second workpiece at a second station, the bonding of objects and workpieces is automated, avoiding manual operation and reducing labor intensity and labor costs. At the same time, the automatic bonding of objects and workpieces by using the first and second bonding devices avoids the poor bonding consistency caused by human factors during manual bonding, thus improving bonding consistency, improving product quality, and facilitating the realization of uniform high-quality mass production.

[0024] By staggering the deployment of the first bonding device and the second bonding device, the first workpiece and the second workpiece can be bonded at different stations. This layout is particularly suitable for applications where bonding systems are miniaturized. In the context of miniaturized bonding systems, interference can be avoided when two bonding devices (such as the first bonding device and the second bonding device) bond workpieces with dual positioning components simultaneously in a small space.

[0025] In addition, both the second bonding device and the first processing device are located at the second workstation, which makes full use of the equipment space and makes the structure more compact. Furthermore, the second bonding device and the first processing device can be operated synchronously, avoiding the first workpiece of the first positioning component corresponding to the second positioning component being idle when the second workpiece of the second positioning component is being bonded, making the production rhythm more compact and improving work efficiency.

[0026] The assembly method provided in this application, by setting a first positioning component and a second positioning component and making them move synchronously, realizes the synchronous switching of the first workpiece and the second workpiece between different workstations. This arrangement of synchronously transporting workpieces with dual positioning components results in a compact structure and improved work efficiency. The first bonding device bonds the first object to the first workpiece at the first workstation, and the second bonding device bonds the second object to the second workpiece at the second workstation, achieving automated bonding of objects and workpieces. This avoids manual operation, reducing labor intensity and labor costs. Simultaneously, the automatic bonding of objects and workpieces using the first and second bonding devices avoids the poor bonding consistency caused by human factors during manual bonding, thus improving bonding consistency, enhancing product quality, and facilitating high-quality mass production. By using an asynchronous approach, where the first and second workpieces complete the same bonding process at several different workstations, while different processes are performed on the first and second workpieces at the same workstation, this layout is particularly suitable for applications requiring miniaturized bonding systems. In the context of miniaturized bonding systems, interference can be avoided when two bonding devices (such as the first and second bonding devices) simultaneously bond workpieces of dual-positioning components within a small space. This also allows for full utilization of equipment space, resulting in a more compact structure. Furthermore, it enables synchronized operation between the second bonding device and the first processing device, preventing the first workpiece of the corresponding first positioning component from being idle while the second workpiece of the second positioning component is being bonded, thus making the production rhythm more efficient and improving work efficiency. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of an assembly device according to an embodiment of this application;

[0029] Figure 2 This is a schematic diagram of the structure of an assembly device according to an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the structure of an assembly device according to an embodiment of this application;

[0031] Figure 4 This is a schematic diagram of the structure of an assembly device according to an embodiment of this application;

[0032] Figure 5 for Figure 4Top view;

[0033] Figure 6 This is a schematic diagram of the third processing device installed on the rack in an embodiment of this application;

[0034] Figure 7 This is a schematic diagram of the loading and unloading device installed on the frame in an embodiment of this application;

[0035] Figure 8 for Figure 1 A schematic diagram of the structure of the first bonding device in the middle;

[0036] Figure 9 This is a schematic diagram illustrating the bonding effect of the diaphragm after it is bonded to the first workpiece in an embodiment of this application;

[0037] Figure 10 for Figure 2 A schematic diagram of the structure of the first bonding device in the middle;

[0038] Figure 11 for Figure 10 A schematic diagram of the lateral limiting device.

[0039] Figure 12 This is a front view of the accessory in the embodiment of this application;

[0040] Figure 13 for Figure 12 Side view of the middle component;

[0041] Figure 14 for Figure 12 A schematic diagram showing the bonding effect of the middle component after it is bonded to the first workpiece;

[0042] Figure 15 A flowchart of the assembly method provided in a specific embodiment of this application;

[0043] Figure 16 A flowchart of the assembly method provided in specific embodiment two of this application;

[0044] Figure 17 This is a flowchart of the assembly method provided in Specific Embodiment 3 of this application;

[0045] Figure 18 This is a flowchart of the assembly method provided in Specific Embodiment 4 of this application.

[0046] Figures 1 to 14 The accompanying figure labels are as follows:

[0047] 100 is the frame, 200 is the conveying device, 300 is the first bonding device, 400 is the second bonding device, 500 is the first processing device, 600 is the second processing device, 700 is the third processing device, 800 is the loading and unloading device, and 900 is the control device.

[0048] 101 is the workpiece loading position, 102 is the qualified workpiece unloading position, and 103 is the defective product unloading position;

[0049] 201 is the first positioning component, 2011 is the positioning pin, 202 is the second positioning component, and 203 is the clamp.

[0050] 301 is the first transfer assembly, 302 is the first imaging device, 303 is the second imaging device, 304 is the first suction head, 305 is the first waste bin, 306 is the first feeding assembly, 3061 is the conveying component, 3062 is the sensing component, 307 is the third transfer assembly, 308 is the fifth imaging device, 309 is the sixth imaging device, 310 is the lateral limiting device, 3101 is the limiting plate, 3102 is the limiting component, 3103 is the force limiting structure, 3104 is the limiting seat, 3105 is the moving seat, 3106 is the boss, 3107 is the return spring, 311 is the second suction head, 312 is the second waste bin, 313 is the vibrating plate, 3131 is the vibrating component, and 3132 is the feeding part;

[0051] 01 is the first workpiece, 02 is the diaphragm, and 03 is the accessory;

[0052] a is the first plane, b is the second plane, c is the third plane, and d is the fourth plane. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0054] This application provides an assembly device and assembly method to reduce the labor intensity of workers, reduce labor costs, and improve work efficiency and product quality.

[0055] Please refer to Figure 1-4This application provides an assembly device, including a frame 100, a conveying device 200, a first bonding device 300, a second bonding device 400, and a first processing device 500. Specifically, the conveying device 200 is mounted on the frame 100 and connected to a first positioning component 201 and a second positioning component 202. The first positioning component 201 is used to position a first workpiece, and the second positioning component 202 is used to position a second workpiece. The conveying device 200 is used to drive the first positioning component 201 and the second positioning component 202 to move synchronously to a first workstation and a second workstation. The first bonding device 300 is located at the first... A first station is used to acquire a first object and, after the first positioning component 201 and the second positioning component 202 move synchronously to the first station, attach the first object to the first workpiece; a second bonding device 400 is located at the second station and is used to acquire a second object and, after the first positioning component 201 and the second positioning component 202 move synchronously to the second station, attach the second object to the second workpiece; a first processing device 500 is located at the second station and is used to process the first workpiece with the attached first object according to preset requirements after the first positioning component 201 and the second positioning component 202 move synchronously to the second station.

[0056] As can be seen, this embodiment sets up a first positioning component 201 and a second positioning component 202, and makes them move synchronously, so as to realize the synchronous switching of the first workpiece and the second workpiece between different workstations. This setting method of synchronously transporting workpieces with dual positioning components enables the operation of dual workstations in one transport, thereby improving work efficiency.

[0057] Furthermore, in this embodiment, the first bonding device 300 is used to bond the first object to the first workpiece at the first station, and the second bonding device 400 is used to bond the second object to the second workpiece at the second station. This achieves automated bonding of the object and the workpiece, avoiding manual operation and reducing the intensity of manual labor and labor costs. At the same time, the automatic bonding of the object and the workpiece by the first bonding device 300 and the second bonding device 400 avoids the poor bonding consistency caused by human factors during manual bonding. Therefore, it can improve the consistency of bonding, improve product quality, and facilitate the realization of uniform high-quality mass production.

[0058] By staggering the deployment of the first bonding device 300 and the second bonding device 400, the first workpiece and the second workpiece are bonded at different stations. This layout is particularly suitable for applications requiring miniaturized bonding systems. In the context of miniaturized bonding systems, interference can be avoided when two bonding devices (such as the first bonding device 300 and the second bonding device 400) simultaneously bond workpieces with dual positioning components within a small space. For example, when the bonding device is a robotic arm, its end effector requires more sensors or more sophisticated structures to perform precise positioning actions. Achieving higher precision usually requires the robotic arm end effector to occupy more space. Furthermore, since either the first or second workpiece being bonded requires specialized equipment for loading, it also increases the space required in compact assembly equipment (such as...). Figure 1 It is difficult to deploy various devices (such as the first bonding device, the second bonding device, the first processing device, the conveying device, and the feeding device) that meet the requirements of efficiency, accuracy, and automation on the rotary table-type combination machine shown. Therefore, by staggering the placement of larger devices and controlling the execution of two different processes at each station, for example by performing asynchronous process processing on the first workpiece and the second workpiece, it is possible to achieve a balance between efficiency, accuracy, and automation requirements in the assembly equipment.

[0059] It should be noted that this embodiment does not limit the specific number of the first positioning component 201 and the second positioning component 202. There can be multiple first positioning components 201 and multiple second positioning components 202, and they are configured in a one-to-one correspondence. Corresponding first positioning components 201 and second positioning components 202 can move synchronously to the same workstation (such as the first workstation or the second workstation). Thus, when the first set of corresponding first positioning components 201 and second positioning components 202 moves synchronously to the second workstation, the second set of corresponding first positioning components 201 and second positioning components 202 moves synchronously to the first workstation. At this time, the first adhesive can be used... The bonding device 300 bonds the first object to the first workpiece of the first positioning component 201 of the second group. Simultaneously, the second bonding device 400 bonds the second object to the second workpiece of the second positioning component 202 of the first group, achieving synchronous operation of the first bonding device 300 and the second bonding device 400. That is, in this embodiment, under the background of miniaturization of the bonding system, while ensuring that the two bonding devices (such as the first bonding device 300 and the second bonding device 400) do not interfere with each other, the first bonding device 300 and the second bonding device 400 can achieve synchronous operation at different workstations, realizing simultaneous bonding of different workpieces, thereby improving production efficiency. In addition, the conveying device 200 realizes the synchronous conveying of the first positioning components 201 and the second positioning components 202 of different groups, so that the first positioning components 201 and the second positioning components 202 of different groups move synchronously to different workstations, which can save production costs and energy.

[0060] Furthermore, after the first positioning component 201 and the second positioning component 202 move synchronously to the second workstation, while the second bonding device 400 bonds the second workpiece to the second object, the first processing device 500 can process the first workpiece that has been bonded to the first object according to preset requirements. Both the second bonding device 400 and the first processing device 500 are located at the second workstation, which makes full use of the equipment space and makes the structure more compact. In addition, the synchronous operation of the second bonding device 400 and the first processing device 500 can be realized, avoiding the first workpiece of the first positioning component 201 corresponding to the second positioning component 202 being idle when the second workpiece of the second positioning component 202 is bonded, making the production rhythm more compact and improving work efficiency.

[0061] Additionally, it should be noted that the first and second workstations in this embodiment are merely for distinguishing between two different workstations and do not represent that the assembly equipment provided in this embodiment includes only two workstations. This embodiment does not limit the specific number of workstations included in the assembly equipment. For example, in some embodiments, the assembly equipment includes four workstations, which, for ease of description, are referred to as the first workstation, the second workstation, the third workstation, and the fourth workstation, respectively.

[0062] When the first positioning component 201 and the second positioning component 202 move synchronously to the first work station, the first bonding device 300 (e.g., Figure 1 As shown, the first object is attached to the first workpiece. When the first positioning component 201 and the second positioning component 202 move synchronously to the second station, the first processing device 500 provided at the second station processes the first workpiece with the attached first object according to preset requirements. When the first positioning component 201 and the second positioning component 202 move synchronously to the third station, the first bonding device 300 provided at the third station (as shown) is used to bond the first object to the first workpiece. Figure 2 As shown, the first object is attached to the first workpiece that has been processed according to preset requirements. When the first positioning component 201 and the second positioning component 202 move synchronously to the fourth station, the first processing device 500 set at the fourth station processes the first workpiece that has been reattached to the first object according to another preset requirement.

[0063] It should be noted that the first objects bonded at the first and third workstations can be different. Furthermore, the first processing device 500 at the second and fourth workstations can process the first workpiece according to different preset requirements. For example, the first object bonded to the first workpiece at the first workstation can be a first colloid, which includes adhesive and a film; the first processing device 500 at the second workstation, according to preset requirements, removes the film from the first workpiece that has been bonded with the first colloid; the first object bonded to the first workpiece at the third workstation can be an accessory, and the first bonding device 300 at the third workstation bonds the accessory to the adhesive position of the first workpiece with the film removed, connecting the accessory to the first workpiece through adhesive; the first processing device 500 at the fourth workstation, according to another preset requirement, maintains pressure on the first workpiece with the attached accessory for a preset time.

[0064] Furthermore, based on this embodiment, such as Figure 3 As shown, the assembly equipment also includes a second processing device 600, located at the third station. This device processes the second workpiece, which has been attached to the second object, according to preset requirements after the first positioning component 201 and the second positioning component 202 have moved synchronously to the third station. That is, the second processing device 600 operates synchronously with the first attachment device 300 located at the third station, performing different operations on the first and second workpieces respectively. This asynchronous operation method, which simultaneously performs asynchronous operations on two workpieces on the dual positioning components, optimizes space utilization while avoiding interference between devices, thus improving work efficiency.

[0065] It should be noted that this embodiment does not limit the second object that the second bonding device 400 bonds to the second workpiece at the second station. Similarly, it does not specifically limit the processing of the second workpiece with the bonded second object by the second processing device 600 at the third station according to preset requirements. For example, the second object bonded to the second workpiece by the second bonding device 400 at the second station can be a second adhesive, which includes both adhesive and a film. In this case, the processing of the second workpiece with the bonded second object by the second processing device 600 at the third station according to preset requirements is: removing the film from the second workpiece with the bonded second adhesive. Of course, the second object bonded to the second workpiece by the second bonding device 400 at the second station can also be an accessory. In this case, the processing of the second workpiece with the bonded second object by the second processing device 600 at the third station according to preset requirements is: maintaining pressure on the second workpiece with the bonded accessory for a preset time.

[0066] Of course, second bonding devices 400 can also be set at the second and fourth workstations respectively, so that when the first positioning component 201 and the second positioning component 202 move synchronously to the second workstation, the second bonding device 400 set at the second workstation (e.g., Figure 1As shown, the second object is attached to the second workpiece, and when the first positioning component 201 and the second positioning component 202 move synchronously to the fourth station, the second bonding device 400 (as shown) located at the fourth station is used. Figure 2 As shown, the second object is attached to the second workpiece that has been processed according to the preset requirements.

[0067] In some embodiments, please refer to Figure 4 and Figure 5 The assembly equipment may include five stations: a first station, a second station, a third station, a fourth station, and a fifth station. The first and third stations are respectively equipped with a first bonding device 300A and a first bonding device 300B. The second and fourth stations are respectively equipped with a second bonding device 400A and a second bonding device 400B. Simultaneously, the second station is equipped with a first processing device 500, and the third station is equipped with a second processing device 600. The assembly equipment also includes a third processing device 700 (e.g., ...). Figure 6 As shown, the bonding device 400, located at the fifth station, is used to simultaneously process the first workpiece (which has been re-bonded to the first object) and the second workpiece (which has been re-bonded to the second object) according to another preset requirement. That is, it can also change the asynchronous processing of the two workpieces to synchronous processing at certain stations. For ease of description, the first bonding device 300 located at the first station is referred to as the first bonding device 300A, the first bonding device 300 located at the third station is referred to as the first bonding device 300B, the second bonding device 400 located at the second station is referred to as the second bonding device 400A, and the second bonding device 400 located at the fourth station is referred to as the second bonding device 400B. Since the objects being bonded are different, the first bonding device 300A and the first bonding device 300B can be different, and the second bonding device 400A and the second bonding device 400B can also be different. The first bonding device 300A bonds the first colloid and the first workpiece; the first bonding device 300B bonds the first workpiece and the first accessory that have been bonded to the first object after being processed according to preset requirements; the second bonding device 400A bonds the second colloid and the second workpiece; and the second bonding device 400B bonds the second workpiece and the second accessory that have been bonded to the second object after being processed according to preset requirements.

[0068] During operation, the conveying device 200 drives the first positioning component 201 and the second positioning component 202 to move synchronously to the first station, where the first bonding device 300A bonds the first adhesive to the first workpiece. The conveying device 200 then drives the first positioning component 201 and the second positioning component 202 to move synchronously to the second station, where the first processing device 500 processes the first workpiece bonded to the first object according to preset requirements, such as removing the film from the first workpiece bonded with the first adhesive. Simultaneously, the second bonding device 400A bonds the second adhesive to the second workpiece. The conveying device 200 then drives the first positioning component 201 and the second positioning component 202 to move synchronously to the third station, where the first bonding device 300B bonds the first accessory to the first workpiece processed according to preset requirements. Simultaneously, the second processing device 600 processes the second workpiece bonded to the second object according to preset requirements, such as removing the film from the second workpiece bonded with the second adhesive.

[0069] The conveying device 200 drives the first positioning component 201 and the second positioning component 202 to move synchronously to the fourth station, where the second bonding device 400B bonds the second accessory to the second workpiece that has been processed according to preset requirements. The conveying device 200 drives the first positioning component 201 and the second positioning component 202 to move synchronously to the fifth station, where the third processing device 700 simultaneously processes the first workpiece with the first accessory bonded and the second workpiece with the second accessory bonded according to another preset requirement, such as a preset pressure holding time.

[0070] Further, please refer to Figure 7 Based on the above embodiments, the conveying device 200 can drive the first positioning component 201 and the second positioning component 202 to move to the sixth station. The assembly equipment also includes a loading and unloading device 800, which is located at the sixth station and is used to remove the first workpiece that has been processed according to another preset requirement from the first positioning component 201 and to remove the second workpiece that has been processed according to another preset requirement from the second positioning component 202. In addition, the loading and unloading device 800 is also used to install the first workpiece to be loaded with the first object onto the first positioning component 201 and to install the second workpiece to be loaded with the second object onto the second positioning component 202.

[0071] In some embodiments, please refer to Figure 5The frame 100 is provided with a workpiece loading position 101, a qualified workpiece unloading position 102, and a defective workpiece unloading position 103. The workpiece loading position 101 is used to receive a first workpiece without a first object and a second workpiece without a second object. The qualified workpiece unloading position 102 is used to receive a qualified first workpiece with a first object and a qualified second workpiece with a second object. The defective workpiece unloading position 103 is used to receive a defective first workpiece with a first object and a defective second workpiece with a second object. In this case, the loading and unloading device 800 can install the first workpiece and the second workpiece at the workpiece loading position 101 to the first positioning component 201 and the second positioning component 202 respectively, unload the first workpiece with the first object installed on the first positioning component 201 and the second workpiece with the second object installed on the second positioning component 202 and the second workpiece with the second object installed on the second positioning component 202 to the qualified workpiece unloading position 102, and unload the first workpiece with the first object installed on the first positioning component 201 and the second workpiece with the second object installed on the second positioning component 202 and the second workpiece with the second object installed on the second positioning component 202 to the defective product unloading position 103.

[0072] Furthermore, such as Figure 1 As shown, in some embodiments, the conveying device 200 is a rotary conveying device 200, including a rotatable turntable that can be positioned at a first workstation and a second workstation. A first positioning component 201 and a second positioning component 202 are disposed on the turntable, and a first bonding device 300, a second bonding device 400, and a first processing device 500 are all disposed on the side of the turntable. During operation, by controlling the rotation of the turntable, the turntable drives the first positioning component 201 and the second positioning component 202 to move synchronously to the first workstation and the second workstation. The rotary conveying device 200 has a compact structure, occupies a small area, and the first positioning component 201 and the second positioning component 202 can be recycled, saving on fixture costs.

[0073] Of course, in other embodiments, the conveying device 200 can also be a production line conveying device 200. The production line conveying device 200 drives the first positioning component 201 and the second positioning component 202 to move synchronously to the first workstation and the second workstation along the conveying direction of the production line conveying device 200. The first bonding device 300, the second bonding device 400, and the first processing device 500 are all located on the side of the production line conveying device 200. The production line conveying device 200 is beneficial for conveying the first workpiece and the second workpiece in a preset direction, which facilitates the structural layout.

[0074] It should be noted that the specific structure of the first bonding device 300 is not limited in the above embodiments.

[0075] Please refer to Figure 8In some embodiments, the first object includes a first bonding component, and the first bonding device 300 includes a first transfer component 301 and a first detection component. The first transfer component 301 is used to acquire the first bonding component and transfer the first bonding component between a first position and a second position. The first position is the position where the first transfer component 301 acquires the first bonding component, and the second position is the position where the first transfer component 301 drives the first bonding component to bond to or leave the first workpiece. The first detection component is used to detect the pose of the first workpiece. The assembly equipment also includes a control device 900, which is coupled to the first transfer component 301, the first detection component, and the first positioning component 201, respectively. The control device 900 is used to control the first transfer component 301 to adjust the pose of the first bonding component or control the first positioning component 201 to adjust the pose of the first workpiece according to the pose of the first workpiece, so that the first bonding component transferred by the first transfer component 301 is bonded to the first workpiece.

[0076] In this embodiment, the first bonding element can be the aforementioned first adhesive, or other suitable structures; when applying the film, such as Figure 9 As shown, the diaphragm 02 can be a structure with a first colloid on one side, and the first colloid only covers part of the surface of the diaphragm. During the bonding process, the first colloid is bonded to the bonding area of ​​the first workpiece 01, and part of the diaphragm 02 extends out of the first workpiece 01.

[0077] like Figure 8 As shown, for ease of explanation, the first transfer component 301 may be a robot, disposed on one side of the conveying device 200, with the end of the robot used to acquire the first bonding component; the robot may also be replaced by a multi-degree-of-freedom module or other structure. In some embodiments, the end of the first transfer component 301 is provided with a first suction head 304 to pick up the first bonding component.

[0078] The first detection component can be an imaging device used to acquire an image of the first workpiece located at a second position, so as to obtain the pose of the first workpiece through the image. It should be noted that the pose of the first workpiece specifically refers to the position, angle, shape, etc. of the first workpiece. In this embodiment, obtaining the pose of the first workpiece can be done by acquiring information such as the position, rotation angle relative to the plane, shape, and protrusion height of the first workpiece.

[0079] In addition, such as Figure 11 As shown, the first positioning component 201 is provided with a positioning pin 2011, which is used to limit the position of the first workpiece in the first positioning component 201; when the shape and size of the first workpiece change, the shape and size of the first positioning component 201 can be adjusted accordingly.

[0080] During operation, after the first positioning component 201 and the second positioning component 202 move synchronously to the first workstation, the first detection component detects the position and orientation of the first workpiece and sends the position and orientation of the first workpiece to the control device 900. The control device 900 controls the first transfer component 301 to adjust the position and orientation of the first bonding component according to the position and orientation of the first workpiece, or controls the first positioning component 201 to adjust the position and orientation of the first workpiece, so that the first bonding component transferred by the first transfer component 301 is bonded to the first workpiece.

[0081] It should be noted that a fixture 203 for mounting the first workpiece can be provided in the first positioning component 201. When the position of the first workpiece does not match the position of the first bonding component, the fixture 203 or the first positioning component 201 can be controlled to move, tilt, or rotate until the position of the first workpiece matches the position of the first bonding component. The first positioning component 201 or the fixture 203 can be controlled to move towards the first bonding component so that the first workpiece and the first bonding component are bonded.

[0082] As can be seen, the first bonding device 300 in this embodiment improves the bonding accuracy of the first bonding component, and the bonding process is convenient and easy to operate.

[0083] In some embodiments, such as Figure 8 As shown, the first detection component includes a first imaging device 302, which is coupled to a control device 900 and installed on the first transfer component 301, located on one side of the first workpiece, and is used to acquire an image of the first bonding component located at a first position; the control device 900 is also used to control the first transfer component 301 to acquire the first bonding component based on the image of the first bonding component located at the first position.

[0084] Specifically, such as Figure 8 As shown, when the first feeding component 306 conveys the first bonding component to the first position, the first imaging device 302 acquires an image of the first bonding component at the first position and transmits the image information to the control device 900. Based on the image of the first bonding component at the first position, the control device 900 acquires the precise position, shape, and posture information of the first bonding component and determines whether the first bonding component is complete and whether its position and posture meet the requirements. When the first bonding component is a film and the film is provided with adhesive, it can also determine whether the adhesive position and adhesive surface are correct. When the position and posture of the first bonding component meet the preset requirements, the control device 900 controls the first transfer component 301 to move to the first position to acquire the first bonding component.

[0085] This embodiment obtains an image of the first bonding component located at the first position, and obtains information such as the precise position, shape, and orientation of the first bonding component located at the first position. This is beneficial for the first transfer component 301 to accurately acquire the first bonding component. At the same time, the orientation of the first bonding component is detected before acquiring the first bonding component to avoid acquiring a first bonding component that does not meet the requirements.

[0086] Please refer to Figure 8 In some embodiments, the first feeding component 306 includes a conveyor 3061, which is a feeding feeder used to convey the film to a first position. A sensing element 3062 is provided at the first position. When the sensing element 3062 senses that the film is at the first position, it sends information to the control device 900. The control device 900 controls the conveyor 3061 to stop conveying so that the film is at the first position.

[0087] Please refer to Figure 8 In some embodiments, the first detection component includes a second imaging device 303, which is coupled to a control device 900 and located on the side of the first workpiece to be bonded away from the first positioning component 201. The second imaging device 303 is used to acquire an image of the first bonding component and the first workpiece to be bonded at a second position. The control device 900 is also used to control the first transfer component 301 to adjust the pose of the first bonding component or control the first positioning component 201 to adjust the pose of the first workpiece based on the image of the first bonding component and the first workpiece to be bonded at the second position.

[0088] It should be noted that the second imaging device 303 is located on the side of the first workpiece to be bonded away from the first positioning component 201. Specifically, when the area to be bonded is located on the upper surface of the first workpiece and the first workpiece is located on the upper surface of the first positioning component 201, the second imaging device 303 is located on the side closer to the area to be bonded; when the area to be bonded is located on the lower surface of the first workpiece and the first workpiece is located on the upper surface of the first positioning component 201, the second imaging device 303 is located on the side closer to the first positioning component 201; when the relative positions of the first workpiece, the area to be bonded, and the first positioning component 201 change, the position of the second imaging device 303 can be adjusted accordingly.

[0089] The second imaging device 303 can take pictures of the area to be bonded or the first bonding component and the area to be bonded from top to bottom. Specifically, the second imaging device 303 can acquire an image that includes the first bonding component and the area to be bonded. By using the image of the first bonding component and the area to be bonded at a second position, the relative position of the first bonding component and the area to be bonded can be obtained, and the pose of the first bonding component or the area to be bonded can be adjusted according to the image of the first bonding component and the area to be bonded at the second position to ensure that the first bonding component is bonded to the appropriate position of the area to be bonded and to improve the bonding accuracy of the first bonding component. Alternatively, the second imaging device can take pictures of the area to be bonded and the first bonding component at the second position respectively, and adjust the pose of the first bonding component or the area to be bonded by analyzing the images of the area to be bonded and the first bonding component at the second position respectively.

[0090] Based on the image of the first bonding component and the area to be bonded located at the second position obtained by the second imaging device 303, the pose of the first bonding component or the area to be bonded is adjusted. The pose adjustment may include adjusting the size of the first bonding component extending out of the area to be bonded, the bonding angle of the first bonding component, the bonding position of the first bonding component, etc.

[0091] Please refer to Figure 8 In some embodiments, the first bonding device 300 further includes a first waste bin 305, so that if the position of the first bonding component still does not match the position of the first workpiece after adjusting the position of the first bonding component, the first transfer component 301 is controlled to move the first bonding component away from the first workpiece and throw the first bonding component whose position does not match the position of the first workpiece into the first waste bin 305.

[0092] In some embodiments, the first object includes a membrane and an adhesive component, the adhesive component being bonded to the first workpiece, and the preset requirement is to remove the membrane from the first workpiece to which the first object has been bonded; the first processing device 500 includes a second detection component, a suction head, and a moving component, the second detection component being used to acquire the spatial position of the membrane, the spatial position including the height position of the membrane or the portion of the first workpiece bonded to the membrane; the suction head being used to adsorb one side of the membrane; the moving component being connected to the suction head and used to drive the suction head to move toward or away from the first workpiece; the assembly device further includes a control device 900, the control device 900 being coupled to the second detection component, the moving component, and the suction head respectively, the control device 900 being used to control the moving component to drive the suction head to move according to the height position of the membrane, so as to separate the membrane from the first workpiece when the membrane is adsorbed.

[0093] When the first processing device 500 is working, it uses the second detection component to obtain the spatial position of the membrane, including the height position of the membrane or the height position of the part of the first workpiece that is attached to the membrane. After obtaining the spatial position of the membrane, the second detection component transmits the spatial position to the control device 900. The control device 900 controls the movement component to move according to the spatial position, so that the movement component moves the suction head to a position where the membrane to be to be torn can be adsorbed. At this time, the suction head can be in contact with the membrane or there can be a small gap between the suction head and the membrane. Then, the control device 900 controls the suction head to adsorb one side of the membrane to be to be torn, so that the membrane is adsorbed on the suction head. At this time, the membrane is in an adsorbed state. At this time, the control device 900 controls the movement component to move the suction head away from the first workpiece. During the movement, the adsorbed membrane moves relative to the first workpiece. Since the adsorption force of the suction head on the membrane is greater than the adhesion force between the membrane and the first workpiece, and the membrane is not fixed by other equipment, the membrane can be separated from the first workpiece when the suction head moves to the appropriate position.

[0094] Therefore, this embodiment utilizes the first processing device 500 to automate the film-tearing process, avoiding manual film tearing, improving tearing efficiency, and reducing labor costs. Moreover, by detecting the spatial position of the film before tearing and controlling the movement of the suction head based on the detected spatial position, the accuracy of the suction head adsorption process is improved, avoiding insufficient suction or damage to the film or the first workpiece, thus improving the operational precision of the film-tearing process. In addition, during the film-tearing process, the suction head can adsorb soft films, avoiding the impact of film bending and deformation on clamping, thereby improving the reliability of the first processing device 500.

[0095] In some embodiments, the conveying device 200 is further used to drive the first positioning component 201 and the second positioning component 202 to move synchronously to the third station; the assembly equipment also includes a third bonding device, which is located at the third station and is used to acquire a third object and bond the third object to the first workpiece that has been processed according to preset requirements after the first positioning component 201 and the second positioning component 202 move synchronously to the third station.

[0096] In other words, in this embodiment, when the first positioning component 201 and the second positioning component 202 move synchronously to the first station, the first bonding device 300 bonds the first object to the first workpiece; when the first positioning component 201 and the second positioning component 202 move synchronously to the second station, the first processing device 500 processes the first workpiece with the bonded first object according to preset requirements; when the first positioning component 201 and the second positioning component 202 move synchronously to the third station, the third bonding device bonds the third object to the first workpiece that has been processed according to preset requirements. In this way, the third object and the first object can be superimposed and bonded. For example, the first object is a colloid, which includes adhesive and a film. The adhesive is bonded to the first workpiece. At this time, the first processing device 500 processes the first workpiece that has been bonded with the first object according to the preset requirements by removing the film from the first workpiece that has been bonded with the colloid, so that the adhesive remains on the first workpiece. The third bonding device bonds the third object to the first workpiece that has been processed according to the preset requirements by bonding the third object to the position of the adhesive on the first workpiece, thereby realizing the bonding of the third object to the first workpiece through bonding.

[0097] In some embodiments, the third bonding device includes a second transfer component and a third detection component. The second transfer component is used to acquire a third object, which may be the first bonding component described in the above embodiments. It then transfers the third object between a third position and a fourth position, where the third position is the position where the second transfer component acquires the third object, and the fourth position is the position where the second transfer component drives the third object to bond with or leave the first workpiece. The third detection component is used to detect the pose of the first workpiece after it has been processed according to preset requirements. The assembly equipment also includes a control device 900, which is coupled to both the second transfer component and the third detection component. The control device 900 is used to control the second transfer component to adjust the pose of the third object or to control the first positioning component 201 to adjust the pose of the first workpiece according to the pose of the first workpiece after it has been processed according to preset requirements, so that the third object transferred by the second transfer component bonds to the first workpiece after it has been processed according to preset requirements.

[0098] In this embodiment, the third object can be a small precision component, the first fitting component described in the above embodiment, or other suitable structures; such as... Figures 12-14 As shown, the third object is accessory 03, which has a bent L-shaped structure. During the bonding process, the fourth plane d of the L-shaped structure is bonded to the first workpiece 01, the second plane b of accessory 03 is parallel to the first plane a of the first workpiece 01, and the second plane b of accessory 03 is spaced apart from the first plane a of the first workpiece 01. The fourth plane d of accessory 03 is spaced apart from the third plane c of the first workpiece 01 to prevent accessory 03 from deflecting during the bonding process.

[0099] The third detection component can be an image capture device used to acquire an image of the first workpiece at a fourth position, so as to obtain the pose of the first workpiece through the image. It should be noted that the pose of the first workpiece specifically refers to the position, angle, shape, etc. of the first workpiece. In this embodiment, obtaining the pose of the first workpiece can be done by acquiring information such as the position, rotation angle relative to the plane, shape, and protrusion height of the first workpiece.

[0100] During operation, after the first positioning component 201 and the second positioning component 202 move synchronously to the third station, the third detection component detects the position and orientation of the first workpiece and sends the position and orientation of the first workpiece to the control device 900. The control device 900 controls the second transfer component to adjust the position and orientation of the third object according to the position and orientation of the first workpiece, or controls the first positioning component 201 to adjust the position and orientation of the first workpiece, so that the third object transferred by the second transfer component fits into the first workpiece.

[0101] In some embodiments, the third detection component includes a third imaging device and a fourth imaging device. The third imaging device is coupled to the control device 900 and is located on the side of the first workpiece to be bonded away from the first positioning component 201, for acquiring a first image of the third object and the first workpiece to be bonded at a fourth position. The fourth imaging device is coupled to the control device 900 and is located on the side of the first workpiece to be bonded close to the first positioning component 201, for acquiring a second image of the third object and the first workpiece to be bonded at a fourth position. The control device 900 is also used to control the second transfer component to adjust the pose of the third object or control the first positioning component 201 to adjust the pose of the first workpiece based on the first image and the second image.

[0102] In this embodiment, the third imaging device is located on the side of the area to be bonded away from the first positioning component 201, and the fourth imaging device is located on the side of the area to be bonded close to the first positioning component 201. Specifically, when the area to be bonded is located on the upper surface of the first workpiece and the first workpiece is located on the upper surface of the first positioning component 201, the third imaging device is located on the side close to the area to be bonded, and the fourth imaging device is located on the side close to the first positioning component 201; when the area to be bonded is located on the lower surface of the first workpiece and the first workpiece is located on the upper surface of the first positioning component 201, the third imaging device is located on the side close to the first positioning component 201, and the fourth imaging device is located on the side close to the first positioning component 201. The device is located on the side closer to the first workpiece. When the relative positions of the first workpiece, the area to be bonded, and the first positioning component 201 change, the relative positions of the third and fourth imaging devices can be adjusted accordingly. However, the third and fourth imaging devices are always positioned on opposite sides of the area to be bonded. One device acquires a first image of the area to be bonded at the fourth position from one side of the area to be bonded, or a first image of the area to be bonded and the third object at the fourth position. The other device acquires a second image of the area to be bonded at the fourth position from the other side of the area to be bonded, or a second image of the area to be bonded and the third object at the fourth position.

[0103] The third imaging device can take a picture of the area to be bonded or the third object and the area to be bonded from top to bottom. Specifically, the third imaging device can acquire an image that includes the third object and the area to be bonded. The relative position of the third object and the area to be bonded can be obtained from the first image of the third object and the area to be bonded in the fourth position. Alternatively, the area to be bonded and the third object located in the fourth position can be photographed separately. By analyzing the first images of the area to be bonded and the third object located in the fourth position, the pose of the third object or the area to be bonded can be adjusted.

[0104] Similarly, the fourth imaging device can take pictures of the area to be bonded or the area to be bonded and the third object from bottom to top. Specifically, the fourth imaging device can acquire an image that includes the area to be bonded and the third object. By using the second image of the area to be bonded and the third object in the fourth position, the relative position of the area to be bonded and the third object can be obtained. Alternatively, the area to be bonded and the third object in the fourth position can be photographed separately. By analyzing the second images of the area to be bonded and the third object in the fourth position, the pose of the third object or the area to be bonded can be adjusted.

[0105] Based on the first and second images, the second transfer component is controlled to adjust the pose of the third object, or the first positioning component 201 is controlled to adjust the pose of the first workpiece. The pose adjustment may include adjusting the size of the third object extending out of the bonding area, the gap between the third object and the edge of the bonding area, and the bonding angle of the third object.

[0106] Please refer to Figure 10 In some embodiments, the first workpiece is provided with a bonding portion. The first bonding device 300 includes a third transfer component 307 and a fourth detection component. The third transfer component 307 is used to acquire the first object and transfer the first object between a fifth position and a sixth position. The fifth position is the position where the third transfer component 307 acquires the first object, and the sixth position is the position where the third transfer component 307 drives the first object to bond with or leave the bonding portion. The fourth detection component is used to detect the position and orientation of the bonding portion. The assembly equipment also includes a control device 900, which is coupled to the third transfer component 307 and the fourth detection component. The control device 900 is used to control the third transfer component 307 to adjust the position and orientation of the first object or control the first positioning component 201 to adjust the position and orientation of the bonding portion according to the position and orientation of the bonding portion, so that the first object transferred by the third transfer component 307 is bonded to the bonding portion.

[0107] In other words, when the first positioning component 201 and the second positioning component 202 move synchronously to the first workstation, the first workpiece will have an adhesive portion, which can refer to the adhesive after the film is peeled off. Furthermore, the first object in this embodiment can have the same structure as the third object mentioned above; for example, the first object can be as follows: Figures 12-14 The accessory 03 is shown. In this embodiment, the structure of the first bonding device 300 can be the same as the structure of the third bonding device described above.

[0108] In some embodiments, the end of the third transfer assembly 307 is provided with a second suction head 311 to pick up the first object.

[0109] The fourth detection component can be an imaging device used to acquire an image of the bonding portion at the sixth position, so as to obtain the pose of the bonding portion through the image. It should be noted that the pose of the bonding portion specifically refers to the position, angle, shape, etc. of the bonding portion. In this embodiment, obtaining the pose of the bonding portion can be done by acquiring information such as the position of the bonding portion, the rotation angle relative to the plane, the shape, and the height of the protrusion.

[0110] Please refer to Figure 10 In some embodiments, the fourth detection component includes a fifth imaging device 308, which is coupled to a control device 900 and installed on the third transfer component 307, located on one side of the bonding portion, for acquiring an image of the first object located at the fifth position; the control device 900 is also used to control the third transfer component 307 to acquire the first object based on the image of the first object located at the fifth position.

[0111] Specifically, the second feeding component disperses the first object into a disordered state. The fifth imaging device 308 is used to acquire an image of the first object in the dispersed state at the fifth position and transmits the image information to the control device 900. The control device 900 acquires the position, shape, posture and other information of the first object that meet the requirements based on the image of the first object at the fifth position, and determines whether the first object is complete and whether its position and posture meet the requirements. When the position and posture of the first object meet the preset requirements, the control device 900 controls the third transfer component 307 to move to the fifth position to acquire the first object.

[0112] In some embodiments, such as Figure 10 As shown, the second feeding component is a vibratory feeder 313, which includes a vibrating element 3131 and a feeding section 3132. The fifth position is located in the feeding section 3132. The vibrating element 3131 can vibrate the first object to the feeding section 3132 so that the first object is located in the fifth position. By controlling the vibration of the vibrating element 3131, multiple first objects can be dispersed into a disordered state and placed in the feeding section 3132. The fifth imaging device 308 acquires image information of multiple first objects in the feeding section 3132. Based on the image information, the position of the first object that meets the requirements is obtained. Based on the position of the first object that meets the requirements, the third transfer component 307 is controlled to acquire the first object.

[0113] Please refer to Figure 10 In some embodiments, the fourth detection component includes a sixth imaging device 309, which is coupled to a control device 900 and located on the side of the bonding portion away from the first positioning component 201. The sixth imaging device 309 is used to acquire a third image of the first object and the bonding portion at a sixth position. The control device 900 is also used to control the third transfer component 307 to adjust the pose of the first object or control the first positioning component 201 to adjust the pose of the bonding portion based on the third image of the first object and the bonding portion at the sixth position.

[0114] The fourth detection component also includes a seventh imaging device, which is coupled to a control device 900 and located on the side of the bonding portion near the first positioning component 201. The seventh imaging device is used to acquire a fourth image of the first object and the bonding portion at a sixth position. The control device 900 is also used to control the third transfer component 307 to adjust the pose of the first object or control the first positioning component 201 to adjust the pose of the bonding portion based on the third and fourth images.

[0115] It should be noted that the specific settings of the sixth and seventh shooting devices are the same as those of the third and fourth shooting devices described above. The method by which the sixth shooting device 309 acquires the third image is the same as the method by which the third shooting device acquires the first image, and the method by which the seventh shooting device acquires the fourth image is the same as the method by which the fourth shooting device acquires the second image. These details will not be repeated here.

[0116] In this embodiment, the third transfer component 307 can be controlled to adjust the position of the first object or the first positioning component 201 can be controlled to adjust the position of the fitting part based solely on the third image obtained by the sixth shooting device 309 showing the first object and the fitting part at the sixth position; alternatively, the third transfer component 307 can be controlled to adjust the position of the first object or the first positioning component 201 can be controlled to adjust the position of the fitting part based on the third image obtained by the sixth shooting device 309 and the fourth image obtained by the seventh shooting device.

[0117] In some embodiments, such as Figure 10 As shown, there are two sixth imaging devices 309, one of which is used to acquire a first image of the first workpiece's mating part being located in the second position, and the other is used to acquire a first image of the first object being located in the second position.

[0118] Please refer to Figure 10 In some embodiments, the first bonding device 300 further includes a second waste bin 312, so that if the position of the first object still does not match the position of the bonding part after the position of the first object is adjusted, the first transfer component 301 is controlled to move the first object away from the first workpiece and throw the first object whose position does not match the position of the bonding part into the second waste bin 312.

[0119] Please refer to Figure 11 In some embodiments, the assembly equipment further includes a limiting plate 3101, a limiting member 3102, a limiting seat 3104, and a movable seat 3105. The limiting plate 3101 is located at the first station, and after the first positioning component 201 and the second positioning component 202 move synchronously to the first station, the limiting plate 3101 is located on one side of the first positioning component 201. The limiting member 3102 is connected to the limiting plate 3101 and can extend or retract from the limiting plate 3101. The limiting member 3102 is used to abut against the side of the first object when the first bonding device 300 bonds the first object to the first workpiece. The limiting plate 3101 is movably disposed on the limiting seat 3104, and the limiting seat 3104 is provided with a protrusion that limits the travel of the limiting plate 3101. The movable seat 3105 is used to push the limiting plate 3101 to move to abut against the protrusion.

[0120] like Figure 10 As shown, the side of the conveying device 200 is also provided with a lateral limiting device 310. When the first positioning component 201 and the second positioning component 202 move synchronously to the first work station, the lateral limiting device 310 is located on one side of the first positioning component 201. Figure 11As shown, the lateral limiting device 310 includes a limiting plate 3101, a limiting member 3102, a limiting seat 3104, and a movable seat 3105. The limiting member 3102 can be configured as a push pin, which is extended or retracted and installed on the limiting plate 3101. The limiting plate 3101 is slidable relative to the limiting seat 3104. The limiting seat 3104 is provided with a protrusion for limiting the travel of the limiting plate 3101. The movable seat 3105 is movable and can push the limiting plate 3101 toward the protrusion during movement until the limiting plate 3101 abuts against the protrusion. The assembly device also includes a reset spring 3107 for resetting the limiting plate 3101. One end of the reset spring 3107 is connected to the limiting plate 3101, and the other end is connected to the limiting seat 3104.

[0121] In some embodiments, the preset requirement is to maintain pressure on the first workpiece, which has been attached to the first object, for a preset time; the first processing device 500 includes a pressure holding module, a first detection module, and a motion module. The number of pressure holding modules is at least one. Each pressure holding module includes a pressure holding head and a lifting drive component. The pressure holding head is used to maintain pressure on the first object attached to the first workpiece. The lifting drive component is connected to the pressure holding head and is used to adjust the position of the pressure holding head in a first direction. The projection of the detection component of the first detection module and the projection of the pressure holding head on the projection plane do not coincide. The projection plane is a plane perpendicular to the first direction. Both the pressure holding module and the first detection module are mounted on the motion module. The motion module is used to move the pressure holding module along the second direction to a position corresponding to the first workpiece or to move the first detection module along the second direction to a position corresponding to the first workpiece. The first direction and the second direction are different.

[0122] During operation, the pressure-holding module applies pressure to the first workpiece, while the first detection module detects the placement of the first workpiece. Since the first detection module and the pressure-holding module are respectively mounted on the motion module, the motion module drives the pressure-holding module to move along a second direction to a position corresponding to the first workpiece. A lifting drive component moves the pressure-holding head along a first direction to apply pressure to the first workpiece, thus providing pressure to the first workpiece. Then, the lifting drive component moves the pressure-holding head in the opposite direction along the first direction to move away from the first workpiece. The motion module drives the first detection module to move along the second direction to a position corresponding to the first workpiece to detect the placement of the first workpiece.

[0123] As can be seen, the first processing device 500 in this embodiment can realize the functions of pressure holding and re-inspection after pressure holding, replacing the traditional manual pressure holding module and microscope re-inspection, reducing manpower requirements and lowering labor costs. Moreover, the pressure holding module is integrated with the first detection module, resulting in a compact overall structure, relatively small space occupation, and short re-inspection time, thus improving the efficiency of pressure holding and re-inspection.

[0124] In some embodiments, the first processing device 500 further includes a second detection module connected to a motion module, the second detection module and the first detection module being located on opposite sides of the first workpiece; the motion module is also used to move the second detection module along a second direction to a position corresponding to the first workpiece.

[0125] It is understandable that the second detection module and the first detection module are located on opposite sides of the first workpiece, enabling detection from different directions to meet different detection requirements. Furthermore, when the motion module moves the first and second detection modules along the second direction to correspond to the opposite sides of the first workpiece, the first and second detection modules can simultaneously detect the first workpiece, improving detection efficiency.

[0126] Of course, in other embodiments, a first detection module can be provided independently without a second detection module. When it is necessary to detect different sides of the first workpiece, the first workpiece can be moved so that its different sides correspond to the first detection module to achieve the corresponding detection. Alternatively, the motion module can also be configured to move the first detection module to correspond to the different sides of the first workpiece to achieve the corresponding detection.

[0127] It should be noted that in the embodiments of this application, the specific structure of the second bonding device 400 is the same as that of the first bonding device 300, and will not be described again here.

[0128] In addition to the assembly equipment described above, this application also provides an assembly method. This assembly method is applied to the assembly equipment, but should not be limited to it. Taking the assembly equipment described above as an example, the assembly equipment includes a conveying device 200, a first bonding device 300, a second bonding device 400, and a first processing device 500. The conveying device 200 is connected to a first positioning component 201 and a second positioning component 202. The first positioning component 201 is used to position a first workpiece, and the second positioning component 202 is used to position a second workpiece. The assembly equipment here can be any of the assembly equipment disclosed in the above embodiments, or it can be other assembly equipment that includes the above-described devices.

[0129] Please refer to Figure 15 The assembly method includes steps S101 to S105:

[0130] S101: Control the conveying device 200 to drive the first positioning component 201 and the second positioning component 202 to move synchronously to the first work station.

[0131] S102: Control the first bonding device 300 to acquire the first object, and control the first bonding device 300 to bond the first object to the first workpiece. The first bonding device 300 is located at the first work station.

[0132] S103: Control the conveying device 200 to drive the first positioning component 201 and the second positioning component 202 to move synchronously to the second work station.

[0133] S104: Control the second bonding device 400 to acquire the second object, and control the second bonding device 400 to bond the second object to the second workpiece. The second bonding device 400 is located at the second work station.

[0134] S105: Control the first processing device 500 to process the first workpiece that has been attached to the first object according to preset requirements. The first processing device 500 is located at the second work station.

[0135] It should be noted that the conveying device 200 can be a rotary conveyor or an assembly line conveyor, as long as the conveying device 200 can drive the first positioning component 201 and the second positioning component 202 to move synchronously to the first or second workstation. Using the conveying device 200 to achieve synchronous conveying of the first positioning component 201 and the second positioning component 202 can save production costs and energy.

[0136] As can be seen, in this embodiment, the first positioning component 201 and the second positioning component 202 drive the workpiece to move synchronously, so as to realize the synchronous switching of the first workpiece and the second workpiece between different workstations. This setting method of synchronously conveying workpieces with dual positioning components makes the structure compact and improves work efficiency.

[0137] Furthermore, when the first positioning component 201 and the second positioning component 202 move synchronously to the first station, the first bonding device 300 can bond the first object to the first workpiece; when the first positioning component 201 and the second positioning component 202 move synchronously to the second station, the second bonding device 400 can bond the second object to the second workpiece. That is, the automatic bonding of the object and the workpiece is realized, avoiding manual operation, reducing the intensity of manual labor and labor costs. At the same time, the automatic bonding of the object and the workpiece by the first bonding device 300 and the second bonding device 400 avoids the poor bonding consistency caused by human factors during manual bonding, improves bonding consistency, improves product quality, and is conducive to achieving mass production with uniform quality.

[0138] The first bonding device 300 and the second bonding device 400 are respectively deployed at the first station and the second station, so that the first workpiece and the second workpiece can be bonded at different stations. That is, the two are staggered. In the context of miniaturization of the bonding system, interference can be avoided when the first bonding device 300 and the second bonding device 400 bond the workpiece of the dual positioning component at the same time in a small space.

[0139] It should be noted that there can be multiple first positioning components 201 and multiple second positioning components 202, and each first positioning component 201 and second positioning component 202 corresponds one-to-one. That is, the corresponding first positioning components 201 and second positioning components 202 can move synchronously to the same workstation (such as the first workstation or the second workstation). By setting multiple sets of first positioning components 201 and second positioning components 202, it is beneficial to achieve synchronous operation of the first bonding device 300 and the second bonding device 400. At the same time, this dual positioning component arrangement also helps to synchronize the operation of the second bonding device 400 and the first processing device 500, avoiding workpiece idleness. While making full use of space, it improves production efficiency.

[0140] In some embodiments, the first object includes a first bonding member, and the first bonding device 300 includes a first detection component and a first transfer component 301;

[0141] S102 above: Controlling the first bonding device 300 to acquire the first object, and controlling the first bonding device 300 to bond the first object to the first workpiece, includes:

[0142] S1021: Control the first detection component to detect the pose of the first workpiece;

[0143] S1022: Control the first transfer component 301 to acquire the first bonding component and transfer the first bonding component between a first position and a second position. The first position is the position where the first transfer component 301 acquires the first bonding component, and the second position is the position where the first transfer component 301 drives the first bonding component to bond with or leave the first workpiece.

[0144] S1023: Based on the position and orientation of the first workpiece, control the first transfer component 301 to adjust the position and orientation of the first bonding component or control the first positioning component 201 to adjust the position and orientation of the first workpiece.

[0145] S1024: Based on the pose matching of the first bonding component and the first workpiece, control the first transfer component 301 to bond the transferred first bonding component to the first workpiece.

[0146] As can be seen, before attaching the first bonding component to the first workpiece, this embodiment uses the first detection component to detect the pose of the first workpiece, and controls the first transfer component 301 to adjust the pose of the first bonding component or controls the first positioning component 201 to adjust the pose of the first workpiece according to the pose of the first workpiece. After the pose of the first bonding component matches the pose of the first workpiece, the first bonding component is then attached to the first workpiece, thereby improving the bonding accuracy between the first bonding component and the first workpiece and ensuring the correctness of the position of the first bonding component after it is attached to the first workpiece.

[0147] It should be noted that, in this embodiment, the pose of the first workpiece specifically refers to its position, angle, shape, etc. Adjusting the pose of the first bonding component in this embodiment includes adjusting its position, rotation angle relative to the plane, tilt angle, etc. During the adjustment of the pose of the first bonding component, the pose can be adjusted by controlling the first transfer assembly 301 to move, rotate, yaw, and tilt.

[0148] In addition, the first bonding component can be bonded to the first workpiece in two ways: the first bonding component can be completely bonded to the first workpiece, or the first bonding component can be partially bonded to the first workpiece and partially protrude from the first workpiece; there can be no gap between the edge of the first bonding component and the first workpiece after bonding, or there can be a certain gap between the first bonding component and the edge of the first workpiece after bonding; or other bonding methods may be used, depending on the actual situation.

[0149] In some embodiments, the first object includes a diaphragm and an adhesive, the adhesive being bonded to the first workpiece; the first processing device 500 includes a second detection assembly, a suction head, and a moving assembly.

[0150] S105 above: Controlling the first processing device 500 to process the first workpiece that has been attached to the first object according to preset requirements, including:

[0151] S1051: Control the second detection component to obtain the spatial position of the diaphragm, the spatial position including the height position of the diaphragm or the part of the first workpiece that is attached to the diaphragm;

[0152] S1052: Based on the height position of the diaphragm, control the moving component to drive the suction head to move closer to the first workpiece;

[0153] S1053: Controls the suction head to adsorb one side of the membrane;

[0154] S1054: Control the moving component to drive the suction head to move away from the first workpiece, so as to separate the membrane from the first workpiece when the membrane is adsorbed.

[0155] In other words, when the first object includes a film and an adhesive component, after the first object is attached to the first workpiece, the adhesive component adheres to the first workpiece. At this point, the first processing device 500 removes the film attached to the adhesive component, leaving only the adhesive component on the first workpiece. Before separating the film and the first workpiece, the spatial position of the film is first obtained using the second detection component, so that the suction head can accurately position itself to adsorb the film, avoiding insufficient suction or damage to the film or the first workpiece. Then, by controlling the moving component, the suction head is moved away from the first workpiece, realizing the separation of the film from the first workpiece. That is, this embodiment automates the film-tearing process, improves the film-tearing efficiency, and reduces the labor costs in the film-tearing process. In addition, during the film-tearing process, using the suction head to adsorb the film avoids the influence of film bending and deformation on the clamping of soft films, improving the reliability of film-tearing.

[0156] It should be noted that when using the second detection component to obtain the spatial position of the diaphragm, only the height position of the diaphragm or the part of the first workpiece that is attached to the diaphragm can be obtained, or both the height position of the diaphragm or the part of the first workpiece that is attached to the diaphragm and the planar position of the diaphragm or the first workpiece that is attached to the diaphragm can be obtained simultaneously, depending on the actual situation.

[0157] During the process of controlling the moving component to move the suction head towards or away from the first workpiece, the moving component can move in a single direction or in a combination of multiple directions, depending on the actual situation.

[0158] In some embodiments, the assembly equipment further includes a third bonding device. After S105: controlling the first processing device 500 to process the first workpiece that has been bonded to the first object according to preset requirements, the assembly method further includes:

[0159] S106: Control the conveying device 200 to drive the first positioning component 201 and the second positioning component 202 to move synchronously to the third station;

[0160] S107: Control the third bonding device to acquire the third object, and control the third bonding device to bond the third object to the first workpiece that has been processed according to the preset requirements. The third bonding device is located at the third station.

[0161] That is, in this embodiment, the third bonding device is used to bond the third object to the first workpiece that has been bonded with the first object and has been processed according to the preset requirements. This can achieve the third object and the first object being bonded to the first workpiece. When the first object is an adhesive containing a film, the first processing device 500 processes the first workpiece that has been bonded with the first object according to the preset requirements by removing the film, leaving the adhesive of the adhesive on the first object. In this way, when the third object is bonded, the third object can be bonded to the position of the adhesive on the first workpiece, so that the third object is connected to the first workpiece through the adhesive.

[0162] In some embodiments, the third bonding device includes a third detection component and a second transfer component;

[0163] S107 above: Controlling the third bonding device to acquire the third object, and controlling the third bonding device to bond the third object to the first workpiece that has been processed according to preset requirements, includes:

[0164] S1071: Control the third detection component to detect the pose of the first workpiece after it has been processed according to preset requirements;

[0165] S1072: Control the second transfer component to acquire the third object and transfer the third object between the third position and the fourth position. The third position is the position where the second transfer component acquires the third object, and the fourth position is the position where the second transfer component drives the third object to adhere to or leave the first workpiece that has been processed according to the preset requirements.

[0166] S1073: Based on the pose of the first workpiece after it has been processed according to preset requirements, control the second transfer component to adjust the pose of the third object or control the first positioning component 201 to adjust the pose of the first workpiece.

[0167] S1074: Based on the pose matching of the third object and the first workpiece, control the second transfer component to attach the transferred third object to the first workpiece that has been processed according to preset requirements.

[0168] As can be seen, before attaching the third object to the first workpiece, this embodiment uses the third detection component to detect the pose of the first workpiece, and controls the second transfer component to adjust the pose of the third object or controls the first positioning component 201 to adjust the pose of the first workpiece based on the pose of the third object and the pose of the first workpiece. After the pose of the third object matches the pose of the first workpiece, the third object is attached to the first workpiece, thereby improving the attachment accuracy between the third object and the first workpiece and ensuring the correctness of the position of the third object after it is attached to the first workpiece.

[0169] It should be noted that the pose of the first workpiece after processing according to preset requirements in this embodiment specifically refers to the position, angle, shape, etc. of the first workpiece, and also includes the pose of the first object within the first workpiece. Adjusting the pose of the third object in this embodiment includes adjusting the position, rotation angle relative to the plane, and tilt angle of the third object. During the adjustment of the pose of the third object, the pose can be adjusted by controlling the movement, rotation, yaw, and tilt of the second transfer component.

[0170] In addition, the third object can be attached to the first workpiece in the following ways: the third object can be completely attached to the first workpiece, or the third object can be partially attached to the first workpiece and partially protruding from the first workpiece; there can be no gap between the edges of the third object and the first workpiece after attachment, or there can be a certain gap between the third object and the edges of the first workpiece after attachment; or other attachment methods, which are determined according to the actual situation.

[0171] In some embodiments, the assembly equipment further includes a limiting member 3102;

[0172] S1073 above: Controlling the second transfer component to adjust the pose of the third object or controlling the first positioning component 201 to adjust the pose of the first workpiece includes:

[0173] S10731: Adjust the position of the limiting component 3102 according to the position and orientation of the first workpiece;

[0174] S10732: Control the movement of the second transfer component so that the third object driven by the second transfer component abuts against the limiting member 3102;

[0175] S10733: Based on the fact that the third object has abutted the limiting member 3102, determine that the pose of the third object matches the pose of the first workpiece.

[0176] It should be noted that during the process of attaching a third object, in order to prevent the third object from tilting or deflecting during the attachment process; or as... Figure 14 As shown, in order to ensure that the distance between the second plane b of the third object extending beyond the first workpiece and the first plane a of the first workpiece meets the requirements; or as... Figure 14 As shown, in order to ensure that the distance between the fourth plane d of the third object and the third plane c of the first workpiece meets the requirements, it is necessary to restrict the position and attachment state of the third object to the first workpiece, and determine the pose of the third object to match the pose of the first workpiece.

[0177] In this embodiment, the adjustment of the position of the limiting member 3102 can be achieved by a mechanical structure or by an automatic force-limiting structure 3103, depending on the actual situation. After the position of the limiting member 3102 is adjusted to meet the requirements, the second transfer component is controlled to move the third object to a position where the third object abuts against the limiting member 3102, thus limiting the position of the third object. During the abutment between the third object and the limiting member 3102, the pose of the third object can be adjusted until it matches the pose of the first workpiece; alternatively, a certain surface of the third object can be limited to abut against a certain surface of the limiting member 3102, limiting the pose of the third object in a surface-to-surface contact state. The limiting member 3102 can be a push pin or other suitable structures, depending on the actual situation.

[0178] In some embodiments, the preset requirement is to maintain pressure on the first workpiece that has been attached to the first object for a preset time; the first processing device 500 includes a pressure holding module, a first detection module and a motion module, the pressure holding module including a pressure holding head and a lifting drive component;

[0179] S105 above: Controlling the first processing device 500 to process the first workpiece that has been attached to the first object according to preset requirements, including:

[0180] S1055: Control the motion module to move the pressure holding module along the second direction to the position corresponding to the first workpiece;

[0181] S1056: Control the lifting drive component to move the pressure holding head along the first direction to the pressure holding position, so that the pressure holding head maintains pressure on the first workpiece that has been attached to the first object for a preset time; the first direction is different from the second direction;

[0182] S1057: Control the lifting drive component to move the pressure holding head to a safe position along the first direction, so that the pressure holding head is away from the first workpiece;

[0183] S1058: The control motion module moves the first detection module along the second direction to a position corresponding to the first workpiece, so that the first detection module can detect whether the relative position of the first object and the first workpiece is qualified.

[0184] As can be seen, this embodiment utilizes a pressure-holding module to maintain pressure on the first object and a first detection module to inspect the mounting of the first object. By driving the pressure-holding module and the first detection module to move, the pressure-holding module and the first detection module can be switched to align with the first workpiece, thereby achieving pressure holding of the first object mounted on the first workpiece or inspection of the mounting of the first object. This replaces the traditional manual pressure-holding module and microscope re-inspection, reducing manpower requirements and lowering labor costs. Furthermore, the integrated design of the pressure-holding module and the first detection module results in a compact overall structure, relatively small space occupation, and short re-inspection time, improving the efficiency of pressure-holding re-inspection.

[0185] In some embodiments, the step of controlling the second bonding device 400 to bond the second object to the second workpiece is synchronized with the step of controlling the first processing device 500 to process the first workpiece, which has been bonded to the first object, according to preset requirements. This synchronization refers to temporal synchronization, or operational sequence synchronization. That is, the first processing device 500 and the second bonding device 400 operate synchronously, improving work efficiency. Furthermore, both the second bonding device 400 and the first processing device 500 are located at the second workstation, balancing spatial layout and resulting in a compact structure.

[0186] In some embodiments, the assembly equipment further includes a second processing device 600 and a third processing device 700, which are disposed at a third work station, and the assembly method further includes:

[0187] S108: Control the conveying device 200 to drive the first positioning component 201 and the second positioning component 202 to move synchronously to the third station;

[0188] S109: Control the second processing device 600 to process the second workpiece that has been attached to the second object according to preset requirements;

[0189] S110: Based on the fact that the first workpiece and the second workpiece have been processed according to preset requirements, control the third processing device 700 to process the first workpiece and the second workpiece simultaneously according to another preset requirement.

[0190] It should be noted that the steps of the second processing device 600 in processing the second workpiece that has been attached to the second object according to the preset requirements can be the same as the steps of the first processing device 500 in processing the first workpiece that has been attached to the first object according to the preset requirements, and will not be repeated here.

[0191] The third processing device 700 simultaneously processes the first workpiece and the second workpiece according to another preset requirement, which can be either holding the first and second workpieces under pressure together or unloading the first and second workpieces together. When the third processing device 700 simultaneously holds the first and second workpieces under pressure, it is necessary to ensure that the pressure holding device can cover the first and second workpieces at the same time; when the third processing device 700 simultaneously unloads the first and second workpieces, it is necessary to ensure that the unloading fixture 203 can clamp the first and second workpieces at once.

[0192] The assembly method provided in this application, by setting a first positioning component and a second positioning component and making them move synchronously, realizes the synchronous switching of the first workpiece and the second workpiece between different workstations. This arrangement of synchronously transporting workpieces with dual positioning components results in a compact structure and improved work efficiency. The first bonding device bonds the first object to the first workpiece at the first workstation, and the second bonding device bonds the second object to the second workpiece at the second workstation, achieving automated bonding of objects and workpieces. This avoids manual operation, reducing labor intensity and labor costs. Simultaneously, the automatic bonding of objects and workpieces using the first and second bonding devices avoids the poor bonding consistency caused by human factors during manual bonding, thus improving bonding consistency, enhancing product quality, and facilitating high-quality mass production. By using an asynchronous approach, where the first and second workpieces complete the same bonding process at several different workstations, while different processes are performed on the first and second workpieces at the same workstation, this layout is particularly suitable for applications requiring miniaturized bonding systems. In the context of miniaturized bonding systems, interference can be avoided when two bonding devices (such as the first and second bonding devices) simultaneously bond workpieces of dual-positioning components within a small space. This also allows for full utilization of equipment space, resulting in a more compact structure. Furthermore, it enables synchronized operation between the second bonding device and the first processing device, preventing the first workpiece of the corresponding first positioning component from being idle while the second workpiece of the second positioning component is being bonded, thus making the production rhythm more efficient and improving work efficiency.

[0193] It should also be noted that, in this specification, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0194] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0195] The assembly equipment and assembly method provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An assembly apparatus, comprising: frame; A conveying device is installed on the frame and connected to a first positioning component and a second positioning component. The first positioning component is used to position a first workpiece, and the second positioning component is used to position a second workpiece. The conveying device is used to drive the first positioning component and the second positioning component to move synchronously to a first workstation or a second workstation. A first bonding device is provided at the first workstation for acquiring a first object and bonding the first object to the first workpiece after the first positioning component and the second positioning component move synchronously to the first workstation. The second bonding device is located at the second work station and is used to acquire the second object and bond the second object to the second workpiece after the first positioning component and the second positioning component move synchronously to the second work station. and A first processing device is located at the second workstation and is used to process the first workpiece that has been attached to the first object according to preset requirements after the first positioning component and the second positioning component move synchronously to the second workstation.

2. The assembly equipment according to claim 1, wherein the first article includes a first bonding component, and the first bonding device includes: A first transfer component is used to acquire the first bonding component and transfer the first bonding component between a first position and a second position. The first position is the position where the first transfer component acquires the first bonding component, and the second position is the position where the first transfer component drives the first bonding component to bond to or leave the first workpiece. and The first detection component is used to detect the pose of the first workpiece; The assembly equipment further includes a control device, which is coupled to the first transfer component, the first detection component, and the first positioning component. The control device is used to control the first transfer component to adjust the position of the first bonding component or to control the first positioning component to adjust the position of the first workpiece according to the position of the first workpiece, so that the first bonding component transferred by the first transfer component is bonded to the first workpiece.

3. The assembly equipment according to claim 2, wherein... The first detection component includes a first imaging device, which is coupled to the control device and installed on the first transfer component, located on one side of the first workpiece, for acquiring an image of the first bonding component located at the first position; The control device is further configured to control the first transfer assembly to acquire the first adhesive component based on an image of the first adhesive component located at the first position.

4. The assembly equipment according to claim 2, wherein The first detection component includes a second imaging device, which is coupled to the control device and located on the side of the first workpiece to be bonded away from the first positioning component, for acquiring an image of the first bonding component and the bonding area at the second position; The control device is further configured to control the first transfer component to adjust the pose of the first bonding component or control the first positioning component to adjust the pose of the first workpiece based on an image showing the first bonding component and the area to be bonded located at the second position.

5. The apparatus according to claim 1, wherein the first article includes a film and a patch, the patch is bonded to the first workpiece, and the predetermined requirement is to remove the film from the first workpiece to which the first article is attached. The first processing device includes: The second detection component is used to obtain the spatial position of the diaphragm, the spatial position including the height position of the diaphragm or the portion of the first workpiece that is attached to the diaphragm; A suction head is used to adsorb one side of the membrane; and A movable component, connected to the suction head, is used to drive the suction head to move towards or away from the first workpiece; The assembly equipment further includes a control device, which is coupled to the second detection component, the moving component, and the suction head. The control device is used to control the moving component to drive the suction head to move according to the height position of the membrane, so as to separate the membrane from the first workpiece when the membrane is adsorbed.

6. The assembly equipment according to claim 1, wherein The conveying device is also used to drive the first positioning component and the second positioning component to move synchronously to the third workstation; The assembly equipment further includes a third bonding device, which is located at the third station and is used to acquire a third object and, after the first positioning component and the second positioning component move synchronously to the third station, bond the third object to the first workpiece that has been processed according to the preset requirements.

7. The assembly equipment according to claim 6, wherein the third bonding device comprises: The second transfer component is used to acquire the third object and transfer the third object between a third position and a fourth position. The third position is the position where the second transfer component acquires the third object, and the fourth position is the position where the second transfer component drives the third object to adhere to or leave the first workpiece. and The third detection component is used to detect the pose of the first workpiece after it has been processed according to the preset requirements; The assembly equipment further includes a control device coupled to the second transfer component and the third detection component. The control device is used to control the second transfer component to adjust the position of the third object or to control the first positioning component to adjust the position of the first workpiece according to the position of the first workpiece after it has been processed according to the preset requirements, so that the third object transferred by the second transfer component fits into the first workpiece after it has been processed according to the preset requirements.

8. The assembly equipment according to claim 7, wherein the third detection component comprises: The third imaging device, coupled to the control device, is located on the side of the first workpiece to be bonded away from the first positioning component, and is used to acquire a first image of the third object and the bonded area at the fourth position. The fourth imaging device, coupled to the control device, is located on the side of the first workpiece to be bonded near the first positioning component, and is used to acquire a second image of the third object and the bonded area at the fourth position. The control device is further configured to control the second transfer component to adjust the pose of the third object or control the first positioning component to adjust the pose of the first workpiece based on the first image and the second image.

9. The assembly equipment according to claim 1, wherein the first workpiece is provided with a bonding portion, and the first bonding device comprises: A third transfer component is used to acquire the first object and transfer the first object between a fifth position and a sixth position. The fifth position is the position where the third transfer component acquires the first object, and the sixth position is the position where the third transfer component drives the first object to adhere to or leave the adhering part. and The fourth detection component is used to detect the pose of the bonding portion; The assembly equipment further includes a control device coupled to the third transfer component and the fourth detection component. The control device is used to control the third transfer component to adjust the position of the first object or to control the first positioning component to adjust the position of the bonding portion according to the position of the bonding portion, so that the first object transferred by the third transfer component is bonded to the bonding portion.

10. The assembly equipment according to claim 9, wherein the fourth detection component includes a fifth imaging device, the fifth imaging device being coupled to the control device, installed on the third transfer component, located on one side of the bonding portion, and used to acquire an image of the first object located at the fifth position; The control device is further configured to control the third transfer component to acquire the first object based on an image of the first object located at the fifth position.

11. The assembly equipment according to claim 9, wherein the fourth detection component includes a sixth imaging device, the sixth imaging device being coupled to the control device and located on the side of the bonding portion opposite to the first positioning component, for acquiring a third image of the first object and the bonding portion located at the sixth position; The control device is further configured to control the third transfer component to adjust the position of the first object or control the first positioning component to adjust the position of the adhesive portion based on a third image showing the first object and the adhesive portion at the sixth position.

12. The assembly equipment according to claim 11, wherein the fourth detection component further comprises a seventh imaging device, the seventh imaging device being coupled to the control device and located on the side of the bonding portion near the first positioning component, for acquiring a fourth image of the first object and the bonding portion located at the sixth position; The control device is further configured to control the third transfer component to adjust the position of the first object or control the first positioning component to adjust the position of the fitting portion based on the third image and the fourth image.

13. The assembly equipment according to claim 1, further comprising: A limiting plate is provided at the first workstation, and after the first positioning component and the second positioning component move synchronously to the first workstation, the limiting plate is located on one side of the first positioning component; A limiting member is connected to the limiting plate and can extend or retract from the limiting plate. The limiting member is used to abut against the side of the first object when the first bonding device bonds the first object to the first workpiece. A limiting seat, wherein the limiting plate is movably disposed on the limiting seat, and the limiting seat is provided with a protrusion that limits the travel of the limiting plate; and A movable seat is used to push the limiting plate to abut against the protrusion.

14. The assembly equipment according to claim 1, wherein the preset requirement is to maintain pressure on the first workpiece, which has been attached to the first object, for a preset time; the first processing device comprises: At least one pressure-holding module, each pressure-holding module including a pressure-holding head and a lifting drive component, the pressure-holding head being used to hold pressure on the first object attached to the first workpiece; the lifting drive component being connected to the pressure-holding head and used to adjust the position of the pressure-holding head in a first direction; The first detection module has a detection component that does not coincide with the projection of the pressure holding head on the projection surface, which is a surface perpendicular to the first direction. and The motion module is equipped with both the pressure holding module and the first detection module. The motion module is used to move the pressure holding module along the second direction to a position corresponding to the first workpiece or to move the first detection module along the second direction to a position corresponding to the first workpiece. The first direction is different from the second direction.

15. The assembly equipment according to claim 14, wherein the first processing device further comprises: A second detection module is connected to the motion module, and the second detection module and the first detection module are located on opposite sides of the first workpiece; The motion module is also used to move the second detection module along the second direction to a position corresponding to the first workpiece.

16. An assembly method applied to an assembly equipment, the assembly equipment comprising a conveying device, a first bonding device, a second bonding device, and a first processing device, the conveying device being connected to a first positioning component and a second positioning component, the first positioning component being used to position a first workpiece, and the second positioning component being used to position a second workpiece; the assembly method comprising: The control device drives the first positioning component and the second positioning component to move synchronously to the first workstation; The first bonding device is controlled to acquire the first object and to bond the first object to the first workpiece. The first bonding device is located at the first work station. The control device drives the first positioning component and the second positioning component to move synchronously to the second workstation; The second bonding device is controlled to acquire the second object and to bond the second object to the second workpiece. The second bonding device is located at the second work station. The first processing device is controlled to process the first workpiece that has been attached to the first object according to preset requirements. The first processing device is located at the second work station.

17. The assembly method according to claim 16, wherein the first object includes a first bonding component, and the first bonding device includes a first detection component and a first transfer component; The method of controlling the first bonding device to acquire the first object and to bond the first object to the first workpiece includes: Control the first detection component to detect the pose of the first workpiece; The first transfer component is controlled to acquire the first bonding component and transfer the first bonding component between a first position and a second position. The first position is the position where the first transfer component acquires the first bonding component, and the second position is the position where the first transfer component drives the first bonding component to bond to or leave the first workpiece. Based on the position and orientation of the first workpiece, control the first transfer component to adjust the position and orientation of the first bonding component or control the first positioning component to adjust the position and orientation of the first workpiece. Based on the pose of the first bonding component matching the pose of the first workpiece, the first transfer component is controlled to bond the transferred first bonding component to the first workpiece.

18. The assembly method according to claim 17, wherein the first object comprises a diaphragm and a bonding component, the bonding component being bonded to the first workpiece; the first processing device comprises a second detection component, a suction head, and a moving component; The control of the first processing device to process the first workpiece, which has been attached to the first object, according to preset requirements includes: The second detection component is controlled to acquire the spatial position of the diaphragm, the spatial position including the height position of the diaphragm or the portion of the first workpiece that is attached to the diaphragm; Based on the height position of the diaphragm, the moving component is controlled to drive the suction head to move closer to the first workpiece; Control the suction head to adsorb one side of the membrane; The moving component is controlled to move the suction head away from the first workpiece, so as to separate the membrane from the first workpiece when the membrane is adsorbed.

19. The assembly method according to claim 16, wherein the assembly equipment further comprises a third bonding device, and after the first processing device is controlled to process the first workpiece that has been bonded to the first object according to preset requirements, the assembly method further comprises: The control device drives the first positioning component and the second positioning component to move synchronously to the third station; The third bonding device is controlled to acquire a third object and to bond the third object to the first workpiece that has been processed according to the preset requirements. The third bonding device is located at the third work station.

20. The assembly method according to claim 19, wherein the third bonding device comprises a third detection component and a second transfer component; The method of controlling the third bonding device to acquire the third object and controlling the third bonding device to bond the third object to the first workpiece that has been processed according to the preset requirements includes: The third detection component is controlled to detect the pose of the first workpiece after it has been processed according to the preset requirements; The second transfer component is controlled to acquire the third object and transfer the third object between a third position and a fourth position. The third position is the position where the second transfer component acquires the third object, and the fourth position is the position where the second transfer component drives the third object to adhere to or leave the first workpiece that has been processed according to the preset requirements. Based on the pose of the first workpiece after it has been processed according to the preset requirements, control the second transfer component to adjust the pose of the third object or control the first positioning component to adjust the pose of the first workpiece. Based on the pose of the third object matching the pose of the first workpiece, the second transfer component is controlled to attach the transferred third object to the first workpiece that has been processed according to the preset requirements.

21. The assembly method according to claim 20, wherein the assembly equipment further includes a limiting member; The control of the second transfer component to adjust the pose of the third object or the control of the first positioning component to adjust the pose of the first workpiece includes: Adjust the position of the limiting component according to the pose of the first workpiece; Control the movement of the second transfer component so that the third object driven by the second transfer component abuts against the limiting member; Based on the fact that the third object has abutted the limiting member, it is determined that the pose of the third object matches the pose of the first workpiece.

22. The assembly method according to claim 16, wherein the preset requirement is to maintain pressure on the first workpiece that has been attached to the first object for a preset time; the first processing device includes a pressure holding module, a first detection module and a motion module, wherein the pressure holding module includes a pressure holding head and a lifting drive component; The control of the first processing device to process the first workpiece, which has been attached to the first object, according to preset requirements includes: The motion module is controlled to move the pressure-holding module along the second direction to a position corresponding to the first workpiece; The lifting drive component is controlled to move the pressure holding head to the pressure holding position along the first direction, so that the pressure holding head maintains pressure on the first workpiece that has been attached to the first object for a preset time; the first direction is different from the second direction. The lifting drive component is controlled to move the pressure holding head to a safe position along the first direction, so that the pressure holding head is away from the first workpiece; The motion module is controlled to move the first detection module along the second direction to a position corresponding to the first workpiece, so that the first detection module can detect whether the relative position of the first object and the first workpiece is qualified.

23. The assembly method according to claim 16, wherein the step of controlling the second bonding device to bond the second object to the second workpiece is synchronized with the step of controlling the first processing device to process the first workpiece that has been bonded with the first object according to preset requirements.

24. The assembly method according to claim 16, wherein the assembly equipment further comprises a second processing device and a third processing device, the second processing device and the third processing device being disposed at a third workstation, and the assembly method further comprises: The control device drives the first positioning component and the second positioning component to move synchronously to the third workstation; The second processing device is controlled to process the second workpiece, which has been attached to the second object, according to the preset requirements; Since both the first workpiece and the second workpiece have been processed according to the preset requirements, the third processing device is controlled to simultaneously process the first workpiece and the second workpiece according to another preset requirement.

Images