一种晶圆处理系统以及处理方法

By incorporating a cleaning device and a vertical cylinder movement for support components in the chemical mechanical polishing process, the problem of scratches caused by residual particles and by-products after wafer polishing has been solved, thereby improving production efficiency and capacity.

CN116690413BActive Publication Date: 2026-07-17CHANGXIN MEMORY TECH INC
View PDF 3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHANGXIN MEMORY TECH INC
Filing Date
2022-02-24
Publication Date
2026-07-17

Smart Images

  • Figure CN116690413B_ABST
    Figure CN116690413B_ABST
Patent Text Reader

Abstract

本公开实施例公开了一种晶圆处理系统以及处理方法，其中，所述晶圆处理系统，包括：至少两个研磨装置，对晶圆分别进行研磨工序；清洗装置，位于相邻两个研磨装置之间，为前一次研磨工序后的所述晶圆进行清洗工序；所述清洗装置包括多个支撑部件和多个第一液压装置，所述支撑部件用于支撑所述晶圆，每个支撑部件与一个第一液压装置连接，所述第一液压装置驱动所述支撑部件进行垂直方向的气缸运动。
Need to check novelty before this filing date? Find Prior Art