一种新型高载药量微针制造方法
By preparing excipient solutions and API suspensions, combined with photosensitive adhesives and ultraviolet light irradiation, high drug-load microneedles were prepared, solving the problem of low drug loading in existing microneedles and improving efficient drug delivery and puncture capabilities.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANTONG WEIZHEN PHARM TECH CO LTD
- Filing Date
- 2023-06-21
- Publication Date
- 2026-07-17
AI Technical Summary
Existing microneedles have low drug loading capacity, which limits their application range and mechanical properties, making it difficult to deliver high doses of drugs. Furthermore, their porous structure reduces their puncture capability.
High-drug-load microneedles were prepared by using excipient solution preparation and API suspension preparation, and by vacuum concentration of API in microneedle mold, combined with photosensitive adhesive and ultraviolet light irradiation. The drug content in the microneedles was detected by high-performance liquid chromatography.
This improved the drug loading capacity of microneedles, enhanced their puncture ability, expanded their application range, and achieved efficient drug delivery.
Smart Images

Figure CN116690871B_ABST