一种钽基扩散键合复合膜层及其制备方法

By preparing diffusion-bonded composite films on tantalum metal surfaces, a method was developed that employs organic solvent pre-cleaning, chemical degreasing, and activation treatment, combined with electrodeposition additive regulation and high-temperature thermal diffusion. This method solved the problem of poor adhesion caused by the dense Ta2O5 oxide film on the tantalum metal surface, achieving diffusion-bonded composite films with good adhesion. It also overcame the Kirkendall effect during heat treatment and improved the wear resistance and corrosion resistance of the film.

CN116695199BActive Publication Date: 2026-07-17CHANGAN UNIV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHANGAN UNIV
Filing Date
2023-06-12
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In the prior art, the adhesion of protective films on the surface of tantalum metal is poor, and it is difficult to directly electrodeposit dense and well-adhesive coatings.

Method used

A method for preparing diffusion-bonded composite films on the surface of tantalum metal involves pre-cleaning the sample with organic solvents, chemical degreasing, and activation before electrodeposition. Electrodeposition additives are used to reduce the overall stress level of the film. Finally, heat treatment is performed to obtain a diffusion-bonded composite film with an interleaved distribution of film, substrate, diffusion solid solution, and intermetallic compounds.

Benefits of technology

A diffusion-bonded composite film with good adhesion and excellent performance was prepared on the surface of tantalum metal, which solved the problem of poor adhesion caused by chemical inertness and the presence of dense Ta2O5 oxide film. By using electrodeposition pretreatment and electrodeposition additives to reduce the overall stress level between the film and the substrate, interface defects and performance degradation caused by Kirkendall effect during heat treatment were avoided.

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Abstract

本发明公开了一种钽基扩散键合膜层及其制备方法,属于钽金属镀层领域。本发明的制备方法,通过钽金属电沉积前处理工艺、电解液成分调控和电沉积后扩散热处理工艺,获得扩散键合的膜层、基体、固溶体、金属间化合物交替分布的复合结构,该复合结构具有结合力良好、无内应力或低内应力、性能优异等特点。本发明克服了热扩散过程中因Kirkendall效应Cu / Ni / Ta结构中原子间进行不平衡热扩散而产生大量空位缺陷,造成膜层界面缺陷和性能降低的缺点。
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