Multi-point array temperature compensation device

Abstract

A kind of multi-point array temperature compensation device, comprising: several first heating lines parallel to first direction;Several second heating lines parallel to second direction, the first direction is perpendicular to the second direction, several first heating lines and several second heating lines are crossed each other in grid shape, and the intersection position of first heating line and second heating line is heating point position;Dot array control module is respectively connected with several first heating lines and several second heating lines, for controlling arbitrary heating point position heating.By dot array control module, arbitrary heating point position can be controlled to heat, so that flexible control and accurate control to any heating point position can be realized, to realize accurate control to temperature compensation, improve the precision of temperature compensation.In addition, since heating point position is formed by the position intersection of first heating line and second heating line, the structure of heating point position is simple, which can effectively reduce the cost.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a multi-point array temperature compensation device. Background Technology

[0002] Photolithography is a crucial technology in semiconductor manufacturing. It transfers patterns from a photomask to the surface of a silicon wafer, forming semiconductor products that meet design requirements. The photolithography process includes an exposure step, a development step following exposure, and an etching step following development. In the exposure step, light passes through the light-transmitting areas of the photomask and shines onto the silicon wafer coated with photoresist, causing a chemical reaction in the photoresist. In the development step, the different solubility of the developer in the photoresist and the non-photoresist is used to form a photolithographic pattern, transferring the photomask pattern onto the photoresist. In the etching step, the silicon wafer is etched based on the photolithographic pattern formed by the photoresist layer, further transferring the photomask pattern onto the silicon wafer.

[0003] As manufacturing precision continues to improve, the requirements for etching processes are also becoming more uniform. Currently, etching uniformity is improved by controlling the etching rate, and there are many methods for controlling the etching rate, such as gas ratio, TCCT, and temperature. Among these, temperature compensation control has been proven to be more precise and has fewer side effects.

[0004] However, there are still many problems with controlling the etching rate through temperature compensation in the existing technology. Summary of the Invention

[0005] The technical problem solved by this invention is to provide a multi-point array temperature compensation device to improve temperature compensation accuracy.

[0006] To address the aforementioned problems, the present invention provides a multi-point array temperature compensation device, comprising: a plurality of first heating wires parallel to a first direction; a plurality of second heating wires parallel to a second direction, wherein the first direction is perpendicular to the second direction, the plurality of first heating wires and the plurality of second heating wires intersect each other in a grid pattern, and the intersection of the first heating wires and the second heating wires is a heating point; and a dot matrix control module, which is electrically connected to the plurality of first heating wires and the plurality of second heating wires respectively, for controlling any of the heating points to be heated.

[0007] Optionally, the first heating wire includes: a first metal conductor; and a first insulating material layer wrapped around the surface of the first metal conductor.

[0008] Optionally, the material of the first insulating layer may include a piezoelectric material.

[0009] Optionally, the piezoelectric material includes any one of lithium niobate, lithium metatitanate, barium strontium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate.

[0010] Optionally, the second heating wire includes: a second metal conductor; and a second insulating material layer wrapped around the surface of the second metal conductor.

[0011] Optionally, the material of the second insulating layer includes a piezoelectric material.

[0012] Optionally, the piezoelectric material includes any one of lithium niobate, lithium metatitanate, barium strontium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate.

[0013] Optionally, the diameter of the first heating wire is in the range of 3mm to 6mm.

[0014] Optionally, the dot matrix control module includes: a microcontroller for sending control signals to control any of the heating points to be heated; a drive circuit module electrically connected to the microcontroller for amplifying the control signals; a first bus module electrically connected to the drive circuit module and a plurality of the first heating wires respectively; and a second bus module electrically connected to the drive circuit module and a plurality of the second heating wires respectively.

[0015] Optionally, it also includes: a plurality of first heat dissipation lines parallel to the first direction, wherein the plurality of first heat dissipation lines and the plurality of second heating lines intersect each other in a grid pattern.

[0016] Optionally, the first heat dissipation wire may be made of an insulating material.

[0017] Optional insulating materials include: polymer fiber materials.

[0018] Optionally, it also includes: a plurality of second heat dissipation lines parallel to the second direction, wherein the plurality of second heat dissipation lines intersect with the plurality of first heating lines in a grid pattern.

[0019] Optionally, the second heat dissipation wire is made of an insulating material.

[0020] Optional insulating materials include: polymer fiber materials.

[0021] Compared with the prior art, the technical solution of the present invention has the following advantages: In the multi-point array temperature compensation device of this invention, any of the heating points can be controlled for heating by a point array control module electrically connected to a plurality of first heating wires and a plurality of second heating wires. This allows for flexible and precise control of any heating point, thereby achieving precise control of temperature compensation and improving its accuracy. Furthermore, since the heating points are formed by the intersection of the positions of the first and second heating wires, this design simplifies the structure of the heating points and effectively reduces the cost of the multi-point array temperature compensation device.

[0022] Furthermore, the diameter of the first heating wire ranges from 3mm to 6mm. Because the diameters of the first and second heating wires are relatively small, the area of ​​the heating point formed at the intersection of the first and second heating wires is much smaller than the area of ​​an independent heating plate. This allows for the fabrication of more heating points within the same wafer area, thereby improving the accuracy of temperature compensation.

[0023] Furthermore, it also includes: several first heat dissipation lines parallel to the first direction, which intersect with several second heating lines in a grid pattern. The several first heat dissipation lines can evenly distribute heat, causing the temperature gradient between the heating points to change slowly. This reduces the influence between adjacent heating points and creates a relatively uniform heat area around each heating point, thereby improving the accuracy of temperature compensation.

[0024] Furthermore, it also includes: several second heat dissipation lines parallel to the second direction, which intersect with the several first heating lines in a grid pattern. The several second heat dissipation lines can homogenize the heat, causing the temperature gradient between the heating points to change slowly. This reduces the influence between adjacent heating points and creates a relatively uniform heat area around each heating point, thereby improving the accuracy of temperature compensation.

[0025] Furthermore, the material of the first insulating layer includes a piezoelectric material; the piezoelectric material includes any one of lithium niobate, lithium metatitanate, barium strontium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate. Since any one of lithium niobate, lithium metatitanate, barium strontium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate is a piezoelectric material, these materials have high polarization and higher electrothermal conversion efficiency. Therefore, they can have better heat generation under the action of an external electric field.

[0026] Furthermore, the material of the second insulating layer includes a piezoelectric material; the piezoelectric material includes any one of lithium niobate, lithium metatitanate, barium strontium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate. Since any one of lithium niobate, lithium metatitanate, barium strontium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate is a piezoelectric material, these materials have high polarization and higher electrothermal conversion efficiency. Therefore, they can have better heat generation under the action of an external electric field. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the multi-point array temperature compensation device in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the first heating wire and the second heating wire in the multi-point array temperature compensation device in this embodiment of the invention. Detailed Implementation

[0028] As described in the background section, there are still many problems with the existing technology of controlling the etching rate through temperature compensation. These will be explained in detail below.

[0029] In existing technologies, temperature compensation for etching rate control typically employs the Hydra system. The Hydra system divides the wafer into approximately 150 regions for temperature compensation of the etching rate, which can significantly improve uniformity. However, the Hydra system uses a large single heating plate area for temperature compensation, thus limiting the number of temperature compensation points and consequently reducing the accuracy of temperature compensation. Furthermore, the structure of a single heating plate is complex, resulting in high manufacturing costs.

[0030] Based on this, the present invention provides a multi-point array temperature compensation device. By using a dot matrix control module electrically connected to a plurality of first heating wires and a plurality of second heating wires, any of the heating points can be controlled for heating, thereby achieving flexible and precise control of any heating point to achieve accurate temperature compensation and improve the accuracy of temperature compensation. Furthermore, since the heating points are formed by the intersection of the positions of the first and second heating wires, this solution simplifies the structure of the heating points and effectively reduces the cost of the multi-point array temperature compensation device.

[0031] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0032] Figure 1 This is a schematic diagram of the structure of the multi-point array temperature compensation device in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the first heating wire and the second heating wire in the multi-point array temperature compensation device in this embodiment of the invention.

[0033] Please refer to Figure 1 A multi-point array temperature compensation device includes: a plurality of first heating wires 101 parallel to a first direction X; a plurality of second heating wires 102 parallel to a second direction Y, wherein the first direction X is perpendicular to the second direction Y, the plurality of first heating wires 101 and the plurality of second heating wires 102 intersect each other in a grid pattern, and the intersection of the first heating wires 101 and the second heating wires 102 is a heating point 103; and a dot matrix control module, which is electrically connected to the plurality of first heating wires 101 and the plurality of second heating wires 102 respectively, for controlling any of the heating points 103 to be heated.

[0034] In this embodiment, the first heating wire 101 includes: a first metal wire 101a; and a first insulating material layer 101b wrapped around the surface of the first metal wire 101a.

[0035] In this embodiment, the second heating wire 102 includes: a second metal wire 102a; and a second insulating material layer 102b wrapped around the surface of the second metal wire 102a.

[0036] Please refer to Figure 2 In this embodiment, after several first heating wires 101 and several second heating wires 102 intersect each other to form a grid, a capacitor is formed at the intersection of the first heating wires 101 and the second heating wires 102, thereby forming a stable electric field at the intersection.

[0037] Ideally, insulating materials contain no free charges. However, actual insulating materials always contain a small number of free charges. Generally, without an electric field, the positive and negative bound charges within an insulating material cancel each other out on average, and macroscopically, no electrical property is observed. Under the influence of an external electric field, the localized movement of bound charges causes macroscopic electrical properties to appear, resulting in charges appearing on the surface and in uneven areas within the insulating material. This phenomenon is called polarization, and heat is generated during the polarization process of the insulating material.

[0038] Therefore, in this embodiment, the heating point 103 is formed at the intersection of the first heating line 101 and the second heating line 102.

[0039] The first insulating material layer 101b is made of a piezoelectric material; the piezoelectric material includes any one of lithium niobate, lithium metatitanate, barium strontium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate. In this embodiment, the first insulating material layer 101b is made of lithium niobate.

[0040] The material of the second insulating layer 102b includes a piezoelectric material; the piezoelectric material includes any one of lithium niobate, lithium metatitanate, barium strontium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate. In this embodiment, the material of the second insulating layer 102b is lithium niobate.

[0041] Due to lithium niobate (LiNbO3), lithium metatitanate (LiTiO3), and barium niobate (Ba x Sr 1-x Any one of Nb₂O₆, lead zirconate titanate (PZT), and lanthanum lead zirconate titanate (PLZT) is a piezoelectric material. These materials have a high degree of polarization and higher electrothermal conversion efficiency. Therefore, they can exhibit better heat generation under the influence of an external electric field.

[0042] In this embodiment, the diameter of the first heating wire ranges from 3mm to 6mm. Because the diameters of the first heating wire 101 and the second heating wire 102 are relatively small, the area of ​​the heating point 103 formed at the intersection of the first heating wire 101 and the second heating wire 102 is much smaller than the area of ​​an independent heating plate. Therefore, more heating points 103 can be fabricated within the same wafer area, thereby improving the accuracy of temperature compensation.

[0043] Please continue to refer to this. Figure 1 In this embodiment, the dot matrix control module includes: a microcontroller 107, used to send control signals to control any of the heating points 103 to be heated; a drive circuit module 106, electrically connected to the microcontroller 107, used to amplify the control signals; a first bus module 104, electrically connected to the drive circuit module 106 and a plurality of first heating wires 101 respectively; and a second bus module 105, electrically connected to the drive circuit module 106 and a plurality of second heating wires 102 respectively.

[0044] In this embodiment, by importing the pre-value of the wafer entering the reaction chamber into the conversion software, the software will automatically generate which points need temperature adjustment. The host computer has a corresponding point conversion program, which will automatically convert the truth table of the corresponding heating point 103 to be activated, and then burn it into the microcontroller 107. The microcontroller 107 sends a control signal to control any of the heating points 103 to be heated according to the burned program.

[0045] In this embodiment, the heating point 103 is formed by the intersection of the first heating wire 101 and the second heating wire 102. A dot matrix control module electrically connected to several first heating wires 101 and several second heating wires 102 can control any of the heating points 103 to be heated, thereby achieving flexible and precise control of any heating point 103, thus enabling precise control of temperature compensation and improving the accuracy of temperature compensation. Furthermore, this solution simplifies the structure of the heating point 103, effectively reducing the cost of the multi-point array temperature compensation device.

[0046] Please continue to refer to this. Figure 1 In this embodiment, it further includes: a plurality of first heat dissipation lines 108 parallel to the first direction X, wherein the plurality of first heat dissipation lines 108 and the plurality of second heating lines 102 intersect each other in a grid pattern.

[0047] In this embodiment, the first heat dissipation wire 108 is made of an insulating material, including: polymer fiber material, specifically such as aramid material.

[0048] In this embodiment, the heat can be uniformly distributed through a plurality of first heat dissipation lines 108, so that the temperature gradient between the heating points 103 changes slowly. On the one hand, this can reduce the influence between adjacent heating points 103, and on the other hand, it can form a relatively uniform heat area around the heating points 103, thereby improving the accuracy of temperature compensation.

[0049] Please continue to refer to this. Figure 1 In this embodiment, it further includes: a plurality of second heat dissipation lines 109 parallel to the second direction Y, wherein the plurality of second heat dissipation lines 109 and the plurality of first heating lines 101 intersect each other in a grid pattern.

[0050] It should be noted that, in this embodiment, several second heat dissipation wires 109 are also interwoven with several first heat dissipation wires 108.

[0051] In this embodiment, the material of the second heat dissipation wire 109 is an insulating material, including: polymer fiber material, specifically such as aramid material.

[0052] In this embodiment, the heat can be uniformly distributed through a plurality of second heat dissipation lines 109, so that the temperature gradient between the heating points 103 changes slowly. On the one hand, this can reduce the influence between adjacent heating points 103, and on the other hand, it can form a relatively uniform heat area around the heating points 103, thereby improving the accuracy of temperature compensation.

[0053] It should be noted that, in this embodiment, the wire diameters of the first heat dissipation wire 108 and the second heat dissipation wire 109 are the same as those of the first heating wire 101 and the second heating wire 102. Furthermore, several first heating wires 101, several second heating wires 102, several first heat dissipation wires 108, and several second heat dissipation wires 109 are tightly woven, meaning the spacing between adjacent first heating wires 101 or adjacent second heating wires 102 is 3mm to 6mm. Taking a 12-inch (30.48cm diameter) wafer as an example, at least 27 to 55 first heating wires 101 and second heating wires 102 are required.

[0054] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A multi-point array temperature compensation device, characterized in that, include: Several first heating wires parallel to the first direction; Several second heating wires are parallel to the second direction, the first direction is perpendicular to the second direction, and the several first heating wires and several second heating wires intersect each other in a grid pattern, and the intersection of the first heating wires and the second heating wires is the heating point. as well as A dot matrix control module is electrically connected to several first heating wires and several second heating wires, respectively, and is used to control any of the heating points to be heated; wherein... The first heating wire includes a first metal conductor and a first insulating material layer wrapped around the surface of the first metal conductor; The material of the first insulating layer includes a piezoelectric material.

2. The multi-point array temperature compensation device as described in claim 1, characterized in that, The piezoelectric material includes any one of lithium niobate, lithium metatitanate, barium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate.

3. The multi-point array temperature compensation device as described in claim 1, characterized in that, The second heating wire includes: a second metal wire; and A second insulating material layer wrapped around the surface of the second metal conductor.

4. The multi-point array temperature compensation device as described in claim 3, characterized in that, The material of the second insulating layer includes a piezoelectric material.

5. The multi-point array temperature compensation device as described in claim 4, characterized in that, The piezoelectric material includes any one of lithium niobate, lithium metatitanate, barium niobate, lead zirconate titanate, and lanthanum lead zirconate titanate.

6. The multi-point array temperature compensation device as described in claim 1, characterized in that, The diameter of the first heating wire ranges from 3mm to 6mm.

7. The multi-point array temperature compensation device as described in claim 1, characterized in that, The dot matrix control module includes: The microcontroller is used to send control signals to control any of the heating points to perform heating. The driving circuit module is electrically connected to the microcontroller and is used to amplify the control signal; A first bus module is electrically connected to the drive circuit module and a plurality of the first heating wires, respectively; and The second bus module is electrically connected to the drive circuit module and several second heating wires, respectively.

8. The multi-point array temperature compensation device as described in claim 1, characterized in that, Also includes: Several first heat dissipation lines parallel to the first direction, and several first heat dissipation lines and several second heating lines intersect each other in a grid pattern.

9. The multi-point array temperature compensation device as described in claim 8, characterized in that, The first heat dissipation wire is made of insulating material.

10. The multi-point array temperature compensation device as described in claim 9, characterized in that, Insulating materials include: polymer fiber materials.

11. The multi-point array temperature compensation device as described in claim 1, characterized in that, Also includes: Several second heat dissipation lines are parallel to the second direction, and these several second heat dissipation lines intersect with several first heating lines to form a grid.

12. The multi-point array temperature compensation device as described in claim 11, characterized in that, The second heat dissipation wire is made of insulating material.

13. The multi-point array temperature compensation device as described in claim 12, characterized in that, Insulating materials include: polymer fiber materials.

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