Microcrystalline grain processing apparatus and microcrystalline grain processing method

Abstract

A micro-crystal grain processing apparatus is disclosed. The apparatus is suitable for processing a plurality of micro-crystal grains on a transparent carrier. The apparatus includes a movable stage, an optical trimming module, a mask micro-projection scanning optical module, a camera device, and a control unit. The mask micro-projection scanning optical module includes a movable mask and a scanning galvanometer module. The movable stage is suitable for carrying the transparent carrier. The optical trimming module is suitable for providing a processing beam. The scanning galvanometer module is suitable for reflecting the processing beam to the transparent carrier and changing the position of the processing beam on the transparent carrier. The control unit is suitable for determining the position error of the transparent carrier on the movable stage according to the image data provided by the camera device and controlling the scanning galvanometer module to compensate the position error. A micro-crystal grain processing method is also disclosed.

Description

Technical Field

[0001] This invention relates to a processing equipment and method, and more particularly to a microcrystalline grain processing equipment and a microcrystalline grain processing method. Background Technology

[0002] Micro LED displays are an emerging display technology that involves thinning, miniaturizing, and arraying light-emitting diodes (LEDs), reducing their size to the micrometer level. The manufacturing process for micro LED displays includes growing microdices on a wafer, followed by mass transfer to transfer the microdices onto a driving substrate. Prior to this transfer to the driving substrate, there is typically at least one step of transferring the microdices to a relay substrate.

[0003] Furthermore, to ensure that all microcrystals on the driving substrate are of good quality, the manufacturing process of micro-LED displays also includes a defective microcrystal removal step, after which good microcrystals must be replaced. Because the processes of removing, transferring, and replacing microcrystals are time-consuming, resulting in high production costs, improving the production efficiency of micro-LED displays has always been a problem that those skilled in the art have been working to address. Summary of the Invention

[0004] This invention provides a microcrystalline grain processing device to improve the efficiency of microcrystalline grain processing.

[0005] This invention provides a microcrystalline processing method to improve the efficiency of microcrystalline processing.

[0006] To achieve at least one of the above advantages, one embodiment of the present invention provides a microcrystalline processing apparatus suitable for processing multiple microcrystalline particles on a transparent substrate. This microcrystalline processing apparatus includes a movable stage, an optical trimming module, a photomask miniature projection scanning optical module, a photographic device, and a control unit. The movable stage is suitable for carrying the transparent substrate. The optical trimming module is suitable for providing a processing beam. The photomask miniature projection scanning optical module includes a movable photomask and a scanning galvanometer module. The movable photomask has multiple pattern units and is adapted to move so that the processing beam passes through one of the pattern units. The scanning galvanometer module is disposed between the movable photomask and the movable stage, and is adapted to reflect the processing beam onto the transparent substrate and change the position of the processing beam illuminating the transparent substrate. The photographic device is disposed on the side of the movable stage away from the scanning galvanometer module. The control unit is electrically connected to the optical trimming module, the movable photomask, the scanning galvanometer module, the imaging device, and the movable stage. The control unit is adapted to determine the positional error of the transparent plate on the movable stage based on the image data provided by the imaging device, and to control the scanning galvanometer module to compensate for this positional error.

[0007] In one embodiment of the present invention, the above-mentioned pattern unit includes pattern units of various shapes and / or pattern units of various sizes.

[0008] In one embodiment of the present invention, the optical trimming module includes a laser source and a beam shaping element. The laser source is adapted to provide a light beam. The beam shaping element is disposed in the transmission path of the light beam to shape the light beam into a processing beam.

[0009] In one embodiment of the present invention, the scanning galvanometer module described above includes a first scanning galvanometer, a second scanning galvanometer, and a projection lens arranged sequentially according to the transmission path of the processing beam. The first scanning galvanometer is adapted to reflect the processing beam and position the processing beam irradiates on the movable stage adapted to move along a first axis of the movable stage. The second scanning galvanometer is adapted to reflect the processing beam and position the processing beam irradiates on the movable stage adapted to move along a second axis of the movable stage, wherein there is an angle between the first axis and the second axis.

[0010] To achieve at least one of the above advantages, embodiments of the present invention further provide a microcrystalline grain processing method applicable to the aforementioned microcrystalline grain processing equipment. This microcrystalline grain processing method includes: a control unit planning at least one processing block based on the distribution of microcrystalline grains to be processed on a transparent substrate; and processing each processing block, wherein the step of processing each processing block includes: the control unit selecting a suitable pattern unit from pattern units and aligning it with an optical trimming module; the control unit controlling the optical trimming module to provide a processing beam through the selected pattern unit; and the control unit controlling a scanning galvanometer module to scan and irradiate the microcrystalline grains within the processing block with the processing beam passing through the selected pattern unit. In the step of processing each processing block, the control unit determines the positional error of the transparent substrate on the movable stage based on image data provided by the imaging device and controls the scanning galvanometer module to compensate for this positional error.

[0011] In one embodiment of the present invention, the microcrystals to be processed are defective microcrystals.

[0012] In one embodiment of the present invention, the microcrystals to be processed are all the microcrystals on the transparent carrier plate, and the microcrystals in the processing block fall off from the transparent carrier plate to the receiving carrier plate.

[0013] In one embodiment of the present invention, the microcrystals to be processed are filling microcrystals, and the microcrystals in the processing block fall off from the transparent carrier plate to the microcrystal vacancy on the receiving carrier plate.

[0014] In one embodiment of the present invention, the number of the above-mentioned processing blocks is multiple, and the steps of processing the processing blocks respectively include controlling the movement of the movable stage by the control unit so that the processing blocks are sequentially located within the scanning range of the scanning galvanometer module, and the control unit also includes compensating for position errors when controlling the movement of the movable stage.

[0015] In one embodiment of the present invention, the above-mentioned step of controlling the movement of the movable platform by the control unit further includes, when the distance continuously moved by the movable platform reaches a preset value, the control unit controls the movable platform to stop moving, and determines the positional error of the transparent plate on the movable platform based on the image data provided by the imaging device.

[0016] In the microcrystalline grain processing equipment and method of this invention, because the movable photomask has multiple different pattern units, a suitable pattern unit can be selected when processing each block. Combined with a scanning galvanometer module, the processing beam scans and illuminates the processing block, thus enabling rapid processing of each block and significantly improving the efficiency of microcrystalline grain processing, thereby reducing production costs. Furthermore, the imaging device can monitor for positional errors in the transparent substrate. When a positional error occurs, the control unit can directly control the scanning galvanometer module to compensate for this error, without needing to move the movable stage to compensate for it. This improves processing accuracy and further enhances the efficiency of microcrystalline grain processing.

[0017] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a microcrystalline grain processing device according to an embodiment of the present invention.

[0019] Figure 2 This is a top view schematic diagram of a movable photomask of a microcrystalline grain processing device according to an embodiment of the present invention.

[0020] Figure 3 for Figure 1 A three-dimensional schematic diagram of the movable stage, scanning galvanometer module, and transparent carrier plate.

[0021] Figure 4 This is a schematic flowchart of a microcrystalline grain processing method according to an embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram of the process for processing each processing block in a microcrystalline grain processing method according to an embodiment of the present invention.

[0023] Figure 6 This is a schematic diagram of a microcrystalline processing method according to another embodiment of the present invention.

[0024] Figure 7 This is a schematic diagram of a microcrystalline processing method according to another embodiment of the present invention. Detailed Implementation

[0025] Figure 1 This is a schematic diagram of a microcrystalline processing device according to an embodiment of the present invention. Figure 2 This is a top view schematic diagram of a movable photomask in a microcrystalline grain processing apparatus according to an embodiment of the present invention. Please refer to... Figure 1 and Figure 2The microcrystalline particle processing apparatus 100 of this embodiment is suitable for processing a plurality of microcrystalline particles G on a transparent substrate S. The microcrystalline particles may be micro-light-emitting diodes, but are not limited thereto. The purpose of processing is, for example, to separate the microcrystalline particles G from the transparent substrate S, but the present invention does not limit the purpose of processing. For example, the purpose of processing may also be to fix the microcrystalline particles G to the transparent substrate S.

[0026] The aforementioned transparent carrier S can be a wafer substrate, a relay substrate (e.g., tape), a driving substrate, or other carrier substrate that carries microcrystals. Furthermore, the microcrystal processing equipment 100 can be applied to steps requiring the separation of all or specific microcrystals from the transparent carrier, such as defective microcrystal removal steps, mass transfer steps, and good microcrystal filling steps. Additionally, the length, width, and thickness of each of the aforementioned microcrystals are, for example, less than 100 μm, and can even be less than 50 μm, for example, less than 10 μm.

[0027] The aforementioned microcrystalline grain processing equipment 100 includes a movable stage 110, an optical trimming module 120, and a photomask miniaturization projection scanning optical module 150 including a movable photomask 130 and a scanning galvanometer module 140. The movable stage 110 is adapted to carry a transparent substrate S. In this embodiment, the movable stage 110 is, for example, movable along a first axis X and a second axis Y, and rotated along a third axis Z. In another embodiment, the movable stage 110 can further move along the third axis Z. Furthermore, the optical trimming module 120 is adapted to provide a processing beam L1. The movable photomask 130 has multiple pattern units, such as pattern units 131, 132, 133, 134 (e.g., ...). Figure 2As shown, the movable photomask 130 is adapted to move so that the processing beam L1 passes through one of the pattern units 131, 132, 133, and 134. The pattern units 131, 132, 133, and 134 include pattern units 131, 132, 133, and 134 of various shapes and / or pattern units 131, 132, 133, and 134 of various sizes. Specifically, pattern units 131 and 132 are, for example, squares of different sizes, and pattern units 133 and 134 are, for example, circles of different sizes. This invention does not limit the shape, size, or number of pattern units 131, 132, 133, and 134. Furthermore, the pattern units 131, 132, 133, and 134 are, for example, arranged in a one-dimensional distribution; in another embodiment, they can also be arranged in a two-dimensional distribution. Furthermore, the movable photomask of the present invention can be moved not only along a one-dimensional or two-dimensional direction, but also rotated. In the rotating embodiment, the pattern units are arranged along a circular trajectory, for example. Additionally, the aforementioned scanning galvanometer module 140 is disposed between the movable photomask 130 and the movable stage 110. The scanning galvanometer module 140 is adapted to reflect the processing beam L1 onto the transparent substrate S and change the position of the processing beam L1 illuminating the transparent substrate S.

[0028] The aforementioned optical trimming module 120 includes, for example, a laser light source 121 and a beam shaping element 122 (such as...). Figure 1 (As shown). Laser source 121 is adapted to provide beam L2. Beam shaping element 122 is disposed on the transmission path of beam L2 to shape beam L2 into processing beam L1. Laser source 121 can be replaced with other high-energy light sources, and the present invention does not limit the type of light source. Beam shaping element 122 is, for example, a diffractive optical element (DOE), but is not limited thereto. Specifically, the beam L2 provided by laser source 121 is, for example, a Gaussian beam, while the processing beam L1 is, for example, a flat-topped light beam, but the present invention is not limited thereto. Since the Gaussian beam has a non-uniform light energy distribution, the energy distribution of the Gaussian beam can be shaped into a flat-topped profile processing beam L1 by beam shaping element 122. Because the flat-topped profile processing beam L1 has a uniform light energy distribution, it is easier to separate the microcrystals G from the transparent carrier S.

[0029] Figure 3 for Figure 1 A three-dimensional schematic diagram of the movable stage, scanning galvanometer module, and transparent carrier plate. Please refer to... Figure 3The aforementioned scanning galvanometer module 140 includes, for example, a first scanning galvanometer 141 and a second scanning galvanometer 142 arranged sequentially along the transmission path of the processing beam L1. The first scanning galvanometer 141 is adapted to oscillate within a preset angle range to reflect the processing beam L1, and to position the processing beam L1 illuminating the movable stage 110 such that it moves along a first axial direction X of the movable stage 110. The second scanning galvanometer 142 is adapted to oscillate within a preset angle range to reflect the processing beam L1 from the first scanning galvanometer 141, and to position the processing beam L1 illuminating the movable stage 110 such that it moves along a second axial direction Y of the movable stage 110, wherein there is an angle θ between the first axial direction X and the second axial direction Y. In this embodiment, the angle θ between the first axial direction X and the second axial direction Y is, for example, 90 degrees, but the invention is not limited thereto. Furthermore, the scanning galvanometer module 140 may further include a projection lens 143 disposed between the movable stage 110 and the second scanning galvanometer 142 for projecting the processing beam L1 onto the transparent substrate S.

[0030] Please refer to again Figure 1 In this embodiment, the microcrystalline processing equipment 100 also includes, for example, a photographic device 160, disposed on the side of the movable stage 110 away from the scanning galvanometer module 140 to facilitate the alignment of the transparent substrate S. Furthermore, another photographic device (not shown) can be added on the side of the scanning galvanometer module 140 away from the stage 110 to further assist in the alignment of the transparent substrate S. Additionally, the movable stage 110 is, for example, a hollow stage, to expose the transparent substrate S to the photographic device 160, allowing the photographic device 160 to capture images of the transparent substrate S. In another embodiment, the photographic device 160 can also be integrated into the movable stage 110 and located on the side away from the scanning galvanometer module 140.

[0031] The aforementioned microcrystalline processing equipment 100 also includes, for example, a control unit 170 electrically connected to the optical trimming module 120, the movable photomask 130, the scanning galvanometer module 140, the imaging device 160, and the movable stage 110. The control unit 170 is adapted to determine the positional error of the transparent substrate S on the movable stage 110 based on image data provided by the imaging device 160, and to control the scanning galvanometer module 140 to compensate for the positional error. The control unit 170 is also adapted to drive the movable stage 110 to move. Specifically, the aforementioned positional error is, for example, caused by the movement error of the movable stage 110. The method of determining the positional error includes, but is not limited to, determining it by the relative positional relationship between the alignment auxiliary lines (e.g., crosshairs) and the alignment marks on the transparent substrate S, or by determining it by the relative distance between the alignment auxiliary lines and the multiple microcrystals G on the transparent substrate S.

[0032] The following will describe the process of applying the above-mentioned microcrystalline processing equipment 100 to the microcrystalline processing method. Figure 4 This is a schematic flowchart of a microcrystalline grain processing method according to an embodiment of the present invention. Please refer to... Figure 1 , Figure 3 and Figure 4 The following will use the removal of defective microcrystals Gb as an example to describe in detail the microcrystal processing method of this embodiment. The microcrystal processing method of this embodiment includes the following steps: As shown in step S100, the control unit 170 plans at least one processing block based on the distribution of microcrystals G (i.e., defective microcrystals Gb) to be processed on the transparent carrier plate S. Figure 3 For example, the microcrystals G with diagonal lines coated on the transparent substrate S are schematically represented as defective microcrystals Gb. The control unit 170 plans the processing blocks B1, B2, B3, and B4 according to the distribution of defective microcrystals Gb on the transparent substrate S.

[0033] Next, as shown in step S200, the processing blocks are processed one by one. Specifically, the control unit 170 calculates the most efficient processing sequence based on the distribution of the processing blocks, and processes processing blocks B1, B2, B3, and B4 according to this sequence. For example, in this embodiment, the processing sequence is processing block B1, processing block B2, processing block B3, and processing block B4. The following will use processing block B1 as an example to explain in detail the process of processing each processing block B1, B2, B3, and B4.

[0034] Figure 5 This is a schematic diagram illustrating the processing of each processing block in a microcrystalline grain processing method according to an embodiment of the present invention. Please refer to... Figure 5 The processing steps for each processing block include step S210: the control unit 170 selects a suitable pattern unit from pattern units 131, 132, 133, and 134 and aligns it with the optical trimming module 120. For example, when the processing block is B1, the control unit 170 can select pattern unit 132 that is similar in size and shape to the processing block B1, and control the movable photomask 130 to move so that the pattern unit 132 is aligned with the optical trimming module 120.

[0035] Next, as shown in step S220, the control unit 170 controls the optical trimming module 120 to provide a processing beam L1 through the selected pattern unit 132, and the control unit 170 controls the scanning galvanometer module 140 to scan and irradiate the microcrystals G within the processing block B1. Specifically, when the processing beam L1 irradiates the processing block B1, it may not cover the entire processing block B1. In this case, the control unit 170 can control the scanning galvanometer module 140 to move the processing beam L1 along the first axis X and / or the second axis Y within the processing block B1, so that the microcrystals G within the entire processing block B1 can be separated from the transparent carrier plate S. Then, the microcrystals G within the processing block B1 can be separated from the transparent carrier plate S by suction.

[0036] It is worth mentioning that the microcrystalline processing method of this embodiment further includes, in the step of processing each processing block B1, B2, B3, and B4, the control unit 170 determines the positional error of the transparent carrier plate S on the movable stage 110 based on the image data provided by the imaging device 160, and controls the scanning galvanometer module 140 to compensate for the positional error. Specifically, when there is an error in the position of the transparent carrier plate S, the processing beam L1 cannot accurately illuminate the predetermined illumination position. At this time, the control unit 170 can control the swing angle of the first scanning galvanometer 141 and the second scanning galvanometer 142 to compensate for the above-mentioned positional error, so that the processing beam L1 can accurately illuminate the predetermined illumination position.

[0037] The aforementioned steps of processing the processing blocks separately include, for example, controlling the movable stage 110 to move via the control unit 170, so that processing blocks B1, B2, B3, and B4 are sequentially located within the scanning range of the scanning galvanometer module 140. The control unit 170's control of the movable stage movement also includes, for example, compensating for positional errors. Specifically, after processing block B1 is completed, the control unit 170 controls the movable stage 110 to move so that processing block B2 of the transparent substrate S is located within the processing range (the irradiation range of the processing beam L1). When calculating the distance the movable stage 110 needs to move, the control unit 170 can simultaneously consider the aforementioned positional errors to compensate for these errors after the movable stage 110 moves, thereby avoiding error accumulation.

[0038] Furthermore, if the distance between two processing blocks is too long, the positional error caused by the movement of the movable stage 110 will be large. Therefore, the aforementioned step of controlling the movement of the movable stage 110 by the control unit 170 may also include, when the distance continuously moved by the movable stage 110 reaches a preset value, the control unit 170 controls the movable stage 110 to stop moving and determines the positional error of the transparent plate S on the movable stage 110 based on the image data provided by the imaging device 160. In other words, to avoid excessive positional error due to long-distance movement, the movable stage 110 has a maximum moving distance (i.e., the aforementioned preset value) each time it moves. When the preset value is reached but the movable stage 110 has not yet moved to the target position, the control unit 170 controls the movable stage 110 to stop moving and determines the positional error of the transparent plate S on the movable stage 110 based on the image data provided by the imaging device 160. Then, the control unit 170 controls the movable stage 110 to move again and compensate for the positional error.

[0039] Although Figure 1 and Figure 3 In one embodiment, the microcrystal G is located on the side of the transparent carrier plate S facing the scanning galvanometer module 140. However, in another embodiment, the microcrystal G may be located on the side of the transparent carrier plate S away from the scanning galvanometer module 140. In this way, when the processing beam L1 irradiates the microcrystal G in the processing block B1, the microcrystal G can be directly detached from the transparent carrier plate S.

[0040] Although the microcrystals G to be processed in the above embodiments are exemplified by defective microcrystals Gb, the present invention is not limited thereto. When applied to mass transfer, such as... Figure 6 As shown, the microcrystals G to be processed can be all the microcrystals G on the transparent carrier plate S, while the microcrystals G within the processing area detach from the transparent carrier plate S and fall onto the receiving carrier plate S1. Specifically, the transparent carrier plate S is, for example, held by a movable stage 110, and the microcrystals G face the receiving carrier plate S1. When the processing beam irradiates the microcrystals G, the microcrystals G can detach from the transparent carrier plate and fall onto the receiving carrier plate S1.

[0041] When applied to microcrystal filling, such as Figure 7 As shown, the microcrystals G to be processed can be filling microcrystals G, and the microcrystals G in the processing block fall from the transparent carrier S to the microcrystal vacancies P on the receiving carrier S2. Specifically, the transparent carrier S is, for example, held by a movable stage 110, and the microcrystals G face the receiving carrier S2. The receiving carrier S2 has, for example, undergone a defective microcrystal removal process, so there are microcrystal vacancies P between the microcrystals G1 on the receiving carrier S2. Therefore, the microcrystals G to be processed can be filling microcrystals G, so that the microcrystals G on the transparent carrier S fall to the microcrystal vacancies P, thereby filling the microcrystal vacancies P.

[0042] In summary, in the microcrystalline grain processing equipment and method of this invention, because the movable photomask has multiple different pattern units, a suitable pattern unit can be selected when processing each block. Combined with the scanning galvanometer module, the processing beam scans and irradiates the processing block, thus enabling rapid processing of each block and significantly improving the efficiency of microcrystalline grain processing, thereby reducing production costs. Furthermore, the imaging device can monitor whether there is a positional error in the transparent substrate. When there is a positional error in the transparent substrate, the control unit can directly control the scanning galvanometer module to compensate for this positional error, without needing to move the movable stage to compensate for it. Therefore, processing accuracy can be improved, further enhancing the efficiency of microcrystalline grain processing.

[0043] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the methods and techniques disclosed above without departing from the scope of the present invention to create equivalent embodiments. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A microcrystalline grain processing device, suitable for processing multiple microcrystalline grains on a transparent substrate, characterized in that, The microcrystalline grain processing equipment includes: A movable platform suitable for supporting the transparent carrier plate; Optical trimming module, suitable for providing a processing beam; and A photomask miniaturized projection scanning optical module includes a movable photomask and a scanning galvanometer module. The movable photomask has multiple pattern units of different shapes. The movable photomask is adapted to move so that the processing beam passes through one of the multiple pattern units. The scanning galvanometer module is disposed between the movable photomask and the movable stage. The scanning galvanometer module is adapted to reflect the processing beam onto the transparent substrate and change the position of the processing beam illuminating the transparent substrate. The imaging device is positioned on the side of the movable stage away from the scanning galvanometer module; and The control unit is electrically connected to the optical trimming module, the movable photomask, the scanning galvanometer module, the photographic device, and the movable stage. The control unit is adapted to determine the positional error of the transparent plate on the movable stage based on the image data provided by the photographic device, and to control the scanning galvanometer module to compensate for the positional error. The scanning galvanometer module includes a first scanning galvanometer, a second scanning galvanometer, and a projection lens arranged sequentially according to the transmission path of the processing beam, wherein: The first scanning galvanometer is adapted to reflect the processing beam and to position the processing beam illuminating the movable stage so that it can move along the first axis of the movable stage. The second scanning galvanometer is adapted to reflect the processing beam and position the processing beam illuminating the movable stage to be movable along a second axis of the movable stage, wherein there is an angle between the first axis and the second axis.

2. The microcrystalline grain processing equipment according to claim 1, characterized in that, The multiple pattern units include pattern units of various shapes and / or pattern units of various sizes.

3. The microcrystalline grain processing equipment according to claim 1, characterized in that, The optical trimming module includes: Laser light source, suitable for providing a beam of light; and A beam shaping element is disposed on the transmission path of the beam to shape the beam into the processing beam.

4. A microcrystalline grain processing method, applicable to a microcrystalline grain processing device, the microcrystalline grain processing device being suitable for processing multiple microcrystalline grains on a transparent substrate, the microcrystalline grain processing device comprising a control unit and a movable stage electrically connected to the control unit, an optical trimming module, a photomask miniaturization projection scanning optical module, and a photographic device, wherein the photomask miniaturization projection scanning optical module includes a movable photomask and a scanning galvanometer module, the movable stage being suitable for carrying the transparent substrate, the movable photomask having multiple pattern units of different shapes, the scanning galvanometer module being disposed between the movable photomask and the movable stage, the scanning galvanometer module including a first scanning galvanometer, a second scanning galvanometer, and a projection lens sequentially arranged according to the transmission path of the processing beam, wherein: The first scanning galvanometer is adapted to reflect the processing beam and position the processing beam illuminating the movable stage is adapted to move along a first axis of the movable stage; the second scanning galvanometer is adapted to reflect the processing beam and position the processing beam illuminating the movable stage is adapted to move along a second axis of the movable stage, wherein there is an angle between the first axis and the second axis, characterized in that the microcrystalline processing method includes: The control unit plans at least one processing block based on the distribution of the plurality of microcrystals to be processed on the transparent substrate; and Processing each of the at least one processing block, wherein the step of processing each of the at least one processing block includes: The control unit selects a suitable pattern unit from the plurality of pattern units for alignment with the optical trimming module; and The control unit controls the optical trimming module to provide a processing beam through the selected pattern unit, and the control unit controls the scanning galvanometer module to scan and irradiate the plurality of microcrystals within the at least one processing block with the processing beam passing through the selected pattern unit. In the step of processing each of the at least one processing block, the control unit determines the positional error of the transparent plate on the movable platform based on the image data provided by the imaging device, and controls the scanning galvanometer module to compensate for the positional error.

5. The microcrystalline processing method according to claim 4, characterized in that, The microcrystals to be processed are defective microcrystals.

6. The microcrystalline processing method according to claim 4, characterized in that, The multiple microcrystals to be processed are all the microcrystals on the transparent carrier plate, and the multiple microcrystals in the processing block fall off from the transparent carrier plate to the receiving carrier plate.

7. The microcrystalline processing method according to claim 4, characterized in that, The multiple microcrystals to be processed are filling microcrystals, and the multiple microcrystals in the processing block fall off from the transparent carrier plate to the microcrystal vacancy on the receiving carrier plate.

8. The microcrystalline processing method according to claim 4, characterized in that, The number of at least one processing block is multiple, and the step of processing the at least one processing block includes controlling the movement of the movable stage by the control unit so that the at least one processing block is sequentially located within the scanning range of the scanning galvanometer module, and the control unit also compensates for the position error when controlling the movement of the movable stage.

9. The microcrystalline processing method according to claim 8, characterized in that, The step of controlling the movement of the mobile platform by the control unit also includes controlling the mobile platform to stop moving when the distance continuously moved by the mobile platform reaches a preset value, and judging the positional error of the transparent plate on the mobile platform based on the image data provided by the imaging device.

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