一种高温超导带材的扩散连接装置

By combining a press and diffusion bonding fixture, temperature and pressure are precisely controlled, solving the problem of unstable silver diffusion bonding in high-temperature superconducting tapes in existing technologies. This enables the simple preparation of low-resistivity silver diffusion joints and obtains silver diffusion joints with high critical current.

CN116706573BActive Publication Date: 2026-07-17INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
Filing Date
2023-06-28
Publication Date
2026-07-17

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Abstract

本发明公开了一种高温超导带材的扩散连接装置，包括压力机和扩散连接工装；压力机包括支架平台、隔热板、温控器、压力控制器以及依次连接的驱动电机、减速器、传动杆、压力传感器、隔热垫圈和压头；扩散连接工装包括压块、盖板和底座；底座安装在隔热板上，底座上设有用于放置带材的凹槽，凹槽的底面两侧设有定位凸台，底座内嵌有加热棒和第一热电偶；盖板底端设置与凹槽配合的凸块，凸块下表面设有加热槽，加热槽侧壁设有进气口，加热槽两端设有出气孔，加热槽中插设有第二热电偶；盖板上设有用于压块进入加热槽的通孔，压块下端设有用于下压带材的凸条。本发明能够实现第二代高温超导带材银层的扩散连接，简便地制备低电阻率的银扩散接头。
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