Electronic device

CN116708627BActive Publication Date: 2026-10-23VIVO MOBILE COMM CO LTD
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Patent Information

Application Number
CN202310877159.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-07-14
Publication Date
2026-10-23
Estimated Expiration
2043-07-14

AI Technical Summary

Technical Problem

[0004]本申请实施例的目的是提供一种电子设备,能够解决目前声学模组的低音频性能和散热性能较差的问题

Benefits of technology

[0007]在本申请实施例中,声学模组具有第一后腔,设备主体设有第二后腔,第二后腔与第一后腔相连通,从而增大声学模组的后腔,以提升声学模组的低音频性能,此时可以减少灌粉量,甚至不需要灌粉,因此可以提高声学模组的散热性能。由此可知,本申请实施例能够解决目前声学模组的低音频性能和散热性能较差的问题。

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Abstract

The application discloses an electronic device, and relates to the technical field of communication devices. The electronic device comprises a device main body and an acoustic module, the acoustic module is arranged in a containing space of the device main body, the acoustic module has a first back cavity, the device main body is provided with a second back cavity, and the second back cavity is in communication with the first back cavity.
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Description

Technical Field

[0001] This application belongs to the field of communication equipment technology, and specifically relates to an electronic device. Background Technology

[0002] With the rapid development of mobile communication technology, the performance of electronic devices is constantly improving. Acoustic performance, as one of the functions of electronic devices, is achieved by acoustic devices. The rear cavity volume and front cavity volume of acoustic devices both require a certain amount of space to meet good audio performance, thereby improving the user experience.

[0003] In order to balance the multifunctionality and thinness of electronic devices, the components of electronic devices are being compressed more and more, resulting in the volume of the rear cavity of acoustic devices becoming smaller and smaller. Currently, the main method is to fill the rear cavity with powder to increase the virtual rear cavity, but this measure has limited effect on improving the low-frequency performance of the acoustic module, and at the same time, it will lead to poor heat dissipation performance of the acoustic module. Summary of the Invention

[0004] The purpose of this application is to provide an electronic device that can solve the problems of low audio performance and poor heat dissipation performance of current acoustic modules.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application provides an electronic device, including a device body and an acoustic module. The acoustic module is disposed within the accommodating space of the device body. The acoustic module has a first rear cavity, and the device body has a second rear cavity, which is connected to the first rear cavity.

[0007] In this embodiment, the acoustic module has a first rear cavity, and the main body of the device has a second rear cavity, which is connected to the first rear cavity. This increases the rear cavity of the acoustic module, thereby improving its low-frequency performance. This reduces the amount of filler powder, or even eliminates the need for filler powder altogether, thus improving the heat dissipation performance of the acoustic module. Therefore, this embodiment can solve the problems of poor low-frequency performance and heat dissipation performance in current acoustic modules. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of the electronic device disclosed in the embodiments of this application;

[0009] Figure 2 This is an exploded view of the electronic device disclosed in the embodiments of this application;

[0010] Figure 3 This is a cross-sectional view of the electronic device disclosed in the embodiments of this application;

[0011] Figures 4 to 5These are schematic diagrams of the partial structure of the middle frame disclosed in the embodiments of this application from different perspectives;

[0012] Figure 6 This is a schematic diagram of the acoustic module disclosed in the embodiments of this application.

[0013] Explanation of reference numerals in the attached figures:

[0014] 100 - Equipment body, 110 - Accommodation space, 111 - Support foot, 120 - Sound transmission hole, 130 - Second rear cavity, 131 - First chamber, 131a - Circumvention opening, 132 - Second chamber, 140 - Middle frame, 141 - Accommodation groove, 150 - Rear cover, 160 - Display module, 170 - First seal, 171 - First sealing section, 172 - Second sealing section, 172a - First sealing sub-section, 172b - Second sealing sub-section, 172c - Third sealing sub-section, 172d - Fourth sealing sub-section, 172e - Fifth sealing sub-section, 173 - Third sealing section;

[0015] 200 - Acoustic module, 210 - First rear cavity, 211 - First through hole, 220 - Housing, 221 - Second through hole, 230 - Acoustic device;

[0016] 300 - Second seal;

[0017] 400 - Third seal;

[0018] 500 - Dustproof parts;

[0019] 600 - Fasteners;

[0020] 700 - Expansion Material. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] The electronic device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0024] refer to Figures 1 to 6 This application discloses an electronic device, which includes a device body 100 and an acoustic module 200. Optionally, the acoustic module 200 can be a BOX module, or other types of acoustic modules. This application does not impose specific limitations on this. The acoustic module 200 is disposed within the accommodating space 110 of the device body 100. The device body 100 is provided with a sound transmission hole 120, so that sound outside the device body 100 can be transmitted into the acoustic module 200, and sound generated by the acoustic module 200 can be transmitted outside the device body 100. That is, the sound transmission hole 120 can be used only to transmit sound outside the device body 100 or sound emitted by the acoustic module 200 to achieve unidirectional sound transmission, or it can transmit sound outside the device body 100 and sound emitted by the acoustic module 200 simultaneously to achieve bidirectional sound transmission. The acoustic module 200 has a first rear cavity 210, and the main body 100 has a second rear cavity 130, which is connected to the first rear cavity 210 to form the rear cavity of the entire acoustic module 200. Further, the acoustic module 200 also has a first through hole 211. Optionally, the cross-sectional shape of the first through hole 211 can be circular, triangular, rectangular, etc., without specific limitations. The second rear cavity 130 is connected to the first rear cavity 210 through the first through hole 211.

[0025] In this embodiment, the first rear cavity 210 of the acoustic module 200 is connected to the second rear cavity 130 of the device body 100, thereby increasing the rear cavity of the acoustic module 200 and improving its low-frequency performance. This reduces or even eliminates the need for powder filling, thus improving the heat dissipation performance of the acoustic module 200. Therefore, this embodiment solves the problems of poor low-frequency performance and heat dissipation in current acoustic modules. Furthermore, by reducing or eliminating the need for powder filling, this application reduces the manufacturing cost of the acoustic module 200. Simultaneously, this application does not add any new structures to the existing structure and does not affect the existing structural layout of the acoustic module 200, making it highly feasible.

[0026] Optionally, the sidewall of the accommodating space 110 has support feet 111, and the electronic device also includes fasteners 600. The acoustic module 200 is fixed to the support feet 111 by the fasteners 600. Specifically, the support feet 111 are provided with threaded connection holes, and the edge of the acoustic module 200 is provided with clearance holes. One end of the fastener 600 passes through the clearance holes and is threaded into the threaded connection holes. Further optionally, the number of support feet 111 is at least two, and each support foot 111 is spaced apart circumferentially along the acoustic module 200. The fasteners 600 are provided in a one-to-one correspondence with the support feet 111, thereby improving the stability of the acoustic module 200.

[0027] In one optional embodiment, the second rear cavity 130 includes a first chamber 131, and the device body 100 includes a middle frame 140, a rear cover 150, and a display module 160. The middle frame 140, the display module 160, and the rear cover 150 enclose a receiving space 110. Optionally, the display module 160 and the rear cover 150 can be respectively disposed on opposite sides of the middle frame 140 to enclose the receiving space 110, thereby protecting the structure disposed within the receiving space 110. Optionally, the rear cover 150 can be provided with a sound transmission hole 120. In this case, when the electronic device is used for making a call, the sound transmission hole 120 is far from the ear, making it difficult to hear clearly. Based on this, in other embodiments, the middle frame 140 is provided with a sound transmission hole 120 to improve the call quality when the electronic device is used for making a call. Optionally, the sound transmission hole 120 can be opened on the lower end surface of the middle frame 140, specifically the side of the middle frame 140 facing downwards when the user holds the electronic device. Optionally, the back cover 150 may have a first cavity 131. However, since the back cover 150 is usually a thin plate structure with a small thickness, it is difficult to open the first cavity 131. Therefore, the inner side wall of the middle frame 140 is provided with a first cavity 131, which is connected to the first rear cavity 210. Since the middle frame 140 has a large dimension in the thickness direction perpendicular to the electronic device, the first cavity 131 can be set up while ensuring the structural strength of the middle frame 140.

[0028] Optionally, the inner surface of the middle frame 140 has support feet 111, and the sound transmission hole 120 is located between a set of adjacent support feet 111 to facilitate the setting of the sound transmission hole 120.

[0029] In a further optional embodiment, the second rear cavity 130 further includes a second chamber 132, with a gap between the display module 160 and the middle frame 140. Optionally, this gap can be an assembly gap, which is unavoidable when assembling the display module 160 and the middle frame 140. The device body 100 also includes a first sealing member 170, through which the display module 160 and the middle frame 140 are sealed together. The display module 160, the middle frame 140, and the first sealing member 170 form the second chamber 132. That is, based on the existing assembly gap, the first sealing member 170 is used to form the second chamber 132. The shape and size of the second chamber 132 are determined by the first sealing member 170. Optionally, during the manufacturing of the electronic device, the shape of the first sealing member 170 can be flexibly adjusted to avoid other structures within the accommodating space, such as electronic components on a circuit board. No specific limitations are imposed here. The first chamber 131 is provided with a clearance opening 131a, which is located on the side of the middle frame 140 facing the display module 160. The first chamber 131 is connected to the second chamber 132 through the clearance opening 131a, thereby further expanding the volume of the second rear chamber 130 and improving the low-frequency performance of the acoustic module 200. Of course, there is also a gap between the rear cover 150 and the middle frame 140. The rear cover 150 and the middle frame 140 can be sealed together by the fourth sealing member. At this time, the rear cover 150, the middle frame 140 and the fourth sealing member form a third chamber, and the second rear chamber 130 includes this third chamber. The rear cover 150 is not easily affected by the vibration generated when the acoustic module 200 emits sound, so it is not easily damaged.

[0030] Optionally, when the display module 160 and the middle frame 140 are sealed together by the first seal 170, the first seal 170 can always be in a deformed state, thereby improving the sealing performance of the second chamber 132. Further optionally, the first seal 170 can be a sealing foam, which has the characteristics of dustproof, high temperature resistance, good vibration isolation performance and anti-compression deformation performance.

[0031] Optionally, the first sealing element 170 can be a closed annular sealing ring, in which case the annular sealing ring surrounds the clearance opening 131a; or, in other embodiments, the clearance opening 131a is located between the first end and the second end of the first sealing element 170, in which case the first sealing element 170 can be a structure that is not connected end to end. The length and shape of the first sealing element 170 with this structure can be adjusted according to actual needs during installation, making it more flexible; in addition, the first sealing element 170 with this structure occupies less structural space in the middle frame 140, which facilitates the manufacturing of the middle frame 140. Optionally, the two ends of the first sealing element 170 can cooperate with the side wall of the middle frame 140, and the clearance opening 131a can be opened on the side wall or adjacent to the side wall. The side wall can protrude relative to other parts of the middle frame 140, thereby sealing the space between the two ends of the first sealing element 170, and finally forming a relatively closed second chamber 132.

[0032] Optionally, the first sealing element 170 includes a first sealing segment 171, a second sealing segment 172, and a third sealing segment 173 connected in sequence, with an avoidance opening 131a located between the first sealing segment 171 and the third sealing segment 173. Optionally, the first sealing segment 171 and the third sealing segment 173 may both extend along the width direction of the avoidance opening 131a. However, since the dimensions of the middle frame 140 in the width direction of the avoidance opening 131a are limited, the dimensions of the first sealing segment 171 and the third sealing segment 173 are relatively limited. In view of this, in other embodiments, the first sealing segment 171 and the third sealing segment 173 both extend along the length direction of the avoidance opening 131a to increase the length of the first sealing segment 171 and the third sealing segment 173, thereby improving the sealing performance of the second chamber 132. In this case, the second sealing segment 172 is spaced apart from the avoidance opening 131a, and the second sealing segment 172 is located on one side of the avoidance opening 131a.

[0033] Optionally, the first sealing section 171 can be fitted to the side wall of the middle frame 140, and the connection between the first sealing section 171 and the second sealing section 172 can form a right angle, that is, the two can be connected perpendicularly. In addition, the connection can be located in the middle of the first sealing section 171. Similarly, the third sealing section 173 can be fitted to the side wall of the middle frame, and the connection between the third sealing section 173 and the second sealing section 172 can form a right angle, that is, the two can be connected perpendicularly. In addition, the connection can be located in the middle of the third sealing section 173. This not only improves the structural strength of the connection, but also expands the volume of the second chamber 132.

[0034] refer to Figure 4Optionally, the second sealing section 172 can be an elongated structure, comprising a first sealing sub-segment 172a, a second sealing sub-segment 172b, a third sealing sub-segment 172c, a fourth sealing sub-segment 172d, and a fifth sealing sub-segment 172e connected sequentially. The first sealing sub-segment 172a is connected to the first sealing section 171, and the fifth sealing sub-segment 172e is connected to the third sealing section 173. The first sealing sub-segment 172a, the third sealing sub-segment 172c, and the fifth sealing sub-segment 172e all extend along the width direction of the clearance opening 131a, while the second sealing sub-segment 172b and the fourth sealing sub-segment 172d both extend along the length direction of the clearance opening 131a. The first distance between the fourth sealing sub-segment 172d and the clearance opening 131a is less than the second distance between the second sealing sub-segment 172b and the clearance opening 131a. In this design, the second sealing section 172 with this structure can avoid electronic components on the circuit board and other structures within the accommodating space.

[0035] In another optional embodiment, the side of the middle frame 140 facing the display module 160 is provided with a receiving groove 141, and a portion of the first sealing member 170 is disposed within the receiving groove 141, thereby fixing the first sealing member 170 and preventing the first sealing member 170 from shifting. Of course, the side of the display module 160 facing the middle frame 140 may also be provided with a receiving groove 141. In this case, the receiving groove 141 may be specifically formed on the substrate of the display module 160, but this may easily affect other structures of the display module 160.

[0036] Optionally, the first chamber 131 can be spherical, conical, square, etc. In this case, the thickness of the middle frame 140 needs to be increased, which will result in a larger size of the electronic device, making it inconvenient for the user to hold. Therefore, in other embodiments, the first chamber 131 is a strip structure. In this case, the volume of the first chamber 131 can be increased without increasing the thickness of the middle frame 140, thereby further improving the low-frequency performance of the acoustic module 200.

[0037] Optionally, when the first chamber 131 is a strip structure, the strip structure can extend along the length of the electronic device, thereby further increasing the volume of the first chamber 131; and the sound transmission hole 120 is usually opened on the lower end face of the middle frame 140. When the first chamber 131 extends along the length of the electronic device, the sound transmission hole 120 and the first chamber 131 are located on different faces of the middle frame 140, thus avoiding mutual interference between the two.

[0038] In another optional embodiment, the electronic device further includes a second seal 300 disposed on the device body 100 and surrounding the opening of the second rear cavity 130. The device body 100 is sealed to the acoustic module 200 through the second seal 300, thereby improving the sealing performance of the rear cavity of the acoustic module 200.

[0039] Optionally, the opening of the second rear cavity 130 can be a strip structure, and the shape of the second seal 300 matches the opening of the second rear cavity 130. The strip structure opening can not only increase its cross-sectional area, but also facilitate the setting of the second rear cavity 130.

[0040] Optionally, in the thickness direction of the electronic device, the cross-sectional area of ​​the opening of the second rear cavity 130 is smaller than the cross-sectional area of ​​other parts of the second rear cavity 130, and the shape of the opening of the second rear cavity 130 can be adapted to the first through hole 211 in order to ensure the structural strength of the device body 100.

[0041] Optionally, the second seal 300 can be a sealing silicone, which has excellent electrical insulation, sealing, and adhesive properties, and good resistance to high and low temperatures. In other words, when the second seal 300 is a sealing silicone, it can be fixed to the middle frame 140 without the need for other fasteners, which is quite convenient.

[0042] In another optional embodiment, the electronic device further includes a dustproof component 500, which is disposed on the outer surface of the acoustic module 200 and covers the first through hole 211, thereby blocking dust from entering the first rear cavity 210 of the acoustic module 200 and preventing dust from damaging the acoustic device 230 of the acoustic module 200.

[0043] Optionally, the dustproof component 500 can be a dustproof mesh with uniform mesh size, smooth surface, and excellent filtration performance; further optionally, the dustproof mesh can be a stainless steel dustproof mesh, which has good high temperature resistance and corrosion resistance.

[0044] In another optional embodiment, the acoustic module 200 includes a housing 220 and an acoustic device 230. Optionally, the acoustic device 230 can be a speaker, a receiver, etc., without specific limitations. The acoustic device 230 is disposed inside the housing 220, dividing the inner cavity of the housing 220 into a front cavity and a first rear cavity 210. The front cavity is connected to the sound transmission hole 120. The housing 220 is provided with a second through hole 221 and a first through hole 211. Optionally, the first through hole 211 and the second through hole 221 are located on different sides of the housing 220 to avoid mutual interference between them. The front cavity is connected to the sound transmission hole 120 through the second through hole 221. The electronic device also includes a third sealing element 400, which is disposed on the housing 220 and surrounds the second through hole 221. The housing 220 is sealed to the device body 100 through the third sealing element 400, thereby improving the sealing performance of the front cavity so that the sound generated by the acoustic module 200 is transmitted through the sound transmission hole 120 as much as possible, thereby improving the working efficiency of the acoustic module 200.

[0045] Optionally, the second through hole 221 can be a strip-shaped hole that extends along the width direction of the electronic device. The number of sound transmission holes 120 is at least two, and each sound transmission hole 120 can be arranged sequentially at intervals along the length direction of the second through hole 221, that is, arranged in a straight line. Multiple sound transmission holes 120 are beneficial to improving sound transmission efficiency.

[0046] Optionally, the third seal 400 can be a sealing silicone, which has excellent electrical insulation, sealing and adhesive properties, and good resistance to high and low temperatures.

[0047] Optionally, the electronic device may further include expansion material 700, which can be disposed in the first rear cavity 210 of the acoustic module 200 to increase the virtual rear cavity, thereby further expanding the volume of the rear cavity of the acoustic module 200 and improving the low-frequency performance of the acoustic module 200. Of course, the expansion material 700 can be used in small quantities or even not at all to avoid significantly reducing the heat dissipation performance of the acoustic module 200. That is to say, it is necessary to consider both the low-frequency performance and heat dissipation performance of the acoustic module 200, and the amount of expansion material 700 should be flexibly adjusted according to the actual situation. This application embodiment does not impose specific limitations on this.

[0048] The electronic devices disclosed in this application can be smartphones, tablets, e-book readers, wearable devices (such as smartwatches), video game consoles, and other electronic devices. This application does not impose specific limitations on the types of electronic devices.

[0049] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An electronic device, characterized in that, The device includes a main body (100) and an acoustic module (200). The acoustic module (200) is disposed in the accommodating space (110) of the main body (100). The acoustic module (200) has a first rear cavity (210), and the main body (100) has a second rear cavity (130). The second rear cavity (130) includes a first chamber (131) and a second chamber (132). The main body of the device (100) includes a middle frame (140), a rear cover (150), a first sealing element (170), and a display module (160). The middle frame (140), the display module (160), and the rear cover (150) form the receiving space (110). The inner sidewall of the middle frame (140) has the first chamber (131) connected to the first rear cavity (210). There is a gap between the display module (160) and the middle frame (140), which is an assembly gap. The frame (140) is sealed and fitted by the first seal (170). The display module (160), the middle frame (140) and the first seal (170) form the second chamber (132) in the assembly gap. The first chamber (131) is provided with a clearance opening (131a). The clearance opening (131a) is located on the side of the middle frame (140) facing the display module (160). The first chamber (131) is connected to the second chamber (132) through the clearance opening (131a). The clearance opening (131a) is located between the first end and the second end of the first seal (170).

2. The electronic device according to claim 1, characterized in that, The first sealing element (170) includes a first sealing section (171), a second sealing section (172), and a third sealing section (173) connected in sequence. The clearance opening (131a) is located between the first sealing section (171) and the third sealing section (173). Both the first sealing section (171) and the third sealing section (173) extend along the length direction of the clearance opening (131a). The second sealing section (172) is spaced apart from the clearance opening (131a) and is located on one side of the clearance opening (131a).

3. The electronic device according to claim 1, characterized in that, The middle frame (140) has a receiving groove (141) on the side facing the display module (160), and a portion of the first sealing member (170) is disposed in the receiving groove (141).

4. The electronic device according to claim 1, characterized in that, The first chamber (131) has a strip-shaped structure.

5. The electronic device according to claim 1, characterized in that, The electronic device further includes a second seal (300), which is disposed on the device body (100) and surrounds the opening of the second rear cavity (130). The device body (100) is sealed to the acoustic module (200) through the second seal (300).

6. The electronic device according to claim 1, characterized in that, The electronic device further includes a dustproof component (500), which is disposed on the outer surface of the acoustic module (200). The acoustic module (200) also has a first through hole (211). The second rear cavity (130) is connected to the first rear cavity (210) through the first through hole (211). The dustproof component (500) covers the first through hole (211).

7. The electronic device according to claim 1, characterized in that, The main body (100) of the device is provided with a sound transmission hole (120). The acoustic module (200) includes a shell (220) and an acoustic device (230). The acoustic device (230) is disposed inside the shell (220). The acoustic device (230) divides the inner cavity of the shell (220) into a front cavity and a first rear cavity (210). The front cavity is connected to the sound transmission hole (120). The shell (220) is provided with a second through hole (221). The front cavity is connected to the sound transmission hole (120) through the second through hole (221). The electronic device also includes a third sealing member (400). The third sealing member (400) is disposed in the shell (220). The third sealing member (400) is disposed around the second through hole (221). The shell (220) is sealed to the main body (100) through the third sealing member (400).

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