Carrier mechanism for cleaning and handling

Abstract

Embodiments of the present disclosure relate to a carrier mechanism for holding optical devices. The carrier mechanism includes adjacent tray assemblies stacked such that a plurality of optical device lenses are held between the adjacent tray assemblies. The carrier mechanism holds the plurality of optical device lenses by contacting corners of the optical device lenses without damaging the plurality of optical device lenses. The plurality of optical device lenses are held using a plurality of support pins and a plurality of catch pins disposed in the tray assemblies. Each tray includes a plurality of openings corresponding to the plurality of optical device lenses such that a fluid can contact the plurality of optical device lenses. The carrier mechanism can be used in a plurality of processing methods for the plurality of optical device lenses.

Description

[0001] background

[0002] field

[0003] The embodiments of this disclosure generally relate to optical devices. More specifically, the embodiments described herein relate to carrier mechanisms for holding optical devices.

[0004] Description of related technologies

[0005] Optical devices, including waveguide combiners (such as augmented reality waveguide combiners) and flat optical devices (such as metasurfaces), are used to assist in overlaying images. The generated light propagates through the optical device until it leaves the device and coats the surrounding environment.

[0006] Optical devices generally include structures mounted on them. Both the optical device and the structures formed on it are made of thin, brittle materials that are susceptible to damage when exposed to external stress. Furthermore, some coatings applied to the optical device and the structures formed on it are sensitive to handling. Therefore, optical devices are easily damaged when transferred between different handling tools. Thus, it is desirable to utilize carrier mechanisms to hold the optical device during handling operations. However, the carrier mechanism requires precise configuration to avoid contact with and damage to the structures, coatings, and optical device.

[0007] Furthermore, many carrier mechanisms used to hold optical devices are typically used only as one step in a series of processing operations, leading to increased handling of the optical devices. For example, vertical handling and fluid-based cleaning operations are difficult to perform while holding the optical devices in a carrier mechanism. Increased handling can result in damage to the optical devices. Accordingly, there is a need in the art for a carrier mechanism for holding optical devices. Summary of the Invention

[0008] In one embodiment, a carrier having at least two tray assemblies is provided. Each tray assembly includes a first positioning rail and a first non-positioning rail. Each tray assembly further includes a tray coupled to the first positioning rail and the first non-positioning rail. The tray is disposed between the first positioning rail and the first non-positioning rail. Each tray assembly further includes a plurality of openings disposed through the tray and a plurality of capture pins disposed through the tray. Each tray assembly further includes a plurality of support pins disposed through the tray, the plurality of support pins and the plurality of capture pins being operable to hold a plurality of optical lens elements.

[0009] In another embodiment, a carrier having at least two tray assemblies is provided. Each tray assembly includes a first positioning rail and a first non-positioning rail. Each tray assembly further includes a tray coupled to the first positioning rail and the first non-positioning rail. The tray is disposed between the first positioning rail and the first non-positioning rail. Each tray assembly further includes a plurality of openings through the tray and a plurality of retaining pins through the tray. Each tray assembly further includes a plurality of support pins disposed through the tray. The plurality of support pins and the plurality of retaining pins are operable to hold a plurality of optical lens elements. The plurality of support pins include ramps operable to engage corners of the plurality of optical lens elements.

[0010] In another embodiment, a method is provided. The method includes the step of: placing a carrier mechanism in a fluid-containing processing station. The carrier mechanism is operable to hold a plurality of optical lenses between a first tray assembly and a second tray assembly. The plurality of optical lenses are held by a plurality of support pins disposed in the first tray assembly and a plurality of capture pins disposed in the second tray assembly. The method further includes the step of: directing ultrasonic energy toward the carrier mechanism. The ultrasonic energy propagates parallel to the surfaces of the plurality of optical lenses to be cleaned. The ultrasonic energy forces the fluid through a gap between the first tray assembly and the second tray assembly and through a plurality of openings in the first tray assembly and the second tray assembly.

[0011] Brief description of the attached figures

[0012] To gain a more detailed understanding of the features described above in this disclosure, a more specific description of the disclosure, which has been briefly summarized above, can be obtained by referring to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate exemplary embodiments only and should not be considered as limiting the scope of this disclosure, and other equivalent embodiments are permissible.

[0013] Figure 1A This is a schematic perspective view of the carrier structure according to the embodiment.

[0014] Figure 1B This is a schematic cross-sectional view of a portion of the carrier mechanism according to the embodiment.

[0015] Figure 1C This is a schematic perspective view of a portion of the carrier mechanism according to the embodiment.

[0016] Figure 2 This is a schematic cross-sectional view of the processing station according to the implementation method.

[0017] Figure 3 This is a flowchart of a method for holding multiple optical device lenses in a carrier mechanism according to an embodiment.

[0018] Figure 4 This is a flowchart of a sub-method for processing multiple optical device lenses in a carrier mechanism according to an embodiment.

[0019] For ease of understanding, the same reference numerals have been used as much as possible to denote the common elements in the figures. It is anticipated that elements and features of one embodiment may be advantageously incorporated into other embodiments without further description. Detailed Implementation

[0020] The embodiments of this disclosure generally relate to optical devices. More specifically, the embodiments described herein relate to carrier mechanisms for holding optical devices. In one embodiment, a carrier having at least two tray assemblies is provided. Each tray assembly includes a first positioning rail and a first non-positioning rail. Each tray assembly further includes a tray coupled to the first positioning rail and the first non-positioning rail. The tray is disposed between the first positioning rail and the first non-positioning rail. Each tray assembly further includes a plurality of openings disposed through the tray and a plurality of capture pins disposed through the tray. Each tray assembly further includes a plurality of support pins disposed through the tray, the plurality of support pins and the plurality of capture pins being operable to hold a plurality of optical device lenses.

[0021] Figure 1AThis is a schematic perspective view of the carrier mechanism 100. The carrier mechanism 100 includes two or more tray assemblies 105, namely, a first tray assembly 105A and a second tray assembly 105B. Each tray assembly 105 includes a positioning rail 102, a non-positioning rail 104, and a tray 106. The tray 106 is coupled to a plurality of capture pins 114 and a plurality of support pins 116. In one embodiment that can be combined with other embodiments described herein, the carrier mechanism 100 has a carrier mechanism height 120 between about 135 mm and about 323 mm. The carrier mechanism 100 is operable to hold a plurality of optical device lenses 112. The carrier mechanism 100 provides for placing the plurality of optical device lenses 112 in a cleaning device, such as an ultrasonic cleaner. The carrier mechanism 100 allows chemical exposure, thermal exposure, vibration, and other manufacturing steps to be applied to the plurality of optical device lenses 112. In addition, the carrier mechanism 100 allows metrological processes to be performed on the plurality of optical device lenses 112. For example, when held by the carrier mechanism 100, optical inspection or quality inspection can be performed on the multiple optical lens 112. The carrier mechanism 100 can also be used to hold the multiple optical lens 112 for transport. Although only four capture pins 114 and four support pins 116 are shown to hold each of the multiple optical lens 112, any number of multiple support pins 116 and multiple capture pins 114 can be arranged in the tray 106 to hold the optical lens 112 as desired.

[0022] like Figure 1A As shown, two or more pallet assemblies 105 are stacked together to form a carrier mechanism 100. The carrier mechanism 100 includes at least a second pallet assembly 105B disposed on (i.e., stacked on) a first pallet assembly 105A. Positioning rails 102 and non-positioning rails 104 of the first pallet assembly 105A are capable of contacting positioning rails 102 and non-positioning rails 104 of the adjacent second pallet assembly 105B, allowing two or more pallet assemblies 105 to be stacked. The positioning rails 102 and non-positioning rails 104 are formed such that the positioning rails 102 and non-positioning rails 104 of the first pallet assembly 105A can overlap with the positioning rails 102 and non-positioning rails 104 of the adjacent second pallet assembly 105B to maintain stacking. In one embodiment, which can be combined with other embodiments described herein, positioning pins are disposed on the positioning rails 102, such that two or more pallet assemblies 105 remain overlapping and stacked. A pallet feeder can be used to stack two or more pallet assemblies 105. Although Figure 1A Only two tray assemblies 105 (first tray assembly 105A and second tray assembly 105B) are shown in the diagram. The carrier mechanism 100 may include more than two stacked tray assemblies 105. For example, the carrier mechanism 100 may include ten tray assemblies 105 in a stack structure.

[0023] Positioning rail 102 and non-positioning rail 104 hold tray 106. Positioning rail 102 includes a first slit 108. Non-positioning rail 104 includes a second slit 109. The first slit 108 and the second slit 109 allow tray 106 to be positioned between positioning rail 102 and non-positioning rail 104. Tray 106 is inserted into the first slit 108 of positioning rail 102. The first slit 108 is aligned with tray 106 within tray assembly 105. Then, tray 106 is slid into the second slit 109 of non-positioning rail 104. Positioning rail 102 and non-positioning rail 104 are formed of materials including, but not limited to, stainless steel, plastics (such as polypropylene), ceramics (such as Al2O3), brass, or combinations thereof.

[0024] Tray 106 further includes a plurality of openings 110. The plurality of openings 110 provide access to a plurality of optical lenses 112 disposed between the two stacked tray assemblies 105. The shape of the plurality of openings 110 can be adjusted to correspond to the profile of the plurality of optical lenses 112 disposed between the two stacked tray assemblies 105. Tray 106 may be made of a corrosion-resistant material. Tray 106 includes, but is not limited to: stainless steel, plastics (such as polypropylene), ceramics (such as Al2O3), brass, or combinations thereof. Although in Figure 1A Only six of the multiple optical device lenses 112 are shown, but any number of multiple optical device lenses 112 can be held by two adjacent tray assemblies 105. Alternatively, any number of multiple optical device lenses can be held in the carrier mechanism 100.

[0025] The multiple openings 110 can be laser-cut into the tray 106 based on the desired profile of the multiple openings 110 corresponding to the multiple optical lens 112. The multiple openings 110 allow fluids, gases, or solids to contact the multiple optical lens 112. For example, a chemical bath or batch of water can contact the multiple optical lens 112 via the multiple openings 110. Fluids, gases, or solids can also contact the multiple optical lens 112 via a gap 126 between two stacked tray assemblies 105. The gap 126 is between approximately 6 mm and approximately 12 mm. In addition, the multiple openings 110 and the gap 126 allow for optical inspection of the multiple optical lens 112.

[0026] The plurality of optical lenses 112 can be any optical lens used in the art, and can be opaque or transparent, depending on the intended use of the optical lenses. Furthermore, the selection of optical lenses can further include variations in shape, thickness, and diameter of the plurality of optical lenses 112. The tray assembly 105 is operable to be adjusted to fit different optical lens shapes. In one embodiment that can be combined with other embodiments described herein, the plurality of optical lenses 112 includes, but is not limited to: silicon (Si), silicon dioxide (SiO2), fused silica, quartz, silicon carbide (SiC), germanium (Ge), silicon germanium (SiGe), indium phosphide (InP), gallium arsenide (GaAs), gallium nitride (GaN), sapphire, or combinations thereof. In some embodiments that can be combined with other embodiments described herein, the plurality of optical lenses 112 are planar optical devices, such as metasurfaces. In other embodiments that can be combined with other embodiments described herein, the plurality of optical lenses 112 are waveguide combiners, such as augmented reality waveguide combiners. In another embodiment that can be combined with other embodiments described herein, the plurality of optical device lenses 112 may have a first surface 113 or a second surface 115 on the plurality of optical device lenses 112. Figure 1B The patterned optical device structure shown in the image.

[0027] Figure 1B This is a schematic cross-sectional view of part 125 of the carrier mechanism 100. Figure 1A The section shown is 125. (For example...) Figure 1B As seen, tray 106 is positioned in the second slit 109 of the non-locating rail 104. Tray 106 can be held in place by a set screw 122. The set screw 122 is located in the non-locating rail 104 and can be tightened to contact tray 106 to improve the stability and holding force of tray 106. The set screw 122 can also be located in the locating rail 102 to hold tray 106 in the first slit 108.

[0028] Multiple capture pins 114 and multiple support pins 116 are coupled to tray 106. The multiple capture pins 114 and multiple support pins 116 are offset to prevent over-contraint of the multiple optical lenses 112. Optical lenses among the multiple optical lenses 112 are positioned to contact the support pins 116. Each of the multiple support pins 116 includes a ramp 118 and a capture post 117. The ramp 118 allows the corners of the multiple optical lenses 112 to be placed on the multiple support pins 116. In one embodiment, which can be combined with other embodiments described herein, the ramp 118 is generally shallow, such that the corners of the multiple optical lenses are held without shifting or moving on the ramp 118. Therefore, the multiple optical lenses 112 do not contact each other on their edges and surfaces. The ramp 118 allows the multiple optical lenses 112 to be held without damage. The capture post 117 prevents lateral movement of the multiple optical lenses 112. Multiple capturing pins 114 provide vertical force to hold multiple optical lenses 112, while multiple support pins 116 prevent lateral movement of the multiple optical lenses 112. Holding the multiple optical lenses 112 in the carrier mechanism 100 by the multiple capturing pins 114 and multiple support pins 116 allows the multiple optical lenses 112 to be transferred to multiple processing stations for processing. The carrier mechanism 100 firmly holds the multiple optical lenses 112, so that the multiple optical lenses 112 do not require additional handling. Therefore, the carrier mechanism 100 minimizes damage to the multiple optical lenses 112. In addition, the carrier mechanism 100, which provides multiple processing steps for the multiple optical lenses 112, increases throughput because less time is required to handle and transfer the multiple optical lenses 112.

[0029] The ramp 119 of each of the plurality of capturing pins 114 also improves the lateral support of the plurality of optical lenses 112 without damaging the plurality of optical lenses 112. The retention of the plurality of optical lenses 112 allows the carrier mechanism 100 to be used for handling methods, such as vertical handling. The plurality of support pins 116 and the plurality of capturing pins 114 are made of plastic materials, such as polyetheretherketone, polypropylene, or other high-temperature plastics.

[0030] Multiple support pins 116 and multiple capture pins 114 are coupled to tray 106 using a heat staking process. Each of the multiple support pins 116 and multiple capture pins 114 includes a bonding region 124. The bonding region 124 of each of the multiple support pins 116 and multiple capture pins 114 is provided through tray 106. A heat staking process is applied to the bonding region 124 to couple the multiple support pins 116 and multiple capture pins 114 to tray 106. Heat exposure provides a bonded seal to tray 106, such that the multiple support pins 116 and multiple capture pins 114 are retained within tray 106. In one embodiment, which may be combined with other embodiments described herein, the bonding region 124 forms a rivet and is bonded to tray 106 upon exposure to the heat staking process.

[0031] Figure 1C This is a schematic perspective view of part 125 of the carrier mechanism 100. Figure 1A The section shown is 125. (For example...) Figure 1C As shown, multiple capturing pins 114 and multiple support pins 116 are offset to prevent over-constraint of the optical lenses of the multiple optical devices 112. A mating region 124 of the multiple support pins 116 and multiple capturing pins 114 is provided through the tray 106. A hot-melt process forms rivets with the mating region 124 to secure the multiple capturing pins 114 and multiple support pins 116 to the tray 106. Furthermore, as... Figure 1C As seen, fluid (i.e., cleaning fluid) can be forced through multiple openings 110 or gaps 126, while multiple optical lenses 112 are held between trays 106.

[0032] Figure 2This is a schematic cross-sectional view of processing station 200. A carrier mechanism 100 is disposed within processing station 200. Processing station 200 may be configured to deliver ultrasonic energy to a plurality of optical lens 112 held by carrier mechanism 100. The ultrasonic energy is provided by transducer 202. Processing station 200 allows carrier mechanism 100 to be immersed in a fluid. In one embodiment, which may be combined with other embodiments described herein, the fluid is a cleaning fluid, and the cleaning fluid is forced through a plurality of openings 110 or gaps 126 of carrier mechanism to remove particles from the plurality of optical lens 112. In some cases, the cleaning fluid includes, but is not limited to: hydrogen fluoride (HF), hydrochloric acid (HCl), nitric acid (HNO3), citric acid (C6H8O7), ammonium hydroxide (NH4OH), deionized water (DIW), or combinations thereof. In another embodiment, which may be combined with other embodiments described herein, carrier mechanism 100 may be disposed on a base (not shown) within processing station 200. In yet another embodiment, which can be combined with other embodiments described herein, the processing station 200 may be configured to deliver an airflow to a plurality of optical lens 112 held by the carrier mechanism 100. For example, the airflow may be forced through a plurality of openings 110 or gaps 126 in the carrier mechanism to dry the plurality of optical lens 112. The processing station 200 may also be configured to spray gas, fluid, or solid onto the plurality of optical lens 112 held by the carrier mechanism 100.

[0033] Multiple optical lenses are held in the carrier mechanism 100 by multiple capturing pins 114 and multiple support pins 116 disposed in the tray 106 of the tray assembly 105. The carrier mechanism 100 includes a stacked structure of the tray assembly 105 to allow multiple optical lenses 112 to be held in a vertical processing position. Therefore, a first surface 113 or a second surface 115 of the multiple optical lenses 112 is perpendicular to the surface 204 of the transducer 202. The first surface 113 and the second surface 115 may have optical structures disposed on the first surface 113 and the second surface 115. Therefore, the first surface 113 and the second surface 115 are surfaces to be cleaned. The first surface 113 and the second surface 115 are parallel to the direction in which the transducer 202 directs ultrasonic energy, so that air pockets are not formed. In other embodiments that can be combined with other embodiments described herein, the transducer 202 is disposed on the sidewall 206 of the processing station 200. Therefore, in order to ensure that the ultrasonic energy is guided parallel to the surfaces to be cleaned by the multiple optical lenses 112, the carrier mechanism 100 is arranged such that the first surface 113 and the second surface 115 are perpendicular to the sidewall 206 of the processing station 200.

[0034] Figure 3This is a flowchart of a method 300 for holding a plurality of optical lenses 112 in a carrier mechanism 100. At operation 301, a plurality of optical lenses 112 are placed on a first tray assembly 105A. The plurality of optical lenses 112 contact a plurality of support pins 116 disposed in a tray 106 of the first tray assembly 105A. At operation 302, a second tray assembly 105B is placed on top of the first tray assembly 105A. A plurality of retaining pins 114 disposed in the second tray assembly 105B further retain the plurality of optical lenses 112. The positioning rails 102 and non-positioning rails 104 of the first tray assembly 105A are aligned and stacked with the positioning rails 102 and non-positioning rails 104 of the second tray assembly 105B. The plurality of retaining pins 114 in the second tray assembly 105B surround the plurality of optical lenses 112 disposed in the carrier mechanism 100.

[0035] In optional operation 303, an additional tray assembly 105 is stacked on top of the second tray assembly 105B until the desired number of optical lenses 112 have been held in the carrier mechanism 100.

[0036] At optional operation 304, sub-method 400 is executed. Figure 4 This is a flowchart of a sub-method 400 for processing multiple optical lens 112s in a carrier mechanism 100. (See reference) Figure 2 Sub-method 400 is described using processing station 200. However, sub-method 400 may be performed in conjunction with other processing stations according to embodiments of the disclosure described herein. At operation 401, a carrier mechanism 100 is placed in processing station 200. The carrier mechanism 100 is placed such that the first surface 113 and the second surface 115 of a plurality of optical lens 112 are parallel to the direction of propagation of ultrasonic energy. Ultrasonic energy is provided by transducer 202. The ultrasonic energy forces fluid through gaps 126 and a plurality of openings 110 in the carrier mechanism 100, such that the fluid contacts the plurality of optical lens 112. In one embodiment, the ultrasonic energy has a frequency of about 20 kHz to about 100 MHz. In another embodiment, which may be combined with other embodiments described herein, megasonic energy may be utilized in operation 304.

[0037] At operation 402, a spray mixture is sprayed onto the carrier mechanism 100. The spray mixture is sprayed through gaps 126 and multiple openings 110 in the carrier mechanism 100, such that the spray mixture contacts multiple optical lens 112. The spray mixture includes, but is not limited to, one or more of the following: gaseous CO2, liquid CO2, solid CO2, a combination of the above, or other suitable materials.

[0038] At operation 403, carrier assembly 100 is exposed to a drying process. The drying process includes directing airflow through a gap 126 between the first tray assembly 105A and the second tray assembly 105B and through a plurality of openings 110. For example, the drying process may include directing air at a plurality of optical lens 112 to dry the plurality of optical lens 112 following a previous processing step (such as operation 402). In some embodiments that may be combined with other embodiments described herein, the drying process is performed in processing station 200 of operation 402. In other embodiments that may be combined with other embodiments described herein, the drying process is performed in a separate processing station.

[0039] In another optional operation 305, the carrier mechanism 100 can be transferred to another processing station for additional processing steps. The carrier mechanism 100 provides multiple processing steps to be performed on the multiple optical lenses 112 while they are held within the carrier mechanism 100. Therefore, the carrier mechanism 100 minimizes damage to the multiple optical lenses 112 because there is less handling of the multiple optical lenses 112 between processing steps. Additionally, the carrier mechanism 100, which provides multiple processing steps for the multiple optical lenses 112, increases throughput because less time is required to handle and transfer the multiple optical lenses 112.

[0040] In summary, this document demonstrates and describes a carrier mechanism for holding optical devices. The carrier mechanism includes adjacent tray assemblies stacked such that multiple optical device lenses are held between the adjacent tray assemblies. Each tray assembly includes positioning rails, non-positioning rails, and a tray held by the positioning and non-positioning rails. Each tray includes multiple capture pins and multiple support pins disposed through the tray. The multiple capture pins and multiple support pins hold the multiple optical device lenses by contacting the corners of the optical device lenses without contacting or damaging them. Each tray includes multiple openings corresponding to the multiple optical device lenses, allowing fluid access to the multiple optical device lenses. Furthermore, the multiple openings provide optical inspection of the multiple optical device lenses. The carrier mechanism is operable for use in multiple processing methods and thus minimizes damage to the multiple optical device lenses and increases throughput.

[0041] While the foregoing provides examples of this disclosure, other and further examples of this disclosure may be devised without departing from the essential scope of this disclosure, the scope of which is determined by the appended claims.

Claims

1. A carrier having at least two tray assemblies, each tray assembly comprising: First positioning rail; First non-positioning rail; A tray, the tray being coupled to the first positioning rail and the first non-positioning rail, the tray being disposed between the first positioning rail and the first non-positioning rail; Multiple openings and multiple capture pins are provided through the tray, each of the multiple capture pins including a ramp operable to provide lateral support for multiple optical lens devices. and Multiple support pins are provided through the tray, and the multiple support pins and multiple capture pins are operable to hold the multiple optical lenses.

2. The carrier as claimed in claim 1, wherein the first positioning rail of the first tray assembly contacts the second positioning rail of the second tray assembly, the first non-positioning rail of the first tray assembly contacts the second non-positioning rail of the second tray assembly, and the first tray assembly and the second tray assembly are adjacent to each other.

3. The carrier as claimed in claim 2, wherein the gap between the first tray assembly and the second tray assembly is between 6 mm and 12 mm.

4. The carrier as claimed in claim 1, wherein the tray is held in the first slit of the first positioning rail and the second slit of the first non-positioning rail.

5. The carrier as claimed in claim 4, wherein a plurality of fixing screws are disposed in the first positioning rail and the first non-positioning rail to couple the tray to the first slit and to the second slit.

6. The carrier as claimed in claim 1, wherein each of the plurality of support pins includes a ramp and a capture post.

7. The carrier of claim 6, wherein the ramp of each of the plurality of support pins is operable to contact the corner of a corresponding one of the plurality of optical lens devices.

8. The carrier of claim 1, wherein the tray comprises a material comprising stainless steel, plastic, ceramic, brass, or a combination thereof.

9. A carrier having at least two tray assemblies, each tray assembly comprising: First positioning rail; First non-positioning rail; A tray, the tray being coupled to the first positioning rail and the first non-positioning rail, the tray being disposed between the first positioning rail and the first non-positioning rail; Multiple openings and multiple capture pins are provided, the multiple openings and multiple capture pins being disposed through the tray; and A plurality of support pins are disposed through the tray, the plurality of support pins and the plurality of catch pins being operable to hold a plurality of optical lens elements, the plurality of support pins including ramps operable to contact the corners of the plurality of optical lens elements.

10. The carrier of claim 9, wherein the first positioning rail of the first tray assembly is coupled to the second positioning rail of the second tray assembly, the first non-positioning rail of the first tray assembly is coupled to the second non-positioning rail of the second tray assembly, and the first tray assembly and the second tray assembly are adjacent to each other.

11. The carrier of claim 10, wherein the gap between the first tray assembly and the second tray assembly is between 6 mm and 12 mm.

12. The carrier of claim 9, wherein the plurality of capture pins includes a ramp operable to provide lateral support for the plurality of optical lens elements.

13. The carrier of claim 9, wherein the plurality of support pins and the plurality of capture pins comprise a plastic material.

14. The carrier of claim 9, wherein the tray comprises a material comprising stainless steel, plastic, ceramic, brass, or a combination thereof.

15. A method for processing a plurality of optical lens devices in a carrier mechanism, comprising the following steps: The carrier mechanism is disposed in a fluid-containing processing station. The carrier mechanism is operable to hold a plurality of optical lenses, each having corner portions, between a first tray assembly and a second tray assembly. The plurality of optical lenses are held by a plurality of support pins disposed in the first tray assembly and a plurality of retaining pins disposed in the second tray assembly, such that the support pins contact these corner portions of the plurality of optical lenses. The ultrasonic energy is directed toward the carrier mechanism and propagates parallel to the surfaces of the plurality of optical lenses to be cleaned. The ultrasonic energy forces the fluid through the gap between the first tray assembly and the second tray assembly and through a plurality of openings in the first tray assembly and the second tray assembly.

16. The method of claim 15, wherein the plurality of capture pins also contact these corners of the plurality of optical lens devices.

17. The method of claim 16, further comprising the step of: applying heat to the plurality of catch pins and the plurality of support pins to couple the plurality of catch pins and the plurality of support pins to the first tray assembly and the second tray assembly.

18. The method of claim 15, further comprising the step of: exposing the carrier assembly to a drying process, the drying process including allowing airflow through the gap between the first tray assembly and the second tray assembly and through the plurality of openings.

19. The method of claim 15, further comprising the step of: spraying a spray mixture onto the carrier mechanism, the spray mixture comprising one or more of the following: gaseous CO2, liquid CO2, or solid CO2.

20. The method of claim 15, further comprising the step of: directing megasonic energy toward the carrier mechanism, the megasonic energy propagating parallel to the surfaces of the plurality of optical lens devices to be cleaned.

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