Thermally conductive silicone composition

Abstract

The present application is a heat conductive silicone composition characterized by comprising: (A) an organopolysiloxane represented by the following general formula (1) and having a kinematic viscosity at 25°C of 10 to 10,000 mm 2 / s; (B) an organopolysiloxane other than the (A) component, represented by the following general formula (2) and having a kinematic viscosity at 25°C of 1,000 to 100,000 mm 2 / s; (C) an organosilane represented by the following general formula (3); and (D) a heat conductive filler having a thermal conductivity of 10 W / m°C or more. Thus, a heat conductive silicone composition is provided which does not undergo thickening during storage and has excellent offset resistance. 3 c SiO (4‑c) / 2 (2)R 4 d R 5 e Si(OR 6 ) 4‑d‑e (3).

Description

Technical Field

[0001] This invention relates to a thermally conductive organosilicon composition. Background Technology

[0002] The increasing heat generation and high-density assembly of electronic components have led to a growing need for component cooling. Common methods for component cooling involve transferring heat from heat-generating components to cooling components. In such structures, thermally conductive components are used to improve the seal between the heat-generating and cooling parts, thereby maximizing heat transfer efficiency. Examples of thermally conductive components include sheet-like components that are molded parts and grease-like components that are not molded parts (Patent Documents 1 and 2).

[0003] From the perspective of automated installation, grease-like materials are more commonly used. However, grease-like materials are in liquid form. If this phenomenon occurs, the contact between the heating and cooling parts deteriorates, the thermal conductivity worsens, and the component's performance decreases. In such cases, greases or similar materials that are liquid during application and cure after application are also used (Patent Documents 3 and 4).

[0004] However, these greases are highly reactive, so they need to be frozen or refrigerated to inhibit the reaction, or stored in airtight containers to prevent moisture. Since the storage of these greases restricts the handling of materials before use, from an operational perspective, there is a need for a material that can be stored at room temperature and under normal conditions.

[0005] Patent Document 5 describes a composition that exhibits excellent flowability and durability and reliability under high temperature and high humidity conditions by simultaneously using organopolysiloxanes and alkoxysilanes with specific structures. However, Patent Document 5 does not describe resistance to displacement, and the grease will thicken during storage if the composition described in the document is stored at room temperature. Existing technical documents Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-233104 Patent Document 2: Japanese Patent Application Publication No. 2018-188559 Patent Document 3: Japanese Patent Application Publication No. 2016-017159 Patent Document 4: Japanese Patent No. 5733087 Patent Document 5: Japanese Patent No. 4933094 Summary of the Invention The technical problem to be solved by the present invention

[0007] The present invention was made in view of the above circumstances, and its object is to provide a thermally conductive organosilicon composition that does not thicken during storage and has excellent resistance to displacement. Technical means to solve technical problems

[0008] To address the aforementioned technical problems, this invention provides a thermally conductive organosilicon composition, which incorporates an organopolysiloxane with a specific viscosity to enable it to be stored at room temperature and improve its resistance to displacement. The means for achieving this are described in detail below.

[0009] That is, the present invention provides a thermally conductive organosilicon composition, characterized in that it comprises: 100 parts by weight of (A) organopolysiloxane, which is represented by the following general formula (1) and has a kinematic viscosity of 10 to 10,000 mm at 25°C. 2 / s, [Chemical Formula 1] R 1 R is an independent monovalent hydrocarbon group, either unsubstituted or substituted. 2 Independently, it is alkyl, alkoxyalkyl, alkenyl or acyl, where a is an integer from 5 to 100 and b is an integer from 1 to 3; 40 to 250 parts by weight of an organopolysiloxane other than component (A) of (B), which is represented by the following general formula (2) and has a kinematic viscosity of 1,000 to 100,000 mm at 25°C. 2 / s, R 3 c SiO (4-c) / 2 (2) R 3 It is one or more groups selected from the group consisting of saturated or unsaturated monovalent hydrocarbon groups with 1 to 18 carbon atoms, where c is a positive number of 1.8 ≤ c ≤ 2.2; (C) An organosilane, represented by the following general formula (3), and comprising 1 to 50 parts by mass relative to a total of 100 parts by mass of component (A) and component (B). R 4 d R 5 e Si(OR 6 ) 4-d-e (3) In equation (3), R 4 Independently, it is an alkyl group having 9 to 15 carbon atoms, R 5 R is an independent monovalent hydrocarbon group consisting of 1 to 8 carbon atoms, either unsubstituted or substituted. 6Independently, it is an alkyl group having 1 to 6 carbon atoms, where d is an integer from 1 to 3 and e is an integer from 0 to 2, wherein d+e is an integer from 1 to 3; and (D) A thermally conductive filler material having a thermal conductivity of 10 W / m·℃ or higher, and having a mass of 500 to 3,000 parts by mass relative to a total of 100 parts by mass of the components (A), (B), and (C).

[0010] If it is such a thermally conductive silicone composition, it will not thicken during storage and has excellent resistance to displacement.

[0011] Furthermore, in this invention, a thermally conductive organosilicon composition with an absolute viscosity of 100 to 800 Pa·s at 25°C is preferred.

[0012] If it is such a thermally conductive silicone composition, it will not cure during storage at room temperature.

[0013] Furthermore, in this invention, a preferred feature is a thermally conductive organosilicon composition having a thermal conductivity of 4.0 W / m·℃ or higher.

[0014] If it is such a thermally conductive silicone composition, then the thermal conductivity is excellent. Invention Effects

[0015] As described above, if it is the thermally conductive silicone composition of the present invention, it can prevent curing during room temperature storage while maintaining high thermal conductivity and offset resistance, compared with the prior art. Detailed Implementation

[0016] As described above, there is a need to develop a thermally conductive silicone composition that does not thicken during storage and exhibits excellent resistance to displacement.

[0017] The inventors of this application have repeatedly conducted in-depth research on the above-mentioned technical problems and found that by setting the amount of organosilane blending within a specific range and further setting the amount of organopolysiloxane with a specific viscosity within a specific range, compared with the prior art, while maintaining high thermal conductivity and resistance to displacement, solidification during room temperature storage can be prevented even without freezing or refrigeration. Thus, the present invention was completed.

[0018] That is, the present invention is a thermally conductive organosilicon composition, characterized in that it comprises: 100 parts by weight of (A) organopolysiloxane, which is represented by the following general formula (1) and has a kinematic viscosity of 10 to 10,000 mm at 25°C. 2 / s, [Chemical Formula 2] R1 R is an independent monovalent hydrocarbon group, either unsubstituted or substituted. 2 Independently, it is alkyl, alkoxyalkyl, alkenyl or acyl, where a is an integer from 5 to 100 and b is an integer from 1 to 3; 40 to 250 parts by weight of an organopolysiloxane other than component (A) of (B), which is represented by the following general formula (2) and has a kinematic viscosity of 1,000 to 100,000 mm at 25°C. 2 / s, R 3 c SiO (4-c) / 2 (2) R 3 It is one or more groups selected from the group consisting of saturated or unsaturated monovalent hydrocarbon groups with 1 to 18 carbon atoms, where c is a positive number of 1.8 ≤ c ≤ 2.2; (C) An organosilane, represented by the following general formula (3), and comprising 1 to 50 parts by mass relative to a total of 100 parts by mass of component (A) and component (B). R 4 d R 5 e Si(OR 6 ) 4-d-e (3) In equation (3), R 4 Independently, it is an alkyl group having 9 to 15 carbon atoms, R 5 R is an independent monovalent hydrocarbon group consisting of 1 to 8 carbon atoms, either unsubstituted or substituted. 6 Independently, it is an alkyl group having 1 to 6 carbon atoms, where d is an integer from 1 to 3 and e is an integer from 0 to 2, wherein d+e is an integer from 1 to 3; and (D) A thermally conductive filler material having a thermal conductivity of 10 W / m·℃ or higher, and having a mass of 500 to 3,000 parts by mass relative to a total of 100 parts by mass of the components (A), (B), and (C).

[0019] The present invention will now be described in detail, but it is not limited thereto.

[0020] (A)Ingredients (A) The organopolysiloxane in the component is represented by general formula (1) and has a kinematic viscosity of 10 to 10,000 mm at 25°C. 2 / s of organopolysiloxanes. [Chemical Formula 3] R 1 R is an independent monovalent hydrocarbon group, either unsubstituted or substituted.2 Independently, it is an alkyl, alkoxyalkyl, alkenyl, or acyl group, where a is an integer from 5 to 100 and b is an integer from 1 to 3.

[0021] (A) Ingredients may be used alone or in combination with two or more ingredients.

[0022] The above R 1 Independently, a monovalent hydrocarbon group, whether unsubstituted or substituted, includes, for example, straight-chain alkyl, branched alkyl, cyclic alkyl, alkenyl, aryl, aralkyl, and haloalkyl. Examples of straight-chain alkyl groups include methyl, ethyl, propyl, hexyl, and octyl. Examples of branched alkyl groups include isopropyl, isobutyl, tert-butyl, and 2-ethylhexyl. Examples of cyclic alkyl groups include cyclopentyl and cyclohexyl. Examples of alkenyl groups include vinyl and allyl. Examples of aryl groups include phenyl and tolyl. Examples of aralkyl groups include 2-phenylethyl and 2-methyl-2-phenylethyl. Examples of haloalkyl groups include 3,3,3-trifluoropropyl, 2-(nonafluorobutyl)ethyl, and 2-(heptadecylfluorooctyl)ethyl. R 1 Methyl or phenyl is preferred.

[0023] The above R 2 It can be independently alkyl, alkoxyalkyl, alkenyl, or acyl. As an alkyl group, examples include those related to R. 1 Examples of linear alkyl groups, branched alkyl groups, and cyclic alkyl groups with the same group structure include: alkoxyalkyl, methoxyethyl, and methoxypropyl, for example; alkenyl, vinyl, and allyl, for example; and acyl, acetyl, and octanoyl, for example. R 2 Preferably alkyl, particularly methyl or ethyl. a is an integer from 5 to 100. b is an integer from 1 to 3, preferably 3.

[0024] (A) The kinematic viscosity at 25°C, measured using an Ostwald viscometer, is typically 10–10,000 mmHg. 2 / s, particularly preferably 10 to 5,000 mm 2 / s. If the kinematic viscosity is less than 10 mm... 2 If the kinematic viscosity is higher than 10,000 mm² / s, oil bleeding is likely to occur from the composition. 2 If the flow rate is reduced to / s, the composition becomes less fluid.

[0025] The following examples can be cited as suitable specific examples of component (A). [Chemical Formula 4]

[0026] (B) Ingredients (B) is an organopolysiloxane other than the component (A), which is represented by the following general formula (2) and has a kinematic viscosity of 1,000 to 100,000 mm at 25°C. 2 / s. R 3 c SiO (4-c) / 2 (2) R 3 It is one or more groups selected from the group consisting of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms, where c is a positive number of 1.8 ≤ c ≤ 2.2.

[0027] Wherein, R in equation (2) above 3 It is at least one group selected from the group consisting of saturated or unsaturated monovalent hydrocarbon groups having 1 to 18 carbon atoms. From the perspective of the desired viscosity, c needs to be a positive number of 1.8 to 2.2, and is particularly preferably a positive number of 1.9 to 2.1. As described above, R... 3 Examples of such compounds include: alkyl groups such as methyl, ethyl, propyl, hexyl, octyl, decyl, dodecyl, tetradecyl, hexadecyl, octadecyl, etc.; cycloalkyl groups such as cyclopentyl and cyclohexyl; alkenyl groups such as vinyl and allyl; aryl groups such as phenyl and tolyl; aralkyl groups such as 2-phenylethyl and 2-methyl-2-phenylethyl; and halogenated hydrocarbon groups such as 3,3,3-trifluoropropyl, 2-(perfluorobutyl)ethyl, 2-(perfluorooctyl)ethyl, and p-chlorophenyl.

[0028] Furthermore, regarding the kinematic viscosity of the aforementioned organopolysiloxane at 25°C, measured using an Ostwald viscometer, if it is less than 1,000 mm... 2 If the concentration is / s, the composition is prone to thickening during storage. If it exceeds 100,000 mm, the thickening will be more likely to occur. 2 If the ratio is less than 1 / s, the resulting composition will lack elasticity and workability, therefore a range of 1,000 to 100,000 mm is required. 2 Within the range of / s, preferably 1,000 to 50,000 mm 2 The range of / s.

[0029] If the amount of component (B) is less than 40 parts by mass, the composition will solidify during storage at room temperature. If it is more than 250 parts by mass, the composition will lack extensibility. Therefore, it needs to be in the range of 40 to 250 parts by mass, preferably 40 to 230 parts by mass.

[0030] (C) Components (C) is an organosilane represented by the following general formula (3). R 4 d R5 e Si(OR 6 ) 4-d-e (3) In equation (3), R 4 Independently, it is an alkyl group having 9 to 15 carbon atoms, R 5 R is an independent monovalent hydrocarbon group consisting of 1 to 8 carbon atoms, either unsubstituted or substituted. 6 Independently, it is an alkyl group having 1 to 6 carbon atoms, where d is an integer from 1 to 3 and e is an integer from 0 to 2, and d+e is an integer from 1 to 3.

[0031] R, as in the above general formula (3) 4 Specific examples include nonyl, decyl, dodecyl, and tetradecyl. If the number of carbon atoms is less than 9, the wettability with the filler material is insufficient; if it is greater than 15, the organosilane will solidify at room temperature, making operation inconvenient and reducing the low-temperature properties of the resulting composition. Furthermore, d is 1, 2, or 3, with 1 being particularly preferred.

[0032] Furthermore, R in the above equation (3) 5 Specific examples include monovalent hydrocarbon groups with 1 to 8 carbon atoms, whether saturated or unsaturated. Examples of such groups include alkyl, cycloalkyl, alkenyl, aryl, aralkyl, and halogenated hydrocarbon groups. Examples include alkyl groups such as methyl, ethyl, propyl, hexyl, and octyl; cycloalkyl groups such as cyclopentyl and cyclohexyl; alkenyl groups such as vinyl and allyl; aryl groups such as phenyl and tolyl; aralkyl groups such as 2-phenylethyl and 2-methyl-2-phenylethyl; and halogenated hydrocarbon groups such as 3,3,3-trifluoropropyl, 2-(perfluorobutyl)ethyl, 2-(perfluorooctyl)ethyl, and p-chlorophenyl, with methyl and ethyl being particularly preferred. Furthermore, e is an integer from 0 to 2. Wherein, d+e is an integer from 1 to 3, with 1 being particularly preferred.

[0033] R in equation (3) above 6 It is one or more alkyl groups having 1 to 6 carbon atoms, such as methyl, ethyl, propyl, butyl, pentyl, and hexyl, with methyl and ethyl being particularly preferred.

[0034] As specific examples of organosilanes represented by the general formula (3), the following examples can be cited.

[0035] C 10 H 21 Si(OCH3)3, C 12 H 25 Si(OCH3)3, C 12 H 25 Si(OC2H5)3, C 10 H 21 Si(CH3)(OCH3)2、C10 H 21 Si(C6H5)(OCH3)2, C 10 H 21 Si(CH3)(OC2H5)2、C 10 H 21 Si(CH=CH2)(OCH3)2、C 10 H 21 Si(CH2CH2CF3)(OCH3)2

[0036] If the organosilane is less than 1 part by mass relative to the total of 100 parts by mass of components (A) and (B), the composition will shift; if it is more than 50 parts by mass, it will solidify during storage at room temperature. Therefore, it needs to be in the range of 1 to 50 parts by mass, preferably 1 to 30 parts by mass, and more preferably 2 to 30 parts by mass.

[0037] (D) Components As component (D), a thermally conductive filler material with a thermal conductivity of 10 W / m·℃ or higher can be used. This is because if the thermal conductivity of the filler material is less than 10 W / m·℃, the thermal conductivity of the thermally conductive silicone composition itself will decrease. Higher thermal conductivity of the filler material is preferred, and there is no specific upper limit; for example, it can be set to 5,000 W / m·℃ or lower.

[0038] Examples of thermally conductive filler materials include aluminum powder, copper powder, silver powder, iron powder, nickel powder, gold powder, tin powder, metallic silicon powder, aluminum nitride powder, boron nitride powder, silicon nitride powder, aluminum oxide powder, diamond powder, carbon powder, indium powder, gallium powder, zinc oxide powder, etc. However, as long as the filler material has a strength of 10 W / m·℃ or higher, it can be any filler material, and it can be a single filler material or a filler material obtained by mixing two or more of them.

[0039] (D) The average particle size of the component can be in the range of 0.1 to 150 μm. The reason is that if the average particle size is greater than 0.1 μm, the resulting composition will be grease-like and have excellent spreadability, while if it is less than 150 μm, the thermal resistance of the heat dissipation grease will be reduced and the performance will be improved.

[0040] Furthermore, in this invention, the average particle size can be measured using a Microtrac MT3300EX manufactured by Nikkiso Co., Ltd., and is the volume average particle size based on volume. (D) The shape of the component can be amorphous, spherical, or any shape.

[0041] If the amount of component (D) is less than 500 parts by mass relative to the total of 100 parts by mass of components (A), (B), and (C), the thermal conductivity of the composition will be low. If it is more than 3,000 parts by mass, the viscosity of the composition will increase and it will lack ductility. Therefore, it needs to be in the range of 500 to 3,000 parts by mass, preferably 800 to 2,800 parts by mass, and more preferably in the range of 800 to 2,500 parts by mass.

[0042] Other ingredients In addition, in this invention, besides the components (A) to (D) mentioned above, antioxidants, heat resistance improvers, colorants, etc. may be added as needed and according to the purpose of this invention.

[0043] The absolute viscosity of the thermally conductive silicone composition of the present invention at 25°C is preferably 100–800 Pa·s. Within this viscosity range, it will not solidify during storage, and the composition exhibits suitable flowability and good workability, thus it is preferred.

[0044] The absolute viscosity at 25°C was measured, for example, using a rotational viscometer.

[0045] Furthermore, the thermally conductive silicone composition of the present invention preferably has a thermal conductivity of 4.0 W / m·℃ or higher. A thermal conductivity of 4.0 W / m·℃ or higher is considered excellent and is therefore preferred. Higher thermal conductivity is more preferred than higher thermal conductivity of the thermally conductive silicone composition of the present invention; no particular upper limit is specified, for example, it can be set to 100 W / m·℃ or lower.

[0046] The thermal conductivity mentioned above was measured, for example, at 25°C using a rapid thermal conductivity meter.

[0047] As described above, the thermally conductive organosilicon composition of the present invention, by optimizing the proportion of the organosilane incorporated and incorporating a specific amount of organopolysiloxane with a specific viscosity, can become a thermally conductive organosilicon composition that does not thicken during storage and has excellent resistance to displacement.

[0048] <Preparation Method of Thermally Conductive Organosilicon Composition> To prepare the thermally conductive silicone composition (grease) of the present invention, components (A) to (D) can be mixed using a mixer such as TRI-MIX, TWINMIX, PLANETARY MIXER (all registered trademarks of mixers manufactured by INOUE MFG., INC.), Ultramixer (registered trademark of mixers manufactured by MIZUHO INDUSTRIAL CO., LTD.), or HIVIS DISPERMIX (registered trademark of mixers manufactured by Tokushoku Keikaku Kabushiki Kaisha). Example

[0049] The present invention will be specifically described below using examples and comparative examples, but the present invention is not limited thereto.

[0050] The effects of the present invention were tested in the following manner.

[0051] [Viscosity Measurement] After the thermally conductive silicone composition was placed in a constant temperature room at 25°C for 24 hours, the absolute viscosity at a rotation speed of 10 rpm was measured using a MALCOM viscometer.

[0052] [Methods for measuring thermal conductivity] The thermal conductivity of the thermally conductive silicone composition was measured at 25°C using a QTM-500 rapid thermal conductivity meter (KYOTOELECTRONICS MANUFACTURING CO.,LTD.).

[0053] [Evaluation of shelf life at room temperature] The sample was stored in a constant temperature bath at 25℃ / 50% humidity for 3 months, and the absolute viscosity was measured using the method described above. A viscosity exceeding 800 Pa·s was considered to be cured.

[0054] [Displacement Resistance] A 100μm thick layer of thermally conductive silicone composition is sandwiched between a glass plate and an aluminum plate, and then placed upright. The test was conducted in a thermal cycling test chamber for 500 cycles. The distance of deviation from the initial position was measured.

[0055] The following components are prepared to form a thermally conductive organosilicon composition. (A)Ingredients A-1: Represented by the following formula (4) and with a kinematic viscosity of 30 mm. 2 / s of organopolysiloxanes [Chemical Formula 5]

[0056] (B) Ingredients B-1: Composed of ((CH3)3SiO 1 / 2 Composed of (CH3)2SiO units and (CH3)2SiO units, with a kinematic viscosity of 1,000 mmH2O. 2 / s of organopolysiloxanes B-2: Composed of ((CH3)3SiO 1 / 2 Composed of (CH3)2SiO units and (CH3)2SiO units, with a kinematic viscosity of 2,000 mmH2O. 2 / s of organopolysiloxanes B-3: Composed of ((CH3)3SiO 1 / 2Composed of (CH3)2SiO units and (CH3)2SiO units, with a kinematic viscosity of 10,000 mmH2O. 2 / s of organopolysiloxanes B-4 (Comparative Example): Composed of ((CH3)3SiO 1 / 2 Composed of (CH3)2SiO units and (CH3)2SiO units, with a kinematic viscosity of 100 mmH2O. 2 / s of organopolysiloxanes B-5 (Comparative Example): Composed of ((CH3)3SiO 1 / 2 Composed of (CH3)2SiO units and (CH3)2SiO units, with a kinematic viscosity of 200,000 mmH2O. 2 / s of organopolysiloxanes In addition, B-1 to B-3 above satisfy the conditions of general formula (2).

[0057] (C) Components C-1: C 10 H 21 Si(OCH3)3

[0058] (D) Components D-1: Using 5 liters of PLANETARY MIXER (manufactured by INOUE MFG., INC.), the aluminum powder and zinc oxide powder were mixed at room temperature for 15 minutes at the mixing ratio shown in Table 1 below to obtain thermally conductive filler material D-1. ○ Aluminum powder with an average particle size of 7 μm (thermal conductivity: 236 W / m·℃) ○ Zinc oxide powder with an average particle size of 0.6 μm (thermal conductivity: 25 W / m·℃)

[0059] [Table 1]

[0060] The thermally conductive organosilicon compositions of Examples 1-8 and Comparative Examples 1-8 were obtained by mixing components (A) to (D) in the following manner: Component (A) was measured into 5 liters of PLANETARY MIXER (manufactured by INOUE MFG., INC.), and components (B), (C), and (D) were added in the amounts shown in Tables 2 and 3, and the mixture was stirred at 70°C for 1 hour. The evaluation results are shown in Tables 2 and 3.

[0061] [Table 2]

[0062] [Table 3]

[0063] As shown in Table 2, the thermally conductive organosilicon compositions prepared in Examples 1 to 8 have a viscosity of 100 to 800 Pa·s after being stored at room temperature and have a high thermal conductivity of over 4.0 W / m·℃.

[0064] On the other hand, as shown in Table 3, curing occurs when the kinematic viscosity of component (B) is low, as in Comparative Example 1. If the kinematic viscosity of component (B) is high, as in Comparative Example 2, it cannot form a paste. If the content of component (B) is too low, as in Comparative Example 3, curing occurs. If the content of component (B) is too high, as in Comparative Example 4, it cannot form a paste. If the content of component (C) is too high, as in Comparative Example 5, curing occurs. If the content of component (D) is too high, as in Comparative Example 6, it cannot form a paste. If the content of component (D) is too low, as in Comparative Example 7, the thermal conductivity decreases. If the content of component (C) is too low, as in Comparative Example 8, the resistance to displacement deteriorates.

[0065] As described above, if the content of component (B) is less than 40 parts by mass, curing will occur (Comparative Example 3); if the content of component (B) is more than 250 parts by mass, it cannot become a paste (Comparative Example 4). Therefore, by keeping the content of component (B) in the thermally conductive silicone composition of the present invention within the range of 40 to 250 parts by mass, a thermally conductive silicone composition that does not thicken during room temperature storage and exhibits good resistance to displacement can be obtained. In the present invention, by skillfully adjusting the kinematic viscosity and doping amount of the incorporated organopolysiloxane, and the doping amount of the organosilane and the thermally conductive filler, such a thermally conductive silicone composition with excellent physical properties can be obtained.

[0066] Furthermore, this invention is not limited to the above-described embodiments. The above embodiments are illustrative examples, and any technical solution having a substantially identical structure and achieving the same effect as the technical concept described in the claims of this invention is included within the technical scope of this invention.

Claims

1. A thermally conductive organosilicon composition, characterized in that, It includes: 100 parts by weight of (A) organopolysiloxane, which is represented by the following general formula (1) and has a kinematic viscosity of 10~10,000 mm at 25°C. 2 / s, R 1 R is an independent monovalent hydrocarbon group, either unsubstituted or substituted. 2 Independently, it is an alkyl, alkoxyalkyl, alkenyl, or acyl group, where a is an integer from 5 to 100 and b is an integer from 1 to 3; 40 to 250 parts by weight of an organopolysiloxane other than component (A) of (B), which is represented by the following general formula (2) and has a kinematic viscosity of 1,000 to 10,000 mm at 25°C. 2 / s, R 3 c SiO (4-c) / 2 (2) R 3 It is one or more groups selected from the group consisting of saturated or unsaturated monovalent hydrocarbon groups with 1 to 18 carbon atoms, where c is a positive number of 1.8 ≤ c ≤ 2.2; (C) An organosilane, represented by the following general formula (3), and comprising 2 to 30 parts by mass relative to a total of 100 parts by mass of component (A) and component (B). R 4 d R 5 e Si(OR 6 ) 4-d-e (3) In equation (3), R 4 Independently, it is an alkyl group having 9 to 15 carbon atoms, R 5 R is an independent monovalent hydrocarbon group consisting of 1 to 8 carbon atoms, either unsubstituted or substituted. 6 Independently, it is an alkyl group having 1 to 6 carbon atoms, where d is an integer from 1 to 2 and e is an integer from 0 to 1, wherein d + e is an integer from 1 to 2; and (D) A thermally conductive filler material having a thermal conductivity of 10 W / m·℃ or higher, and having a mass of 800 to 2,500 parts by mass relative to a total of 100 parts by mass of the components (A), (B), and (C).

2. The thermally conductive organosilicon composition according to claim 1, characterized in that, The absolute viscosity at 25℃ is 100~800 Pa·s.

3. The thermally conductive organosilicon composition according to claim 1 or 2, characterized in that, It has a thermal conductivity of over 4.0 W / m·℃.

Images