Speaker module structure and electronic device including the same

Abstract

A speaker module structure according to various embodiments of the disclosure includes a first structure, a second structure coupled with the first structure, and a speaker coupled to at least one of the first structure and the second structure, wherein the second structure includes at least one recess forming a resonance space through coupling between the first structure and the second structure, wherein the resonance space is connected to the speaker and is injected with an adsorbing material, and when the first structure and the second structure are coupled together, one end of the recess can include an opening formed as a closed loop including a portion of the first structure and a portion of the second structure.

Description

Technical Field

[0001] This disclosure relates to a loudspeaker module structure and an electronic device including the loudspeaker module structure. Background Technology

[0002] Typically, electronic devices include speaker units for providing sound services to users, and the speaker units are fixed inside the electronic device.

[0003] Loudspeaker units require resonant space to ensure high-quality sound output from the loudspeaker units. Therefore, loudspeaker units may include a housing to accommodate the loudspeaker units and ensure resonant space.

[0004] To meet the current trend of thin and compact electronic devices, the speaker units housed within these devices also need to be compact. Specifically, the housing used to house the speaker units and ensure the resonant space has a limited size, and the resonant space for sound quality can also have a limited space.

[0005] The above information is presented as background information only to aid in understanding this disclosure. No determination or assertion is made as to whether any of the above content constitutes prior art relating to this disclosure. Summary of the Invention

[0006] Technical issues

[0007] When the adsorbent material is injected into the resonant space of the speaker device along its height to adsorb air, insufficient height of the speaker device narrows the movement path of the adsorbent material, thus interfering with its movement into the resonant space. As a result, during processing, it may take longer for the adsorbent material to move from the injection port to the resonant space at a distance, increasing manufacturing costs. Furthermore, the device structure may narrow the movement path of the adsorbent material, making its injection difficult.

[0008] The loudspeaker module may have increased dimensions to ensure an injection opening or movement path for injecting the absorbent material. Therefore, a structure for the loudspeaker module is needed that is configured to ensure an injection opening or movement path for injecting the absorbent material while maintaining a compact loudspeaker module.

[0009] The aspects of this disclosure at least address the aforementioned problems and / or disadvantages, and provide at least the following advantages. Therefore, one aspect of this disclosure is to provide a loudspeaker module structure and an electronic device including the loudspeaker module structure, wherein a housing for accommodating a loudspeaker unit is formed by a separately separable connecting structure, and an absorbent material can be injected through an opening formed through the side surface of the housing.

[0010] Additional aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of the presented embodiments.

[0011] Solution to the problem

[0012] According to various embodiments of the present disclosure, a loudspeaker module structure may include a first structure, a second structure configured to be coupled to the first structure, and a loudspeaker coupled to at least one of the first structure or the second structure, wherein the second structure includes at least one groove configured to form a resonant space through a connection between the first structure and the second structure, wherein the resonant space is connected to the loudspeaker and has an absorbent material injected therein, and wherein, when the first structure and the second structure are coupled, one end of the groove includes an opening formed as a closed loop, the closed loop including a portion of the first structure and a portion of the second structure.

[0013] According to various embodiments of the present disclosure, an electronic device includes a speaker assembly, the speaker assembly including a first carrier, a second carrier configured to be coupled to the first carrier, and a speaker coupled to at least one of the first carrier or the second carrier, wherein the second carrier includes at least one groove configured to form a resonant space through a connection between the first carrier and the second carrier, wherein the resonant space is connected to the speaker and has an absorbent material injected therein, and wherein, when the first carrier and the second carrier are coupled, one end of the groove includes an opening formed as a closed loop, the closed loop including a portion of the first carrier and a portion of the second carrier.

[0014] Beneficial effects of the invention

[0015] According to the various embodiments disclosed herein, by connecting the separable structure, the adsorbent material can be effectively injected into the resonant space of the speaker device through an opening formed through the side surface of the speaker device.

[0016] According to the various embodiments disclosed herein, an opening for injecting absorbent material is formed through the side surface of the speaker device, enabling the speaker device to have a reduced height compared to the case where the material is injected in the height direction of the speaker device, thereby reducing space loss.

[0017] Other aspects, advantages, and salient features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments disclosed in conjunction with the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a front perspective view of an electronic device according to an embodiment.

[0019] Figure 2This is a rear perspective view of an electronic device according to an embodiment.

[0020] Figure 3 It is a projection diagram showing the arrangement of internal components of an electronic device according to an embodiment.

[0021] Figure 4 An example of an embodiment is shown along Figure 3 A partial sectional view taken by line A-A'.

[0022] Figure 5a The first and second states of a speaker module according to one embodiment are shown.

[0023] Figure 5b A speaker module according to another embodiment is shown.

[0024] Figure 6a An embodiment is shown. Figure 5a The speaker module is shown in a cross-sectional view taken along line B-B' in the second state.

[0025] Figure 6b An illustration is shown according to another embodiment. Figure 5b A cross-sectional view of the speaker module taken along line C-C'.

[0026] Figure 7 An opening formed through a speaker module according to one embodiment is shown.

[0027] Figure 8 A first sealing member attached to a region of a speaker module according to one embodiment is shown.

[0028] Figure 9 A second sealing member attached to a speaker module according to one embodiment is shown.

[0029] Figure 10 An opening formed through the speaker module according to another embodiment is shown.

[0030] Figure 11 The area to which the first sealing member is attached and the area to which the second sealing member is attached, according to another embodiment, are shown.

[0031] Figure 12 This is a block diagram of an electronic device in a network environment according to various embodiments.

[0032] In all the accompanying drawings, similar reference numerals will be understood to refer to similar parts, components and structures. Detailed Implementation

[0033] The following description, provided with reference to the accompanying drawings, is intended to aid in a comprehensive understanding of the various embodiments of this disclosure as defined by the claims and their equivalents. It includes various specific details to aid understanding, but these are to be considered exemplary only. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of this disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and structures may be omitted.

[0034] The terms and words used in the following description and claims are not limited to their documentary meaning, but are used by the inventors only to enable a clear and consistent understanding of this disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this disclosure is provided for illustrative purposes only and is not intended to limit the disclosure as defined by the appended claims and their equivalents.

[0035] It will be understood that the singular forms “a,” “an,” and “the” include plural indicators unless the context explicitly specifies otherwise. Thus, for example, referring to “the surface of a component” includes referring to one or more such surfaces.

[0036] Figure 1 This is a front perspective view of an electronic device 101 according to an embodiment. Figure 2 This is a rear perspective view of an electronic device 101 according to an embodiment.

[0037] Figure 1 The electronic device 101 may correspond to the one described later. Figure 12 Electronic device 1201. For example, electronic device 101 may include components constituting... Figure 12 Part or all of the components of the electronic device 1201. (See reference...) Figure 1 and Figure 2 The present disclosure provides examples of speaker devices provided in candybar-type electronic devices, in conjunction with speaker devices according to embodiments of the present disclosure. However, speaker devices can be applied to other electronic devices provided with speaker devices, such as slidable, rollable, and foldable types, and are not limited thereto.

[0038] Reference Figure 1 and Figure 2 The electronic device 101 according to an embodiment may include a housing 110, the housing 110 including a first surface 110A (or front surface), a second surface 110B (or rear surface), and a side surface 110C (or sidewall), the side surface 110C being configured to surround the space between the first surface 110A and the second surface 110B. In another embodiment, the housing 110 may be referred to as a structure configured to form part of the first surface 110A, the second surface 110B, and the side surface 110C.

[0039] According to one embodiment, the first surface 110A may be formed of a front panel 121 (e.g., a glass or polymer panel including various coatings), at least a portion of which is substantially transparent. In one embodiment, the front panel 121, at least its side edge portions, may include curved portions configured to curve from the first surface 110A toward the rear panel 111 and extend seamlessly therefrom.

[0040] In one embodiment, the second surface 110B may be formed of a substantially opaque back plate 111. In one embodiment, the back plate 111 may be formed of a coating or a combination of at least two of the following materials: colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium). In one embodiment, the back plate 111, at least its side edge portions, may include curved portions configured to curve from the second surface 110B to the front plate 121 and extend seamlessly therefrom.

[0041] In one embodiment, the side surface 110C may be formed by a side member (e.g., a side frame structure or sidewall) coupled to the front panel 121 and the rear panel 111 and comprising metal and / or polymer. In one embodiment, the side surface 110C may include the right side of the electronic device 101 (e.g., Figure 1 (in the +x direction) and along the first direction (e.g., Figure 1 A first side surface 1111 extending in the +y direction, a second side surface 1112 extending parallel to the first side surface 1111 and along the first direction, and a second side surface 1112 extending along a second direction perpendicular to the first direction (e.g., along the +y direction). Figure 1 (in the +x direction) extends and connects to one end of the first side surface 1111 (e.g., Figure 1 One end in the +y direction) and one end of the second side surface 1112 (e.g., Figure 1 The third side surface 1113 of the +y direction end, and / or the other end parallel to the third side surface 1113 and connected to the first side surface 1111 (e.g., Figure 1 One end in the -y direction) and the other end of the second side surface 1112 (e.g., Figure 1 The fourth side surface 1114 of the end in the -y direction.

[0042] According to one embodiment, electronic device 101 may include at least one of a display 120, a first optical sensor 103 (e.g., a sensor module and / or a camera module), a connector port 104, or an audio module 105. In one embodiment, at least one element may be omitted from electronic device 101, or other elements may be additionally included therein. For example, electronic device 101 may further include a sensor module (not shown). Key input device 107 may be omitted from electronic device 101.

[0043] In one embodiment, sensors such as proximity sensors, illuminance sensors, image sensors, or iris sensors may be integrated into the display 120 or located adjacent to the display 120 within an area provided by the front panel 121.

[0044] In one embodiment, the display 120 is visually exposed through a large portion of the front panel 121. In one embodiment, the display 120 may be coupled to touch detection circuitry, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting magnetic field types of styluses, or may be disposed adjacent to them. In one embodiment, the corners of the display 120 may be formed to have a shape substantially the same as the peripheral shape (e.g., curved surface) of the adjacent front panel 121.

[0045] In one embodiment, connector hole 104 can accommodate a connector for external electronic devices (e.g., Figure 12 The electronic device 101 (1202 and 1204) includes connectors for transmitting power and / or data to or receiving power and / or data from external electronic devices, and / or connectors for transmitting or receiving audio signals to or from external electronic devices. For example, connector hole 104 may include a Universal Serial Bus (USB) connector or a headphone jack (not shown) (or "headphone interface"). In one embodiment, the USB connector and headphone jack may be implemented as a single hole, and in another embodiment, without a separate connector hole, electronic device 101 may be configured to transmit and / or receive power and / or data to or from external electronic devices, or to transmit or receive audio signals.

[0046] In one embodiment, the audio module 105 may include a microphone hole and a speaker hole. A microphone for acquiring external sound may be disposed within the microphone hole, and multiple microphones may be arranged therein to detect the direction of sound. In another embodiment, the speaker hole and microphone hole may be implemented as a single hole, or, in the absence of a speaker hole, a speaker (e.g., a piezoelectric speaker) may be included. The speaker hole may include an external speaker hole for communication and a receiver hole.

[0047] In one embodiment, the key input device 107 may be disposed on the side surface 110C of the housing 110. In one embodiment, the electronic device 101 may not include part or all of the aforementioned key input device 107, and the excluded key input device 107 may be implemented in other types, such as soft keys on the display 120. In one embodiment, the key input device 107 may include at least a portion of a fingerprint sensor disposed on the second surface 110B of the housing 110.

[0048] In one embodiment, the second optical sensor 130 and the third optical sensor 106 may be disposed on the second surface 110B of the electronic device 101. The second optical sensor 130 may include multiple cameras. In one embodiment, the third optical sensor 106 may include a flash. In one embodiment, the first optical sensor 103, the second optical sensor 130, and the third optical sensor 106 may include one or more lenses, an image sensor, and / or an image processor. The third optical sensor 106 may include a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (e.g., infrared cameras, wide-angle lenses, and / or telephoto lenses) and image sensors may be disposed on one surface of the electronic device 101.

[0049] In one embodiment, the electronic device 101 may include a sensor module (not shown) that can generate electronic signals or data values ​​corresponding to its internal operating state or external environmental state. The electronic device 101 may further include a sensor module (not shown), such as at least one of a gesture sensor, gyroscope sensor, barometric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, temperature sensor, or humidity sensor.

[0050] Figure 3 This is a projection diagram showing the arrangement of internal components of an electronic device 101 according to an embodiment.

[0051] At least one component of electronic device 101 can be connected to Figure 1 or Figure 2 The electronic device 101 has at least one element that is the same or similar to the other, and repeated descriptions will be omitted below.

[0052] Reference Figure 3 In one embodiment, the first optical sensor 103, the second optical sensor 130, the circuit board 210, the motor 220, and the speaker module 300 can be arranged in the internal space of the electronic device 101.

[0053] In one embodiment, circuit board 210 may be disposed within at least a portion of housing 110. Circuit board 210 may include a processor (e.g., a processor required for the operation of electronic device 101) Figure 12 The processor 1220), memory (e.g., Figure 12 Memory 1230), communication circuit (e.g., Figure 12 The communication module 1290), power management module (e.g., Figure 12 The power management module 1288) and / or interface (e.g., Figure 12 Interface 1277).

[0054] In one embodiment, circuit board 210 may include at least one of a printed board assembly (PBA), a printed circuit board (PCB), or a flexible printed circuit board (FPCB).

[0055] In one embodiment, circuit board 210 may be electrically connected to speaker module 300 and may be provided for use with a speaker (e.g., described later). Figure 4 The speaker unit 301 outputs audio data or voice / sound signals.

[0056] In one embodiment, the speaker module 300 can convert electrical signals into sound signals and output sound through an output portion (e.g., a diaphragm).

[0057] Figure 4 An example of an embodiment is shown along Figure 3 A partial sectional view taken by line A-A'.

[0058] Reference Figure 4 The z-axis can represent the thickness direction of the electronic device 101. In one embodiment, the z-axis may include a first direction (e.g., the +z direction) and a second direction (e.g., the -z direction).

[0059] Reference Figure 4 The electronic device 101 may include a rear panel 111, a side frame structure 131, a support member 132, a display 120, or a speaker module 300. In one embodiment, at least a portion of the speaker module 300 may be disposed between the support member 132 and the rear panel 111. In one embodiment, the speaker module 300 may be referred to as a speaker module structure or a speaker assembly.

[0060] In one embodiment, the side bezel structure 131 may be formed to at least partially surround the front surface of the electronic device 101 (e.g., Figure 1 The first surface 110A) and the rear surface (e.g., Figure 2 The space between the second surface 110B. In one embodiment, the side frame structure 131 may form the side surface of the electronic device 101 (e.g., Figure 1 At least a portion of the side surface 110C. In one embodiment, the side frame structure 131 may include metal and / or polymer and may have a frame configured to substantially form the side surface of the electronic device 101. In one embodiment, when the side frame structure 131 includes a metallic material, a portion of its metallic material portion may be insulated from other portions and may be used as an antenna for transmitting or receiving wireless signals.

[0061] In one embodiment, the support member 132 may be disposed within the internal space of the electronic device 101. For example, the support member 132 may be disposed in the area or space surrounded by the side bezel structure 131. In one embodiment, the support member 132 may be formed in a flat plate shape, with one surface positioned substantially facing the inner surface of the display 120.

[0062] In one embodiment, although the side frame structure 131 and the support member 132 are described separately, the support member 132 may be integrally formed with the side frame structure 131. For example, multiple metal material portions and synthetic resin material portions may be combined by processes such as die casting, inlay injection, or lathe machining, so that the side frame structure 131 and the support member 132 may be integrally formed with each other. In one embodiment, a portion of the metal portion of the side frame structure 131 or the support member 132 may be used as an antenna. In another embodiment, the support member 132 may be manufactured separately from the side frame structure 131 and may be assembled and mounted to the inside of the side frame structure 131.

[0063] In one embodiment, the support member 132 may include an opening 132a. In one embodiment, the opening 132a may be formed to extend from one surface of the support member 132 (e.g., a surface facing the inner surface of the display 120) to another surface of the support member 132 (e.g., a surface facing in the opposite direction to one surface of the support member 132). In one embodiment, the support member 132 may include a flange 132b configured to extend from the other surface of the support member 132. In one embodiment, sound output from the speaker unit 301 can be output to the outside through the opening 132a.

[0064] In one embodiment, the loudspeaker module 300 may include a structure 310, a loudspeaker unit 301, a protective member 302, and a resonant space RS. In one embodiment, at least a portion of the resonant space RS may be filled with an absorbent material.

[0065] In one embodiment, structure 310 may include a first structure 311 and a second structure 312. Structure 310 may be referred to as carrier 310 or shell 310.

[0066] Reference Figure 4 The speaker module 300 may be a separate structure including speaker unit 301 and structure 310, and may be provided in a structure configured to block the rear sound of speaker unit 301 by means of first structure 311 and second structure 312.

[0067] Reference Figure 4The protective member 302, the speaker unit 301, the first structure 311 and the second structure 312 can be arranged sequentially from the support member 132 of the electronic device 101 in the first direction (e.g., the +z direction).

[0068] In one embodiment, the second structure 312 may be formed in a flat plate shape and positioned facing the inner surface of the rear plate 111. The first structure 311 may have a flat plate shape and may be configured to face at least a portion of the second structure 312 for connection thereto. In one embodiment, the first structure 311 may include a first groove formed along a first direction (e.g., the +z direction). In another embodiment, the second structure 312 may include a second groove formed in a second direction (e.g., the -z direction). In one embodiment, when the first structure 311 and the second structure 312 are connected, the resonant space RS may be formed by the first groove and / or the second groove.

[0069] In one embodiment, the resonant space RS may have an adsorbed material injected therein. This will be described later. Figures 5a to 10 Describe in detail the resonant space RS into which the adsorbent material is injected.

[0070] In one embodiment, the first structure 311 may include a rib structure formed along a second direction (e.g., the -z direction) to allow the speaker unit 301 to be stably mounted thereon.

[0071] In one embodiment, the first structure 311 may include an opening 311a such that a surface of the disposed speaker unit 301 corresponds to the resonant space RS. In one embodiment, the opening 311a may be formed to extend from one surface of the first structure 311 (e.g., the surface facing the second structure 312) to another surface of the first structure 311 (e.g., a surface facing in the opposite direction to one surface of the first structure 311). In one embodiment, ribs of the first structure 311 may be formed in regions adjacent to one side and the other side of the opening 311a. In one embodiment, the speaker unit 301 may be stably disposed on the ribs, and a surface of the speaker unit 301 may form the resonant space RS together with the first structure 311 and the second structure 312.

[0072] In one embodiment, the loudspeaker unit 301 may be provided in a substantially hexahedral shape. In one embodiment, the loudspeaker unit 301 may include a magnetic circuit comprising a yoke and magnets, a voice coil located in an air gap in the magnetic circuit, side diaphragms and a central diaphragm vibrating from the voice coil, a suspension configured to guide the movement of the voice coil and diaphragms, and components such as terminal pads configured to receive electrical signals from the outside in order to transmit the electrical signals to the voice coil via the suspension. However, the configuration or shape of the loudspeaker unit 301 may not be limited to this.

[0073] In one embodiment, the protective member 302 may be attached and / or coupled to another surface of the speaker unit 301 (e.g., a surface opposite to one surface of the speaker unit 301 forming the resonant space RS). In one embodiment, the protective member 302 may be configured to allow sound from the speaker unit 301 to pass through. In one embodiment, the protective member 302 may be a cover for external protection of the speaker unit 301. In one embodiment, the protective member 302 may be a member made of an elastic material having a structure configured to prevent foreign objects from being introduced into the electronic device 101 on which the speaker module 300 is mounted. For example, the protective member 302 may include at least one of liquid-injected silicone rubber (LSR), silicone, or rubber. The protective member 302 is not limited to these and may include rigid materials or stainless steel (STS).

[0074] In one embodiment, the display 120 may be disposed on one surface of the support member 132 to output an image to the front of the electronic device 101.

[0075] Figure 5a A first state 300a and a second state 300b of a speaker module 300 according to an embodiment are shown.

[0076] Reference Figure 5a The first state 300a of the speaker module 300 can be a state in which the first structure 311 and the second structure 312 are separated from each other. The second state 300b of the speaker module 300 can be a state in which the first structure 311 and the second structure 312 are connected to each other.

[0077] In one embodiment, the first structure 311 may have a first size, and the second structure 312 may have a second size larger than the first size, but its size is not limited thereto. In one embodiment, the second structure 312 may include a first region corresponding to the first structure 311 and a second region other than the first region.

[0078] In one embodiment, the first structure 311 and the second structure 312 may be connected to each other. In one embodiment, each of the first structure 311 and the second structure 312 may include a protrusion, a recess, and / or a groove. For example, the second structure 312 may include at least one protrusion in the direction facing the first structure 311. The first structure 311 may include at least one groove for receiving the at least one protrusion of the second structure 312.

[0079] In one embodiment, the first structure 311 and the second structure 312 can be fixed by at least one of ultrasonic welding, double-sided tape, and adhesive processes.

[0080] In one embodiment, the resonant space may be formed in the second state 300b of the speaker module 300 by a groove formed on the first structure 311 or the second structure 312.

[0081] Reference Figure 5a The speaker module 300 may include an opening 500 for adsorbing material (e.g., described later). Figure 8 The adsorbent material 803 is injected into the resonant space RS formed by the connection between a surface of the first structure 311, a surface of the second structure 312 and a surface of the speaker unit 301.

[0082] Figure 5b A speaker module 300-1 according to one embodiment is shown.

[0083] Figure 5b The speaker module 300-1 relative to Figure 5a The speaker module 300 may have some structural differences, but other components and functions can be applied in the same way.

[0084] Reference Figure 5b In one embodiment, the speaker module 300-1 may include a first structure 311-1, a second structure 312-1, a speaker unit 301-1, and a protective member 305.

[0085] In one embodiment, when the first structure 311-1 and the second structure 312-1 are connected, the speaker unit 301-1 may have a resonant space RS formed by a groove formed on the first structure 311-1 or the second structure 312-1. In one embodiment, the speaker unit 301-1 may be disposed in the resonant space RS. In one embodiment, the speaker unit 301-1 may be disposed in at least one region of the resonant space RS.

[0086] In one embodiment, the first structure 311-1 may include an opening 311-1a to allow the loudspeaker unit 301-1 to be disposed in at least one region of the resonant space RS. In one embodiment, at least a portion of the loudspeaker unit 301-1 may be disposed in the region corresponding to the opening 311-1a of the first structure 311-1. In one embodiment, the opening 311-1a may be formed to extend from one surface of the first structure 311-1 (e.g., the surface facing the second structure 312-1) to another surface of the first structure 311-1 (e.g., the surface opposite to one surface of the first structure 311-1).

[0087] Figure 6a An embodiment is shown. Figure 5a The speaker module 300 is shown in a cross-sectional view taken along line B-B' in the second state 300b.

[0088] Reference Figure 6a In one embodiment, the speaker module 300 may include a sound-absorbing sheet 303 and an opening 500.

[0089] In one embodiment, the resonant space RS can be formed in the second state 300b of the speaker module 300 by at least one groove formed on the first structure 311 and / or the second structure 312. In one embodiment, an adsorbent material can be injected into the resonant space RS. In one embodiment, the adsorbent material can be a porous material for venting, condensing, or adsorbing a portion of the air within the resonant space RS. For example, the adsorbent material can be configured by mixing a binder with at least one of granular activated carbon (of various sizes and belonging to the activated carbon family), powdered activated carbon, or ARCP. As another example, the adsorbent material can be configured by mixing a binder with Cu, Po1, Zr1, Zr2, or Al particles having a metal-organic framework structure. Yet another example, the adsorbent material can be configured by mixing a binder with at least one of elements from the diatomaceous earth family, perlite or silica family, or zeolite family.

[0090] In one embodiment, the speaker module 300 may include an opening 500 for injecting absorbent material therein. In one embodiment, the opening 500 may be defined as a closed loop formed by the connection between the first structure 311 and the second structure 312. In one embodiment, the area of ​​the opening 500 may be determined taking into account the size of the absorbent material. For example, the area of ​​the opening 500 may be 1.15 mm. 2 Or larger. In one embodiment, reference will be made to... Figure 7 The closed-loop shape of the opening 500, which includes a portion of the first structure 311 and a portion of the second structure 312, is described in detail.

[0091] In one embodiment, the opening 500 may be a through-hole configured to connect the resonant space RS in a space outside the resonant space RS. In one embodiment, adsorbent material can be injected through the opening 500 disposed on the left side surface (e.g., in the -x direction) of the speaker module 300. In one embodiment, the adsorbent material injected through the opening 500 can be injected into the resonant space RS formed by a surface of the speaker unit 301, which is stably positioned in the region corresponding to the opening 311a of the first structure 311.

[0092] In one embodiment, due to the adsorption material 803 (e.g., disposed in the resonant space RS) Figure 8The repeated movement of the adsorbent material 803 may cause allophones. In one embodiment, allophones may occur due to friction between the first structure 311, the second structure 312 and / or at least one region of the loudspeaker unit 301 forming the resonant space RS and the adsorbent material 803.

[0093] In one embodiment, the sound-absorbing sheet 303 may be attached to at least one surface of the first structure 311 and the second structure 312 forming the resonant space RS. In one embodiment, the sound-absorbing sheet 303 may be attached to at least one surface of the first structure 311 and / or the second structure 312 in the resonant space RS, thereby becoming substantially horizontal with respect to the direction of injection of the absorbent material (e.g., the +x direction). In one embodiment, the sound-absorbing sheet 303 may comprise PORON or sponge.

[0094] In one embodiment, the sound-absorbing sheet 303 can prevent tone variants caused by the adsorbent material. In one embodiment, the sound-absorbing sheet 303 can be arranged in a direction substantially horizontal to the direction of injection of the adsorbent material to minimize the effect on the movement of the adsorbent material, so that the adsorbent material can smoothly fill the resonant space RS.

[0095] In one embodiment, the sound-absorbing sheet 303 may be configured to form part of the resonant space RS. That is, the sound-absorbing sheet 303 may be attached to at least one region of the first structure 311 or the second structure 312 forming the resonant space RS.

[0096] Figure 6b An illustration shows the path along according to another embodiment. Figure 5b A cross-sectional view taken along line C-C' of speaker module 300-1.

[0097] Figure 6b The connection state of the first structure 311-1 and the second structure 312-1 is shown.

[0098] In one embodiment, the first structure 311-1 may include a first direction (e.g., Figure 6b The rib structure (in the +z direction) is formed to allow the speaker unit 301-1 to be stably mounted on it.

[0099] In one embodiment, the protective member 305 may be disposed on the upper surface of the speaker unit 301-1 (e.g., Figure 6b (in the +z direction). In one embodiment, the protective member 305 may include a material such as sponge or cotton.

[0100] Reference Figure 6bThe speaker module 300-1 may include an opening 500-1 for injecting absorbent material into a resonant space RS formed by the connection between the first structure 311-1 and the second structure 312-1. In one embodiment, the opening 500-1 may be defined as a closed loop formed by the connection between the first structure 311-1 and the second structure 312-1. In one embodiment, to protect the speaker module 300-1, a support member 132-1 may be coupled to the first structure 311-1 or may be integrally formed with the first structure 311-1. In one embodiment, the support member 132-1 may be formed in a flat plate shape, allowing one surface of the support member 132-1 to substantially face the display (e.g., ...). Figure 1 The inner surface of the display (120).

[0101] Figure 7 An opening 500 formed through a speaker module 300 according to one embodiment is shown.

[0102] Reference Figure 7 The first structure 311 and / or the second structure 312 may include at least one groove for forming a resonant space RS, and in the second state 300b of the speaker module 300, one end of the groove formed on the first structure 311 and / or the second structure 312 may include an opening 500 formed as a closed loop.

[0103] In one embodiment, the opening 500 forming a closed loop may include a portion of a first structure 311 and a portion of a second structure 312. In one embodiment, the shape of the opening 500 may be determined by a connection structure between the first structure 311 and the second structure 312, an open loop of the first structure 311 configured to form the opening 500, and / or an open loop of the second structure 312 configured to form the opening 500. In one embodiment, the opening 500 may be formed by a connection between an open loop of the first structure 311 corresponding to the upper portion of the opening 500 and an open loop of the second structure 312 corresponding to the lower portion of the opening 500. The open loop of the first structure 311 may be the shape of a first portion 701. The open loop of the second structure 312 may be the shape of a second portion 702. For example, the open loop of the first structure 311 corresponds to a lower portion with the quadrilateral removed. The shape, and the open loop of the second structure 312 corresponds to the removal of the upper part of the quadrilateral. In terms of shape, the speaker module 300 may include an opening 500 that is formed as a closed loop with a generally rectangular shape through the connection between the first structure 311 and the second structure 312. In one embodiment, the shape of the opening 500 formed as a closed loop is not limited to this. For example, the opening 500 may be circular, trapezoidal, triangular, or a polygon such as a rhombus.

[0104] Figure 8A first sealing member 800 attached to a region of a speaker module according to one embodiment is shown.

[0105] In one embodiment, the first sealing member 800 may be disposed along the peripheral portion of the opening 500 formed by the connection between the first structure 311 and the second structure 312 to close the resonant space RS. In one embodiment, the first sealing member 800 may be attached or secured to the area corresponding to the opening 500 of the speaker module 300 by means of an adhesive member (e.g., double-sided tape). In one embodiment, the adhesive member may include a closed loop formed along the periphery of the opening 500.

[0106] In one embodiment, the first sealing member 800 may be configured to prevent the adsorbent material injected into the resonant space RS from leaking into areas outside the resonant space RS, or to prevent foreign matter from being introduced from areas outside the resonant space RS.

[0107] In one embodiment, the first sealing member 800 may be made of an elastic material. For example, the first sealing member 800 may include rubber.

[0108] Figure 8 Part (a) is a cross-sectional view taken along line C-C' of the speaker module 300 in the area to which the first sealing member 800 is attached. Figure 8 Part (b) is a cross-sectional view taken along line D-D' of the speaker module 300 in the area where the first sealing member 800 is not attached.

[0109] In one embodiment, the first structure 311 and the second structure 312 can be joined by assembling and / or mounting the first structure 311 to a surface of the second structure 312, and the connection between the first structure 311 and the second structure 312 can be fixed by a process such as ultrasonic welding.

[0110] Reference Figure 8In part (a), the adsorbent material 803 can be injected into the resonant space RS formed by the connection between the first structure 311 and the second structure 312. In one embodiment, the resonant space RS may include the remaining space 801 after the adsorbent material 803 has been injected. In one embodiment, space compensation material (not shown) may be injected into the remaining space 801 after the adsorbent material 803 has been injected. In one embodiment, the space compensation material may include a movement-preventing material for the adsorbent material 803, which is provided to reduce phoneme variants caused by movement of the adsorbent material 803. The movement-preventing material for the adsorbent material 803 may include a sponge or cotton. In another embodiment, the space compensation material may be a material with a different particle size than and the same as the adsorbent material 803, or it may be an air adsorbent material with a different material than the adsorbent material 803.

[0111] Reference Figure 8 In part (b), when the first structure 311 and the second structure 312 are connected and / or fixed, due to errors caused by the manufacturing or assembly processes of the first structure 311 and / or the second structure 312, gaps or steps may appear in the area 802 where the first structure 311 and the second structure 312 are in contact with each other.

[0112] In one embodiment, if a gap or step appears in the region 802 where the first structure 311 and the second structure 312 are in contact with each other, then in order to connect and / or fix the first structure 311 and the second structure 312, the joint or weld between the first structure 311 and the second structure 312 may overflow through the gap or step.

[0113] In one embodiment, a second sealing member (e.g., described later) is used to compensate for the gap or step created by the connection between the first structure 311 and the second structure 312. Figure 9 The second sealing member 900 can be provided in the speaker module 300.

[0114] Figure 9 A second sealing member 900 attached to a speaker module 300 according to one embodiment is shown.

[0115] Reference Figure 9 In order to compensate for the gap or step caused by the connection between the first structure 311 and the second structure 312, the second sealing member 900 may be provided in at least one region of the speaker module 300.

[0116] In one embodiment, to seal the resonant space RS, a second sealing member 900 may be disposed in the region surrounding the first sealing member 800, which is attached or fixed to the region corresponding to the opening 500. In one embodiment, the second sealing member 900 can prevent adsorbent material or space-compensating material disposed in the resonant space RS from leaking through the gap or step between the first sealing member 800 and the opening 500.

[0117] In one embodiment, the second sealing member 900 may include a eutectic adhesive and / or a polymeric adhesive.

[0118] Figure 10 An opening formed through the speaker module 400 according to another embodiment is shown.

[0119] Reference Figure 10 The speaker module 400 can differ from others in terms of the opening that forms a closed loop. Figure 7 The speaker module 300, and other components can be applied to it in the same way.

[0120] In one embodiment, the speaker module 400 may include a first structure 411, a second structure 412, and an opening 501.

[0121] Reference Figure 10 The first state 400a of the speaker module 400 can be a state in which the first structure 411 and the second structure 412 are separated. The second state 400b of the speaker module 400 can be a state in which the first structure 411 and the second structure 412 are connected.

[0122] In one embodiment, the speaker module 400 may include an opening 501 that forms a closed loop for injecting adsorbent material through a connection between a first structure 411 and a second structure 412. In one embodiment, the opening 501 may include a portion of the first structure 411 and a portion of the second structure 412. In one embodiment, the opening 501 may be formed by a connection between an open loop of the first structure 411 corresponding to the upper portion of the opening 501 and an open loop of the second structure 412 corresponding to the lower portion of the opening 501. The open loop of the first structure 411 may be in the shape of a first portion 1001. The open loop of the second structure 412 may be in the shape of a second portion 1002. For example, the open loop of the first structure 411 may have a shape resembling the letter "T". In the case that the open loop of the second structure 412 has a horizontally placed strip-shaped "—" shape, the speaker module 400 may include an opening 501 defined as a closed loop, the closed loop having a shape resembling the letter "T". shape.

[0123] Figure 11The region 1101 to which the first sealing member 800a is attached, and the region 1102 to which the second sealing member 900a is attached, are shown according to another embodiment.

[0124] In one embodiment, the speaker module 400 may include a first sealing member 800a and a second sealing member 900a.

[0125] Reference Figure 11 The first sealing member 800a may be disposed along the periphery of the opening 501 formed by the connection between the first structure 411 and the second structure 412. In one embodiment, the first sealing member 800a may be attached or secured to the area corresponding to the opening 501 by means of an adhesive member (e.g., double-sided tape). In one embodiment, the adhesive member may be attached to the area 1101 formed along the periphery of the first structure 411, thereby enabling the first sealing member 800a to be attached to the area corresponding to the opening 501.

[0126] In one embodiment, the first sealing member 800a may be formed in a shape corresponding to the opening 501. For example, if the opening 501 is in the shape of the letter "T", then the first sealing member 800a may be in the shape of "T" to correspond to the shape of the opening 501.

[0127] In one embodiment, when the first structure 411 and the second structure 412 are connected and / or fixed, a gap or step may appear in the portion where the first structure 411 and the second structure 412 contact each other. In one embodiment, the speaker module 400 may have a second sealing member 900a disposed in the speaker module 400 to compensate for the gap or step created by the connection between the first structure 411 and the second structure 412. In one embodiment, the second sealing member 900a may be disposed in the region 1102 where the first structure 411 and the second structure 412 contact each other.

[0128] Figure 12 This is a block diagram illustrating an electronic device 1201 in a network environment 1200 according to various embodiments. (Refer to...) Figure 12In network environment 1200, electronic device 1201 can communicate with electronic device 1202 via a first network 1298 (e.g., a short-range wireless communication network), or with at least one of electronic device 1204 or server 1208 via a second network 1299 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 1201 can communicate with electronic device 1204 via server 1208. According to an embodiment, electronic device 1201 may include a processor 1220, a memory 1230, an input module 1250, a sound output module 1255, a display module 1260, an audio module 1270, a sensor module 1276, an interface 1277, a connection terminal 1278, a haptic module 1279, a camera module 1280, a power management module 1288, a battery 1289, a communication module 1290, a subscriber identification module (SIM) 1296, or an antenna module 1297. In some embodiments, at least one of the aforementioned components (e.g., connection terminal 1278) may be omitted from electronic device 1201, or one or more other components may be added to electronic device 1201. In some embodiments, some of the aforementioned components (e.g., sensor module 1276, camera module 1280, or antenna module 1297) may be implemented as a single integrated component (e.g., display module 1260).

[0129] Processor 1220 may run software (e.g., program 1240) to control at least one other component (e.g., hardware or software component) of electronic device 1201 connected to processor 1220, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 1220 may store commands or data received from another component (e.g., sensor module 1276 or communication module 1290) in volatile memory 1232, process the commands or data stored in volatile memory 1232, and store the result data in non-volatile memory 1234. According to embodiments, processor 1220 may include a main processor 1221 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 1223 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 1221. For example, when electronic device 1201 includes a main processor 1221 and an auxiliary processor 1223, the auxiliary processor 1223 may be adapted to consume less power than the main processor 1221, or adapted to be dedicated to a specific function. The auxiliary processor 1223 may be implemented separately from the main processor 1221, or may be implemented as part of the main processor 1221.

[0130] When the main processor 1221 is inactive (e.g., in sleep) state, the auxiliary processor 1223 (rather than the main processor 1221) can control at least some of the functions or states associated with at least one component of the electronic device 1201 (e.g., display module 1260, sensor module 1276, or communication module 1290), or when the main processor 1221 is active (e.g., running an application), the auxiliary processor 1223 can work with the main processor 1221 to control at least some of the functions or states associated with at least one component of the electronic device 1201 (e.g., display module 1260, sensor module 1276, or communication module 1290). According to embodiments, the auxiliary processor 1223 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 1280 or communication module 1290) functionally associated with the auxiliary processor 1223. According to embodiments, the auxiliary processor 1223 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 1201 where the artificial intelligence is executed, or via a separate server (e.g., server 1208). Learning algorithms may include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural networks may be deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), or deep Q-networks, or combinations of two or more thereof, but are not limited to these. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0131] The memory 1230 may store various data used by at least one component of the electronic device 1201 (e.g., processor 1220 or sensor module 1276). The various data may include, for example, software (e.g., program 1240) and input or output data for commands associated with it. The memory 1230 may include volatile memory 1232 or non-volatile memory 1234.

[0132] The program 1240 may be stored as software in the memory 1230, and the program 1240 may include, for example, an operating system (OS) 1242, middleware 1244, or application 1246.

[0133] The input module 1250 can receive commands or data from outside the electronic device 1201 (e.g., a user) that will be used by other components of the electronic device 1201 (e.g., the processor 1220). The input module 1250 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus).

[0134] The sound output module 1255 can output sound signals to the outside of the electronic device 1201. The sound output module 1255 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0135] Display module 1260 can visually provide information to the outside of electronic device 1201 (e.g., to a user). Display device 1260 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 1260 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0136] The audio module 1270 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 1270 can obtain sound via the input module 1250, or output sound via the sound output module 1255 or headphones of an external electronic device (e.g., electronic device 1202) that is directly (e.g., wired) or wirelessly connected to the electronic device 1201.

[0137] Sensor module 1276 can detect the operating state of electronic device 1201 (e.g., power or temperature) or the environmental state outside electronic device 1201 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 1276 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0138] Interface 1277 may support one or more specific protocols used to enable electronic device 1201 to connect directly (e.g., wired) or wirelessly to external electronic device (e.g., electronic device 1202). According to embodiments, interface 1277 may include, for example, a High Definition Multimedia Interface (HDMI), a USB interface, a Secure Digital Card (SD) interface, or an audio interface.

[0139] Connection 1278 may include a connector, via which electronic device 1201 may be physically connected to an external electronic device (e.g., electronic device 1202). According to embodiments, connection 1278 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0140] The haptic module 1279 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 1279 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0141] Camera module 1280 can capture still or moving images. According to an embodiment, camera module 1280 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0142] The power management module 1288 manages the power supply to the electronic device 1201. According to an embodiment, the power management module 1288 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0143] Battery 1289 can power at least one component of electronic device 1201. According to an embodiment, battery 1289 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0144] Communication module 1290 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 1201 and external electronic devices (e.g., electronic device 1202, electronic device 1204, or server 1208), and perform communication via the established communication channel. Communication module 1290 may include one or more communication processors capable of operating independently of processor 1220 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 1290 may include wireless communication module 1292 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 1294 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 1298 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 1299 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 1292 can identify and verify the electronic device 1201 in the communication network (such as the first network 1298 or the second network 1299) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1296.

[0145] Wireless communication module 1292 can support 5G networks beyond 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable low-latency communications (URLLC). Wireless communication module 1292 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 1292 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 1292 can support various requirements specified in electronic device 1201, external electronic device (e.g., electronic device 1204), or network system (e.g., second network 1299). According to an embodiment, the wireless communication module 1292 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0146] Antenna module 1297 can transmit or receive signals or power to or from the exterior of electronic device 1201 (e.g., external electronic device). According to an embodiment, antenna module 1297 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 1297 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 1298 or a second network 1299) can be selected from the multiple antennas by, for example, communication module 1290 (e.g., wireless communication module 1292). Signals or power can then be transmitted or received between communication module 1290 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 1297.

[0147] According to various embodiments, antenna module 1297 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0148] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0149] According to an embodiment, commands or data can be sent or received between electronic device 1201 and external electronic device 1204 via server 1208 connected to the second network 1299. Each of electronic device 1202 or electronic device 1204 can be a device of the same type as electronic device 1201, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 1201 can be performed on one or more of external electronic devices 1202, external electronic devices 1204, or server 1208. For example, if electronic device 1201 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 1201 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 1201 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 1201. Electronic device 1201 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 1201 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 1204 may include an Internet of Things (IoT) device. Server 1208 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, external electronic device 1204 or server 1208 may be included in a second network 1299. Electronic device 1201 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0150] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0151] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0152] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0153] The various embodiments set forth herein can be implemented as software (e.g., program 1240) containing one or more instructions readable by a machine (e.g., electronic device 1201) stored in a storage medium (e.g., internal memory 1236 or external memory 1238). For example, under the control of a processor, the processor (e.g., processor 1220) of the machine (e.g., electronic device 1201) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0154] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0155] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0156] The speaker module structure according to various embodiments may include a first structure (e.g., first structure 311), a second structure (e.g., second structure 312) configured to be coupled to the first structure (e.g., first structure 311), and a speaker (e.g., speaker unit 301) coupled to at least one of the first and second structures, wherein the second structure includes at least one groove configured to form a resonant space (e.g., resonant space RS) by coupling between the first and second structures, wherein the resonant space is connected to the speaker and has an absorbent material (e.g., absorbent material 803) injected therein, and wherein when the first and second structures are coupled, one end of the groove includes an opening (e.g., opening 500) that forms a closed loop including a portion of the first structure and a portion of the second structure.

[0157] In one embodiment, the speaker module structure may further include a first sealing member (e.g., first sealing member 800) configured to close the opening.

[0158] In one embodiment, the speaker module structure may further include a second sealing member (e.g., a second sealing member 900) configured to close a groove formed by the connection between the first structure and the second structure.

[0159] In one embodiment, the second sealing member may include at least one of a eutectic bond or a polymer adhesive.

[0160] In one embodiment, the loudspeaker module structure may further include a sound-absorbing sheet (e.g., sound-absorbing sheet 303) disposed on at least one surface of the first or second structure in the resonant space.

[0161] In one embodiment, the sound-absorbing sheet may include at least one of PORON, rubber, or silicone.

[0162] In one embodiment, this portion of the first structure may include a "T"-shaped open loop.

[0163] In one embodiment, a portion of the second structure may be disposed in the open portion of the open ring to form an opening.

[0164] In one embodiment, the space compensation material can be disposed in the resonant space in the remaining space after the adsorption material is disposed.

[0165] In one embodiment, the space-compensating material may include at least one of zeolite, sponge, cotton, or foam resin.

[0166] In an electronic device including a speaker assembly according to various embodiments, the speaker assembly may include a first carrier (e.g., first structure 311), a second carrier configured to be coupled to the first carrier (e.g., second structure 312), and a speaker (e.g., speaker unit 301) coupled to at least one of the first and second carriers, wherein the second carrier includes at least one groove configured to form a resonant space (e.g., resonant space RS) through a connection between the first and second carriers, wherein the resonant space is connected to the speaker and has an absorbent material (e.g., absorbent material 803) injected therein, and wherein when the first and second carriers are coupled, one end of the groove includes an opening formed as a closed loop (e.g., opening 500), the closed loop including a portion of the first carrier and a portion of the second carrier.

[0167] In one embodiment, in the electronic device, the speaker assembly may further include a first sealing member configured to close the opening.

[0168] In one embodiment, the electronic device may further include a second sealing member configured to close a groove formed by the connection between the first carrier and the second carrier.

[0169] In one embodiment, the second sealing member may include at least one of a eutectic bond or a polymer adhesive.

[0170] In one embodiment, the electronic device may further include a sound-absorbing sheet disposed on at least one surface of a first carrier or a second carrier in a resonant space.

[0171] In one embodiment, the sound-absorbing sheet may include at least one of PORON, rubber, or silicone.

[0172] In one embodiment, a portion of the first carrier may include a "T"-shaped open loop.

[0173] In one embodiment, a portion of the second carrier may be disposed in the open portion of the open ring to form an opening.

[0174] In one embodiment, the space compensation material can be disposed in the resonant space in the remaining space after the adsorption material is disposed.

[0175] In one embodiment, the space-compensating material may include at least one of zeolite, sponge, cotton, or foam resin.

[0176] Although this disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. A loudspeaker module structure, comprising: First structure; The second structure is configured to be connected to the first structure to form a resonant space; A loudspeaker, disposed in the resonant space and connected to at least one of the first structure or the second structure; as well as An opening connects to the resonant space. The first structure and / or the second structure includes at least one groove, the at least one groove being configured to form the resonant space. The adsorbent material is disposed in the resonant space. The opening is configured to inject the adsorbent material into the resonant space, and The opening is formed by the connection between the first structure and the second structure.

2. The speaker module structure according to claim 1, further comprising: A first sealing member configured to close the opening.

3. The speaker module structure according to claim 2, wherein the first sealing member is disposed along the periphery of the opening.

4. The speaker module structure according to claim 2, further comprising: A second sealing member is configured to surround the first sealing member.

5. The speaker module structure according to claim 4, wherein the second sealing member comprises at least one of a eutectic bond or a polymer adhesive.

6. The speaker module structure according to claim 1, further comprising: A sound-absorbing sheet is disposed on at least one surface of the first structure or the second structure in the resonant space.

7. The loudspeaker module structure according to claim 6, wherein the sound-absorbing sheet comprises at least one of rubber or silicone resin.

8. The speaker module structure according to claim 1, wherein, The portion of the first structure that forms the opening includes a "T" shape.

9. The speaker module structure according to claim 1, The first structure forms the first surface of the speaker module structure. The second structure forms a second surface of the speaker module structure opposite to the first surface, and The opening is formed on a side surface of the speaker module structure perpendicular to at least one of the first surface or the second surface, such that the absorbent material is injected from the side surface of the speaker module structure into the resonant space through the opening while the first structure and the second structure are connected to each other.

10. The loudspeaker module structure of claim 1, wherein the remaining space after the adsorbent material has been injected comprises a space compensation material, the space compensation material comprising a movement prevention material for the adsorbent material, the movement prevention material being provided to reduce tonometry caused by movement of the adsorbent material.

11. The speaker module structure according to claim 10, wherein the movement prevention material comprises at least one of the following: zeolite, sponge, cotton, a material having a different particle size from the adsorbent material and the same as the adsorbent material, or an air adsorbent material having a different material from the adsorbent material.

12. The speaker module structure according to claim 1, wherein the first structure includes a first portion corresponding to the upper part of the opening. The second structure includes a second portion corresponding to the lower part of the opening, and The opening is formed by connecting the first part and the second part.

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