Vacuum apparatus for simulating the exposure environment of an extreme ultraviolet lithography machine

Abstract

The application relates to the field of extreme ultraviolet lithography technology, in particular to a vacuum device for simulating an exposure environment of an extreme ultraviolet lithography machine. The vacuum device is used for basic scientific research on improving reflectivity stability by simulating an extreme ultraviolet exposure environment. The vacuum device for simulating an exposure environment of an extreme ultraviolet lithography machine comprises a vacuum cavity, a stage, a hollow plate structure, a bottom connecting piece, a heating device, a temperature detection device and a control device. The hollow plate structure is fixed in the vacuum cavity through the bottom connecting piece, and the stage is used for placing a to-be-tested structure. The heating device is arranged in the hollow cavity of the hollow plate structure and is used for heating the to-be-tested structure. The temperature detection device is arranged on the stage and is used for detecting the heating temperature of the to-be-tested structure. The control device is electrically connected with the heating device and the temperature detection device, is used for controlling the opening, closing and heating temperature of the heating device, acquiring the temperature detected by the temperature detection device and outputting the temperature detected by the temperature detection device.

Description

Technical Field

[0001] This application relates to the field of extreme ultraviolet lithography technology, and in particular to a vacuum device that simulates the exposure environment of an extreme ultraviolet lithography machine. Background Technology

[0002] With the continuous development of integrated circuit technology, the feature size of transistors is getting smaller and smaller. The most advanced lithography machine that has emerged is the extreme ultraviolet (EUV) lithography machine. The EUV lithography machine uses a 13.5nm EUV light source for exposure. The wavelength of this EUV light is close to that of X-rays and is easily absorbed by matter, or even by air. Therefore, the transmission optical path system made of glass lenses cannot be used, and a completely new reflective EUV exposure system needs to be developed.

[0003] Currently, reflective extreme ultraviolet (EUV) exposure systems suffer from reflectivity stability issues due to high-energy EUV photon radiation and contaminants in the exposure environment. Therefore, fundamental scientific research on how to simulate the EUV exposure environment to improve the reflectivity stability of optical components is an urgent problem to be solved. Summary of the Invention

[0004] Based on this, this application provides a vacuum device that simulates the exposure environment of an extreme ultraviolet lithography machine, so as to conduct basic scientific research on improving reflectivity stability by simulating the extreme ultraviolet exposure environment.

[0005] Firstly, a vacuum device is provided to simulate the exposure environment of an extreme ultraviolet lithography machine, comprising:

[0006] Vacuum cavity;

[0007] The stage is a hollow plate-shaped structure; the hollow plate-shaped structure is fixed in the vacuum chamber by a bottom connector. The stage is used to place the structural component to be tested. The material of the hollow plate-shaped structure includes: thermally conductive material.

[0008] The heating device is installed inside the hollow cavity of the hollow plate-shaped structure and is used to heat the structural component to be tested.

[0009] A temperature detection device is installed on the stage and is used to detect the heating temperature of the structural component under test.

[0010] A control device is located outside the vacuum chamber and is electrically connected to the heating device and the temperature detection device. It is used to control the opening and closing of the heating device and the heating temperature, as well as to acquire the temperature detected by the temperature detection device and output the temperature detected by the temperature detection device.

[0011] Optionally, the vacuum equipment also includes: a hollow annular component and a gas supply device, wherein the hollow annular component is used to surround the structure to be tested, and the hollow cavity of the hollow annular component is provided with a gas inlet communicating with the gas supply device, and a gas outlet for purging gas for the structure to be tested.

[0012] A valve is installed at the gas outlet of the gas supply device, and a control device is electrically connected to the valve to control the gas supply device to output gas or stop outputting gas.

[0013] And / or,

[0014] The vacuum equipment also includes a condensation device, which is located inside the hollow cavity of the hollow plate-like structure and is used to condense the structural component to be tested.

[0015] Optionally, the vacuum equipment also includes: a lifting device, a heat shield and a first vacuum gauge disposed in the vacuum chamber, and the control device is also electrically connected to the lifting device and the first vacuum gauge;

[0016] The first vacuum gauge is located at the gas outlet of the hollow annular component, and the control device is used to acquire the first vacuum degree detected by the first vacuum gauge and output the first vacuum degree.

[0017] The lifting device is connected to the heat shield. The lifting device is used to drive the heat shield to rise or fall under the control of the control device, so as to control the heat shield to expose the structure to be tested and the hollow annular component in the vacuum chamber, or to control the heat shield to cover the structure to be tested and the hollow annular component.

[0018] And / or,

[0019] A second vacuum gauge is also installed on the housing of the vacuum chamber. The second vacuum gauge is electrically connected to the control device. The control device is used to acquire the second vacuum degree detected by the second vacuum gauge and output the second vacuum degree.

[0020] Optionally, an infrared heating device is also provided inside the heat insulation cover;

[0021] Optionally, the infrared heating device is an infrared heating tube surrounding the inner wall of the heat insulation cover.

[0022] Optionally, the material of the heat shield includes ceramic materials.

[0023] Optionally, the hollow annular component and the stage are an integral structure;

[0024] And / or,

[0025] The vacuum equipment also includes: multiple spring clips set on the stage, one end of each spring clip being fixed to the stage, and the other end being used to press down on the surface of the structure to be tested near the edge to fix the structure to be tested.

[0026] Optionally, there are two hollow ring components, and the positions of the two hollow ring components correspond one-to-one with the positions of the two structural components to be tested, forming two sets of components, each containing one hollow ring component, and the two sets of components are arranged side by side on the stage.

[0027] The vacuum device further includes: a first opening in the housing of the vacuum chamber, the first opening being used to connect an electron beam generating device, the electron beam generating device being used to generate an electron beam, the electron beam being used as a radiation beam to irradiate the surface of the structure under test; or, a transparent window being installed at the first opening, the transparent window being used to allow a laser beam to pass through, and the laser beam being used as a radiation beam to irradiate the surface of the structure under test, the wavelength of the laser beam including: 193nm and / or 248nm;

[0028] Furthermore, the vacuum device also includes: a first connection port formed on the housing of the vacuum chamber for connecting to a secondary electron probe; the secondary electron probe is used to detect the yield of secondary electrons in the vacuum chamber.

[0029] Optionally, the bottom connector is rotatably connected to the bottom of the vacuum chamber to move the two structural components under test to a first position, which is directly opposite the first opening;

[0030] When the first position is directly opposite the first opening, the radiation beam can be perpendicularly irradiated onto the surface of the structure under test through the first opening or the transparent window.

[0031] Alternatively, the transparent window may be made of quartz.

[0032] Optionally, the vacuum device may further include a second connection port formed on the housing of the vacuum chamber for connecting to the sample inlet of the thermal analyzer.

[0033] In the vacuum equipment simulating the exposure environment of an extreme ultraviolet (EUV) lithography machine provided in this application embodiment, a stage is set up and configured as a hollow plate structure. This hollow plate structure includes a thermally conductive material. By setting a heating device inside the hollow cavity of the hollow plate structure and a temperature detection device on the stage, the structure under test can be heated and its heating temperature can be detected in real time. In this way, the temperature rise of the structure under test due to the irradiation of EUV light during EUV exposure can be simulated. Since the effect of temperature on the performance of the multilayer film of the reflector (such as aberration) can lead to poor reflectivity stability, the heating temperature of the structure under test can be output by the control device, allowing researchers to study the relationship between temperature and the performance of the multilayer film of the reflector (such as aberration). This allows for fundamental scientific research on improving reflectivity stability by simulating the EUV exposure environment.

[0034] In addition, temperature control will be different in a vacuum environment. Therefore, in the vacuum equipment provided in this application, by heating the structure under test using a heating device in a vacuum environment and detecting the heating temperature of the structure under test using a temperature detection device, it is also possible to study the changes in the performance (such as aberration) of the multilayer film of the reflector caused by temperature changes in a vacuum environment, and thus conduct basic research on the exposure of extreme ultraviolet light. Attached Figure Description

[0035] Figure 1 A schematic diagram of a vacuum device simulating the exposure environment of an extreme ultraviolet lithography machine is provided in an embodiment of this application;

[0036] Figure 2 A schematic diagram of the structure of another vacuum device simulating the exposure environment of an extreme ultraviolet lithography machine provided in this application embodiment;

[0037] Figure 3 An exploded view of a vacuum apparatus simulating the exposure environment of an extreme ultraviolet lithography machine, provided in an embodiment of this application;

[0038] Figure 4 A schematic diagram of the structure of a vacuum device for simulating the exposure environment of an extreme ultraviolet lithography machine, provided in an embodiment of this application;

[0039] Figure 5 This is a schematic diagram of the overall architecture of a computer device provided in an embodiment of this application. Detailed Implementation

[0040] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0042] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0043] In the accompanying drawings, the size of the constituent elements, the thickness of the layers, or the area are sometimes exaggerated for clarity. Therefore, one aspect of this application is not necessarily limited to these dimensions, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and one aspect of this application is not limited to the shapes or values ​​shown in the drawings.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] Based on the above problems, some embodiments of this application provide a vacuum device that simulates the exposure environment of an extreme ultraviolet lithography machine, such as... Figure 1 and Figure 2 As shown, the vacuum device 10 includes: a vacuum chamber 1, a stage 2, a heating device 3, a temperature detection device 4, and a control device 5; wherein, the stage 2 is a hollow plate structure, which is fixed in the vacuum chamber 1 by a bottom connector 6, and the stage 2 is used to place the structural component 20 to be tested, and the material of the hollow plate structure includes: a thermally conductive material; the heating device 3 is disposed in the hollow cavity of the hollow plate structure and is used to heat the structural component 20 to be tested; the temperature detection device 4 is disposed on the stage 2 and is used to detect the heating temperature of the structural component 20 to be tested; the control device 5 is disposed outside the vacuum chamber and is electrically connected to the heating device 3 and the temperature detection device 4, and is used to control the opening and closing of the heating device 3 and the heating temperature, as well as to acquire the temperature detected by the temperature detection device 4 and output the temperature detected by the temperature detection device 4.

[0046] The aforementioned thermally conductive materials may include: stainless steel, etc.

[0047] The shell 11 of the aforementioned vacuum chamber 1 can be made of stainless steel. Stainless steel has high strength and can provide an exposure environment with temperatures as low as 10°C. -5 The vacuum level of ttor allows for the simulation of the exposure environment of extreme ultraviolet lithography machines.

[0048] Among them, such as Figure 1 and Figure 2 As shown, by providing an opening L on the housing 11 of the vacuum chamber 1 and connecting a vacuum pumping system to the opening L, the vacuum level inside the vacuum chamber 1 can be adjusted by the vacuum pumping system.

[0049] In some embodiments, the structure under test 20 can be any structure that can affect the exposure accuracy under heating. For example, the structure under test 20 can be a wafer or an optical element, such as a mirror or a mask.

[0050] In the vacuum device 10 simulating the exposure environment of an extreme ultraviolet (EUV) lithography machine provided in this application embodiment, a stage 2 is set up and configured as a hollow plate structure. The hollow plate structure includes a thermally conductive material. By setting a heating device 3 inside the hollow cavity of the hollow plate structure and a temperature detection device 4 on the stage 2, the structure to be tested 20 can be heated, and the heating temperature of the structure to be tested 20 can be detected in real time. In this way, the temperature rise of the structure to be tested 20 due to the irradiation of EUV light during EUV exposure can be simulated. Since the effect of temperature on the performance of the multilayer film of the reflector (such as aberration) will lead to poor reflectivity stability, by outputting the heating temperature of the structure to be tested 20 through the control device, researchers can study the relationship between temperature and the performance of the multilayer film of the reflector (such as aberration). This allows for basic scientific research on improving reflectivity stability by simulating the EUV exposure environment.

[0051] In addition, temperature control will be different in a vacuum environment. Therefore, in the vacuum equipment provided in this application, by heating the structure to be tested 20 in a vacuum environment using the heating device 3 and detecting the heating temperature of the structure to be tested 20 using the temperature detection device 4, it is also possible to study the changes in the performance (such as aberration) of the multilayer film of the reflector caused by temperature changes in a vacuum environment, and thus conduct basic research on the exposure of extreme ultraviolet light.

[0052] In order to detect the vacuum level in the vacuum chamber 1, in some embodiments, a second vacuum gauge is also provided on the shell of the vacuum chamber 1. The second vacuum gauge is electrically connected to the control device 5. The control device 5 is used to acquire the second vacuum level detected by the second vacuum gauge and output the second vacuum level.

[0053] Using this second vacuum gauge, the vacuum level inside the vacuum chamber 1 can be detected, making it convenient for researchers to obtain the vacuum level inside the vacuum chamber 1 from outside the vacuum chamber 1.

[0054] like Figure 1 and Figure 2 As shown, the housing 11 of the vacuum chamber 1 has an opening M, which is used to install a second vacuum gauge.

[0055] In some embodiments, the vacuum device 10 further includes a plurality of spring clips disposed on the stage 2, one end of each spring clip being fixed on the stage 2, and the other end being used to press down on the surface of the structure to be tested 20 near the edge to fix the structure to be tested 20.

[0056] In these embodiments, the fixation stability of the structure under test 20 can be improved.

[0057] One end of the spring clip can be fixed to the platform 2 by gluing or welding.

[0058] In some embodiments, such as Figure 1 As shown, the vacuum device 10 also includes: a hollow annular component 7 and a gas supply device; the hollow annular component 7 surrounds the structure 3 to be tested, and the hollow cavity of the hollow annular component 7 is provided with a gas inlet 71 communicating with the gas supply device and a gas outlet 72 for purging gas for the structure 20 to be tested.

[0059] A valve is installed at the gas outlet of the gas supply device. The control device 5 is electrically connected to the valve and is used to control the gas supply device to output gas or stop outputting gas.

[0060] In these embodiments, by providing a hollow annular component 7, during the heating process described above, gas can be introduced into the gas inlet of the hollow annular component 7 through a gas supply device, thereby blowing the structure 20 under test with gas, which can cool the structure 20 under test, and thus allow for more precise control of the temperature of the structure 20 under test.

[0061] The added gas can also be used to study the performance of multilayer films in mirrors. By reacting the gas with the multilayer film, contaminants on the surface of the multilayer film can be removed, thereby improving the reflectivity of optical components.

[0062] In addition, gas molecule flow and temperature control are different in a vacuum environment. Therefore, it is possible to study gas molecule flow and temperature changes in a vacuum environment, which can further study the exposure environment and improve the reliability of exposure in a vacuum environment.

[0063] In some embodiments, such as Figure 1 and Figure 2As shown, the vacuum device 10 also includes: a lifting device, a heat shield 8 and a first vacuum gauge 9 disposed in the vacuum chamber 1; the control device 5 is also electrically connected to the lifting device and the first vacuum gauge 9.

[0064] The first vacuum gauge 9 is located at the gas outlet 72 of the hollow annular component 7, and the control device 5 is used to obtain the first vacuum degree detected by the first vacuum gauge and output the first vacuum degree.

[0065] The lifting device is connected to the heat shield 8. The lifting device is used to drive the heat shield 8 to rise or fall under the control of the control device 5, so as to control the heat shield 8 to expose the structure 20 to be tested and the hollow annular component 7 in the vacuum chamber 1, or to control the heat shield 8 to cover the structure 20 to be tested and the hollow annular component 7.

[0066] In these embodiments, by providing a heat shield 8, the heat shield 8 can insulate the hollow annular component 7 and the structure under test 20, thereby increasing the heating rate of the structure under test 3 and achieving rapid temperature rise. Under heating, gas molecules entering the hollow cavity of the hollow annular component 7 are more easily drawn away, and the gas pressure increases. Therefore, the vacuum value inside the heat shield 8 will be lower than the vacuum value inside the entire vacuum cavity 1. By providing a first vacuum gauge 9, the vacuum value inside the heat shield 8 can be detected in real time, thereby enabling further research on temperature control and gas molecule flow under vacuum conditions.

[0067] In addition, during the heating process, gas is introduced into the gas inlet of the hollow annular component 7 through the gas supply device, and the gas is used to blow on the structure 20 under test, which can also cool down the structure 20 under test, thereby allowing for further temperature control.

[0068] In some embodiments, such as Figure 1 As shown, the vacuum device 10 also includes a condensation device, which is disposed in the hollow cavity of the hollow plate structure and is used to condense the structural component 20 to be tested.

[0069] In these embodiments, by providing a condensation device, the structure under test 20 can be cooled down, thereby achieving rapid cooling of the structure under test 20.

[0070] In addition, the vacuum device 10 may also include a PID temperature controller, which is electrically connected to the control switch of the heating device 3, the control switch of the condensing device, and the control device 5, respectively, and is used to control the heating device 3 or the condensing device to achieve precise temperature control according to the temperature set by the control device 5.

[0071] The aforementioned platform 2 can be equipped with a storage slot, and the temperature detection device 4 can be placed in the storage slot to detect the temperature of the structural component to be tested.

[0072] In some embodiments, an infrared heating device is also provided inside the heat insulation cover 8.

[0073] The infrared heating device can heat the structure 20 under test, and further control the temperature of the structure 20 under test.

[0074] In some embodiments, the infrared heating device is an infrared heating tube surrounding the inner wall of the heat insulation cover 8.

[0075] In these embodiments, the structure 20 under test can be heated uniformly.

[0076] The material of the heat insulation cover 8 may include a heat-resistant inert material.

[0077] In some embodiments, the material of the heat insulation cover 8 includes ceramic materials or other heat-resistant inert materials.

[0078] In some embodiments, the hollow annular member 7 is one.

[0079] In these embodiments, the structure under test 20 can be a wafer or an optical element. In this way, a hollow ring member 7 can be placed around the wafer or optical element to simulate the performance changes of the multilayer film of the mirror caused by the temperature of the wafer and the optical element, thereby enabling the study of the relationship between temperature and the performance of the multilayer film of the mirror.

[0080] In some embodiments, such as Figure 3 and Figure 4 As shown, there are two hollow ring components 7, and the positions of the two hollow ring components 7 correspond one-to-one with the positions of the two structural components 20 to be tested, forming two sets of components, each containing one hollow ring component 7. The two sets of components are arranged side by side on the stage 2.

[0081] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the vacuum device 10 further includes: a first opening V formed on the housing 11 of the vacuum chamber 1, the first opening V being used to connect an electron beam generating device, the electron beam generating device being used to generate an electron beam, the electron beam being used as a radiation beam to irradiate the surface of the structure 20 under test, or, a transparent window being provided at the first opening, the transparent window being used to allow a laser beam to pass through, and the laser beam being used as a radiation beam to irradiate the surface of the structure 20 under test, the wavelength of the laser beam including: 193nm and / or 248nm.

[0082] Furthermore, the vacuum device also includes: a first connection port 12 formed on the housing 11 of the vacuum chamber 1 for connecting to a secondary electron probe; the secondary electron probe is used to detect the yield of secondary electrons in the vacuum chamber 1.

[0083] During the exposure process, as photoresist-coated wafers continuously enter and exit the lithography machine, hydrocarbons from the decomposition of the photoresist diffuse into vacuum chamber 1. These hydrocarbons are then adsorbed onto optical components and the wafer. When extreme ultraviolet (EUV) light strikes these objects, secondary electrons are generated. These secondary electrons cause the molecular chains of the adsorbed hydrocarbons on the surface to break, forming a carbon film. This carbon film has a strong absorption capacity for EUV light, significantly reducing the reflectivity of the mirror. Similar to hydrocarbons, water molecules are also adsorbed onto the reflective film surface during the exposure process. Under EUV irradiation, water molecules decompose into oxygen and hydrogen ions, causing surface oxidation and hydrogen ion diffusion. Data shows that a 0.3 nm surface oxide layer can lead to a 1% loss in reflectivity, while hydrogen ions easily diffuse into the reflective film, generating bubbles, which can even damage the mirror in severe cases.

[0084] Based on this, in these embodiments, by setting two hollow annular components 7, one of which can be placed around the wafer coated with photoresist and the other around the optical element, the adsorption of hydrocarbons and water molecules on the surface of the optical element that may occur under extreme ultraviolet irradiation in a vacuum environment can be simulated, thereby simulating the exposure environment. Furthermore, by setting a secondary electron probe, the yield of secondary electrons in the vacuum cavity can be detected, thus allowing for the study of the relationship between secondary electrons and hydrocarbon molecular chain breakage. This enables fundamental research on secondary electrons and hydrocarbon molecular chain breakage, creating conditions for subsequent research on exposure environments with high reflectivity.

[0085] Furthermore, in extreme ultraviolet (EUV) lithography systems, optical components such as masks and reflectors utilize high-performance Mo / Si multilayer film structures. These multilayer film components require a lifespan of 30,000 hours in actual lithography systems, and reflectivity variations must be controlled within 2% to ensure the lithography machine's throughput. During multilayer film growth, a diffusion interface layer always exists between the Mo and Si layers. This is because lattice defects at the interface cause atoms to diffuse and combine, forming new chemical bonds. When the thickness of the diffusion interface layer exceeds one-quarter of the multilayer film period's wavelength, the abrupt interface becomes blurred, the refractive index difference decreases, and atomic compaction leads to a reduction in period thickness, ultimately resulting in a sharp drop in reflectivity. Simultaneously, the wavelength of maximum reflectivity for multilayer film optical components also changes due to the presence of the diffusion interface layer, causing poor reflectivity stability.

[0086] In addition, smooth surfaces and interfaces are essential characteristics of optical components, therefore the root mean square (RMS) roughness of surfaces and interfaces must be below 0.1 nm. Rough surfaces and interfaces cause light scattering and result in uneven film thickness. The phase of reflected light cannot achieve constructive interference, leading to light loss and reduced reflectivity, as well as poor reflectivity stability.

[0087] Based on this, in these embodiments, the energy of the electron beam is close to that of extreme ultraviolet (EUV) light, allowing for the simulation of EUV. Laser beams with wavelengths of 193 nm and / or 248 nm, with higher photon energies (approximately 5 eV), can also substitute for high-energy EUV photons. The structure under test (SUT) 20 can be an optical element. By irradiating the surface of the SUT 20 with a radiation beam, the reflectivity of the optical element under different radiation beam irradiations can be simulated, thereby enabling fundamental research on improving reflectivity stability.

[0088] In some embodiments, such as Figures 1-4 As shown, the material of the aforementioned transparent window includes quartz.

[0089] In these embodiments, the transparent window is both transparent to laser beams with wavelengths of 193 nm and / or 248 nm and resistant to high voltage.

[0090] In some embodiments, the bottom connector 6 is rotatably connected to the bottom of the vacuum chamber 1, and is used to drive the two test structural members 20 to a first position, which is directly opposite the first opening V;

[0091] When the first position is directly opposite the first opening V, the radiation beam can be perpendicularly irradiated onto the surface of the structure 20 under test through the first opening V or the transparent window.

[0092] In these embodiments, by making the bottom connector 6 and the bottom of the vacuum chamber 1 rotatably connected, the two test structures 20 can be moved, so that both test structures 20 can be simulated under extreme ultraviolet light irradiation.

[0093] In some embodiments, such as Figures 1-4 As shown, the vacuum device 10 also includes a second connection port 13 on the housing 11 of the vacuum chamber 1 for communicating with the sample inlet of the thermal analyzer.

[0094] In these embodiments, by setting up a thermal analyzer, the composition of the material inside the vacuum chamber 1 can be analyzed, thereby improving the accuracy of experimental environment research.

[0095] Each control module in the aforementioned control device 5 can be implemented entirely or partially through software, hardware, or a combination thereof. These control modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the operations corresponding to each control module. For example, the processor acquires the temperature detected by the temperature detection device and adjusts the heating temperature of the heating device based on the temperature detected by the temperature detection device, thereby adjusting the heating temperature of the structural component 20 under test.

[0096] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 5 As shown, the computer device includes a processor, memory, communication interface, display unit, and input device connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements the control methods of the aforementioned control device. The display unit can be a liquid crystal display (LCD) or an e-ink display. The input device can be a touch layer covering the display screen, buttons, a trackball, or a touchpad mounted on the computer device casing, or an external keyboard, touchpad, or mouse.

[0097] Those skilled in the art will understand that Figure 5 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0098] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps performed by the control device 5 described above.

[0099] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A vacuum device for simulating the exposure environment of an extreme ultraviolet lithography machine, characterized in that, include: A vacuum chamber, wherein a first opening is provided on the vacuum chamber, the first opening being used to connect an electron beam generating device or to allow a laser beam to pass through; The housing of the vacuum chamber has a first connection port for connecting to a secondary electron probe, which is used to detect the yield of secondary electrons in the vacuum chamber. A stage, wherein the stage is a hollow plate-like structure; The hollow plate-shaped structure is fixed inside the vacuum cavity by a bottom connector. The stage is used to place the structural component to be tested. The material of the hollow plate-shaped structure includes a thermally conductive material. A heating device is disposed in the hollow cavity of the hollow plate-like structure and is used to heat the structural component to be tested; A temperature detection device is installed on the stage and is used to detect the heating temperature of the structural component to be tested. A control device, located outside the vacuum chamber and electrically connected to the heating device and the temperature detection device, is used to control the opening and closing of the heating device and the heating temperature, as well as to acquire the temperature detected by the temperature detection device and output the temperature detected by the temperature detection device. The vacuum equipment also includes: a hollow annular component and a gas supply device; The hollow annular component is used to surround the structure to be tested, and the hollow cavity of the hollow annular component is provided with a gas inlet communicating with the gas supply device, and a gas outlet for purging gas to the structure to be tested. There are two hollow annular components, and the positions of the two hollow annular components correspond one-to-one with the positions of the two structural components to be tested, forming two sets of components, each containing one hollow annular component. The two sets of components are arranged side by side on the platform.

2. The vacuum equipment for simulating the exposure environment of an extreme ultraviolet lithography machine according to claim 1, characterized in that, A valve is provided at the gas outlet of the gas supply device, and the control device is electrically connected to the valve to control the gas supply device to output gas or stop outputting gas; and / or, The vacuum equipment further includes a condensation device, which is disposed in the hollow cavity of the hollow plate structure and is used to condense the structural component to be tested.

3. The vacuum equipment for simulating the exposure environment of an extreme ultraviolet lithography machine according to claim 2, characterized in that, The vacuum equipment further includes: a lifting device, a heat shield, and a first vacuum gauge disposed in the vacuum chamber; the control device is also electrically connected to the lifting device and the first vacuum gauge. The first vacuum gauge is located at the gas outlet of the hollow annular component, and the control device is used to acquire the first vacuum degree detected by the first vacuum gauge and output the first vacuum degree. The lifting device is connected to the heat insulation cover. The lifting device, under the control of the control device, drives the heat insulation cover to rise or fall, thereby controlling the heat insulation cover to expose the structure under test and the hollow annular component within the vacuum cavity, or controlling the heat insulation cover to cover the structure under test and the hollow annular component; and / or, A second vacuum gauge is also provided on the housing of the vacuum chamber. The second vacuum gauge is electrically connected to the control device. The control device is used to acquire the second vacuum degree detected by the second vacuum gauge and output the second vacuum degree.

4. The vacuum equipment for simulating the exposure environment of an extreme ultraviolet lithography machine according to claim 3, characterized in that, An infrared heating device is also installed inside the heat insulation cover; The infrared heating device is an infrared heating tube that surrounds the inner wall of the heat insulation cover.

5. The vacuum equipment for simulating the exposure environment of an extreme ultraviolet lithography machine according to claim 3, characterized in that, The heat insulation cover is made of ceramic materials.

6. The vacuum equipment for simulating the exposure environment of an extreme ultraviolet lithography machine according to claim 1, characterized in that, The hollow annular component and the stage are an integral structure; and / or The vacuum device further includes: a plurality of spring clips disposed on the stage, one end of each spring clip being fixed to the stage, and the other end being used to press down on the surface of the structure to be tested near the edge to fix the structure to be tested.

7. The vacuum apparatus for simulating the exposure environment of an extreme ultraviolet lithography machine according to any one of claims 2 to 6, characterized in that, The electron beam generating device is used to generate an electron beam, which irradiates the surface of the structure under test as a radiation beam; or, a transparent window is installed at the first opening, which allows a laser beam to pass through and irradiates the surface of the structure under test as a radiation beam, wherein the wavelength of the laser beam includes 193 nm and / or 248 nm.

8. The vacuum equipment for simulating the exposure environment of an extreme ultraviolet lithography machine according to claim 7, characterized in that, The bottom connector is rotatably connected to the bottom of the vacuum chamber, and is used to move the two test structural components to a first position, which is directly opposite the first opening; When the first position is directly opposite the first opening, the radiation beam can be perpendicularly irradiated onto the surface of the structure under test through the first opening or transparent window.

9. The vacuum equipment for simulating the exposure environment of an extreme ultraviolet lithography machine according to claim 7, characterized in that, The transparent window is made of quartz.

10. The vacuum equipment for simulating the exposure environment of an extreme ultraviolet lithography machine according to claim 7, characterized in that, The vacuum device further includes a second connection port formed on the housing of the vacuum chamber for connecting to the sample inlet of the thermal analyzer.

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