A novel method for preparing metal lines

By attaching an underlay material and conductive metal to the substrate, combined with the use of photosensitive adhesive and a specific etching solution, the problems of weak adhesion and inconsistent etching rate of metal circuits are solved, thereby improving the stability and fabrication efficiency of metal circuits.

CN116723643BActive Publication Date: 2026-06-19SHENZHEN ZHILING WEIYE TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN ZHILING WEIYE TECH
Filing Date
2023-06-13
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In the prior art, the adhesion of metal lines to the substrate is weak, and the etching rate of the etching solution to the conductive metal and the underlay material is inconsistent, making it difficult to control the patterned lines.

Method used

First, a layer of underlay material is attached to the substrate, then conductive metal is attached. After covering with photosensitive emulsion, the substrate is exposed and developed. During etching, a specific etching solution is used to etch the conductive metal. The film stripping solution removes the photosensitive emulsion while simultaneously etching the underlay material, ensuring that the patterns of the two are consistent.

Benefits of technology

It achieves strong adhesion of conductive metal to the substrate, simplifies the preparation process, improves the stability and preparation efficiency of the circuit, and is suitable for a variety of substrates.

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Abstract

This invention relates to the field of metal circuit fabrication technology, specifically a novel method for fabricating metal circuits. The method includes the following steps: S1: Selecting a substrate and then attaching a layer of underlay material to the substrate surface; S2: Attaching a layer of conductive metal to the underlay material; S3: Covering the conductive metal surface with photosensitive adhesive; S4: Fabricating a photosensitive adhesive circuit through exposure and development; S5: Etching the conductive metal using an etching solution to create a conductive metal pattern while keeping the underlay material untouched by etching; S6: Removing the photosensitive adhesive using a stripping solution while simultaneously etching the underlay material to ensure consistency between the underlay material and the conductive metal pattern, thus completing the fabrication of the metal circuit. The fabrication method proposed in this invention achieves consistent etching of the underlay material and the conductive metal by using specific chemicals and liquids, ensuring the accuracy of circuit fabrication and improving the stability and reliability of the circuit.
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