Chip recovery device
By installing a cover in the workpiece processing section, and using gas jets and gravity to collect chips, the problem of complex structure in existing devices is solved, achieving efficient chip recovery and smooth workpiece processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TOYOTA JIDOSHA KK
- Filing Date
- 2023-02-20
- Publication Date
- 2026-07-14
AI Technical Summary
Existing chip recycling devices have complex structures, and a simpler chip recycling method is desired.
A cover is used to cover the workpiece machining area. The cover is equipped with a tool insertion port, an outlet port and a spray port, and the chips are effectively collected by gas jet and gravity.
The simple structure effectively suppresses chip scattering, achieving efficient chip collection and recycling without hindering workpiece processing.
Smart Images

Figure CN116728145B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a chip recovery device. Background Technology
[0002] Patent Document 1 discloses an apparatus comprising: a cover covering a workpiece being cut by a tool; a nozzle for separating chips generated during the cutting process from the workpiece and the tool by blowing gas onto the workpiece and the tool; and a suction nozzle disposed above the workpiece and the tool to draw in the gas and chips from the nozzle.
[0003] Existing technical documents
[0004] Patent documents
[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-131716 Summary of the Invention
[0006] The problem that the invention aims to solve
[0007] In the apparatus described in the aforementioned literature, chips are separated from the workpiece and tool by blowing gas from a nozzle, and the chips are recovered by suction from a suction nozzle; therefore, the structure of the apparatus is complex. Thus, an apparatus capable of recovering chips with a simpler structure is desired.
[0008] Technical solutions for solving the problem
[0009] This disclosure can be implemented in the following manner.
[0010] (1) According to one aspect of the present disclosure, a chip recovery device is provided. The chip recovery device includes a cover that covers a processed portion of a workpiece to which the removal process is performed. The cover has: a tool insertion port for inserting a tool to perform the removal process on the processed portion; an outlet for discharging chips generated by performing the removal process on the processed portion; and a first injection port for injecting gas toward the outlet, the processed portion being disposed between the first injection port and the outlet.
[0011] According to this chip recovery device, since a cover is provided to cover the machining portion of the workpiece, it is possible to suppress the scattering of chips generated during the removal process of the workpiece outside the cover. Furthermore, since the cover has a first injection port that sprays gas toward the discharge port, and the machining portion of the workpiece is positioned between the first injection port and the discharge port, the gas injected from the first injection port can move the chips generated during the removal process of the workpiece to the discharge port. Therefore, chips can be recovered with a simple structure.
[0012] (2) In the chip recovery device described above, the tool may move along the surface of the processing part relative to the processing part and the cover while performing the removal processing on the processing part, the tool insertion port is provided along the moving direction of the tool during the removal processing, and the first spray port is provided along the edge of the tool insertion port.
[0013] According to this chip recovery device, a tool insertion port is provided along the moving direction of the tool during the removal process, thus suppressing the obstruction of the removal process of the workpiece by the tool.
[0014] (3) In the chip recycling device described above, a recess is formed on the outer wall of the cover, the tool insertion port is disposed on the bottom surface of the recess, and the side wall of the recess is inclined such that the width of the recess becomes narrower the closer it is to the tool insertion port.
[0015] According to this chip recovery device, since the sidewall of the recess is inclined such that the width of the recess becomes narrower as it gets closer to the tool insertion port, the airflow velocity that accompanies the gas ejected from the first injection port into the shroud can be increased. Therefore, it is possible to suppress the situation where chips fly out of the shroud through the tool insertion port.
[0016] (4) In the chip recovery device described above, the tool may move along the surface of the processing part relative to the processing part and the cover while performing the removal processing on the processing part. A recess is formed on the outer wall of the cover. The tool insertion port is provided on the bottom surface of the recess along the moving direction of the tool during the removal processing. The side wall of the recess is inclined such that the width of the recess becomes narrower as it gets closer to the tool insertion port. The first spray port is provided along the edge of the tool insertion port.
[0017] According to this chip recovery device, a tool insertion port is provided along the moving direction of the tool during removal processing, thus preventing the removal of the workpiece by the tool from being obstructed by the cover. Furthermore, since the sidewall of the recess is inclined such that its width narrows closer to the tool insertion port, the airflow velocity of the air entering the cover from the tool insertion port along with the gas ejected from the first jet port can be increased. Therefore, it is possible to prevent chips from scattering outside the cover through the tool insertion port.
[0018] (5) In the chip recovery device described above, the discharge port may be disposed on the lower side in the vertical direction relative to the processing part.
[0019] According to this chip recovery device, since the discharge port is positioned on the lower side in the vertical direction relative to the processing section, the chips can be moved to the discharge port not only by utilizing the gas ejected from the first injection port but also by utilizing gravity. Therefore, the chips can be easily moved to the discharge port.
[0020] (6) In the chip recovery device described above, the cover may also have a second injection port that injects gas toward the outlet, the second injection port being disposed between the processing section and the outlet.
[0021] According to this chip recovery device, by injecting gas from the second injection port, the gas injected from the first injection port can be easily made to flow from the first injection port toward the discharge port.
[0022] (7) The chip recovery device described above may also include a filter connected to the hood to capture the chips discharged from the outlet and allow the gas discharged from the outlet to pass through.
[0023] According to this method, the chip recovery device can easily recover chips that have moved to the discharge port through a filter.
[0024] This disclosure can also be implemented in various ways other than chip recovery devices. For example, it can be implemented by means of machine tools or covers. Attached Figure Description
[0025] Figure 1 This is a side view showing the schematic structure of the machine tool according to the first embodiment.
[0026] Figure 2 This is a perspective view showing the structure of the chip recovery device according to the first embodiment.
[0027] Figure 3 This is a first cross-sectional view showing the structure of the cover according to the first embodiment.
[0028] Figure 4 This is a second cross-sectional view showing the structure of the cover according to the first embodiment.
[0029] Figure 5 This is a third cross-sectional view showing the structure of the cover according to the first embodiment.
[0030] Figure 6 This is a cross-sectional view showing the structure of the cover in other embodiments. Detailed Implementation
[0031] A. First implementation method:
[0032] Figure 1 This is a side view showing the schematic structure of the machine tool 10 equipped with the chip recovery device 15 of the first embodiment. Figure 1 The diagram shows arrows representing the three mutually orthogonal coordinate axes: the X, Y, and Z axes. The X and Y axes are parallel to the horizontal plane. The Z axis is parallel to the vertical direction, and the arrows representing the Z axis indicate a direction opposite to the vertical direction. The arrows representing the X, Y, and Z axes are also shown in other diagrams with the direction they indicate being perpendicular to the vertical plane. Figure 1 The corresponding methods are illustrated appropriately.
[0033] The machine tool 10 in this embodiment is a machining center, comprising a bed 20, a column 30, a spindle rotation device 40, a slide 50, a worktable 60, and a control device (not shown). The bed 20 is located at the lower end of the machine tool 10. The column 30 is fixed to the upper surface of the bed 20. The column 30 is arranged along the Z-axis.
[0034] The spindle rotation device 40 is positioned above the bed 20 and supported by the column 30. The spindle rotation device 40 is guided by a track 35 located on the front of the column 30 and can move along the Z-axis. The spindle rotation device 40 has a spindle 45. A tool TL is mounted on the spindle 45. In this embodiment, an end mill is used as the tool TL. The spindle rotation device 40 rotates the tool TL by rotating the spindle 45 about the rotation axis Rt. The spindle rotation device 40 changes the orientation of the spindle 45 and the tool TL by rotating about the rotation axis Rs, which is parallel to the Y-axis.
[0035] A slide saddle 50 is positioned above the bed 20. The slide saddle 50 moves along the X-axis, guided by a track 25 on the upper surface of the bed 20. A worktable 60 is positioned above the slide saddle 50. The worktable 60 moves along the Y-axis, guided by a track 55 on the upper surface of the slide saddle 50. A workpiece clamp 70 for fixing the workpiece WK to the worktable 60 is provided on the upper surface of the worktable 60. The aforementioned spindle rotation device 40, slide saddle 50, and worktable 60 are driven, for example, by a servo motor (not shown) driven under the control of a control device.
[0036] In this embodiment, the workpiece fixing fixture 70 includes a base portion 73, a workpiece fixing portion 75, and a workpiece rotating portion 78. The base portion 73 is disposed along the Z-axis. The base portion 73 is fixed to the worktable 60, for example, by bolts. The workpiece fixing portion 75 is rotatably supported by the base portion 73. The workpiece WK is fixed in the workpiece fixing portion 75. In this embodiment, the workpiece WK has a rod-shaped appearance. Specifically, in this embodiment, the workpiece WK is a flat copper wire formed by providing an enamel insulating film on the surface of a copper conductor. The workpiece rotating portion 78 changes the orientation of the workpiece WK by rotating the workpiece fixing portion 75 around a rotation axis Rw parallel to the X-axis. In this embodiment, the workpiece rotating portion 78 is configured by combining a servo motor, a belt, and a pulley that are driven under the control of a control device.
[0037] Machine tool 10 performs cutting operations on workpiece WK by rotating tool TL relative to workpiece WK while bringing tool TL into contact with workpiece WK. In this embodiment, machine tool 10 removes the insulating film from workpiece WK and processes the conductor of workpiece WK into a desired shape by changing the orientation of workpiece WK using workpiece rotation part 78 and moving rotating tool TL relative to workpiece WK along a predetermined path. In the following description, the portion of workpiece WK to which cutting or other removal operations are performed is referred to as the processed portion.
[0038] A chip recovery device 15 is installed on the machine tool 10. In this embodiment, the chip recovery device 15 includes a cover 100 and a filter 200. The cover 100 covers the machined portion of the workpiece WK. The filter 200 is connected to the cover 100 and collects chips generated by cutting the machined portion of the workpiece WK. Chips refer to the shavings of the workpiece WK generated by cutting or other removal processes. Chips are generated not only by cutting the workpiece WK but also, for example, by grinding the workpiece WK.
[0039] The shroud 100 is connected to a gas supply source 18 via piping (not shown). The gas supply source 18 pressurizes and supplies gas GS into the shroud 100. In this embodiment, the gas supply source 18 is an air compressor, and the gas GS is air. Chips generated inside the shroud 100 are conveyed to the filter 200 via the gas GS from the gas supply source 18. Alternatively, in other embodiments, the gas supply source 18 may not be an air compressor, but rather, for example, a gas tank storing compressed gas GS. The gas GS may also not be air, but rather an inert gas such as argon.
[0040] Figure 2 This is a perspective view showing the structure of the chip recovery device 15 of this embodiment. Figure 3This is a first cross-sectional view showing the structure of the cover 100 in this embodiment. Figure 4 This is a second cross-sectional view showing the structure of the cover 100 in this embodiment. Figure 5 This is a third cross-sectional view showing the structure of the cover 100 in this embodiment. Figure 3 The diagram shows a cross-section of the cover 100 and the workpiece fixing fixture 70 when the cover 100 is cut with a plane perpendicular to the Y-axis. Figure 4 The image shows a cross-section of the cover 100 when it is cut with a plane perpendicular to the X-axis. Figure 5 The diagram shows a cross-section of the cover 100 when it is cut with a plane perpendicular to the Z-axis.
[0041] like Figure 2 As shown, in this embodiment, the chip collection device 15 includes a cover 100 and a filter 200. The cover 100 has a main body portion 110 and a flange portion 120. In this embodiment, the cover 100 is configured to be symmetrical from left to right. However, in other embodiments, the cover 100 may also be configured to be asymmetrical from left to right.
[0042] The main body 110 includes a front wall portion 111, a left side wall portion 112, a right side wall portion 113, a rear wall portion 114, a left nozzle portion 115, and a right nozzle portion 116. The front wall portion 111 and the rear wall portion 114 are arranged opposite each other. In this embodiment, the length of the front wall portion 111 along the Z-axis is shorter than the length of the rear wall portion 114 along the Z-axis. The upper end of the front wall portion 111 is located below the upper end of the rear wall portion 114, and the lower end of the front wall portion 111 is located at approximately the same height as the lower end of the rear wall portion 114. The left side wall portion 112 and the right side wall portion 113 are arranged opposite each other. The left side wall portion 112 connects the left end of the front wall portion 111 and the left end of the rear wall portion 114, and the right side wall portion 113 connects the right end of the front wall portion 111 and the right end of the rear wall portion 114.
[0043] The left nozzle portion 115 is configured to protrude from the upper end of the left side wall portion 112 toward the right side wall portion 113. The left nozzle portion 115 extends from the connection between the left side wall portion 112 and the rear wall portion 114 to the connection between the left side wall portion 112 and the front wall portion 111, along the edge of the left side wall portion 112. A first injection port 165L (described later) is provided at the front end of the left nozzle portion 115. The right nozzle portion 116 is configured to protrude from the upper end of the right side wall portion 113 toward the left side wall portion 112. The right nozzle portion 116 and the left nozzle portion 115 are configured symmetrically. A first injection port 165R (described later) is provided at the front end of the right nozzle portion 116.
[0044] The flange portion 120 is configured as a flat plate and is connected to the left and right ends of the rear wall portion 114. In this embodiment, the flange portion 120 has a plurality of through holes 125 and is fixed to the base portion 73 of the workpiece fixing fixture 70 by bolts inserted into each through hole 125. Alternatively, the flange portion 120 may be fixed to the base portion 73 by, for example, a clamp without bolts.
[0045] In this embodiment, the cover 100 is formed of a resin material. The cover 100 can be manufactured, for example, by injection molding or by additive manufacturing using a 3D printer. Alternatively, in other embodiments, the cover 100 may be formed of a metal material instead of a resin material.
[0046] The filter 200 is fixed to the lower end of the cover 100. In this embodiment, the filter 200 is made of a mesh component and has a bottomed cylindrical shape. The filter 200 allows gas GS to pass through and captures chips.
[0047] like Figure 3 and Figure 4 As shown, the cover 100 has an internal space SP enclosed by a front wall portion 111, a left side wall portion 112, a right side wall portion 113, a rear wall portion 114, a left nozzle portion 115, and a right nozzle portion 116. The inner wall surface of the cover 100 facing the internal space SP is configured to be generally cylindrical.
[0048] like Figure 3 As shown, in this embodiment, the cover 100 has a workpiece insertion port 130, a tool insertion port 140, an outlet port 150, an inlet port 161, a common flow path 163C, a left flow path 163L, a right flow path 163R, a first spray port 165L, 165R, and a second spray port 169.
[0049] like Figure 4 As shown, the workpiece insertion port 130 is located at the center of the rear wall portion 114. The workpiece insertion port 130 is configured to penetrate the rear wall portion 114 and communicate with the outside of the cover 100 and the internal space SP. The workpiece WK, which is fixed to the workpiece fixing portion 75, is inserted into the internal space SP through the workpiece insertion port 130.
[0050] A recess 119 is formed on the outer wall surface of the cover 100 via a left nozzle portion 115 and a right nozzle portion 116, and a tool insertion port 140 is provided on the bottom surface of the recess 119. The side wall surfaces of the recess 119, namely the upper surfaces of the left nozzle portion 115 and the right nozzle portion 116, are inclined such that the width of the recess 119 becomes narrower as it approaches the tool insertion port 140. The width of the recess 119 refers to the spacing between the side wall surfaces configured to face each other. In this embodiment, the width of the recess 119 refers to the spacing between the upper surfaces of the left nozzle portion 115 and the right nozzle portion 116 along the Y-axis direction. The tool insertion port 140 communicates the outside of the cover 100 with the internal space SP. Figure 3 As shown, the tool TL, mounted on the spindle 45 of the machine tool 10, is inserted into the internal space SP through the tool insertion port 140. As described above, in this embodiment, the machine tool 10 performs cutting machining on the workpiece WK by changing the tilt angle of the front end of the tool TL relative to the workpiece WK along a predetermined path along the X and Z axes, with the rotation axis Rs parallel to the Y-axis as the center. The tool insertion port 140 is configured not to contact the tool TL moving along the aforementioned path. More specifically, in this embodiment, the tool insertion port 140 is configured as a slit-like structure extending from the rear wall portion 114 to the upper end of the front wall portion 111 along the direction of movement of the tool TL during cutting machining.
[0051] The outlet 150 is located at the lower end of the cover 100. The outlet 150 connects the outside of the cover 100 with the internal space SP. Chips generated during the cutting of the workpiece WK are discharged from the outlet 150.
[0052] like Figure 2 As shown, the inlet 161 is located at the center of the outer surface of the front wall portion 111. Although not shown in the figure, a pipe connected to the gas supply source 18 described above is attached to the inlet 161. In this embodiment, the inlet 161 is located on the lower part of the front wall portion 111 so that the tool TL and the spindle rotation device 40 do not come into contact with the pipe connected to the inlet 161. Gas GS supplied from the gas supply source 18 is introduced into the common flow path 163C through the inlet 161.
[0053] like Figure 5 As shown, a common flow path 163C is located in the center of the front wall portion 111. One end of the common flow path 163C communicates with the inlet 161. The other end of the common flow path 163C communicates with the left flow path 163L and the right flow path 163R. Figure 4 and Figure 5As shown, the left flow path 163L communicates with the first injection port 165L and the second injection port 169 through the left side portion of the front wall portion 111, the interior of the left side wall portion 112, and the interior of the left nozzle portion 115. The right flow path 163R communicates with the first injection port 165R and the second injection port 169 through the right side portion of the front wall portion 111, the interior of the right side wall portion 113, and the interior of the right nozzle portion 116.
[0054] like Figure 4 As shown, the first injection ports 165L and 165R are positioned on the side opposite to the outlet 150 relative to the machined portion of the workpiece WK. In other words, the machined portion of the workpiece WK is positioned between the first injection ports 165L and 165R and the outlet 150. In this embodiment, the left first injection port 165L is provided in a slit shape at the front end of the left nozzle portion 115, and the right first injection port 165R is provided in a slit shape at the front end of the right nozzle portion 116. The first injection ports 165L and 165R inject gas GS toward the outlet 150. The phrase "the first injection ports 165L and 165R inject gas GS toward the outlet 150" means that the vector representing the injection direction of gas GS from the first injection ports 165L and 165R has a component from the first injection ports 165L and 165R toward the outlet 150, and the outlet 150 may not be positioned on the extension line of the vector representing the injection direction of gas GS from the first injection ports 165L and 165R. In this embodiment, the first injection ports 165L and 165R are provided in such a way that an airflow-based curtain is formed between the tool insertion port 140 and the machining portion of the workpiece WK by injecting gas GS from the first injection ports 165L and 165R. Alternatively, in other embodiments, the first injection ports 165L and 165R may not be slit-shaped. For example, a plurality of first injection ports 165L may be arranged at the front end of the left nozzle portion 115, and a plurality of first injection ports 165R may be arranged at the front end of the right nozzle portion 116.
[0055] The second injection port 169 is disposed between the machined portion of the workpiece WK and the outlet 150. In this embodiment, the second injection port 169 is provided in a slit shape along the Y-axis on the inner wall surface of the front wall portion 111. The second injection port 169 injects gas GS toward the outlet 150. "The second injection port 169 injects gas GS toward the outlet 150" means that the vector representing the injection direction of gas GS from the second injection port 169 has a component from the second injection port 169 toward the outlet 150, and the outlet 150 may not be disposed on the extension line of the vector representing the injection direction of gas GS from the second injection port 169. Alternatively, in other embodiments, the second injection port 169 may not be provided in a slit shape. For example, a plurality of second injection ports 169 may be arranged along the Y-axis.
[0056] like Figure 3 As shown, by injecting gas GS from the first injection ports 165L and 165R, a flow of gas GS from the first injection ports 165L and 165R toward the outlet 150 is formed in the internal space SP. Chips generated from the machining portion of the workpiece WK are conveyed to the outlet 150 via the gas GS and captured by the filter 200. Furthermore, when the flow of gas GS from the first injection ports 165L and 165R toward the outlet 150 is generated, air flows into the internal space SP from the outside of the cover 100 through the tool insertion port 140, thus suppressing the scattering of chips to the outside of the cover 100 through the tool insertion port 140. Moreover, in this embodiment, gas GS is injected not only from the first injection ports 165L and 165R but also from the second injection port 169, thus preventing the gas GS from stagnating near the outlet 150.
[0057] According to the chip recovery device 15 of this embodiment described above, since a cover 100 covering the machining portion of the workpiece WK is provided, it is possible to suppress the scattering of chips generated during the cutting of the workpiece WK to the outside of the cover 100. Furthermore, in this embodiment, the cover 100 is provided with first injection ports 165L and 165R that inject gas GS toward the discharge port 150, and the machining portion of the workpiece WK is disposed between the first injection ports 165L and 165R and the discharge port 150. Therefore, the gas GS injected from the first injection ports 165L and 165R can transport the chips generated during the cutting of the workpiece WK to the discharge port 150. Thus, chips can be recovered with a simple structure. In particular, in this embodiment, no device for drawing chips from the internal space SP of the cover 100 is provided, thereby enabling chip recovery with a simple structure.
[0058] Furthermore, in this embodiment, the cover 100 is provided with a tool insertion port 140 for inserting the front end of the tool TL, and the entire tool TL is not covered by the cover 100. Therefore, compared to covering the entire tool TL with a cover, the cover 100 can be miniaturized. In particular, in this embodiment, the tool insertion port 140 is provided in a slit shape so as not to contact the tool TL that performs cutting on the workpiece WK while moving relative to the workpiece WK and the cover 100. Therefore, by providing the cover 100, it is possible to prevent the workpiece WK from being restricted from being machined into the desired shape. Moreover, in this embodiment, first jet ports 165L and 165R are provided along the edge of the tool insertion port 140, so by jetting gas GS from the first jet ports 165L and 165R, an airflow-based curtain can be formed between the tool insertion port 140 and the machined portion of the workpiece WK. Therefore, it is possible to prevent chips from flying out of the cover 100 through the tool insertion port 140.
[0059] Furthermore, in this embodiment, the tool insertion port 140 is provided in the recess 119 formed on the outer wall surface of the cover 100. The side wall surface of the recess 119 is inclined such that the width of the recess 119 becomes narrower as it approaches the tool insertion port 140. Therefore, the airflow velocity of the air flowing from the tool insertion port 140 into the internal space SP of the cover 100 along with the injection of gas GS from the first injection ports 165L and 165R can be increased. Therefore, it is possible to suppress the situation where chips fly out of the cover 100 through the tool insertion port 140.
[0060] Furthermore, in this embodiment, the discharge port 150 is positioned on the lower side in the vertical direction relative to the machined portion of the workpiece WK. Therefore, not only can the gas GS ejected from the first injection ports 165L and 165R be utilized, but gravity can also be used to move the chips to the discharge port 150. Thus, the chips can be easily moved to the discharge port 150.
[0061] Furthermore, in this embodiment, a second injection port 169 is provided in the cover 100. This second injection port 169 is disposed between the machined portion of the workpiece WK and the outlet 150, and injects gas GS toward the outlet 150. Therefore, by injecting gas GS from the second injection port 169, the gas GS injected from the first injection ports 165L and 165R can be easily made to flow from the first injection ports 165L and 165R toward the outlet 150.
[0062] Furthermore, in this embodiment, a filter 200 is provided at the outlet 150 to allow gas GS to pass through and to capture chips. Therefore, chips can be easily recovered through the filter 200. In particular, in this embodiment, the filter 200 is made of a mesh member to allow gas GS to pass through easily, thus preventing the situation where the pressure of gas GS between the machining portion of the workpiece WK and the outlet 150 increases, resulting in gas GS flowing from the machining portion toward the tool insertion port 140.
[0063] B. Other implementation methods:
[0064] (B1) In the first embodiment described above, the machine tool 10 is a machining center that uses a tool TL to cut the workpiece WK. In contrast, the machine tool 10 may not be a machining center, but rather, for example, a drilling machine or a lathe. If the machine tool 10 is a drilling machine, a drill bit can be used as the tool TL. If the machine tool 10 is a lathe, a lathe tool can be used as the tool TL. The cover 100 of the chip recovery device 15 can be designed according to the type of machine tool 10, the type of tool TL, the machining method, etc. For example, if the machine tool 10 is a drilling machine, the cover 100 may be configured as a cylinder having a central axis along the rotation axis Rt of the tool TL. If the machine tool 10 is a lathe, the cover 100 may be configured as a cylinder having a central axis along the rotation axis Rw of the workpiece WK, and a tool insertion port 140 is provided on the side of the cylindrical cover 100.
[0065] (B2) In the first embodiment described above, machine tool 10 is a machining center that uses tool TL to perform cutting operations on workpiece WK. In contrast, machine tool 10 may also be a machine that uses tool TL to perform removal operations on workpiece WK other than cutting operations. For example, machine tool 10 may also be a grinding machine that uses a grinding wheel as tool TL to perform grinding operations on workpiece WK.
[0066] (B3) In the chip recovery device 15 of the first embodiment described above, the tool insertion port 140 is provided on the bottom surface of the recess 119 formed on the outer wall surface of the cover 100, and the side wall surface of the recess 119 is inclined such that the width of the recess 119 becomes narrower as it approaches the tool insertion port 140. In contrast, the tool insertion port 140 may not be provided on the bottom surface of the recess 119. Furthermore, even when the tool insertion port 140 is provided on the bottom surface of the recess 119, the side wall surface of the recess 119 may not be inclined in such a way that the width of the recess 119 becomes narrower as it approaches the tool insertion port 140.
[0067] (B4) In the chip recovery device 15 of the first embodiment described above, a second spray port 169 is provided in the cover 100. In contrast, the second spray port 169 may not be provided in the cover 100.
[0068] (B5) In the chip recovery device 15 of the first embodiment described above, a workpiece insertion port 130 is provided in the cover 100. In contrast, the workpiece insertion port 130 may not be provided in the cover 100. In this case, the cover 100 may be configured to cover the workpiece fixing clamp 70 and the workpiece WK.
[0069] (B6) The chip collection device 15 of the first embodiment described above has a filter 200. In contrast, the chip collection device 15 may also not have a filter 200. For example, the outlet 150 of the cover 100 may also be connected to a collection container for storing chips via a hose.
[0070] (B7) In the chip recovery device 15 of the first embodiment described above, the first spray ports 165L and 165R of the cover 100 are arranged symmetrically from left to right. Conversely, the first spray ports 165L and 165R may not be arranged symmetrically from left to right. For example, as... Figure 6 As shown, the left and right first injection ports 165L and 165R can also be arranged with their positions differing, and are configured to inject gas GS along the tangential direction of the inner wall surface of the cover 100 when viewed parallel to the central axis of the cylindrical internal space SP. In this case, since a vortex-like flow of gas GS is formed in the internal space SP from the first injection ports 165L and 165R toward the outlet 150, it is easy to make the gas GS flow from the first injection ports 165L and 165R toward the outlet 150. In addition, in Figure 6 The diagram shows the structure around the first injection ports 165L and 165R, but illustrations of other structures are omitted.
[0071] This disclosure is not limited to the embodiments described above, and can be implemented in various structures without departing from the spirit of this disclosure. For example, in order to solve some or all of the above-described problems, or to achieve some or all of the above-described effects, the technical features in the embodiments corresponding to the technical features in the various methods described in the Summary of the Invention section can be appropriately replaced or combined. Furthermore, if a technical feature is not described as a necessary technical feature in this specification, it can be appropriately deleted.
[0072] Label Explanation
[0073] 10…Machine tool, 15…Chip recovery device, 18…Gas supply source, 20…Bed, 30…Column, 40…Spindle rotation device, 45…Spindle, 50…Saddle, 60…Worktable, 70…Workpiece fixing fixture, 73…Base, 75…Workpiece fixing part, 78…Workpiece rotating part, 100…Cover, 110…Main body, 111…Front wall, 112…Left side wall, 113…Right side wall, 114…Rear wall, 115…Left nozzle. 116…Right nozzle portion, 119…Recess, 120…Flange portion, 125…Through hole, 130…Workpiece insertion port, 140…Tool insertion port, 150…Exit port, 161…Inlet port, 163C…Common flow path, 163L…Left flow path, 163R…Right flow path, 165L, 165R…First injection port, 169…Second injection port, 200…Filter, GS…Gas, SP…Internal space, TL…Tool, WK…Workpiece.
Claims
1. A chip recycling device, wherein, The chip recovery device includes a cover that covers the processed portion of the workpiece from which the chip removal process is performed. The cover has: A tool insertion port for inserting a tool to perform the removal process on the processed portion; A discharge port is used to discharge chips generated by the removal process performed on the processed portion; and The first injection port injects gas toward the exhaust port. The processing section is positioned between the first injection port and the discharge port. The tool performs the removal process on the processed portion while moving along the surface of the processed portion relative to the processed portion and the cover. Recesses are formed on the outer wall surface of the cover through the left nozzle portion and the right nozzle portion. The tool insertion port is positioned on the bottom surface of the recess along the direction of tool movement during the removal process. The sidewalls of the recess, namely the upper surfaces of the left and right nozzles, are inclined such that the width of the recess becomes narrower as it gets closer to the tool insertion port. A first injection port on the left and a first injection port on the right are provided along the edge of the tool insertion port, so as to form an airflow-based curtain between the tool insertion port and the machining section by injecting gas from the first injection port on the left and the first injection port on the right. The shroud has a second injection port that sprays gas toward the exhaust port. The second injection port is disposed between the processing section and the discharge port.
2. The chip recycling device according to claim 1, wherein, The outlet is positioned on the lower side in the vertical direction relative to the processing section.
3. The chip recycling device according to claim 1, wherein, The chip recovery device includes a filter connected to the hood to capture the chips discharged from the outlet and allow the gas discharged from the outlet to pass through.