An inner frame for a large blackbody radiation source
Patent Information
- Application Number
- CN202310127788.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-02-17
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2043-02-17
AI Technical Summary
常用的内框架结构设计难以达到预期效果,需要一种能够克服该问题的内框架均温板结构
本发明能够在有限的空间内将热量均匀地散失,最后在辐射面形成一个均匀的温度场。而且本发明的均温板上设有柱体,柱体具有对穿孔,能够将TEC的热量均匀地向四周传递,防止热量集中在一点。
Smart Images

Figure CN116735004B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of infrared radiation measurement technology, specifically relating to an inner frame for a large blackbody radiation source. Background Technology
[0002] The effective emissivity of an ideal blackbody cavity is ε(λ, T) = 1. However, in practical blackbody construction, the opening is very large, resulting in an effective emissivity ε(λ, T) < 1. The effective emissivity of a cavity is a function of the cavity shape, the material used, and the distance between the cavity and true isothermal conditions. Therefore, when fabricating a blackbody, it is essential to use theoretical calculations of the effective emissivity ε to correctly select the cavity shape and material, and to take various measures to increase the isothermal region length and improve the cavity's temperature stability, thereby making the effective emissivity as close to 1 as possible. However, with conventional blackbody radiation sources, as the area increases, maintaining high emissivity becomes problematic due to issues with emissivity uniformity.
[0003] The most crucial factor in evaluating the performance of a blackbody radiation source is its emissivity. Whether used as a calibration source for various infrared instruments or as an ideal light source, a blackbody must ensure emission of the same spectrum under the same temperature parameters. Commonly used internal frame structures often fail to achieve the desired results, necessitating an internal frame temperature-equalizing plate structure that overcomes this limitation. Summary of the Invention
[0004] To overcome the shortcomings of existing technologies, this invention provides a heat spreader and its inner frame for overcoming the thermal conductivity problem of large blackbody, which can dissipate heat evenly in a limited space and finally form a uniform temperature field on the radiating surface.
[0005] A heat spreader for overcoming the thermal conductivity problem of large blackbody includes a heat spreader body, wherein a plurality of columns are arranged on the heat spreader body, and a plurality of through holes are formed on the side of the columns.
[0006] Furthermore, a boss structure is provided on the body of the temperature distribution plate, and the column is disposed on the boss structure.
[0007] Furthermore, the boss structure includes a central boss portion and several side boss portions arranged around the central boss portion, with grooves formed between adjacent side boss portions, and the columns are correspondingly arranged on the side boss portions.
[0008] Furthermore, the column is a square column structure with through holes on all four sides.
[0009] Furthermore, four pillars are symmetrically arranged on the body of the temperature distribution plate.
[0010] The present invention also includes an inner frame, comprising a frame assembly, wherein a temperature distribution plate array is disposed in the frame assembly, characterized in that the temperature distribution plate array is composed of a plurality of temperature distribution plates as described above.
[0011] Furthermore, the frame assembly includes an inner frame plate and an outer frame that are fitted together. A radiating surface, a TEC group, a heat spreader, an insulation layer, a water channel, and a heat sink are sequentially sandwiched between the inner frame plate and the outer frame. The TEC group is disposed on the column of the heat spreader array, and a cavity is formed between the outer frame and the radiating surface.
[0012] Furthermore, a sealing sponge is provided on the outer side of the outer frame, and a baffle and insulation cotton are provided on the inner side of the outer frame. The sealing sponge, baffle and insulation cotton have a ring structure consistent with the outer frame.
[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention can dissipate heat evenly within a limited space, ultimately forming a uniform temperature field on the radiating surface. Furthermore, the heat spreader of this invention features columns with perforations, which can evenly distribute the heat from the TEC (Thermal Design Equipment) in all directions, preventing heat from concentrating at a single point. Attached Figure Description
[0014] Figure 1 This is one of the schematic diagrams of the heat exchanger structure of the present invention; Figure 2 This is one of the schematic diagrams of the heat exchanger structure of the present invention; Figure 3 This is a schematic diagram of the internal frame structure of the present invention; Figure 4 This is a schematic diagram of the exploded internal frame structure of the present invention; Figure 5 This is a schematic diagram of the thermodynamic analysis of the temperature distribution plate in this invention; Figure 6 This is a schematic diagram of the overall thermodynamic analysis of the radiation surface source in this invention. Detailed Implementation
[0015] In the description of this invention, it should be understood that the terms "one end", "the other end", "outer side", "upper side", "inner side", "horizontal", "coaxial", "center", "end", "length", "outer end", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.
[0016] The invention will now be further described with reference to the accompanying drawings.
[0017] Please see Figure 1 and Figure 2 A heat spreader for overcoming the thermal conductivity problem of large blackbody is provided, comprising a heat spreader body 500, a boss structure 502 provided on the heat spreader body 500, the boss structure 502 includes a central boss portion 5020 and four boss side portions 5021 arranged around the central boss portion 5020, a groove is formed between adjacent boss side portions 5021, a column 501 is provided on each boss side portion 5021, the column 501 is preferably a square column structure, and through holes 5010 are provided on its four sides. A groove 5011 is provided on the top of the column 501 for connecting TEC group.
[0018] The vapor chamber structure is made of aluminum alloy, which is lightweight and easy to process. This unit structure can ensure optimal temperature uniformity of the radiant surface source within limited materials and space, achieving the best results.
[0019] Please see Figure 3 and Figure 4 An inner frame is installed at the center of the entire blackbody radiation source, including a frame assembly, in which a heat spreader array 5 is disposed, the heat spreader array 5 being composed of several heat spreaders as described above.
[0020] The frame assembly includes an inner frame plate 8 and an outer frame 1 that are installed together. A radiating surface 4, a TEC group (not shown in the figure), a heat spreader 5, an insulation layer 6, a water channel, and a heat sink 7 are sequentially sandwiched between the inner frame plate 8 and the outer frame 1. The TEC group is set on the column 501 of the heat spreader array 5. A cavity 9 is formed between the outer frame 1 and the radiating surface 4.
[0021] Furthermore, a sealing sponge (not shown in the figure) is provided on the outer side of the outer frame 1, and a baffle 2 and insulation cotton 3 are provided on the inner side of the outer frame 1. That is, a baffle 2 and insulation cotton 3 are sandwiched between the outer frame 1 and the radiating surface 1. The sealing sponge, baffle 2 and insulation cotton 3 have a ring structure consistent with the outer frame 1. The baffle 2 is preferably a resin baffle. The outer frame 1 is located outside the radiating surface 4, strengthening the overall structure. Its surface is covered with a layer of sealing sponge, primarily to prevent air from being drawn from the front of the radiating surface 4 to the back, affecting its temperature, when the fan is operating. The baffle 2 acts as insulation, reducing heat conduction and preventing heat from escaping from the frame of the radiating surface 4. The insulation cotton 3 also provides good insulation and prevents heat loss. The radiating surface 4 is made entirely of aluminum, forming the main body of the blackbody radiation source, with a high emissivity coating on its outer surface. The TEC group is a temperature control device that utilizes the Peltier effect to regulate the temperature of the radiating surface 4. The heat spreader array 5 assists in uniform temperature conduction. The insulation layer 6 mainly consists of ceramic fiberboard and fiber cotton, aiding in heat conduction. The water circuit is made of PU tubing and is connected to a matching water chiller for constant-temperature water cooling. The heat sink 7 contains 64 silent fans, further assisting in cooling the radiating surface on top of the water cooling system. The inner frame plate 8 is connected to a frame support, and the two together provide structural support and fixation. After the entire inner frame is assembled, this inner frame heat exchanger structure can effectively transfer heat and ensure the uniformity and stability of the overall temperature of the radiant surface.
[0022] One side of the vapor chamber is a relatively smooth flat surface that fits tightly against the inner end of the radiant surface 4, transferring the cooling and heating energy of the radiant surface 4. The other end of the vapor chamber is designed to fit 64 TECs (Thermal Design Units), and is modified into a columnar form 501. Each vapor chamber has four columns 501, each in a square shape to match the appearance of the TEC. Perforations are drilled on all four sides of each square column to evenly distribute the heat from the TEC and prevent heat concentration at a single point. A solid square column would cause excessively high temperatures in the central area, affecting the temperature uniformity of the radiant surface. Since heat is difficult to transfer from the center of the vapor chamber, a boss structure 502 is designed to raise the height of the center and lower the height of the surrounding area, forming a groove to ensure uniform temperature across the entire interface. Heat is transferred from the hot end of the TEC to the insulation layer. The subsequent water circuit connects to an external constant-temperature chiller, achieving water cooling through a specific water loop structure. In addition to water cooling, there will be 64 sets of ultra-quiet fans to supplement the cooling of the entire radiation source, so as to achieve high-precision temperature control of the entire blackbody radiation source.
[0023] The feature of this embodiment is: 1. Large-area blackbody radiation sources rely on TEC and water channels for heating and cooling.
[0024] 2. The entire internal frame of the large-area blackbody radiation source is assembled from multiple layers, which ensures the uniformity and stability of the temperature of the entire blackbody radiation source.
[0025] 3. The designed specific heat spreader column structure can compensate for the problem that the TEC group and the radiant surface cannot be completely fitted together, which in turn affects the normal transfer of heat.
[0026] 4. The vapor chamber structure can be designed in different shapes and sizes according to different radiation sources and TEC dimensions.
[0027] 5. Thermally conductive silicone can be used as a heat transfer medium in the gaps between the various parts of the inner frame. Air in the gaps between the surfaces can hinder heat conduction to the heat sink, but thermally conductive silicone can fill these gaps, making heat conduction smoother.
[0028] The main technical specifications of the entire blackbody radiation surface source after adopting the temperature distribution plate structure implemented in this invention are as follows:
[0029] like Figure 5 , Figure 6 As shown, through finite element analysis software and thermodynamic simulation, it can be clearly seen that after the heat dissipation is assisted by the heat spreader, the temperature difference range of the entire radiation surface source is maintained at about ±0.01, and the radiation surface source has good temperature uniformity.
[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. An inner frame for a large blackbody radiation source, comprising frame components, characterized in that, The frame assembly includes an inner frame plate (8) and an outer frame (1) that are installed together. A radiating surface (4), a heat spreader array (5), a TEC group, an insulation layer (6), a water channel, and a heat sink (7) are sequentially sandwiched between the inner frame plate (8) and the outer frame (1). The TEC group is set on the column of the heat spreader array (5). A cavity (9) is formed between the outer frame (1) and the radiating surface (4). The heat spreader array (5) is composed of several heat spreaders. The heat spreader includes a heat spreader body (500). Several columns (501) are set on the heat spreader body (500). The columns (501) are square columns with through holes (5010) on all four sides. The insulation layer (6) is composed of ceramic fiber board and fiber cotton. The water channel is made of PU pipe. A 64-channel silent fan is installed in the heat sink (7). The heat exchange plate body (500) is provided with a boss structure (502), and the column (501) is provided on the boss structure (502); The boss structure (502) includes a central boss (5020) and several side bosses (5021) arranged around the central boss (5020). A groove is formed between adjacent side bosses (5021), and the column (501) is correspondingly arranged on the side bosses (5021).
2. The inner frame for a large blackbody radiation source according to claim 1, characterized in that, Four columns (501) are symmetrically arranged on the body of the temperature distribution plate (500).
3. The inner frame for a large blackbody radiation source according to claim 1, characterized in that, The outer side of the outer frame (1) is provided with a sealing sponge, and the inner side of the outer frame (1) is provided with a baffle (2) and a heat insulation cotton (3). The sealing sponge, baffle (2) and heat insulation cotton (3) are a ring structure consistent with the outer frame (1).
Citation Information
Patent Citations
Large-surface-source blackbody radiation source based on gas-liquid two-phase reflux temperature control
CN110736551A
Mini-type extend blackbody device based on TEC
CN202582738U
Thermoelectric cooler system, method and device
US20120139076A1