镜头模组及其制作方法
By placing an optical film in the middle region of the glass substrate in the lens module, and not placing an optical film in the surrounding annular bonding area, combined with silicon-based or UV-cured adhesives, the warping and stress problems caused by the optical film are solved, improving the yield of the lens module and the selectivity of the adhesive.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HOWE OPTOELECTRONICS TECH SHANGHAI
- Filing Date
- 2023-07-28
- Publication Date
- 2026-07-17
AI Technical Summary
In existing lens modules, the optical film completely covers the glass substrate, resulting in large warpage and high stress. This makes the modules prone to damage during stacking and cutting processes, affecting yield. Furthermore, UV-cured adhesives cannot be used for bonding.
An optical film is set in the middle area of the glass substrate, while no optical film is set in the annular bonding area around the glass substrate and the second lens. The bonding is carried out using a silicon-based or UV-cured adhesive. The top layer of the optical film can be made of an inorganic compound or a polymer composite material, allowing UV light to pass through.
It reduces the warpage and stress of the glass substrate, improves the yield of the lens module, and enables the use of UV-cured adhesives, enhancing the flexibility and versatility of bonding.
Smart Images
Figure CN116736464B_ABST