Monitoring system, method and backlight module

Abstract

The present application relates to the technical field of backlight modules, and provides a monitoring system, method and backlight module. When the backlight module starts working, the control module monitors the thermal expansion amount set on the optical film through the monitoring module; when the thermal expansion amount is greater than a preset expansion amount threshold, the monitoring module further monitors the warping amount of the optical film. When the warping amount is within the preset warping amount range, a corresponding heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform corresponding heat dissipation operations on the optical film, which can effectively improve the problem that the refractive properties of the optical film change after the thermal expansion, so that the light cannot be evenly diverged.

Description

Technical Field

[0001] The present application relates to the technical field of backlight modules, and in particular provides a monitoring system, method and backlight module. Background Art

[0002] Optical film is an important optical component in the backlight module of a display device, used to evenly disperse the light emitted by the backlight source to the display panel, thereby improving the brightness uniformity of the image displayed by the display panel.

[0003] When the display device is working, the backlight source and the display panel will generate heat, causing the optical film to expand due to heat and change its refraction characteristics of light, so that the light cannot be evenly dispersed to the display panel, affecting the brightness uniformity of the display panel. Summary of the Invention

[0004] The present application provides a monitoring system, method and backlight module, which aim to solve the problem that both the existing backlight source and the display panel generate heat, causing the optical film to expand due to heat and change the refraction characteristics of light, so that the light cannot be evenly converged to the display panel, affecting the brightness uniformity of the display panel.

[0005] A first aspect of the present application provides a monitoring system applied to a backlight module, wherein the backlight module includes an optical film and a backlight source, and the monitoring system includes:

[0006] A monitoring module is configured to be disposed toward the optical film;

[0007] The control module is electrically connected to the monitoring module and is configured to:

[0008] electrically connected to the heat dissipation module;

[0009] When the backlight source is turned on, the warping amount of the optical film is monitored by the monitoring module;

[0010] If the warping amount is within a preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to perform a corresponding heat dissipation operation on the optical film.

[0011] In one embodiment, the monitoring module includes:

[0012] The first monitoring unit and the second monitoring unit are configured to be disposed toward the optical film;

[0013] The control module is electrically connected to the first monitoring unit and the second monitoring unit, and is specifically configured to:

[0014] When the backlight source is turned on, the thermal expansion of the optical film is monitored by the first monitoring unit;

[0015] If the thermal expansion amount is greater than a preset expansion amount threshold, the warping amount of the optical film is monitored by the second monitoring unit.

[0016] In one embodiment, the first monitoring unit includes at least one of a pressure-sensitive sensor and a displacement sensor, and the second monitoring unit includes a camera;

[0017] When the first monitoring unit includes a pressure-sensitive sensor, the control module is specifically configured to:

[0018] When the backlight module starts working, the pressure value applied to the pressure-sensitive sensor when the optical film expands due to heat is monitored by the pressure-sensitive sensor;

[0019] If the pressure value is greater than a preset pressure threshold, it is determined that the thermal expansion of the optical film is greater than a preset expansion threshold;

[0020] When the first monitoring unit includes a displacement sensor, the control module is specifically configured as follows:

[0021] When the backlight module starts working, the displacement value of the optical film when it expands due to heat is monitored by the displacement sensor;

[0022] If the displacement value is greater than a preset displacement threshold, it is determined that the thermal expansion of the optical film is greater than a preset expansion threshold;

[0023] The control module is further configured to:

[0024] If the thermal expansion amount is greater than a preset expansion amount threshold, collecting a thermal expansion image of the optical film through the camera;

[0025] The warping amount of the optical film is determined based on the thermal expansion image and an initial image of the optical film before thermal expansion.

[0026] In one embodiment, the monitoring module includes a camera;

[0027] The control module is specifically configured as follows:

[0028] When the backlight source is turned on, the camera collects a thermal expansion image of the optical film;

[0029] determining a warping amount of the optical film according to the thermal expansion image and an initial image of the optical film before thermal expansion;

[0030] If the warping amount is within a preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to perform a corresponding heat dissipation operation on the optical film.

[0031] In one embodiment, the control module is specifically configured to:

[0032] If the warping amount is within a first preset warping amount range, an intermittent heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform an intermittent heat dissipation operation on the optical film;

[0033] If the warping amount is within a second preset warping amount range, a continuous heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform a continuous heat dissipation operation on the optical film, and the upper limit value of the first preset warping amount range is less than the lower limit value of the second preset warping amount range.

[0034] In one embodiment, the control module is further configured to:

[0035] If the warping amount is less than a lower limit of the preset warping amount range, a heat dissipation stop instruction is sent to the heat dissipation module to control the heat dissipation module to stop performing a heat dissipation operation on the optical film;

[0036] electrically connected to the backlight source;

[0037] If the warping amount is within a preset warping amount range, or is greater than an upper limit of the preset warping amount range, a extinguishing instruction is issued to the backlight source to control the backlight source to extinguish.

[0038] In one embodiment, the monitoring system is further configured to:

[0039] electrically connected to the prompt module;

[0040] If the warping amount is greater than a lower limit value of a preset warping amount range, an abnormal prompt instruction is sent to the prompt module to control the prompt module to send abnormal prompt information.

[0041] A second aspect of the embodiments of the present application provides a monitoring method, which is implemented based on the monitoring system provided in the first aspect of the embodiments of the present application. The monitoring method includes the following steps performed by the control module:

[0042] When the backlight source is turned on, the warping amount of the optical film is monitored by the monitoring module;

[0043] If the warping amount is within a preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to perform a corresponding heat dissipation operation on the optical film.

[0044] A third aspect of the embodiments of the present application provides a backlight module, including an optical film, a backlight source, and the monitoring system provided by the first aspect of the embodiments of the present application.

[0045] In one embodiment, the backlight module further includes a circuit board and the heat dissipation module, and the control module is disposed on the circuit board.

[0046] The fourth aspect of the embodiments of the present application provides a display device, comprising the backlight module provided by the third aspect of the embodiments of the present application, a display panel, and a computer program stored in the memory and executable on the control module, wherein when the control module executes the computer program, the steps of the monitoring method provided by the second aspect of the embodiments of the present application are implemented.

[0047] A fifth aspect of an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a control module, it implements the steps of the monitoring method provided in the second aspect of the embodiment of the present application.

[0048] A first aspect of an embodiment of the present application provides a monitoring system applied to a backlight module. When the backlight module starts working, the control module monitors the thermal expansion amount set on the optical film through the monitoring module; when the thermal expansion amount is greater than a preset expansion amount threshold, the monitoring module further monitors the warping amount of the optical film. When the warping amount is within the preset warping amount range, a corresponding heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform corresponding heat dissipation operations on the optical film, which can effectively improve the problem that the refractive properties of the optical film to light are changed after the thermal expansion, so that the light cannot be evenly diverged.

[0049] It can be understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0051] Figure 1 A schematic diagram of the first structure of the backlight module provided in an embodiment of the present application;

[0052] Figure 2 A schematic diagram of the structure of a display device provided in an embodiment of the present application;

[0053] Figure 3 A schematic diagram of the optical film provided in an embodiment of the present application in contact with a pressure-sensitive sensor;

[0054] Figure 4 A schematic diagram of an optical film provided in an embodiment of the present application when warping occurs;

[0055] Figure 5 A second structural diagram of the backlight module provided in an embodiment of the present application;

[0056] Figure 6 A flow chart of the monitoring method provided in the embodiment of the present application;

[0057] Reference numerals:

[0058] 11. Back panel; 12. Reflector; 13. Base plate; 14. Light guide plate; 15. Backlight source; 16. Optical film; 17. First plastic frame; 18. Second plastic frame; 19. Shading tape; 20. Circuit board;

[0059] 111, side panel; 112, bottom panel; 113, lampshade;

[0060] 21. Lower polarizer; 22. Transistor; 23. Color filter; 24. Lower polarizer;

[0061] 30. Monitoring module; 31. First monitoring unit; 32. Second monitoring unit;

[0062] 4. Heat dissipation module; 41. Fan; 42. Heat dissipation pipe. DETAILED DESCRIPTION

[0063] The following describes in detail embodiments of the present application, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0064] In the description of this application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0066] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.

[0067] like Figure 1 As shown, the embodiment of the present application provides a backlight module, including a back plate 11, a reflector 12, a substrate 13, a light guide plate 14, a backlight source 15 and an optical film 16. The back plate 11 includes side plates 111, a bottom plate 112 and a lampshade 113;

[0068] The reflector 12 and the base plate 13 are arranged side by side on the bottom plate 112;

[0069] The light guide plate 14 is disposed on a side of the reflector 12 away from the bottom plate 112 ;

[0070] The backlight source 15 is disposed on a side of the substrate 13 away from the bottom plate 112 , and the light guide plate 14 is adjacent to the backlight source 15 ;

[0071] The optical film 16 is disposed on a side of the light guide plate 14 away from the reflective plate 12 ;

[0072] The side panel 111 is disposed at one end of the bottom panel 112 , and the lampshade 113 is bent from the other end of the bottom panel 112 and extends to a side of the backlight source 15 away from the substrate 13 .

[0073] In application, the side panels, bottom panel and lampshade included in the back panel can be integrated or separated according to actual needs. Figure 1 The back plate is shown as an integral structure. The shape of the lampshade can be set according to actual needs, as long as it can achieve the function of being set on the light-emitting side of the backlight source (that is, the side of the backlight source away from the substrate). Figure 1 The lampshade is exemplarily shown as an L-shaped structure.

[0074] In applications, the substrate is a substrate of a backlight source. The backlight source can be implemented based on any light-emitting element, such as a light-emitting diode (LED).

[0075] In use, the reflector, light guide, and optical film are sequentially stacked on the base plate. The light guide guide guides light from the backlight source toward the reflector and optical film, the reflector reflects the light toward the optical film, and the optical film refracts the light away from the base plate. This allows the light from the backlight source to ultimately illuminate the display panel when the backlight module is combined with the display panel. The optical film may include, but is not limited to, at least one of a diffusion film and a brightness enhancement film.

[0076] In the application, Figure 1 The illustrated backlight module has a single-sided emitting structure, meaning the backlight source is located on one side of the backplate, emitting light from the side of the backplate. In other embodiments, the backlight module may also have a double-sided emitting structure, meaning the substrate and backlight source can be located on both sides of the backplate, emitting light from either side. Alternatively, the backlight module may have a bottom-emitting structure, meaning the substrate and backlight source are sequentially located between a reflector and a light guide plate. When the backlight module has a double-sided emitting structure or a bottom-emitting structure, the side panels and lampshade can be identical in structure and symmetrically located on the bottom panel.

[0077] like Figure 2 As shown, an embodiment of the present application further provides a display device, comprising a backlight module and a liquid crystal box;

[0078] The backlight module further includes a first plastic frame 17, a second plastic frame 18 and a light-shielding tape 19. The first plastic frame 17 is disposed at one end of the bottom plate 112 and is in close contact with the inner wall of the side plate 111. The second plastic frame is disposed at the other end of the bottom plate 112 and is in close contact with the outer wall of the lampshade 113.

[0079] The liquid crystal box is arranged on the top of the first plastic frame 17 and the second plastic frame 18 to cover the backlight module;

[0080] One end of the light-shielding tape 19 is disposed between the contact surface of the liquid crystal cell and the first plastic frame 17 , and the other end is disposed on the end of the optical film 16 close to the first plastic frame 17 ;

[0081] The liquid crystal cell includes a lower polarizer 21 , a transistor 22 , a color filter 23 and a lower polarizer 24 which are sequentially arranged on a side of the optical film 16 away from the light guide plate 14 .

[0082] In applications, the liquid crystal cell may include but is not limited to a lower polarizer, a transistor (eg, a thin film transistor (TFT)), a color filter, a lower polarizer, etc. By injecting liquid crystal into the liquid crystal cell, the liquid crystal cell can form a display panel.

[0083] In application, the first plastic frame and the second plastic frame are used to support the liquid crystal box, so that the liquid crystal box can be covered with other structures of the backlight module.

[0084] It should be understood that Figure 1 、 Figure 2 The display device or its component structure shown is merely exemplary and does not constitute a limitation on the display device or its component structure. Certain structures may be added or deleted, or the location or implementation of certain structures may be changed according to actual needs.

[0085] In applications, since both the backlight source and the display panel generate heat when the display device is operating, the optical film expands due to heat, causing the refractive properties of light to change. This results in uneven light distribution to the display panel, affecting the brightness uniformity of the display panel image. Therefore, the first embodiment of the present application also provides a monitoring system for a backlight module or display device to address the problem of uneven light distribution caused by changes in the refractive properties of light due to thermal expansion of the optical film.

[0086] like Figure 2 As shown, the first embodiment of the present application provides a monitoring system, including:

[0087] The monitoring module 30 is configured to be disposed toward the optical film 16;

[0088] The control module (not shown) is electrically connected to the monitoring module 30 and is configured to:

[0089] Electrically connected to the heat dissipation module 4;

[0090] When the backlight source 15 is turned on, the warping amount of the optical film 16 is monitored by the monitoring module 30;

[0091] If the warping amount is within the preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module 4 to control the heat dissipation module 4 to perform a corresponding heat dissipation operation on the optical film 16 .

[0092] In application, since the backlight source generates heat when the backlight module starts working, when the backlight module is applied to a display device, the display panel of the display device also generates heat when it starts working. The circuit boards of the backlight module and the display panel may also generate heat when they start working. This heat causes the optical film to expand due to heat, resulting in a deformation extending in a direction parallel to the surface of the optical film (that is, the surface on the side away from the light guide plate). The deformation amount of the optical film extending in a direction parallel to the surface of the optical film is defined as the thermal expansion amount. When the thermal expansion amount of the optical film reaches a certain level, the surface of the optical film will warp, resulting in deformation of the edges or the middle. The deformation amount of the edge or the middle bending of the surface of the optical film is defined as the warping amount. If the warping amount is too large, the refractive properties of the optical film for light will change, so that the light cannot be evenly dispersed to the display panel, affecting the brightness uniformity of the display panel.

[0093] In application, the thermal expansion of the optical film can be monitored through the monitoring module first. When the thermal expansion is greater than the preset expansion threshold, the warping of the optical film can be further monitored through the monitoring module. The warping of the optical film can also be monitored directly through the monitoring module. Then, according to the size of the monitored warping, a corresponding heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to perform a heat dissipation operation corresponding to the size of the warping on the optical film, thereby reducing the heat acting on the optical film, reducing or even eliminating the thermal expansion phenomenon of the optical film, and thereby reducing or eliminating the warping phenomenon of the optical film.

[0094] like Figure 2 、 Figure 3 or Figure 4 As shown, in one embodiment, the monitoring module 30 includes:

[0095] The first monitoring unit 31 and the second monitoring unit 32 are configured to be disposed toward the optical film 16;

[0096] The control module is electrically connected to the first monitoring unit 31 and the second monitoring unit 32, and is specifically configured as follows:

[0097] When the backlight source 15 is turned on, the thermal expansion of the optical film 16 is monitored by the first monitoring unit 31;

[0098] If the thermal expansion is greater than the preset expansion threshold, the warping of the optical film is monitored by the second monitoring unit 32;

[0099] If the warping amount is within the preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module 4 to control the heat dissipation module 4 to perform a corresponding heat dissipation operation on the optical film 16 .

[0100] In use, the monitoring module may include two different monitoring units for monitoring the thermal expansion and warping of the optical film, respectively. The first monitoring unit first detects the thermal expansion of the optical film. If the thermal expansion exceeds a preset expansion threshold, the second monitoring unit further monitors the warping of the optical film. The first monitoring unit and the second monitoring unit may be positioned toward the same end of the optical film in a direction parallel to the surface of the optical film, or may be positioned toward two different ends of the optical film in a direction parallel to the surface of the optical film.

[0101] In application, the first monitoring unit may include any device capable of detecting the thermal expansion of the optical film, such as a pressure sensor, a displacement sensor, etc. The first monitoring unit may be disposed toward either end of the optical film in a direction parallel to the surface of the optical film. Figure 2 and Figure 3 exemplarily shown in FIG. 1 , the first monitoring unit 31 is disposed in the gap between the first frame 17 and the optical film 16 and faces one end of the optical film 16 close to the first plastic frame 17 .

[0102] In one embodiment, the first monitoring unit includes a pressure-sensitive sensor;

[0103] Accordingly, the control module is specifically configured as follows:

[0104] When the backlight module starts working, the pressure value applied to the pressure-sensitive sensor when the optical film expands due to heat is monitored by the pressure-sensitive sensor;

[0105] If the pressure value is greater than the preset pressure threshold, it is determined that the thermal expansion of the optical film is greater than the preset expansion threshold.

[0106] In application, the deformation of the optical film caused by thermal expansion, which extends in a direction parallel to the surface of the optical film, causes the end of the optical film to contact the pressure sensor and apply pressure to the pressure sensor. The pressure sensor generates an electrical signal when under pressure and sends it to the control module. The control module calculates the pressure value applied by the optical film to the pressure sensor based on the electrical signal. The magnitude of the thermal expansion is measured according to the magnitude of the pressure value. The pressure value can be made equal to the thermal expansion value, or the thermal expansion value can be defined as positively correlated with the pressure value. When the pressure value is greater than the preset pressure threshold, it can be determined that the thermal expansion of the optical film is greater than the preset expansion threshold. The preset pressure threshold can be set according to actual needs to be the critical value of the pressure applied to the pressure sensor when the optical film warps. Accordingly, the preset thermal expansion threshold is set based on the preset pressure threshold.

[0107] Figure 3 The schematic diagram of the optical film in contact with the pressure-sensitive sensor is shown as an example.

[0108] In another embodiment, the first monitoring unit includes a displacement sensor;

[0109] Accordingly, the control module is specifically configured as follows:

[0110] When the backlight module starts working, the displacement value of the optical film when it expands due to heat is monitored by the displacement sensor;

[0111] If the displacement value is greater than the preset displacement threshold, it is determined that the thermal expansion of the optical film is greater than the preset expansion threshold.

[0112] In use, thermal expansion of the optical film causes deformation extending parallel to the surface of the optical film, bringing the end of the optical film closer to the displacement sensor. This allows the displacement sensor to generate an electrical signal based on the change in distance between the end of the optical film and the displacement sensor, which is then transmitted to a control module. The control module then calculates the distance between the end of the optical film and the displacement sensor based on the electrical signal. Since the position of the displacement sensor is fixed and known, the displacement of the end of the optical film can be further calculated based on the distance between the end of the optical film and the displacement sensor and the position of the displacement sensor. The magnitude of thermal expansion can be measured based on the displacement value. The displacement value can be set equal to the thermal expansion value, or the thermal expansion value can be defined as positively correlated with the displacement value. When the displacement value exceeds a preset displacement threshold, it is determined that the thermal expansion of the optical film exceeds the preset expansion threshold. The preset displacement threshold can be set, as needed, to a critical value of the displacement of the end of the optical film, calculated based on the distance between the end of the optical film and the displacement sensor and the position of the displacement sensor, when warping of the optical film occurs. Accordingly, the preset thermal expansion threshold is set based on the preset displacement threshold.

[0113] In application, the first monitoring unit may also include a pressure-sensitive sensor and a displacement sensor at the same time. The pressure-sensitive sensor and the displacement sensor may be arranged toward the same end or different ends of the optical film. By making the first monitoring unit include both a pressure-sensitive sensor and a displacement sensor, dual monitoring of the thermal expansion amount may be achieved. When the thermal expansion amount detected by any sensor is greater than a preset expansion amount threshold, the second monitoring unit is triggered to further monitor the warping amount. In this way, the sensitivity and accuracy of monitoring the thermal expansion amount can be improved.

[0114] In application, the second monitoring unit may include any device capable of detecting the warping amount of the optical film, such as a camera, multiple pressure-sensitive sensors, multiple displacement sensors, etc., wherein multiple pressure-sensitive sensors or multiple proximity sensors may be distributed toward multiple different detection points on the surface of the optical film (for example, four end points and a monitoring point in the middle) to detect the pressure values ​​or displacement amounts of multiple different detection points on the optical film, and then determine the warping amount of the optical film based on the difference between the pressure values ​​or displacement amounts of the multiple different detection points.

[0115] In one embodiment, the second monitoring unit includes a camera;

[0116] Accordingly, the control module is specifically configured as follows:

[0117] If the thermal expansion is greater than a preset expansion threshold, a thermal expansion image of the optical film is captured by a camera;

[0118] The warping amount of the optical film is determined based on the thermal expansion image and an initial image of the optical film before thermal expansion.

[0119] In application, the camera may be disposed toward either end of the optical film in a direction parallel to the surface of the optical film, or toward the surface of the optical film. Figure 2 and Figure 3 exemplarily shown in FIG. 1 , the second monitoring unit 32 is disposed on a side of the lampshade 113 away from the light guide plate 14 and facing an end of the optical film 16 close to the lampshade 113 .

[0120] In one embodiment, the monitoring module includes a camera;

[0121] Accordingly, the control module is specifically configured as follows:

[0122] When the backlight source is on, the camera collects the thermal expansion image of the optical film;

[0123] determining a warping amount of the optical film according to the thermal expansion image and an initial image of the optical film before thermal expansion;

[0124] If the warping amount is within a preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to perform a corresponding heat dissipation operation on the optical film.

[0125] In application, the monitoring module may also only include a camera, and directly monitor the warping of the optical film through the camera. In this way, the structure of the monitoring system can be simplified, and the structure of the backlight module and the display device can be simplified, thereby reducing costs.

[0126] Figure 4 The schematic diagram of warping of an optical film is shown as an example.

[0127] In applications, the control module can be independently provided relative to the circuit board of the backlight unit (e.g., a printed circuit board (PCB)), or can be provided on the circuit board of the backlight unit. The control module can be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor, etc.

[0128] In one embodiment, the heat dissipation module includes at least one of an air cooling unit, an electric cooling unit, and a liquid cooling unit.

[0129] In practice, air cooling units offer advantages such as low cost, durability, wide applicability, and freedom from leakage and short circuits. Liquid cooling units offer excellent heat dissipation, dissipating a large amount of heat in a short period of time. Electric cooling units offer the advantage of high reliability. The air cooling unit can include at least one fan, while the electric cooling unit can include a heat pipe. The installation location of the fan or heat pipe can be designed according to actual needs, for example, on the outside of the baseplate. By simultaneously using two or more of the air, electric, and liquid cooling units to dissipate heat from the optical film, heat dissipation efficiency can be improved.

[0130] In practice, the heat dissipation module can be an existing structure of the backlight module or display device, or it can be an additional structure added to the backlight module or display device. When the heat dissipation module is an existing structure, the monitoring system only needs to include a monitoring module and a control module added to the backlight module to achieve heat dissipation from the optical film. This method of utilizing existing structures to achieve heat dissipation can effectively reduce manufacturing difficulty and save costs.

[0131] like Figure 5 As shown, the exemplary backlight module also includes a circuit board 20 arranged at the outer bottom of the back plate 11, and the heat dissipation module 4 includes two fans 41 and a heat dissipation pipe 42 arranged in the middle of the outer side of the back plate 11, and the two fans 41 are symmetrically located between the pipes of the heat dissipation pipe 42.

[0132] In one embodiment, the control module is further configured to:

[0133] If the warping amount is less than the lower limit of the preset warping amount range, a stop heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to stop performing the heat dissipation operation on the optical film;

[0134] If the warping amount is greater than an upper limit of a preset warping amount range, a extinguishing instruction is sent to the backlight source to control the backlight source to extinguish.

[0135] In application, when the display device is working, the higher the heat generated by the backlight source and the display panel, the greater the warping of the optical film. The heat dissipation power of the heat dissipation module can be set to be positively correlated with the warping amount. Alternatively, when the warping amount of the optical film is small (for example, lower than the lower limit of the preset warping amount range), the effect on the change of the refractive characteristics of the light is small, and it is not enough to affect the brightness uniformity of the display panel. The heat dissipation module can be started for heat dissipation; when the warping amount is large enough (for example, within the preset warping amount range), the effect on the change of the refractive characteristics of the light is large enough to affect the brightness uniformity of the display panel. The heat dissipation module can be started for heat dissipation; when the warping amount is too large (for example, higher than the upper limit of the preset warping amount range), the effect on the change of the refractive characteristics of the light is too large, which will seriously damage the display panel, the backlight source can be controlled to be extinguished, and the display panel can be controlled to stop working to prevent the backlight source and the display panel from continuing to generate heat from the source.

[0136] In one embodiment, the control module is specifically configured to:

[0137] If the warping amount is within a first preset warping amount range, an intermittent heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform an intermittent heat dissipation operation on the optical film;

[0138] If the warping amount is within the second preset warping amount range, a continuous heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform a continuous heat dissipation operation on the optical film, and the upper limit value of the first preset warping amount range is less than the lower limit value of the second preset warping amount range.

[0139] In an application, the preset warpage range can be divided into a lower first preset warpage range and a higher second preset warpage range. When the warpage is within the first preset warpage range, the control module can control the heat dissipation module to perform intermittent heat dissipation (for example, controlling the heat dissipation module to continuously start for a second time interval at intervals of a first time, the first time and the second time can be the same or different, for example, the first time is 1 minute and the second time is 2 minutes). When the warpage is less than the lower limit of the preset warpage range, the heat dissipation module can be controlled to stop performing the heat dissipation operation. When the warpage is within the second preset warpage range, the control module can control the heat dissipation module to perform continuous heat dissipation until the warpage is within the first preset warpage range, at which point the heat dissipation module can be controlled to perform intermittent heat dissipation.

[0140] In one embodiment, the control module is further configured to:

[0141] If the warping amount is within the preset warping amount range, or is greater than the upper limit of the preset warping amount range, an abnormal prompt instruction is sent to the prompt module to control the prompt module to send abnormal prompt information.

[0142] In the application, the control module controls the heat dissipation module to perform heat dissipation operations, or controls the backlight source to extinguish due to excessive warping, and controls the display panel to stop working. At the same time, it can also control the prompt module to issue corresponding abnormal prompts to remind the user that the heat generated by the backlight source and the display panel will affect the brightness uniformity of the display panel image, or seriously damage the display panel.

[0143] In applications, the prompt module can be a light alarm, an audible alarm, or a combination of the two. Correspondingly, the abnormality prompt information can be a light signal, an audible signal, or a combination of the two. The control module can control the prompt module to issue different abnormality prompts for situations where the warpage is within a preset warpage range and when it exceeds the upper limit of the preset warpage range, allowing the user to distinguish and take appropriate protective measures in a timely manner. The prompt module can be installed anywhere on the backlight module or display panel.

[0144] like Figure 6 As shown, the embodiment of the present application further provides a monitoring method executed by a control module, which can be executed by the control module when running a computer program with corresponding functions, including the following steps S1 and S2:

[0145] Step S1: When the backlight source is turned on, the warping amount of the optical film is monitored by the monitoring module;

[0146] Step S2: If the warping amount is within a preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to perform a corresponding heat dissipation operation on the optical film.

[0147] In one embodiment, step S1 includes:

[0148] Step S11: When the backlight source is turned on, the thermal expansion of the optical film is monitored by the first monitoring unit;

[0149] Step S12: If the thermal expansion is greater than a preset expansion threshold, the warping of the optical film is monitored by the second monitoring unit.

[0150] In one embodiment, step S11 includes:

[0151] When the backlight module starts working, the pressure value applied to the pressure-sensitive sensor when the optical film expands due to heat is monitored by the pressure-sensitive sensor;

[0152] If the pressure value is greater than a preset pressure threshold, it is determined that the thermal expansion of the optical film is greater than a preset expansion threshold;

[0153] Alternatively, step S11 includes:

[0154] When the backlight module starts working, the displacement value of the optical film when it expands due to heat is monitored by the displacement sensor;

[0155] If the displacement value is greater than a preset displacement threshold, it is determined that the thermal expansion of the optical film is greater than a preset expansion threshold;

[0156] Step S12 includes:

[0157] If the thermal expansion amount is greater than a preset expansion amount threshold, collecting a thermal expansion image of the optical film through the camera;

[0158] The warping amount of the optical film is determined based on the thermal expansion image and an initial image of the optical film before thermal expansion.

[0159] In one embodiment, step S12 includes:

[0160] When the backlight source is turned on, the camera collects a thermal expansion image of the optical film;

[0161] determining a warping amount of the optical film according to the thermal expansion image and an initial image of the optical film before thermal expansion;

[0162] If the warping amount is within a preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to perform a corresponding heat dissipation operation on the optical film.

[0163] In one embodiment, step S2 includes:

[0164] If the warping amount is within a first preset warping amount range, an intermittent heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform an intermittent heat dissipation operation on the optical film;

[0165] If the warping amount is within a second preset warping amount range, a continuous heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform a continuous heat dissipation operation on the optical film.

[0166] In one embodiment, the monitoring method further comprises the following steps:

[0167] If the warping amount is less than a lower limit of the preset warping amount range, a heat dissipation stop instruction is sent to the heat dissipation module to control the heat dissipation module to stop performing a heat dissipation operation on the optical film;

[0168] If the warping amount is greater than an upper limit of a preset warping amount range, a extinguishing instruction is sent to the backlight source to control the backlight source to extinguish.

[0169] In one embodiment, the monitoring method further comprises the following steps:

[0170] If the warping amount is greater than a lower limit value of a preset warping amount range, an abnormal prompt instruction is sent to the prompt module to control the prompt module to send abnormal prompt information.

[0171] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0172] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a control module, the steps in the above-mentioned various monitoring method embodiments can be implemented.

[0173] An embodiment of the present application provides a computer program product. When the computer program product runs on a control module, the control module can implement the steps in the above-mentioned various monitoring method embodiments when executed.

[0174] The present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by the control module, it can implement the steps of the above-mentioned various method embodiments. The computer program includes computer program code, which can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: a medium capable of carrying the computer program code to any entity or device, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electric carrier signal, a telecommunication signal and a software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk.

[0175] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0176] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0177] In the embodiments provided in this application, it should be understood that the disclosed structures and methods can be implemented in other ways. For example, the structural embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0178] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

[0179] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A monitoring system, characterized in that: Applied to a backlight module, the backlight module includes an optical film and a backlight source, and the monitoring system includes: A monitoring module is configured to be disposed toward the optical film; The control module is electrically connected to the monitoring module and is configured to: electrically connected to the heat dissipation module; When the backlight source is turned on, the warping amount of the optical film is monitored by the monitoring module; If the warping amount is within a preset warping amount range, a corresponding heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform a corresponding heat dissipation operation on the optical film; wherein the monitoring module includes: The first monitoring unit and the second monitoring unit are configured to be disposed toward the optical film; The control module is electrically connected to the first monitoring unit and the second monitoring unit, and is specifically configured to: When the backlight source is turned on, the thermal expansion of the optical film is monitored by the first monitoring unit; If the thermal expansion amount is greater than a preset expansion amount threshold, the warping amount of the optical film is monitored by the second monitoring unit.

2. The monitoring system according to claim 1, wherein: The first monitoring unit includes at least one of a pressure-sensitive sensor and a displacement sensor, and the second monitoring unit includes a camera; When the first monitoring unit includes a pressure-sensitive sensor, the control module is specifically configured to: When the backlight module starts working, the pressure value applied to the pressure-sensitive sensor when the optical film expands due to heat is monitored by the pressure-sensitive sensor; If the pressure value is greater than a preset pressure threshold, it is determined that the thermal expansion of the optical film is greater than a preset expansion threshold; When the first monitoring unit includes a displacement sensor, the control module is specifically configured as follows: When the backlight module starts working, the displacement value of the optical film when it expands due to heat is monitored by the displacement sensor; If the displacement value is greater than a preset displacement threshold, it is determined that the thermal expansion of the optical film is greater than a preset expansion threshold; The control module is further configured to: If the thermal expansion amount is greater than a preset expansion amount threshold, collecting a thermal expansion image of the optical film through the camera; The warping amount of the optical film is determined based on the thermal expansion image and an initial image of the optical film before thermal expansion.

3. The monitoring system according to claim 1, wherein: The monitoring module includes a camera; The control module is specifically configured as follows: When the backlight source is turned on, the camera collects a thermal expansion image of the optical film; determining a warping amount of the optical film according to the thermal expansion image and an initial image of the optical film before thermal expansion; If the warping amount is within a preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to perform a corresponding heat dissipation operation on the optical film.

4. The monitoring system according to any one of claims 1 to 3, characterized in that: The control module is specifically configured as follows: If the warping amount is within a first preset warping amount range, an intermittent heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform an intermittent heat dissipation operation on the optical film; If the warping amount is within a second preset warping amount range, a continuous heat dissipation instruction is issued to the heat dissipation module to control the heat dissipation module to perform a continuous heat dissipation operation on the optical film, and the upper limit value of the first preset warping amount range is less than the lower limit value of the second preset warping amount range.

5. The monitoring system according to any one of claims 1 to 3, characterized in that: The control module is further configured to: If the warping amount is less than a lower limit of the preset warping amount range, a heat dissipation stop instruction is sent to the heat dissipation module to control the heat dissipation module to stop performing a heat dissipation operation on the optical film; electrically connected to the backlight source; If the warping amount is within a preset warping amount range, or is greater than an upper limit of the preset warping amount range, a extinguishing instruction is issued to the backlight source to control the backlight source to extinguish.

6. The monitoring system according to any one of claims 1 to 3, characterized in that: The monitoring system is further configured to: electrically connected to the prompt module; If the warping amount is greater than a lower limit value of a preset warping amount range, an abnormal prompt instruction is sent to the prompt module to control the prompt module to send abnormal prompt information.

7. A monitoring method, characterized in that: Based on the monitoring system according to any one of claims 1 to 6, the monitoring method includes the following steps performed by the control module: When the backlight source is on, the thermal expansion of the optical film is monitored by the first monitoring unit in the monitoring module. If the thermal expansion is greater than a preset expansion threshold, the warping of the optical film is monitored by the second monitoring unit in the monitoring module. If the warping amount is within a preset warping amount range, a corresponding heat dissipation instruction is sent to the heat dissipation module to control the heat dissipation module to perform a corresponding heat dissipation operation on the optical film.

8. A backlight module, characterized in that: The invention comprises an optical film, a backlight source and the monitoring system according to any one of claims 1 to 6.

9. The backlight module according to claim 8, wherein: It also includes a circuit board and the heat dissipation module, and the control module is arranged on the circuit board.

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