Display device

Abstract

The display device improves the cooling efficiency of a reflective light modulation element. The display device includes: a base having a first surface and a second surface opposite to the first surface; a reflective light modulation element disposed on the first surface and electrically connected to the base; a drive circuit board having a third surface electrically connected to the second surface and a fourth surface opposite to the third surface, for driving the reflective light modulation element; a vapor chamber having a heated portion for receiving heat transferred from the outside, a heat dissipation portion for dissipating heat, and a fluid receiving chamber for collecting working fluid, wherein the working fluid changes from a liquid phase to a gas phase at the heated portion due to the received heat, and changes from a gas phase to a liquid phase at the heat dissipation portion; and a heat dissipation component connected to the heat dissipation portion in a manner enabling heat transfer, the heated portion having a first region facing the second surface and a second region facing the fourth surface, the first region protruding towards the base than the second region and connected to the second surface in a manner enabling heat transfer.

Description

Technical Field

[0001] This disclosure relates to display devices. Background Technology

[0002] Conventionally, projectors are known to use a light modulation element to modulate light emitted from a light source to form image light and project the formed image light. In such projectors, the light modulation element is a component that is prone to degradation due to heat, thus requiring efficient cooling of the light modulation element. To address this problem, projection-type display devices are known to dissipate the heat generated by the light modulation element through a heat sink connected to the light modulation element (see, for example, Patent Document 1).

[0003] The projection-type display device described in Patent Document 1 uses a DMD (Digital Micromirror Device) element as a reflective light modulation element. In the DMD element, a rear surface cooling unit is provided on the rear surface opposite to the front surface where light is incident. The rear surface cooling unit cools the DMD element from the rear surface. The rear surface cooling unit is, for example, a combination of a heat sink and a fan.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2010-32945

[0005] However, in the component rear surface cooling unit described in Patent Document 1, the surface of the heat sink that connects to the rear surface of the DMD component is only a portion of the surface of the heat sink on the side closest to the DMD component. Therefore, heat transferred from the DMD component to the heat sink is difficult to transfer to the entire heat sink, and the heat dissipation efficiency of the heat transferred from the DMD component may be insufficient. Especially when the DMD component is small and the heat density of the contact portion of the heat sink with the DMD component is high, uneven heat distribution is easily generated within the heat sink, making it difficult to improve the heat dissipation efficiency of the heat transferred from the DMD component.

[0006] Therefore, a structure that can improve the cooling efficiency of reflective optical modulation elements is desired. Summary of the Invention

[0007] One aspect of the display device disclosed herein includes: a base having a first surface and a second surface opposite to the first surface; a reflective light modulation element disposed on the first surface and electrically connected to the base; a drive circuit board having a third surface electrically connected to the second surface and a fourth surface opposite to the third surface, for driving the reflective light modulation element; a vapor chamber having a heated portion for receiving heat transferred from the outside, a heat dissipation portion for dissipating heat, and a fluid receiving chamber for receiving working fluid, the working fluid changing from a liquid phase to a gas phase at the heated portion by the received heat, and changing from a gas phase to a liquid phase at the heat dissipation portion; and a heat dissipation component connected to the heat dissipation portion in a manner capable of heat transfer, the heated portion having a first region facing the second surface and a second region facing the fourth surface, the first region protruding towards the base side than the second region and connected to the second surface in a manner capable of heat transfer. Attached Figure Description

[0008] Figure 1 This is a schematic diagram showing the structure of the projector in the first embodiment.

[0009] Figure 2 This is a cross-sectional view showing the display device in the first embodiment.

[0010] Figure 3 This is a cross-sectional view showing the display device included in the projector in the second embodiment.

[0011] Figure 4 This is a cross-sectional view showing the display device of the projector in the third embodiment.

[0012] Label Explanation

[0013] 1: Projector; 34B, 34G, 34R, 36, 37: Display device; 4: Light modulation unit; 41: Base; 41A: Support surface (first surface); 41B: Contact surface (second surface); 42: Reflective light modulation element; 42A: Emission surface (image emission surface); 42B: Opposing surface; 43: Light-transmitting component; 44: Support frame; 441: Outer peripheral surface; 45: Welding component; 46: Drive circuit board; 46A: Mounting surface (third surface); 46B: Opposing surface (fourth surface); 46C: Penetrated part; 46C1: Inner surface; 47: Contact point; 48: Clamping component; 5: Cooling section; 51: Steam chamber; 52: Heated section; 53: First area; 53A: Connecting surface; 53B: Side; 54: Second area; 54A: Connecting surface; 55: Heat dissipation section; 56: Fluid collection chamber; 57: Mesh; 58: Column; 59: Heat dissipation component; 591: Fin; 61: Steam chamber; 62: Bending section; 63: Connecting section; 64: Heat dissipation component; 65: Shell; 651: Liquid collection section; 652: Outflow section; 653: Inflow section; 71: Radiator; 72, 73: Piping; S: Space; WR: Lead wire. Detailed Implementation

[0014] [First Implementation]

[0015] Hereinafter, the first embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0016] [Structure of a projector]

[0017] Figure 1 This is a schematic diagram showing the general structure of the projector 1 in this embodiment.

[0018] In this embodiment, the projector 1 modulates light emitted from a light source to form image light corresponding to image information, and projects the formed image light onto a projection surface such as a screen. Figure 1 As shown, the projector 1 includes: an outer casing 2, which constitutes the outer casing of the projector 1; and an image projection device 3, which is housed within the outer casing 2. Furthermore, although not shown in the figures, the projector 1 includes a power supply unit and a control unit housed within the outer casing 2. The power supply unit supplies power to the electronic components of the projector 1. The control unit controls the operation of the projector 1.

[0019] [Structure of the image projection device]

[0020] The image projection device 3 generates image light corresponding to the image signal input from the control device and projects the generated image light. The image projection device 3 includes an illumination device 31, a relay device 32, a dichroic prism 33, a display device 34 (34R, 34G and 34B) and a projection optics device 35.

[0021] [Structure of the lighting device]

[0022] The lighting device 31 emits illumination light with a substantially uniform illuminance distribution and consistent polarization direction to the relay device 32. That is, the lighting device 31 emits illumination light containing red light, green light, and blue light modulated by the display device 34. The lighting device 31 has a light source device 31A and a homogenization device 31B.

[0023] [Structure of the light source device]

[0024] The light source device 31A emits light into the homogenization device 31B. The light source device 31A includes a light-emitting element 311, a light-concentrating element 312, a wavelength conversion device 313, and a parallelization lens 314.

[0025] The light-emitting element 311 is a laser source that emits laser light. In this embodiment, the laser light emitted by the light-emitting element 311 is, for example, blue light with a peak wavelength of about 445 nm.

[0026] The light-emitting element 311 can be composed of one light-emitting element or multiple light-emitting elements.

[0027] The focusing element 312 converges the light beam incident from the light-emitting element 311 and directs it to the wavelength conversion device 313. The focusing element 312 is composed of two lenses 3121 and 3122, but the number of lenses constituting the focusing element 312 is not limited to 2.

[0028] The wavelength conversion device 313 converts a portion of the blue light incident as excitation light into green and red light, and emits the light containing blue, green, and red light to the side opposite to the incident side of the blue light. The wavelength conversion device 313 has a wavelength conversion element 3131 and a motor 3135 that rotates the wavelength conversion element 3131.

[0029] Wavelength conversion element 3131 is a transmission-type wavelength conversion element that emits converted light along the incident direction of the excitation light. Wavelength conversion element 3131 has a disk 3132, a wavelength conversion layer 3133, and a selective reflection layer 3134, and has a structure in which the wavelength conversion layer 3133 and the selective reflection layer 3134 are formed on the disk 3132 along the circumference of the disk 3132. The wavelength conversion layer 3133 contains a phosphor that converts the wavelength of the incident light. The selective reflection layer 3134 is disposed on the blue light incident side relative to the wavelength conversion layer 3133, allowing blue light to pass through and reflecting green and red light.

[0030] The motor 3135 causes the wavelength conversion element 3131 to rotate about a rotation axis along the incident direction of the blue light relative to the wavelength conversion device 313.

[0031] The parallelizing lens 314 parallelizes the light emitted from the wavelength conversion element 3131.

[0032] In this light source device 31A, a portion of the blue light emitted from the light-emitting element 311 passes through the wavelength conversion layer 3133, while the remaining blue light is converted into green and red light by the wavelength conversion layer 3133. The green and red light emitted from the wavelength conversion layer 3133 that is directed toward the incident side of the blue light is reflected by the selective reflection layer 3134. Thus, the wavelength conversion element 3131 emits white light containing blue, green, and red light toward the side opposite to the incident side of the blue light.

[0033] The white light emitted from the wavelength conversion element 3131 is parallelized by the parallelization lens 314 and then incident on the homogenization device 31B.

[0034] Furthermore, the light source device 31A employs a transmissive wavelength conversion element 3131. However, it is not limited to this; the light source device 31A may also have a reflective wavelength conversion element that emits converted light, obtained by converting the wavelength of the excitation light, in a direction opposite to the incident direction of the excitation light. In this case, the reflective wavelength conversion element can convert almost all of the incident blue light into red and green light, or it can convert a portion of the incident blue light into red and green light. In the former case, the light source device 31A may also be configured to emit white light generated by combining the green and red light converted by the reflective wavelength conversion element into blue light.

[0035] [Structure of the homogenization device]

[0036] The homogenization device 31B homogenizes the illuminance distribution of white light incident from the light source device 31A and aligns the polarization direction of the white light so that it is emitted as illumination light. The homogenization device 31B includes a first lens array 315, a second lens array 316, a polarization conversion element 317, and an overlapping lens 318.

[0037] The polarization conversion element 317 converts one linearly polarized component of the incident light into the other linearly polarized component, thereby emitting light with the same polarization direction. In this embodiment, the polarization conversion element 317 converts the s-polarized component to emit the p-polarized component, but it can also be configured to convert the p-polarized component to emit the s-polarized component.

[0038] [Structure of the relay device]

[0039] The relay device 32 guides the illumination light emitted from the illumination device 31 to the dichroic prism 33. The relay device 32 includes a total reflection mirror 321, a polarization separation device 322, and a parallelizing lens 323.

[0040] The total reflection mirror 321 causes the illumination light incident from the illumination device 31 to be reflected toward the polarization separation device 322.

[0041] The polarization separation device 322 is a so-called plate-type polarization beam splitter (PBS). The polarization separation device 322 allows one of the p-polarized light and the s-polarized light to pass through, while reflecting the other polarized light.

[0042] In this embodiment, since the polarization component of the light emitted from the homogenizing device 31B is the same as the p-polarization component, the polarization separating device 322 allows the p-polarization component to pass through and reflects the s-polarization component. Therefore, the light incident from the total reflection mirror 321 onto the polarization separating device 322 passes through the polarization separating device 322, and then enters the dichroic prism 33 via the parallelizing lens 323.

[0043] On the other hand, the modulated light, which is modulated by the display device 34 described later and incident from the dichroic prism 33, is reflected by the polarization separation device 322 and incident on the projection optical device 35.

[0044] A parallelizing lens 323 is disposed between the polarization separating device 322 and the dichroic prism 33. The parallelizing lens 323 parallelizes the light incident from the polarization separating device 322 onto the dichroic prism 33.

[0045] [Structure of a dichroic prism]

[0046] The dichroic prism 33 separates the three colored lights—red (R), green (G), and blue (B)—from the illumination light incident from the relay device 32 and guides them to the three display devices 34 (34R, 34G, 34B). The dichroic prism 33 synthesizes the colored lights R, G, and B modulated by the display devices 34R, 34G, and 34B, and emits an image light composed of the synthesized three colored lights R, G, and B. In other words, the dichroic prism 33 can be described as a color separation and synthesis device that separates the three colored lights R, G, and B from the illumination light and synthesizes the modulated three colored lights R, G, and B.

[0047] The dichroic prism 33 is a so-called gapless prism. The dichroic prism 33 has a first prism 331, a second prism 332, a third prism 333, a first color separation layer 334 and a second color separation layer 335, and has a structure that combines each prism 331 to 333.

[0048] The first prism 331 is formed in the shape of a triangular prism and is positioned closest to the parallelizing lens 323 among all prisms 331 to 333. In other words, the first prism 331 is positioned opposite the parallelizing lens 323.

[0049] The first prism 331 has an incident and exit surface 3311. Illumination light, parallelized by the parallelizing lens 323, is incident on the incident and exit surface 3311. In addition, the incident and exit surface 3311 emits image light synthesized by the dichroic prism 33.

[0050] The first prism 331 and the second prism 332 are joined together. A first color separation layer 334 is provided between the first prism 331 and the second prism 332. The first color separation layer 334 reflects the red light R in the light incident through the incident and exit surfaces 3311, and allows the green light G and the blue light B to pass through.

[0051] The red light R reflected by the first color separation layer 334 is incident on the incident-exit surface 3311 at an angle above the critical angle. Therefore, after being reflected by the inner surface at the incident-exit surface 3311, the red light R is emitted from the exit surface 3312 of the first prism 331 toward the display device 34R.

[0052] Blue light B and green light G, which have passed through the first color separation layer 334, are incident on the second prism 332.

[0053] The second prism 332 is formed as a quadrangular prism with a generally trapezoidal cross-section and is joined with the first prism 331 and the third prism 333. A second color separation layer 335 is disposed between the second prism 332 and the third prism 333 to reflect blue light B and transmit green light G. The second color separation layer 335 and the first color separation layer 334 are tilted at different angles relative to the central axis of the light incident from the parallelization lens 323 to the incident-exit surface 3311.

[0054] The blue light B from the blue light B and the green light G incident from the first color separation layer 334 onto the second prism 332 is reflected by the second color separation layer 335, travels within the second prism 332, and is emitted from the emission surface 3321 of the second prism 332 toward the display device 34B.

[0055] The blue light B and the green light G from the blue light B incident on the second prism 332 from the first color separation layer 334 pass through the second color separation layer 335 and are incident on the third prism 333.

[0056] The third prism 333, like the second prism 332, is formed into a quadrangular prism with a roughly trapezoidal cross-section and is joined with the second prism 332. The green light G incident from the second color separation layer 335 onto the third prism 333 is emitted from the emission surface 3331, which is located in the direction of travel of the green light G and is roughly parallel to the incident emission surface 3311, toward the display device 34G.

[0057] Then, the colored lights R, G, B modulated by the display devices 34R, 34G, 34B are synthesized along the opposite paths from the incident exit surface 3311 to the colored lights R, G, B of each display device 34R, 34G, 34B, and emitted as image light from the incident exit surface 3311 to the parallelization lens 323.

[0058] [Simplified Structure of the Display Device]

[0059] Multiple display devices 34 modulate corresponding colors of the three colors of light: red, green, and blue (R, G, B). The multiple display devices 34 include a display device 34R that modulates red light (R), a display device 34G that modulates green light (G), and a display device 34B that modulates blue light (B). Each display device 34R, 34G, and 34B emits the modulated color light in a direction opposite to the incident direction of the color light.

[0060] The structure of such a display device 34 will be described in detail later.

[0061] [Structure of the projection optical device]

[0062] The projection optics 35 projects the image light reflected by the polarization separation device 322 onto the projection surface. Although detailed illustrations are omitted, the projection optics 35 is configured as a group of lenses having multiple lenses and a lens barrel housing the multiple lenses.

[0063] [Detailed Structure of the Display Device]

[0064] Figure 2 This is a cross-sectional view showing the display device 34. Furthermore, in Figure 2 In the display device 34, among the multiple fins 591 of the heat dissipation component 59, only a portion of the fins 591 are labeled.

[0065] As described above, the display device 34 modulates the incident colored light and emits the modulated colored light in a direction opposite to the incident direction of the colored light. Figure 2 As shown, the display device 34 has a structure that combines the light modulation unit 4 and the cooling unit 5.

[0066] [Structure of the optical modulation section]

[0067] The light modulation unit 4 modulates the incident colored light. The light modulation unit 4 includes a base 41, a reflective light modulation element 42, a light-transmitting component 43, a support frame 44, a welding component 45, a drive circuit board 46, a contact 47, and a clamping component 48.

[0068] Furthermore, in the following description, the three mutually perpendicular directions are designated as the +X direction, +Y direction, and +Z direction. The +Z direction is defined as the direction in which the colored light is incident on the display device 34, and the two directions perpendicular to and mutually perpendicular to the +Z direction are designated as the +X direction and +Y direction. Additionally, although the illustration is omitted, the direction opposite to the +Z direction, i.e., the direction in which the modulated colored light is emitted, is designated as the -Z direction, the direction opposite to the +X direction is designated as the -X direction, and the direction opposite to the +Y direction is designated as the -Y direction.

[0069] [Structure of the base]

[0070] The base 41 is, for example, a substrate containing aluminum nitride, supporting the reflective light modulation element 42. The base 41 has a support surface 41A and a contact surface 41B.

[0071] The support surface 41A is equivalent to the first surface. The support surface 41A is the surface in the base 41 facing the -Z direction. The base 41 uses the support surface 41A to support the reflective optical modulation element 42 and the support frame 44.

[0072] Contact surface 41B is equivalent to the second surface. Contact surface 41B is the surface in the base 41 facing the +Z direction, and the first region 53 of the steam chamber 51, described later, contacts contact surface 41B.

[0073] [Structure of a reflective optical modulation element]

[0074] The reflective light modulation element 42 modulates the incident colored light for each pixel and emits the modulated colored light in the opposite direction to the incident direction of the colored light. The reflective light modulation element 42 is disposed on the support surface 41A of the base 41 and is electrically connected to the base 41 via a lead WR. In this embodiment, the reflective light modulation element 42 is composed of a DMD element.

[0075] The reflective light modulation element 42 has an emission surface 42A and an opposing surface 42B.

[0076] The emission surface 42A is the surface on which the colored light is incident, and it is also the surface on which the modulated colored light is emitted. That is, the emission surface 42A is the image emission surface in the reflective light modulation element 42 from which the image is emitted.

[0077] Opposing surface 42B is the surface opposite to the injection surface 42A. Opposing surface 42B is opposite to the support surface 41A of the base 41.

[0078] [Structure of light-transmitting components]

[0079] The light-transmitting component 43 is a plate-shaped component that is light-transmitting and rectangular when viewed from the -Z direction. The light-transmitting component 43 is disposed in the optical path of the colored light incident on the reflective light modulation element 42, and also in the optical path of the colored light emitted from the reflective light modulation element 42. That is, the light-transmitting component 43 faces the emission surface 42A of the reflective light modulation element 42 and is disposed on the side opposite to the base 41 relative to the reflective light modulation element 42. Specifically, when viewed from the -Z direction, the light-transmitting component 43 is disposed to cover the entire reflective light modulation element 42. This light-transmitting component 43 is supported by a support frame 44.

[0080] [Structure of support frame and welded components]

[0081] The support frame 44, while supporting the light-transmitting member 43, is welded to the base 41 via the welding member 45. That is, the support frame 44 supports the light-transmitting member 43 and is disposed on the base 41. Furthermore, the welding member 45 is formed of a metallic material such as solder. That is, the welding member 45 is thermally conductive.

[0082] The support frame 44 contacts the circumferential side of the light-transmitting member 43, centered on the axis along the +Z direction. That is, the support frame 44 contacts the sides of the rectangular light-transmitting member 43 in both the ±X and ±Y directions. Furthermore, the +Z direction surface of the support frame 44 is welded to the base 41 via the welding member 45. Therefore, the space S surrounded by the support surface 41A of the base 41, the light-transmitting member 43, the support frame 44, and the welding member 45 is sealed.

[0083] Here, the support frame 44 can be formed of a thermally conductive metal. Thus, a portion of the heat generated by the reflective light modulation element 42 is transferred via gas within space S to the light-transmitting component 43 and the support frame 44. The heat transferred to the light-transmitting component 43 is transferred to the support frame 44. The heat transferred to the support frame 44 is transferred to the base 41 via the welding component 45.

[0084] [Structure of the driving circuit board and contacts]

[0085] The driving circuit board 46 is electrically connected to the base 41 and is a substrate for driving the reflective light modulation element 42 disposed on the base 41. It is formed, for example, from glass epoxy resin. The driving circuit board 46 is disposed in the +Z direction relative to the base 41. In other words, the driving circuit board 46 is disposed on the side opposite to the reflective light modulation element 42 relative to the base 41.

[0086] The drive circuit board 46 has a mounting surface 46A, an opposing surface 46B, and an insertion portion 46C.

[0087] Mounting surface 46A corresponds to the third surface. Mounting surface 46A is the surface of the drive circuit board 46 facing the -Z direction, and is electrically connected to the contact surface 41B of the base 41 via contact 47. Contact 47 is formed of a metal that is not only conductive but also thermally conductive.

[0088] Opposing surface 46B corresponds to the fourth surface. Opposing surface 46B is the surface of the drive circuit board 46 facing the +Z direction, and is opposite to the vapor chamber 51 of the cooling section 5 in the +Z direction.

[0089] The penetrated portion 46C is the portion of the first region 53 in the steam chamber 51 that penetrates along the -Z direction. In this embodiment, the penetrated portion 46C is a through-hole that penetrates the drive circuit board 46 along the +Z direction, as will be described in detail later, but the first region 53 of the steam chamber 51 is penetrated by the penetrated portion 46C along the -Z direction and connected to the contact surface 41B of the base 41. In addition, the inner surface 46C1 of the penetrated portion 46C is connected to the side surface 53B of the first region 53 in a manner that allows for heat transfer. In other words, the inner surface 46C1 of the penetrated portion 46C, which faces the first region 53, is connected to the side surface 53B of the first region 53 in a manner that allows for heat transfer.

[0090] A flexible substrate (not shown) is connected to the drive circuit board 46 to supply image signals or power. The flexible substrate can be connected to either the mounting surface 46A or the opposing surface 46B of the drive circuit board 46, but is preferably connected to the mounting surface 46A that is opposite to the steam chamber 51.

[0091] [Structure of clamping components]

[0092] The clamping member 48 is disposed in the +Z direction relative to the drive circuit board 46. That is, the clamping member 48 is clamped between the drive circuit board 46 and the second region 54 in the vapor chamber 51 (described later). The clamping member 48 can be made of, for example, a thermally conductive sheet, or an insulating sheet.

[0093] [Structure of the cooling section]

[0094] The cooling unit 5 cools the optical modulation unit 4. Specifically, the cooling unit 5 cools the reflective optical modulation element 42 by dissipating the heat generated by the reflective optical modulation element 42. The cooling unit 5 has a vapor chamber 51 and a heat dissipation component 59.

[0095] [Structure of the steam chamber]

[0096] The vapor chamber 51 is a heat diffusion element that diffuses and transfers heat from the reflective light modulation element 42, which is transmitted from the base 41 and the drive circuit board 46, to the heat dissipation component 59. The main part of the vapor chamber 51 is disposed on the side opposite to the base 41, i.e., in the +Z direction, relative to the drive circuit board 46. The vapor chamber 51 has a heated part 52 and a heat dissipation part 55.

[0097] The heated portion 52 is the part in the steam chamber 51 that receives heat from the outside. The heated portion 52 is disposed in the steam chamber 51 on a surface in the -Z direction. The heated portion 52 is connected to the light modulation unit 4 in a manner capable of heat transfer, and receives heat transferred from the light modulation unit 4. The heated portion 52 has a first region 53 and a second region 54.

[0098] Viewed from the -Z direction, the first region 53 corresponds to the penetration portion 46C of the drive circuit board 46 and is opposite to the contact surface 41B. The first region 53 protrudes from the second region 54 toward the base 41 side, i.e., in the -Z direction, and penetrates the penetration portion 46C in the -Z direction. In the first region 53, the connecting surface 53A, which is the surface on the base 41 side, is a flat surface, and the connecting surface 53A is connected to the contact surface 41B of the base 41 in a manner that allows for heat transfer. Furthermore, a thermally conductive grease GR is sandwiched between the connecting surface 53A and the contact surface 41B. That is, the display device 34 has a thermally conductive grease GR disposed between the contact surface 41B and the connecting surface 53A, which is the portion in the first region 53 opposite to the contact surface 41B. The heat of the reflective light modulation element 42 is transferred from the contact surface 41B to the first region 53 via the grease GR.

[0099] In the first region 53, the side 53B facing the direction perpendicular to the +Z direction is connected to the inner surface 46C1 of the inserted portion 46C in a manner that allows for heat transfer. Specifically, in the first region 53, the side 53B facing the +X, -X, +Y, and -Y directions are connected to the inner surface 46C1 of the inserted portion 46C in a manner that allows for heat transfer. Therefore, a portion of the heat transferred to the reflective light modulation element 42 of the drive circuit board 46 is transferred to the first region 53 via the inner surface 46C1.

[0100] Viewed from the -Z direction, the second region 54 corresponds to the opposing surface 46B of the driving circuit substrate 46, and is opposite to the opposing surface 46B. A clamping member 48 is connected to the connecting surface 54A in the -Z direction of the second region 54 in a manner that allows for heat transfer. That is, the second region 54 is connected to the opposing surface 46B of the driving circuit substrate 46 via the clamping member 48 in a manner that allows for heat transfer. Therefore, another portion of the heat transferred to the reflective light modulation element 42 of the driving circuit substrate 46 is transferred to the second region 54.

[0101] Furthermore, the distance between the second region 54 and the opposing surface 46B is greater than the distance between the first region 53 and the contact surface 41B. In other words, the distance between the first region 53 and the contact surface 41B is less than the distance between the second region 54 and the opposing surface 46B. Therefore, the first region 53 can be easily connected to the base 41 in a heat-transferable manner, and the heat generated by the reflective light modulation element 42 can be easily transferred to the first region 53. The distance between the base 41 and the reflective light modulation element 42 is shorter than the distance between the drive circuit board 46 and the reflective light modulation element 42.

[0102] The heat dissipation section 55 is the part in the steam chamber 51 that transfers heat to the outside. The heat dissipation section 55 is provided on a surface in the steam chamber 51 in the +Z direction. The surface in the steam chamber 51 where the heat dissipation section 55 is provided is a flat surface, and the heat dissipation component 59 is mounted on the heat dissipation section 55 in a manner that enables heat transfer.

[0103] Inside the steam chamber 51, a fluid receiving chamber 56 is provided, which receives a working fluid capable of phase change between a gas phase and a liquid phase. Furthermore, a mesh 57 is provided on the inner surface of the fluid receiving chamber 56 to hold and transport the liquid working fluid. In other words, the steam chamber 51 has: a fluid receiving chamber 56 that receives the working fluid; and a mesh 57 disposed on the inner surface of the fluid receiving chamber 56.

[0104] The fluid receiving chamber 56 contains the working fluid sealed in a depressurized state. The liquid phase of the working fluid contained in the fluid receiving chamber 56 vaporizes in the heat transfer section from the outside. For example, the liquid phase of the working fluid held in the mesh 57 vaporizes on the inner surface corresponding to the connection surface 53A of the first region 53 connected to the base 41, and on the inner surface corresponding to the side surface 53B of the first region 53 connected to the inner surface 46C1 of the drive circuit board 46, through the heat transferred by the reflective light modulation element 42. In addition, the liquid phase of the working fluid vaporizes on the inner surface corresponding to the connection surface 54A of the second region 54 connected to the drive circuit board 46 in a heat transfer manner through the heat transferred by the reflective light modulation element 42.

[0105] The vaporized working fluid circulates within the fluid receiving chamber 56 and condenses in the heat dissipation section 55, which is a low-thermal-density section, transforming into a liquid working fluid. This liquid working fluid is held within the mesh 57 and, through capillary force within the mesh 57, is transported to a high-thermal-density section, such as the section where heat from the reflective light modulation element 42 is transferred. Thus, the heat from the reflective light modulation element 42 transferred to the vapor chamber 51 diffuses throughout the fluid receiving chamber 56 in the form of the working fluid and is transferred to the outside via the heat dissipation section 55.

[0106] In addition, a plurality of columns 58 extending along the +Z direction are provided in the fluid receiving chamber 56. That is, the steam chamber 51 has a plurality of columns 58 provided in the fluid receiving chamber 56.

[0107] Multiple pillars 58 connect the inner surfaces corresponding to the heated portion 52 and the inner surfaces corresponding to the heat dissipation portion 55, respectively. Specifically, viewed from the +Z or -Z direction, the multiple pillars 58 are arranged corresponding to the second region 54. In other words, viewed from the +Z or -Z direction, the multiple pillars 58 are not located in the first region 53.

[0108] The strength of the steam chamber 51 can be ensured by using such multiple columns 58.

[0109] Here, the flatness of the portion with multiple pillars 58 tends to increase. That is, it is difficult to make the portion with multiple pillars 58 flat. To address this, no pillars 58 are provided in the first region 53. Therefore, the flatness of the connecting surface 53A, which is connected to the contact surface 41B of the base 41 in a manner that allows for heat transfer, can be reduced, and the contact area between the contact surface 41B and the connecting surface 53A can be increased. Therefore, heat can be easily transferred from the base 41 to the first region 53.

[0110] [Structure of heat dissipation components]

[0111] The heat dissipation component 59 is disposed on the heat dissipation section 55 in a manner capable of heat transfer, and is a metal heat sink that dissipates heat transferred from the steam chamber 51. The heat dissipation component 59 has a plurality of fins 591 extending to the side opposite to the steam chamber 51. Each of the plurality of fins 591 dissipates heat transferred to the heat dissipation component 59. In this way, by having the heat dissipation component 59 have a plurality of fins 591, the heat dissipation area of ​​the heat transferred to the heat dissipation component 59, i.e., the heat dissipation area of ​​the reflective optical modulation element 42, can be increased.

[0112] [Effects of the first embodiment]

[0113] The projector 1 of this embodiment described above has the following effects.

[0114] The display device 34 includes a base 41, a reflective light modulation element 42, a driving circuit board 46, a vapor chamber 51, and a heat dissipation component 59.

[0115] The base 41 has a support surface 41A and a contact surface 41B opposite to the support surface 41A. The support surface 41A corresponds to the first surface, and the contact surface 41B corresponds to the second surface.

[0116] A reflective light modulation element 42 is disposed on the support surface 41A and electrically connected to the base 41 to modulate the incident light.

[0117] The driving circuit board 46 has a mounting surface 46A electrically connected to the contact surface 41B and an opposing surface 46B opposite to the mounting surface 46A, driving the reflective light modulation element 42. The mounting surface 46A corresponds to the third surface, and the opposing surface 46B corresponds to the fourth surface.

[0118] The steam chamber 51 includes a heating section 52, a heat dissipation section 55, and a fluid receiving chamber 56. The heating section 52 receives heat transferred from the outside. The heat dissipation section 55 dissipates the heat. The fluid receiving chamber 56 receives the working fluid, which changes from a liquid phase to a gas phase at the heating section 52 due to the heat received, and changes from a gas phase to a liquid phase at the heat dissipation section 55.

[0119] The heat dissipation component 59 is connected to the heat dissipation unit 55 in a manner that enables heat transfer.

[0120] The heated portion 52 has a first region 53 and a second region 54. The first region 53 is opposite to the contact surface 41B, and the second region 54 is opposite to the opposing surface 46B. The first region 53 protrudes toward the base 41 compared to the second region 54, and is connected to the contact surface 41B in a manner that enables heat transfer.

[0121] According to this structure, the heat generated by the reflective light modulation element 42 is transferred to the base 41 on which the reflective light modulation element 42 is disposed. The heat transferred to the base 41 is transferred to the first region 53 in the vapor chamber 51, which is connected to the contact surface 41B of the base 41 in a manner that allows for heat transfer. Since the working fluid is contained in the fluid receiving chamber 56 of the vapor chamber 51, the liquid phase working fluid in the portion of the fluid receiving chamber 56 corresponding to the first region 53 vaporizes due to the heat transferred to the first region 53. The gaseous working fluid increases in volume and diffuses within the fluid receiving chamber 56, thus the heat transferred to the first region 53 diffuses within the fluid receiving chamber 56. The gaseous working fluid condenses and changes into a liquid phase at the inner surface of the heat dissipation section 55 connected to the heat dissipation member 59, and the liquid phase working fluid is again transported in the fluid receiving chamber 56 to the portion corresponding to the first region 53.

[0122] In this way, the heat of the reflective light modulation element 42 is diffused through the vapor chamber 51, thereby effectively reducing the heat density of the reflective light modulation element 42. Since a heat dissipation component 59 is provided in the heat dissipation section 55 of the vapor chamber 51, the heat of the reflective light modulation element 42 can be efficiently transferred to the heat dissipation component 59 through the vapor chamber 51. Therefore, the reflective light modulation element 42 can be effectively cooled. Furthermore, the structure of the vapor chamber 51 is a closed structure for the working fluid, thus preventing the display device 34 from becoming too large.

[0123] In the display device 34, the driving circuit board 46 has an insertion portion 46C corresponding to the reflective light modulation element 42. The first region 53 is inserted into the insertion portion 46C and connected to the contact surface 41B in a manner that enables heat transfer.

[0124] With this structure, even if the vapor chamber 51 is positioned on the side opposite to the base 41 relative to the drive circuit board 46, the first region 53 of the vapor chamber 51 can be connected to the contact surface 41B of the base 41 in a manner that allows for heat transfer. Therefore, the heat transferred to the contact surface 41B of the reflective light modulation element 42 can be efficiently transferred to the vapor chamber 51, thereby effectively cooling the reflective light modulation element 42.

[0125] In the display device 34, the driving circuit board 46 receives heat generated by the reflective light modulation element 42 on the mounting surface 46A via the contact surface 41B. Furthermore, the driving circuit board 46 transfers the received heat to the first region 53 through the portion of the inserted portion 46C opposite to the first region 53. The portion of the inserted portion 46C opposite to the first region 53 includes the portion of the heated portion 52 opposite to the side surface 53B of the protruding first region 53.

[0126] With this structure, the heat from the reflective light modulator 42 is transferred not only via the base 41 to the portion of the first region 53 opposite to the base 41, but also to the portion of the first region 53 opposite to the inserted portion 46C. This increases the path for heat transfer from the reflective light modulator 42 to the first region 53, thus enabling more efficient heat transfer from the reflective light modulator 42 to the first region 53. Consequently, the reflective light modulator 42 can be cooled more effectively.

[0127] The display device 34 has a heat-transferable grease GR disposed between a contact surface 41B and a connecting surface 53A, which is the portion in the first region 53 opposite to the contact surface 41B.

[0128] With this structure, even if a gap is formed between the contact surface 41B of the base 41 and the first region 53 of the vapor chamber 51, heat can be easily transferred from the contact surface 41B to the first region 53 through the grease GR. Therefore, the heat of the reflective light modulation element 42 can be efficiently cooled to the vapor chamber 51, thus enabling more effective cooling of the reflective light modulation element 42.

[0129] In the display device 34, the driving circuit board 46 receives heat generated by the reflective light modulation element 42 on the mounting surface 46A via the contact surface 41B. The driving circuit board 46 transfers the received heat from the opposing surface 46B to the second region 54 of the vapor chamber 51.

[0130] With this structure, in the vapor chamber 51, in addition to transferring heat from the reflective light modulator 42 to the first region 53 via the base 41, heat from the reflective light modulator 42 is also transferred to the second region 54 via the base 41 and the drive circuit board 46. Therefore, the path for heat transfer from the reflective light modulator 42 to the vapor chamber 51 can be increased, thus enabling more efficient cooling of the reflective light modulator 42.

[0131] In the display device 34, the steam chamber 51 has a plurality of pillars 58 disposed within the fluid receiving chamber 56, connecting the inner surface corresponding to the heated part 52 and the inner surface corresponding to the heat dissipation part 55. The plurality of pillars 58 are disposed corresponding to the second region 54.

[0132] With this structure, the strength of the steam chamber 51, in which the working fluid is vaporized and condensed, can be ensured by using multiple columns 58.

[0133] Furthermore, the portion of the steam chamber 51 with multiple pillars 58 is difficult to flatten. In other words, the portion of the steam chamber 51 with multiple pillars 58 is prone to unevenness. To address this, the portion of the steam chamber 51 with multiple pillars 58 is designated as the second region 54, thus making it easier to reduce the flatness of the connecting surface 53A of the first region 53, which faces the contact surface 41B of the base 41. Therefore, the contact area between the contact surface 41B and the connecting surface 53A can be increased, and heat from the reflective optical modulation element 42 can be efficiently transferred from the contact surface 41B to the first region 53.

[0134] In the display device 34, the distance between the first region 53 and the contact surface 41B is smaller than the distance between the second region 54 and the opposing surface 46B.

[0135] With this structure, since the pillar 58 is not provided in the first region 53, the flatness of the first region 53 will not be reduced even if multiple pillars 58 are manufactured. Therefore, the first region 53 can be easily connected to the contact surface 41B in a manner that allows for heat transfer. Therefore, heat can be easily transferred from the reflective light modulation element 42 to the first region 53 via the base 41.

[0136] In the display device 34, the heat dissipation component 59 has a plurality of fins 591.

[0137] With this structure, the heat dissipation area for heat transferred from the steam chamber 51 can be increased, thus promoting the condensation of the working fluid at the heat dissipation section 55 of the steam chamber 51. Therefore, the heat transferred from the reflective light modulation element 42 can be used to promote the vaporization of the working fluid in the first region 53, thereby improving the cooling efficiency of the reflective light modulation element 42.

[0138] [Second Implementation]

[0139] Next, the second embodiment of this disclosure will be described.

[0140] The projector of this embodiment has the same structure as the projector 1 of the first embodiment, but the structure of the steam chamber of the display device is different. Furthermore, in the following description, parts that are the same as or substantially the same as those already described are marked with the same reference numerals and their descriptions are omitted.

[0141] [General Structure of a Projector]

[0142] Figure 3 This is a cross-sectional view showing the display device 36 of the projector in this embodiment.

[0143] The projector in this embodiment, in addition to having Figure 3 The display device 36 shown replaces the display device 34 and has the same structure and function as the projector 1 in the first embodiment.

[0144] The display device 36 has the same structure and function as the display device 34, except that it has a steam chamber 61 instead of a steam chamber 51. That is, in this embodiment, the display device 36 has a light modulation unit 4 and a cooling unit 5 that has a steam chamber 61 instead of a steam chamber 51.

[0145] [Structure of the steam chamber]

[0146] The steam chamber 61, like the steam chamber 51 in the first embodiment, is a heat diffusion element. It is connected to the base 41, the drive circuit board 46, and the clamping member 48 in a manner that allows heat transfer, so that the heat from the reflective light modulation element 42 transferred from the base 41, the drive circuit board 46, and the clamping member 48 is diffused and transferred to the heat dissipation member 59. The steam chamber 61 has the same structure as the steam chamber 51, but it differs from the steam chamber 51 in that a part of the steam chamber 61 is connected to the outer peripheral surface 441 of the support frame 44 in a manner that allows heat transfer.

[0147] Specifically, in addition to having the same heating section 52, heat dissipation section 55, fluid collection chamber 56, mesh 57 and multiple column sections 58 as steam chamber 51, steam chamber 61 also has multiple bend sections 62 and multiple connecting sections 63.

[0148] The multiple bends 62 are portions that bend in the -Z direction from the end of the second region 54 on the side opposite to the first region 53. Figure 3In the example, one of the multiple bends 62, bend 62A, bends outward from its +X-direction end in the second region 54 and extends in the -Z-direction, then extends in the -X-direction. Additionally, one of the multiple bends 62, bends outward from its -X-direction end in the second region 54 and extends in the -Z-direction, then extends in the +X-direction. Furthermore, although not shown in the figure, another bend 62, bends outward from its +Y-direction end in the second region 54 and extends in the -Y-direction, then extends in the -Y-direction. And, although not shown in the figure, yet another bend 62, bends outward from its -Y-direction end in the second region 54 and extends in the -Z-direction, then extends in the +Y-direction.

[0149] Alternatively, instead of the bending portion 62, a bending portion may be provided in the second region 54 that bends in the -Z direction from the end opposite to the first region 53 and then bends again toward the base 41 and the support frame 44.

[0150] Multiple connecting portions 63 are respectively provided at corresponding bends 62 among the multiple bends 62. The multiple connecting portions 63 are connected to the outer peripheral surface 441 of the support frame 44 supporting the light-transmitting member 43 in a manner capable of heat transfer. For example, connecting portion 63A of the multiple connecting portions 63 provided at bend 62A is connected to the +X direction portion of the outer peripheral surface 441 of the support frame 44. Similarly, for example, connecting portion 63B of the multiple connecting portions 63 provided at bend 62B is connected to the -X direction portion of the outer peripheral surface 441 of the support frame 44. Furthermore, the same applies to connecting portions 63 provided at other bends 62.

[0151] Multiple connecting portions 63 receive heat transferred to the reflective light modulation element 42 by the support frame 44. That is, the multiple connecting portions 63 each constitute a heat-receiving portion 52.

[0152] Furthermore, the connecting portion 63 may not be connected to the support frame 44, but may be connected to the base 41 in a manner that allows for heat transfer; or it may be connected to the base 41 in addition to being connected to the support frame 44, in a manner that allows for heat transfer, thereby receiving heat transferred to the reflective light modulation element 42 from the base 41. Alternatively, the connecting portion 63 may also be connected to the mounting surface 46A of the drive circuit board 46.

[0153] [Effects of the second implementation method]

[0154] In addition to having the same effect as the projector 1 of the first embodiment, the projector described above also has the following effects.

[0155] The display device 36 includes a light-transmitting component 43 and a support frame 44. The light-transmitting component 43 is positioned opposite the emission surface 42A, which serves as the image emission surface, in the reflective light modulation element 42, and is located on the side opposite to the base 41. The support frame 44 supports the light-transmitting component 43 and is disposed on the base 41. The vapor chamber 61 is connected to the support frame 44 in a manner that allows for heat transfer and receives heat generated by the reflective light modulation element 42.

[0156] With this structure, the heat generated by the reflective light modulation element 42 that is transferred to the light-transmitting component 43 can be transferred to the vapor chamber 61 via the support frame 44. Therefore, the path of heat transfer from the reflective light modulation element 42 to the vapor chamber 61 can be increased, thus enabling more efficient cooling of the reflective light modulation element 42.

[0157] [Third Implementation]

[0158] Next, the third embodiment of this disclosure will be described.

[0159] The projector of this embodiment has the same structure as the projector 1 of the first embodiment, but the structure of the heat dissipation component is different. Furthermore, in the following description, parts that are the same as or substantially the same as those already described are marked with the same reference numerals and their descriptions are omitted.

[0160] [General Structure of a Projector]

[0161] Figure 4 This diagram shows the display device 37, heat sink 71, and piping 72 and 73 included in the projector of this embodiment.

[0162] The projector in this embodiment, in addition to having Figure 4 The display device 37 shown replaces the display device 34, and except that it also has a heat sink 71 and a plurality of pipes 72, 73, it has the same structure and function as the projector 1 of the first embodiment.

[0163] The display device 37 has the same structure and function as the display device 34, except that it has a heat dissipation component 64 instead of a heat dissipation component 59. That is, in this embodiment, the display device 37 includes a light modulation unit 4 and a cooling unit 5 having a vapor chamber 51 and a heat dissipation component 64.

[0164] Alternatively, the display device 37 may have a steam chamber 61 of the second embodiment instead of a steam chamber 51 of the first embodiment.

[0165] [Structure of radiator and piping]

[0166] First, the radiator 71 and the piping 72 and 73 will be explained.

[0167] The radiator 71 cools the coolant flowing from the heat dissipation component 64 via piping 72, and supplies the cooled coolant back to the heat dissipation component 64 via piping 73. The radiator 71 receives heat from the flowing coolant and transfers the received heat to cooling air flowing through a fan (not shown). Thus, the radiator 71 cools the coolant.

[0168] In addition, the cooling gas that has been heated in the radiator 71 is discharged to the outside of the outer casing 2.

[0169] [Structure of heat dissipation components]

[0170] Like heat dissipation component 59, heat dissipation component 64 is connected to the heat dissipation section 55 of the steam chamber 51 in a manner that enables heat transfer, and dissipates the heat transferred from the heat dissipation section 55. Specifically, heat dissipation component 64 dissipates the heat transferred from the heat dissipation section 55 to the cooling liquid flowing into the chamber. Heat dissipation component 64 includes a housing 65, an impeller 66, and a motor 67.

[0171] The housing 65 has a liquid receiving section 651, an outlet section 652, and an inlet section 653.

[0172] The liquid receiving section 651 receives the cooling liquid, the impeller 66, and a portion of the motor 67.

[0173] When the impeller 66 is rotated by the motor 67, the outlet 652 causes the cooling liquid in the liquid collection section 651 to flow outward.

[0174] The inflow section 653 allows cooling liquid flowing from the outside to flow into the liquid receiving section 651.

[0175] The outflow section 652 and the inflow section 653 are connected to the radiator 71 via multiple pipes 72 and 73 in a manner that allows the cooling liquid to flow.

[0176] The impeller 66 is disposed in the liquid collection section 651 and rotates by the motor 67.

[0177] Heat transferred from the heat dissipation section 55 of the steam chamber 51 to the housing 65 is transferred to the cooling liquid in the liquid collection section 651. When the impeller 66 is rotated by the motor 67, the heated cooling liquid flows out from the outlet 652 through the pipe 72 to the radiator 71. The heat transferred to the cooling liquid through the radiator 71 is transferred to the cooling gas flowing in the radiator 71. That is, a portion of the heat generated by the reflective light modulation element 42 is transferred to the cooling gas via the cooling liquid. Thus, the cooling liquid is cooled.

[0178] The coolant, after being cooled by the radiator 71, flows into the liquid collection section 651 through the inlet section 653 via the piping 73.

[0179] With such a heat dissipation component 64, the heat generated by the reflective light modulation element 42 and transferred to the vapor chamber 51 can be efficiently transferred to the cooling liquid. Therefore, the reflective light modulation element 42 can be cooled efficiently.

[0180] Furthermore, the projector of this embodiment has three display devices 37. One of the three display devices 37 modulates red light R, another modulates green light G, and the remaining display device 37 modulates blue light B. The three heat dissipation components 64 respectively disposed on the three display devices 37 can also be connected to the heat sink 71. In this case, the three heat dissipation components 64 can be connected in series or in parallel with the heat sink 71.

[0181] [Effects of the third embodiment]

[0182] In addition to having the same effect as the projector 1 of the first embodiment, the projector described above also has the following effects.

[0183] In the display device 37, the heat dissipation component 64 has a liquid receiving section 651 disposed inside the heat dissipation component 64 and for the cooling liquid to circulate inside and outside.

[0184] With this structure, heat from the reflective light modulation element 42 can be transferred to the cooling liquid flowing inside and outside the liquid receiving section 651, thus promoting the condensation of the working fluid at the heat dissipation section 55 of the vapor chamber 51. Therefore, the heat transferred from the reflective light modulation element 42 can be used to promote the vaporization of the working fluid in the first region 53 and the second region 54, thereby improving the cooling efficiency of the reflective light modulation element 42.

[0185] [Variations on the implementation method]

[0186] This disclosure is not limited to the above-described embodiments. Modifications and improvements within the scope of achieving the purpose of this disclosure are included in this disclosure.

[0187] In the embodiments described above, in the steam chambers 51 and 61, the heat dissipation portion 55 is disposed in the +Z direction relative to the heated portion 52. That is, the heat dissipation portion 55 is disposed on the surface in the +Z direction in the steam chambers 51 and 61. However, this is not a limitation, and the heat dissipation portion 55 may also be disposed in other parts of the steam chamber. Here, since the heat dissipation portion is disposed in a part with low heat density in the steam chamber, it is easy for the heat dissipation portion to become a part in which a heat dissipation component is disposed in the steam chamber. Therefore, depending on the arrangement position of the heat dissipation component in the steam chamber, the heat dissipation portion may also be disposed in other parts. For example, if, when viewed from the -Z direction, the surface in the -Z direction of the steam chamber extends outward from the light modulation portion 4, the heat dissipation portion may also be disposed on the surface in the -Z direction.

[0188] In the above embodiments, the penetration portion 46C, which is provided on the drive circuit board 46 and through which the first region 53 of the steam chambers 51 and 61 is inserted in the -Z direction, is a through-hole that passes through the drive circuit board 46. However, it is not limited to this; the penetration portion 46C may also be a notch provided at the end of the drive circuit board 46. That is, the penetration portion 46C does not necessarily have to be a through-hole surrounded by surrounding surfaces.

[0189] In the above embodiments, the inner surface 46C1 of the inserted portion 46C is connected to the side surface 53B of the first region 53 in a manner that allows for heat transfer. That is, the drive circuit board 46 transfers a portion of the heat transferred to the reflective light modulation element 42 to the first region 53. However, it is not limited to this, and the drive circuit board 46 may not necessarily be connected to the first region 53 in a manner that allows for heat transfer.

[0190] In the above embodiments, a thermally conductive grease GR is provided between the contact surface 41B of the base 41 and the connecting surface 53A of the first region 53 of the steam chambers 51 and 61. However, this is not a limitation; the grease GR may be omitted, and the contact surface 41B and the connecting surface 53A may be in direct contact. Alternatively, an adhesive may be provided between the contact surface 41B and the connecting surface 53A instead of the grease GR to bond them together. In this case, the adhesive may also be a thermally conductive adhesive.

[0191] In the above embodiments, the drive circuit board 46 transfers heat from the opposing surface 46B to the second region 54 of the steam chambers 51 and 61 via the clamping member 48. However, it is not limited to this, and heat may not be transferred from the opposing surface 46B to the second region 54. In addition, the clamping member 48 may be omitted.

[0192] In the above embodiments, the steam chambers 51 and 61 have a plurality of pillars 58 disposed within the fluid receiving chamber 56, and the plurality of pillars 58 extend along the protruding direction of the first region 53. Moreover, viewed from the base 41 side, i.e., in the -Z direction, the plurality of pillars 58 are disposed corresponding to the second region 54, but not in the first region 53. However, this is not a limitation, and the pillars 58 may be absent. In addition, when pillars 58 are provided, the pillars 58 may be disposed not only corresponding to the second region 54, but also corresponding to the first region 53, or they may not be disposed in the portion corresponding to the second region 54.

[0193] In the above embodiments, the distance between the first region 53 and the contact surface 41B is smaller than the distance between the second region 54 and the opposing surface 46B. However, this is not a limitation. As long as heat can be transferred from the contact surface 41B to the first region 53, the distance between the first region 53 and the contact surface 41B does not necessarily have to be less than the distance between the second region 54 and the opposing surface 46B.

[0194] In the first and second embodiments described above, the heat dissipation component 59 is a heat sink with multiple fins 591. In the third embodiment described above, the heat dissipation component 64 transfers heat from the steam chambers 51 and 61 to the cooling liquid in the liquid receiving section 651 located inside. However, it is not limited to this, and the structure of the heat dissipation component connected to the heat dissipation section 55 of the steam chambers 51 and 61 in a manner that enables heat transfer is not limited to the structure described above. For example, the heat dissipation component 64 may not have an impeller 66 and a motor 67, and may not have an outlet section 652 and an inlet section 653.

[0195] In the above embodiments, display devices 34, 36, and 37 are applied to projector 1. However, this is not the only application; the display devices of this disclosure can also be used in electronic devices other than projectors, or as independent display devices.

[0196] [Summary of this disclosure]

[0197] The following is a summary published in this note.

[0198] One aspect of the display device disclosed herein includes: a base having a first surface and a second surface opposite to the first surface; a reflective light modulation element disposed on the first surface and electrically connected to the base; a drive circuit board having a third surface electrically connected to the second surface and a fourth surface opposite to the third surface, for driving the reflective light modulation element; a vapor chamber having a heated portion for receiving heat transferred from the outside, a heat dissipation portion for dissipating heat, and a fluid receiving chamber for receiving working fluid, the working fluid changing from a liquid phase to a gas phase at the heated portion by the received heat, and changing from a gas phase to a liquid phase at the heat dissipation portion; and a heat dissipation component connected to the heat dissipation portion in a manner capable of heat transfer, the heated portion having a first region facing the second surface and a second region facing the fourth surface, the first region protruding towards the base side than the second region and connected to the second surface in a manner capable of heat transfer.

[0199] According to this structure, heat generated by the reflective light modulation element is transferred to the base on which the reflective light modulation element is mounted. The heat transferred to the base is then transferred in the vapor chamber to a first region connected to the second surface of the base in a manner capable of heat transfer. Since the working fluid is contained in the fluid receiving chamber of the vapor chamber, the liquid phase working fluid in the portion corresponding to the first region within the fluid receiving chamber vaporizes due to the heat transferred to the first region. The gaseous working fluid expands in volume and diffuses within the fluid receiving chamber, thus diffusing the heat transferred to the first region within the fluid receiving chamber. The gaseous working fluid condenses at the inner surface of the heat dissipation section connected to the heat dissipation component, changing into a liquid phase working fluid, which is then transported again in the fluid receiving chamber to the portion corresponding to the first region.

[0200] In this way, the heat of the reflective light modulation element is diffused through the vapor chamber, thus effectively reducing the heat density of the reflective light modulation element. Furthermore, since a heat dissipation component is provided in the heat dissipation section of the vapor chamber, the heat from the reflective light modulation element can be efficiently transferred to the heat dissipation component through the vapor chamber. Therefore, the reflective light modulation element can be effectively cooled. In addition, the structure of the vapor chamber is a closed structure for the working fluid, thus preventing the display device from becoming too large.

[0201] Furthermore, the term "opposite" used in "the first region facing the second face" and "the second region facing the fourth face" is not limited to the case of direct facing, but also includes the case where there are clamps.

[0202] In one of the above embodiments, the driving circuit substrate may have an insertion portion corresponding to the reflective light modulation element, and the first region may be inserted through the insertion portion to be connected to the second surface in a manner that enables heat transfer.

[0203] With this structure, even if the vapor chamber is positioned on the opposite side of the base relative to the drive circuit board, the first region of the vapor chamber can be connected to the second surface of the base in a manner that allows for heat transfer. Therefore, the heat from the reflective optical modulation element, which is transferred to the second surface, can be efficiently transferred to the vapor chamber, thereby effectively cooling the reflective optical modulation element.

[0204] In one of the above embodiments, the driving circuit substrate may receive heat generated by the reflective light modulation element at the third surface via the second surface, and transfer the received heat to the first region at the portion of the inserted portion opposite to the first region.

[0205] With this structure, the heat from the reflective optical modulator is transferred not only via the base to the portion in the first region opposite to the base, but also to the portion in the first region opposite to the inserted portion. This increases the number of paths for heat transfer from the reflective optical modulator to the first region, thus enabling more efficient heat transfer from the reflective optical modulator to the first region. Consequently, the reflective optical modulator can be cooled more effectively.

[0206] In one of the above embodiments, the device may also include: a light-transmitting component facing the image emission surface of the reflective light modulation element and disposed on the opposite side of the base relative to the reflective light modulation element; and a support frame supporting the light-transmitting component and disposed on the base, wherein the vapor chamber is connected to the support frame in a manner capable of heat transfer and receives heat generated by the reflective light modulation element.

[0207] With this structure, the heat generated by the reflective light modulation element and transferred to the light-transmitting component can be transferred to the vapor chamber via the support frame. Therefore, the heat transfer path from the reflective light modulation element to the vapor chamber can be increased, thus enabling more efficient cooling of the reflective light modulation element.

[0208] In one of the above methods, a heat-transferable grease may be used, the grease being disposed between the second surface and the portion of the first region opposite to the second surface.

[0209] With this structure, even if a gap exists between the second surface of the base and the first region of the vapor chamber, heat can be easily transferred from the second surface to the first region via grease. Therefore, the heat of the reflective optical modulation element can be efficiently transferred to the vapor chamber, thus enabling more effective cooling of the reflective optical modulation element.

[0210] In one of the above embodiments, the driving circuit substrate may receive heat generated by the reflective light modulation element at the third surface via the second surface, and transfer the received heat from the fourth surface to the second region of the vapor chamber.

[0211] With this structure, in the vapor chamber, in addition to transferring heat from the reflective optical modulator to the first region via the base, heat from the reflective optical modulator is also transferred to the second region via the base and the drive circuit board. Therefore, the path for heat transfer from the reflective optical modulator to the vapor chamber is increased, thus enabling more efficient cooling of the reflective optical modulator.

[0212] In one of the above embodiments, the steam chamber may have multiple columns disposed within the fluid receiving chamber, connecting the inner surface corresponding to the heated portion and the inner surface corresponding to the heat dissipation portion, and the multiple columns are disposed corresponding to the second region.

[0213] With this structure, the strength of the steam chamber, which allows the working fluid to vaporize and condense internally, can be ensured through multiple columns.

[0214] Furthermore, the portion of the vapor chamber with multiple pillars is difficult to flatten. In other words, the portion of the vapor chamber with multiple pillars is prone to unevenness. In contrast, since the portion of the vapor chamber with multiple pillars is the second region, the flatness of the first region facing the second surface of the base can be easily reduced. Therefore, the contact area between the second surface and the first region can be increased, and the heat of the reflective optical modulation element can be efficiently transferred from the second surface to the first region.

[0215] In one of the above methods, the distance between the first region and the second surface may be less than the distance between the second region and the fourth surface.

[0216] With this structure, since the pillars are not located in the first region, the flatness of the first region will not decrease even if multiple pillars are manufactured. Therefore, the first region can be easily connected to the second surface in a manner that allows for heat transfer. Thus, heat can be easily transferred from the reflective light modulation element to the first region via the base.

[0217] In one of the above methods, the heat dissipation component may have multiple fins.

[0218] With this structure, the heat dissipation area for heat transfer from the steam chamber can be increased, thus promoting the condensation of the working fluid at the heat dissipation section of the steam chamber. Therefore, the heat transferred from the reflective optical modulation element can be used to promote the vaporization of the working fluid in the first region, thereby improving the cooling efficiency of the reflective optical modulation element.

[0219] In one of the above embodiments, the heat dissipation component may also have a liquid receiving section disposed inside the heat dissipation component, allowing cooling liquid to circulate between the inside and outside.

[0220] With this structure, heat from the reflective light modulation element can be transferred to the cooling liquid flowing inside and outside the liquid receiving section, thus promoting condensation of the working fluid at the heat dissipation section of the vapor chamber. Therefore, the heat transferred from the reflective light modulation element can be used to promote the vaporization of the working fluid in the first region, thereby improving the cooling efficiency of the reflective light modulation element.

Claims

1. A display device, characterized by comprising: The display device has: A base having a first surface and a second surface opposite to the first surface; A reflective light modulation unit is disposed on the first surface and electrically connected to the base; A driving circuit board having a third surface electrically connected to the second surface and a fourth surface on the opposite side of the third surface, drives the reflective light modulation unit; A steam chamber having a heating section for receiving heat transferred from the outside, a heat dissipation section for dissipating heat, and a fluid receiving chamber for receiving working fluid, wherein the working fluid changes from liquid to gas phase at the heating section by receiving heat, and changes from gas phase to liquid phase at the heat dissipation section. as well as A heat dissipation component, which is connected to the heat dissipation unit in a manner that enables heat transfer. The heated portion has a first region facing the second surface and a second region facing the fourth surface. The first region protrudes towards the base side compared to the second region. In the first region, a flat contact surface is provided on the base side, and this contact surface is connected to the second surface in a manner that allows for heat transfer. The steam chamber has multiple columns disposed within the fluid receiving chamber, connecting the inner surfaces corresponding to the heated portion and the inner surfaces corresponding to the heat dissipation portion. The plurality of columns are arranged in a manner that corresponds to the second region, rather than to the first region.

2. The display device according to claim 1, characterized in that, The driving circuit substrate has an insertion portion corresponding to the reflective light modulation section. The first region penetrates the penetrated portion and is connected to the second surface in a manner that allows for heat transfer.

3. The display device according to claim 2, characterized in that, The drive circuit substrate receives heat generated by the reflective light modulation unit at the third surface via the second surface, and transfers the received heat to the first region at the portion of the inserted portion opposite to the first region.

4. The display device according to any one of claims 1 to 3, wherein The display device has: A light-transmitting plate is positioned opposite the image emission surface of the reflective light modulation unit and is disposed on the side opposite to the base relative to the reflective light modulation unit. as well as A support frame, which supports the light-transmitting plate, is disposed on the base. The steam chamber is connected to the support frame in a manner that allows for heat transfer, and receives heat generated by the reflective light modulation unit.

5. The display device according to any one of claims 1 to 3, characterized in that, The display device has a heat-transferable grease disposed between the second surface and the portion of the first region opposite to the second surface.

6. The display device according to any one of claims 1 to 3, characterized in that, The drive circuit board receives heat generated by the reflective light modulation unit at the third surface via the second surface, and transfers the received heat from the fourth surface to the second region of the steam chamber.

7. The display device according to claim 1, characterized in that, The distance between the first region and the second surface is less than the distance between the second region and the fourth surface.

8. The display device according to any one of claims 1 to 3, wherein the heat dissipating member has a plurality of fins.

9. The display device according to any one of claims 1 to 3, wherein the heat dissipating member has a liquid receiving portion provided inside the heat dissipating member for circulation of a cooling liquid inside and outside.

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