Folding terminal

Abstract

This application provides a foldable terminal, including a housing, a flexible screen, a first circuit board, a second circuit board, and a circuit structure. The housing and the flexible screen form a receiving cavity. The first circuit board and the second circuit board are located within the receiving cavity, with the first circuit board facing the first screen area of ​​the flexible screen and the second circuit board facing the second screen area of ​​the flexible screen. The first screen area and the second screen area are connected through a foldable screen area of ​​the flexible screen. The circuit structure is located within the receiving cavity and is disposed corresponding to the foldable screen area of ​​the flexible screen. The circuit structure is attached to the flexible screen and is used to support the flexible screen. The circuit structure includes: a foldable support piece located within the receiving cavity, the foldable support piece including a first side and a second side disposed opposite to each other; a first circuit layer disposed on the first side and located between the first side and the flexible screen; and a second circuit layer disposed on the second side. Both the first circuit layer and the second circuit layer are electrically connected to the first circuit board and the second circuit board.

Description

Technical Field

[0001] This application belongs to the field of electronic product technology, and specifically relates to a foldable terminal. Background Technology

[0002] With breakthroughs and developments in flexible screen technology, foldable terminals have fulfilled users' demands for large screens and satisfied their visual experience needs when browsing the web, playing games, or watching videos. While pursuing larger screens, they have also improved portability and grip comfort. Foldable terminals feature portability, flexibility, and multi-angle hovering capabilities, and have broad market application prospects.

[0003] To meet the high folding requirements of foldable devices, in addition to introducing screens with good flexibility, it is also necessary to have a circuit structure that can adapt to the bending of foldable devices.

[0004] However, the circuit structure commonly used in current foldable terminals is a flexible circuit board. During bending, the flexible circuit board is prone to wrinkles, requiring space to be provided to avoid them. Therefore, the circuit structure of existing foldable terminals occupies a large amount of space. Summary of the Invention

[0005] This application provides a foldable terminal to solve the problem of large space occupation by the circuit structure.

[0006] In a first aspect, embodiments of this application provide a foldable terminal, the foldable terminal including a housing, a flexible screen, a first circuit board, a second circuit board, and a circuit structure. The housing and the flexible screen form a receiving cavity. The first circuit board and the second circuit board are located within the receiving cavity, with the first circuit board facing a first screen area of ​​the flexible screen and the second circuit board facing a second screen area of ​​the flexible screen. The first screen area and the second screen area are connected through a foldable screen area of ​​the flexible screen. The circuit structure is located within the receiving cavity and is disposed corresponding to the foldable screen area of ​​the flexible screen. The circuit structure is fitted to the flexible screen and is used to support the flexible screen. The circuit structure includes:

[0007] A foldable support piece, the foldable support piece being located within the receiving cavity, the foldable support piece including a first side and a second side disposed opposite to each other;

[0008] A first circuit layer is disposed on the first side and located between the first side and the flexible screen;

[0009] The second line layer is disposed on the second side;

[0010] Both the first circuit layer and the second circuit layer are electrically connected to the first circuit board and the second circuit board.

[0011] In this embodiment, communication between the first circuit board and the second circuit board is achieved by respectively setting a first circuit layer and a second circuit layer on the two opposite sides of the foldable support sheet. This reuses the foldable support sheet used to support the flexible screen, and no additional clearance space is required during bending. Therefore, this embodiment reduces the space occupied by the circuit structure, which is beneficial for the miniaturization design of the foldable terminal. Simultaneously, when the flexible screen of the foldable terminal bends, the bending force is mainly concentrated on the foldable support sheet, while the bending force on the first and second circuit layers is relatively small. The first and second circuit layers are less prone to deformation, thereby improving the lifespan of the circuit layers and consequently, the service life of the circuit structure. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of a foldable terminal according to an embodiment of this application;

[0014] Figure 2 This is one of the schematic diagrams of a partial stacked structure of a circuit structure according to an embodiment of this application;

[0015] Figure 3 This is one of the schematic diagrams of a circuit structure according to an embodiment of this application;

[0016] Figure 4 This is a second schematic diagram of a circuit structure according to an embodiment of this application;

[0017] Figure 5 This is a third schematic diagram of a circuit structure according to an embodiment of this application;

[0018] Figure 6 This is a second schematic diagram of a partial stacked structure of a circuit structure according to an embodiment of this application;

[0019] Figure 7 This is a third schematic diagram of a partial stacked structure of a circuit structure according to an embodiment of this application;

[0020] Figure 8 This is a schematic diagram of the production process of a circuit structure according to an embodiment of this application;

[0021] Figure 9This is a schematic diagram of the production process of another circuit structure according to an embodiment of this application;

[0022] Figure 10 This is a schematic diagram of the production process of another circuit structure according to an embodiment of this application.

[0023] Figures 1 to 10 Reference numerals: 10, housing; 20, flexible screen; 30, first circuit board; 40, second circuit board; 101, receiving cavity; 201, first screen area; 202, second screen area; 203, foldable screen area; 301, flexible circuit board; 501, foldable support piece; 502, first circuit layer; 503, second circuit layer; 504, third circuit layer; 5011, through hole; 5012, conductive hole; 5013, first... Support area; 5014, foldable support area; 5015, second support area; 5016, adhesive layer; 5021, first insulating layer; 5022, first circuit layer; 5031, second insulating layer; 5032, second conductor layer; 5041, third insulating layer; 5042, third conductor layer; 50121, insulating material; 50141, first metal suspension wire; 50142, hollow area; 50143, second metal suspension wire. Detailed Implementation

[0024] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0026] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] The following is combined Figures 1 to 10 Describe the circuit structure according to an embodiment of this application.

[0029] See Figures 1 to 10 This application provides a foldable terminal, such as... Figure 1 As shown, the foldable terminal includes a housing 10, a flexible screen 20, a first circuit board 30, a second circuit board 40, and a circuit structure 50. The housing 10 and the flexible screen 20 form a receiving cavity 101. The first circuit board 30 and the second circuit board 40 are located within the receiving cavity 101, with the first circuit board 30 facing the first screen area 201 of the flexible screen 20, and the second circuit board 40 facing the second screen area 202 of the flexible screen 20. The first screen area 201 and the second screen area 202 are connected through the foldable screen area 203 of the flexible screen. The circuit structure 50 is located within the receiving cavity 101 and is disposed corresponding to the foldable screen area 203 of the flexible screen 20. The circuit structure 50 is fitted to the flexible screen 20 to support the flexible screen 20. The circuit structure 50 includes:

[0030] A foldable support piece 501 is located inside the receiving cavity 101. The foldable support piece 501 includes a first side and a second side disposed opposite to each other.

[0031] The first circuit layer 502 is disposed on the first side and located between the first side and the flexible screen;

[0032] The second line layer 503 is disposed on the second side;

[0033] The first circuit layer 502 and the second circuit layer 503 are both electrically connected to the first circuit board 30 and the second circuit board 40.

[0034] In this embodiment, the foldable support sheet 501 is a bendable support sheet used to support the flexible screen 20, for example, a bendable stainless steel support sheet.

[0035] Optionally, the first circuit layer 502 can be directly electrically connected to the first circuit board 30 and the second circuit board 40, or it can be electrically connected through other conductive components. Similarly, the second circuit layer 503 can be directly electrically connected to the first circuit board 30 and the second circuit board 40, or it can be electrically connected through other conductive components. In some embodiments, a flexible circuit board 301 can be provided, with both the first circuit layer 502 and the second circuit layer 503 electrically connected to the first circuit board 30 and the second circuit board 40 respectively via the flexible circuit board 301. Alternatively, the first circuit layer 502 can be electrically connected to the first circuit board 30 and the second circuit board 40 respectively via the flexible circuit board on the second circuit layer 503, or the second circuit layer 503 can be electrically connected to the first circuit board 30 and the second circuit board 40 respectively via the flexible circuit board on the first circuit layer 502.

[0036] Optionally, the first circuit board 30 can be a motherboard for carrying electronic components and transmitting signals, and the second circuit board 40 can also be called a sub-board for carrying electronic components and transmitting signals. At least one of the first circuit layer 502 and the second circuit layer 503 can be used to realize signal transmission between the first circuit board 30 and the second circuit board 40.

[0037] In this embodiment, communication between the first circuit board 30 and the second circuit board 40 is achieved by respectively setting a first circuit layer 502 and a second circuit layer 503 on the two opposite sides of the foldable support piece 501. This reuses the foldable support piece 501 used to support the flexible screen 20, and no additional clearance space is required during bending. Therefore, this embodiment reduces the space occupied by the circuit structure, which is beneficial for the miniaturization design of the foldable terminal. Simultaneously, when the flexible screen 20 of the foldable terminal bends, the bending force is mainly concentrated on the foldable support piece 501, while the bending force on the first circuit layer 502 and the second circuit layer 503 is relatively small. The first circuit layer 502 and the second circuit layer 503 are less prone to deformation, thereby improving the lifespan of the circuit layers and thus the service life of the circuit structure.

[0038] As an example, the foldable support piece 501 can be a foldable metal sheet, capable of withstanding over 300,000 bends. The foldable metal sheet includes, but is not limited to, foldable stainless steel sheets. Using a foldable stainless steel sheet avoids rust interference with the normal communication of the first circuit layer 502 and the second circuit layer 503 integrated on the surface of the foldable stainless steel sheet, and prevents negative impacts on the lifespan of the first circuit layer 502 and the second circuit layer 503. Furthermore, due to the inherent properties of the foldable metal sheet, it can withstand numerous bends and is not easily deformed. The placement of the first circuit layer 502 and the second circuit layer 503 on the surface of the foldable metal sheet further prevents deformation of the overall circuit structure, thus improving its lifespan.

[0039] Optionally, in some embodiments, the foldable support sheet 501 is provided with a through hole 5011 and a conductive hole 5012, the conductive hole 5012 is located inside the through hole 5011, and the gap between the conductive hole 5012 and the through hole 5011 is filled with an insulating material 50121, and the two ends of the conductive hole 5012 are electrically connected to the first circuit layer 502 and the second circuit layer 503, respectively.

[0040] In this embodiment, a through hole 5011 can be formed by drilling, then an insulating material can be filled into the through hole 5011, followed by drilling through the insulating material, and then the first conductive through hole can be formed by electroplating. It should be noted that if the foldable support sheet 501 is made of a non-metallic material, the conductive hole 5012 can be formed directly by drilling and then by electroplating.

[0041] Since conductive holes 5012 are used to achieve conductive connection between the first circuit layer 502 and the second circuit layer 503, the electrical connection structure between the first circuit layer 502 and the second circuit layer 503 and the first circuit board 30 and the second circuit board 40 can be simplified. For example, by simply providing a flexible circuit board on the first circuit layer 502 or the second circuit layer 503, the electrical connection between the first circuit layer 502 and the second circuit layer 503 and the first circuit board 30 and the second circuit board 40 can be achieved.

[0042] Optionally, in some embodiments, the foldable support piece 501 includes a first support area 5013, a foldable support area 5014, and a second support area 5015 connected in sequence, wherein the first support area 5013 corresponds to the first screen area 201, the foldable support area 5014 corresponds to the foldable screen area 203, and the second support area 5015 corresponds to the second screen area 202; the foldable support area 5014 is provided with a hollow structure.

[0043] In this embodiment of the application, the foldable support area 5014 includes a first metal suspension layer, which includes at least two first metal suspension wires 50141, and the hollow structure is formed between adjacent first metal suspension wires 50141.

[0044] The first circuit layer 502 is disposed on the side of the first metal suspension wire 50141 facing the flexible screen 20; the second circuit layer 503 is disposed on the side of the first metal suspension wire 50141 away from the flexible screen 20.

[0045] Optionally, in some embodiments, the first circuit layer 502 may include a first insulating layer 5021 and a first conductor layer 5022 disposed in the first insulating layer 5021; the second circuit layer 503 may include a second insulating layer 5031 and a second conductor layer 5032 disposed in the second insulating layer 5031.

[0046] Optionally, the fact that the two ends of the conductive hole 5012 are electrically connected to the first circuit layer 502 and the second circuit layer 503 respectively can be understood as: the above-mentioned through hole 5011 is used to realize the electrical connection between the first conductor layer 5022 and the second conductor layer 5032.

[0047] Optionally, in some embodiments, the first conductor layer 5022 includes at least one metal trace disposed on each first metal suspension wire 50141. Each metal trace can be used to implement a function, such as power transmission (i.e., the corresponding metal trace is a power line) or data transmission (i.e., the corresponding metal trace is a data line).

[0048] Optionally, in some embodiments, a metal trace is provided on each of the two back sides of each first metal suspension wire 50141. The multiple metal traces used to achieve a single function can be understood as follows: the two ends of the multiple metal traces are respectively connected to each other in the first support region 5013 and the second support region 5015, as specifically... Figure 3 As shown. In this way, for wider power lines, multiple metal traces can be interconnected to form a power line, thereby reducing the width of the metal traces and consequently reducing the width of the first metal suspension wire 50141, thus improving the elasticity of the foldable support area 5014.

[0049] In this embodiment, since a hollow structure is provided in the foldable support area 5014, during the bending process, the first metal suspension wire 50141 can be delayed towards the hollow area 50142 in the hollow structure to buffer the bending stress, improve the bending performance of the foldable area of ​​the foldable support piece 501, and thus improve the bending life of the foldable support piece 501.

[0050] Optionally, in some embodiments, the planar structure formed by the first metal suspension wire 50141 can be set according to actual needs. For example, in some embodiments, as Figure 4 and Figure 5 shown, the first metal suspension wire 50141 includes N connecting portions connected in sequence, and the connecting portions are arranged in a "ji" shape or a rhombus shape;

[0051] wherein, the first connecting portion is connected to the first support region 5013, and the Nth connecting portion is connected to the second support region 5015.

[0052] In the embodiments of the present application, a multi-segment "ji" shape (as Figure 4 shown) or a multi-segment rhombus structure (or a so-called back shape, as Figure 5 shown) is used to form the first metal suspension wire 50141. Thus, during the bending process, the first metal suspension wire 50141 can produce better deformation in the bending direction, improving the reliability of bending.

[0053] Optionally, as Figure 6 shown, in some embodiments, the foldable support region 5014 further includes a second metal suspension wire layer, which is adhesively connected to the first metal suspension wire layer and is located between the first metal suspension wire layer and the second circuit layer 503. The second metal suspension wire layer includes at least two second metal suspension wires 50143, and the second metal suspension wires 50143 are stacked corresponding to the first metal suspension wires 50141 one by one.

[0054] In the embodiments of the present application, since two metal suspension wire layers are provided, the reliability of fixing the metal suspension wires can be increased, thereby enhancing the mechanical strength of the circuit structure. For example, in some embodiments, an adhesive layer can be provided between the first metal suspension wire layer and the second metal suspension wire layer, and then the first metal suspension wire layer and the second metal suspension wire are pressed and bonded together.

[0055] Optionally, as Figure 7 shown, in some embodiments, at least one of the side of the first circuit layer 502 facing away from the foldable support piece 501 and the side of the second circuit layer 503 facing away from the foldable support piece 501 is provided with a third circuit layer 504, and the third circuit layer 504 is electrically connected to the first circuit board 30 and the second circuit board 40 respectively.

[0056] In the embodiments of the present application, since the third circuit layer 504 is added, the density of the circuit layout can be further increased, thereby meeting more wiring requirements.

[0057] It should be understood that the third circuit layer 504 described above has similar functions and connection structures to the first circuit layer 502 and the second circuit layer 503. For example, the third circuit layer 504 may include a third insulating layer 5041 and a third conductor layer 5042 disposed in the third insulating layer 5041.

[0058] Optionally, in some embodiments, conductive vias can be provided to achieve conductive connection between the first conductor layer 5022 and the third conductor layer 5042, and to achieve conductive connection between the second conductor layer 5032 and the third conductor layer 5042. For example, in some embodiments, the third conductor layer 5042 is electrically connected to the first conductor layer 502 on the side of the first conductor layer 502 away from the foldable support piece 501; the third conductor layer 5042 is electrically connected to the second conductor layer 503 on the side of the second conductor layer 503 away from the foldable support piece 501. Since the third conductor layer 5042 is electrically connected to the first conductor layer 5022 and the second conductor layer 5032 respectively, the trace width of the first conductor layer 5022 and the second conductor layer 5032 can be reduced, thereby reducing the width of the first metal suspension wire 50141 and improving the elasticity of the foldable support area 5014.

[0059] To better understand this application, the industrial production process of the circuit structure of this application is described below.

[0060] In some embodiments, the industrial production process of the circuit structure is as follows:

[0061] Step 11: Drill holes in the stainless steel substrate (i.e., the first metal suspension layer of the foldable support sheet) to obtain through holes 5011, forming... Figure 8 The structure shown in A1;

[0062] Step 12: Press the adhesive-backed substrate onto the upper and lower surfaces of the stainless steel substrate to form... Figure 8 The structure shown in A2 is such that the through hole 5011 is filled with an insulating material 50121, and the adhesive substrate is used to form the insulating material 50121 and a portion of the insulating layer (i.e., a portion of the structure of the first insulating layer and the second insulating layer).

[0063] Step 13: Drill a hole between the insulator 50121 and the inner wall of the through hole 5011, and form a conductive hole 5012 through hole metallization, specifically as follows... Figure 8 As shown in A3 of the diagram.

[0064] Step 14: Form a conductive layer (such as a first conductive layer and a second conductive layer) on the surface of the adhesive-backed substrate, forming a structure as shown in the figure. Figure 8 The structure shown in A4 is as follows.

[0065] Step 15: An insulating material is laminated onto the surface of the adhesive-backed substrate to form another insulating layer (i.e., a portion of the structure of the first and second insulating layers), specifically as follows... Figure 8 As shown in A5 of the document.

[0066] Step 16: The outline is laser-cut and the stainless steel substrate is etched to form a metal suspension wire (i.e., the first metal suspension wire), specifically as follows: Figure 8 As shown in A6 of the diagram.

[0067] Optionally, in some embodiments, two stainless steel substrates (i.e., the first and second metal suspension layers of the foldable support sheet) can be laminated together, wherein the two stainless steel substrates are bonded together by an adhesive layer 5016, as shown in the following example. Figure 9 As shown in B1, the subsequent process flow is the same as steps 1 to 6 above, and the resulting structure is as follows. Figure 9 As shown in B2 to B7 of the diagram.

[0068] Optionally, in some embodiments, multiple circuit layers may be provided on the two back sides of the stainless steel substrate. Specifically, the process includes the following steps: steps 21 to 30, wherein...

[0069] Steps 21 to 25 are the same as steps 11 to 15, and the resulting structure is as follows: Figure 10 As shown in C1 to C5;

[0070] Step 26: Press the outer adhesive substrate to form a partial insulating layer (i.e., a partial structure of the first, second, and third insulating layers), specifically as follows: Figure 10 As shown in C6;

[0071] Step 27: After drilling and filling the laminated adhesive substrate with insulating material, drill holes again in the insulating material and form conductive holes through hole metallization, as detailed below. Figure 10 As shown in C7;

[0072] Step 28: Form a conductive layer (such as a third conductive layer) on the surface of the outer adhesive substrate to form a conductive layer. Figure 10 The structure shown in C8;

[0073] Step 29: An insulating material is laminated onto the surface of the outer adhesive substrate to form another insulating layer (i.e., part of the third insulating layer structure), specifically as follows... Figure 10 As shown in C9.

[0074] Step 30: The outline is laser-cut and the stainless steel substrate is etched to form a metal suspension wire (i.e., the first metal suspension wire), specifically as follows: Figure 10 As shown in C10.

[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0076] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A foldable terminal, characterized in that, The folding terminal includes a housing, a flexible screen, a first circuit board, a second circuit board, and a circuit structure. The housing and the flexible screen form a receiving cavity. The first circuit board and the second circuit board are located in the receiving cavity. The first circuit board is opposite to the first screen area of the flexible screen, and the second circuit board is opposite to the second screen area of the flexible screen. The first screen area and the second screen area are connected through the foldable screen area of the flexible screen. The circuit structure is located in the receiving cavity and is provided corresponding to the foldable screen area of the flexible screen. The circuit structure is adhered to the flexible screen and is used to support the flexible screen. The circuit structure includes: A foldable support sheet, which is located in the receiving cavity. The foldable support sheet includes a first side and a second side arranged opposite to each other. A first circuit layer, which is provided on the first side and is located between the first side and the flexible screen. A second circuit layer, which is provided on the second side. Wherein, both the first circuit layer and the second circuit layer are electrically connected to the first circuit board and the second circuit board. The foldable support sheet includes a first support area, a foldable support area, and a second support area connected in sequence. Among them, the first support area is provided corresponding to the first screen area, the foldable support area is provided corresponding to the foldable screen area, and the second support area is provided corresponding to the second screen area. The foldable support sheet is a foldable metal sheet, and a hollow structure is provided in the foldable support area. Through holes and conductive holes are provided on the foldable support area of the foldable support sheet. The conductive hole is located within the through hole, and the gap between the conductive hole and the through hole is filled with an insulating material. Both ends of the conductive hole are electrically connected to the first circuit layer and the second circuit layer respectively. The first circuit layer includes a first insulating layer and a first wire layer provided in the first insulating layer. The second circuit layer includes a second insulating layer and a second wire layer provided in the second insulating layer. The through hole is used to realize the electrical connection between the first wire layer and the second wire layer. At least one of the side of the first circuit layer facing away from the foldable support sheet and the side of the second circuit layer facing away from the foldable support sheet is provided with a third circuit layer, and the third circuit layer is electrically connected to the first circuit board and the second circuit board respectively.

2. The folding terminal according to claim 1, characterized in that, The foldable support area includes a first metal suspension wire layer, and the first metal suspension wire layer includes at least two first metal suspension wires. A hollow structure is formed between adjacent first metal suspension wires. Wherein, the first circuit layer is provided on the side of the first metal suspension wire facing the flexible screen, and the second circuit layer is provided on the side of the first metal suspension wire facing away from the flexible screen.

3. The folding terminal according to claim 2, characterized in that, The first metal suspension wire includes N connection parts connected in sequence, and the connection parts are arranged in a "ji" shape or a rhombus shape. Among them, the first connection part is connected to the first support area, and the Nth connection part is connected to the second support area.

4. The folding terminal according to claim 2, characterized in that, The foldable support area also includes a second metal suspension wire layer, which is bonded to the first metal suspension wire layer and located between the first metal suspension wire layer and the second circuit layer. The second metal suspension wire layer includes at least two second metal suspension wires, which are stacked one-to-one with the first metal suspension wires.

5. The folding terminal according to claim 1, characterized in that, The third circuit layer includes a third insulation layer and a third conductor layer disposed within the third insulation layer.

6. The folding terminal according to claim 1, characterized in that, A third conductor layer on the side of the first circuit layer opposite to the foldable support piece is electrically connected to the first circuit layer; a third conductor layer on the side of the second circuit layer opposite to the foldable support piece is electrically connected to the second circuit layer.

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