earphone

Abstract

The application provides an earphone, comprising a shell, a first loudspeaker unit and a second loudspeaker unit. The shell has a sound outlet; the first loudspeaker unit and the second loudspeaker unit are respectively and independently fixed in the shell, the first loudspeaker unit sounds towards the sound outlet, the second loudspeaker unit is located on the side of the first loudspeaker unit away from the sound outlet and is arranged in a spaced mode with the first loudspeaker unit, and the sounding frequency of the second loudspeaker unit is less than the sounding frequency of the first loudspeaker unit; wherein a cavity is enclosed among the first loudspeaker unit, the second loudspeaker unit and the inner wall of the shell, the cavity is used as a front cavity of the second loudspeaker unit, and the front cavity is communicated with the sound outlet through a sound outlet channel. According to the earphone provided by the application, the sound outlet effect is good.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and in particular to a pair of headphones. Background Technology

[0002] In order to allow users to listen to the sound information provided by electronic products without disturbing others during use, headphones have become an essential accessory for electronic products.

[0003] In related technologies, the sound output of the headphones is poor and needs further improvement. Summary of the Invention

[0004] This application provides an earphone that improves the sound output performance.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: The earphones provided according to the embodiments of this application may include: a shell, a first speaker unit, and a second speaker unit. The shell has a sound outlet; the first speaker unit and the second speaker unit are respectively and independently fixed inside the shell, the first speaker unit emits sound towards the sound outlet, and the second speaker unit is located on the side of the first speaker unit away from the sound outlet and is spaced apart from the first speaker unit, the sound frequency of the second speaker unit is lower than the sound frequency of the first speaker unit; wherein, the first speaker unit, the second speaker unit, and the inner wall of the shell form a cavity, the cavity serving as the front cavity of the second speaker unit, and the front cavity communicating with the sound outlet through a sound outlet channel. The sound outlet channel is formed in the first speaker unit. Specifically, the first speaker unit is annular to define the sound outlet channel.

[0006] According to the earphones provided in this application embodiment, by independently fixing the first speaker unit and the second speaker unit within the housing, when one of the first speaker unit or the second speaker unit malfunctions or is damaged, only the damaged one needs to be removed, replaced, or repaired. This avoids the need to completely disassemble and replace the first and second speaker units as a whole due to modular design, thus reducing maintenance costs and preventing damage to the speaker unit that does not need to be replaced during disassembly. Furthermore, compared to a modular design, independently fixing the first and second speaker units within the housing eliminates the need for connecting components between them. The housing serves as the physical connection, saving space within the housing and allowing for the integration of more functional components. It also facilitates a more rational optimization of the internal structural layout of the earphones. Moreover, by utilizing the characteristic that the first speaker unit's frequency of sound emission is higher than that of the second speaker unit, the high-frequency response of the earphones can be further improved, resulting in better sound performance across different frequency ranges and enhancing the overall sound output.

[0007] In some embodiments provided in this application, the outer shell includes a front shell and a rear shell. The front shell and the rear shell are detachably connected. A sound outlet is formed in the front shell, and the first speaker unit and the second speaker unit are located inside the front shell. This facilitates the separate processing of the front and rear shells, simplifies the mold structure of the front and rear shells, reduces the molding difficulty of the front and rear shells, and consequently reduces the manufacturing difficulty of the outer shell. Furthermore, it facilitates the disassembly of the front and rear shells for easy headphone repair.

[0008] In some examples, the front and / or rear shells are made of rigid plastic. This helps to achieve a lightweight design for the headphones.

[0009] Specifically, the front shell includes a main body and a sound outlet. A first receiving cavity can be formed within the main body, and the side of the first receiving cavity adjacent to the rear shell is open. The sound outlet is located on the side of the main body away from the rear shell and extends in a direction away from the rear shell. The sound outlet communicates with the first receiving cavity, and a sound outlet hole is formed at the end of the sound outlet away from the main body. By providing a sound outlet and placing the sound outlet hole on the sound outlet, it is easier for the sound outlet to extend into the ear canal of the human ear, thereby shortening the distance between the sound outlet of the earphone and the eardrum of the human ear. This is beneficial for the sound emitted by the earphone to be well received by the user, improving the user experience.

[0010] In some embodiments provided in this application, a support step is formed on the inner circumferential surface of the housing, and the second speaker unit is supported and fixed on the support step. This arrangement facilitates the positioning and installation of the second speaker unit.

[0011] In some embodiments provided in this application, the second speaker unit is a moving-coil speaker unit.

[0012] In some embodiments provided in this application, the second loudspeaker unit includes a diaphragm assembly, a voice coil, a magnetic circuit system, and a frame. The frame is open on the side facing the sound outlet, and the diaphragm assembly is fixed to the open end of the frame. The voice coil and magnetic circuit system are located inside the frame. The voice coil is connected to the diaphragm assembly. The magnetic circuit system has a magnetic gap, and the end of the voice coil away from the diaphragm assembly extends into the magnetic gap. The magnetic circuit system can cooperate with the voice coil to drive the diaphragm assembly to vibrate synchronously. Therefore, the structure of the second loudspeaker unit is simple.

[0013] In some embodiments provided in this application, the inner circumferential surface of the open end of the speaker frame is provided with an annular groove recessed in a direction away from the central axis of the speaker frame. The annular groove extends in a ring shape along the circumference of the speaker frame and extends through to the end face of the open end of the speaker frame, that is, the end face facing the sound outlet. The outer edge of the diaphragm assembly is received within the annular groove and fixed to the wall surface of the annular groove opposite the sound outlet. This allows for effective support of the diaphragm assembly using the annular groove, while also increasing the volume of the space within the speaker frame, which allows for a larger diaphragm assembly, thereby increasing the effective vibration area of ​​the diaphragm assembly and improving the low-frequency performance of the second speaker unit.

[0014] In some embodiments provided in this application, the diaphragm assembly includes: a connecting segment, a folded ring, and a dome surrounded by the folded ring. The connecting segment is stacked on the wall surface of the annular groove opposite the sound outlet. The voice coil is connected to the dome. The outer peripheral edge of the folded ring is connected to the inner peripheral edge of the connecting segment. The folded ring protrudes towards the sound outlet. This facilitates further reduction of the front cavity volume, resulting in a compact structure.

[0015] In some examples, the diaphragm assembly is a single molded component. This design improves the structural strength of the diaphragm assembly and facilitates its manufacturing.

[0016] In some embodiments provided in this application, the magnetic circuit system includes a side magnetic portion and a first central magnetic portion. The side magnetic portion is located on the outer periphery of the first central magnetic portion to define a magnetic gap with the first central magnetic portion. The magnetization directions of the side magnetic portion and the first central magnetic portion are opposite, so that the side magnetic portion and the first central magnetic portion can form a magnetic circuit for driving the voice coil to move.

[0017] In some embodiments provided in this application, the magnetic circuit system includes a second central magnetic section. The second central magnetic section blocks the end of the side magnetic section away from the diaphragm assembly, and the first central magnetic section and the second central magnetic section are stacked together. The second central magnetic section can be a magnetically conductive material. In this way, the second central magnetic section can be used to confine the leakage of magnetic lines of force, thereby increasing the magnetic induction intensity of the magnetic circuit system.

[0018] In some embodiments provided in this application, the magnetic circuit system further includes a magnetically conductive yoke. The magnetically conductive yoke is disposed on the side of the first central magnetic portion facing the diaphragm assembly, and is used to constrain the leakage of magnetic field lines, thereby increasing the driving force on the diaphragm assembly.

[0019] Specifically, the outer peripheral surface of the magnetic yoke is flush with the outer peripheral surface of the first central magnetic part along the axial direction of the magnetic circuit system. This helps to further improve the constraint effect of the magnetic yoke on the magnetic lines of force, increase the magnetic induction intensity of the magnetic circuit system, and the magnetic yoke does not affect the magnetic gap, which helps to improve the compatibility between the magnetic circuit system and the voice coil.

[0020] In some embodiments provided in this application, the first speaker unit is a piezoelectric ceramic speaker unit. Piezoelectric ceramic speaker units are thin, small in size, and have good high-frequency sound effects.

[0021] In some embodiments provided in this application, the first loudspeaker unit includes a diaphragm and a piezoelectric ceramic plate. Both the diaphragm and the piezoelectric ceramic plate are annular flat plates. The first loudspeaker unit is fixed inside the housing by the diaphragm. The piezoelectric ceramic plates are stacked on the surface of the diaphragm facing the sound outlet. In this way, the front cavity can be defined by the surface of the diaphragm facing the second loudspeaker unit, the diaphragm assembly, and the inner wall of the housing, thereby improving the regularity of the shape of the front cavity and further improving the sound performance of the second loudspeaker unit.

[0022] Specifically, the diaphragm includes a support portion and a connecting portion. The support portion supports the piezoelectric ceramic sheet and faces it directly. The connecting portion surrounds the outer periphery of the support portion, thereby securing the first speaker unit. Thus, when the diaphragm is connected to the housing, the piezoelectric ceramic sheet is suspended, and the support portion of the diaphragm is also suspended, facilitating the vibration of the diaphragm driven by the piezoelectric ceramic sheet.

[0023] For example, the materials of the vibrating plate include, but are not limited to, metal and plastic.

[0024] In some embodiments provided in this application, the headphones include a bracket located between a first speaker unit and a sound outlet, wherein the first speaker unit is fixed within a housing by the bracket. The bracket facilitates the installation of the first speaker unit. Furthermore, positioning the bracket between the first speaker unit and the sound outlet prevents the need for a large front cavity due to the bracket's placement, and also helps to form a regular front cavity, thereby improving the sound output of the second speaker unit.

[0025] In some embodiments provided in this application, the bracket includes an annular fixing portion, and the outer peripheral edge of the first speaker unit is fixed to the inner peripheral surface of the housing by means of the fixing portion. For example, the connecting portion of the diaphragm is stacked and fixed on the fixing portion, and the fixing portion is in turn fixed to the inner peripheral surface of the housing.

[0026] In some embodiments provided in this application, a first step is formed on the inner circumferential surface of the housing, and the fixing part is supported and fixed to the first step. The first step facilitates the overall positioning and installation of the bracket and the first speaker unit.

[0027] In some embodiments provided in this application, the fixing part includes a fixing plate and an annular flange. The fixing plate is supported and fixed to the step surface of the first step facing the second speaker unit. The annular flange is disposed around the edge of the fixing plate and protrudes towards the second speaker unit. The outer peripheral edge of the first speaker unit is supported and fixed to the end face of the annular flange away from the sound outlet. This allows for a larger design of the first speaker unit, further improving the sound output effect. Furthermore, when the annular flange is fixed to the step surface of the first step facing the central axis of the second speaker unit, it also helps to increase the connection area between the bracket and the housing, improving the reliability of the connection between them.

[0028] In some embodiments provided in this application, the fixing part is made of a flexible material. This allows the cushioning effect of the fixing part to reduce the vibration transmitted from the first speaker unit to the outer shell, thereby improving the user's comfort when wearing the headphones and enhancing the sound performance of the first speaker unit. Furthermore, it can also, to some extent, prevent the vibration of the outer shell from interfering with the air vibration within the front cavity, which is beneficial for improving the sound performance of the second speaker unit.

[0029] For example, the fixing part is made of rubber or silicone.

[0030] To simplify the manufacturing process of the entire support and ensure the consistency of the support material, the entire support can be made of a flexible material.

[0031] For example, the bracket is made of rigid plastic.

[0032] In some embodiments provided in this application, the annular fixing portion defines a sound transmission channel, which connects the sound outlet hole and the sound outlet channel. This facilitates the sound output of the second speaker unit.

[0033] In some embodiments provided in this application, the output channel and the transmission channel are coaxially arranged. This allows the output channel and the transmission channel to be directly opposite each other, thereby improving the transmission effect of the transmission channel.

[0034] In some embodiments provided in this application, the first loudspeaker unit is a piezoelectric ceramic loudspeaker unit, and the sound transmission channel is used as the front sound cavity of the first loudspeaker unit.

[0035] In some embodiments provided in this application, the first speaker unit has an external terminal facing the sound outlet. By making the external terminal face the sound outlet, it is easier to form the front cavity of the second speaker unit, preventing the problem of the external terminal being unable to connect to the wiring because it is located inside the front cavity.

[0036] In some embodiments provided in this application, a portion of the surface of the fixing part facing the first speaker unit is recessed towards the sound outlet to form a relief groove, which is used to avoid interference between the bracket and the external terminal.

[0037] In some embodiments provided in this application, the earphone includes: a first signal trace; a clearance groove extending to the outer peripheral edge of the fixing portion, one end of the first signal trace being fixed and electrically connected to an external terminal, and the first signal trace extending through the clearance groove toward the second speaker unit. This facilitates the first signal trace extending out of the sound transmission channel through the clearance groove.

[0038] In some embodiments provided in this application, the outer peripheral surface of the first speaker unit has a first contour surface, and the inner peripheral surface of the housing has a first region directly opposite the first contour surface. The first contour surface and the first region are spaced apart to form a first clearance gap. The first clearance gap communicates with a clearance groove and is used to avoid the first signal trace. This helps to improve the reliability of the first signal trace and avoids interference between the first signal trace and other structures within the housing.

[0039] To separate the first contour surface from the first region, for example, the first contour surface is a plane. Also for example, the first contour surface is an arcuate surface extending circumferentially along the housing, and the first contour surface arches towards the center of the first speaker unit. Still for example, the first region may be recessed away from the first contour surface to form a recessed groove.

[0040] In some embodiments provided in this application, the outer shell has a balancing hole. The balancing hole connects the front cavity and the outer side of the outer shell. This allows the balancing hole to balance the air pressure between the front cavity and the outer side of the outer shell, improving the comfort of using the headphones.

[0041] Specifically, a clearance notch is formed at the position of the fixing part corresponding to the balance hole, and the clearance notch connects the balance hole and the sound transmission channel. This allows the front cavity to communicate with the outside atmosphere of the outer shell.

[0042] In some embodiments provided in this application, the headphones include a noise-canceling microphone located between the first speaker unit and the sound outlet. The noise-canceling microphone is fixed inside the housing by a bracket. This allows the noise-canceling microphone and the first speaker unit to be fixed together by the bracket, forming a modular design. This allows the first speaker unit, bracket, and noise-canceling microphone to be installed as a single unit within the housing, eliminating the need for separate installation of the first speaker unit and the noise-canceling microphone. This simplifies the installation process, improves assembly efficiency, and results in a highly compact overall structure for the first speaker unit and the noise-canceling microphone. Furthermore, the location of the noise-canceling microphone between the first speaker unit and the sound outlet facilitates its placement close to the sound outlet, thereby improving the noise-canceling effect of the headphones. In some embodiments provided in this application, the housing includes a main body and a sound outlet. The main body has a first receiving cavity, and both the first speaker unit and the second speaker unit are fixed within the first receiving cavity. The sound outlet communicates with the first receiving cavity, and a sound outlet hole is formed at the end of the sound outlet away from the main body. At least a portion of the noise-canceling microphone is located within the sound outlet hole. This arrangement allows the noise-canceling microphone to be closer to the sound outlet hole, thereby improving the microphone's sound pickup effect and further enhancing the noise-canceling effect of the headphones.

[0043] In some embodiments provided in this application, the bracket includes a support plate and an annular fixing part. The outer peripheral edge of the first speaker unit is fixed to the inner peripheral surface of the housing by means of the fixing part. The support plate is fixed to the fixing part and extends toward the sound outlet. The noise-canceling microphone is fixed to the support plate. This facilitates the installation of the noise-canceling microphone close to the sound outlet, improving the sound pickup effect of the noise-canceling microphone and thus improving the noise cancellation effect of the headphones.

[0044] In some embodiments provided in this application, the support plate is located on the inner periphery of the fixing part and is connected to the inner peripheral wall of the fixing part. This prevents interference between the support plate and the inner wall of the housing, thereby avoiding the problem of insufficient installation space for the noise-canceling microphone due to interference between the noise-canceling microphone and the inner wall of the housing, and facilitating reliable installation of the noise-canceling microphone.

[0045] In some embodiments provided in this application, the annular fixing portion defines a sound transmission channel, which connects the sound outlet hole and the sound transmission channel. The orthographic projection of the support plate and the noise-canceling microphone on the first speaker unit is located on the outer periphery of the sound transmission channel. This prevents the support plate and the noise-canceling microphone from blocking the sound output of the second speaker unit, ensuring the sound output effect of the second speaker unit.

[0046] In some embodiments provided in this application, the orthographic projection of the support plate on the first speaker unit is located between the orthographic projection of the noise-canceling microphone on the first speaker unit and the sound output channel. This arrangement helps to further avoid interference between the support plate and the housing.

[0047] In some embodiments provided in this application, the earphone includes: a motherboard and a second signal trace, and the noise-canceling microphone is adapted to be electrically connected to the motherboard through the second signal trace.

[0048] In some embodiments provided in this application, the motherboard is located on the side of the second speaker unit away from the sound outlet, and a clearance space is formed between the fixing part and the inner wall surface of the housing. The second signal trace extends towards the motherboard through the clearance space. This facilitates the avoidance of the second signal trace and the connection between the second signal trace and the motherboard.

[0049] In some embodiments provided in this application, the outer peripheral surface of the first speaker unit has a second profile surface, and the inner peripheral surface of the housing has a second region directly opposite the second profile surface. The second profile surface and the second region are spaced apart to form a second clearance gap, which is used to avoid interference between the second signal trace and other structures within the housing. This improves the reliability of the second signal trace and avoids interference between the second signal trace and other structures within the housing.

[0050] To separate the second contour surface from the second region, for example, the second contour surface is a plane. Also for example, the second contour surface is an arcuate surface extending circumferentially along the housing, and the second contour surface arches towards the center of the first speaker unit. Yet another example, the second region may be recessed away from the second contour surface to form a recessed groove.

[0051] In some embodiments provided in this application, a wiring groove is provided on the inner peripheral surface of the housing between the motherboard and the fixing part, and a portion of the second signal wiring is fixed to the wiring groove. This helps to improve the reliability of the second signal wiring and avoids interference between the second signal wiring and other structures within the housing.

[0052] In some embodiments provided in this application, a first positioning part is formed on the outer peripheral wall of the fixing part, and a second positioning part is formed on the inner peripheral surface of the outer shell. The first positioning part and the second positioning part cooperate with each other. This facilitates the overall installation and positioning of the bracket and the first speaker unit, preventing them from being placed backwards or misaligned.

[0053] In some embodiments provided in this application, a third positioning portion is formed on the outer peripheral edge of the first speaker unit, and a second positioning portion is formed on the inner wall surface of the housing. The third positioning portion cooperates with the second positioning portion. This facilitates the installation and positioning of the first speaker unit to prevent it from being placed backwards or misplaced.

[0054] In some embodiments provided in this application, the first speaker unit has an external terminal, and the second speaker unit has a wiring terminal. The external terminal and the wiring terminal are electrically connected through a first signal trace. This simplifies the electrical connection between the first speaker unit, the second speaker unit, and the motherboard.

[0055] In some embodiments provided in this application, the portion of the inner circumferential surface of the housing located between the second speaker unit and the first speaker unit has a wiring groove, which is used to avoid the first signal trace. This helps to improve the reliability of the first signal trace and avoids interference between the first signal trace and other structures within the housing.

[0056] In some embodiments provided in this application, the first speaker unit and the second speaker unit are coaxially arranged. This is beneficial for improving the sound output effect of the sound output channel. Attached Figure Description

[0057] Figure 1 This is a schematic diagram of the structure of the earphone provided in some embodiments of this application; Figure 2 for Figure 1 The diagram shows the exploded structure of the headphones. Figure 3 According to Figures 1-2 The diagram shows a cross-sectional view of the front shell of the headphones after it is assembled with the dynamic speaker unit. Figure 4 This is a partial structural schematic diagram of an earphone provided according to other embodiments of this application; Figure 5 According to Figure 4 The diagram shows a cross-sectional view of a portion of the headphone structure at line AA. Figure 6 According to Figures 4-5 A perspective view of the second speaker unit in the headphones shown; Figure 7 According to Figure 6 A cross-sectional schematic diagram of the second speaker unit is shown; Figure 8 According to Figures 4-5 A perspective view of the first speaker unit in the headphones shown; Figure 9 According to Figure 8 The diagram shows a cross-sectional view of the first speaker unit at the BB line. Figure 10 According to Figures 4-5 The diagram shows the connection of the motherboard, first speaker unit, second speaker unit, first signal trace, and conductive trace in the earphone. Figure 11This is a partial structural schematic diagram of an earphone provided according to some embodiments of this application; Figure 12 According to Figure 11 A cross-sectional schematic diagram of a portion of the headphone structure at the CC line; Figure 13 According to Figures 11-12 A perspective view of the support frame in the headphones shown; Figure 14 According to Figure 12 The enlarged view of the part of the headphone structure shown in the diagram, circled at point E; Figure 15 According to Figures 11-12 The diagram shows the interaction of the headphone's support, first speaker unit, and noise-canceling microphone. Figure 16 According to Figure 12 The enlarged view of the part of the headphone structure shown in the diagram, circled at F; Figure 17 According to Figures 11-12 The diagram shows the connection between the bracket and the first speaker unit. Figure 18 According to Figures 11-12 A schematic diagram showing the assembly of a portion of the front shell, the support, and the first speaker unit of the headphones; Figure 19 According to Figure 18 A schematic diagram from another direction showing a portion of the front shell, the support, and the first speaker unit of the headphones in combination; Figure 20 According to Figure 17 The diagram shows another direction of the bracket after it is engaged with the first speaker unit; Figure 21 According to Figure 11 The diagram shows a cross-sectional view of the earphone's partial structure at the HH line, where the first signal trace, conductive trace, and motherboard are not shown. Figure 22 The curves showing the frequency and sound pressure level changes of the headphones in this embodiment of the application are shown.

[0058] Figure label: 100. Headphones; 1. Outer shell; 10. Accommodating space; 101. First accommodating cavity; 1011. Supporting step; 11. Front shell; 110. Sound outlet; 111. Main body; 1111. First area; 1112. Second area; 1113. Wiring groove; 1114. Wiring channel; 1115. Second positioning part; 1116. Balance hole; 112. Sound outlet; 1121. Limiting rib; 113. First step; 12. Rear shell; 102. Second accommodating cavity; 103. Third accommodating cavity; 121. Cover; 122. Rod; 1221. Front rod; 1222. Rear rod; 123. Charging contact; 13. Contact sleeve; 2. Motherboard; 3. Battery; 4. Moving-coil loudspeaker unit; K1, front cavity; K2, rear cavity; 4a. Second loudspeaker unit; 4a1. Diaphragm assembly; 4a11. Connecting section; 4a12. Surround; 4a13. Dome; 4a2. Voice coil; 4a3. Magnetic circuit system; 4a3a. Magnetic gap; 4a31. Side magnet; 4a32. First center magnet; 4a33. Second center magnet; 4a34. Magnetic yoke; 4a4. Frame; 4a43. Annular groove; 4a5. Terminal block; 4a51. Negative terminal block; 4a52. Positive terminal block; 4a6. Conductive wiring; 4b. First loudspeaker unit; 4b1. Vibrating plate; 4b11. Supporting part; 4b12. Connecting part; 4b13. First contour surface; 4b13a. First clearance gap; 4b14. Second contour surface; 4b14a. Second clearance gap; 4b15. Third positioning part; 4b2. Piezoelectric ceramic sheet; 4b21. First electrode layer; 4b22. Second electrode layer; 4b23. Piezoelectric element; 4b3. External terminal; 4b31. Positive external terminal; 4b32. Negative external terminal; 4bb. Sound outlet channel; 5. First signal routing; 6. Second signal routing; 7. Bracket; 71. Support plate; 72. Fixing part; 721. Annular flange; 722. Fixing plate; 723. Sound transmission channel; 724. Clearance groove; 724a. Clearance space; 725. Avoidance groove; 726. First positioning part; 727. Avoidance notch; 8. Noise-canceling microphone. Detailed Implementation

[0059] In the embodiments of this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of that feature.

[0060] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. "Rotary connection" refers to a connection where the two parts can rotate relative to each other after connection. "Sliding connection" refers to a connection where the two parts can slide relative to each other after connection.

[0061] The directional terms used in the embodiments of this application, such as "inner" and "outer," are merely for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. Furthermore, unless otherwise stated in this application, "multiple" as used in this application refers to two or more.

[0062] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0063] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship. It should be noted that the effective vibration area of ​​the diaphragm assembly mentioned herein refers to the area of ​​the portion of the diaphragm assembly capable of propelling air movement.

[0064] This application provides an earphone that can be used with electronic products such as mobile phones, tablets, and laptops to receive sound information provided by the electronic products and output it to the user. By using the earphone with electronic products, the sound from the electronic products can be prevented from disturbing others. The earphone can be wireless or wired.

[0065] Please see Figure 1 and Figure 2 , Figure 1This is a schematic diagram of the structure of the earphone 100 provided in some embodiments of this application; Figure 2 for Figure 1 The exploded view of the earphone 100 shown is shown. Figure 1 and Figure 2 The illustrated earphone 100 is a wireless earphone as an example. In this embodiment, the earphone 100 may include a housing 1, a motherboard 2, a battery 3, a wireless communication module (not shown), and a dynamic speaker unit 4.

[0066] Understandable, Figure 1 , Figure 2 The accompanying drawings below only schematically illustrate some of the components included in the earphone 100; the actual shape, size, position, and construction of these components are not subject to change. Figure 1 , Figure 2 As well as the accompanying drawings below. Furthermore, when the earphone 100 is a wired earphone, it may not include the battery 3 and the wireless communication module.

[0067] The outer shell 1 has a receiving space 10. Functional components such as the motherboard 2, battery 3, wireless communication module, and dynamic speaker unit 4 can be housed within the receiving space 10 of the outer shell 1. Thus, the outer shell 1 can serve as a carrier for the functional components in the earphone 100, protecting the functional components located within the receiving space 10 of the outer shell 1. Furthermore, when a user wears the earphone 100, the earphone 100 contacts the user's ear through the outer shell 1. Therefore, to improve the user's comfort when wearing the earphone 100, the outer shell 1 can be shaped to conform to the shape of the human ear.

[0068] Since the outer shell 1 is directly exposed to the external environment and in contact with the human ear, or the earphone 100 comes into contact with other external structures through the outer shell 1, scratches and corrosion on the outer surface of the outer shell 1 are inevitable. To avoid this technical problem, the outer shell 1 can have certain properties such as wear resistance, corrosion resistance, and scratch resistance, or a layer of functional material for wear resistance, corrosion resistance, and scratch resistance can be coated on the outer surface of the outer shell 1.

[0069] In some embodiments, the outer shell 1 can be a single structural unit, meaning it can be a one-piece molded part, which provides higher structural strength. In other embodiments, the outer shell 1 can also be formed by assembling multiple parts. Please continue reading. Figure 1 and Figure 2In this embodiment, the outer shell 1 may include a front shell 11 and a rear shell 12. The front shell 11 faces the user's ear when the earphone 100 is in use, while the rear shell 12 faces away from the user's ear. The front shell 11 and the rear shell 12 are detachably connected. The assembly of the front shell 11 and the rear shell 12 defines the aforementioned accommodating space 10. This facilitates the separate processing of the front shell 11 and the rear shell 12, simplifying the mold structure of the front shell 11 and the rear shell 12, thereby reducing the molding difficulty of the front shell 11 and the rear shell 12, and consequently reducing the manufacturing difficulty of the outer shell 1. It also facilitates the disassembly of the front shell 11 and the rear shell 12 for the maintenance of the earphone 100. Specifically, the front shell 11 can be fixedly connected to the rear shell 12 by a snap-fit ​​method. The front shell 11 can also be connected to the rear shell 12 by screws. Alternatively, in other embodiments, the front shell 11 can also be fixedly connected to the rear shell 12 by adhesive.

[0070] The front shell 11 can be made of materials including but not limited to hard plastic, metal, and a combination of plastic and metal. To achieve a lightweight design for the Headphones 100, the front shell 11 can be made of hard plastic.

[0071] Please see Figure 2 The front shell 11 may include a main body 111 and a sound outlet 112. A first receiving cavity 101 may be formed within the main body 111, and the side of the first receiving cavity 101 adjacent to the rear shell 12 is open. The sound outlet 112 may be located on the side of the main body 111 away from the rear shell 12 and extend in a direction away from the rear shell 12. The sound outlet 112 communicates with the first receiving cavity 101, and a sound outlet hole 110 is formed at the end of the sound outlet 112 away from the main body 111. By providing the sound outlet 112 and setting the sound outlet hole 110 on the sound outlet 112, it is easier for the sound outlet 112 to extend into the ear canal of the human ear, thereby shortening the distance between the sound outlet hole 110 of the earphone 100 and the eardrum of the human ear, which is beneficial for the sound emitted by the earphone 100 to be well received by the user and improves the user experience.

[0072] The main body 111 and the sound outlet 112 can be integrally molded. This can improve the connection strength between the main body 111 and the sound outlet 112, simplify the processing technology, and reduce production costs.

[0073] Of course, in other examples, the main body 111 and the sound outlet 112 can also be processed separately and then connected by fastening, screw connection, welding or gluing. This makes it easier to process the main body 111 and the sound outlet 112 separately, which helps to simplify the mold structure of the main body 111 and the sound outlet 112, thereby reducing the molding difficulty of the main body 111 and the sound outlet 112, and thus reducing the processing and manufacturing difficulty of the front shell 11.

[0074] It is understood that in some other embodiments, the front shell 11 may not include the sound outlet 112, but instead the sound outlet 110 is directly opened on the wall of the main body 111.

[0075] To improve user comfort when wearing the headphones, please continue reading. Figure 1 and Figure 2 The earphone 100 may also be provided with a contact sleeve 13. This contact sleeve 13 is used to contact the user's ear. For example, the contact sleeve 13 may surround the outer periphery of the sound outlet 112, and the contact sleeve 13 may be similar in shape to the human ear canal to improve the comfort of wearing the earphone 100. The material of the contact sleeve 13 includes, but is not limited to, silicone and rubber, to improve the user's comfort when wearing the earphone 100.

[0076] Please see Figure 2 A limiting rib 1121 can be formed on the outer peripheral surface of the sound outlet 112 at the end away from the main body 111. When the contact sleeve 13 surrounds the outer peripheral surface of the sound outlet 112, a portion of the contact sleeve 13 abuts against the limiting rib 1121 and the main body 111, thereby limiting the contact sleeve 13 and reducing the probability of it naturally detaching from the sound outlet 112. Of course, to reduce costs, the earphone 100 may not include the contact sleeve 13.

[0077] The material of the back cover 12 can be the same as that of the front cover 11. Of course, the material of the back cover 12 can also be different from that of the front cover 11. In order to achieve the lightweight design of the earphone 100, the material of the back cover 12 can be hard plastic.

[0078] Please continue reading. Figure 2 The rear shell 12 may include a cover 121 and a rod 122. The cover 121 may be connected to the front shell 11, and the rod 122 may be disposed on the side of the cover 121 away from the front shell 11. A second receiving cavity 102 may be formed inside the cover 121, and the side of the second receiving cavity 102 adjacent to the front shell 11 is open, so that the second receiving cavity 102 can communicate with the first receiving cavity 101. The rod 122 has a third receiving cavity 103. The third receiving cavity 103 communicates with the second receiving cavity 102. And the third receiving cavity 103, the second receiving cavity 102, and the first receiving cavity 101 can together form the receiving space 10 of the outer shell 1.

[0079] The rod 122 includes a front rod 1221 and a rear rod 1222. The front rod 1221 is fixed to the cover 121. The front rod 1221 and the cover 121 can be a single integral structure. This simplifies the manufacturing process of the rear cover 12 and improves the connection strength between the cover 121 and the front rod 1221. The rear rod 1222 is detachably disposed on the side of the front rod 1221 away from the main body 111. The front rod 1221 and the rear rod 1222 cooperate to define a third receiving cavity 103. The front rod 1221 and the rear rod 1222 can be connected by means of adhesive, snap-fit, or screw connection.

[0080] The motherboard 2 can be accommodated within the receiving space 10 of the housing 1. Specifically, the motherboard 2 can be installed within the second receiving cavity 102. The installation methods of the motherboard 2 within the housing 1 include, but are not limited to, snap-fit, screw connection, or adhesive bonding.

[0081] Motherboard 2 is used to integrate control chips, such as application processors (APs), double data rate synchronous dynamic random access memory (DDR), and universal flash storage (UFS). Motherboard 2 is electrically connected to functional components such as the wireless communication module, battery 3, and dynamic speaker unit 4 to realize signal control and data signal processing between different functional components.

[0082] Motherboard 2 can be a rigid circuit board, a flexible printed circuit (FPC), or a rigid-flex circuit board. Motherboard 2 can use FR- dielectric boards, Rogers dielectric boards, or hybrid dielectric boards of FR- and Rogers, etc. Here, FR- is a designation for a flame-retardant material grade, and Rogers dielectric boards are a type of high-frequency board.

[0083] A wireless communication module (not shown) can be integrated onto the motherboard 2. For example, the wireless communication module can be soldered and fixed onto the motherboard 2. Optionally, the wireless communication module can be a Bluetooth, infrared, or Wi-Fi module. The earphone 100 can wirelessly interact with electronic products via this wireless communication module to receive audio information from the electronic products.

[0084] Battery 3 provides power to functional devices within the earphone 100, such as the motherboard 2, wireless communication module, and dynamic speaker unit 4. Battery 3 may include, but is not limited to, nickel-cadmium, nickel-metal hydride, lithium, or other types of batteries. Furthermore, the number of batteries 3 in this embodiment may be multiple or a single battery. The shape of battery 3 includes, but is not limited to, a cuboid, cylinder, or frustum. In some examples, battery 3 may be located within the second receiving cavity 102, and battery 3 may be located on the side of the motherboard 2 closest to the first receiving cavity 101. In other examples, battery 3 may be located within the second receiving cavity 102, and battery 3 may be located on the side of the motherboard 2 opposite to the first receiving cavity 101. The installation method of battery 3 within the housing 1 includes, but is not limited to, snap-fit, screw connection, or adhesive bonding.

[0085] To achieve charging of battery 3, please refer to some examples. Figure 1 and Figure 2 The rod 122 is provided with a charging contact 123. A charging circuit (not shown) is provided in the third receiving cavity 103, which electrically connects the charging contact 123 to the main board 2 in the second receiving cavity 102. When the charging contact 123 is electrically connected to the interface of the external power supply, the external power supply can charge the earphone 100.

[0086] Please continue reading. Figure 2 The dynamic speaker unit 4 can be installed within the first receiving cavity 101, thus positioning it on the side of the battery 3 near the sound outlet 110. Positioning the dynamic speaker unit 4 close to the sound outlet 110 improves sound quality. The assembly method between the dynamic speaker unit 4 and the housing 1 includes, but is not limited to, snap-fit, threaded connection, or adhesive bonding. The dynamic speaker unit 4 is electrically connected to the main board 2 to acquire audio signals such as music and voice, and can convert these audio signals into sound signals, supporting external audio playback.

[0087] Please see Figure 3 , Figure 3 According to Figures 1-2 The diagram shows a cross-sectional view of the front shell 11 of the earphone 100 after it is fitted with the moving-coil speaker unit 4. The cavity of the front shell 11 located between the moving-coil speaker unit 4 and the sound outlet 110 can be formed as the front cavity K1 of the moving-coil speaker unit 4.

[0088] The above Figures 1-3In the illustrated embodiment, the dynamic speaker unit 4 is a woofer. While this enables the headphones 100 to have low-frequency performance and reduces its cost, the dynamic speaker unit 4 has a large vibrating mass and poor transient response. The asymmetrical distribution of mass distribution, diaphragm compliance, and BL electromagnetic driving force produces varying degrees of rocking vibration and segmented vibration at different frequencies, resulting in severe peaks and valleys in the high-frequency response. This makes it impossible to achieve high-frequency performance, leading to poor audio output performance and poor sound quality of the headphones 100. Furthermore, since the front cavity K1 of the dynamic speaker unit 4 is formed by the cavity between the dynamic speaker unit 4 and the sound outlet 110 in the front shell 11, the large volume of the front cavity K1 further hinders the high-frequency performance of the dynamic speaker unit 4.

[0089] Please see Figure 4 and Figure 5 , Figure 4 This is a partial structural schematic diagram of the earphone 100 provided in other embodiments of this application; Figure 5 According to Figure 4 The diagram shows a partial cross-sectional view of the headphone 100 at line AA. In this embodiment, the headphone 100 no longer includes only one dynamic speaker unit 4, but includes two speaker units, namely a first speaker unit 4b and a second speaker unit 4a.

[0090] Understandable, Figure 4 and Figure 5 The accompanying drawings below only schematically illustrate some of the components included in the earphone 100; the actual size, location, and construction of these components are not subject to change. Figure 4 and Figure 5 As well as the limitations of the accompanying figures below.

[0091] The first speaker unit 4b and the second speaker unit 4a are each independently fixed inside the housing 1. Specifically, the first speaker unit 4b and the second speaker unit 4a are each independently fixed inside the first receiving cavity.

[0092] It should be noted that "the first speaker unit 4b and the second speaker unit 4a are each independently fixed inside the housing 1" means that the first speaker unit 4b and the second speaker unit 4a are not fixed into the housing 1 as a whole. Instead, the first speaker unit 4b and the second speaker unit 4a are installed separately and independently inside the housing 1, and there is a specific order in which they are installed. For example, the first speaker unit 4b is fixed into the housing 1 first, and then the second speaker unit 4a is fixed into the housing 1. Or, the second speaker unit 4a is fixed into the housing 1 first, and then the first speaker unit 4b is fixed into the housing 1.

[0093] In the earphone 100 of this application embodiment, by fixing the first speaker unit 4b and the second speaker unit 4a independently in the housing 1, when one of the first speaker unit 4b and the second speaker unit 4a malfunctions or is damaged, only the damaged one needs to be removed, replaced or repaired. This avoids the need to completely disassemble and replace the first speaker unit 4b and the second speaker unit 4a as a whole due to modularizing the first speaker unit 4b and the second speaker unit 4a, which helps to reduce maintenance costs and also avoids damage to the speaker unit that does not need to be replaced during the disassembly process.

[0094] Furthermore, compared with the modular design of the first speaker unit 4b and the second speaker unit 4a, the independent fixing of the first speaker unit 4b and the second speaker unit 4a within the housing 1 eliminates the need for a connector between the first speaker unit 4b and the second speaker unit 4a. The housing 1 can be used as the connector to achieve a physical connection between the two, which helps to save space within the housing 1, allowing for the integration of more functional components into the earphone 100. It also helps to optimize the structural layout within the earphone 100.

[0095] The second speaker unit 4a is located on the side of the first speaker unit 4b away from the sound outlet 110, and the second speaker unit 4a is spaced apart from the first speaker unit 4b. Both the first speaker unit 4b and the second speaker unit 4a emit sound towards the sound outlet 110. The emission frequency of the first speaker unit 4b is greater than that of the second speaker unit 4a. Therefore, by including the first speaker unit 4b and the second speaker unit 4a with different emission frequencies in the headphone 100, it is advantageous to utilize the difference in emission frequencies between the first speaker unit 4b and the second speaker unit 4a to enable the headphone 100 to have better sound performance in different frequency ranges, thereby improving the sound output effect of the headphone 100.

[0096] In this embodiment, the first speaker unit 4b serves as a tweeter. Specifically, the first speaker unit 4b can be a piezoelectric ceramic speaker unit. The second speaker unit 4a can be a woofer or a mid-bass speaker. Specifically, the second speaker unit 4a can be one of the aforementioned... Figures 1-3 The second speaker unit 4a is shown as a moving-coil speaker unit 4. Of course, it is understood that in other examples, the second speaker unit 4a could also be a moving-iron speaker unit or a planar voice coil speaker unit.

[0097] Please continue reading. Figure 5 The first speaker unit 4b, the second speaker unit 4a, and the inner wall of the housing 1 can form a cavity. This cavity serves as the front cavity K1 of the second speaker unit 4a, and the front cavity K1 is connected to the sound outlet 110 via the sound outlet channel 4bb. Thus, in conjunction with the above... Figures 1-3 Compared to the embodiment shown where a single dynamic speaker unit 4 is provided in the housing 1 of the earphone 100, using the cavity formed by the first speaker unit 4b, the second speaker unit 4a, and the inner wall of the housing 1 as the front cavity K1 of the second speaker unit 4a helps to reduce the volume of the front cavity K1. This can at least to some extent improve the high-frequency performance of the second speaker unit 4a in a specific high-frequency band, and the structure is more compact. Furthermore, by utilizing the characteristic that the emission frequency of the first speaker unit 4b is greater than that of the second speaker unit 4a, the high-frequency deficiency of the earphone 100 in the above embodiment can be further improved, so that the earphone 100 has better sound performance in different frequency ranges, thus improving the sound output effect of the earphone 100.

[0098] Please see Figure 6 and Figure 7 , Figure 6 According to Figures 4-5 A perspective view of the second speaker unit 4a in the earphone 100 shown; Figure 7 for Figure 6 The diagram shows a cross-sectional view of the second loudspeaker unit 4a. In this embodiment, the second loudspeaker unit 4a is a moving-coil loudspeaker unit and includes a diaphragm assembly 4a1, a voice coil 4a2, a magnetic circuit system 4a3, a frame 4a4, and a terminal block 4a5.

[0099] Understandable, Figure 6 and Figure 7 The accompanying drawings below only schematically illustrate some of the components included in the second speaker unit 4a. The actual size, location, and construction of these components are not subject to change. Figure 6 and Figure 7 As well as the limitations of the accompanying figures below.

[0100] Specifically, the second speaker unit 4a is fixed to the housing 1 (e.g., the first receiving cavity 101) by means of a frame 4a4. The assembly method between the frame 4a4 and the housing 1 includes, but is not limited to, snap-fit, threaded connection, or adhesive bonding. For example, a support step 1011 is formed on the inner peripheral wall of the first receiving cavity 101 (in conjunction with...). Figure 5 The second speaker unit 4a is supported and fixed on the support step 1011 by means of the frame 4a4, so as to facilitate the positioning and installation of the second speaker unit 4a.

[0101] The speaker frame 4a4 is open on the side facing the sound outlet 110. The frame 4a4 serves as the "support skeleton" of the second speaker unit 4a, supporting the diaphragm assembly 4a1, voice coil 4a2, and magnetic circuit system 4a3. The frame 4a4 can be made of materials including, but not limited to, metal, plastic, and a combination of metal and plastic. The frame 4a4 can be a single molded part, meaning it is a one-piece structure. This improves the connection strength of the frame 4a4.

[0102] Of course, this application is not limited to this. The basin frame 4a4 can also be assembled from different parts, and multiple different parts can be connected by snap-fit, threaded connection, adhesive or welding.

[0103] Please continue reading. Figure 7 The diaphragm assembly 4a1 is fixed to the open end of the frame 4a4. Specifically, the inner circumferential surface of the open end of the frame 4a4 is provided with an annular groove 4a43 recessed in a direction away from the central axis of the frame 4a4. The annular groove 4a43 extends in a ring shape along the circumference of the frame 4a4 and extends through to the end face of the open end of the frame 4a4, that is, the end face facing the sound outlet 110. The outer edge of the diaphragm assembly 4a1 is received in the annular groove 4a43 and fixed to the wall surface of the annular groove 4a43 opposite to the sound outlet 110.

[0104] In the embodiments of this application, by accommodating the outer edge of the diaphragm assembly 4a1 within the annular groove 4a43 and fixing it to the wall surface of the annular groove 4a43 opposite to the sound outlet 110, it is advantageous to effectively support the diaphragm assembly 4a1 using the annular groove 4a43. Simultaneously, the arrangement of the annular groove 4a43 increases the volume of the space within the frame 4a4, allowing for a larger size of the diaphragm assembly 4a1, thereby increasing the effective vibration area of ​​the diaphragm assembly 4a1 and improving the sound output performance of the second speaker unit 4a. It is understood that the annular groove 4a43 may not be provided on the frame 4a4, and the outer edge of the diaphragm assembly 4a1 may be fixedly connected to the open end face of the frame 4a4.

[0105] In this way, the front cavity K1 of the second speaker unit 4a can be enclosed by the diaphragm assembly 4a1, the first speaker unit 4b, and the inner wall of the housing 1. It can be understood that the rear cavity K2 of the second speaker unit 4a is located on the side of the diaphragm assembly 4a1 furthest from the front cavity K1. The voice coil 4a2, the magnetic circuit system 4a3, and the frame 4a4 are located within the rear cavity K2.

[0106] Please continue reading. Figure 7 The diaphragm assembly 4a1 includes: a connecting section 4a11, a folded ring 4a12, and a dome 4a13 surrounded by the folded ring 4a12.

[0107] The connecting segment 4a11 is in the shape of an annular sheet. For example, the connecting segment 4a11 is a circular ring or a rectangular ring. The connecting segment 4a11 is stacked on the wall surface of the annular groove 4a43 opposite to the sound outlet 110, so that the diaphragm assembly 4a1 is connected to the frame 4a4 via the connecting segment 4a11. The connection method between the connecting segment 4a11 and the annular groove 4a43 includes, but is not limited to, adhesive bonding, snap-fitting, welding, or screw connection.

[0108] The outer peripheral edge of the folding ring 4a12 is connected to the inner peripheral edge of the connecting section 4a11. The cross-sectional shape of the folding ring 4a12 is arc-shaped or approximately arc-shaped. The folding ring 4a12 extends in a circular or rectangular pattern along the circumferential trajectory of the frame 4a4. The folding ring 4a12 protrudes towards the sound outlet 110.

[0109] This allows the folded ring 4a12 to deform under external force, enabling the dome 4a13 to vibrate axially relative to the connecting section 4a11 along the diaphragm assembly 4a1, while also helping to further reduce the volume of the front cavity K1. Of course, it is understandable that the folded ring 4a12 can also protrude in a direction away from the sound outlet 110.

[0110] In some examples, the diaphragm assembly 4a1 is a single molded component. That is, the connecting segment 4a11, the folded ring 4a12, and the dome 4a13 are a single, integral structure. This design improves the structural strength of the diaphragm assembly 4a1 and facilitates its manufacturing. However, this application is not limited to this; the connecting segment 4a11, the folded ring 4a12, and the dome 4a13 can also be independently molded components. The connecting segment 4a11 and the folded ring 4a12 can be bonded together, as can the folded ring 4a12 and the dome 4a13. The materials of the diaphragm assembly 4a1 include, but are not limited to, metal, plastic, plant fibers, and animal fibers.

[0111] The voice coil 4a2 is connected to the surface of the dome 4a13 opposite to the sound outlet 110. The connection between the voice coil 4a2 and the dome 4a13 can be made by means including but not limited to adhesive bonding.

[0112] The magnetic circuit system 4a3 is fixed within the frame 4a4. The magnetic circuit system 4a3 has an annular magnetic gap 4a3a. The end of the voice coil 4a2 furthest from the diaphragm assembly 4a1 can extend into the magnetic gap 4a3a. Thus, the magnetic circuit system 4a3 can cooperate with the voice coil 4a2 to drive the diaphragm assembly 4a1 to vibrate synchronously. Specifically, when the voice coil 4a2 is energized, it generates an induced magnetic field. The magnetic circuit system 4a3 responds to this induced magnetic field, causing the voice coil 4a2 to displace under the magnetic force of the magnetic circuit system 4a3, thereby driving the diaphragm assembly 4a1 to vibrate. This vibration of the air within the front cavity K1 generates sound, which is output through the sound outlet 110.

[0113] Please continue reading. Figure 7The magnetic circuit system 4a3 includes: a side magnetic portion 4a31, a first central magnetic portion 4a32, and a second central magnetic portion 4a33. The side magnetic portion 4a31 is located on the outer periphery of the first central magnetic portion 4a32 to define a magnetic gap 4a3a with the first central magnetic portion 4a32. The magnetization directions of the side magnetic portion 4a31 and the first central magnetic portion 4a32 are opposite, so that the side magnetic portion 4a31 and the first central magnetic portion 4a32 can form a magnetic circuit for driving the voice coil 4a2 to move. For example, along the axial direction of the frame 4a4 and in a direction away from the diaphragm assembly 4a1, the magnetization direction of the side magnetic portion 4a31 is from the north pole (N) to the south pole (S), and the magnetization direction of the first central magnetic portion 4a32 is from the south pole (S) to the north pole (N).

[0114] Please continue reading. Figure 7 The edge magnetic portion 4a31 can be formed as a ring. For example, the edge magnetic portion 4a31 can be formed as a circular ring or a rectangular ring. Of course, it is understood that the edge magnetic portion 4a31 can also be non-ring-shaped, and there can be multiple edge magnetic portions 4a31, which are spaced apart in the circumferential direction of the first central magnetic portion 4a32.

[0115] The second central magnet 4a33 blocks the end of the side magnet 4a31 that is away from the diaphragm assembly 4a1, and the first central magnet 4a32 and the second central magnet 4a33 are stacked together. The second central magnet 4a33 and the side magnet 4a31 can be integrally formed. That is, the second central magnet 4a33 and the side magnet 4a31 can be a single structural unit. Of course, this application is not limited to this; the second central magnet 4a33 and the side magnet 4a31 can also be connected by means of adhesive bonding, snap-fit, threaded connection, etc.

[0116] Specifically, the second central magnetic part 4a33 can be made of a magnetically conductive material. This allows the second central magnetic part 4a33 to confine the leakage of magnetic field lines, increasing the magnetic induction intensity of the magnetic circuit system 4a3. Of course, this application is not limited to this; in other examples, the second central magnetic part 4a33 can be a magnet. Specifically, the magnet is a magnetic steel magnet or a magnetic steel magnet.

[0117] In some examples, both the edge magnetic portion 4a31 and the first central magnetic portion 4a32 can be magnets. Exemplarily, both the edge magnetic portion 4a31 and the first central magnetic portion 4a32 are magnets or magnetic steel. Of course, this application is not limited to this; in other embodiments, one of the edge magnetic portion 4a31 and the first central magnetic portion 4a32 is a magnet, and the other is a magnetically conductive material.

[0118] To increase the magnetic induction intensity of the magnetic circuit system 4a3, the magnetic circuit system 4a3 also includes a magnetically conductive yoke 4a34. The magnetically conductive yoke 4a34 is located on the side of the first central magnetic part 4a32 facing the diaphragm assembly 4a1, and is used to constrain the leakage of magnetic field lines, thereby increasing the driving force on the diaphragm assembly 4a1.

[0119] Specifically, the outer peripheral surface of the magnetic yoke 4a34 and the outer peripheral surface of the first central magnetic part 4a32 are flush along the axial direction of the magnetic circuit system 4a3. This helps to further improve the constraint effect of the magnetic yoke 4a34 on the magnetic lines of force, increase the magnetic induction intensity of the magnetic circuit system 4a3, and the magnetic yoke 4a34 does not affect the magnetic gap 4a3a, which helps to improve the compatibility between the magnetic circuit system 4a3 and the voice coil 4a2.

[0120] Please see Figure 6 The terminal block 4a5 is disposed on the basin frame 4a4. Specifically, the terminal block 4a5 is located on the outer side of the basin frame 4a4. For example, the terminal block 4a5 may protrude from the outer peripheral surface of the basin frame 4a4. As another example, a groove may be formed on the outer peripheral surface of the basin frame 4a4, and the terminal block 4a5 may be located within the groove. Regarding the arrangement of the terminal block 4a5, those skilled in the art can design it according to actual needs, as long as the terminal block 4a5 is located on the outer side of the basin frame 4a4.

[0121] Terminal 4a5 includes a positive terminal 4a52 and a negative terminal 4a51. The portion of the positive terminal 4a52 located within the frame 4a4 is electrically connected to the positive lead of the voice coil 4a2. In some examples, the portion of the positive terminal 4a52 located within the frame 4a4 can be soldered to the positive lead of the voice coil 4a2. The portion of the negative terminal 4a51 located within the frame 4a4 is electrically connected to the negative lead of the voice coil 4a2. In some examples, the portion of the negative terminal 4a51 located within the frame 4a4 can be soldered to the negative lead of the voice coil 4a2. This facilitates energizing the voice coil 4a2.

[0122] Please see Figure 8 , Figure 8 According to Figures 4-5 The image shows a perspective view of the first speaker unit 4b in the earphone 100. In this embodiment, the first speaker unit 4b is a piezoelectric ceramic speaker unit. In the embodiments of this application, the piezoelectric ceramic speaker unit is thin, small in size, and has good high-frequency sound effects.

[0123] To facilitate communication between the front cavity K1 and the sound outlet 110, the sound outlet channel 4bb can be formed on the first speaker unit 4b. For details, please refer to [link / reference needed]. Figure 8 There is one sound output channel 4bb, and the first loudspeaker unit 4b is in a ring shape to define the one sound output channel 4bb.

[0124] Furthermore, to improve the sound output effect of the sound output channel 4bb, the first speaker unit 4b and the second speaker unit 4a are coaxially arranged, and the sound output channel 4bb is located in the middle of the first speaker unit 4b. In this way, the sound generated by the vibration of the diaphragm assembly 4a1 driving the air in the front cavity K1 can be transmitted towards the sound outlet 110 through the sound output channel 4bb.

[0125] In other examples, there may be multiple sound outlet channels 4bb, which are formed in the first speaker unit 4b and spaced apart. Of course, this application is not limited to this. In other examples, the sound outlet channels 4bb may also be formed between the outer peripheral edge of the first speaker unit 4b and the inner wall of the housing 1.

[0126] Please continue reading. Figure 8 and Figure 9 ,in, Figure 9 According to Figure 8 The diagram shows a cross-sectional view of the first loudspeaker unit 4b at the BB line. The first loudspeaker unit 4b includes a diaphragm 4b1 and a piezoelectric ceramic plate 4b2.

[0127] Understandable, Figure 8 and Figure 9 The accompanying drawings below only schematically illustrate some components of the first speaker unit 4b; the actual shape, size, location, and construction of these components are not subject to change. Figure 8 and Figure 9 As well as the limitations of the accompanying figures below.

[0128] The vibrating plate 4b1 is an annular plate. For example, the vibrating plate 4b1 is a circular annular plate, a square annular plate, or an irregularly shaped annular plate. The outer periphery of the vibrating plate 4b1 is adapted to the inner wall surface of the outer casing 1.

[0129] The vibrating plate 4b1 is arranged opposite to the diaphragm assembly 4a1. For example, the vibrating plate 4b1 and the diaphragm assembly 4a1 are arranged parallel to each other. Here, "parallel" means that they are completely parallel, i.e., the included angle is 0°, or it can be within a certain error range, such as the included angle between -10° and 10°. The material of the vibrating plate 4b1 includes, but is not limited to, metal and plastic.

[0130] The first speaker unit 4b is fixed inside the housing 1 by a diaphragm 4b1. Specifically, the first speaker unit 4b is fixed inside the first receiving cavity 101 by the outer peripheral edge of the diaphragm 4b1. Specifically, the diaphragm 4b1 includes a supporting part 4b11 and a connecting part 4b12.

[0131] The supporting portion 4b11 supports the piezoelectric ceramic sheet 4b2 and faces it directly. The connecting portion 4b12 is arranged around the outer periphery of the supporting portion 4b11. The connecting portion 4b12 is then fixed to the inner wall of the outer casing 1. Thus, when the vibrating plate 4b1 is connected to the outer casing 1, the piezoelectric ceramic sheet 4b2 is suspended, and the supporting portion 4b11 of the vibrating plate 4b1 is also suspended, facilitating the vibration of the vibrating plate 4b1 driven by the piezoelectric ceramic sheet 4b2.

[0132] For example, a first step 113 is formed on the inner wall surface of the outer casing 1, and the connecting part 4b12 can be supported and fixed on the first step 113. The connection method between the vibrating plate 4b1 and the inner wall surface of the outer casing 1 includes, but is not limited to, adhesive bonding, snap-fitting, welding or screw connection.

[0133] Since the diaphragm 4b1 is connected to the outer shell 1, when the diaphragm 4b1 vibrates under the drive of the piezoelectric ceramic sheet 4b2, it will inevitably transmit the vibration to the outer shell 1, resulting in poor comfort for the user wearing the headphones 100 and also negatively impacting the sound performance of the first speaker unit 4b. To solve this technical problem, the part of the front shell 11 that is fixed to the diaphragm 4b1 can be made of a flexible material, such as rubber or silicone. Of course, it is understandable that the material of this part does not have to be flexible.

[0134] A piezoelectric ceramic sheet 4b2 is stacked on the surface of the diaphragm plate 4b1 facing the sound outlet 110. This allows the front cavity K1 to be defined by the surface of the diaphragm plate 4b1 facing the second speaker unit 4a, the diaphragm assembly 4a1, and the inner wall of the housing 1, thereby improving the regularity of the shape of the front cavity K1 and further enhancing the sound output performance of the second speaker unit 4a. Alternatively, in other examples, the piezoelectric ceramic sheet 4b2 can also be disposed on the surface of the diaphragm plate 4b1 facing the second speaker unit 4a. Or, piezoelectric ceramic sheets 4b2 can be disposed on both sides of the diaphragm plate 4b1 in the thickness direction. The connection method between the piezoelectric ceramic sheet 4b2 and the diaphragm plate 4b1 includes, but is not limited to, adhesive bonding.

[0135] The piezoelectric ceramic sheet 4b2 is ring-shaped. It can be understood that the stacked ring-shaped piezoelectric ceramic sheet 4b2 and the ring-shaped diaphragm 4b1 can jointly define the aforementioned sound output channel 4bb.

[0136] The piezoelectric ceramic sheet 4b2 includes a piezoelectric body 4b23, a first electrode layer 4b21, and a second electrode layer 4b22. The piezoelectric body 4b23, the first electrode layer 4b21, and the second electrode layer 4b22 are stacked sequentially. In some examples, the first electrode layer 4b21, the piezoelectric body 4b23, and the second electrode layer 4b22 can each be a single layer. In other examples, the first electrode layer 4b21, the piezoelectric body 4b23, and the second electrode layer 4b22 can each be multiple layers, with the multiple layers of first electrode layer 4b21, multiple layers of piezoelectric body 4b23, and multiple layers of second electrode layer 4b22 arranged sequentially along the first electrode layer 4b21, the piezoelectric body 4b23, and the second electrode layer 4b22, ensuring that there is one piezoelectric body 4b23 between any two adjacent electrode layers.

[0137] The materials of the piezoelectric 4b23 include, but are not limited to, aluminum nitride, zinc oxide, and rare earth element doped materials of the above materials (such as scandium doping with a certain atomic ratio). Lead zirconate, lead zirconate titanate, lanthanum lead zirconate titanate, doped lead zirconate titanate, barium titanate, lithium niobate, lithium tantalate, polyvinylidene fluoride (PVDF), tungsten bronze structure compounds, and solid solutions of barium titanate and bismuth ferrite, etc.

[0138] The first electrode layer 4b21 can be formed on the piezoelectric material 4b23 by processes such as vapor deposition, electroplating, or sputtering. The material of the first electrode layer 4b21 can be a metal. Specifically, for example, the materials of the first electrode layer 4b21 include, but are not limited to, molybdenum, aluminum, tungsten, ruthenium, gold, platinum, silver, copper, palladium, chromium, iron, tin, and nickel.

[0139] The second electrode layer 4b22 can be formed on the piezoelectric material 4b23 through processes such as vapor deposition, electroplating, or sputtering. The material of the second electrode layer 4b22 can be a metal. Specifically, for example, the materials of the second electrode layer 4b22 include, but are not limited to, molybdenum, aluminum, tungsten, ruthenium, gold, platinum, silver, copper, palladium, chromium, iron, tin, and nickel. The materials of the first electrode layer 4b21 and the second electrode layer 4b22 can be the same or different.

[0140] Please continue reading. Figure 9 To facilitate the electrical connection between the first speaker unit 4b and the motherboard 2, the first speaker unit 4b has an external terminal 4b3. The external terminal 4b3 is located on the side of the first speaker unit 4b facing the sound outlet 110. By positioning the external terminal 4b3 on the side of the first speaker unit 4b facing the sound outlet 110, it is easier to form the front cavity K1 of the second speaker unit 4a, preventing the problem of being unable to connect the external terminal 4b3 to signal traces due to its location within the front cavity K1. Of course, it is understood that in other examples, the external terminal 4b3 may also face the second speaker unit 4a.

[0141] For details, please refer to Figure 9 and combined Figure 8 The external terminal 4b3 includes a positive external terminal 4b31 and a negative external terminal 4b32. One of the positive external terminal 4b31 and the negative external terminal is disposed on the vibrating plate 4b1, and the vibrating plate 4b1 is conductive. The second electrode layer 4b22 is electrically connected to the vibrating plate 4b1. The other of the positive external terminal 4b31 and the negative external terminal 4b32 is disposed on the surface of the first electrode layer 4b21. This arrangement facilitates the separation of the positive external terminal 4b31 and the negative external terminal 4b32, avoiding short circuit problems.

[0142] For example, one of the positive external terminal 4b31 and the negative external terminal can be connected to the vibrating plate 4b1 by welding or by bonding with conductive adhesive. The other of the positive external terminal 4b31 and the negative external terminal can be connected to the first electrode layer 4b21 by welding or by bonding with conductive adhesive.

[0143] Specifically, when an alternating current is applied to the piezoelectric ceramic speaker unit, the piezoelectric element 4b23 will expand and contract, thereby driving the diaphragm 4b1 to vibrate, which in turn drives the air to vibrate and produce sound. Since the piezoelectric ceramic sheet 4b2 has a thin film structure, its longitudinal bending modulus is relatively small, thus enabling it to output a large sound pressure level.

[0144] Please see Figure 10 , Figure 10 According to Figures 4-5 The diagram shows the connection of the mainboard 2, first speaker unit 4b, second speaker unit 4a, first signal trace 5, and conductive trace 4a6 in the earphone 100. In this embodiment, to simplify the electrical connection between the first speaker unit 4b, the second speaker unit 4a, and the mainboard 2, the external terminal 4b3 and the wiring terminal 4a5 are electrically connected via the first signal trace 5. The wiring terminal 4a5 can be electrically connected to the mainboard 2 via the conductive trace 4a6.

[0145] In this way, the conductive trace 4a6 can be used to achieve the electrical connection between the second speaker unit 4a and the motherboard 2. The conductive trace 4a6 and the first signal trace 5 can be used to achieve the electrical connection between the first speaker unit 4b and the motherboard 2. This simplifies the electrical connection between the functional components in the headphone 100 and the motherboard 2 to at least a certain extent, avoiding the problem of making the first signal trace 5 too long due to the need to electrically connect the motherboard 2 and the external terminal 4b3 using the first signal trace 5.

[0146] For example, the conductive trace 4a6 can be enameled wire. However, this application is not limited to this; the conductive trace 4a6 can also be a flexible printed circuit (FPC). The first signal trace 5 can be enameled wire. However, this application is not limited to this; the first signal trace 5 can also be a flexible printed circuit.

[0147] Please see Figure 11 and Figure 12 , Figure 11 This is a schematic diagram illustrating a portion of the structure of the earphone 100 according to some embodiments of this application. Figure 12 According to Figure 11 The diagram shows a partial cross-sectional view of the headphone 100 at the CC line. This embodiment differs from the previous embodiment in that the headphone 100 also includes a bracket 7. The bracket 7 is located between the first speaker unit 4b and the sound outlet 110. The first speaker unit 4b is fixed to the inner wall of the housing 1 via the bracket 7. Therefore, by providing the bracket 7, the installation of the first speaker unit 4b can be facilitated. Furthermore, placing the bracket 7 between the first speaker unit 4b and the sound outlet 110 prevents the need for a larger front cavity K1 due to the bracket 7's placement, and also facilitates the formation of a regular front cavity K1, thereby improving the sound output of the second speaker unit 4a.

[0148] Please continue reading. Figure 11 and Figure 12 The headphones 100 also include a noise-canceling microphone 8. The noise-canceling microphone 8 is located between the first speaker unit 4b and the sound outlet 110, and is electrically connected to the motherboard 2. This arrangement allows the noise-canceling microphone 8 to be positioned close to the sound outlet 110, facilitating its ability to pick up background noise within the ear canal and feed it back to the motherboard 2, thereby improving the noise-canceling effect of the headphones 100. Specifically, the noise-canceling microphone 8 and the motherboard 2 can be electrically connected via a second signal trace 6.

[0149] The second signal trace 6 can be enameled wire. Of course, this application is not limited to this; the second signal trace 6 can also be a flexible circuit board.

[0150] To improve the sound pickup effect of the noise-canceling microphone 8, the noise-canceling microphone 8 can be inserted into the sound outlet 112. This arrangement allows the noise-canceling microphone 8 to be closer to the sound outlet 110, thereby improving the microphone's sound pickup effect and further enhancing the noise reduction effect of the headphones 100.

[0151] For instructions on installing the noise-canceling microphone 8, please refer to [link / reference needed]. Figure 12The noise-canceling microphone 8 can be fixed inside the housing 1 by the bracket 7. In this way, the noise-canceling microphone 8 and the first speaker unit 4b are fixed together by the bracket 7, forming a modular design. Therefore, when installing the first speaker unit 4b, the bracket 7 and the noise-canceling microphone 8, it is convenient to install the first speaker unit 4b, the bracket 7 and the noise-canceling microphone 8 as a whole into the housing 1, so that the first speaker unit 4b and the noise-canceling microphone 8 do not need to be installed separately. This simplifies the installation steps, improves assembly efficiency, and the overall structure of the first speaker unit 4b and the noise-canceling microphone 8 is highly compact.

[0152] Of course, it is understandable that in other examples, the noise-canceling microphone 8 and the first speaker unit 4b may also be installed separately and independently within the housing 1. In other words, the noise-canceling microphone 8 may be fixed within the housing 1 without the aid of the bracket 7.

[0153] Please see Figure 13 and Figure 14 , Figure 13 According to Figures 11-12 A perspective view of the support 7 in the earphone 100 shown; Figure 14 According to Figure 12 The enlarged view of the portion of the headphone 100 shown is circled at point E. The bracket 7 includes a fixing part 72 and a support plate 71.

[0154] The fixing part 72 is annular, extending circumferentially along the outer casing 1. A first step 113 is formed on the inner circumferential surface of the outer casing 1, and the fixing part 72 is supported and fixed to the first step 113. Exemplarily, the connection between the fixing part 72 and the first step 113 includes, but is not limited to, adhesive bonding, snap-fitting, welding, or screw connection. The first speaker unit 4b is supported and fixed to the fixing part 72 via the connecting part 4b12 of the diaphragm 4b1. The connection between the diaphragm 4b1 and the fixing part 72 includes, but is not limited to, adhesive bonding, snap-fitting, welding, or screw connection. The first step 113 facilitates the overall positioning and installation of the bracket 7 and the first speaker unit 4b.

[0155] Specifically, since the sound outlet channel 4bb is formed on the first loudspeaker unit 4b, the annular fixing part 72 can define the sound transmission channel 723. The sound transmission channel 723 can connect the sound outlet hole 110 and the sound outlet channel 4bb. In this way, the sound transmission channel 723 can be used as the front sound cavity of the first loudspeaker unit 4b. The vibration of the first loudspeaker unit 4b causes the air in the front sound cavity to vibrate and produce sound. On the other hand, the sound transmission channel 723 can also be used as the sound transmission channel between the second loudspeaker unit 4a and the sound outlet hole 110, so as to facilitate the sound production of the second loudspeaker unit 4a.

[0156] Since the vibrating plate 4b1 is connected to the outer shell 1 via the fixing part 72, when the vibrating plate 4b1 vibrates under the drive of the piezoelectric ceramic plate 4b2, it will inevitably transmit the vibration to the outer shell 1, causing poor comfort for the user wearing the headphones 100. This also negatively impacts the sound output of the first speaker unit 4b. To solve this technical problem, the fixing part 72 can be made of a flexible material. For example, the fixing part 72 can be made of rubber or silicone.

[0157] In this way, the buffering effect of the fixing part 72 can be used to reduce the vibration transmitted from the first speaker unit 4b to the outer shell 1, thereby improving the user's comfort when wearing the headphones 100 and improving the sound performance of the first speaker unit 4b. In addition, it can also avoid the interference of the vibration of the outer shell 1 on the air vibration in the front cavity K1 to a certain extent, which is beneficial to improving the sound performance of the second speaker unit 4a.

[0158] Based on this, to simplify the manufacturing process of the entire bracket 7 and ensure the consistency of the material of bracket 7, the entire bracket 7 can be made of a flexible material. For example, the material of bracket 7 can be rubber or silicone. In other examples, only the fixing part 72 of bracket 7 can be made of a flexible material, while other structures on bracket 7, such as the aforementioned support plate 71, are made of non-flexible materials. Of course, it is understood that bracket 7 can also be made of a non-flexible material. For example, the material of bracket 7 includes, but is not limited to, rigid plastic and metal. This can improve the service life of bracket 7. For example, the material of bracket 7 can be the same as the material of outer shell 1.

[0159] Please continue reading. Figure 13 and Figure 14 The fixing part 72 includes a fixing plate 722 and an annular flange 721. The fixing plate 722 is annular and is supported and fixed to the step surface of the first step 113 facing the second speaker unit 4a. The annular flange 721 is provided around the edge of the fixing plate 722 and protrudes towards the second speaker unit 4a. The outer peripheral edge of the first speaker unit 4b (i.e., the connecting part 4b12 of the diaphragm 4b1) is supported and fixed to the side end face of the annular flange 721 facing the sound outlet 110.

[0160] In the embodiments of this application, by supporting and fixing the outer peripheral edge of the first speaker unit 4b (i.e., the connecting part 4b12 of the vibrating plate 4b1) to the end face of the annular flange 721 facing the sound outlet 110, on the one hand, the annular flange 721 can be used to separate the first speaker unit 4b and the fixing plate 722, so as to suspend the piezoelectric ceramic sheet and the supporting part 4b11, which is beneficial to improve the sound output effect of the first speaker unit 4b. On the other hand, it is also beneficial to design the size of the first speaker unit 4b to be larger, further improving the sound output effect. In addition, when the annular flange 721 is fixed to the stepped surface of the first step 113 facing the central axis of the second speaker unit 4a, it is also beneficial to increase the connection area between the bracket 7 and the outer shell 1, and improve the reliability of the connection between the two.

[0161] Understandably, the annular flange 721 and the annular fixing plate 722 together define the sound transmission channel 723.

[0162] Of course, in other examples, the structure of the fixing part 72 is not limited to this. The fixing part 72 may also not have a flange. In this way, the outer peripheral edge of the first speaker unit 4b (that is, the connecting part 4b12 of the diaphragm 4b1) can be supported and fixed on the fixing plate 722.

[0163] Please continue reading. Figure 13 and combined Figure 12 The support plate 71 is fixed to the fixing part 72. The support plate 71 extends towards the sound outlet 110. This facilitates the installation of the noise-canceling microphone 8 close to the sound outlet 110, improving the sound pickup effect of the noise-canceling microphone 8.

[0164] Furthermore, to facilitate the placement of the noise-canceling microphone 8 within the sound outlet 112, the support plate 71 extends into the sound outlet 112. This allows for the modularization of the noise-canceling microphone 8 with the first speaker unit 4b while simultaneously ensuring that the noise-canceling microphone 8 is placed within the sound outlet 112.

[0165] For details, please continue reading. Figure 13 To facilitate the insertion of the support plate 71 into the sound outlet 112 without interfering with the outer casing 1, the support plate 71 can be located within the inner periphery of the fixing part 72 and connected to the inner peripheral wall of the fixing part 72, for example, the inner peripheral wall of the fixing plate 722. Therefore, compared to connecting the support plate 71 to the outer peripheral edge of the fixing part 72, connecting the support plate 71 to the inner peripheral wall of the fixing part 72 prevents interference between the support plate 71 and the inner wall of the outer casing 1. This avoids the problem of insufficient installation space for the noise-canceling microphone 8 due to interference between the noise-canceling microphone 8 and the inner wall of the outer casing 1, thus ensuring reliable installation of the noise-canceling microphone 8. It is understood that the inner peripheral wall of the fixing part 72 is the same as the inner peripheral wall of the sound transmission channel 723.

[0166] To improve the sound transmission performance of the sound transmission channel 723 and prevent interference between the support plate 71 and the noise-canceling microphone 8 and the sound output channel 4bb, please refer to [link / reference needed]. Figure 15 , Figure 15 According to Figures 11-12 The diagram shows the interaction of the support plate 7, the first speaker unit 4b, and the noise-canceling microphone 8 in the earphone 100. The orthographic projection of the support plate 71 and the noise-canceling microphone 8 onto the first speaker unit 4b is located on the outer periphery of the sound output channel 4bb. This prevents the support plate 71 and the noise-canceling microphone 8 from blocking the sound output of the second speaker unit 4a, ensuring the sound output effect of the second speaker unit 4a. Of course, it is understood that in other examples, the orthographic projection of the support plate 71 and the noise-canceling microphone 8 onto the first speaker unit 4b may also cover a portion of the sound output channel 4bb.

[0167] Based on this, please continue to refer to Figure 15 The orthographic projection of the support plate 71 on the first speaker unit 4b can be positioned between the orthographic projection of the noise-canceling microphone 8 on the first speaker unit 4b and the sound output channel 4bb. This arrangement helps to further position the support plate 71 closer to the central region of the sound outlet 112, preventing interference between the support plate 71 and the sound outlet 112. Of course, the orthographic projection of the support plate 71 on the first speaker unit 4b can also be positioned on the side of the orthographic projection of the noise-canceling microphone 8 on the first speaker unit 4b away from the sound output channel 4bb.

[0168] Since the motherboard 2 is located on the side of the second speaker unit 4a furthest from the sound outlet 110, and the noise-canceling microphone 8 is located between the fixing part 72 and the sound outlet 110, please refer to [further details]. Figure 15 and Figure 16 , Figure 16 According to Figure 12 The enlarged view of the portion circled at F in the diagram of the earphone 100 shows that, to facilitate the installation of the second signal trace 6 connecting the noise-canceling microphone 8 and the motherboard 2, a clearance space 724a is formed between the fixing part 72 and the inner wall surface of the outer casing 1. The second signal trace 6 extends towards the motherboard 2 through the clearance space 724a. Specifically, a clearance space 724a is formed between the fixing part 72 and the first step 113.

[0169] For example, a portion of the surface of the fixing portion 72 facing the first step 113 is recessed in a direction away from the first step 113 to form a relief groove 724. The relief groove 724 and the first step 113 define a relief space 724a. A portion of the relief groove 724 is located on the fixing plate 722, and another portion is located on the annular flange 721. Also for example, a portion of the step surface of the first step 113 is recessed in a direction away from the fixing portion 72 to form a relief groove 724. The relief groove 724 engages with the surface of the fixing portion 72 facing the first step 113 to define the relief space 724a.

[0170] Based on this, in order to further avoid the second signal trace 6, please refer to [link / reference needed]. Figure 16 and combined Figure 17 , Figure 17 According to Figures 11-12 The diagram shows the cooperation between the bracket 7 and the first speaker unit 4b. The outer peripheral surface of the first speaker unit 4b has a second contour surface 4b14; specifically, the outer peripheral surface of the diaphragm 4b1 also has a second contour surface 4b14. The inner peripheral surface of the housing 1 has a second region 1112 directly opposite the second contour surface 4b14. A second clearance gap 4b14a is formed between the second contour surface 4b14 and the second region 1112, and the second clearance gap 4b14a communicates with the clearance space 724a. In this way, the second signal trace 6 can extend towards the main board 2 by passing sequentially through the clearance space 724a and the second clearance gap 4b14a. This improves the reliability of the second signal trace 6 and avoids interference between the second signal trace 6 and other structures within the housing 1.

[0171] For example, in order to separate the second contour surface 4b14 from the second region 1112, the second contour surface 4b14 is a plane. Also for example, the second contour surface 4b14 is an arcuate surface extending circumferentially along the housing 1, and the second contour surface 4b14 arches towards the center of the first speaker unit 4b.

[0172] For example, in order to separate the second contour surface 4b14 from the second region 1112, the second region 1112 may be recessed in a direction away from the second contour surface 4b14 to form a recessed groove.

[0173] Please see Figure 18 , Figure 18 According to Figures 11-12The diagram shows a portion of the front shell 11, the bracket 7, and the first speaker unit 4b of the earphone 100. The inner circumferential surface of the shell 1, i.e., the inner circumferential surface of the front shell 11, located between the main board 2 and the fixing part 72, has a wiring groove 1113. The wiring groove 1113 can communicate with the second clearance gap 4b14a, and a portion of the second signal wiring 6 can be fixed within the wiring groove 1113. Thus, the second signal wiring 6 can extend towards the main board 2 sequentially through the clearance space 724a, the second clearance gap 4b14a, and the wiring groove 1113. This improves the reliability of the second signal wiring 6 and avoids interference between the second signal wiring 6 and other structures within the shell 1.

[0174] For example, the second signal trace 6 can be fixed in the trace groove 1113 by means of adhesive or snap-fit.

[0175] For example, the wiring groove 1113, the recessed groove, and the clearance groove 724 formed on the housing 1 as described above can be connected. This configuration results in a simple structure and facilitates manufacturing.

[0176] Since the external terminal 4b3 of the first speaker unit 4b faces the sound outlet 110, and the bracket 7 is located between the first speaker unit 4b and the sound outlet 110, in order to avoid interference between the bracket 7 and the external terminal 4b3, the first signal trace 5 cannot be soldered. Please refer to [further details needed]. Figure 17 and combined Figure 13 A portion of the surface of the fixing part 72 facing the first speaker unit 4b is recessed toward the sound outlet 110 to form a relief groove 725, which is used to avoid the external terminal 4b3. It can be understood that when the first signal line 5 is connected to the external terminal 4b3, the relief groove 725 can also avoid the first signal line 5.

[0177] Specifically, in order to further improve the avoidance effect of the clearance groove 725 on the first signal line 5, the clearance groove 725 can extend to the outer peripheral edge of the fixing part 72. This allows the first signal line 5 to pass through the clearance groove 725 and extend from the sound transmission channel 723, and extend towards the second speaker unit 4a to connect with the wiring terminal 4a5 of the second speaker unit 4a.

[0178] Based on this, in order to further avoid the first signal trace 5, please refer to... Figures 19-20 , Figure 19 According to Figure 18 A schematic diagram of another direction showing the engagement of a portion of the front shell 11 of the earphone 100, the bracket 7, and the first speaker unit 4b. Figure 20 According to Figure 17The diagram shows another direction of the bracket 7 after it is engaged with the first speaker unit 4b. The outer peripheral surface of the first speaker unit 4b has a first profile surface 4b13; specifically, the outer peripheral surface of the diaphragm 4b1 also has a first profile surface 4b13. The inner peripheral surface of the housing 1 has a first region 1111 that is directly opposite the first profile surface 4b13. The first profile surface 4b13 and the first region 1111 are spaced apart to form a first clearance gap 4b13a. The first clearance gap 4b13a communicates with the clearance groove 725.

[0179] In this way, the first signal trace 5 can extend towards the second speaker unit 4a by passing through the clearance groove 725 and the first clearance gap 4b13a in sequence, so as to connect with the wiring terminal 4a5 of the second speaker unit 4a. This helps to improve the reliability of the first signal trace 6 and avoids interference between the first signal trace 6 and other structures inside the housing 1.

[0180] To achieve the separation of the first contour surface 4b13 from the first region 1111, the first contour surface 4b13 is, for example, a plane. Alternatively, the first contour surface 4b13 is an arcuate surface extending circumferentially along the housing 1, and the first contour surface 4b13 arches towards the center of the first speaker unit 4b.

[0181] For example, in order to separate the first contour surface 4b13 from the first region 1111, the first region 1111 is a curved surface extending circumferentially along the outer shell 1, such as an arc surface. Alternatively, the first region 1111 may be recessed in a direction away from the first contour surface 4b13 to form a recessed groove.

[0182] Based on this, please continue to refer to Figure 19 and Figure 20 The portion of the inner circumferential surface of the housing 1 located between the second speaker unit 4a and the first speaker unit 4b has a wiring groove 1114. The wiring groove 1114 can communicate with the first clearance gap 4b13a. A portion of the first signal line 5 can be fixed in the wiring groove 1114, thereby using the wiring groove 1114 to avoid the first signal line 5.

[0183] In this way, the first signal trace 5 can sequentially pass through the clearance groove 725, the first clearance gap 4b13a, and the trace groove 1114 to connect to the terminal 4a5 of the second speaker unit 4a. This helps to improve the reliability of the first signal trace 5 and avoids interference between the first signal trace 5 and other structures within the housing 1.

[0184] For example, the first signal trace 5 can be fixed in the trace groove 1114 by means of adhesive or snap-fit.

[0185] In order to save the length of the first signal line 5, the terminal 4a5 is aligned with the wiring groove 1114 along the arrangement direction of the first speaker unit 4b and the second speaker unit 4a.

[0186] Please continue reading. Figure 19 and Figure 20 To facilitate the overall installation and positioning of the bracket 7 and the first speaker unit 4b, and to prevent the bracket 7 from being placed backwards or misaligned, a first positioning part 726 is formed on the outer peripheral wall of the fixing part 72 (e.g., the outer peripheral wall of the annular flange 721), and a second positioning part 1115 is formed on the inner wall surface of the outer casing 1. The first positioning part 726 and the second positioning part 1115 cooperate with each other.

[0187] For example, please continue reading Figure 19 and Figure 20 The first positioning part 726 can be a positioning groove, and the second positioning part 1115 can be a protrusion protruding from the inner wall surface of the outer casing 1. Alternatively, the first positioning part 726 can be a protrusion protruding from the outer peripheral wall of the fixing part 72, and the second positioning part 1115 can be a positioning groove formed on the inner wall surface of the outer casing 1.

[0188] To further improve the ease of installation and positioning of the bracket 7 and the first speaker unit 4b as a whole, a third positioning part 4b15 is provided on the outer periphery of the first speaker unit 4b (e.g., the diaphragm 4b1) at the position corresponding to the first positioning part 726. The third positioning part 4b15 and the first positioning part 726 cooperate with the second positioning part 1115.

[0189] For example, both the first positioning part 726 and the third positioning part 4b15 can be positioning grooves, and the second positioning part 1115 can be a protrusion protruding from the inner wall surface of the outer casing 1. Alternatively, both the first positioning part 726 and the third positioning part 4b15 can be protrusions, and the second positioning part 1115 can be a positioning groove formed on the inner wall surface of the outer casing 1.

[0190] Understandably, in other examples, while the first speaker unit 4b is fixed inside the housing 1 using the bracket 7, the first positioning part 726 may not be provided on the fixing part 72. Instead, positioning is achieved by the cooperation of the third positioning part 4b15 and the second positioning part 1115. Alternatively, when the first speaker unit 4b is not fixed inside the housing 1 with the help of the bracket 7, but is directly fixed inside the housing 1, the positioning and installation of the first speaker unit 4b is achieved by the cooperation of the third positioning part 4b15 and the second positioning part 1115.

[0191] Please see Figure 21 , Figure 21 According to Figure 11The diagram shows a cross-sectional view of the headphone 100 at the HH line, where the first signal trace 5, conductive trace 4a6, and motherboard 2 are not shown. The outer shell 1 has a balance hole 1116. The balance hole 1116 connects the front cavity K1 and the outer side of the outer shell 1. Specifically, when a user wears the headphone 100, the sound outlet 110 faces into the user's ear canal, and the outer shell 1 provides a certain degree of sealing to the ear canal. By providing the balance hole 1116, located on the outer side of the ear canal, the balance hole 1116 can balance the air pressure between the front cavity K1 and the outer side of the outer shell 1, improving the comfort of using the headphone 100.

[0192] For details, please continue reading. Figure 21 and combined Figure 13 and Figure 20 The balance hole is located at the first step 113 mentioned above, and a clearance notch 727 is formed on the fixing part 72 at the position corresponding to the balance hole 1116. The clearance notch 727 connects the balance hole 1116 and the sound transmission channel 723, thereby enabling communication between the front cavity K1 and the outside atmosphere of the outer shell 1. It can be understood that when the balance hole 1116 is located at the position of the front cavity K1, the clearance notch 727 may not be provided on the fixing part 72.

[0193] The above embodiments will be further explained below with reference to the relationship between the frequency and sound pressure level of the earphone 100 in the embodiments of this application.

[0194] Please see Figure 22 , Figure 22 This diagram illustrates the relationship between the frequency and sound pressure level of the earphone 100 in this embodiment. The horizontal axis represents frequency in Hz, and the vertical axis represents sound pressure level in dBSPL. Figure 22 In the diagram, curve S1 represents the curve in this application. Figures 1-3 The diagram shows the relationship between frequency and sound pressure level for the earphone 100, which contains only a dynamic speaker unit 4. Curve S2 represents the relationship between frequency and sound pressure level for the earphone 100 with dual speaker units (i.e., the first speaker unit 4b and the second speaker unit 4a) when both speaker units are operating simultaneously. Curve S3 represents the relationship between frequency and sound pressure level for the earphone 100 with dual speaker units (i.e., the first speaker unit 4b and the second speaker unit 4a) when the second speaker unit 4a is operating and the first speaker unit 4b is not operating.

[0195] Combining curves S1 and S3, it can be concluded that in the high-frequency range of 10000Hz to 'a', where 'a' ranges from 16000Hz to 18000Hz, the sound pressure level of curve S3 is greater than that of curve S1 at the same frequency. At the same sound pressure level, the frequency of curve S3 is greater than that of curve S1. Therefore, considering both sound pressure level and frequency, it can be concluded that the headphone 100 with dual speaker units (i.e., the first speaker unit 4b and the second speaker unit 4a) in this application exhibits superior high-frequency performance when the cavity formed by the first speaker unit 4b, the second speaker unit 4a, and the inner wall of the outer shell 1 is used as the front cavity K1 of the second speaker unit 4a. Figures 1-3 The high-frequency effect of the dynamic speaker unit 4 in the earphone 100 shown when working alone.

[0196] Within the frequency band a~20000Hz, although the sound pressure level of curve S3 is lower than that of curve S1 at the same frequency, the frequency of curve S3 is lower than that of curve S1 at the same sound pressure level. In other words, although curves S1 and S3 reflect that within the frequency band a~20000Hz, the high-frequency performance of the headphone 100 with dual speaker units (i.e., the first speaker unit 4b and the second speaker unit 4a) is not as good as that of the second speaker unit 4a when it emits sound within the frequency band a~20000Hz. Figures 1-3 The dynamic speaker unit 4 in the illustrated headphone 100 exhibits good high-frequency performance when operating alone. However, on one hand, compared to the frequency range of 10000Hz~a, the sound in the a~20000Hz frequency range is less perceptible to the human ear, especially closer to 20000Hz. On the other hand, this difference can be compensated for by adding a first speaker unit 4b. Specifically, combining curves S1 and S2, it can be concluded that in the higher frequency range of 10000Hz~20000Hz, the sound pressure level of the headphone 100 with dual speaker units is greater than [missing value] when both speaker units are operating simultaneously. Figures 1-3 The image shows the sound pressure level of the dynamic speaker unit 4 in the earphone 100 when it operates alone. At the same sound pressure level, the earphone 100 with dual speaker units has a higher frequency when both speaker units operate simultaneously than... Figures 1-3 The frequency of the dynamic speaker unit 4 in the earphone 100 shown is when it operates alone. Therefore, the earphone 100 with dual speaker units (i.e., the first speaker unit 4b and the second speaker unit 4a) in this application has better overall high-frequency performance.

[0197] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0198] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An earphone, characterized in that, include: The outer casing has a sound outlet; A first speaker unit and a second speaker unit are respectively and independently fixed inside the housing. The first speaker unit emits sound towards the sound outlet. The second speaker unit is located on the side of the first speaker unit away from the sound outlet and is spaced apart from the first speaker unit. The sound emission frequency of the second speaker unit is lower than that of the first speaker unit. The first speaker unit is annular and includes a first through hole in the middle. The first through hole is opposite to the sound outlet. The second loudspeaker unit includes a diaphragm assembly opposite to the first loudspeaker unit; wherein, the first loudspeaker unit, the diaphragm assembly, and the inner wall of the housing form a front cavity of the second loudspeaker unit, the front cavity is connected to the sound outlet through the first through hole, and the sound emitted by the vibration of the air in the front cavity is transmitted toward the sound outlet through the first through hole; A noise-canceling microphone, wherein the noise-canceling microphone is located between the first speaker unit and the sound outlet; The noise-canceling microphone is fixed inside the housing via the bracket; the bracket includes a support plate, the noise-canceling microphone is fixed on the support plate, and the orthographic projections of the support plate and the noise-canceling microphone on the first speaker unit are both located on the outer periphery of the first through hole.

2. The earphone according to claim 1, characterized in that, The bracket is located between the first speaker unit and the sound outlet, and the first speaker unit is fixed inside the housing by the bracket.

3. The earphone according to claim 2, characterized in that, The bracket includes an annular fixing part, the outer peripheral edge of the first speaker unit is fixed to the fixing part, and the fixing part is fixed to the inner peripheral surface of the housing.

4. The earphone according to claim 3, characterized in that, A first step is formed on the inner circumferential surface of the outer shell, and the fixing part is supported and fixed to the first step.

5. The earphone according to claim 4, characterized in that, The fixing part includes a fixing plate and an annular flange. The fixing plate is supported and fixed to the step surface of the first step facing the second speaker unit. The annular flange is disposed around the edge of the fixing plate and protrudes towards the second speaker unit. The outer peripheral edge of the first speaker unit is supported and fixed to the end face of the annular flange away from the sound outlet.

6. The earphone according to claim 3, characterized in that, The fixing part is made of a flexible material.

7. The earphone according to claim 3, characterized in that, The annular fixing portion defines a second through hole, which connects the sound outlet hole and the first through hole.

8. The earphone according to claim 7, characterized in that, The first speaker unit is a piezoelectric ceramic speaker unit, and the second through hole serves as the front sound cavity of the first speaker unit.

9. The earphone according to claim 3, characterized in that, The first speaker unit has an external terminal facing the sound outlet, and a portion of the surface of the fixing part facing the first speaker unit is recessed toward the sound outlet to form a relief groove, the relief groove being used to avoid the external terminal.

10. The earphone according to claim 9, characterized in that, include: First signal routing; The clearance groove extends to the outer peripheral edge of the fixing part, one end of the first signal line is fixed and electrically connected to the external terminal, and the first signal line extends through the clearance groove toward the second speaker unit.

11. The earphone according to claim 10, characterized in that, The outer peripheral surface of the first speaker unit has a first contour surface, and the inner peripheral surface of the housing has a first region directly opposite the first contour surface. The first contour surface and the first region are spaced apart to form a first clearance gap. The first clearance gap communicates with the clearance groove, and the first clearance gap is used to avoid the first signal trace.

12. The earphone according to claim 7, characterized in that, The outer casing has a balance hole, and a clearance notch is formed at the position of the fixing part corresponding to the balance hole. The clearance notch connects the balance hole and the second through hole.

13. The earphone according to any one of claims 1-12, characterized in that, The outer casing includes a front shell, the front shell includes a main body and a sound outlet, the main body has a first receiving cavity, the first speaker unit and the second speaker unit are both fixed in the first receiving cavity, the sound outlet communicates with the first receiving cavity, the end of the sound outlet away from the main body is formed with the sound outlet hole, and at least a portion of the noise-canceling microphone is located in the sound outlet.

14. The earphone according to any one of claims 1-12, characterized in that, The bracket includes an annular fixing part, the outer peripheral edge of the first speaker unit is fixed to the fixing part, the fixing part is fixed to the inner peripheral surface of the housing, and the support plate is fixed to the fixing part and extends toward the sound outlet.

15. The earphone according to claim 14, characterized in that, The support plate is located on the inner periphery of the fixing part and is connected to the inner peripheral wall of the fixing part.

16. The earphone according to claim 15, characterized in that, The annular fixing portion defines a second through hole, which connects the sound outlet hole and the first through hole.

17. The earphone according to claim 14, characterized in that, include: The motherboard and the second signal trace are provided, and the noise-canceling microphone is adapted to be electrically connected to the motherboard via the second signal trace.

18. The earphone according to claim 17, characterized in that, The motherboard is located on the side of the second speaker unit away from the sound outlet. A clearance space is formed between the fixing part and the inner wall surface of the housing. The second signal trace extends towards the motherboard through the clearance space.

19. The earphone according to claim 17, characterized in that, The outer peripheral surface of the first speaker unit has a second profile surface, and the inner peripheral surface of the housing has a second region that is directly opposite to the second profile surface. The second profile surface and the second region are spaced apart to form a second clearance gap, which is used to avoid the second signal trace.

20. The earphone according to claim 17, characterized in that, The inner circumferential surface of the housing has a wiring groove on the portion between the motherboard and the fixing part, and a portion of the second signal wiring is fixed to the wiring groove.

21. The earphone according to any one of claims 3-12 and 14-20, characterized in that, A first positioning part is formed on the outer peripheral wall of the fixing part, and a second positioning part is formed on the inner peripheral surface of the outer shell. The first positioning part and the second positioning part cooperate with each other.

22. The earphone according to any one of claims 1-12, characterized in that, The outer peripheral edge of the first speaker unit has a third positioning part, and the inner peripheral surface of the housing has a second positioning part, the third positioning part cooperating with the second positioning part.

23. The earphone according to any one of claims 1-12, characterized in that, The first speaker unit has an external terminal, and the second speaker unit has a wiring terminal. The external terminal and the wiring terminal are electrically connected through a first signal trace.

24. The headphones according to claim 23, characterized in that, The portion of the inner circumferential surface of the housing located between the second speaker unit and the first speaker unit has a wiring groove, which is used to avoid the first signal line.

25. The earphone according to any one of claims 1-12, characterized in that, The first loudspeaker unit is a piezoelectric ceramic loudspeaker unit; and / or, the second loudspeaker unit is a moving coil loudspeaker unit.

26. The earphone according to any one of claims 1-12, characterized in that, The first speaker unit and the second speaker unit are coaxially arranged.

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