Electronic device and method for controlling transmit power of a communication module

Abstract

Various embodiments of the present invention include an electronic device and method for controlling a transmission power of a communication module, wherein the electronic device can include a housing, a first antenna that transmits and receives at least one of a first wireless transmission signal and a first wireless reception signal by using a first portion of the housing, a first printed circuit board that is electrically connected to the first antenna and includes a first connector, a second printed circuit board that is electrically connected to the first printed circuit board and includes a second connector, a signal connection member having a first end connected to the first connector and a second end connected to the second connector, a communication module that is electrically connected to the second connector and controls the at least one of the first wireless transmission signal and the first wireless reception signal, a sensor module that is electrically connected to the second connector, adjusts at least one sensing parameter based on frequency information of the at least one of the first wireless transmission signal and the first wireless reception signal, and measures a capacitance of a path between the first antenna and the second connector for the at least one of the first wireless transmission signal and the first wireless reception signal, and a processor configured to control a transmission power of the communication module according to the capacitance measured by using the sensor module. Various other embodiments are possible.

Description

Technical Field

[0001] This disclosure generally relates to an electronic device and method for controlling the transmission power of a communication module. Background Technology

[0002] Different types of electronic devices, such as candybar electronic devices, foldable electronic devices, rollable electronic devices, wearable electronic devices, or tablet personal computers (PCs), are increasing.

[0003] Electronic devices can send telephone calls and various data to other electronic devices via wireless communication, and can also receive telephone calls and various data from other electronic devices.

[0004] The electronic device may include at least one antenna to perform wireless communication with other electronic devices using a network. Summary of the Invention

[0005] Technical issues

[0006] In electronic devices, at least a portion of the casing forming the exterior may be made of a conductive material (e.g., a metal).

[0007] At least a portion of the housing made of conductive material can be used as an antenna (or antenna radiator) for performing wireless communication. For example, the housing of an electronic device can be separated by at least one segment (e.g., a slit) to be used as multiple antennas.

[0008] When using multiple antennas to transmit wireless signals, the electronic device may include multiple sensor modules (e.g., grip sensors or touch sensors) that support control of the transmission power based on the electromagnetic absorption ratio (SAR). For example, when the electronic device uses multiple antennas to support various frequency bands, the electronic device may include multiple sensor modules disposed at the lower and upper ends of the housing.

[0009] When an electronic device uses multiple sensor modules, the cost of the device may increase, the space available for mounting electronic components may decrease, and power consumption may increase.

[0010] Various embodiments of this disclosure may provide an electronic device and method capable of controlling the transmit power of a communication module using a signal connection component (e.g., a coaxial cable or a flexible printed circuit board (FPCB)) and a sensor module (e.g., a grip sensor or a touch sensor).

[0011] The technical problems to be solved in this disclosure are not limited to those described above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

[0012] Technical solution

[0013] According to one aspect of this disclosure, an electronic device includes: a housing; a first antenna for transmitting and receiving at least one of a first wireless transmit signal and a first wireless receive signal using a first portion of the housing; a first printed circuit board (PCB) electrically connected to the first antenna and including a first connector; a second PCB electrically connected to the first PCB and including a second connector; a signal connection member having a first end connected to the first connector and a second end connected to the second connector; a communication module electrically connected to the second connector and controlling the at least one of the first wireless transmit signal and the first wireless receive signal; a sensor module electrically connected to the second connector and adjusting at least one sensing parameter based on frequency information of the at least one of the first wireless transmit signal and the first wireless receive signal, and measuring capacitance for a path between the first antenna and the second connector for the at least one of the first wireless transmit signal and the first wireless receive signal; and a processor configured to control the transmit power of the communication module based on the capacitance measured by using the sensor module.

[0014] According to another aspect of this disclosure, a method for controlling the transmission power of an electronic device is provided. The method includes: monitoring the contact state of a first antenna by a processor; setting at least one of a filter setting value and a sensing period of a sensor module based on information from a frequency band, wherein communication via the first antenna is conducted in the frequency band; determining whether a user's body is in contact with the first antenna by the processor; when the user's body is in contact with the first antenna, removing noise signals from a first wireless received signal received via the first antenna and / or a sensed signal related to the unit-time change value of the capacitance of the first antenna by the processor using at least one of a first filter or a second filter; and controlling a communication module by the processor to control the transmission power transmitted via the first antenna.

[0015] Beneficial effects

[0016] The electronic device and method according to the embodiments electrically connect a first PCB and a second PCB via signal connection components (e.g., coaxial cable or FPCB) to transmit and receive wireless signals and / or sensing signals, and use a sensor module (e.g., a grip sensor or touch sensor) to reduce the cost of the electronic device, ensure mounting space for electronic components, and control the transmission power of the communication module.

[0017] In addition, it can provide various effects that can be directly or indirectly identified through this article. Attached Figure Description

[0018] The above and other aspects, features, and advantages of certain embodiments of this disclosure will become clearer from the following description taken in conjunction with the accompanying drawings, in which:

[0019] Figure 1 An electronic device in a network environment according to an embodiment is shown.

[0020] Figure 2a This is an exploded perspective view schematically illustrating an electronic device according to an embodiment.

[0021] Figure 2b An electronic device according to an embodiment is shown.

[0022] Figure 3 An example is shown. Figure 2a and Figure 2b The sensing parameter adjustment unit of the electronic device.

[0023] Figure 4 The diagram illustrates the change in capacitance of the first antenna when a user touches it, according to an embodiment.

[0024] Figure 5 The following is illustrated according to the embodiment. Figure 4 The noise signal of capacitance change.

[0025] Figure 6 The use of a second filter pair according to an embodiment is shown. Figure 5 The noise signal is filtered.

[0026] Figure 7 A memory for storing a program for controlling a sensor module of an electronic device is shown according to an embodiment.

[0027] Figure 8 This is a flowchart illustrating a method for controlling the transmission power of a communication module of an electronic device according to an embodiment.

[0028] Figure 9 An example is shown. Figure 8 The subroutine of step 820 disclosed in the document. Detailed Implementation

[0029] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0030] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0031] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a periodic neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional periodic deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0032] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0033] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0034] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0035] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0037] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0038] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0039] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0040] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The tactile module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0042] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0043] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0044] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0045] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0046] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0047] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0048] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0049] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0050] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0051] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0052] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0053] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0054] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0055] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an app store (e.g., the Play Store™), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0056] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0057] Figure 2a This is an exploded perspective view schematically illustrating an electronic device according to an embodiment. Figure 2b This is a block diagram schematically illustrating the construction of an electronic device according to an embodiment. Figure 3 This illustrates an embodiment. Figure 2a and 2b A diagram illustrating the structure of the sensing parameter adjustment unit of an electronic device. Figure 4 This is a diagram illustrating the change in capacitance of the first antenna when a user comes into contact with it, according to an embodiment. Figure 5 This illustrates the basis according to the embodiment. Figure 4 A diagram illustrating the noise signal caused by capacitance changes. Figure 6 This illustrates the use of a second filter according to an embodiment. Figure 5 An example diagram illustrating the filtering of noise signals. Figure 7 This is a schematic diagram illustrating the construction of a memory in an electronic device according to an embodiment that stores a program for controlling a sensor module.

[0058] Figure 2a and Figure 2b The electronic device 200 may include via Figure 1 The components and embodiments described in the illustrated electronic device 101. Electronic devices 200 according to various embodiments of this disclosure may include candybar electronic devices, foldable electronic devices, rollable electronic devices, sliding electronic devices, wearable electronic devices, tablet PCs, or laptop PCs. Electronic devices 200 according to various embodiments of this disclosure are not limited to the examples described above and may include various other electronic devices.

[0059] Reference Figure 2a and 2bThe electronic device 200 includes a housing 201 (e.g., a side member or side frame structure), a first support member 201a (e.g., a bracket or support structure), a front panel 202 (e.g., a front cover), a display 203, a first PCB 230, a second PCB 240, a battery 205, a second support member 206 (e.g., a rear cover), an antenna 207, and a rear panel 208 (e.g., a rear cover). In some embodiments, the electronic device 200 may omit at least one of the above components (e.g., the first support member 201a or the second support member 206) or additionally include other components. At least one component of the electronic device 200 may be compatible with... Figure 1 At least one component of the electronic device 101 shown is the same or similar, and overlapping descriptions will be omitted below.

[0060] The first support member 201a may be disposed inside the electronic device 200 and connected to the housing 201, or may be integrally formed with the housing 201. The first support member 201a may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The first support member 201a may be bonded to the display 203 on one surface, and either or both of the first PCB 230 or the second PCB 240 may be bonded to the other surface.

[0061] The first PCB 230 may include an impedance matching circuit 233.

[0062] The second PCB 240 may be equipped with a processor 260, a memory 270, or an interface 177. The processor 260 may include one or more of, for example, a central processing unit, an application processor (AP), a GPU, an ISP, a sensor hub processor, or a CP.

[0063] The second PCB 240 can be equipped with Figure 2b The communication module 244, the first filter 245, or the sensor module 250 shown are illustrated.

[0064] The first PCB 230 can be implemented as an FPCB. The second PCB 240 can be implemented as a rigid PCB. The second PCB 240 may include a structure that stacks multiple PCBs. When multiple PCBs are stacked, each PCB can be electrically connected using interposers.

[0065] The first PCB 230 and the second PCB 240 can be electrically connected using signal connection components 235 (e.g., coaxial cable or FPCB).

[0066] The memory 270 may include, for example, volatile memory or non-volatile memory.

[0067] Interface 177 may include, for example, an HDMI interface, a USB interface, an SD card interface, or an audio interface. The interface may, for example, electrically or physically connect electronic device 200 to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0068] Battery 205 is a device for supplying power to at least one component of electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell. At least a portion of battery 205 may be configured to be substantially coplanar with one or both of the first PCB 230 and the second PCB 240. Battery 205 may be integrally disposed within electronic device 200. Additionally, battery 205 may be configured to be removable from electronic device 200.

[0069] Antenna 207 may be disposed between rear panel 208 and battery 205. Antenna 207 may include near field communication (NFC) antenna, wireless charging antenna, or magnetically secure transmission (MST) antenna. Antenna 207 may perform short-range communication with external devices or wirelessly send / receive power required for charging. Additionally, the antenna structure may be formed from a portion of housing 201 or first support member 201a, or a combination thereof.

[0070] The housing 201 may form the outer surface of the electronic device 200. At least a portion of the housing 201 may be formed of a conductive material (e.g., metal). The housing 201 may include a first portion (e.g., a lower surface) physically separated by a first segment 2011 and a second segment 2012. The first portion may be used as a first antenna 210. The housing 201 may include a second portion (e.g., an upper surface) physically separated by a third segment 2013 and a fourth segment 2014. The second portion may be used as a second antenna 220.

[0071] The housing 201 may use a third portion (e.g., a first side) between the first segment 2011 and the third segment 2013 as a third antenna 2017. The housing 201 may use a fourth portion (e.g., a second side) between the second segment 2012 and the fourth segment 2014 as a fourth antenna 2018.

[0072] The housing 201 of the electronic device 200 according to various embodiments of this disclosure is not limited to the first antenna 210, the second antenna 220, the third antenna 2017, and the fourth antenna 2018, and may also include more nth antennas depending on the number of segments. See also... Figure 2a and 2b The electronic device 200 includes a housing 201, a first antenna 210, a second antenna 220, a first PCB 230, a signal connection member 235, and a second PCB 240, or any combination thereof.

[0073] The housing 201 may include a first PCB 230 and a second PCB 240.

[0074] The first antenna 210 may include an antenna radiator that is at least a part of the housing 201 (e.g., the lower surface or lower end) and is separated by a first segment 2011 and a second segment 2012. For example, the first antenna 210 may be configured using a first portion (e.g., the lower surface) of the housing 201 separated by the first segment 2011 and the second segment 2012. The first antenna 210 may transmit a first radio frequency (RF) signal (e.g., a first frequency band) to an external electronic device, or may receive a first wireless signal from an external electronic device. The first wireless signal transmitted to the external electronic device via the first antenna 210 may be a signal generated by the processor 260 and processed by the communication module 244. The first wireless signal received from the external electronic device via the first antenna 210 may be processed by the communication module 244 and analyzed by the processor 260.

[0075] The first antenna 210 can operate in a first frequency band (e.g., about 0.7 GHz to 6 GHz). The first antenna 210 is not limited to the first frequency band and can transmit and receive signals in other frequency bands.

[0076] The second antenna 220 may include an antenna radiator that is at least part of the housing 201 (e.g., the upper surface or upper end) and is separated by the third segment 2013 and the fourth segment 2014. For example, the second antenna 220 may be configured using a second portion (e.g., the upper surface) of the housing 201 separated by the third segment 2013 and the fourth segment 2014. The second antenna 220 may transmit a second RF transmission signal (e.g., a second frequency band) to an external electronic device, or may receive a first wireless reception signal from an external electronic device. The second wireless transmission signal transmitted to the external electronic device via the second antenna 220 may be a signal generated by the processor 260 and processed by the communication module 244. The second wireless reception signal received from the external electronic device via the second antenna 220 may be processed by the communication module 244 and analyzed by the processor 260.

[0077] The second antenna 220 can transmit and receive one or both of a first wireless transmit signal or a second wireless receive signal having a frequency band different from that of the first antenna 210. For example, the second antenna 220 can operate in a second frequency band (e.g., about 1 GHz to 10 GHz). The second antenna 220 is not limited to a second frequency band and can transmit and receive signals in other frequency bands.

[0078] The first PCB 230 may be electrically connected to the first antenna 210. For example, the first PCB 230 may be connected to the first antenna 210 using a connecting element (e.g., a C-clamp) to achieve impedance matching and a short transmission length. The first PCB 230 may include a first connector 231 and an impedance matching circuit 233.

[0079] The first connector 231 can be connected to the first end of the signal connection member 235. The first connector 231 can be electrically connected to the first antenna 210 via the impedance matching circuit 233.

[0080] Impedance matching circuit 233 may be electrically connected to the first antenna 210 and the first connector 231. Impedance matching circuit 233 may power the first antenna 210. Impedance matching circuit 233 may match the impedance between communication module 244 disposed on the second PCB 240 and the first antenna 210. Impedance matching circuit 233 may include at least one of a resistor, a capacitor, and an inductor to match the impedance between communication module 244 and the first antenna 210. Impedance matching circuit 233 may be electrically connected to a grounding member to match the impedance between communication module 244 and the first antenna 210.

[0081] Signal connection member 235 can electrically connect the first PCB 230 and the second PCB 240 to each other. Signal connection member 235 can form an electrical path between the first PCB 230 and the second PCB 240. A first end of signal connection member 235 can be electrically connected to a first connector 231 disposed on the first PCB 230, and a second end can be electrically connected to a connector 242 disposed on the second PCB 240. Signal connection member 235 may include a coaxial cable or an FPCB. The first PCB 230 and the second PCB 240 can be electrically connected via a coaxial cable or an FPCB.

[0082] The signal connection component 235 can form a first path S1, wherein the first path S1 transmits a first wireless transmission signal transmitted through one or both of the first antenna 210 or impedance matching circuit 233 to the communication module 244 disposed on the second PCB 240, and provides the signal processed by the communication module 244 to the first antenna 210.

[0083] When the first antenna 210 comes into contact with the user's body (e.g., by holding or touching), the signal connection member 235 can form a second signal path S2, wherein the second signal path S2 provides a sensing signal related to the amount of change in the capacitance of the first antenna 210 (e.g., the change in capacitance per unit time) to the sensor module 250 disposed on the second PCB 240.

[0084] The second PCB 240 may include a second connector 242, a communication module 244, a first filter 245, a sensor module 250, a processor 260 or a memory 270, or any combination thereof. The second PCB 240 may include a rigid PCB.

[0085] The second connector 242 can be connected to the second end of the signal connection member 235. The second connector 242 can provide a branch point for the communication module 244 and the first filter 245 (or sensor module 250).

[0086] The second connector 242 can transmit the signal processed by the communication module 244 to the first connector 231 and the first antenna 210 via the first signal path S1 of the signal connection member 235. The second connector 242 can also transmit one or both of the first wireless transmission signal or the first wireless reception signal of the first antenna 210 transmitted through the signal connection member 235 to the communication module 244 via the first signal path S1. When the first antenna 210 contacts the user's body of the electronic device 200, the second connector 242 can receive a sensing signal related to the amount of change in capacitance of the contacted first antenna (e.g., a sensing signal related to the unit-time change value of the capacitance) via the second signal path S2 of the signal connection member 235, and provide the received sensing signal to one or both of the first filter 245 or the sensor module 250.

[0087] The communication module 244 can be electrically connected to the second connector 242. The communication module 244 can be configured to transmit and receive a first wireless transmit signal and a first wireless receive signal from the first antenna 210, and a second wireless transmit signal and a second wireless receive signal from the second antenna 220, respectively. The communication module 244 can supply power to the second connector 242 and the first connector 231 using the signal connection member 235.

[0088] Communication module 244 may include Figure 1 The communication module 190. The communication module 244 is capable of supporting the establishment of a direct (e.g., wired) communication channel or a wireless communication channel, and performing communication between the electronic device 200 and an external electronic device through the established communication channel.

[0089] The communication module 244 can be controlled by a CP included in the processor 260. The communication module 244 can receive control signals from the processor 260 and control the transmission power transmitted through the first antenna 210 and the second antenna 220. The communication module 244 can also receive control signals from the processor 260 and control the strength of the signals transmitted through the first antenna 210 and the second antenna 220.

[0090] The transmit power transmitted via the first antenna 210 and / or the second antenna 220 may be related to the electromagnetic absorption ratio (SAR) of the human body, which may adversely affect the user of the electronic device 200. When the user touches the electronic device 200, the communication module 244 may control the transmit power under the control of the processor 260 to reduce SAR. During communication with external electronic devices, the communication module 244 may control the transmit power even when the user of the electronic device 200 is in close proximity to the first antenna 210 of the housing 201.

[0091] The first filter 245 may be electrically connected to the second connector 242. The first filter 245 is capable of filtering noise from the first wireless transmitted signal, the first wireless received signal, and / or the sensed signal related to the capacitance change of the first antenna 210 (e.g., the capacitance change per unit time) transmitted through the first signal path S1 and / or the second signal path S2 of the signal connection member 235. The first filter 245 can prevent noise signals transmitted from the first antenna 210 through the signal connection member 235 from being transmitted to the sensor module 250.

[0092] The first filter 245 may include a bandpass filter or a lowpass filter. The first filter 245 may include a resistor-inductor (RL) circuit or a resistor-capacitor (RC) circuit.

[0093] Sensor module 250 can be electrically connected to first filter 245. Sensor module 250 can be electrically connected to second connector 242 via first filter 245. Sensor module 250 can support multiple channels. Sensor module 250 can be configured to measure the change in capacitance per unit time (or the amount of change). Sensor module 250 can send the measured sensed value (e.g., the change in capacitance per unit time or the amount of change) to processor 260.

[0094] The sensor module 250 may include one or both of the capacitance measurement unit 252 or the sensing parameter adjustment unit 254.

[0095] The capacitance measurement unit 252 can measure the amount of capacitance change (e.g., the change in capacitance per unit time) transmitted via the second signal path S2 through the signal connection member 235 for the path between the first antenna 210 and the second connector 242, and can send a signal associated with the measured capacitance to the processor 260. When the first antenna 210 comes into contact (e.g., is held or touched) with the user of the electronic device 200, or during the communication between the electronic device 200 and an external electronic device via the first antenna 210, or when the user of the electronic device 200 is in close proximity to the first antenna 210 of the housing 201, the capacitance measurement unit 252 can determine whether the change in capacitance per unit time (or the amount of change) is greater than or equal to a specified set value.

[0096] The sensing parameter adjustment unit 254 can receive control information related to one or both of the first wireless transmission signal or the first wireless reception signal of the first antenna 210 via the processor 260. The sensing parameter adjustment unit 254 can adjust at least one sensing parameter (e.g., filter setting value, sensing period, or sensing frequency) based on the control information received from the processor 260 related to the first wireless transmission signal and the first wireless reception signal.

[0097] Sensor module 250 may include Figure 1 Sensor module 176. Sensor module 250 may include a grip sensor or touch sensor that measures capacitance value or capacitance change (e.g., capacitance change per unit time). During the time when a user of electronic device 200 contacts (e.g., holds or touches) the first antenna 210 to the outside of the electronic device 200, sensor module 250 may determine the transmit power that meets SAR-related requirements and send the determined value to processor 260.

[0098] Reference Figure 3 The sensing parameter adjustment unit 254 may include one or both of the sensing cycle control module 255 and the second filter 256.

[0099] The sensing cycle control module 255 can change the sensing cycle or sensing frequency used to identify contact (holding or touching) with the first antenna 210 to correspond to the frequency band information transmitted in real time by the processor 260. The sensing cycle control module 255 can avoid noise signals sensed through a specific frequency band (e.g., about 0.7 GHz to 6 GHz). The sensing cycle control module 255 can be configured to avoid time-domain correlated noise signals related to the first wireless transmission signal of the first antenna 210 transmitted through the first signal path S1 and / or the amount of capacitance change (e.g., the change in capacitance per unit time).

[0100] The second filter 256 can filter out noise signals that were not removed by the first filter 245. The second filter 256 can adjust its filter settings based on frequency band information transmitted in real time via the processor 260. The second filter 256 can use dynamic or variable control of software stored in the memory 270 to filter out noise signals not removed by the first filter 245. The sensing parameter adjustment unit 254 can include multiple hardware filters. The sensing parameter adjustment unit 254 can select or switch one of the multiple hardware filters to correspond to the frequency band information of the first antenna 210.

[0101] The second filter 256 may include a band-pass filter or a low-pass filter. The second filter 256 may include an RL circuit or an RC circuit. The second filter 256 can control the RC circuit to set the cutoff frequency. The RC value of the second filter 256 can be adjusted according to the control of the processor 260.

[0102] The sensor module 250 can receive frequency band information with noise components from the processor 260 in real time. Based on the frequency band information with noise components transmitted in real time from the processor 260 through the sensing parameter adjustment unit 254, the sensor module 250 can remove noise signals that were not removed by the first filter 245 by adjusting at least one sensing parameter (e.g., filter set point, sensing period, or sensing frequency) via the second filter 256.

[0103] Signals containing ripple in frequency band information with noise components can generate ghost grip. Sensor module 250 can remove noise associated with the ripple signal by using sensing parameter adjustment unit 254 or second filter 256 to change the sensing frequency or sensing period according to the frequency band information with noise components transmitted in real time from processor 260.

[0104] Reference Figure 4 When a user of the electronic device 200 contacts (e.g., holds or touches) the first antenna 210, the change in capacitance of the first antenna 210 per unit time (e.g., C1, C2) can be altered. The change in capacitance per unit time can vary, for example, within a period of tens to hundreds of milliseconds (msec).

[0105] Reference Figure 5 When a user of the electronic device 200 contacts (e.g., holds or touches) the first antenna 210, the noise signal (e.g., n1, n2 and / or n3) included in the first wireless transmission signal of the first antenna 210 can represent the unit time change value (or amount of change) of the capacitance over tens of nanoseconds (nsec).

[0106] Reference Figure 6 For example, a second filter 256 can be used for filtering (e.g., f1, f2, and / or f3). Figure 5 The noise signal (e.g., n1, n2, and / or n3). For example, the processor 260 of the electronic device 200 can use a window function of about 20 milliseconds to remove the grip signal and the change generated due to the occurrence of a unit-time change value (or amount of change) of the capacitance that does not have a continuous value within about 20 milliseconds through the second filter 256.

[0107] Processor 260 can be configured to control the transmit power of communication module 244 based on signals measured using sensor module 250. Processor 260 can be electrically connected to or operatively connected to first antenna 210, second antenna 220, communication module 244, sensor module 250, or memory 270. Processor 260 can control at least one sensing parameter of sensor module 250 (e.g., filter setting value, sensing period, or sensing frequency).

[0108] Processor 260 can control the overall operation of electronic device 200 and the signal flow between internal components of electronic device 200, and can perform data processing functions for processing data. For example, processor 260 may include a CPU, AP, and CP. Processor 260 may be configured as a single-core processor or a multi-core processor. Processor 260 may include at least one processor. Processor 260 may include... Figure 1 The processor is 260.

[0109] The processor 260 may include an interface 261, a grip determination unit 263, a bandwidth transfer unit 265, and a transmit power control unit 267.

[0110] Interface 261 may support at least one specified protocol that enables direct or wireless connection between electronic device 200 and external electronic device. Interface 261 may be electrically connected to communication module 244.

[0111] The grip determination unit 263 receives, via the sensor module 250, the unit-time change value or the unit-time change amount of capacitance transmitted through the second signal path S2 of the signal connection member 235 for the path between the first antenna 210 and the second connector 242. Furthermore, based on the received unit-time change value (or change amount) of capacitance, the grip determination unit can determine whether the user has contacted (grabbed or touched) the first antenna 210.

[0112] The frequency band transmission unit 265 can transmit frequency band information with noise components to the sensor module 250 in real time. For example, the frequency band transmission unit 265 can analyze the frequency band information of a network communicating through the first antenna 210 or the second antenna, and can transmit the analyzed information to the sensor module 250 in real time.

[0113] The transmit power control unit 267 can control the communication module 244 to control the power transmitted through one or both of the first antenna 210 and the second antenna 220. When transmitting a first wireless transmission signal from the first antenna 210 or a second wireless transmission signal from the second antenna 220 to the outside of the electronic device 200, the transmit power control unit 267 can determine the transmit power that meets the requirements related to the electromagnetic absorption ratio (e.g., SAR) and can send the determined value to the communication module 244.

[0114] The memory 270 may store a lookup table related to at least one sensing parameter of the sensor module 250, and may store at least one of the filter settings, sensing period, or sensing frequency of the sensor module 250.

[0115] The memory 270 can perform functions such as storing programs, operating systems, various applications, and input / output data for processing and control of the processor 260; and can store programs for controlling the overall operation of the electronic device 200. The memory 270 can store the user interface (UI) provided by the electronic device 200 and various setting information required for functional processing within the electronic device 200. The memory 270 can store and retrieve instructions for operations performed by the processor 260.

[0116] Reference Figure 7 [a] Memory 270 may store sensor module control software (SW) for controlling sensor module 250 via processor 260. Memory 270 may use the stored sensor module control software to support sensor module 250 in sensing the grip (e.g., contact or touch) state of first antenna 210 and the grip (e.g., contact or touch) state of second antenna 220. Memory 270 may include one (e.g., a single) software to control sensor module 250. Memory 270 may use said one software to simultaneously sense the grip (e.g., contact or touch) state of first antenna 210 and the grip (e.g., contact or touch) state of second antenna 220. Memory 270 may support controlling at least one sensing parameter (e.g., filter setting value, sensing period, or sensing frequency) of sensor module 250 via processor 260.

[0117] Reference Figure 7 [b] The memory 270 can use the stored sensor module to control the SW to support the sensor module 250 in sensing the holding state of the first antenna 210, the holding state of the second antenna 220, and the nth antenna (e.g., Figure 2a The third antenna 2017 and the fourth antenna 2018 are held in a gripped state. In addition to the first antenna 210 and the second antenna 220, the housing 201 may also include multiple other antennas (e.g., an nth antenna, such as...). Figure 2aThe third antenna 2017 and the fourth antenna 2018 are shown in the diagram. Multiple antennas (the nth antenna) can be determined based on the number of segments (e.g., slits) formed in the housing 201. The multiple antennas may include millimeter-wave array antennas, FPCB antennas, laser direct-formed (LDS) antennas, PCB-embedded antennas (PEA), and chip antennas. Additionally, the memory 270 can be configured to use a single sensor module to control software to simultaneously sense the holding status of the first antenna 210, the second antenna 220, and the nth antenna (millimeter-wave array antenna, FPCB antenna, PEA, or chip antenna).

[0118] Figure 8 This is a flowchart illustrating a method for controlling the transmission power of a communication module of an electronic device according to an embodiment. Figure 9 An example is shown. Figure 8 The subroutine of step 820 disclosed in the document.

[0119] Reference Figure 8 and Figure 9 The described operation can be, for example, Figure 1 Electronic device 101 or Figure 2a and 2b The components described in the electronic device 200 are used to perform this function. Figure 8 and Figure 9 The operational embodiments disclosed herein may include those described above. Figures 1 to 7 The embodiments disclosed herein. Figure 8 and Figure 9 The embodiments described herein may include, for example, communication activation, communication standby mode, and communication state for the first antenna 210 of the electronic device 200.

[0120] According to various embodiments of the present disclosure, the electronic device 200 electrically connects the first PCB 230 and the second PCB 240 via a signal connection member 235 to transmit and receive wireless signals or sensing signals, and the electronic device 200 can control the transmission power of the communication module 244 by using a sensor module 250 (e.g., a grip sensor or a touch sensor).

[0121] In step 810, the processor 260 monitors the contact status of the first antenna 210.

[0122] When the first antenna 210 comes into contact with the user's body of the electronic device 200, the processor 260 can receive a sensing signal related to the change in capacitance of the first antenna 210 per unit time based on the contact via a sensor module 250 disposed on the second PCB 240.

[0123] In step 820, the processor 260 configures the filter setting value or sensing period of the sensor module 250 (e.g., the second filter 256) based on the information of the frequency band, wherein communication via the first antenna 210 is carried out in the frequency band.

[0124] The second filter 256 can adjust the filter setting value or sensing period (or sensing frequency) based on the frequency band information transmitted in real time by the processor 260.

[0125] In step 830, the processor 260 determines whether a part of the user's body of the electronic device 200 has come into contact with the first antenna 210.

[0126] The processor 260 can use the grip determination unit 263 to determine, via the sensor module 250, the capacitance change value (e.g., the change in capacitance per unit time or the amount of change) of the path transmitted through the second signal path S2 of the signal connection member 235 between the first antenna 210 and the second connector 242. Furthermore, the processor 260 can determine whether the first antenna 210 is being touched (held or touched) by a user based on the received change in capacitance per unit time (or the amount of change).

[0127] In step 840, if a user of the electronic device 200 contacts (holds or touches) the first antenna 210, a first filter 245 or a second filter 256 is used to remove noise signals from the first wireless received signal or the sensing signal related to the unit time change value (or amount of change) of the capacitance received through the first antenna 210.

[0128] In step 850, the processor 260 controls the communication module 244 to control the transmission power of the signal transmitted through the first antenna 210.

[0129] When transmitting a first wireless transmission signal from the first antenna 210 or a second wireless transmission signal from the second antenna 220 to the outside of the electronic device 200, the processor 260 may use the transmit power control unit 267 to determine the transmit power that meets the SAR-related requirements, and may send the determined value to the communication module 244.

[0130] The filter settings and sensing period (or sensing frequency) of the second filter 256 in step 820 above can be used. Figure 9 The publicly available procedures are used to execute them.

[0131] In step 821, the processor 260 sends the frequency band information to the sensor module 250 in real time, wherein communication is carried out in the frequency band via the first antenna 210 or the second antenna 220.

[0132] In step 823, processor 260 retrieves setting information from a lookup table. For example, processor 260 may search for configuration information related to at least one sensing parameter of sensor module 250 (e.g., filter setting value, sensing period, or sensing frequency) from memory 270 (e.g., a lookup table).

[0133] In step 825, the processor 260 sets the second filter 256 with a filter setting value and a sensing period (or sensing frequency) corresponding to the information retrieved from the memory 270.

[0134] Electronic device 200 may include: a housing 201; a first antenna 210 for transmitting and receiving one or both of a first wireless transmit signal or a first wireless receive signal using a first portion of the housing; a first PCB 230 electrically connected to the first antenna and including a first connector 231; a second PCB 240 electrically connected to the first PCB and including a second connector 242; a signal connection member 235 having a first end connected to the first connector and a second end connected to the second connector; a communication module 244 electrically connected to the second connector and controlling one or both of the first wireless transmit signal or the first wireless receive signal; a sensor module 250 electrically connected to the second connector and adjusting at least one sensing parameter based on frequency information of one or both of the first wireless transmit signal or the first wireless receive signal, and measuring capacitance for one or both of the first wireless transmit signal or the second wireless transmit signal along a path between the first antenna and the second connector; and a processor 260 configured to control the transmit power of the communication module based on the capacitance measured using the sensor module.

[0135] An impedance matching circuit 233 for matching the impedance between the first antenna and the communication module may be included between the first antenna and the first connector.

[0136] The signal connection component 235 may include a coaxial cable or an FPCB.

[0137] The signal connection component 235 can be configured to form a first signal path S1, wherein the first signal path S1 transmits one or both of a first wireless transmission signal or a first wireless reception signal transmitted through the first antenna to the communication module, and provides a processed signal from the communication module to the first antenna.

[0138] The signal connection member 235 can be configured to form a second signal path S2, wherein when the first antenna comes into contact with the human body of the user of the electronic device, the second signal path S2 provides a sensing signal related to the unit time change value of the capacitance corresponding to the contact to the sensor module.

[0139] Between the second connector 242 and the sensor module 250, a first filter 245 may be included for filtering noise signals transmitted from the first antenna to the sensor module.

[0140] According to various embodiments, the sensor module 250 may include: a capacitance measurement unit 252 for measuring a unit-time change in capacitance transmitted via the signal connection member 235 for the path between the first antenna and the second connector, and transmitting the measured unit-time change in capacitance to the processor; and a sensing parameter adjustment unit 254 configured to adjust at least one sensing parameter based on one or both of the measured unit-time change in capacitance transmitted via the signal connection member or a first wireless transmission signal.

[0141] The sensing parameter adjustment unit 254 may include: a sensing cycle control module 255, which changes the sensing cycle or sensing frequency used to identify contact with the first antenna to correspond to the frequency band information based on the frequency band information transmitted in real time by the processor.

[0142] The sensing parameter adjustment unit 254 may include: a second filter 256, which filters out noise signals that have not been removed by the first filter, and adjusts the filter setting value based on the frequency band information transmitted in real time by the processor.

[0143] The sensor module 250 may include a grip sensor or a touch sensor.

[0144] Processor 260 can receive, via sensor module, the unit-time change value of capacitance transmitted through signal connection member for the path between the first antenna and the second connector. Furthermore, processor 260 may include: a grip determination unit 263, which determines whether a user of the electronic device has touched the first antenna based on the received unit-time change value of capacitance; a bandpass transmission unit 265, which transmits bandpass information, including noise components, to the sensor module in real time; and a transmit power control unit 267, configured to control the communication module to control the power transmitted through the first antenna.

[0145] The electronic device 200 may further include a memory 270 that stores a lookup table associated with at least one sensing parameter of the sensor module 250.

[0146] The memory 270 may store software for controlling the sensor module via the processor to sense the grip state of the first antenna.

[0147] Methods for controlling the transmit power of electronic devices 101 and 200 may include: processor 260 monitoring the contact status of first antenna 210; processor 260 setting one or both of a filter setting value or a sensing period of sensor module 250 based on frequency band information, wherein communication via first antenna 210 is conducted in the frequency band; processor 260 determining whether the user's body is in contact with first antenna 210 when the user's body of the electronic device is in contact with first antenna 210; processor 260 removing noise signals from a first wireless received signal or a sense signal related to the unit time change value of the capacitance of first antenna using one or both of first filter 245 or second filter 256; and processor 260 controlling communication module 244 to control the transmit power transmitted via first antenna.

[0148] The steps of setting the filter setting value or sensing period of sensor module 250 may include: processor 260 sending information of frequency band to sensor module 250 in real time, wherein communication via the first antenna is performed in the frequency band; processor 260 searching memory 270 to obtain setting information related to at least one sensing parameter of sensor module, and processor 260 setting one or both of the filter setting value or sensing period corresponding to the information retrieved from memory to second filter 256.

[0149] The sensor module 250 may include a sensing parameter adjustment unit 254, which, based on information about the frequency band transmitted in real time by the processor 260, changes one or both of the sensing frequency or sensing period used to identify contact with the first antenna to correspond to the frequency band information.

[0150] The second filter 256 can filter out noise signals that were not removed by the first filter 245, and can be configured to adjust either or both of the filter setting value or the sensing period based on information of the frequency band transmitted in real time by the processor 260.

[0151] The processor 260 may include: a grip determination unit 263, which receives the unit-time change value of the capacitance of the first antenna 210 through the sensor module 250 and determines whether the first antenna has been touched by the user of the electronic device based on the received unit-time change value of the capacitance; a frequency band transmission unit 265, which transmits frequency band information, including noise signals, to the sensor module in real time; and a transmit power control unit 267, which is configured to control the communication module 244 to control the power transmitted through the first antenna 210.

[0152] The memory 270 may store a lookup table associated with at least one sensing parameter of the sensor module 250.

[0153] The memory 270 can be configured to store software for controlling the sensor module 250 via the processor 260 to sense the gripping state of the first antenna 210.

[0154] Although this disclosure has been specifically shown and described with reference to particular embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device comprising: case; The first antenna is configured to transmit and receive at least one of a first wireless transmit signal and a first wireless receive signal using a portion of the housing; A first printed circuit board (PCB) is electrically connected to a first antenna and includes a first connector; The second PCB includes the second connector; A signal connection member having a first end connected to a first connector and a second end connected to a second connector such that a second PCB is connected to a first PCB via the signal connection member; The second PCB includes: A communication module, electrically connected to a second connector, is configured to control at least one of a first wireless transmit signal and a first wireless receive signal; a sensor module, electrically connected to the second connector, is configured to adjust at least one sensing parameter based on frequency information of the at least one of the first wireless transmit signal and the first wireless receive signal, and to measure the capacitance of a signal path between a first antenna and a second connector, wherein the signal path is the path through which the at least one of the first wireless transmit signal and the first wireless receive signal is transmitted and received; and The processor is configured to control the transmit power of the communication module based on the capacitance measured by the sensor module.

2. The electronic device as claimed in claim 1, wherein, The first PCB includes an impedance matching circuit between the first antenna and the first connector for matching the impedance between the first antenna and the communication module.

3. The electronic device as claimed in claim 1, wherein, The signal connection component includes a coaxial cable or a flexible PCB.

4. The electronic device as claimed in claim 1, wherein, The signal connection member is configured to form a first signal path, wherein the first signal path transmits at least one of a first wireless transmitted signal and a first wireless received signal transmitted through the first antenna to the communication module, and provides a signal processed by the communication module to the first antenna.

5. The electronic device as claimed in claim 4, wherein, When the first antenna comes into contact with the user's body of the electronic device, the signal connection member is configured to form a second signal path, wherein the second signal path provides a sensing signal related to the unit time change value of the capacitance corresponding to the contact to the sensor module.

6. The electronic device as claimed in claim 1, wherein, A first filter, configured to filter noise signals transmitted from the first antenna to the sensor module, is included between the second connector and the sensor module.

7. The electronic device as claimed in claim 6, wherein, The sensor module includes: A capacitance measurement unit is configured to measure the unit-time change in capacitance transmitted through the signal connection member along a path between the first antenna and the second connector, and to send the measured unit-time change in capacitance to the processor; and The sensing parameter adjustment unit is configured to adjust the at least one sensing parameter based on at least one of a first wireless transmission signal transmitted through the signal connection member and the unit time change value of the measured capacitance.

8. The electronic device according to claim 7, wherein, The sensing parameter adjustment unit includes a sensing cycle control module, which changes the sensing cycle or sensing frequency used to identify contact with the first antenna to correspond to the frequency band information based on the frequency band information transmitted in real time by the processor.

9. The electronic device as claimed in claim 7, wherein, The sensing parameter adjustment unit includes a second filter that filters out noise signals not removed by the first filter and adjusts the filter setting value based on the frequency band information transmitted in real time by the processor.

10. The electronic device of claim 1, wherein, The sensor module includes a grip sensor or a touch sensor.

11. The electronic device according to claim 1, wherein, The processor includes: The grip determination unit receives, via the sensor module, a unit-time change value of the capacitance of the path between the first antenna and the second connector transmitted through the signal connection member, and determines, based on the received unit-time change value of the capacitance, whether the user of the electronic device has touched the first antenna. The frequency band transmission unit transmits frequency band information, including noise components, to the sensor module in real time; and A transmit power control unit is configured to control the communication module to control the transmit power transmitted through the first antenna.

12. The electronic device according to claim 1, further comprising: A memory for storing lookup tables associated with the at least one sensing parameter of the sensor module.

13. The electronic device of claim 12, wherein, The memory stores software used by the processor to control the sensor module to sense the gripping state of the first antenna.

14. A method for controlling the transmission power of the electronic device as claimed in claim 1, the method comprising: The processor monitors the contact status of the first antenna; The processor sets at least one of the filter setting value and sensing period of the sensor module based on the frequency band information, wherein communication via the first antenna is carried out in the frequency band; The processor determines whether the user's body is in contact with the first antenna. When the user's body comes into contact with the first antenna, the processor uses at least one of a first filter or a second filter to remove noise signals from the first wireless received signal received through the first antenna and / or the sensed signal related to the unit-time change value of the antenna's capacitance; and The processor controls the communication module to control the transmission power transmitted through the first antenna.

15. The method of claim 14, wherein, The step of setting at least one of the filter settings and sensing period of the sensor module includes: The processor transmits information about the frequency band to the sensor module in real time, wherein communication via the first antenna is performed in the frequency band; The processor retrieves setting information related to at least one sensing parameter of the sensor module from the memory; and The processor sets at least one of the filter setting value and the sensing period corresponding to the setting information retrieved from the memory to the second filter.

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