A wafer sorting box capable of preventing wafer damage and a wafer dropping box method

Abstract

The application discloses a sorting box capable of preventing silicon wafer from being damaged and a silicon wafer falling box method, and the sorting box comprises a bracket, a box, an air damper and a battery, and a first magnet and a coil are arranged in the bracket. The box is suspended in the bracket, and the box is provided with a second magnet which can be arranged at the bottom of the box and has the same magnetic pole direction as the first magnet. The air damper is arranged on the bracket and in front of the box. After the silicon wafer falls into the box, the silicon wafer and the box have a complete inelastic collision and compress the air damper together; after the speed of the box is reduced to zero, the air damper pushes the box back to reset; during the movement of the box, the second magnet moves relative to the coil, current is generated in the coil and the battery is charged. In the process of speed reduction, most of the kinetic energy loss of the silicon wafer is converted into electric energy after overcoming the magnetic work, so that the quality abnormal phenomena such as edge collapse, silicon falling and hidden crack of the silicon wafer can be avoided.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer manufacturing technology, specifically to a sorting box and a method for placing silicon wafers into the box that can prevent damage to silicon wafers. Background Technology

[0002] In the silicon wafer production process, silicon rods are cut by multi-wire slicing machines, and after debinding, insertion and cleaning processes, they enter the sorting process. The sorting equipment drops the inspected silicon wafers into corresponding material boxes according to their grades. After passing two inspections, the silicon wafers are packaged and sold to customers.

[0003] During the silicon wafer sorting and placement process, after passing through the inspection area, the wafers are marked with virtual serial numbers and transported forward by conveyor belt. When they reach their designated cassette, a corresponding lifting mechanism raises the wafer. As the lifting mechanism operates, the wafer detaches from the conveyor belt, turns 90 degrees, and falls into the cassette. The wafer falls into the cassette at high speed with significant kinetic energy, resulting in a hard impact. The wafer's forward kinetic energy is converted into the internal energy of the cassette's buffer and the wafer's reverse kinetic energy. During this turning motion, the wafer's traveling edge is highly susceptible to quality defects such as edge chipping, silicon drop, and microcracks, leading to wafer damage. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide a sorting box that can prevent silicon wafer damage.

[0005] To solve the above problems, the technical solution adopted by the present invention is as follows: a sorting box capable of preventing silicon wafer damage, comprising: a bracket, the bracket having a first magnet and a coil, the coil being wound around the outer periphery of the first magnet; a box, suspended within the bracket, the box having a second magnet, the second magnet having the same magnetic pole orientation as the first magnet; an air damper located in front of the box; and a battery electrically connected to the coil; after the silicon wafer falls into the box, the silicon wafer and the box undergo a completely inelastic collision and together compress the air damper forward; when the speed of the box drops to zero, the air damper pushes the box backward to reset; during the movement of the box, the second magnet moves relative to the coil, a current is generated in the coil and charges the battery.

[0006] Compared to existing technologies, the advantages of this invention are as follows: The sorting box is suspended within the support frame. When a silicon wafer falls into the box, it undergoes a completely inelastic collision with the box, moving forward together. The wafer's forward kinetic energy is converted into the internal energy of the box and the wafer. As the wafer and box move forward, they compress the air damper until the box's velocity drops to zero, at which point the final kinetic energy of the wafer and box becomes the air energy of the damper. The damper then pushes the box back to its original position, ultimately converting the kinetic energy of the wafer and box into work done on the magnetic field. Therefore, this sorting box avoids hard collisions between the wafer and the box, preventing quality defects such as edge chipping, silicon drop, and microcracks. During the box's movement, the second magnet on the box moves relative to the coil on the support frame, changing the magnetic field strength around the coil. This generates current in the coil, charging the battery, which stores electrical energy that can then be used as energy.

[0007] The sorting box described above, which can prevent damage to silicon wafers, has a U-shaped bracket with ball bearings on both sides and a clearance fit between the bracket and the box.

[0008] The sorting box described above, which can prevent damage to silicon wafers, has the axial direction of the balls in the vertical direction, and there are multiple balls arranged sequentially in the front-to-back direction.

[0009] The sorting box described above, which can prevent damage to silicon wafers, has a front baffle and a side baffle.

[0010] The aforementioned sorting box, which can prevent damage to silicon wafers, has a buffer pad on both the front baffle and the bottom of the box.

[0011] The sorting box described above, which can prevent damage to silicon wafers, has a limiting plate on the bracket, and the air damper is installed on the limiting plate.

[0012] The present invention also provides a method for placing silicon wafers into a cassette, using the above-mentioned sorting cassette capable of preventing damage to the silicon wafers, comprising the following steps:

[0013] Step S100: The silicon wafer falls into the material box, and the front end of the silicon wafer collides completely inelastically with the front end of the material box.

[0014] In step S200, the silicon wafer and the cassette work together against the magnetic force while in a relatively stationary state, and together compress the air damper until the speed drops to zero.

[0015] In step S300, the material box is reset backward by the reaction force of the air damper and the force of the magnetic field.

[0016] In the aforementioned silicon wafer placement method, after the silicon wafer falls into the cassette, it undergoes a completely inelastic collision with the cassette. The wafer and cassette move forward together, and the wafer's forward kinetic energy is converted into the internal energy of the cassette and the wafer. As the wafer and cassette move forward together, they compress the air damper until the cassette's velocity drops to zero. The final kinetic energy of the wafer and cassette is converted into the air energy of the air damper. Then, the air damper pushes the cassette backward to reset it. Ultimately, the kinetic energy of the wafer and cassette is converted into work done on the magnetic field. This method avoids hard collisions between the wafer and the cassette, preventing quality abnormalities such as edge chipping, silicon drop, and microcracks.

[0017] In the above-described method for placing silicon wafers into a cassette, multiple silicon wafers are sequentially placed into the cassette in the order of steps S100 to S300. As the number of silicon wafers in the cassette increases, the vertical distance between the cassette and the support decreases continuously, and this vertical distance is inversely proportional to the number of silicon wafers in the cassette.

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is one of the structural schematic diagrams of the sorting box according to an embodiment of the present invention;

[0020] Figure 2 This is a second schematic diagram of the sorting box according to an embodiment of the present invention.

[0021] The following are the reference numerals: 100 bracket, 110 first magnet, 120 coil, 130 ball bearing, 140 limit plate, 200 material box, 210 second magnet, 220 front baffle, 230 side baffle, 300 air damper, 400 battery. Detailed Implementation

[0022] The embodiments of the present invention are described in detail below, with reference to... Figure 1 and Figure 2This invention provides a sorting box capable of preventing silicon wafer damage, comprising a bracket 100, a box 200, an air damper 300, and a battery 400. The bracket 100 houses a first magnet 110 and a coil 120, with the coil 120 wound around the outer periphery of the first magnet 110. The two poles of the battery 400 are electrically connected to the two ends of the coil 120. The box 200 is suspended within the bracket 100. The box 200 includes a second magnet 210, which can be installed at the bottom of the box 200, and the magnetic poles of the second magnet 210 and the first magnet 110 face the same direction. The air damper 300 is mounted on the bracket 100 and positioned in front of the box 200. After the silicon wafer falls into the cassette 200, the silicon wafer collides with the cassette 200 in a completely inelastic manner and together they compress the air damper 300 forward. When the speed of the cassette 200 drops to zero, the air damper 300 pushes the cassette 200 backward to reset it. During the movement of the cassette 200, the second magnet 210 moves relative to the coil 120, and a current is generated in the coil 120 to charge the battery 400.

[0023] Compared to existing technologies, the material box 200 of this sorting box is suspended within the bracket 100. When the silicon wafer falls into the material box 200, it undergoes a completely inelastic collision with the box 200, causing them to move forward together. The positive kinetic energy of the silicon wafer is converted into the internal energy of the box 200 and the silicon wafer. As the silicon wafer and box 200 move forward together, they compress the air damper 300 until the velocity of the box 200 drops to zero. The final kinetic energy of the silicon wafer and box 200 is converted into the air energy of the air damper 300. Then, the air damper 300 pushes the box 200 backward to reset it. Finally, the kinetic energy of the silicon wafer and box 200 is converted into work done on the magnetic field. Therefore, this sorting box can avoid hard collisions between the silicon wafer and the box 200, preventing quality abnormalities such as edge chipping, silicon drop, and microcracks. During the movement of the material box 200, the second magnet 210 on the material box 200 moves relative to the coil 120 on the bracket 100, changing the magnetic field strength around the coil 120. This causes a current to be generated in the coil 120, charging the battery 400. The battery 400 stores electrical energy, which can then be used as energy. In this invention, after the silicon wafer falls into the material box 200, most of the kinetic energy lost during the deceleration process is converted into electrical energy after overcoming the magnetic force. This reduces or eliminates quality abnormalities such as edge chipping, silicon drop, or microcracks caused by stress concentration due to excessive absorption of internal energy in the silicon wafer.

[0024] Furthermore, such as Figure 1 and Figure 2As shown, the bracket 100 is U-shaped, and both side walls of the bracket 100 are provided with ball bearings 130. The bracket 100 and the material box 200 are fitted with a clearance fit, which can limit and guide the material box 200. Specifically, the axial direction of the ball bearings 130 is vertical, and there are multiple ball bearings 130 arranged sequentially in the front-to-back direction. Specifically, the material box 200 has a front baffle 220 and a side baffle 230. Both the front baffle 220 and the bottom of the material box 200 are provided with buffer pads to protect the silicon wafers falling into the material box 200. Specifically, the bracket 100 is provided with a limiting plate 140, and an air damper 300 is installed on the limiting plate 140 to prevent the air damper 300 from moving laterally when pushed by the material box 200.

[0025] Embodiments of the present invention also provide a method for placing silicon wafers into a cassette, employing the aforementioned sorting cassette capable of preventing damage to the silicon wafers, comprising the following steps:

[0026] In step S100, the silicon wafer falls into the material box 200, and the front end of the silicon wafer collides completely inelastically with the front end of the material box 200.

[0027] In step S200, the silicon wafer and the material box 200 work together against the magnetic force in a relatively stationary state, and together compress the air damper 300 until the speed drops to zero.

[0028] In step S300, the material box 200 is reset backward by the reaction force of the air damper 300 and the force of the magnetic field.

[0029] After the silicon wafer falls into the cassette 200, it undergoes a completely inelastic collision with the cassette 200. The wafer and cassette 200 move forward together, and the wafer's forward kinetic energy is converted into the internal energy of both the wafer and the cassette 200. As the wafer and cassette 200 move forward together, they compress the air damper 300 until the cassette 200's velocity drops to zero. The final kinetic energy of the wafer and cassette 200 is converted into the air energy of the air damper 300. Then, the air damper 300 pushes the cassette 200 backward to reset it. Ultimately, the kinetic energy of the wafer and cassette 200 is converted into work done on the magnetic field, preventing hard collisions between the wafer and cassette 200 and avoiding quality abnormalities such as edge chipping, silicon drop, and microcracks.

[0030] Furthermore, during the silicon wafer sorting process, multiple silicon wafers fall into the material box 200 in sequence according to steps S100 to S300. As the number of silicon wafers in the material box 200 increases, under the premise that the magnetic field strength remains unchanged, the vertical distance between the material box 200 and the bracket 100 continuously decreases, and the vertical distance is inversely proportional to the number of silicon wafers in the material box 200, thus satisfying the predetermined magnetic field strength setting value.

[0031] It should be noted that in the description of this invention, any descriptions of orientation, such as up, down, front, back, left, right, etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the purpose of facilitating the description of this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation of this invention.

[0032] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," "exceeding," etc. are understood to exclude the stated number, while "above," "below," "within," etc. are understood to include the stated number. If "first" or "second" is mentioned, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0033] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0034] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A sorting box capable of preventing damage to silicon wafers, characterized in that, include: A bracket (100) is provided with a first magnet (110) and a coil (120), the coil (120) being wound around the outer periphery of the first magnet (110); The material box (200) is suspended inside the bracket (100). The material box (200) is provided with a second magnet (210), and the magnetic poles of the second magnet (210) are oriented in the same direction as those of the first magnet (110). An air damper (300) is located in front of the material box (200); as well as A storage battery (400) is electrically connected to the coil (120); After the silicon wafer falls into the cassette (200), the silicon wafer collides with the cassette (200) in a completely inelastic manner and together they compress the air damper (300) forward. When the speed of the cassette (200) drops to zero, the air damper (300) pushes the cassette (200) backward to reset it. During the movement of the cassette (200), the second magnet (210) moves relative to the coil (120), and a current is generated in the coil (120) to charge the battery (400).

2. The sorting box for preventing silicon wafer damage according to claim 1, characterized in that, The bracket (100) is U-shaped, and ball bearings (130) are provided on both sides of the bracket (100). The bracket (100) and the material box (200) are fitted with a clearance.

3. The sorting box for preventing silicon wafer damage according to claim 2, characterized in that, The axial direction of the ball (130) is vertical, and there are multiple balls (130), which are arranged sequentially in the front-to-back direction.

4. The sorting box for preventing silicon wafer damage according to claim 1, characterized in that, The hopper (200) has a front baffle (220) and a side baffle (230).

5. The sorting box for preventing silicon wafer damage according to claim 4, characterized in that, Both the front end baffle (220) and the bottom of the material box (200) are provided with cushioning pads.

6. The sorting box for preventing silicon wafer damage according to claim 1, characterized in that, The bracket (100) is provided with a limiting plate (140), and the air damper (300) is installed on the limiting plate (140).

7. A method for placing a silicon wafer into a cassette, characterized in that, The method of using a sorting box as described in any one of claims 1-6 to prevent silicon wafer damage includes the following steps: In step S100, the silicon wafer falls into the material box (200), and the front end of the silicon wafer collides completely inelastically with the front end of the material box (200). In step S200, the silicon wafer and the cassette (200) work together against the magnetic force in a relatively stationary state and compress the air damper (300) together until the speed drops to zero. In step S300, the material box (200) is reset backward by the reaction force of the air damper (300) and the force of the magnetic field.

8. The wafer placement method according to claim 7, characterized in that, Multiple silicon wafers are sequentially dropped into the cassette (200) in the order of steps S100 to S300. As the number of silicon wafers in the cassette (200) increases, the vertical distance between the cassette (200) and the bracket (100) continuously decreases, and the vertical distance is inversely proportional to the number of silicon wafers in the cassette (200).

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