Antenna module

Abstract

The application discloses an antenna module, comprising a body, wherein a low-frequency magnetic dipole antenna unit, a millimeter wave edge-shooting dielectric resonator antenna array and a millimeter wave end-shooting dielectric resonator antenna array are arranged on the body, the low-frequency magnetic dipole antenna unit is located between the millimeter wave edge-shooting dielectric resonator antenna array and the millimeter wave end-shooting dielectric resonator antenna array, the millimeter wave edge-shooting dielectric resonator antenna array comprises a plurality of edge-shooting dielectric resonator antenna units arranged in a row, and the millimeter wave end-shooting dielectric resonator antenna array comprises a plurality of end-shooting dielectric resonator antenna units arranged in a row. The antenna module has the advantages of novel structure, compactness, coverage of a 5G terminal middle-low frequency N78 frequency band and a 5G mmWave frequency band, high isolation, high gain and a large scanning angle.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and particularly to antenna modules. Background Technology

[0002] According to 3GPP TS38.101-2 5G Terminal RF Technical Specification and TR38.817 Terminal RF Technical Report, 5G mmWave antennas need to cover N257 (26.5-29.5GHz), N258 (24.25-27.25GHz), N260 (37-40GHz), and N261 (27.5-28.35GHz). However, 5G terminals also need to accommodate traditional low-frequency SUB-6 antennas. While designing separate low-frequency and mmWave antennas would achieve good results, it would occupy a large area, failing to meet the trend of antenna module miniaturization. Therefore, integrating the two is a good solution; however, current technology lacks antenna modules that can cover both the low-frequency N78 band and the 5G mmWave band in 5G terminals. Summary of the Invention

[0003] The technical problem solved by the present invention is to provide an antenna module that can cover the low-frequency N78 band and the 5G mmWave band in 5G terminals.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: an antenna module, including a body, wherein the body is provided with a low-frequency magnetic dipole antenna element, a millimeter-wave side-fire dielectric resonator antenna array and a millimeter-wave end-fire dielectric resonator antenna array, the low-frequency magnetic dipole antenna element is located between the millimeter-wave side-fire dielectric resonator antenna array and the millimeter-wave end-fire dielectric resonator antenna array, the millimeter-wave side-fire dielectric resonator antenna array includes a plurality of side-fire dielectric resonator antenna elements arranged in a row, and the millimeter-wave end-fire dielectric resonator antenna array includes a plurality of end-fire dielectric resonator antenna elements arranged in a row.

[0005] The beneficial effects of this invention are as follows: the antenna module has a novel and compact structure, can cover the low-frequency N78 band and the 5G mmWave band in 5G terminals, and has advantages such as high isolation, high gain and large scanning angle. Attached Figure Description

[0006] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0007] Figure 1 This is a schematic diagram of the overall structure of the antenna module according to Embodiment 1 of the present invention;

[0008] Figure 2 This is a schematic diagram of the overall structure of the antenna module according to Embodiment 1 of the present invention from another perspective;

[0009] Figure 3 This is a schematic diagram of the structure of the antenna module after hiding the main body and the first metal layer according to Embodiment 1 of the present invention;

[0010] Figure 4 This is a schematic diagram of the structure of the antenna module after hiding the main body and the first metal layer according to Embodiment 1 of the present invention (another perspective);

[0011] Figure 5 This is the S-parameter-gain curve of the low-frequency magnetic dipole antenna element in the antenna module of Embodiment 1 of the present invention;

[0012] Figure 6 This is the S-parameter-gain curve of the millimeter-wave side-fire dielectric resonator antenna array in the antenna module of Embodiment 1 of the present invention;

[0013] Figure 7 This is the S-parameter-gain curve of the millimeter-wave end-fire dielectric resonator antenna array in the antenna module of Embodiment 1 of the present invention;

[0014] Figure 8 This is a scanning angle diagram of the millimeter-wave side-fire dielectric resonator antenna array in the antenna module of Embodiment 1 of the present invention;

[0015] Figure 9 This is a scanning angle diagram of the millimeter-wave end-fire dielectric resonator antenna array in the antenna module of Embodiment 1 of the present invention.

[0016] Explanation of icon numbers:

[0017] 1. Body; 11. First dielectric substrate; 12. Second dielectric substrate; 13. Third substrate; 14. Fourth dielectric substrate; 15. Fifth dielectric substrate;

[0018] 2. Low-frequency magnetic dipole antenna element; 21. First feed port;

[0019] 3. Millimeter-wave side-fire dielectric resonator antenna array; 31. Side-fire dielectric resonator antenna element; 32. Second feed port;

[0020] 4. Millimeter-wave end-fire dielectric resonator antenna array; 41. End-fire dielectric resonator antenna element; 42. Isolation structure; 421. Air isolation hole; 43. Third feed port;

[0021] 51. First metal layer; 511. Top rectangular patch; 512. First conductive post; 513. Top separator patch; 514. Second conductive post; 52. Second metal layer; 521. Coupling gap; 53. Third metal layer; 531. Window; 532. Feed plate; 54. Fourth metal layer; 541. Clearance opening; 55. Grounding post. Detailed Implementation

[0022] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that if the embodiments of the present invention involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, if the embodiments of the present invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0026] Furthermore, if the meaning of "and / or" appears throughout the text, it refers to three parallel solutions. For example, "and / or" includes solution 1, solution 2, and solution 3, which simultaneously satisfy the above conditions. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0027] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] Example 1

[0029] Please refer to Figures 1 to 9 The first embodiment of the present invention is an antenna module, which is particularly suitable for 5G mobile terminal devices.

[0030] like Figure 1 As shown, the antenna module includes a body 1, on which a low-frequency magnetic dipole antenna element 2, a millimeter-wave side-fire dielectric resonator antenna array 3, and a millimeter-wave end-fire dielectric resonator antenna array 4 are provided. The low-frequency magnetic dipole antenna element 2 is located between the millimeter-wave side-fire dielectric resonator antenna array 3 and the millimeter-wave end-fire dielectric resonator antenna array 4. The millimeter-wave side-fire dielectric resonator antenna array 3 includes a plurality of side-fire dielectric resonator antenna elements 31 arranged in a row. The millimeter-wave end-fire dielectric resonator antenna array 4 includes a plurality of end-fire dielectric resonator antenna elements 41 arranged in a row.

[0031] In this embodiment, the number of side-fire dielectric resonator antenna elements 31 and the number of end-fire dielectric resonator antenna elements 41 are both seven, that is, the millimeter-wave side-fire dielectric resonator antenna array 3 is a 1x7 array, and the millimeter-wave end-fire dielectric resonator antenna array 4 is a 1x7 array. In other embodiments, the number of side-fire dielectric resonator antenna elements 31 can be other numbers, not necessarily seven, and can be set according to actual conditions; similarly, the number of end-fire dielectric resonator antenna elements 41 can also be other numbers, not necessarily seven.

[0032] Please combine Figures 1 to 4The body 1 has a first metal layer 51, a second metal layer 52, a third metal layer 53, and a fourth metal layer 54 arranged sequentially from top to bottom. The first metal layer 51 is disposed on the top surface of the body 1, and the fourth metal layer 54 is disposed on the bottom surface of the body 1. The fourth metal layer 54 is connected to the third metal layer 53 through a plurality of grounding posts 55, and the grounding posts 55 are disposed inside the body 1. The first metal layer 51 includes a top rectangular patch 511, which is located on the body. In the center of the top surface of the body 1, a plurality of first conductive posts 512 are provided. These first conductive posts 512 are arranged in a U-shape along the edge of the top rectangular patch 511. The first conductive posts 512 connect the third metal layer 53 to the top rectangular patch 511. The top rectangular patch 511 near the millimeter-wave end-fire dielectric resonator antenna array 4 does not have any first conductive posts 512. The bottom of the body 1 has a first feed port 21 connecting to the top rectangular patch 511. It is easy to see that this section discloses the structure of the low-frequency magnetic dipole antenna unit 2 in this antenna module. The first conductive posts 512 and the grounding posts 55 can be metallized holes, metal posts, conductive filler paste, etc., respectively.

[0033] The first metal layer 51 further includes a plurality of top-level separator patches 513 arranged in a row at intervals. The top-level separator patches 513 are located on one side of the top-level rectangular patch 511 and connected to the top-level rectangular patch 511. The body 1 is provided with a second conductive post 514. The top-level separator patches 513 are connected to the second metal layer 52 through the plurality of second conductive posts 514. The second metal layer 52 is connected to the third metal layer 53. The second metal layer 52 is provided with a plurality of coupling gaps 521. The coupling gaps 521 are provided in the area between two adjacent top-level separator patches 513. The third metal layer 53 is provided with a window 531 corresponding to the area between two adjacent top-level separator patches 513. The window 531 is provided with a feed piece 532 coupled to the coupling gap 521. The bottom of the body 1 is provided with a second feed port 32 connected to the feed piece 532. This section discloses the structure of the side-fire dielectric resonator antenna unit 31 in this antenna module. Specifically, the second metal layer 52, the second conductive post 514, the first conductive post 512, and the first metal layer 51 isolate the dielectric resonator region of the side-fire dielectric resonator antenna unit 31 on the body 1. The dielectric resonator region of the side-fire dielectric resonator antenna unit 31 is slot-coupled and fed by the cooperation of the feed patch 532 and the coupling slot 521. In this embodiment, each of the top layer separator patch 513 is connected to nine second conductive posts 514, and the nine second conductive posts 514 are arranged in a rectangular array.

[0034] To further improve the isolation between two adjacent side-firing dielectric resonator antenna elements 31, it is preferable that the second conductive post 514 is connected to the third metal layer 53.

[0035] like Figure 4 As shown, preferably, the window 531 is closed on all sides, and the feed plate 532 is located within the closed window 531. This reduces external signal interference to the feed plate 532 and also reduces signal leakage transmitted on the feed plate 532. It is readily understood that the feed plate 532 can be formed from a portion of the third metal layer 53.

[0036] like Figure 1 and Figure 2 As shown, the main body 1 has multiple sets of isolation structures 42 on the side away from the millimeter-wave side-fire dielectric resonator antenna array 3. The multiple sets of isolation structures 42 are arranged in a row along the length direction of the top rectangular patch 511. The end-fire dielectric resonator antenna element 41 is formed between two adjacent sets of isolation structures 42. The bottom of the main body 1 is provided with a third feed port 43 for feeding the end-fire dielectric resonator antenna element 41.

[0037] In this embodiment, the isolation structure 42 includes a plurality of air isolation holes 421 arranged in an array, and the air isolation holes 421 connect the top surface and the bottom surface of the body 1.

[0038] Please combine Figures 2 to 4 Optionally, the fourth metal layer 54 is provided with a plurality of clearance ports 541 on the side away from the side-firing dielectric resonator antenna unit 31, the third feed port 43 is provided corresponding to the clearance ports 541, and the grounding post 55 is provided on both sides of the clearance ports 541 respectively.

[0039] like Figure 1 As shown in the figure, in detail, the body 1 includes a first substrate, a second substrate, and a third substrate 13 arranged sequentially from top to bottom. The first metal layer 51 is disposed on the bottom surface of the first substrate. The top surface of the second metal layer 52 is connected to the bottom surface of the first substrate, and the bottom surface of the second metal layer 52 is connected to the top surface of the second substrate. The top surface of the third metal layer 53 is connected to the bottom surface of the second substrate, and the bottom surface of the third metal layer 53 is connected to the top surface of the third substrate 13. The fourth metal layer 54 is disposed on the bottom surface of the third substrate 13.

[0040] More specifically, the first substrate includes a first dielectric plate 11 and a second dielectric plate 12 connected together. The first dielectric plate 11 is located above the second dielectric plate 12. The first metal layer 51 is disposed on the top surface of the first dielectric plate 11, and the top surface of the second metal layer 52 is connected to the bottom surface of the second dielectric plate 12. The dielectric constant of the first dielectric plate 11 is different from that of the second dielectric plate 12. The third substrate 13 includes a fourth dielectric plate 14 and a fifth dielectric plate 15 connected together. The fourth dielectric plate 14 is located above the fifth dielectric plate 15. The bottom surface of the third metal layer 53 is connected to the top surface of the fourth dielectric plate 14, and the fourth metal layer 54 is disposed on the bottom surface of the fifth dielectric plate 15. The dielectric constant of the fourth dielectric plate 14 is different from that of the fifth dielectric plate 15. In this embodiment, the first dielectric substrate 11 is a Rogers 4350 substrate with a thickness of 1 mm, the second dielectric substrate 12 is a Rogers 4450 substrate with a thickness of 0.2 mm, the second substrate is a Rogers 4350 substrate with a thickness of 0.335 mm, the fourth dielectric substrate 14 is a Rogers 4450 substrate with a thickness of 0.2 mm, and the fifth dielectric substrate 15 is a Rogers 4350 substrate with a thickness of 0.75 mm.

[0041] Figure 5 This is the S-parameter-gain curve of the low-frequency magnetic dipole antenna element in the antenna module of this embodiment. Figure 5 It can be seen that it can cover the N78 (3.3-3.8GHz) frequency band, indicating that it is a typical broadband antenna; its gain curve shows high gain in the N78 frequency band, indicating that it is a high-gain antenna.

[0042] Figure 6 This is the S-parameter-gain curve of the millimeter-wave side-fire dielectric resonator antenna array in the antenna module of this embodiment. Figure 6 It can be seen that it can cover the N257 frequency band and has a high gain within the covered frequency band.

[0043] Figure 7 This is the S-parameter-gain curve of the millimeter-wave end-fire dielectric resonator antenna array in the antenna module of this embodiment. Figure 7 It can be seen that it can cover the N257 frequency band and has a high gain within the covered frequency band.

[0044] Figure 8 This is a scanning angle diagram of the millimeter-wave side-fire dielectric resonator antenna array in the antenna module of this embodiment. Figure 8 It can be seen that its scanning angle is ±50 degrees or more, indicating that the antenna can perform large-angle spatial scanning coverage.

[0045] Figure 9This is a scanning angle diagram of the millimeter-wave end-fire dielectric resonator antenna array in the antenna module of this embodiment. Figure 9 It can be seen that its scanning angle is ±40 degrees or more, indicating that the antenna can perform large-angle spatial scanning coverage.

[0046] The above are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An antenna module, characterized in that: The device includes a main body, on which are provided a low-frequency magnetic dipole antenna element, a millimeter-wave side-fire dielectric resonator antenna array, and a millimeter-wave end-fire dielectric resonator antenna array. The low-frequency magnetic dipole antenna element is located between the millimeter-wave side-fire dielectric resonator antenna array and the millimeter-wave end-fire dielectric resonator antenna array. The millimeter-wave side-fire dielectric resonator antenna array includes multiple side-fire dielectric resonator antenna elements arranged in a row, and the millimeter-wave end-fire dielectric resonator antenna array includes multiple end-fire dielectric resonator antenna elements arranged in a row. The body has a first metal layer, a second metal layer, a third metal layer, and a fourth metal layer arranged sequentially from top to bottom. The first metal layer is located on the top surface of the body, and the fourth metal layer is located on the bottom surface of the body. The fourth metal layer is connected to the third metal layer through multiple grounding posts, which are located within the body. The first metal layer includes a top rectangular patch located in the center of the top surface of the body. Multiple first conductive posts are provided within the body, arranged in a U-shape along the edge of the top rectangular patch. The first conductive posts connect the third metal layer and the top rectangular patch. The top rectangular patch does not have any first conductive posts on the side near the millimeter-wave end-fire dielectric resonator antenna array. The bottom of the body has a first feed port connected to the top rectangular patch.

2. The antenna module according to claim 1, characterized in that: The first metal layer further includes a plurality of top-level separator patches arranged in a row at intervals. The top-level separator patches are located on one side of the top-level rectangular patch and connected to the top-level rectangular patch. The body has a second conductive post. The top-level separator patches are connected to the second metal layer through the plurality of second conductive posts. The second metal layer is conductive to the third metal layer. The second metal layer has a plurality of coupling gaps. The coupling gaps are set in the area between two adjacent top-level separator patches. The third metal layer has an opening set in the area between two adjacent top-level separator patches. The opening has a feed plate coupled to the coupling gap. The bottom of the body has a second feed port connected to the feed plate.

3. The antenna module according to claim 2, characterized in that: The second conductive post is connected to the third metal layer.

4. The antenna module according to claim 1, characterized in that: The main body has multiple sets of isolation structures on the side away from the millimeter-wave side-fire dielectric resonator antenna array. The multiple sets of isolation structures are arranged in a row along the length of the top rectangular patch. The end-fire dielectric resonator antenna unit is formed between two adjacent sets of isolation structures. The bottom of the main body has a third feed port for feeding the end-fire dielectric resonator antenna unit.

5. The antenna module according to claim 4, characterized in that: The isolation structure includes an array of multiple air isolation holes.

6. The antenna module according to claim 4, characterized in that: The fourth metal layer has multiple clearance openings on the side away from the side-firing dielectric resonator antenna element, the third feed port is set corresponding to the clearance openings, and the grounding post is set on both sides of the clearance openings respectively.

7. The antenna module according to claim 1, characterized in that: The body includes a first substrate, a second substrate, and a third substrate arranged sequentially from top to bottom. The first metal layer is disposed on the bottom surface of the first substrate, the top surface of the second metal layer is connected to the bottom surface of the first substrate, the bottom surface of the second metal layer is connected to the top surface of the second substrate, the top surface of the third metal layer is connected to the bottom surface of the second substrate, the bottom surface of the third metal layer is connected to the top surface of the third substrate, and the fourth metal layer is disposed on the bottom surface of the third substrate.

8. The antenna module according to claim 7, characterized in that: The first substrate includes a first dielectric plate and a second dielectric plate connected together. The first dielectric plate is located above the second dielectric plate. The first metal layer is disposed on the top surface of the first dielectric plate. The top surface of the second metal layer is connected to the bottom surface of the second dielectric plate. The dielectric constant of the first dielectric plate is different from that of the second dielectric plate.

9. The antenna module according to claim 7, characterized in that: The third substrate includes a fourth dielectric plate and a fifth dielectric plate connected together. The fourth dielectric plate is located above the fifth dielectric plate. The bottom surface of the third metal layer is connected to the top surface of the fourth dielectric plate. The fourth metal layer is disposed on the bottom surface of the fifth dielectric plate. The dielectric constant of the fourth dielectric plate is different from that of the fifth dielectric plate.

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