Antenna module and electronic device including the same

Abstract

The disclosure relates to a fifth generation (5G) or sixth generation (6G) communication system supporting a higher data transmission rate than a fourth generation (4G) communication such as long term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit including a plurality of antenna elements constituting a subarray, and a network unit disposed below the antenna unit in a plurality of layers, the network unit including at least one transmission line configured to branch to locations of the plurality of antenna elements, a via extending through the plurality of layers, and a stub structure disposed on an area adjacent to the via. The open stub structure designed on a first layer of the plurality of layers forming a ground plane can include a first via pad disposed adjacent to the via, a first open stub extending from the first via pad in a first direction, and a first slot portion configured to surround at least a portion of edges of the first via pad and the first open stub. The stub structure designed on a second layer different from the first layer on which the open stub structure is designed can include a second via pad disposed adjacent to the via, a stub extending from the second via pad in a second direction perpendicular to the first direction, a transformer extending from the second via pad in a third direction different from the second direction so as to be connected to the at least one transmission line, and a second slot portion configured to surround at least a portion of edges of the second via pad, the stub, and the transformer.

Description

Technical Field

[0001] This disclosure relates to antenna modules and electronic devices including antenna modules. Background Technology

[0002] A review of the evolution of mobile communications from generation to generation shows that development has primarily focused on human-centric service technologies, such as voice-based services, multimedia services, and data services. An exponential increase in connected devices is anticipated after the commercialization of fifth-generation (5G) communication systems. Examples of things connected to the network can include vehicles, robots, dashboards, home appliances, displays, smart sensors connected to various infrastructures, construction machinery, and factory equipment. Mobile devices are expected to evolve in various forms, such as augmented reality glasses, virtual reality headsets, and holographic devices. Efforts are underway to develop improved 6G communication systems to provide a wide range of services by connecting tens of billions of devices and things in the 6th generation (6G) era. For these reasons, 6G communication systems are referred to as "beyond 5G" systems.

[0003] The 6G communication system, expected to be realized around 2030, will have a maximum transmission rate of tera (1,000 giga) bps and a radio latency of 100 microseconds, and will therefore be 50 times faster than the 5G communication system and have 1 / 10 of its radio latency.

[0004] To achieve such high data transmission rates and ultra-low latency, 6G communication systems have been considered for implementation in the terahertz band (e.g., the 95 GHz to 3 THz band). Due to the more severe path loss and atmospheric absorption in the terahertz band compared to the millimeter (mm) band introduced in 5G, technologies capable of ensuring signal transmission distance (i.e., coverage) are expected to become even more critical. As key technologies for ensuring coverage, it is necessary to develop multi-antenna transmission technologies, including radio frequency (RF) elements, antennas, novel waveforms with better coverage than orthogonal frequency division multiplexing (OFDM), beamforming and massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, and massive MIMO. Furthermore, new technologies for improving terahertz band signal coverage, such as metamaterial-based lenses and antennas, orbital angular momentum (OAM), and reconfigurable smart surfaces (RIS), have been discussed.

[0005] Furthermore, to improve frequency efficiency and system networks, the following technologies have been developed for 6G communication systems: full-duplex technology to enable uplink (User Equipment (UE) transmission) and downlink (Node B transmission) to use the same frequency resources simultaneously; network technologies that integrate satellites, High Altitude Platform Stations (HAPS), etc.; innovative network architecture technologies to support mobile Node Bs and achieve network operation optimization and automation; dynamic spectrum sharing technology based on spectrum usage prediction to avoid conflicts; AI-based communication technologies to achieve system optimization by adopting AI from the technical design steps and internalizing end-to-end AI support functions; and next-generation distributed computing technologies to achieve services with complexity exceeding UE computing capacity limits by using ultra-high-performance communication and computing resources (Mobile Edge Computing (MEC), cloud, etc.). In addition, continuous efforts are being made to further enhance connectivity between devices, further optimize networks, promote the software implementation of network entities, and increase the openness of wireless communication by designing new protocols for 6G communication systems, developing mechanisms for achieving hardware-based secure environments and secure data use, and developing technologies for privacy maintenance methods.

[0006] This research and development of 6G communication systems is expected to enable the next hyper-connected experience in a new dimension through the hyper-connectivity of 6G communication systems, which covers connections between things and connections between people and things. Specifically, it is anticipated that services such as truly immersive XR, high-fidelity mobile holograms, and digital replicas can be provided through 6G communication systems. Furthermore, leveraging enhanced security and reliability, services such as remote surgery, industrial automation, and emergency response will be provided through 6G communication systems, and therefore these services will be applied to various fields including industry, healthcare, automotive, and home appliances.

[0007] A communication system may include a transmit / receive (Tx / Rx) integrated circuit for generating Tx / RX signals, and an antenna element for transmitting them as radio waves. With the increasing frequencies used by antennas, recent developments have focused on combining antennas and communication circuitry (e.g., radio frequency integrated circuits (RFICs)) to reduce Tx line losses.

[0008] The above information is presented as background information only to aid in understanding this disclosure. No determination or assertion is made regarding whether any of the above content can be considered applicable prior art to this disclosure. Summary of the Invention

[0009] [Technical Issues]

[0010] Antenna structures using the UHF band can be designed as a stack of multiple substrates including antenna elements and wireless communication circuitry (e.g., RF circuitry). When designing Tx lines disposed within multiple substrates, the antenna structure can employ a stripline structure parallel to the substrates, and vertical Tx vias connecting the layers.

[0011] Because the antenna structure uses two different types of Tx lines (e.g., striplines and Tx vias), discontinuities may occur between the two types of Tx lines, and if the two types of Tx lines have different impedances, losses may increase due to mismatch. Therefore, an improved structure is needed to address this problem.

[0012] Various aspects of this disclosure will solve at least the aforementioned problems and / or disadvantages, and provide at least the following advantages. Therefore, one aspect of this disclosure is to provide an antenna module that uses an ultra-high frequency band and employs a structure in which multiple substrates are stacked, allowing for the design of open-circuit stub structures and / or short-stub structures to reduce mismatch between different types of Tx lines.

[0013] Other aspects will be set forth in part in the description which follows, and in part will be apparent from the description or may be learned by practice of the presented embodiments.

[0014] [Technical Solution]

[0015] According to one aspect of this disclosure, an antenna module is provided. The antenna module includes: a communication circuit, an antenna portion including a plurality of antenna elements constituting a subarray, and a network portion disposed below the antenna portion in a plurality of layers. The network portion includes: at least one transmission line configured to branch to the locations of the plurality of antenna elements, vias extending through the multiple layers, and a stub structure disposed in a region adjacent to the vias. The stub structure, configured to be designed on a first layer forming a ground plane in the plurality of layers, may include: a first via pad disposed adjacent to the via, a first open stub extending from the first via pad along a first direction, and a first groove portion formed around the edges of the first via pad and the first open stub. The stub structure designed on a second layer different from the first layer may include: a second via pad disposed adjacent to the via, a stub extending from the second via pad along a second direction, a transformer extending from the second via pad along a third direction different from the second direction and connected to at least one transmission line, and a second groove portion formed around at least a portion of the edges of the second via pad, the stub, and the transformer.

[0016] According to another aspect of this disclosure, an antenna module is provided. The antenna module includes: a communication circuit, an antenna portion including a plurality of antenna elements constituting a subarray, and a network portion including a plurality of substrates stacked between the communication circuit and the antenna portion. An open-circuit stub structure is designed on at least one layer of the plurality of substrates configured to form a ground plane. The open-circuit stub structure may include: a first via pad formed along the edge of a via, a first open-circuit stub extending from the first via pad in a first direction, and a first groove portion formed around the edges of the first via pad and the first open-circuit stub to separate the first via pad and the first open-circuit stub from the ground plane.

[0017] According to another aspect of this disclosure, an antenna module is provided. The antenna module includes: a communication circuit, an antenna portion including a plurality of antenna elements constituting a subarray, and a network portion including a plurality of substrates stacked between the communication circuit and the antenna portion. A stub structure is designed on at least one layer of the plurality of substrates having transmission lines disposed thereon striplines. The stub structure may include: a first through-hole pad formed along the edge of a via, a stub extending from the first through-hole pad in a first direction, a transformer extending from the first through-hole pad in a second direction different from the first direction to connect to the transmission lines of the striplines, and a first groove portion formed as at least a portion surrounding the edges of the first through-hole pad, the stub, and the transformer.

[0018] [Beneficial Effects]

[0019] Various embodiments of this disclosure can be combined with antenna modules having multiple stacked substrates to provide structures for reducing mismatch of Tx lines disposed inside or on the surface of the substrate.

[0020] Antenna modules according to various embodiments of the present disclosure may have improved open-circuit stub structures and / or short-circuit structures designed in regions of the substrate, thereby achieving impedance matching between different types of Tx lines.

[0021] Antenna modules according to various embodiments of the present disclosure may have improved open-circuit stub structures and / or short-circuit structures designed in regions of the substrate, thereby maximizing physical space availability and minimizing signal Tx line loss.

[0022] Antenna modules according to various embodiments of the present disclosure can be designed to optimize the internal structure of the module, so that each layer has a specified function and is independent, thereby improving module development efficiency.

[0023] Other aspects, advantages, and distinctive features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments disclosed in conjunction with the accompanying drawings. Attached Figure Description

[0024] The above and other aspects, features, and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 An embodiment of the structure of an electronic device according to an embodiment of the present disclosure is shown; Figure 2 It is according to the embodiments of this disclosure along Figure 1 A cross-sectional view taken along axis A-A' in the middle; Figure 3 It is according to the embodiments of this disclosure along Figure 1 A cross-sectional view taken along axis B-B' in the middle; Figure 4 It is according to the embodiments of this disclosure along Figure 1 A cross-sectional view taken along axis C-C'; Figure 5 This is a cross-sectional view of an antenna module disposed in an electronic device according to an embodiment of the present disclosure; Figure 6 This is a cross-sectional view showing the matching structure between transmission lines in the network unit of an antenna module according to an embodiment of the present disclosure; Figure 7 This is a perspective view showing an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 8 This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 9 This is a perspective view showing an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 10 This is a diagram illustrating a comparison between the properties of a transmission line when an open-circuit cut structure is designed in the wiring unit of an antenna module according to an embodiment of the present disclosure and the properties of a transmission line when an open-circuit cut structure is excluded from the wiring unit of an antenna module. Figure 11A This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 11B This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 11C This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 11D This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 11E This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 11F This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 11G This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 11H This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 12 It is a diagram depicting the properties of the transmission line between open slits when different open slits are implemented on the network element of the antenna module according to an embodiment of the present disclosure; Figure 13 This is a perspective view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 14 This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 15 This is a cross-section showing a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 16A This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 16B This illustrates the exclusion of stub structures from the transmission line structure according to embodiments of the present disclosure to... Figure 16A Plan view of the transmission line structures for comparison; Figure 17A This is a diagram illustrating the properties of the transmission line when designing a stub structure in the network element of an antenna module according to an embodiment of the present disclosure; Figure 17B This describes an embodiment of the present disclosure that excludes stub structures in order to... Figure 17A A graph of the properties of the transmission line during comparison; Figure 18A This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 18B This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 19 This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 20 This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure; Figure 21 This is a view illustrating the arrangement of vias and transmission lines in the network element of an antenna module according to an embodiment of the present disclosure; and Figure 22 This is a view showing the arrangement of vias and transmission lines in the network unit of an antenna module according to an embodiment of the present disclosure. Detailed Implementation

[0025] The following description, with reference to the accompanying drawings, is provided to aid in a full understanding of the various embodiments of this disclosure as defined by the claims and their equivalents. It includes various specific details to aid understanding, but these are to be considered exemplary only. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of this disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and structures may be omitted.

[0026] The terms and words used in the following description and claims are not limited to their bibliographical meaning, but are used solely by the inventors to enable a clear and consistent understanding of this disclosure. Therefore, it will be clear to those skilled in the art that the following description, which provides various embodiments of this disclosure, is for illustrative purposes only and is not intended to limit the disclosure as defined by the appended claims and their equivalents.

[0027] It should be understood that the singular forms “a,” “an,” and “the” include plural indicators unless the context clearly specifies otherwise. Thus, for example, referring to “the surface of a component” includes referring to one or more such surfaces.

[0028] The electronic devices according to the various embodiments disclosed herein may be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this disclosure are not limited to those described above.

[0029] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features described herein to specific embodiments, and include various modifications, equivalents, or alternatives to the corresponding embodiments. Regarding the description of the drawings, similar reference numerals may be used to denote similar or related elements. It should be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to an item may include one or more items. As used herein, each of phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of items listed together in the corresponding phrase. As used herein, terms such as “first,” “second,” “first,” and “second” may be used simply to distinguish the corresponding element from another element and do not limit the element in other respects (e.g., importance or order). It should be understood that if an element (e.g., the first element) is referred to (with or without the terms “operably” or “communically”) as being “connected to another element (e.g., the second element),” “attached to another element (e.g., the second element),” “connected to another element (e.g., the second element),” or “connected to another element (e.g., the second element)”, it means that the element can be directly (e.g., wired), wirelessly, or via a third element to the other element.

[0030] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms such as "logic," "logic block," "component," or "circuit." A "module" can be the smallest unit of a single integrated component suitable for performing one or more functions, or a portion thereof. For example, according to an embodiment, a "module" can be implemented as an application-specific integrated circuit (ASIC).

[0031] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a machine-readable storage medium (e.g., internal memory 136 or external memory 138). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke at least one of the one or more instructions stored in the storage medium and execute it. This allows the machine to be operated to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between locations where data is stored semi-permanently in the storage medium and locations where data is temporarily stored in the storage medium.

[0032] According to embodiments, methods according to various embodiments of this disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., an optical disc read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be distributed online (e.g., downloaded or uploaded) or directly between two user devices (e.g., smartphones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as the memory of a manufacturer's server, an app store server, or a relay server.

[0033] According to various embodiments, each of the above-described elements (e.g., a module or program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-described elements may be omitted, or one or more other elements may be added. Alternatively or additionally, multiple elements (e.g., modules or programs) may be integrated into a single element. In this case, according to various embodiments, the integrated element may still perform one or more functions of each of the multiple elements in the same or similar manner as performed by the corresponding one of the multiple elements prior to integration. According to various embodiments, operations performed by a module, program, or other element may be performed sequentially, in parallel, repeatedly, or tentatively, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

[0034] Figure 1 This is an embodiment of the structure of an electronic device according to embodiments of the present disclosure.

[0035] Figure 2 It is according to the embodiments of this disclosure along Figure 1 A cross-sectional view taken along axis A-A'.

[0036] Figure 3 It is according to the embodiments of this disclosure along Figure 1 A cross-sectional view taken along axis B-B'.

[0037] Figure 4 It is according to the embodiments of this disclosure along Figure 1 A cross-sectional view taken along axis C-C'.

[0038] Reference Figures 1-4 The electronic device 101 may include a housing 110, which includes a first plate 220 (e.g., a front plate), a second plate 230 (e.g., a rear plate or rear glass) spaced apart from the first plate 220 and facing in a direction opposite to the first plate, and a transverse member 240 surrounding the space between the first plate 220 and the second plate 230.

[0039] According to an embodiment, the first plate 220 may include a transparent material, including a glass plate. The second plate 230 may include a non-conductive and / or conductive material. The transverse member 240 may include a conductive and / or non-conductive material. In an embodiment, at least a portion of the transverse member 240 may be integrally formed with the second plate 230. In an embodiment, the transverse member 240 may include first to third insulating units 241, 243, and 245 and / or first to third conductive units 251, 253, and 255. In another embodiment, the transverse member 240 may omit one of the first to third insulating units 241, 243, and 245 and / or the first to third conductive units 251, 253, and 255. For example, when the first to third insulating units 241, 243, and 245 are omitted, the portion corresponding to the first to third insulating units 241, 243, and 245 may be formed by conductive units. In another example, when the first to third conductive units 251, 253 and 255 are omitted, the portions corresponding to the first to third conductive units 251, 253 and 255 can be formed by insulating units.

[0040] According to an embodiment, the electronic device 101 may include a display shown through the first board 220, a main printed circuit board (PCB) 271, and / or an intermediate board (not shown) in the space, and may optionally include other components in addition.

[0041] According to an embodiment, the electronic device 101 may include a first antenna (e.g., a first conducting element 251), a second antenna (e.g., a second conducting element 253), or a third antenna (e.g., a third conducting element 255) in and / or a portion of the housing 110 (e.g., the lateral member 240). For example, the first to third antennas may be used as antenna radiators to support, for example, cellular communications (e.g., second-generation (2G), third-generation (3G), fourth-generation (4G), or Long Term Evolution (LTE)), near-field communications (e.g., Wi-Fi, Bluetooth, or NFC), and / or Global Navigation Satellite Systems (GNSS).

[0042] According to an embodiment, the electronic device 101 may include a first antenna module 261, a second antenna module 263, and / or a third antenna module 265 for forming a directional beam. For example, antenna modules 261, 263, and 265 may be used for 5G network communication, millimeter-wave communication, 60GHz communication, WiGig wireless communication, or 6G network communication. In one embodiment, antenna modules 261, 263, and 265 may be disposed in a space separated from the metal components of the electronic device 101 (e.g., housing 110, internal components 273, and / or the first to third antennas). In another embodiment, antenna modules 261, 263, and 265 may be disposed in a space in contact with the metal components of the electronic device 101 (e.g., housing 110, and / or the first to third conductive units 251, 253, and 255).

[0043] Reference Figure 1 In one embodiment, the first antenna module 261 may be located at the upper left (-Y-axis), the second antenna module 263 may be located at the middle upper (X-axis), and the third antenna module 265 may be located at the middle right (Y-axis). In another embodiment, the electronic device 101 may include an additional antenna module located at an additional position (e.g., the lower middle (-X-axis)), or a portion of the first to third antenna modules 261, 263, and 265 may be omitted. According to an embodiment, the first to third antenna modules 261, 263, and 265 may be electrically connected to at least one communication processor 120 disposed on PCB 271 via a conductor 281 (e.g., a coaxial cable or a flexible PCB (FPCB)).

[0044] Reference is shown along Figure 1 The cross-sectional view taken by axis A-A' in the middle Figure 2 In the first antenna module 261, which includes a first antenna array (not shown) or a second antenna array (not shown), the first antenna array can be configured to perform radiation toward the second plate 230, and the second antenna array can be configured to perform radiation through the first insulating unit 241.

[0045] Reference Figure 3 , Figure 3 It shows along Figure 1 In the cross-sectional view taken along axis B-B', the first antenna array of the second antenna module 263 can be configured to perform radiation toward the second plate 230, and its second antenna array can be configured to perform radiation through the second insulating unit 243. In embodiments, the first antenna array or the second antenna array may include a dipole antenna, a patch antenna, a monopole antenna, a slot antenna, or a loop antenna.

[0046] In one embodiment, the second antenna module 263 may include a first printed circuit board and a second printed circuit board electrically connected to the first printed circuit board. A first antenna array may be disposed on the first printed circuit board. The second antenna array may be disposed on the second printed circuit board. According to an embodiment, the first and second printed circuit boards may be connected via a flexible circuit board or a coaxial cable. The flexible circuit board and coaxial cable may be disposed around electronic components (e.g., receivers, speakers, sensors, cameras, earpieces, or buttons).

[0047] Reference Figure 4 , Figure 4 It shows along Figure 1 In a cross-sectional view taken along axis C-C', the third antenna module 265 can be configured to perform radiation toward the transverse member 240 of the housing 110. For example, the antenna array of the third antenna module 265 can be configured to perform radiation through the third insulating element 245.

[0048] Figure 5 This is a cross-section of an antenna module disposed in an electronic device according to an embodiment of the present disclosure.

[0049] According to various embodiments, electronic devices (e.g., Figures 1-4 The electronic device 101 may include an antenna module 300.

[0050] Reference Figure 5 The antenna module 300 may have an antenna in a package structure applicable to ultra-high frequencies, and the antennas disposed on the antenna module 300 may form a subarray (e.g., a subarray structure). According to an embodiment, the groups constituting the various layers of the antenna module 300 (hereinafter referred to as antenna unit 301, network unit 302, and communication circuit unit 303) are designed to be independent of each other in order to minimize line loss and improve space efficiency by optimizing the internal structure of the module.

[0051] According to various embodiments, the antenna module 300 may include an antenna unit 301 in which antenna elements 301a (e.g., conductive plates) form a designated array, and the antenna unit 301 consists of multiple layers. In the antenna module 300, a network unit 302 and a communication circuit unit 303 are stacked in a downward direction relative to the antenna unit 301. According to embodiments, the network unit 302 may include a feed network unit 320 and a wiring unit 330.

[0052] According to various embodiments, the antenna module 300 can be designed to have a high-density interconnect (HDI) PCB structure consisting of multiple layers. For example, each of the antenna element 301, the feed network element 320, the wiring element 330, and the communication circuit element 303 can be formed by stacking multiple layers.

[0053] According to various embodiments, antenna element 301 can be designed as a subarray structure having a specific arrangement (e.g., subarray) of antenna elements 301a. Antenna element 301a can be an antenna radiator and can include, for example, a patch-type radiating conductor or a conductive plate type having a dipole structure extending in one direction. As another example, patch-type antenna element 301a can efficiently utilize the physical space of antenna module 300 and provide a wide-side radiation pattern, thus being advantageous in terms of gain and beam control.

[0054] According to various embodiments, antenna element 301 can be designed with a subarray structure in which the main radiator (e.g., antenna element 301a) connected to the power line of feed network element 320 is arranged on a surface of a first layer, including a surface exposed to the outside, or within the first layer. In the subarray structure, the number of radiators that can be deployed in antenna module 300 is determined according to the frequency band used, and the subarray structure can be designed differently to correspond to the determined number of radiators. For example, based on the patch type, the subarray structure can be arranged differently, such as in a 2×1, 2×2, 4×1, or 4×2 array. For another example, the patch type shape can be one of various shapes such as square, circular, rectangular, or elliptical. According to another embodiment, the arrangement and shape of the subarray structure can be determined according to the requirements of half-power beamwidth and beam scanning range.

[0055] According to various embodiments, network unit 302 may be disposed below antenna unit 301 and formed of multiple layers. Network unit 302 can electrically connect transmit signals and / or receive signals transmitted from communication circuitry (e.g., RFIC) 341 to antenna element 301a of antenna unit 301. According to embodiments, in network unit 302, feed network unit 320 adjacent to antenna unit 301 and wiring unit 330 adjacent to communication circuitry unit 303 may be stacked on top of each other. Antenna modules for UHF necessitate increased integration of transmission lines due to limited physical space, and to address this, network unit 302 may be designed with two separate stacked groups (each consisting of multiple layers). For example, the optimal path for minimum loss and maximum efficiency can be designed by separating the functions of each group, such that one group is used as feed network unit 320 and another group is used as wiring unit 330, examining the spatial topology analyzed by considering the location of the transmitted signal and / or received transmission line (e.g., ridge map) provided by communication circuit 341 and the feed location of the antenna elements forming the subarray structure, and optimizing the adjacency and connectivity between each layer.

[0056] According to various embodiments, the feed network unit 320 of the network unit 302 can be formed of multiple layers and can transmit signals from the communication circuit 341 to the antenna element 301a of the antenna unit 301 (or the feed line connected to the antenna element 301a) by using a first transmission line 315 in the form of a power divider. When each of the antenna elements 301a forming the subarray structure is provided with the same power and phase values, the antenna elements can maximize their performance, and for this purpose, the first transmission line 315 of the feed network unit 320 can be designed differently.

[0057] According to an embodiment, the first transmission line 315 of the feed network unit 320 can be respectively formed as a strip transmission line branching from a first point P1 connected to the wiring unit 330 to a plurality of second points P2 facing a plurality of first antenna elements. The first point P1 and at least one second point P2 of the first transmission line 315 can form the same transmission line. According to another embodiment, the first point P1 and the plurality of second points P2 of the first transmission line 315 can be disposed on the same layer or on different layers.

[0058] According to various embodiments, the wiring unit 330 of network unit 302 may be formed of multiple layers and may electrically connect the output position of communication circuit 341 to the input position of feed network unit 320. For example, wiring unit 330 may include a strip-shaped second transmission line 316 and a second via 318 to provide signals from communication circuit 341 to feed network unit 320 via wiring unit 330. The second transmission line 316 of wiring unit 330 may extend from a third point P3, which is connected to a first via 317 of communication circuit unit 303, to a fourth point P4 facing a first point P1 of feed network unit 320 on a layer. According to embodiments, the second via 318 of wiring unit 330 may be a via for signal flow and may connect the first point of feed network unit 320 and the fourth point of wiring unit 330.

[0059] According to an embodiment, the positions of the communication circuit 341 on the lower surface of the antenna module 300 and the antenna element 301a of the subarray structure on its upper surface can have fixed values, and the output position (e.g., second point P2) of the first transmission line 315 of the feed network unit 320 connected to the antenna element 301a can also have fixed values. The feed network unit 320 can be formed as a transmission line in the form of a power divider, and therefore the wiring unit 330 can be formed with an optimal path connecting the two points, taking into account the input position (e.g., first point P1) of the first transmission line 315 of the feed network unit 320 and the output position (e.g., the position of the Tx terminal / Rx terminal of the communication circuit 341).

[0060] According to various embodiments, the communication circuit unit 303 may be located below the network unit 302 and includes communication circuitry 341. The communication circuit unit 303 may include a plurality of first vias 317 to provide transmit and / or receive outputs of the communication circuitry 341 to the wiring unit 330, and each of the plurality of first vias 317 may be designed to pass through a plurality of conductive layers (and dielectric layers). According to embodiments, the communication circuit unit 303 may include vias (e.g., first vias 317) without transmission lines.

[0061] According to an embodiment, the communication circuit unit 303 may include RF signal lines for transmitting and / or receiving RF signals from the communication circuit 341, inputting and outputting intermediate frequency (IF) signals used in the communication circuit 341, input and output logic circuits, control signals, and power / ground lines. The thickness of the communication circuit unit 303 may be designed to correspond to the number of input and output signals of the communication circuit 341.

[0062] Figure 6 This is a cross-section showing the matching structure between transmission lines in the network unit of an antenna module according to an embodiment of the present disclosure.

[0063] Reference Figure 6 According to various embodiments, electronic devices (e.g., Figures 1-4 Electronic device 101 in the device may include an antenna module (e.g., Figure 5 Antenna module 300 (as shown in the image). Antenna module 300 may have antennas in a package structure applicable to ultra-high frequencies, and the antennas disposed on antenna module 300 may form a sub-array. The various layers constituting antenna module 300 are designed to be independent of each other in order to minimize line loss and improve space efficiency by optimizing the internal structure of the module.

[0064] Figure 6 The configuration of the network element 302 of the antenna module can be completely or partially integrated with... Figure 5 The configuration of the network unit 302 of the antenna module is the same.

[0065] According to various embodiments, the network unit 302 of the antenna module 300 may include a feed network unit 320 and a wiring unit 330 stacked on top of each other. The feed network unit 320 and / or the wiring unit 330 may have a structure in which multiple circuit boards are stacked on top of each other, and at least a portion of the multiple circuit boards may include transmission lines for transmitting and / or receiving signals.

[0066] According to various embodiments, transmission lines can be designed to be arranged on and / or within a circuit board, and can include transmission lines extending horizontally and vertically to pass through multiple circuit boards. For example, the horizontally extending transmission line can be a stripline, while the vertically extending transmission line can be a via. According to embodiments, in order to reduce losses that may be caused by impedance mismatches that may occur between the horizontal transmission line (hereinafter referred to as the stripline transmission line) and the vertical transmission line (hereinafter referred to as the transmission via), the antenna module 300 can be designed to have an open-circuit stub structure 500 and / or a stub structure 600 adjacent to the transmission line.

[0067] According to various embodiments, open-circuit cut-off structures 500 and / or short-circuit cut-off structures 600 can be designed in the power supply network unit 320 and / or wiring unit 330. For example, refer to Figure 5 Similar to the area surrounded by dashed lines, the open stub structure 500 and / or the short stub structure 600 can be designed as the portion where horizontal and vertical transmission lines are placed.

[0068] According to various embodiments, in the stacked circuit board constituting the power supply network unit 320 and / or wiring unit 330, the second layer L2, the third layer L3, the fourth layer L4, and the fifth layer L5 can be arranged sequentially along the -Z axis direction relative to the first layer L1 disposed on top. Open-circuit stub structures 500 and / or short-circuit structures 600 may be disposed adjacent to vias 410a extending through the circuit board. According to embodiments, vias 410, as a type of transmission line (e.g., a transmission via) for providing signals, can pass through the second layer L2, the third layer L3, and the fourth layer L4, and can be electrically connected to striplines 420a disposed on the second layer L2 and the fourth layer L4. According to embodiments, the open-circuit stub structure 500 can be disposed on the same layer as the third layer L3 forming the ground plane. The open-circuit stub structure 500 can be designed to include via pads, open-circuit stubs, and slot portions. According to an embodiment, the stub structure 600 can be formed on the same layer as the second layer L2 and / or the fourth layer L4, which is provided with the stripline 420a. The stub structure 600 can be designed to include through-hole pads, a stub, a transformer, and a slot portion.

[0069] The open-circuit stub structure and the short-circuit stub structure will be described in detail below.

[0070] Figure 7 This is a perspective view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0071] Figure 8 This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0072] Figure 9 This is a perspective view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0073] According to various embodiments, electronic devices (e.g., Figures 1-4 Electronic device 101 in the device may include an antenna module (e.g., Figure 5 Antenna module 300 (as shown in the image). Antenna module 300 can have antennas in a package structure applicable to ultra-high frequencies, and the antennas disposed on antenna module 300 can form a sub-array. The network unit 302 constituting antenna module 300 can provide an efficient matching design for transmission lines in a narrow space to provide high frequencies. Therefore, space efficiency can be improved, and line losses can be minimized by optimizing the internal structure of the module.

[0074] Figures 7 to 9 The configuration of the network element 302 of the antenna module can be completely or partially integrated with... Figure 5 and Figure 6 The configuration of the network unit 302 of the antenna module is the same.

[0075] According to various embodiments, the network element 302 of the antenna module 300 may include stacked feed network elements 320 and wiring elements 330. Each of the feed network element 320 and wiring element 330 may include multiple layers. An open-circuit cutout structure 500 may be designed in a region of the feed network element 320 and / or the wiring element 330. The open-circuit cutout structure 500 designed in the wiring element 330 will be described below, and the described open-circuit cutout structure 500 can also be applied to the feed network element 320 in the same way.

[0076] Refer to the embodiments Figure 7 The wiring unit 330 may include a second layer L2 and a third layer L3 in the -Z axis direction, which refer to a first layer L1 stacked adjacent to the feed network unit 320. An open-circuit cut structure 500 may be designed on one layer of the wiring unit 330, and the open-circuit cut structure 500 can improve transmission lines in narrow spaces (e.g., Figure 6 The impedance matching performance between the stripline 420a and the via 410a is considered. According to an embodiment, the stripline transmission line 420 can be designed on the first layer L1 and the third layer L3, and the second layer L2 inserted between the first layer L1 and the third layer L3 can form a ground plane. The open-circuit cut-off structure 500 can be designed on the ground plane serving as the second layer L2, and can utilize a relatively larger space compared to the first layer L1 and the third layer L3.

[0077] Refer to the embodiments Figure 9 A method with Figure 7 The structure of the stacked circuit board is compared to a structure with more stacked substrates. The wiring unit 330 may include a second, third, fourth, and fifth layer in the -Z-axis direction relative to the first layer stacked adjacent to the power supply network unit 320, and the open-circuit cut-off structure 500 may be designed on a layer including a ground plane. According to an embodiment, the transmission via 410 may pass through a total of five layers of the stacked substrate, the open-circuit cut-off structure 500 may be designed on the ground plane and the fourth layer, and the stripline transmission line 420 may be designed on the first and fifth layers. According to an embodiment, the open-circuit cut-off structure 500 may be designed on a different surface than the ground plane.

[0078] In the following text, reference will be made to Figure 7 The open-circuit cut-off structure 500 is described in the text.

[0079] According to various embodiments, the open-circuit stub structure 500 may be designed adjacent to a portion (e.g., the second layer) of the transmission via 410 extending through the first layer L1, the second layer L2, and the third layer L3. For example, the open-circuit stub structure 500 may include a first via pad 510 disposed adjacent to the via 411, an open-circuit stub 520 extending from the first via pad 510, and a groove portion 530. In another example, the open-circuit stub structure 500 may be designed to include an opening formed through a region of the second layer L2 forming a ground plane 450, an open-circuit stub 520 formed in a region of the via pad 510 and extending along the opening.

[0080] According to an embodiment, the first through-hole pad 510 can be formed around the periphery of the through-hole 411. For example, the first through-hole pad 510 can be provided in a closed-loop shape, and at least a portion of the groove portion 530 can be designed along the periphery of the first through-hole pad 510. The open-circuit stub 520 can be a region extending from the first through-hole pad 510 and can include a first open-circuit stub 521 extending toward a first direction (+X-axis direction) and a second open-circuit stub 522 extending toward a second direction (-X-axis direction) opposite to the first direction. The first open-circuit stub 521 and the second open-circuit stub 522 can include conductive material and can be designed as strips parallel to the ground plane 450 of the second layer L2. By designing the first open-circuit stub 521 and the second open-circuit stub 522 into shapes having the same length corresponding to each other, stable properties can be provided. However, considering space and performance, the illustrated embodiment corresponds to a structure, and the open-circuit stubs can be designed and changed into various shapes other than stripes.

[0081] According to an embodiment, the first open-circuit line 521 and the second open-circuit line 522 can be formed to have a thickness of approximately 0.02 mm to 0.06 mm. For example, the first open-circuit line 521 and the second open-circuit line 522 can be formed to have a thickness of approximately 0.04 mm. According to another embodiment, each of the first open-circuit line 521 and the second open-circuit line 522 formed on the second layer L2 can be arranged in a direction perpendicular to the direction in which the strip line 420a formed on the first layer L1 and / or the third layer L3 is disposed (third direction (+Y axis direction or -Y axis direction)).

[0082] According to an embodiment, the groove portion 530 of the open-circuit cut-off structure 500 may be formed to surround at least a portion of the first open-circuit cut-off 521, the second open-circuit cut-off 522, and the through-hole pad 510. For example, the groove portion 530 may include: a first groove portion 531, which is formed in a closed-loop shape to surround the annular through-hole pad 510; a second groove portion 532, which is connected to the first groove portion 531 and formed to surround the first open-circuit cut-off 521; and a third groove portion 533, which is connected to the first groove portion 531 and formed to surround the second open-circuit cut-off 522. In another example, the slot portion 530 may include: a first slot portion 531, which is configured to correspond to the shape of the through-hole pad 510 and separates the through-hole pad 510 from the ground plane; a second slot portion 532, which is connected to the first slot portion 531 and formed along the end of the first open-circuit line 521 and the opposite lateral surface; and a third slot portion 533, which is connected to the first slot portion 531 and formed along the end of the second open-circuit line 522 and the opposite lateral surface. In another example, when viewed from above the second layer L2, each of the through-hole pad 510, the first open-circuit line 521, and the second open-circuit line 522 extends from the through-hole pad 510 and can be designed by the slot portion 530 to be in the shape of an island floating in space.

[0083] Figure 10 This is a diagram depicting a comparison between the properties of a transmission line when an open-circuit cut structure is designed in the wiring unit of an antenna module according to an embodiment of the present disclosure, and the properties of a transmission line when an open-circuit cut structure is excluded from the wiring unit of an antenna module.

[0084] exist Figure 10 The open-circuit cutoff structure 500 of the antenna module, as defined in the curve diagram, can be partially or completely related to... Figure 7 and Figure 8 The open circuit cut-off structure in the 500 is the same.

[0085] According to various embodiments, it can be assumed that in the network unit of an antenna module in which multiple circuit boards are stacked, the transmission lines of striplines for transmitting signals through vias can be disposed on upper and / or lower layers relative to the layer forming the ground plane, and the open-circuit stub structure is designed on the layer forming the ground plane. By applying a predetermined ideal open-circuit stub structure as an equivalent circuit and analyzing it, a specific impedance corresponding to the length or thickness of the stub can be matched. For example, a via impedance close to 50 ohms can be obtained, and based on experimental data, it can be derived that... Figure 10 The result of the curve graph.

[0086] Reference Figure 10Lines 1 A1 and 2 A2 (e.g., dashed lines) illustrate the properties of the transmission line when no open-circuit slit structure is present, and lines 3 A3 and 4 A4 (solid lines) illustrate the properties of the transmission line when an open-circuit slit structure is designed according to an embodiment. Lines 1 A1 and 3 A3 are S11 curves, and lines 2 A2 and 4 A4 are S21 curves.

[0087] A comparison of the embodiment including the open-circuit cut-off structure (e.g., line 3 A3) with the embodiment excluding the open-circuit cut-off structure (e.g., line 1 A1) confirms that the case including the open-circuit cut-off structure has a relatively lower reflectivity in a specific bandwidth. A comparison of the embodiment including the open-circuit cut-off structure (e.g., line 4) with the case excluding the open-circuit cut-off structure (e.g., line 2) confirms that the case including the open-circuit cut-off structure has a relatively higher magnetic permeability in a specific bandwidth. For example, it is confirmed that the S21 property is improved by at least about 1 dB or more in a specific bandwidth through the open-circuit cut-off structure.

[0088] Figure 11A This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0089] Figure 11B This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0090] Figure 11C This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0091] Figure 11D This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0092] Figure 11E This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0093] Figure 11F This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0094] Figure 11G This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0095] Figure 11H This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0096] Figure 12This is a diagram depicting the properties of the transmission lines between open slits when different open slits are implemented on the network element of the antenna module according to an embodiment of the present disclosure.

[0097] According to various embodiments, electronic devices (e.g., Figures 1-4 Electronic device 101 in the device may include an antenna module (e.g., Figure 5 The antenna module 300 (as shown in the image) has a network element 302 that provides an efficient matching design for transmission lines in a narrow space to deliver high frequencies. Therefore, space efficiency can be improved, and line losses can be minimized by optimizing the module's internal structure.

[0098] Figure 11A , Figure 11B , Figure 11C , Figure 11D , Figure 11E , Figure 11F , Figure 11G and Figure 11H The open-circuit stub structure 500 of the antenna module can be partially or completely connected to... Figures 5 to 10 The open-circuit cut-off structure of the antenna module in the 500 is the same.

[0099] According to various embodiments, the open-circuit stub extending from the via pad in the open-circuit stub structure can be designed and modified into various shapes. For example, an antenna can be designed to have stable properties by including an open-circuit stub extending from the via pad in different directions (e.g., opposite directions). As another example, a structure including an open-circuit stub extending from the via pad in only one direction can be designed to provide spatial advantages and have stable properties for an antenna corresponding to a structure including bidirectional extension portions adjusted according to their length and thickness.

[0100] According to various embodiments, the open-circuit stub of the open-circuit structure can be designed in various shapes, such as strip, radial, T-shaped, and zigzag shapes, and is selectively constructed on the ground plane through which the via passes in order to match the impedance between transmission lines. According to embodiments, the open-circuit stub structure can be designed on the same layer as the layer providing the ground plane.

[0101] Reference Figure 11A The open-circuit stub structure 501 can be designed to include: a via pad 501a formed around the periphery of a via, an open-circuit stub 501b extending from the via pad 501a, and a groove portion 501c formed around the via pad 501a and the open-circuit stub 501b. One of the open-circuit stubs 501b can have a strip shape.

[0102] refer to Figure 11BAnother open-circuit cutout structure 502 can be designed to include: a via pad 502a formed around the periphery of the via, an open-circuit cutout 502b extending from the via pad 502a, and a groove portion 502c formed around the via pad 502a and the open-circuit cutout 502b. One of the open-circuit cutouts 502b can be radial. For example, the open-circuit cutout 502b can be designed to be radial, with its area increasing outward from the via pad 502a to have a structure that facilitates wide bandwidth.

[0103] refer to Figure 11C Another open-circuit cut-off structure 503 can be designed to include: a through-hole pad 503a formed around the periphery of the through-hole, an open-circuit cut-off line 503b extending from the through-hole pad 503a, and a groove portion 503c formed around the through-hole pad 503a and the open-circuit cut-off line 503b. One of the open-circuit cut-off lines 503b can be T-shaped. For example, the open-circuit cut-off line 503b can be designed to have a structure including a strip extending from the through-hole pad 503a and a portion extending from the end of the strip in a direction perpendicular to the strip.

[0104] refer to Figure 11D Another open-circuit stub structure 504 can be designed to include: a via pad 504a formed around the periphery of a via, an open-circuit stub 504b extending from the via pad 504a, and a groove portion 504c formed around the via pad 504a and the open-circuit stub 504b. One of the open-circuit stubs 504b can have a zigzag shape. For example, the open-circuit stub 504b can be designed as an elongated zigzag structure extending outward from the via pad 504a.

[0105] refer to Figure 11E Another open-circuit slit structure 505 can be adopted Figure 11A The open-circuit cut-off structure 501 in the middle. Figure 11E The open circuit structure 505 can be a structure including open circuits 501b and 501d, which are arranged in a direction opposite to the through hole pad 501a, and the two open circuits 501b and 501d can be designed to face opposite directions and have corresponding stripes.

[0106] refer to Figure 11F Another open-circuit slit structure 506 can be adopted Figure 11B The open-circuit cut-off structure 502 in the middle. Figure 11F The open circuit structure 506 can be a structure including open circuits 502b and 502d, which are arranged in a direction opposite to the through hole pad 502a, and the two open circuits 502b and 502d can be designed to face opposite directions and have a radial shape corresponding to each other.

[0107] refer to Figure 11G Another open-circuit slit structure 507 can be adopted Figure 11C The open-circuit cut-off structure 503 in the middle. Figure 11G The open circuit structure 507 can be a structure including open circuits 503b and 503d, which are arranged in a direction opposite to the through hole pad 503a, and the two open circuits 503b and 503d can be designed to face opposite directions and have corresponding T-shapes.

[0108] refer to Figure 11H Another open-circuit slit structure 508 can be adopted Figure 11D The open-circuit cut-off structure 504 in the middle. Figure 11H The open circuit structure 508 can be a structure including open circuits 504b and 504d, which are arranged in a direction opposite to the through hole pad 504a, and the two open circuits 504b and 504d can be designed to face opposite directions and have corresponding zigzag shapes.

[0109] However, the open-circuit stub structure of the antenna module is not limited to the embodiment shown, and can be designed and modified in various structures to match the impedance between transmission lines.

[0110] Reference Figure 12 It can be such as Figure 11B or Figure 11F The radial stub structure is designed on the same layer as the layer forming the ground plane to achieve an advantageous open-circuit stub structure in broadband, and with Figure 11A or Figure 11E Compared to the strip stub structure, the radial stub structure has been shown to exhibit improved transmission line performance.

[0111] exist Figure 12 In the diagram shown, line 1B1 illustrates the properties of the transmission line in a strip-shaped stub structure, while line 2B2 illustrates the properties of the transmission line in a radial stub structure. Lines 1B1 and 2B2 represent the S21 curve.

[0112] According to embodiments, radial stub structures have been shown to exhibit relatively higher permeability over a specific bandwidth compared to strip-shaped stub structures. However, the transmission line properties in the graph are equivalent to an example comparing the broadband properties of strip-shaped and radial stub structures under the same conditions, and the strip-shaped stub structure may exhibit more favorable transmission line properties depending on the conditions of the surrounding structure.

[0113] Figure 13This is a perspective view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure. Figure 14 This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure. Figure 15 This is a cross-section showing a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0114] According to various embodiments, electronic devices (e.g., Figures 1-4 Electronic device 101 in the device may include an antenna module (e.g., Figure 5 Antenna module 300 (as shown in the image). Antenna module 300 can have antennas in a package structure applicable to ultra-high frequencies, and the antennas disposed on antenna module 300 can form a sub-array. Network element 302 of antenna module 300 can provide efficient matching design of transmission lines in narrow space to provide high frequencies. Therefore, space efficiency can be improved, and line loss can be minimized by optimizing the internal structure of the module.

[0115] Figures 13 to 15 The configuration of the network element 302 of the antenna module can be completely or partially integrated with... Figure 5 and Figure 6 The configuration of the network unit 302 of the antenna module is the same.

[0116] According to various embodiments, the network element 302 of the antenna module 300 may include stacked feed network elements (e.g., Figure 6 The power supply network unit 320 and wiring unit (e.g., in the middle) Figure 6 The wiring unit 330 in the feed network unit 320 and the wiring unit 330 may each include multiple layers. A stub structure 600 may be designed in a region of the feed network unit 320 and / or the wiring unit 330. The stub structure 600 designed in the wiring unit 330 will be described below, and the described stub structure 600 can also be applied to the feed network unit 320 in the same way.

[0117] According to various embodiments, the stub structure 600 may be included in at least one layer of the wiring unit 330, and the stub structure 600 may improve impedance matching performance between transmission lines in a confined space. According to an embodiment, the stub structure 600 may be designed on a first layer L1, a second layer L2 located above or below the first layer L1 may include a ground plane, and the second layer L2 may be electrically connected to the first layer L1 via vias 410 (including via 411 and via pad 510). For another example, in the region adjacent to the vias of the second layer L2, an open-circuit stub structure (e.g., Figures 7 to 9The open-circuit cut-off structure 500 in the middle can be designed to extend from the through hole along a first direction (+X axis direction) (or a second direction (-X axis direction)).

[0118] According to various embodiments, the stub structure 600 may be formed in the same layer as the transmission line 420 forming the stripline. The transmission line 420 may receive transmission signals emitted from the via 410 through the stub structure 600. For example, the stub structure 600 may include a second via pad 610 formed adjacent to the via 411, a stub 620 extending from the second via pad 610 in a third direction (+Y axis direction), a transformer 630 extending in a direction different from the third direction, and a slot portion 640. In another example, the stub structure 600 may be designed to include an opening formed adjacent to a via 411 in a substrate layer where the transmission line 420 is disposed, a stub 620 in a region of the second via pad 610, and a transformer 630 formed in a different region and extending along the opening.

[0119] According to an embodiment, the second via pad 610 can be formed around the periphery of the via 411. For example, the second via pad 610 can be provided in a closed-loop shape, and the groove portion 640 can be designed along the periphery of the second via pad 610. In a stub 620 extending from the second via pad 610 in a third direction (+Y axis direction), its end facing the third direction (+Y axis direction) can be configured to contact a region of the substrate in the same layer, and opposing side surfaces formed in a direction perpendicular to the third direction (+Y axis direction) (e.g., +X, -X axis directions) can be separated from the substrate by at least a portion of the groove portion 640 (e.g., the second groove portion 642). According to an embodiment, a region of the substrate in contact with one end of the stub 620 can provide a ground plane. According to an embodiment, the stub 620 can include a conductive material and can be designed as a strip disposed parallel to the substrate. The stub 620 is designed to contact a ground plane that provides the same surface as the stripline, and therefore does not increase the size of the via and achieves impedance matching between transmission lines in physically confined spaces.

[0120] According to an embodiment, a transformer 630 extending from the second via pad 610 along a fourth direction (-Y-axis direction) opposite to the third direction (+Y-axis direction) can be designed to extend to the transmission line 420. The transformer 630 can provide a signal transmitted through the via 410 to the transmission line 420 via an electrical connection to the transmission line 420. The transformer 630 can be formed to have a thickness different from that of the stub 620. For example, the stub 620 can have a width d1 of a first length extending in a first direction (+X-axis direction) (or a second direction (-X-axis direction)), and the transformer 630 can have a width d2 of a second length extending in the first direction (+X-axis direction) (or the second direction (-X-axis direction)). The width d2 of the second length can be designed to be greater than the width d1 of the first length. For another example, the width d2 of the second length can be designed to be twice or greater than the width d1 of the first length. According to an embodiment, the transformer 630 may include a conductive material and can be designed as a strip disposed parallel to the substrate. The slot portion 640 may be formed along the edge of the transformer 630, and at least a portion of the end of the transformer 630 facing the fourth direction (-Y-axis direction) and the opposite lateral side may be spaced apart from the adjacent substrate. According to an embodiment, the transformer 630 may be designed to have a specified impedance and consist of a single, thin stage. Therefore, impedance matching between transmission lines can be achieved in a physically confined space.

[0121] According to an embodiment, the slot portion 640 of the stub structure 600 may be formed to surround at least a portion of the second through-hole pad 610, the stub 620, and the transformer 630. For example, the slot portion 640 may include: a first slot portion 641 formed in a closed-loop shape to surround the annular second through-hole pad 610; a second slot portion 642 connected to the first slot portion 641 and formed to surround the stub 620; and a third slot portion 643 connected to the first slot portion 641 and formed to surround the transformer 630. In another example, the slot portion 640 may include: a first slot portion 641, a second slot portion 642, and a third slot portion 643, wherein the first slot portion 641 is formed in a shape corresponding to the second through-hole pad 610 and separates the second through-hole pad 610 from the substrate region, the second slot portion 642 is connected to the first slot portion 641 and is formed along the end of the stub 620 and the opposite transverse surface, and the third slot portion 643 is connected to the first slot portion 641 and is formed along the opposite transverse surface of the transformer 630.

[0122] Figure 16A This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0123] Figure 16BThis illustrates the exclusion of stub structures from the transmission line structure according to embodiments of the present disclosure for use with... Figure 16A Plan view of the transmission line structures for comparison.

[0124] Figure 17A This is a diagram illustrating the properties of the transmission line when designing a stub structure in the network element of an antenna module according to embodiments of the present disclosure.

[0125] Figure 17B This describes an embodiment of the present disclosure that excludes stub structures in order to... Figure 17A A graph of the properties of the transmission line when making comparisons.

[0126] According to various embodiments, in a network unit of an antenna module in which multiple circuit boards are stacked, a transmission line 420 can be designed to be disposed between a first via V1 and a second via V2 configured to transmit signals. Due to various components on the substrate (e.g., ground vias), the transmission line 420 may include bent or curved portions in the path between the first via V1 and the second via V2.

[0127] Reference Figure 16A The stub structure 600 can be designed adjacent to each of the first via V1 and the second via V2. For example, the first stub structure 600a can be designed adjacent to the first via V1 and then connected to the first via V1 and one end of the transmission line 420. For another example, the second stub structure 600b can be designed adjacent to the second via V2 and then connected to the second via V2 and the other end of the transmission line 420. Figure 16A The first stub structure 600a and the second stub structure 600b shown can be partially or completely integrated with... Figures 13 to 15 The stub structure in the middle is the same as that in 600.

[0128] and Figure 16A different, Figure 16B A structure without the first stub structure 600a and / or the second stub structure 600b is shown, and simply has a transmission line 420 disposed between the first through hole V1 and the second through hole V2.

[0129] Figure 17A It shows a depiction of having, for example Figure 16A A diagram showing the properties of the transmission line 420 of the stub structure 600 shown, while... Figure 17B It shows a depiction without such as Figure 16B A diagram showing the properties of the transmission line 420 with the stub structure shown.

[0130] refer to Figure 17A According to the embodiment, lines 1 C1 and 2 C2 illustrate the properties of the transmission line when designing the stub structure 600, and refer to Figure 17B Lines 3 C3 and 4 C4 illustrate the properties of the transmission line when no stub structure is present. Lines 1 C1 and 3 C3 are S11 curves, and lines 2 C2 and 4 C4 are S21 curves.

[0131] A comparison of the embodiment including the stub structure 600 (e.g., line 1 C1) with the embodiment excluding the stub structure (e.g., line 3 C3) confirms that the case including the open-circuit stub structure has a relatively reduced reflectivity within a specific bandwidth. A comparison of the embodiment including the stub structure 600 (e.g., line 2 C2) with the case excluding the stub structure (e.g., line 4 C4) confirms that the case including the stub structure has a relatively high permeability within a specific bandwidth.

[0132] Figure 18A This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0133] Figure 18B This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0134] The network elements constituting the antenna module 300 (e.g., Figure 5 The network unit 302 in the module can provide an efficient matching design for transmission lines in a narrow space to deliver high frequencies. Therefore, space efficiency can be improved, and line losses can be minimized by optimizing the module's internal structure.

[0135] Figure 18A and Figure 18B The stub structures 601 and 602 of the antenna module in the middle can be partially or completely connected with... Figures 13 to 15 The stub structure of the antenna module in the 600 is the same.

[0136] According to various embodiments, the stubs and transformers extending from the via pads in the open-circuit stub structure can be designed and modified into various shapes. The structure and shape of the stub may be influenced by the performance and adequacy of physical space. For example, when designing the stub structure, a slot can be added in the direction of the available space near the via, which is configured to transmit signals to ensure space, and then the stub is grounded (short-circuited) to a region of the substrate. As another example, in addition to a structure from the via to the stripline (e.g., via to stripline), the design of the stub structure can be reversed to a structure from the stripline to the via (e.g., stripline to via).

[0137] Reference Figure 18AA stub structure 601 can be designed to include: a through-hole pad 601a formed around the periphery of a through-hole; a stub 601b extending from the through-hole pad 601a in a third direction; a transformer 601c extending in a fourth direction different from the third direction; and a slot portion 601d formed around the through-hole pad 601a, the stub 601b, and the transformer 601c. The third and fourth directions can be defined and designed at specified angles, such as greater than 90 degrees and less than 180 degrees.

[0138] Reference Figure 18B A stub structure 602 can be designed to include: a through-hole pad 602a formed around the periphery of a through-hole; a first stub 602b extending from the through-hole pad 602a in a third direction; a second stub 602c extending from the through-hole pad 602a in a fourth direction different from the third direction; a transformer 602d extending from the through-hole pad 602a in a fifth direction different from the third and fourth directions; and a slot portion 602e formed around the through-hole pad 602a, the first stub 602b, the second stub 602c, and the transformer 602d. The third and fourth directions may be opposite to each other, and the fifth direction may be perpendicular to the third direction (or the fourth direction).

[0139] Figure 19 This is a plan view illustrating a stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0140] Figure 20 This is a plan view illustrating an open-circuit stub structure designed in the network element of an antenna module according to an embodiment of the present disclosure.

[0141] According to various embodiments, the antenna module may include transmission lines branching on multiple stacked substrates for transmitting and / or receiving signals, which serve as antenna elements forming a subarray. In embodiments, impedance mismatch may occur at transition points in the transmission structures of the multiple stacked substrates, and to address this mismatch, open-circuit stub structures and stub structures may be selectively designed at these transition points. For example, as described above, one of the open-circuit stub structures or the stub structure may be selected and matched, or both structures may be selected and matched (e.g., open-circuit stub structure and stub structure).

[0142] Figure 19 and Figure 20 The short stub structure 701 and the open stub structure 702 can be partially or completely integrated with... Figures 7 to 9 The open circuit cut-off structure 500 and Figures 13 to 15 The stub structure in the middle is the same as that in 600.

[0143] Reference Figure 19 It is possible to design something similar to Figures 7 to 9 The open-circuit stub structure 500 includes a stub structure 600. The available impedance reactance varies depending on the stub type; therefore, in structures that can resolve mismatches, the stub structure 701 can be designed in the same layer as the ground plane through which the via passes. For example, the stub structure 701 may include a via pad 701a formed adjacent to the via, a stub 701b extending from the via pad 701a, and a groove portion 701c. Multiple stubs 701b may extend from the via pad 701a and are configured to contact the substrate 701h forming the ground plane.

[0144] Reference Figure 20 It can be designed with Figures 13 to 15 The open-circuit stub structure 702 is similar to the stub structure 600 in the diagram. The available impedance reactance varies depending on the stub type; therefore, in structures that can resolve mismatches, the open-circuit stub structure 702 can be designed in the same layer as the transmission line 420 for connection to the transmission line 420. For example, the open-circuit stub structure 702 may include a via pad 702a formed adjacent to a via, an open-circuit stub 702b extending from the via pad 702a and spaced from the substrate, a transformer 702c facing the direction opposite to the open-circuit stub 702b and connected to the transmission line 420, and a slot portion 702d.

[0145] Figure 21 This is a view showing the arrangement of vias and transmission lines in the network unit of an antenna module according to an embodiment of the present disclosure. Figure 22 This is a view showing the arrangement of vias and transmission lines in the network unit of an antenna module according to an embodiment of the present disclosure.

[0146] According to various embodiments, an antenna module may include transmission lines branching across multiple stacked substrates as antenna elements forming a subarray, for transmitting and / or receiving signals. In embodiments, impedance mismatch may occur at transition points in the transmission structures of the multiple stacked substrates, and to address this mismatch, open-circuit stub structures and / or stub structures may be selectively designed at these transition points. The stub structures and / or stub structures may be affected by the vias of the striplines formed on the network cells and the impedance of the transmission lines. The parameters for determining the impedance of the vias and the transmission lines of the striplines will be described below.

[0147] Reference Figure 21In one region of the substrate, a via (hereinafter referred to as vertical transmission line 810) configured to transmit and / or receive signals can be designed to be spaced apart from a plurality of ground vias (820) on the peripheral region. According to an embodiment, by adjusting the diameter t of the vertical transmission line 810 and the distance r from the center of the vertical transmission line 810 to the center of the ground via 820, the impedance of the vertical transmission line 810 can be controlled to have a favorable value rather than a specific value in the design.

[0148] refer to Figure 22 In another region of the substrate, a stripline transmission line (hereinafter referred to as horizontal transmission line 830) configured to transmit and / or receive signals can be designed to have a plurality of ground vias 840, which are arranged on opposite lateral sides of the horizontal transmission line 830 and spaced apart from each other. According to an embodiment, by adjusting the line thickness W of the horizontal transmission line 830 and the distance d from the center of the horizontal transmission line 830 to the center of the ground via 840, the impedance of the horizontal transmission line 830 can be controlled to have a favorable value rather than a specific value in the design.

[0149] According to various embodiments, the transition portions of the vertical transmission line 810 and the horizontal transmission line 830 can achieve impedance matching between the transition portions of the vertical transmission line 810 and the horizontal transmission line 830 in a multi-substrate structure while utilizing minimal space by applying the open-circuit stub structure and / or short-circuit stub structure described above.

[0150] Antenna modules according to various embodiments (e.g., Figure 5 and Figure 6 The antenna module 300 in the middle may include: communication circuitry (e.g., Figure 5 The communication circuit 341 in the middle includes an antenna section comprising multiple antenna elements constituting a subarray (e.g., Figure 5 Antenna element 301 in the middle), and network portions arranged below the antenna portion in multiple layers (e.g., Figure 5 Network unit 302 in the multilayer structure includes at least one transmission line configured to branch to multiple antenna elements, vias extending through multiple layers, and stub structures disposed adjacent to the vias. An open-circuit stub structure forming a ground plane is designed on the first layer of the multilayer structure (e.g., Figure 6 The open-circuit cut-off structure 500 in the middle may include: a first through-hole pad disposed adjacent to the through-hole (e.g., Figure 7 The first through-hole pad 510 in the first direction, and the first open circuit line extending from the first through-hole pad in the first direction (e.g., Figure 7 The first open-circuit stub 521), and the first groove portion configured to surround the edge of the first through-hole pad and the first open-circuit stub (e.g., Figure 7The slot portion 530 in the middle). A stub structure designed on a second layer different from the first layer (e.g., Figure 6 The stub structure 600 in the middle may include: a second through-hole pad disposed adjacent to the through-hole (e.g., Figure 13 The second through-hole pad 610 in the second direction, and the short stub extending from the second through-hole pad (e.g., Figure 13 The short stub 620 in the middle extends upward from the second through-hole pad in a third direction different from the second direction in order to connect to the transformer of at least one transmission line (e.g., Figure 13 Transformer 630 in the middle), and a second slot portion configured to surround at least a portion of the second through-hole pad, the stub, and the edge of the transformer (e.g., Figure 13 The groove portion 640 in the middle.

[0151] According to various embodiments, the open-circuit cut-off structure may also include a second open-circuit cut-off (e.g., Figure 7 The second open circuit line 522 extends from the first through-hole pad in a fourth direction, different from the first direction.

[0152] According to various embodiments, in the open-circuit cut-off structure, the first direction and the fourth direction can be opposite to each other.

[0153] According to various embodiments, in the open-circuit cut-off structure, the first through-hole pad can be configured in a closed-loop shape to surround the periphery of the through-hole, and the first open-circuit cut-off or the second open-circuit cut-off can be configured to be spaced apart from the ground plane.

[0154] According to various embodiments, the groove portion may include: a first (1-1) groove portion (e.g., Figure 7 The first slot portion 531 in the middle is configured to correspond to the shape of the first through-hole pad and to separate the first through-hole pad from the ground plane; the second slot portion (e.g., Figure 7 The second groove portion 532), which connects to the (1-1) groove and is formed along the end and opposite side surface of the first open-circuit section; and the (1-3) groove portion (e.g., Figure 7 The third groove portion 533 is connected to the (1-1) groove portion and is formed along the end of the second open section and the opposite side surface.

[0155] According to various embodiments, the first open-circuit cutoff line and / or the second open-circuit cutoff line can be designed as at least one of the following shapes: strip, radial, T-shaped, and zigzag.

[0156] According to various embodiments, in the stub structure, the second via pad can be configured in a closed-loop shape to surround the periphery of the via, and the stub can be configured to contact a region of the substrate of the second layer.

[0157] According to various embodiments, in the stub structure, the second direction and the third direction can be opposite to each other.

[0158] According to various embodiments, the first direction of the first open-circuit extension of the open-circuit structure and the second direction of the short-circuit extension of the short-circuit structure can be perpendicular to each other.

[0159] According to various embodiments, the second groove portion may include: a (2-1)th groove portion (e.g., Figure 13 The first groove portion 641 in the middle is configured to be shaped to correspond to the second through-hole pad and to separate the second through-hole pad from the adjacent substrate; the second groove portion (e.g., Figure 13 The second groove portion 642), which is connected to the (2-1) groove portion and is formed along the opposite side surfaces of the stub; and the (2-3) groove portion (e.g., Figure 13 The third slot portion 643 in the transformer is connected to the (2-1) slot and is formed along the opposite side surface of the transformer.

[0160] According to various embodiments, the transformer can be designed to have a first length of width in a direction perpendicular to the extension direction, the stub has a second length of width in a direction perpendicular to the extension direction, and the first length of width is designed to be greater than the second length of width.

[0161] According to various embodiments, a region of the substrate in contact with one end of the stub can provide a ground plane.

[0162] According to various embodiments, the network portion may include: a feed network portion 320 disposed below the antenna portion and including a first transmission via and a first transmission line, the first transmission line branching to the locations of a plurality of antenna elements such that the plurality of antenna elements form the same phase; and a wiring portion disposed between the feed network portion and the communication circuit and including a second transmission via and a second transmission line, the second transmission line extending on at least one layer from a location corresponding to an output terminal of the communication circuit to a location corresponding to an input terminal of the feed network portion.

[0163] According to various embodiments, an open-circuit cut-off structure or a short-circuit cut-off structure can be designed in the transition region between the first transmission line and the first transmission via in the power supply network section, or an open-circuit cut-off structure or a short-circuit cut-off structure can be designed in the transition region between the second transmission line and the second transmission via in the wiring section.

[0164] Antenna modules according to various embodiments of the present disclosure may include: a communication circuit, an antenna portion including a plurality of antenna elements constituting a subarray, and a network portion including a plurality of substrates stacked between the communication circuit and the antenna portion, wherein an open-circuit stub structure is designed on at least one layer of the plurality of substrates and configured to form a ground plane. The open-circuit stub structure may include: a first via pad formed along the edge of a via, a first open-circuit stub extending from the first via pad in a first direction, and a first groove portion formed around the edges of the first via pad and the first open-circuit stub to separate the first via pad and the first open-circuit stub from the ground plane.

[0165] According to various embodiments, the open-circuit cut-off structure may also include a second open-circuit cut-off extending from the first through-hole pad in a direction different from the first direction.

[0166] According to various embodiments, a stub structure designed on a layer different from the layer on which the open stub structure is designed may include: a second through-hole pad configured to be adjacent to the through-hole; a stub extending from the second through-hole pad in a second direction perpendicular to the first direction; a transformer extending from the second through-hole pad in a third direction different from the second direction to connect to at least one transmission line; and a second groove portion configured to surround at least a portion of the edges of the second through-hole pad, the stub, and the transformer.

[0167] Antenna modules according to various embodiments of the present disclosure may include: a communication circuit, an antenna portion including a plurality of antenna elements constituting a subarray, and a network portion including a plurality of substrates stacked between the communication circuit and the antenna portion, wherein a stub structure is designed on at least one layer of the plurality of substrates, the stub structure having a transmission line of a stripline disposed thereon. The stub structure may include: a first through-hole pad formed along the edge of a through-hole; a stub extending from the first through-hole pad in a first direction; a transformer extending from the first through-hole pad in a second direction different from the first direction to connect to the transmission line of the stripline; and a first groove portion configured to surround at least a portion of the edges of the first through-hole pad, the stub, and the transformer.

[0168] According to various embodiments, the second direction and the third direction can be opposite to each other.

[0169] According to various embodiments, the transformer can be designed to have a first length of width in a direction perpendicular to the extension direction, and the stub can have a second length of width in a direction perpendicular to the extension direction, wherein the width of the first length is greater than the width of the second length.

[0170] It will be apparent to those skilled in the art to which this disclosure pertains that the antenna modules and electronic devices including the antenna modules according to various embodiments of this disclosure are not limited to the above embodiments and drawings, and that various substitutions, modifications and changes can be made within the scope of the technology disclosed.

[0171] Although this disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An antenna module, comprising: Communication circuits; The antenna section includes multiple antenna elements that make up the subarray; as well as A network portion, arranged below the antenna portion in multiple layers, includes: at least one transmission line configured to branch to the locations of the plurality of antenna elements; vias extending through the plurality of layers; and short-circuit stub structures arranged in a region adjacent to the vias. The open-circuit stub structure designed on the first layer, which is configured to form a ground plane, among the plurality of layers includes: The first through-hole pad is positioned adjacent to the through-hole. The first open-circuit cut-off line extends from the first through-hole pad along the first direction. The first trench portion is formed around the edge of the first through-hole pad and the first open-circuit cutoff line, and The short-circuit cut-off structure designed on the second layer, which is different from the first layer, includes: The second through-hole pad is positioned adjacent to the through-hole. The short-circuit cut-off line extends from the second through-hole pad along the second direction. A transformer extends from the second through-hole pad in a third direction different from the second direction and is connected to the at least one transmission line. The second slot portion is formed as at least a portion surrounding the edge of the second through-hole pad, the short-circuit cut-off line, and the transformer.

2. The antenna module according to claim 1, wherein, The open circuit cut-out structure also includes a second open circuit cut-out, which extends from the first through-hole pad in a fourth direction different from the first direction.

3. The antenna module according to claim 2, wherein, In the open-circuit slit structure, the first direction and the fourth direction are opposite to each other.

4. The antenna module according to claim 2, in, In the open-circuit slit structure, the first via pad is configured in a closed-loop shape to surround the periphery of the via. The first open circuit line or the second open circuit line is configured to be spaced apart from the grounding plane.

5. The antenna module according to claim 2, wherein, The first slot portion includes: The first-1 slot portion is configured to have a shape corresponding to the first through-hole pad and to separate the first through-hole pad from the ground plane. The first-second groove portion is connected to the first-first groove portion and is formed along the end and opposite side surface of the first open-circuit section; and The first-3 slot portion is connected to the first-1 slot portion and is formed along the end and opposite side surface of the second open-circuit section.

6. The antenna module according to claim 2, wherein, At least one of the first open circuit line or the second open circuit line is designed as at least one of the following shapes: strip, radial, T-shaped, or zigzag.

7. The antenna module according to claim 1, in, In the short-circuit stub structure, the second via pad is configured in a closed-loop shape to surround the periphery of the via. The short-circuit cut-off line is configured to contact the area of ​​the substrate of the second layer.

8. The antenna module according to claim 7, wherein, In the short-circuit severance structure, the second direction and the third direction are opposite to each other.

9. The antenna module according to claim 7, wherein, The first direction in which the first open-circuit slit of the open-circuit slit structure extends and the second direction in which the short-circuit slit of the short-circuit slit structure extends are perpendicular to each other.

10. The antenna module according to claim 9, wherein, The second groove portion includes: The second-1 groove portion is configured to be shaped to correspond to the second through-hole pad and to separate the second through-hole pad from the adjacent substrate. The 2-2 slot portion is connected to the 2-1 slot portion and formed along the opposite side surfaces of the short-circuit truncated line; and The second-third slot portion is connected to the second-first slot portion and is formed along the opposite side surface of the transformer.

11. The antenna module according to claim 7, in, The transformer has a width of a first length in a direction perpendicular to the extension direction. Wherein, the short-circuit slit has a width of a second length in a direction perpendicular to the extension direction, and The width of the first length is greater than the width of the second length.

12. The antenna module according to claim 7, wherein, The area of ​​the substrate that contacts the end of the short-circuit stub provides a ground plane.

13. The antenna module according to claim 1, wherein, The network portion includes: A feed network section, disposed below the antenna section, includes a first transmission via and a first transmission line, the first transmission line branching to the locations of the plurality of antenna elements such that the plurality of antenna elements form the same phase; and The wiring portion is disposed between the power supply network portion and the communication circuit, and includes a second transmission via and a second transmission line, the second transmission line extending on at least one layer from a position corresponding to the output terminal of the communication circuit to a position corresponding to the input terminal of the power supply network portion.

14. The antenna module according to claim 13, in, The open-circuit cut-off structure or the short-circuit cut-off structure is designed in the transition region between the first transmission line and the first transmission via in the power supply network section, or The open-circuit cut-off structure or the short-circuit cut-off structure is designed in the transition region between the second transmission line and the second transmission via in the wiring section.

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