Acoustic input / output device

Abstract

This application discloses an acoustic input / output device, including: a speaker assembly for transmitting sound waves by generating a first mechanical vibration; and a microphone for receiving a second mechanical vibration generated when a speech signal is provided by a speech signal source. The microphone generates a first signal and a second signal under the action of the first mechanical vibration and the second mechanical vibration, respectively. In a certain frequency range, the ratio of the first mechanical vibration to the first signal is greater than the ratio of the second mechanical vibration to the second signal.

Description

Technical Field

[0001] This application relates to the field of acoustics, and in particular to an acoustic input / output device. Background Technology

[0002] The speaker assembly transmits sound by generating mechanical vibrations. The microphone receives the user's speech signal by picking up vibrations from areas such as the user's skin when they speak. When the speaker assembly and microphone work simultaneously, the mechanical vibrations of the speaker assembly are transmitted to the microphone, causing the microphone to receive the vibration signal from the speaker assembly and produce an echo. This reduces the quality of the sound signal produced by the microphone and affects the user experience.

[0003] This application provides an acoustic input / output device that can reduce the impact of speaker components on microphones, reduce the intensity of echo signals generated by microphones, and improve the quality of speech signals acquired by microphones. Summary of the Invention

[0004] The purpose of this invention is to provide an acoustic input / output device that reduces the impact of the speaker assembly on the vibration of the bone conduction microphone, reduces the intensity of the echo signal generated by the bone conduction microphone, and improves the quality of the sound signal picked up by the bone conduction microphone.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solution:

[0006] An acoustic input / output device includes: a speaker assembly for transmitting sound waves by generating a first mechanical vibration; and a microphone for receiving a second mechanical vibration generated when a speech signal is provided by a speech signal source, wherein the microphone generates a first signal and a second signal respectively under the action of the first mechanical vibration and the second mechanical vibration, wherein, within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal.

[0007] In some embodiments, the speaker assembly is a bone conduction speaker assembly, which includes a housing and a vibrating element connected to the housing for generating a first mechanical vibration, and a microphone is directly or indirectly connected to the housing.

[0008] In some embodiments, when a user wears an acoustic input / output device, the clamping force on the part of the acoustic input / output device that contacts the user is 0.1N to 0.5N.

[0009] In some embodiments, a vibration damping structure is also included, through which the microphone is connected to the speaker assembly.

[0010] In some embodiments, the vibration damping structure includes a vibration damping material with an elastic modulus less than a first threshold.

[0011] In some embodiments, the elastic modulus of the damping material is 0.01 MPa to 1000 MPa.

[0012] In some embodiments, the thickness of the vibration damping structure is 0.5 mm to 5 mm.

[0013] In some embodiments, a first portion of the microphone surface is used to conduct a second mechanical vibration, and a vibration damping structure is provided on the outer side of a second portion of the microphone surface and connected to a speaker assembly through the vibration damping structure.

[0014] In some embodiments, a first portion of the microphone surface is provided with a vibration-transmitting layer.

[0015] In some embodiments, the elastic modulus of the material of the vibration transmission layer is greater than a second threshold.

[0016] In some embodiments, the speaker assembly includes a housing and a vibrating element, with a first connection between the housing and the vibrating element and a second connection between the microphone and the housing, the first connection including a first damping structure.

[0017] In some embodiments, the second connection includes a second vibration damping structure.

[0018] In some embodiments, the mass of the vibrating element is in the range of 0.005g to 0.3g.

[0019] In some embodiments, when a user wears an acoustic input / output device, the clamping force on the part of the acoustic input / output device that contacts the user is 0.01N to 0.05N.

[0020] In some embodiments, the loudspeaker assembly includes a first diaphragm and a second diaphragm, the first diaphragm and the second diaphragm vibrating in opposite directions.

[0021] In some embodiments, the loudspeaker assembly includes a housing, the housing including a first cavity and a second cavity, a first diaphragm and a second diaphragm being located in the first cavity and the second cavity, respectively; the side wall of the first cavity is provided with a first sound-transmitting hole and a second sound-transmitting hole, the side wall of the second cavity is provided with a third sound-transmitting hole and a fourth sound-transmitting hole, the phase of the sound emitted from the first sound-transmitting hole is the same as the phase of the sound emitted from the third sound-transmitting hole, and the phase of the sound emitted from the second sound-transmitting hole is the same as the phase of the sound emitted from the fourth sound-transmitting hole.

[0022] In some embodiments, the first and third sound-permeable holes are disposed on the same side wall of the housing, the second and fourth sound-permeable holes are disposed on the same side wall of the housing, the first and second sound-permeable holes are disposed on non-adjacent side walls of the housing, and the third and fourth sound-permeable holes are disposed on non-adjacent side walls of the housing.

[0023] In some embodiments, the loudspeaker assembly further includes a first magnetic circuit assembly and a second magnetic circuit assembly for forming a magnetic field, the first magnetic circuit assembly for causing a first diaphragm to vibrate, and the second magnetic circuit assembly for causing a second diaphragm to vibrate; the first cavity and the second cavity are connected, and the first magnetic circuit assembly and the second magnetic circuit assembly are directly or indirectly connected.

[0024] In some embodiments, the vibration point of the voice signal source when providing voice signals to the user is greater than a third threshold when the user is wearing an acoustic input / output device.

[0025] In some embodiments, the microphone is located near at least one of the user's vocal cords, throat, mouth, or nasal cavity.

[0026] In some embodiments, the acoustic input / output device further includes a fixing component for maintaining stable contact between the acoustic input / output device and the user, and the fixing component is fixedly connected to the speaker assembly.

[0027] In some embodiments, the acoustic input / output device is a headset, and the fixing component includes a headband and two earcups connected to both sides of the headband. The headband is used to fix the headset to the user's skull and to fix the two earcups to both sides of the user's skull. The microphone and speaker components are respectively disposed in the two earcups.

[0028] In some embodiments, the acoustic input / output device is a binaural headset, with a foam cover on the side of each earcup that contacts the user, and a microphone housed within the foam cover.

[0029] In some embodiments, the ratio of the intensity of the second signal to the intensity of the third signal is greater than a threshold.

[0030] One or more embodiments of this application also provide an acoustic input / output device, including a speaker assembly for transmitting sound waves by generating a first mechanical vibration; and a microphone for receiving a second mechanical vibration generated when a speech signal is provided by a speech signal source, wherein the microphone generates a first signal and a second signal respectively under the action of the first mechanical vibration and the second mechanical vibration; the first angle formed by the vibration direction of the microphone and the direction of the first mechanical vibration is within a set angle range such that, within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal.

[0031] In some embodiments, the first included angle is within the range of 20 degrees to 90 degrees.

[0032] In some embodiments, the first included angle includes 90 degrees.

[0033] In some embodiments, the second angle formed by the vibration direction of the microphone and the direction of the second mechanical vibration is within a set angular range such that the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal.

[0034] In some embodiments, the second included angle is within the range of 0 degrees to 85 degrees. Attached Figure Description

[0035] This application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote similar structures, wherein:

[0036] Figure 1 This is a structural block diagram of an acoustic input / output device according to some embodiments of this application;

[0037] Figure 2A and Figure 2B This is a schematic diagram of the structure of an acoustic input / output device according to some embodiments of this application;

[0038] Figure 3 This is a cross-sectional schematic diagram of a portion of the structure of an acoustic input / output device according to some embodiments of this application;

[0039] Figure 4 This is a simplified schematic diagram of vibration transmission in an acoustic input / output device according to some embodiments of this application;

[0040] Figure 5 This is a schematic diagram of another mechanical vibration transmission model of an acoustic input / output device according to some embodiments of this application;

[0041] Figure 6 This is another structural schematic diagram of vibration transmission of an acoustic input / output device according to some embodiments of this application;

[0042] Figure 7 This is a schematic diagram illustrating the calculation and generation of electrical signals by a two-axis microphone according to some embodiments of this application;

[0043] Figure 8 It is an intensity curve diagram of the second signal and the first signal shown in some embodiments of this application;

[0044] Figure 9 This is yet another intensity curve of the second signal and the first signal shown in some embodiments of this application;

[0045] Figure 10 This is a cross-sectional schematic diagram showing the connection between the bone conduction microphone and the vibration damping structure according to some embodiments of this application;

[0046] Figure 11 This is a cross-sectional schematic diagram of an acoustic input / output device with a vibration damping structure according to some embodiments of this application;

[0047] Figure 12 This is a cross-sectional schematic diagram of an acoustic input / output device according to some embodiments of this application;

[0048] Figure 13 This is a cross-sectional schematic diagram of an acoustic input / output device according to some embodiments of this application;

[0049] Figure 14 This is a cross-sectional schematic diagram of an acoustic input / output device having two air-conducting loudspeaker assemblies, according to some embodiments of this application;

[0050] Figure 15 This is yet another cross-sectional schematic diagram of an acoustic input / output device having two air-conducting loudspeaker assemblies, according to some embodiments of this application;

[0051] Figure 16 This is a schematic diagram of the structure of a headset according to some embodiments of this application;

[0052] Figure 17 This is a schematic diagram of the structure of a single-ear headphone according to some embodiments of this application;

[0053] Figure 18 This is a cross-sectional schematic diagram of a binaural over-ear headphone according to some embodiments of this application;

[0054] Figure 19 This is a schematic diagram of the structure of a pair of glasses according to some embodiments of this application. Detailed Implementation

[0055] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. It should be understood that these exemplary embodiments are given merely to enable those skilled in the art to better understand and implement the present invention, and are not intended to limit the scope of the present invention in any way. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0056] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. The term "based on" means "at least partially based on." The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment." Definitions of other terms will be given in the following description. Hereinafter, without loss of generality, the terms "bone conduction microphone," "bone conduction microphone assembly," "bone conduction speaker," "bone conduction speaker assembly," or "bone conduction headphones" will be used in describing bone conduction-related technologies of the present invention. The terms "air conduction microphone," "air conduction microphone assembly," "air conduction speaker," "air conduction speaker assembly," or "air conduction headphones" will be used in describing air conduction-related technologies of the present invention. This description represents only one form of bone conduction application. For those skilled in the art, "device" or "earphone" can be replaced with other similar terms, such as "player" or "hearing aid." In fact, the various implementations of this invention can be readily applied to other non-speaker devices. For example, those skilled in the art, after understanding the basic principles of the device, can make various formal and detailed modifications and changes to the specific methods and steps of implementing the device without departing from these principles. In particular, adding environmental sound pickup and processing functions to the device enables it to function as a hearing aid. For example, a bone conduction microphone or other microphone can pick up sounds from the user's / wearer's surroundings and, under a certain algorithm, process the sound (or generate electrical signals) and transmit it to the speaker assembly. That is, the bone conduction microphone can be modified to include the function of picking up environmental sounds, and after certain signal processing, transmit the sound to the user / wearer through the speaker assembly, thereby achieving the function of a hearing aid. As an example, the algorithms mentioned here may include one or more combinations of noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active noise cancellation, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, and volume control.

[0057] Figure 1 This is a structural block diagram of an acoustic input / output device according to some embodiments of this application. For example... Figure 1 As shown, the acoustic input / output device 100 may include a speaker assembly 110, a microphone assembly 120, and a fixing assembly 130.

[0058] The loudspeaker assembly 110 can be used to convert a signal containing sound information into an acoustic signal (also referred to as a speech signal). For example, the loudspeaker assembly 110 can generate mechanical vibrations in response to receiving a signal containing sound information to transmit sound waves (i.e., an acoustic signal). For ease of description, the mechanical vibration generated by the loudspeaker assembly 110 can be referred to as a first mechanical vibration. In some embodiments, the loudspeaker assembly may include a vibrating element and / or a transmission element connected to the vibrating element (e.g., at least a portion of the housing of the acoustic input / output device 100, a transducer). The generation of the first mechanical vibration by the loudspeaker assembly 110 is accompanied by energy conversion, and the loudspeaker assembly 110 can realize the conversion of a signal containing sound information into mechanical vibration. The conversion process may involve the coexistence and conversion of multiple different types of energy. For example, an electrical signal (i.e., a signal containing sound information) can be directly converted into the first mechanical vibration by a transducer in the vibrating element of the loudspeaker assembly 110, and the first mechanical vibration is transmitted through the transmission element of the loudspeaker assembly 110 to transmit sound waves. As another example, the sound information may be contained in an optical signal, and a specific transducer can realize the process of converting the optical signal into a vibration signal. Other energy types that can coexist and be converted during the operation of a transducer include thermal energy and magnetic field energy. The energy conversion methods of a transducer can include moving-coil, electrostatic, piezoelectric, moving-iron, pneumatic, and electromagnetic types.

[0059] The speaker assembly 110 may include an air-conducting speaker assembly and / or a bone-conducting speaker assembly. In some embodiments, the speaker assembly 110 may include a vibrating element and a housing. In some embodiments, when the speaker assembly 110 is a bone-conducting speaker assembly, the housing of the speaker assembly 110 may be used to contact a part of the user's body (e.g., the face) and transmit the first mechanical vibration generated by the vibrating element via the bones to the auditory nerve, enabling the user to hear sound, and to house the vibrating element and microphone assembly 120 as at least a portion of the acoustic input / output device 100. In some embodiments, when the speaker assembly 110 is an air-conducting speaker assembly, the vibrating element can change the air density by pushing the air to vibrate, thereby enabling the user to hear sound, and the housing may house the vibrating element and microphone assembly 120 as at least a portion of the acoustic input / output device 100. In some embodiments, the speaker assembly 110 and the microphone assembly 120 may be located within different housings.

[0060] A vibrating element can convert a sound signal into a mechanical vibration signal, thereby generating a first mechanical vibration. In some embodiments, the vibrating element (i.e., the transducer) may include a magnetic circuit assembly. The magnetic circuit assembly can provide a magnetic field. The magnetic field can be used to convert a signal containing sound information into a mechanical vibration signal. In some embodiments, the sound information may include video or audio files with a specific data format, or data or files that can be converted into sound through a specific means. The signal containing sound information may originate from the storage component of the acoustic input / output device 100 itself, or from an information generation, storage, or transmission system outside the acoustic input / output device 100. The signal containing sound information may include one or more combinations of electrical signals, optical signals, magnetic signals, mechanical signals, etc. The signal containing sound information may originate from one or more signal sources. Multiple signal sources may be correlated or uncorrelated. In some embodiments, the acoustic input / output device 100 may acquire the signal containing sound information in a variety of different ways, and the acquisition of the signal may be wired or wireless, or real-time or delayed. For example, the acoustic input / output device 100 may receive an electrical signal containing sound information via wired or wireless means, or it may directly acquire data from a storage medium to generate a sound signal. For example, the acoustic input / output device 100 may include a component with sound acquisition capabilities (e.g., an air conduction microphone assembly) that picks up ambient sound, converts the mechanical vibrations of the sound into electrical signals, and processes these signals through an amplifier to obtain electrical signals that meet specific requirements. In some embodiments, the wired connection may include a metal cable, an optical cable, or a hybrid cable of metal and optics, such as coaxial cable, communication cable, flexible cable, spiral cable, non-metallic sheathed cable, metallic sheathed cable, multi-core cable, twisted pair cable, ribbon cable, shielded cable, telecommunication cable, two-strand cable, parallel two-core conductor, twisted pair, and one or more combinations thereof. The examples described above are for illustrative purposes only; the medium for the wired connection may also be other types, such as other carriers for transmitting electrical or optical signals.

[0061] Wireless connectivity can include radio communication, free-space optical communication, acoustic communication, and electromagnetic induction. Radio communication can include IEEE 802.11 series standards, IEEE 802.15 series standards (such as Bluetooth and cellular technologies), first-generation mobile communication technologies, second-generation mobile communication technologies (such as FDMA, TDMA, SDMA, CDMA, and SSMA), General Packet Radio Service technologies, third-generation mobile communication technologies (such as CDMA2000, WCDMA, TD-SCDMA, and WiMAX), fourth-generation mobile communication technologies (such as TD-LTE and FDD-LTE), satellite communication (such as GPS), near-field communication (NFC), and other technologies operating in the ISM band (such as 2.4 GHz). Free-space optical communication can include visible light and infrared signals. Acoustic communication can include sound waves and ultrasonic signals. Electromagnetic induction can include near-field communication technologies. The examples described above are for illustrative purposes only; the medium for wireless connectivity can also be other types, such as Z-wave technology, other paid civilian radio bands, and military radio bands. For example, as one application scenario of this technology, the acoustic input / output device 100 can acquire signals containing sound information from other acoustic input / output devices via Bluetooth technology.

[0062] Microphone assembly 120 can be used to pick up sound signals (also referred to as speech signals) and convert them into signals containing sound information (e.g., electrical signals). For example, microphone assembly 120 picks up the mechanical vibrations generated when a speech signal source provides a speech signal and converts them into electrical signals. For ease of description, the mechanical vibrations generated when a user provides a speech signal can be referred to as second mechanical vibrations. In some embodiments, microphone assembly 120 may include one or more microphones. In some embodiments, microphones can be classified into bone conduction microphones and / or air conduction microphones based on their operating principles. For ease of description, a bone conduction microphone will be used as an example in one or more embodiments of this application. It should be noted that the bone conduction microphone in one or more embodiments of this application can also be replaced by an air conduction microphone.

[0063] A bone conduction microphone can be used to collect any mechanical vibrations (e.g., a first mechanical vibration and a second mechanical vibration) transmitted through the user's bones, skin, or other tissues that can be sensed by the bone conduction microphone. The received mechanical vibrations cause corresponding mechanical vibrations (e.g., a third mechanical vibration and a fourth mechanical vibration) in the internal components (e.g., the microphone diaphragm) of the bone conduction microphone 120, which are then converted into electrical signals containing speech information (e.g., a first signal and a second signal). The first signal can be understood as the echo signal generated by the bone conduction microphone; the second signal can be understood as the speech signal generated by the bone conduction microphone. An air conduction microphone can collect mechanical vibrations (i.e., sound waves) transmitted through the air and convert them into signals containing sound information (e.g., electrical signals). For example, if the speaker assembly 110 includes an air conduction speaker, the air conduction microphone can receive the echo signal transmitted by the air conduction speaker (transmitted via air conduction). As another example, if the speaker assembly 110 includes a bone conduction speaker, the air conduction microphone can simultaneously receive the mechanical vibrations transmitted by the bone conduction speaker and the echo signal transmitted by the bone conduction speaker through the air conduction path. In some embodiments, the microphone assembly 120 may include a microphone diaphragm and other electronic components. Mechanical vibrations from the speech signal source, transmitted to the microphone diaphragm, cause corresponding mechanical vibrations in the diaphragm. The electronic components can convert the mechanical vibration signal into a signal containing speech information (e.g., an electrical signal). In some embodiments, the microphone assembly 120 may include, but is not limited to, a ribbon microphone, a microelectromechanical system (MEMS) microphone, a dynamic microphone, a piezoelectric microphone, a condenser microphone, a carbon microphone, an analog microphone, a digital microphone, or any combination thereof. For example, a bone conduction microphone may include an omnidirectional microphone, a unidirectional microphone, a bidirectional microphone, a cardioid microphone, or any combination thereof.

[0064] In some embodiments, when the speaker assembly 110 and the microphone assembly 120 operate simultaneously, the microphone assembly 120 can sense a first mechanical vibration generated by the speaker assembly 110 and a second mechanical vibration generated by the voice signal source. In response to the first mechanical vibration, the microphone assembly 120 can generate a third mechanical vibration and convert the third mechanical vibration into a first signal. In response to the second mechanical vibration, the microphone assembly 120 can generate a fourth mechanical vibration and convert the fourth mechanical vibration into a second signal. In some embodiments, the speaker assembly 110 can be referred to as an echo signal source. In some embodiments, when the speaker assembly 110 and the microphone assembly 120 operate simultaneously, within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal. The frequency range may include 200Hz to 10kHz, or 200Hz to 5000Hz, or 200Hz to 2000Hz, or 200Hz to 1000Hz, etc.

[0065] The fixing component 130 can support the speaker assembly 110 and the microphone assembly 120. In some embodiments, the fixing component 130 may include an arc-shaped elastic member capable of generating a force that rebounds towards the center of the arc to achieve stable contact with the human skull. In some embodiments, the fixing component 130 may include one or more connectors. One or more connectors can connect the speaker assembly 110 and / or the microphone assembly 120. In some embodiments, the fixing component 130 can be worn in both ears. For example, each end of the fixing component 130 can be fixedly connected to two sets of speaker assemblies 110. When a user wears the acoustic input / output device 100, the fixing component 130 can fix the two sets of speaker assemblies 110 near the user's left and right ears, respectively. In some embodiments, the fixing component 130 can also be worn in one ear. For example, the fixing component 130 can be fixedly connected to only one set of speaker assemblies 110. When a user wears the acoustic input / output device 100, the fixing component 130 can fix the speaker assembly 110 near one ear of the user. In some embodiments, the fixing component 130 may be any combination of one or more of eyeglasses (e.g., sunglasses, augmented reality glasses, virtual reality glasses), helmets, headbands, etc., without limitation herein.

[0066] The above description of the acoustic input / output device structure is merely a specific example and should not be considered the only feasible implementation. Obviously, those skilled in the art, after understanding the basic principles of the acoustic input / output device 100, may make various modifications and changes in form and detail to the specific methods and steps of implementing the acoustic input / output device 100 without departing from these principles; however, these modifications and changes are still within the scope of the above description. For example, the acoustic input / output device 100 may include one or more processors that can execute one or more audio signal processing algorithms. Audio signal processing algorithms can modify or enhance audio signals. For example, they can perform noise reduction, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environmental recognition, active noise cancellation, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, or other similar or any combination thereof. These modifications and changes are still within the scope of protection of the claims of this invention. As another example, the acoustic input / output device 100 may include one or more sensors, such as temperature sensors, humidity sensors, speed sensors, displacement sensors, etc. These sensors can collect user information or environmental information.

[0067] Figure 2A and Figure 2B This is a schematic diagram of the acoustic input / output device shown in some embodiments of this application. (In conjunction with...) Figure 2A and Figure 2BAs shown, in some embodiments, the acoustic input / output device 200 can be an ear-clip earphone, which may include an earphone core 210, a fixing assembly 230, a control circuit 240, and a battery 250. The earphone core 210 may include a speaker assembly (not shown) and a microphone assembly (not shown). The fixing assembly may include an ear hook 231, an earphone housing 232, a circuit housing 233, and a back hook 234. The earphone housing 232 and the circuit housing 233 may be respectively disposed at both ends of the ear hook 231, and the back hook 234 may be further disposed at the end of the circuit housing 233 furthest from the ear hook 231. The earphone housing 232 can be used to accommodate different earphone cores. The circuit housing 233 can be used to accommodate the control circuit 260 and the battery 270. The two ends of the back hook 234 can be respectively connected to the corresponding circuit housing 233. The ear hook 231 can refer to the structure that hangs the ear clip-on headphones on the user's ears when the user wears the acoustic input / output device 200, and fixes the headphone shell 232 and the headphone core 210 at a predetermined position relative to the user's ears.

[0068] In some embodiments, the ear hook 231 may include a flexible metal wire. The flexible metal wire can be configured to maintain the shape of the ear hook 231 in accordance with the user's ear and has a certain degree of elasticity, allowing it to undergo elastic deformation according to the user's ear and head shape when the user wears the clip-on headphones, thus adapting to users with different ear and head shapes. In some embodiments, the flexible metal wire may be made of a shape-memory alloy with good deformation recovery capability. Even if the ear hook 231 is deformed by external force, it may return to its original shape when the external force is removed, thereby extending the lifespan of the clip-on headphones. In some embodiments, the flexible metal wire may also be made of a non-shape-memory alloy. Conductors may be provided in the flexible metal wire to establish an electrical connection between the headphone core 210 and other components (e.g., control circuitry 260, battery 270, etc.) to provide power and data transmission to the headphone core 210. In some embodiments, the ear hook 231 may also include a protective sleeve 236 and a housing protector 237 integrally formed with the protective sleeve 236.

[0069] In some embodiments, the earphone housing 232 may be configured to receive the earphone core 210. The earphone core 210 may include one or more speaker assemblies and / or one or more microphone assemblies. The one or more speaker assemblies may include bone conduction speaker assemblies, air conduction speaker assemblies, etc. The one or more microphone assemblies may include bone conduction microphone assemblies, air conduction microphone assemblies, etc. For details regarding the structure and arrangement of the speaker assemblies and microphone assemblies, please refer to descriptions elsewhere in this application, for example... Figure 3-15 And its detailed description. There can be two earphone cores 210 and earphone shells 232, which can correspond to the user's left ear and right ear respectively.

[0070] In some embodiments, the ear hook 231 and the earphone housing 232 may be molded separately and then assembled together, rather than being molded together directly.

[0071] In some embodiments, the earphone housing 232 may be provided with a contact surface 2321. The contact surface 2321 may contact the user's skin. When using clip-on headphones, sound waves generated by one or more bone conduction speakers of the earphone core 210 can be transferred outside the earphone housing 232 through the contact surface 2321 (e.g., to the user's eardrum). In some embodiments, the material and thickness of the contact surface 2321 may affect the propagation of bone conduction sound waves to the user, thereby affecting sound quality. For example, if the material of the contact surface 2321 is highly elastic, the transmission of bone conduction sound waves in the low-frequency range may be better than that in the high-frequency range. Conversely, if the material of the contact surface 2321 is less elastic, the transmission of bone conduction sound waves in the high-frequency range may be better than that in the low-frequency range. It should be noted that the earphone housing 232 in this embodiment, as well as the housing in other embodiments of this application, are used to refer to the parts of the acoustic input / output device 200 that come into contact with the user.

[0072] Figure 3 This is a cross-sectional schematic diagram of a portion of the structure of an acoustic input / output device shown in some embodiments of this application. For example... Figure 3 As shown, in some embodiments, the acoustic input / output device 300 may include a speaker assembly 310, which can be used to transmit sound waves by generating a first mechanical vibration; and a bone conduction microphone 320, which can be used to receive a second mechanical vibration generated when a speech signal source provides a speech signal. In some embodiments, the acoustic input / output device 300 may also include a fixing component 330, such as... Figure 3As shown, the fixing component 330 is fixedly connected to the speaker component 310. When the user wears the acoustic input / output device 300, the speaker component 310 and the bone conduction microphone 320 are kept in contact with the user's face 340. In some embodiments, when the bone conduction microphone 320 and the speaker component 310 operate simultaneously, the bone conduction microphone 320 can receive a first mechanical vibration and a second mechanical vibration, generate a third mechanical vibration and a fourth mechanical vibration under the action of the first and second mechanical vibrations respectively, and convert the third mechanical vibration and the fourth mechanical vibration into a first signal and a second signal respectively. In some embodiments, within a certain frequency range, the ratio of the intensity of the first mechanical vibration to the intensity of the first signal is greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal. As described herein, the third mechanical vibration can also be referred to as the first mechanical vibration received by the bone conduction microphone 320, i.e., the echo signal received by the bone conduction microphone 320; the fourth mechanical vibration can also be referred to as the second mechanical vibration received by the bone conduction microphone 320, i.e., the speech signal received by the bone conduction microphone 320. In some embodiments, the frequency range may include 200Hz to 10kHz. In some embodiments, the frequency range may include 200Hz to 9000Hz. In some embodiments, the frequency range may include 200Hz to 8000Hz. In some embodiments, the frequency range may include 200Hz to 6000Hz. In some embodiments, the frequency range may include 200Hz to 5000Hz.

[0073] The speaker assembly 310 transmits sound waves by generating a first mechanical vibration, enabling the user to hear sound. The speaker assembly 310 transmits sound waves via air conduction and bone conduction. Air conduction corresponds to an air conduction speaker assembly, which propagates sound waves in the form of waves through the air. These sound waves are transmitted to the auditory nerve via the user's tympanic membrane, ossicles, and cochlea, allowing the user to hear sound. Bone conduction corresponds to a bone conduction speaker assembly, which transmits mechanical vibrations to the user's facial skin and bones through contact with the user's face 340 (e.g., the housing 350 of the bone conduction speaker assembly contacts the user's face 340), and then to the auditory nerve via the bones, enabling the user to hear sound. Regardless of whether it is a bone conduction or air conduction speaker assembly, a bone conduction microphone 320 is directly or indirectly connected to the speaker assembly 310. Specifically, when the speaker assembly 310 is a bone conduction speaker assembly, the housing 350 is one of the vibration transmission elements of the bone conduction speaker assembly. The vibration element in the bone conduction speaker assembly needs to be directly or indirectly connected to the housing 350 to transmit vibrations to the user's skin and bones. The bone conduction microphone 320 needs to be directly or indirectly connected to the housing 350 to collect vibrations generated when the user speaks. When the bone conduction speaker transmits sound waves, it causes mechanical vibration in the housing 350, which in turn transmits the mechanical vibration to the bone conduction microphone 320. After receiving the mechanical vibration, the bone conduction microphone 320 generates a corresponding third mechanical vibration and, based on the third mechanical vibration, generates a first signal containing sound information. When the speaker assembly 310 is an air conduction speaker assembly, the housing 350 is used to house the air conduction speaker assembly and the bone conduction microphone 320, essentially serving as the outer shell of the acoustic input / output device 300. The vibration element in the air conduction speaker assembly can be directly or indirectly connected to the housing 350 to fix the air conduction speaker assembly. In summary, the bone conduction microphone 320 needs to be directly or indirectly connected to the housing 350 to collect vibrations generated when the user speaks. When the air conduction speaker transmits sound waves, it will cause mechanical vibration of the housing 350. The housing 350 will then transmit the mechanical vibration to the bone conduction microphone 320. After receiving the mechanical vibration, the bone conduction microphone 320 will generate a corresponding third mechanical vibration and generate a first signal containing sound information based on the third mechanical vibration.

[0074] Therefore, at least a portion of the first mechanical vibration generated by the speaker assembly 310 is transmitted to the bone conduction microphone 320, causing the bone conduction microphone 320 to generate a third mechanical vibration. In addition to the first mechanical vibration transmitted by the speaker assembly 310, the bone conduction microphone 320 can receive a second mechanical vibration (e.g., vibration of skin and bones) generated when the user speaks through contact with the user's face 340, causing the bone conduction microphone 320 to generate a fourth mechanical vibration.

[0075] When the bone conduction microphone 320 and the speaker assembly 310 operate simultaneously, for example, when the bone conduction microphone 320 receives a speech signal (e.g., by picking up vibrations of the skin or other parts of the body when a person speaks), and the speaker assembly 310 transmits a speech signal (e.g., music) through vibration, the bone conduction microphone 320 will simultaneously receive a first mechanical vibration and a second mechanical vibration. The microphone diaphragm of the bone conduction microphone 320 (not shown in the figure) will generate a third mechanical vibration and a fourth mechanical vibration corresponding to the first and second mechanical vibrations, respectively, and will convert the third and fourth mechanical vibrations into a first signal and a second signal, respectively. When the microphone diaphragm generates a third mechanical vibration in response to the picked-up first mechanical vibration, the bone conduction microphone 320 will receive speech information transmitted by the first mechanical vibration other than the speech information transmitted by the second mechanical vibration, thereby affecting the quality of the sound signal picked up by the microphone. For ease of description, the signal transmitted by the first mechanical vibration can be referred to as an echo signal (or a secondary speech signal), and the components that generate and transmit the first mechanical vibration (e.g., the speaker assembly 310, the housing 350) can be referred to as an echo signal source (or a secondary speech signal source). The second mechanical vibration can be called a speech signal (or main speech signal), and the component that generates and transmits the second mechanical vibration (e.g., the user's vocal cords, nasal cavity, mouth, etc.) can be called a speech signal source (or main speech signal source). Figure 3 The vibration directions of the speech signal source, echo signal source, and bone conduction microphone are shown. Arrow A points to the direction of the first mechanical vibration, which is also the vibration direction of the echo signal source; arrow B points to the direction of the bone conduction microphone, which is also the direction of the third and fourth mechanical vibrations; and arrow C points to the direction of the second mechanical vibration, which is also the vibration direction of the speech signal source.

[0076] For the reasons mentioned above, it is necessary to design the acoustic input / output device 300 to reduce the intensity of the echo signal (i.e., the intensity of the first signal) generated by the bone conduction microphone 320. Furthermore, while reducing the intensity of the echo signal generated by the bone conduction microphone 320, the intensity of the speech signal (i.e., the intensity of the second signal) generated by the bone conduction microphone 320 can be increased. This achieves the goal of reducing the intensity of the first signal and increasing the intensity of the second signal, making the ratio of the intensity of the first mechanical vibration to the intensity of the first signal greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal, thereby improving the quality of the sound signal generated by the bone conduction microphone.

[0077] Figure 4 This is a schematic diagram of vibration transmission in an acoustic input / output device as shown in some embodiments of this application. (In conjunction with...) Figure 3 and Figure 4As shown, when the bone conduction microphone 320 and speaker assembly 310 in the acoustic input / output device 300 operate simultaneously, the mechanical vibration transmission model of the acoustic input / output device 300 can be equivalent to... Figure 4 The model shown is as follows. Specifically, the intensity of the mechanical vibration (i.e., the second mechanical vibration) of the voice signal source 360 ​​(e.g., the user's bones or vocal cords) is L1; the intensity of the mechanical vibration (i.e., the first mechanical vibration) of the echo signal source 380 (e.g., the speaker assembly 310) is L2; ​​the bone conduction microphone 320 and the voice signal source 360 ​​can be connected by a first elastic connection 370, with an elastic coefficient of k1; the bone conduction microphone 320 and the echo signal source 380 can be connected by a second elastic connection 390, with an elastic coefficient of k2; the mass of the bone conduction microphone 320 is m. The first elastic connection 370 between the voice signal source 360 ​​and the bone conduction microphone 320 may include contact parts between the bone conduction microphone 320 and the user's face 340 (e.g., a vibration transmission layer, a metal sheet, a portion of the housing 350, etc.), the user's skin, etc. The second elastic connection 390 between the bone conduction microphone 320 and the echo signal source 380 is part of the acoustic input / output device 300. For example, if the bone conduction microphone 320 and the echo source 380 can be physically connected to the housing 350 simultaneously, then the second elastic connection 390 may include the housing 350. As another example, if the bone conduction microphone 320 and the echo source 380 can be physically connected to the housing 350 separately via connectors, then the second elastic connection 390 may include the housing 350 and the connectors. Figure 4 In the illustrated embodiment, it can be assumed that the vibration direction of the voice signal source 360 ​​is parallel to the vibration direction of the bone conduction microphone 320, and the vibration direction of the echo signal source 380 is parallel to the vibration direction of the bone conduction microphone 320. The bone conduction microphone can receive the vibrations of the voice signal source 360 ​​and the echo signal source 380 to the greatest extent. The vibration direction of the bone conduction microphone 320 can be understood as the direction of the microphone diaphragm vibration.

[0078] according to Figure 4 The intensity L of the mechanical vibration received by the bone conduction microphone 320 can be obtained as follows:

[0079]

[0080] Where L1 is the intensity of the second mechanical vibration received by the bone conduction microphone 320 (i.e., the fourth mechanical vibration intensity), L2 is the intensity of the first mechanical vibration received (i.e., the third mechanical vibration intensity), and m is the mass of the bone conduction microphone 320. ω is the angular frequency of the signal, which includes speech signals and / or echo signals. This can represent the effect of L1 (i.e., the second mechanical vibration) on L; This can represent the effect of L2 (i.e., the first mechanical vibration) on L.

[0081] Therefore, it can be concluded that the larger the elastic coefficient k1 of the first elastic connection 370, the greater the influence of the vibration intensity L1 of the voice signal source 360 ​​on the intensity L of the mechanical vibration received by the bone conduction microphone 320; the smaller the elastic coefficient k2 of the second elastic connection 390, the smaller the influence of the vibration intensity L2 of the echo signal source 380 on the intensity L of the mechanical vibration received by the bone conduction microphone 320, and the smaller the echo signal received by the bone conduction microphone 320.

[0082] Based on formula (1), it can be seen that in order to reduce the echo signal received by the bone conduction microphone 320, the acoustic input and output devices can be designed from multiple aspects. For example, L1 and / or k1 can be increased as much as possible, and L2 and / or k2 can be decreased as much as possible, so as to increase the influence of L1 on L and decrease the influence of L2 on L, thereby improving the quality of the sound signal generated by the bone conduction microphone.

[0083] Figure 5 This is a schematic diagram of another mechanical vibration transmission model of the acoustic input / output device shown in some embodiments of this application. For example... Figure 5 As shown, in some embodiments, the bone conduction microphone 520 can be a single-axis bone conduction microphone. The microphone diaphragm of a single-axis bone conduction microphone can only vibrate in one direction; that is, the microphone diaphragm can only convert mechanical vibrations in that direction into electrical signals (e.g., a first signal). For example, with... Figure 5 For example, the vibration direction of the bone conduction microphone 520 is vertical. When the direction of mechanical vibration is parallel to the vibration direction of the bone conduction microphone 520 (i.e., both vertical), the microphone diaphragm can convert the received mechanical vibration into electrical signals (e.g., the first signal and the second signal) to the greatest extent possible. This maximization of the conversion of received mechanical vibration into electrical signals can be understood as meaning that almost all mechanical vibrations, excluding losses caused by resistance (e.g., some loss occurs when mechanical vibration is transmitted via the first elastic connection 570 and the second elastic connection 590), can be received by the microphone diaphragm and converted into electrical signals. When the direction of mechanical vibration is perpendicular to the vibration direction of the bone conduction microphone 520 (i.e., horizontal), only a small portion of the received mechanical vibration can be converted into electrical signals by the microphone diaphragm. Therefore, the intensity of the electrical signal is minimal. In other words, when the vibration direction of the bone conduction microphone 520 is perpendicular to the direction of mechanical vibration, the intensity of the electrical signal generated by the bone conduction microphone 520 is minimal, and the intensity of the generated sound signal is also minimal.

[0084] Based on the above principles, in some embodiments, the mounting position of the bone conduction microphone 520 can be designed such that the vibration direction of the bone conduction microphone 520 is aligned with the echo signal source 580 (e.g., Figure 3 The vibration direction (i.e., the first mechanical vibration direction) of the speaker assembly 310 shown is within a certain angular range to reduce the intensity of the first signal generated by the bone conduction microphone 520, that is, to reduce the intensity of the echo signal generated by the bone conduction microphone 520. Further, in some embodiments, the vibration direction of the bone conduction microphone 520 is aligned with that of the speech signal source 560 (e.g., Figure 3 The vibration direction of the user's face (340) shown is within a certain angle range to increase the intensity of the second signal generated by the bone conduction microphone 520, that is, to increase the intensity of the voice signal generated by the bone conduction microphone 520.

[0085] Figure 6 This is another structural schematic diagram of the vibration transmission of the acoustic input / output device shown in some embodiments of this application. For example... Figure 6 As shown, in some embodiments, the vibration direction of the bone conduction microphone 620 is opposite to that of the echo source 680 (e.g., Figure 3 The angle formed by the vibration direction of the speaker assembly 310 shown can be a first angle α. In some embodiments, the first angle α can be in the range of 20 degrees to 90 degrees. In some embodiments, the first angle α can be in the range of 45 degrees to 90 degrees. In some embodiments, the first angle α can be in the range of 60 degrees to 90 degrees. In some embodiments, the first angle α can be in the range of 75 degrees to 90 degrees. In some embodiments, the first angle α can be 90 degrees. In this embodiment, within the range of 20 degrees to 90 degrees, the larger the angle α of the first angle, the closer the vibration direction of the microphone diaphragm is to being perpendicular to the vibration direction of the echo signal source 680, and the smaller the intensity of the first signal converted by the microphone diaphragm. When the first angle α is 90 degrees, the intensity of the first signal converted by the microphone diaphragm is the smallest, that is, the intensity of the echo signal generated by the bone conduction microphone 620 is the smallest.

[0086] In some embodiments, according to formula (1), the greater the influence of the vibration intensity L1 of the voice signal source 660 on the intensity L of the mechanical vibration received by the bone conduction microphone 620, that is, the greater the vibration intensity L1 of the voice signal source 660 received by the bone conduction microphone 620, the greater the influence of the vibration intensity L2 of the echo signal source 680 on the intensity L of the mechanical vibration received by the bone conduction microphone 620. In some embodiments, in order to increase the influence of the vibration intensity L1 of the voice signal source 660 on the sound signal L generated by the bone conduction microphone 620, the angle between the vibration direction of the bone conduction microphone 620 and the vibration direction of the voice signal source 660 can be designed to be within a certain range. The angle between the vibration direction of the bone conduction microphone 620 and the vibration direction of the voice signal source 660 can be a second angle β. In some embodiments, the second angle β can be within the angle range of 0 degrees to 85 degrees. In some embodiments, the second angle β can be within the angle range of 0 degrees to 75 degrees. In some embodiments, the second angle β can be within the angle range of 0 degrees to 60 degrees. In some embodiments, the second angle β can be within the angle range of 0 degrees to 45 degrees. In some embodiments, the second included angle β can be in the range of 0 degrees to 30 degrees. In some embodiments, the second included angle β can be in the range of 0 degrees to 15 degrees. In some embodiments, the second included angle β can be in the range of 0 degrees to 5 degrees. In some embodiments, the second included angle β can be 0 degrees, that is, the vibration direction of the bone conduction microphone 620 is parallel to the vibration direction of the voice signal source 660. In this embodiment, within the range of 0 degrees to 90 degrees, the smaller the angle of the second included angle β, the closer the vibration direction of the microphone diaphragm is to being parallel to the vibration direction of the voice signal source 660, and the greater the intensity of the second signal converted by the microphone diaphragm. When the second included angle β is 0 degrees, the intensity of the first signal converted by the microphone diaphragm is the greatest, and at this time the intensity of the second signal generated by the bone conduction microphone 620 is the greatest, that is, the intensity of the generated voice signal is the greatest. As described herein, the included angle between two directions refers to the smallest positive angle formed by the intersection of the straight lines containing the two directions.

[0087] It should be noted that the scheme of controlling the first included angle α within a set angle range and the scheme of controlling the second included angle β within a set angle range can be combined. In some embodiments, the first included angle α can be set to 90 degrees and the second included angle β can be set to 30 degrees. In some embodiments, the first included angle α can be set to 90 degrees and the second included angle β can be set to 45 degrees. In some embodiments, the first included angle α can be set to 90 degrees and the second included angle β can be set to 60 degrees. In some embodiments, the first included angle α can be set to 45 degrees and the second included angle β can be set to 30 degrees. In some embodiments, the first included angle α can be set to 90 degrees and the second included angle β can be set to 15 degrees. When the first included angle α is set to 90 degrees and the second included angle β is set to 0 degrees, Figure 6 and Figure 5 The same applies. In this embodiment, the bone conduction microphone 620 can convert the vibrations received from the voice signal source 660 into a second signal to the greatest extent possible, and the intensity of the first signal generated is minimized, thereby improving the quality of the sound signal generated by the bone conduction microphone 620.

[0088] Figure 8 These are intensity curves of the second signal and the first signal shown in some embodiments of this application. Figure 8 The bone conduction microphone based on Figure 4 The intensity curves 810 and 820 of the first signal converted from the mechanical vibration (i.e., the first mechanical vibration) generated by the echo signal source 380 and the mechanical vibration (i.e., the second mechanical vibration) generated by the speech signal source 360 ​​are shown, where the horizontal axis represents frequency and the vertical axis represents sound intensity. In some embodiments, Figure 8 The intensity curves of the first and second signals shown were obtained when the first included angle α was 0 degrees and the second included angle β was also 0 degrees. Combined with... Figure 3 , Figure 4 and Figure 8 It can be observed that within a frequency range of approximately 0–500 Hz, the intensity of the first signal generated by the bone conduction microphone 320 is less than the intensity of the second signal. However, when the frequency exceeds 500 Hz, for example, within the frequency range of 500 Hz–10000 Hz, the intensity of the first signal generated by the bone conduction microphone 320 is greater than the intensity of the second signal, resulting in a larger echo generated by the bone conduction microphone 320. Therefore, the intensity of the echo signal generated by the bone conduction microphone 320 can be reduced by designing the mounting position of the bone conduction microphone 320 and the speaker assembly 310.

[0089] For example, Figure 9 This is yet another intensity curve of the first and second signals shown in some embodiments of this application. For example... Figure 9 As shown, in this embodiment, the bone conduction microphone 620 and the echo source 680 (e.g., Figure 3 The position of the speaker assembly 310 shown is designed such that the first included angle α is 90 degrees and the second included angle β is 60 degrees. From the intensity curves 810 and 910 of the first signal, and 820 and 920 of the second signal, it can be seen that after the above design (i.e., adjusting the first included angle α and the second included angle β), the intensity of the first signal generated by the bone conduction microphone 620 is significantly reduced (e.g., ...). Figure 9(As shown). Meanwhile, the above design results in a very small or negligible reduction in the intensity of the second signal generated by the bone conduction microphone 620. The reduction in the intensity of the first signal generated by the bone conduction microphone 620 is significantly smaller than the reduction in the intensity of the first signal, making the ratio of the intensity of the first mechanical vibration to the intensity of the first signal greater than the ratio of the intensity of the second mechanical vibration to the intensity of the second signal. In some embodiments, after adopting the above design, the intensity of the first signal generated by the bone conduction microphone 620 is relatively small in the frequency range of 0–800 Hz, compared to… Figure 8 In addition, the strength of the first signal generated by the bone conduction microphone 620 is smaller in a wider low frequency range, that is, the strength of the echo signal generated by the bone conduction microphone 620 is smaller, thereby enabling users to hear clearer voice signals, effectively improving sound quality and user experience.

[0090] In some embodiments, by designing the positions of the bone conduction microphone 620 and the echo source 680 (e.g., speaker assembly 310), the decrease in the intensity of the second signal is significantly less than the decrease in the intensity of the first signal. This results in the ratio of the intensity of the second signal to the intensity of the first signal being greater than a threshold, increasing the proportion of the speech signal in the sound signal generated by the bone conduction microphone 620, making the speech signal clearer and providing a better user experience. In some embodiments, the ratio of the intensity of the second signal to the intensity of the first signal can be greater than 1 / 4. In some embodiments, the ratio of the intensity of the second signal to the intensity of the first signal can be greater than 1 / 3. In some embodiments, the ratio of the intensity of the second signal to the intensity of the first signal can be greater than 1 / 2. In some embodiments, the ratio of the intensity of the second signal to the intensity of the first signal can be greater than 2 / 3.

[0091] It should be noted that the microphone assembly (e.g., increasing the size by adjusting the first and second angles) described in one or more of the foregoing embodiments is... Figure 3 The scheme for reducing the intensity of the echo signal received by the microphone assembly 320 shown can also be applied to air conduction microphones.

[0092] In some embodiments, the uniaxial bone conduction microphone is used for illustrative purposes only. In addition, bone conduction microphones (e.g., Figure 3 The bone conduction microphone 320 shown can also be other types of microphones, such as a two-axis microphone, a three-axis microphone, a vibration sensor, an accelerometer, etc.

[0093] Continue to refer to Figure 3 and Figure 4In some embodiments, the bone conduction microphone 320 can be a biaxial microphone, meaning that the bone conduction microphone 320 can convert received mechanical vibrations in two directions into electrical signals. For example, Figure 7 This is a schematic diagram illustrating the calculation of electrical signals generated by a two-axis microphone according to some embodiments of this application. In some embodiments, the two directions may have a certain angle (i.e., a third angle). The angle range of the third angle is 0 degrees to 90 degrees. Figure 7 As shown, the two directions are represented by the X-axis and the Y-axis, with the X-axis perpendicular to the Y-axis. The angle between the echo source 380 and the X-axis of the bone conduction microphone is α(e), and the angle between the speech source 360 ​​and the X-axis of the bone conduction microphone is β(s). The echo signal (i.e., the first mechanical vibration) generated by the echo source 380 is e(t), and the speech signal (i.e., the second mechanical vibration) generated by the speech source 360 ​​is s(t). Therefore, the vibration components of the echo source 380 and the speech source 360 ​​on the X-axis of the bone conduction microphone are:

[0094] x(t)=e(t)cos(α(e))+s(t)cos(β(s)), (2)

[0095] The vibration components of the echo signal source 380 and the voice signal source 360 ​​on the Y-axis of the bone conduction microphone are:

[0096] y(t)=e(t)sin(α(e))+s(t)sin(β(s)), (3)

[0097] The echo signal of the bone conduction microphone 320 can be eliminated by weighting the vibration components x(t) of the echo source 380 and the voice source 360 ​​on the X-axis of the bone conduction microphone and the vibration components y(t) of the echo source 380 and the voice source 360 ​​on the Y-axis of the bone conduction microphone. The total sound signal of the bone conduction microphone 320 is then:

[0098] out(t)=x(t)sin(α(e))-y(t)cos(α(e))=s(t)sin(α(e)-β(s)), (4)

[0099] The weighting coefficients for the vibration components x(t) of the echo source 380 and the speech source 360 ​​on the X-axis of the bone conduction microphone are sin(α(e)) and -cos(α(e)). In some embodiments, the angle α(e) between the echo source 380 and the X-axis of the bone conduction microphone can be obtained during the assembly of the acoustic input / output device. In some embodiments, α(e) can be obtained through the following process, including determining whether the current signal of the bone conduction microphone 320 has a speech signal s(t); when the current signal does not have a speech signal s(t), the magnitude of α(e) is obtained by the following formulas (5)-(7).

[0100] x(t)=e(t)cos(α(e)), (5)

[0101] y(t)=e(t)sin(α(e)), (6)

[0102] According to formulas (5) and (6), we can obtain:

[0103]

[0104] In some embodiments, x(t) and y(t) can be weighted and then α(e) can be obtained according to formula (7). In some embodiments, after solving α(e) according to formula (9), a more stable estimate of α(e) can be obtained by smoothing α(e) over time.

[0105] In some embodiments, the bone conduction microphone 320 can also be a triaxial microphone. For example, the microphone can have an X-axis, a Y-axis, and a Z-axis, and the sound signal generated by the triaxial microphone can be calculated based on the weighted sum of the components of the speech signal s(t) and the echo signal e(t) on the X-axis, Y-axis, and Z-axis of the bone conduction microphone. Since the principle of calculating the sound signal generated by the triaxial microphone is similar to that of the biaxial microphone, it will not be described in detail here.

[0106] In some embodiments, the vibration direction of the echo source 380 may not be a single direction; for example, the vibration direction of the echo source 380 may diffuse along an arc trajectory. In this case, vibrations generated by the echo source 380 that are not perpendicular to the vibration direction of the bone conduction microphone 320 can be received by the bone conduction microphone 320 and converted into a first signal, i.e., generating an echo signal. Therefore, in some embodiments, the speaker assembly 310 and the bone conduction microphone 320 can be designed such that the position between the bone conduction microphone 320 and the speaker assembly 310 (e.g., housing 350) is relatively fixed to reduce the vibrations transmitted by the echo source 380 received by the bone conduction microphone 320.

[0107] In some embodiments, in addition to designing the first included angle α and the second included angle β, the purpose of reducing echo can also be achieved by changing the elastic coefficient k1 of the first elastic connection 370 and the elastic coefficient k2 of the second elastic connection 390.

[0108] In some embodiments, the intensity of the first mechanical vibration (i.e. the third mechanical vibration) received by the bone conduction microphone 320 can be reduced by decreasing the elastic strength k2 of the second elastic connection 390 between the bone conduction microphone 320 and the echo signal source 380.

[0109] Figure 10 This is a cross-sectional schematic diagram showing the connection between the bone conduction microphone and the vibration damping structure in some embodiments of this application. Figure 11 This is a cross-sectional schematic diagram of an acoustic input / output device with a vibration damping structure, as shown in some embodiments of this application. (Combined with...) Figure 10 and Figure 11 As shown, the acoustic input / output device 1000 may include a bone conduction microphone 1020 and a speaker assembly 1010. The bone conduction microphone 1020 and the speaker assembly 1010 may be housed in the same housing. In some embodiments, the acoustic input / output device 1000 may further include a vibration damping structure 1100, through which the bone conduction microphone 1020 can be connected to the speaker assembly 1010. When the bone conduction microphone 1020 and the speaker assembly 1010 operate simultaneously, the speaker assembly 1010 can transmit speech signals (sound waves) through a first mechanical vibration, and the bone conduction microphone 1020 can receive or transmit a second mechanical vibration generated when a speech signal source provides a speech signal to pick up the speech signal. The first mechanical vibration of the speaker assembly 1010 can be transmitted to the bone conduction microphone 1020 through the vibration damping structure 1100, and the bone conduction microphone 1020 can generate a third and a fourth mechanical vibration under the action of the first and second mechanical vibrations. The vibration damping structure 1100 can reduce the intensity of the first mechanical vibration received by the bone conduction microphone 1020 from the speaker assembly 1010 (echo signal source), thereby reducing the intensity of the first signal generated by the bone conduction microphone 1020.

[0110] The vibration damping structure 1100 can refer to a structure with a certain degree of elasticity, which reduces the intensity of mechanical vibration transmitted from the echo signal source 1080 through its elasticity. In some embodiments, the vibration damping structure 1100 can be an elastic member to reduce the intensity of transmitted mechanical vibration. The elasticity of the vibration damping structure 1100 can be determined by various factors such as the material, thickness, and structure of the vibration damping structure.

[0111] In some embodiments, the vibration damping structure 1100 may be made of a vibration damping material with an elastic modulus less than a first threshold. In some embodiments, the first threshold may be 5000 MPa. In some embodiments, the first threshold may be 4000 MPa. In some embodiments, the first threshold may be 3000 MPa. In some embodiments, the elastic modulus of the vibration damping material may be in the range of 0.01 MPa to 1000 MPa. In some embodiments, the elastic modulus of the vibration damping material may be in the range of 0.015 MPa to 2500 MPa. In some embodiments, the elastic modulus of the vibration damping material may be in the range of 0.02 MPa to 2000 MPa. In some embodiments, the elastic modulus of the vibration damping material may be in the range of 0.025 MPa to 1500 MPa. In some embodiments, the elastic modulus of the vibration damping material may be in the range of 0.03 MPa to 1000 MPa. In some embodiments, the vibration damping material may include, but is not limited to, foam, plastics (e.g., but not limited to, high molecular weight polyethylene, blown nylon, engineering plastics, etc.), rubber, silicone, etc. In some embodiments, the vibration damping material may be foam.

[0112] In some embodiments, the vibration damping structure 1100 may have a certain thickness. (Refer to...) Figure 10 As shown, the thickness of the vibration damping structure 1100 can be understood as the dimension in any one of the X-axis, Y-axis, or Z-axis directions. In some embodiments, the thickness of the vibration damping structure 1100 can be in the range of 0.5 mm to 5 mm. In some embodiments, the thickness of the vibration damping structure 1100 can be in the range of 1 mm to 4.5 mm. In some embodiments, the thickness of the vibration damping structure 1100 can be in the range of 1.5 mm to 4 mm. In some embodiments, the thickness of the vibration damping structure 1100 can be in the range of 2 mm to 3.5 mm. In some embodiments, the thickness of the vibration damping structure 1100 can be in the range of 2 mm to 3 mm.

[0113] In some embodiments, the elasticity of the damping structure 1100 can be provided through its structural design. For example, the damping structure 1100 can be an elastic structure, providing elasticity even if the material used to make the damping structure 1100 has high stiffness. In some embodiments, the damping structure 1100 may include, but is not limited to, a spring-like structure, a ring-shaped structure, or a ring-like structure.

[0114] In some embodiments, the surface of the bone conduction microphone 1020 may include a first portion 1021 and a second portion 1022. The first portion 1021 may be used to contact the user's face 1040 to conduct a second mechanical vibration provided by a speech signal source. The second portion 1022 may be used to connect to other components of the acoustic input / output device 1000 (e.g., to a speaker assembly 1010). The second portion 1022 may be provided with a vibration damping structure 1100 and then connected to the speaker assembly 1010 through the vibration damping structure 1100. In this embodiment, the vibration damping structure 1100 disposed between the speaker assembly 1010 and the bone conduction microphone 1020 has a certain elasticity, which can reduce the first mechanical vibration transmitted by the speaker assembly 1010 and reduce the intensity of the first mechanical vibration received by the bone conduction microphone 1020, thereby making the echo signal generated by the bone conduction microphone 1020 smaller. Furthermore, the reason why a vibration damping structure 1100 is not provided in the first part 1021 is because the first part 1021 of the surface of the bone conduction microphone 1020 is in contact with the user's face 1040 to conduct the second mechanical vibration. For example, the first part 1021 could be the side close to the microphone diaphragm. The second mechanical vibration represents the voice signal provided by the voice signal source, so it is important to ensure that the second mechanical vibration is not weakened as much as possible. Specifically, in conjunction with... Figure 10 and Figure 11 As shown, the vibration damping structure 1100 can surround the second portion 1022 of the surface of the bone conduction microphone 1020 and leave the first portion 1021 open so that the first portion 1021 can directly contact the user's face 1040.

[0115] In some embodiments, the vibration damping structure 1100 can be adhesively attached to the second portion 1022 on the surface of the bone conduction microphone. In some embodiments, the vibration damping structure 1100 can also be fixed to the bone conduction microphone 1020 by welding, snap-fitting, riveting, threaded connection (e.g., connection by screws, bolts, threaded rods, bolts, etc.), clamp connection, pin connection, wedge key connection, or integral molding.

[0116] In some embodiments, a vibration transmission layer 1023 may be provided on the first portion 1021 of the surface of the bone conduction microphone 1020. Since the bone conduction microphone 1020 has high rigidity, if the first portion 1021 directly contacts the user's face 1040, it may cause discomfort to the user and reduce the user experience. After providing the vibration transmission layer 1023 on the first portion 1021, the tactile sensation when in contact with the user is better, which can effectively improve the user experience.

[0117] In some embodiments, the vibration transmission layer 1023 needs to maintain a certain degree of elasticity to reduce the loss of the second mechanical vibration during transmission and to ensure a good tactile feel when the user wears the acoustic input / output device 1000. In some embodiments, if the elastic modulus of the material of the vibration transmission layer 1023 is too small, it indicates that the material of the vibration transmission layer 1023 has low elasticity, which will weaken the intensity of the second mechanical vibration. Therefore, in some embodiments, the elastic modulus of the material used to make the vibration transmission layer 1023 can be greater than a second threshold. In some embodiments, the second threshold can be 0.01 MPa. In some embodiments, the second threshold can be 0.015 MPa. In some embodiments, the second threshold can be 0.02 MPa. In some embodiments, the second threshold can be 0.025 MPa. In some embodiments, the second threshold can be 0.03 MPa. In some embodiments, the elastic modulus of the vibration transmission layer 1023 can be in the range of 0.03 MPa to 3000 MPa. In some embodiments, the elastic modulus of the vibration transmission layer 1023 can be in the range of 5 MPa to 2000 MPa. In some embodiments, the elastic modulus of the vibration transmission layer 1023 can be in the range of 10 MPa to 1500 MPa. In some embodiments, the elastic modulus of the vibration transmission layer 1023 can be in the range of 10 MPa to 1000 MPa. In some embodiments, the material used to make the vibration transmission layer 1023 can be silicone (the elastic modulus of silicone is 10 MPa), rubber, or plastic (the elastic modulus of plastic is 1000 MPa).

[0118] In some embodiments, the loss of the second mechanical vibration during transmission can be reduced by decreasing the thickness of the vibration transmission layer 1023. When the vibration transmission layer 1023 is thinner, even if the elastic modulus of the material used to make the vibration transmission layer 1023 is low, the intensity of the second mechanical vibration will not be significantly reduced. In some embodiments, the thickness of the vibration transmission layer 1023 may be less than 30 mm. In some embodiments, the thickness of the vibration transmission layer 1023 may be less than 25 mm. In some embodiments, the thickness of the vibration transmission layer 1023 may be less than 20 mm. In some embodiments, the thickness of the vibration transmission layer 1023 may be less than 15 mm. In some embodiments, the thickness of the vibration transmission layer 1023 may be less than 10 mm. In some embodiments, the thickness of the vibration transmission layer 1023 may be less than 5 mm. In some embodiments, the vibration transmission layer 1023 may be made of rubber or silicone with a thickness of 5 mm, ensuring a good tactile feel while also ensuring the intensity of the second mechanical vibration received by the bone conduction microphone 1020.

[0119] It should be noted that the above-described embodiments of the acoustic input / output device 1000 are applicable to both bone conduction speaker assemblies and air conduction speaker assemblies. For example, when it is a bone conduction speaker assembly, the housing 1050 can be part of the bone conduction speaker assembly, and the bone conduction microphone 1020 can be connected to the housing of the bone conduction speaker assembly through a vibration damping structure 1100. When it is an air conduction speaker assembly, both the air conduction speaker assembly and the bone conduction microphone 1020 can be connected to the housing (e.g., the diaphragm is connected to the housing, and the bone conduction microphone 1020 is connected to the housing), and a vibration damping structure is also provided between the bone conduction microphone 1020 and the housing.

[0120] In some embodiments, the intensity of the second mechanical vibration (i.e., the fourth mechanical vibration) received by the bone conduction microphone can be increased by increasing the clamping force on the acoustic input / output device 1000 in contact with the user. It is understood that the closer the contact between the acoustic input / output device 1000 and the user (e.g., the user's face 1040), the less the second mechanical vibration is lost during transmission. However, if the clamping force on the acoustic input / output device 1000 is too large, the user will experience pain, resulting in a poor user experience. Therefore, the clamping force needs to be controlled within a certain range. In some embodiments, when the speaker assembly 1010 is an air-conduction speaker assembly, i.e., the acoustic input / output device 1000 transmits sound signals to the user through the air-conduction speaker assembly and receives the user's voice signals through the bone conduction microphone 1020, the clamping force can be set in the range of 0.001N to 0.3N. In some embodiments, the clamping force can be set in the range of 0.0025N to 0.25N. In some embodiments, the clamping force can be set in the range of 0.005N to 0.15N. In some embodiments, the clamping force can be set in the range of 0.0075N to 0.1N. In some embodiments, the clamping force can be set in the range of 0.01N to 0.05N. In some embodiments, since the bone conduction speaker assembly transmits the mechanical vibration generated by the vibrating element through the housing to the user's face so that the user can hear the sound, the clamping force is different when the speaker assembly 1010 is a bone conduction speaker assembly. For example, when the speaker assembly 1010 of the acoustic input / output device 1000 includes a bone conduction speaker assembly, if the clamping force is too small, the intensity of the mechanical vibration transmitted to the user by the bone conduction speaker assembly will also be too small, that is, the volume of the sound transmitted to the user by the acoustic input / output device 1000 will be too low. Therefore, in order to ensure the intensity of the mechanical vibration received by the user, in some embodiments, when the speaker assembly 1010 of the acoustic input / output device 1000 includes a bone conduction speaker assembly, it is necessary to set the clamping force within a certain range. In some embodiments, the clamping force can be set in the range of 0.01N to 2.5N. In some embodiments, the clamping force can be set in the range of 0.025N to 2N. In some embodiments, the clamping force can be set in the range of 0.05N to 1.5N. In some embodiments, the clamping force can be set in the range of 0.075N to 1N. In some embodiments, the clamping force can be set in the range of 0.1N to 0.5N.

[0121] In some embodiments, the speaker assembly 1010 and the bone conduction microphone 1020 may be directly connected; for example, the bone conduction microphone 1020 may be directly connected to and housed within the housing 1050 of the speaker assembly 1010. In some embodiments, the bone conduction microphone and the speaker assembly may be indirectly connected.

[0122] Figure 12 This is a cross-sectional schematic diagram of an acoustic input / output device shown in some embodiments of this application. In some embodiments, the acoustic input / output device 1200 includes a speaker assembly 1210 and a bone conduction microphone 1220. The speaker assembly 1210 is a bone conduction speaker assembly. The speaker assembly 1210 may include a housing 1250 and a vibrating element 1211 connected to the housing 1250 for generating a first mechanical vibration in transmitting sound waves. The bone conduction microphone 1220 is connected to the housing 1250. Figure 12 As shown, the vibrating element 1211 may include a transducer 1213, a magnetic circuit assembly 1215, and a coil 1217 (or voice coil). The magnetic circuit assembly 1215 can be used to form a magnetic field, in which the coil 1217 can undergo mechanical vibration, thereby causing the transducer 1213 to vibrate. Specifically, when a signal current is passed through the coil 1217, the coil 1217 is in the magnetic field formed by the magnetic circuit assembly 1215 and undergoes mechanical vibration under the action of Ampere force. The vibration of the coil 1217 drives the transducer 1213 to produce mechanical vibration. Furthermore, the mechanical rotation of the transducer 1213 can be further transferred to the housing 1250, and then the housing 1250 contacts the user, allowing the user to hear the sound.

[0123] In some embodiments, the bone conduction microphone 1220 can be disposed at any position on the inner wall of the housing 1250, for example, disposed at... Figure 12 The lower inner wall of the housing 1250 is shown at the junction with the left inner wall. Alternatively, the inner wall on the lower side of the housing 1250 may not contact the left or right inner walls. The acoustic input / output device 1200 can be combined with one or more of the foregoing embodiments, for example, in... Figure 12 A vibration damping structure is provided between the bone conduction microphone 1220 and the housing 1250 to reduce the intensity of the first mechanical vibration received by the bone conduction microphone 1220.

[0124] Figure 13This is a cross-sectional schematic diagram of an acoustic input / output device according to some embodiments of this application. The acoustic input / output device 1300 includes a speaker assembly 1310 and a bone conduction microphone 1320. In some embodiments, the speaker assembly 1310 is an air-conduction speaker assembly, which may include a housing 1350 and a vibrating element 1311. The vibrating element 1311 may include a diaphragm 1313, a magnetic circuit assembly 1315, and a coil 1317. The magnetic circuit assembly 1315 can be used to generate a magnetic field, in which the coil 1317 can undergo mechanical vibration, thereby causing the diaphragm 1313 to vibrate. A first connection is provided between the housing 1350 and the vibrating element 1311. The first connection may include a first damping structure.

[0125] When the air-conducted loudspeaker assembly is in operation, the diaphragm 1313 will generate mechanical vibration, and because the diaphragm 1313 and the housing 1350 are directly connected (e.g., Figure 13 (As shown), therefore, the vibration of the diaphragm 1313 will cause mechanical vibration of the housing 1350. Figure 12 Unlike the bone conduction speaker assembly shown, the air conduction speaker assembly does not rely on the vibration of the housing 1350 to transmit sound waves. Instead, it relies on several sound-permeable holes (e.g., the first sound-permeable hole 1351 and the second sound-permeable hole 1352) formed on the housing to transmit sound waves to the user. Therefore, a first damping structure can be provided between the vibrating element 1311 and the housing 1350 to reduce the mechanical vibration of the housing 1350, thereby reducing the intensity of the mechanical vibration transmitted by the housing 1350 received by the bone conduction microphone 1320.

[0126] In some embodiments, the first vibration damping structure may be configured in the same way or similarly to the vibration damping structure 1100 in the foregoing embodiments. For example, the first vibration damping structure may be made with the same thickness, the same material, and the same structure as the vibration damping structure 1100. In some embodiments, the first vibration damping structure may be different from the vibration damping structure 1100. For example, the first vibration damping structure may be a strip-shaped member or a sheet-shaped member with a certain elasticity. The two ends of the strip-shaped member or sheet-shaped member are respectively connected to the diaphragm 1313 and the housing 1350 to reduce the intensity of the mechanical vibration transmitted from the diaphragm 1313 to the housing 1350. The first vibration damping structure may also be a ring-shaped member. The middle part of the ring-shaped member is connected to the diaphragm, and the outer side of the ring-shaped member is connected to the housing 1350, which can also reduce the intensity of the mechanical vibration transmitted from the diaphragm 1313 to the housing 1350.

[0127] Continue to refer to Figure 13 In some embodiments, a second connection may be included between the housing 1350 and the bone conduction microphone 1320. The second connection may include a second damping structure. The second damping structure can reduce the intensity of mechanical vibrations (i.e., third mechanical vibrations) transmitted to the bone conduction microphone 1320 via the housing 1350.

[0128] In some embodiments, the bone conduction microphone 1320 and the speaker assembly 1310 may be respectively disposed in different areas of the acoustic input / output device, and a second damping structure is provided between the housing 1350 of the bone conduction microphone 1320 and the speaker assembly 1310. In some embodiments, the bone conduction microphone 1320 may be separately disposed in other areas of the acoustic input / output device, and then connected to the housing 1350 via the second damping structure. Figure 17 In the illustrated embodiment, the acoustic input / output device 1700 is a monoearthable headphone. A bone conduction microphone 1720 and a speaker assembly 1710 are respectively housed in two earcups 1731 on either side of a fixing assembly 1730, and then connected via the fixing assembly 1730. Figure 17 In the illustrated embodiment, the second connection includes a fixing component 1730 and earmuffs 1731 disposed on both sides of the fixing component 1730. A second vibration damping structure can be provided on the fixing component 1730 and the earmuffs 1731. For example, a layer of vibration damping material can be applied over the fixing component 1730 as the second vibration damping structure. Another example is... Figure 18 In the illustrated embodiment, the acoustic input / output device 1800 is a binaural headset. A foam sleeve 1833 is provided on the earcups 1831, and a bone conduction microphone 1820 is disposed within the foam sleeve 1833, connected to the housing 1850 of the speaker assembly 1810 via the foam sleeve 1833. In this embodiment, the foam sleeve 1833 can function as a second vibration damping structure, reducing the intensity of the first mechanical vibration transmitted to the bone conduction microphone 1820. For a detailed description of the second vibration damping structure, please refer to other embodiments of this application (such as...). Figure 17 , Figure 18 and Figure 19 (The embodiments are described in detail here.)

[0129] The above-described embodiments regarding the second vibration damping structure are applicable not only to air-conducting speaker assemblies but also to bone-conducting speaker assemblies. For example, Figure 17 , Figure 18 The speaker assembly in the illustrated embodiment can be replaced with Figure 12 The bone conduction speaker assembly shown. Figure 17 For example, the bone conduction speaker assembly and the bone conduction microphone 1720 are respectively disposed inside the two earmuffs 1731, and a layer of damping material can still be fitted on the fixing assembly 1730 as a second damping structure.

[0130] It should be noted that when a bone conduction microphone is like... Figure 13 As shown, when the bone conduction microphone is directly connected to the housing and is positioned inside the housing, the second vibration damping structure is the same as the vibration damping structure in the aforementioned embodiment. For more details, please refer to [link to relevant documentation]. Figure 10 and Figure 11 The relevant details will not be elaborated here.

[0131] refer to Figure 13 As shown, in some embodiments, the mechanical vibration intensity of the housing 1350 can be reduced not only by adding a first damping structure between the vibrating element 1311 and the housing 1350, but also by other means. In some embodiments, the impact of the vibrating element 1311 on the housing 1350 during vibration can be reduced by decreasing the mass of the vibrating element 1311, thereby reducing the mechanical vibration intensity of the housing 1350. The vibrating element 1311 may include a diaphragm 1313, and the mechanical vibration of the housing 1350 is caused by the vibration of the diaphragm 1313. If the mass of the vibrating element 1311 (e.g., the diaphragm 1313) is small, then the impact of the vibrating element 1311 on the housing 1350 during vibration will be smaller, and the intensity of the mechanical vibration generated by the housing 1350 will be smaller. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.001g to 1g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.002g to 0.9g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.003g to 0.8g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.004g to 0.7g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.005g to 0.6g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.005g to 0.5g. In some embodiments, the mass of the diaphragm 1313 can be controlled within the range of 0.005g to 0.3g.

[0132] Similarly, if the mass of the housing 1350 is much greater than the mass of the diaphragm 1313, then the mechanical vibration of the diaphragm 1313 will have a smaller impact on the housing 1350. Therefore, in some embodiments, the mechanical vibration intensity of the housing 1350 can be reduced by increasing the mass of the housing 1350. In some embodiments, the mass of the housing 1350 can be controlled within the range of 2g to 20g. In some embodiments, the mass of the housing 1350 can be controlled within the range of 3g to 15g. In some embodiments, the mass of the housing 1350 can be controlled within the range of 4g to 10g. In some embodiments, the ratio of the mass of the housing 1350 to the mass of the diaphragm 1313 can be controlled such that the mass of the housing 1350 is much greater than the mass of the diaphragm 1313, thereby reducing the impact of the mechanical vibration of the diaphragm 1313 on the housing 1350. In some embodiments, the ratio of the mass of the housing 1350 to the mass of the diaphragm 1313 can be controlled within the range of 10 to 100. In some embodiments, the ratio of the mass of the housing 1350 to the mass of the diaphragm 1313 can be controlled within the range of 15 to 80. In some embodiments, the mass ratio of the housing 1350 to the diaphragm 1313 can be controlled within the range of 20 to 60. In some embodiments, the mass ratio of the housing 1350 to the diaphragm 1313 can be controlled within the range of 25 to 50. In some embodiments, the mass ratio of the housing 1350 to the diaphragm 1313 can be controlled within the range of 30 to 50.

[0133] Figure 14 This is a cross-sectional schematic diagram of an acoustic input / output device having two air-conducting speaker assemblies, as shown in some embodiments of this application. Figure 15 This is a cross-sectional schematic diagram of another acoustic input / output device having two air-conducting loudspeaker assemblies, as shown in some embodiments of this application. Figure 14 and Figure 15 In the embodiments shown, the speaker assemblies are all air-conducting speaker assemblies. For example... Figure 14 As shown, in some embodiments, the loudspeaker assembly 1410 may include a first vibrating element 1411 and a second vibrating element 1412. The first vibrating element 1411 includes a first diaphragm 1413, a first magnetic circuit assembly 1415, and a first coil 1417. The second vibrating element 1412 includes a second diaphragm 1414, a second magnetic circuit assembly 1416, and a second coil 1418 (or voice coil). In some embodiments, the vibration directions of the first diaphragm 1413 and the second diaphragm 1414 are opposite. For example, Figure 14The vibration directions of the first diaphragm 1413 and the second diaphragm 1414 at a certain moment are shown, wherein the vibration direction of the first diaphragm 1413 is from top to bottom, and the vibration direction of the second diaphragm 1414 is from bottom to top. Since the sound heard by the user does not originate from vibrations felt by the user's bones, skin, etc., but rather from the first diaphragm 1413 and the second diaphragm 1414 changing the air density by pushing the air to vibrate, thus allowing the user to hear the sound, the intensity of the mechanical vibration (i.e., the third mechanical vibration) transmitted by the bone conduction microphone (not shown) received by the bone conduction microphone can be reduced by decreasing the intensity of the mechanical vibration (i.e., the first mechanical vibration) of the housing 1450 and the components connected to the housing 1450 (i.e., the echo source), thereby reducing the intensity of the first signal generated by the bone conduction microphone. Furthermore, the speaker assembly 1410 also includes a second diaphragm 1414 whose vibration direction is opposite to that of the first diaphragm 1413. The air-conducting loudspeaker assembly includes two diaphragms. The mechanical vibration generated by the first diaphragm 1413 causes the housing 1450 to vibrate, and the mechanical vibration generated by the second diaphragm 1414 also causes the housing 1450 to vibrate. Since the vibration directions of the first diaphragm 1413 and the second diaphragm 1414 are opposite, the two mechanical vibrations generated on the housing cancel each other out, thereby reducing the intensity of the mechanical vibration on the housing. In some embodiments, the two diaphragms may be components within the same air-conducting loudspeaker assembly. In other embodiments, the acoustic input / output device 1400 may include a first air-conducting loudspeaker assembly and a second air-conducting loudspeaker assembly, with the first diaphragm 1413 and the second diaphragm 1414 being components within the first and second air-conducting loudspeaker assemblies, respectively. Figure 14 In the embodiment shown, there are two air-conducting loudspeaker assemblies located in different areas of the housing 1450. Each air-conducting loudspeaker assembly includes a diaphragm, a magnetic circuit assembly, and a coil.

[0134] In some embodiments, the housing 1450 may include a first cavity 1455 and a second cavity 1456, and a first diaphragm 1413 and a second diaphragm 1414 may be located in the first cavity 1455 and the second cavity 1456, respectively. The housing 1450 may include a first portion corresponding to the first cavity 1455 and a second portion corresponding to the second cavity 1456. The sidewall of the first cavity 1455 (i.e., the sidewall of the first portion of the housing 1450) may have a first sound-permeable hole 1451 and a second sound-permeable hole 1452. In some embodiments, the first sound-permeable hole 1451 and the second sound-permeable hole 1452 may be provided on different sidewalls of the first portion of the housing 1450. In some embodiments, the first sound-permeable hole 1451 and the second sound-permeable hole 1452 may be provided on non-adjacent sidewalls of the first portion of the housing 1450, that is, the first sound-permeable hole 1451 and the second sound-permeable hole 1452 may be provided on opposite sides of the first portion of the housing 1450 (e.g., ...). Figure 14 (As shown).

[0135] The sidewall of the second cavity 1456 (i.e., the sidewall of the second part of the housing 1450) may be provided with a third sound-permeable hole 1453 and a fourth sound-permeable hole 1454. In some embodiments, the third sound-permeable hole 1453 and the fourth sound-permeable hole 1454 may be provided on different sidewalls of the second part of the housing 1450. In some embodiments, the third sound-permeable hole 1453 and the fourth sound-permeable hole 1454 may be provided on non-adjacent sidewalls of the second part of the housing 1450, that is, the third sound-permeable hole 1453 and the fourth sound-permeable hole 1454 may be provided on opposite sides of the second part of the housing 1450 (e.g., ...). Figure 14 (As shown).

[0136] like Figure 14As shown, in some embodiments, the first sound-permeable hole 1451 and the third sound-permeable hole 1453 can be located on the same side of the housing 1450. The second sound-permeable hole 1452 and the fourth sound-permeable hole 1454 can be located on the same side of the housing 1450, so that the sound phase emitted by the first sound-permeable hole 1451 is the same as the sound phase emitted by the third sound-permeable hole 1453, and the sound phase emitted by the second sound-permeable hole 1452 is the same as the sound phase emitted by the fourth sound-permeable hole 1454. In this embodiment, the housing 1450 is divided into two non-communicating cavities, namely the first cavity 1455 and the second cavity 1456, and the first air-conducting speaker assembly (or the first vibrating element 1411) and the second air-conducting speaker assembly (or the second vibrating element 1412) are located in the two cavities respectively. The first cavity 1455 can be divided into a front cavity and a rear cavity by the first diaphragm 1413, and the second cavity 1456 can be divided into a front cavity and a rear cavity by the second diaphragm 1414. The first sound-permeable hole 1451 and the third sound-permeable hole 1453 can be equivalent to the front sound-permeable holes of the first cavity 1455 and the second cavity 1456. The second sound-permeable hole 1452 and the fourth sound-permeable hole 1454 can be equivalent to the rear sound-permeable holes of the first cavity 1455 and the second cavity 1456. When the sound phases of the front sound-permeable holes of the first cavity 1455 and the second cavity 1456 are the same, and the sound phases of the rear sound-permeable holes are also the same, the sound phases emitted by the two diaphragms are the same, so the volume of air conduction will not be reduced.

[0137] In some embodiments, when the number of diaphragms in the speaker assembly 1410 is multiple, the structure of the speaker assembly 1410 can be adjusted to reduce the overall size.

[0138] like Figure 15 As shown, in some embodiments, the loudspeaker assembly 1510 may include a first resonant element 1511 and a second resonant element 1512. The first resonant element 1511 includes a first diaphragm 1513, a first magnetic circuit assembly 1515, and a first coil 1517. Similarly, the second resonant element 1512 also includes a second diaphragm 1514, a second magnetic circuit assembly 1516, and a second coil 1518 (or voice coil). The first cavity 1555 and the second cavity 1556 may be connected. The first magnetic circuit assembly 1515 and the second magnetic circuit assembly 1516 are connected as a whole to reduce the space occupied by the entire loudspeaker assembly 1510.

[0139] In some embodiments, the first air-conducting speaker assembly and the second air-conducting speaker assembly may be two identical speakers. In some embodiments, the first air-conducting speaker assembly and the second air-conducting speaker assembly may be two different speakers. For example, in an acoustic input / output device 1500, a first air-conducting speaker assembly and a second air-conducting speaker assembly are included, wherein the first air-conducting speaker assembly may serve as the main speaker, primarily generating the sound signal heard by the user. The second air-conducting speaker assembly may serve as an auxiliary speaker. By adjusting the intensity of the mechanical vibration of the auxiliary speaker, it generates a force on the housing 1550 opposite to that of the main speaker, thereby reducing the vibration intensity of the housing 1550. In some embodiments, the speaker assembly 1510 may include a main speaker and an auxiliary device for generating vibrations on the housing 1550 opposite to the vibration direction of the main speaker. In some embodiments, the auxiliary device may be a vibration motor, which can generate vibrations on the housing 1550 opposite to the vibration direction of the main speaker, thereby reducing the vibration intensity of the housing 1550. In some embodiments, the intensity of the mechanical vibration generated by the auxiliary speaker may be adjustable. Specifically, the speaker assembly 1510 may include an auxiliary speaker control device. This device can acquire the intensity and direction of the mechanical vibration of the main speaker, and adjust the intensity and direction of the mechanical vibration generated by the auxiliary speaker based on the intensity and direction of the main speaker's mechanical vibration. This allows the force exerted by the auxiliary speaker on the housing to cancel out the force exerted by the main speaker on the housing 1550, thereby reducing the vibration of the housing 1550. Furthermore, it can reduce the vibration transmitted from the housing 1550 to the bone conduction microphone 1520, thereby reducing the vibration of the bone conduction microphone (…). Figure 15 The intensity of the echo signal generated (not shown in the image).

[0140] It should be noted that the implementation of setting the vibration directions of the two diaphragms in opposite directions can be combined with one or more of the foregoing embodiments. For example, in an embodiment where the vibration directions of the two diaphragms are set in opposite directions, a second damping structure can be provided between the first diaphragm (e.g., first diaphragm 1413) and the housing (e.g., housing 1450) and between the second diaphragm (e.g., second diaphragm 1414) and the housing 1450 to reduce the mechanical vibration received by the housing 1450, thereby reducing the intensity of the first mechanical vibration received by the bone conduction microphone.

[0141] In some embodiments, the speech signal source can provide the vibrating parts of the user's speech signal. For example, when a user speaks, the vibration intensity of their vocal cords, mouth, nasal cavity, and larynx is significantly higher than that of their ears and eyes; therefore, these parts can serve as speech signal sources. In some embodiments, the bone conduction microphone 1920 can be designed such that it is located near at least one of the user's mouth, nasal cavity, or vocal cords. For example, when the acoustic input / output device 1900 is... Figure 19 When using the glasses shown, the bone conduction microphone 1920 can be placed in the nose bridge 1935 of the glasses. Because the bone conduction microphone 1920 is close to the user's nose bridge, the intensity of the received mechanical vibration is greater. Figure 19 Further description of the glasses shown can be found in other embodiments of this application, and will not be repeated here. Figure 19 As shown, in some embodiments, the acoustic input / output device 1900 can be configured such that when a user wears the acoustic input / output device 1900, the distance between the bone conduction microphone 1920 and the user's vibrating part (not shown) is less than a third threshold. As described herein, taking the distance between the bone conduction microphone 1920 and the user's larynx as an example, in some embodiments, the third threshold can be 20 cm. In some embodiments, the third threshold can be 15 cm. In some embodiments, the third threshold can be 10 cm. In some embodiments, the third threshold can be 2 cm. In this embodiment, because the bone conduction microphone 1920 is closer to the user's vibrating part, the intensity of the received second mechanical vibration (i.e., the fourth mechanical vibration) is greater, and the intensity of the second signal generated by the bone conduction microphone 1920 is greater, which can effectively improve the speech signal strength.

[0142] Figure 16 This is a schematic diagram of the structure of a headset shown in some embodiments of this application. For example... Figure 16 As shown, in some embodiments, the acoustic input / output device 1600 can be a headset, including a fixing component 1630. The fixing component 1630 may include a headband 1632 and two earcups 1631 connected to both sides of the headband 1632. The headband 1632 can be used to fix the headset to the user's head and to fix the two earcups 1631 to both sides of the user's head. Each earcup 1631 may be provided with a bone conduction microphone 1620 and a speaker assembly 1610. In some embodiments, the bone conduction microphone 1620 may be located at any position in the earcup 1631. For example, the bone conduction microphone 1620 may be located at a position slightly above the earcup 1631. Another example is that the bone conduction microphone 1620 may be located at a position slightly below the earcup 1631 (e.g.,...). Figure 16As shown, when a user wears the acoustic input / output device 1600, the distance between the bone conduction microphone 1620 and the user's vibrating part can be shortened. In this embodiment, the bone conduction microphone 1620 is closer to the vibrating part of the user's body when speaking, which allows the intensity of the vibration (i.e., the fourth mechanical vibration) received by the bone conduction microphone 1620 when the user speaks to be greater, and the intensity of the second signal generated by the bone conduction microphone 1620 to be greater. This results in a larger ratio of the intensity of the second signal to the intensity of the fourth signal, a smaller proportion of echo signal in the sound signal generated by the bone conduction microphone, and a better user experience.

[0143] Figure 17 This is a schematic diagram of the structure of a single-ear over-ear headphone shown in some embodiments of this application. For example... Figure 17 As shown, in some embodiments, the acoustic input / output device 1700 can be a mono-ear headphone, meaning the bone conduction microphone 1720 and speaker assembly 1710 can be respectively disposed in two earcups 1731, with only one speaker assembly 1710 or one bone conduction microphone 1720 disposed in each earcup 1731. In this embodiment, since the bone conduction microphone 1720 and speaker assembly 1710 are respectively disposed in different earcups 1731, located on both sides of the user's head, the distance between the bone conduction microphone 1720 and speaker assembly 1710 is relatively large. Therefore, the intensity of the first mechanical vibration received by the bone conduction microphone 1720 from the speaker assembly 1710 is smaller, i.e., the intensity of the third mechanical vibration is even smaller, resulting in a smaller proportion of echo signal in the sound signal generated by the bone conduction microphone 1720, and a better user experience. In some embodiments, the headband 1732 may include one or more second damping structures (not shown) for reducing the intensity of the first mechanical vibration transmitted via the headband 1732. In some embodiments, the headband 1732 may be provided with foam to reduce the intensity of the first mechanical vibration transmitted from the speaker assembly 1710 to the bone conduction microphone 1720. In other embodiments, the headband 1732 may be made of a second damping material. The damping material may be the same as that in one or more of the foregoing embodiments; for example, the headband 1732 may be made of materials such as silicone or rubber.

[0144] In some embodiments, the bone conduction microphone 1720 or the speaker assembly 1710 may not be housed within the earcup 1731. For example, the bone conduction microphone may be located in... Figure 16 and Figure 17 Point D on the headband is shown, corresponding to the top of the user's head, while the speaker assembly is housed within the earcups. Alternatively, the speaker assembly could be positioned... Figure 16 and Figure 17 Point D on the headband is shown, corresponding to the top of the user's head, while the bone conduction microphone is located inside the earcups.

[0145] Figure 18 This is a cross-sectional schematic diagram of a binaural over-ear headphone shown in some embodiments of this application. (In conjunction with...) Figure 16 and Figure 18 As shown, in some embodiments, the acoustic input / output device 1800 can be a binaural headset, including a fixing component 1830. The fixing component 1830 may include a headband 1832 and two earcups 1831 connected to both sides of the headband 1832. Each earcup 1831 may have a foam sleeve 1833 on the side that contacts the user's face 1840, and the bone conduction microphone 1820 may be housed within the foam sleeve 1833. The foam sleeve 1833 effectively adds a vibration damping structure between the bone conduction microphone 1820 and the housing 1850 of the speaker assembly 1810, i.e., the second vibration damping structure in the aforementioned embodiments, reducing the intensity of the first mechanical vibration transmitted through the housing 1850 by the speaker assembly 1810. Furthermore, since the foam sleeve 1833 has high elasticity, it weakens the intensity of the second mechanical vibration transmitted through the user's face 1840. Therefore, in some embodiments, a portion of the surface of the foam sleeve 1833 may be provided with a vibration transmission structure with high stiffness. In some embodiments, the vibration transmission structure can be configured as a sheet-like member, such as a metal sheet or a plastic sheet (neither metal sheet nor plastic sheet is shown in the figures). In some embodiments, the outer side of the sheet-like member can contact the user's face 1840, and the inner side of the sheet-like member is connected to the bone conduction microphone 1820. In this embodiment, by using a sheet-like member with high stiffness to make the user's face 1840 contact the bone conduction microphone 1820, the loss of vibration (i.e., the second mechanical vibration) received by the bone conduction microphone 1820 when the user speaks is minimized during transmission, the intensity of the fourth mechanical vibration is increased, and thus the intensity of the voice signal generated by the bone conduction microphone 1820 is increased.

[0146] Figure 19 This is a schematic diagram of the structure of a pair of glasses shown in some embodiments of this application. For example... Figure 19As shown, in some embodiments, the acoustic input / output device 1900 can be a pair of eyeglasses with speaker and microphone functions. The eyeglasses can include a fixing component, which can be an eyeglass frame 1930. The eyeglass frame 1930 can include an eyeglass frame 1932 and two temples 1933. The temples 1933 can include temple bodies 1934 connected to the eyeglass frame 1932. At least one temple body 1934 can include a speaker assembly 1910 as described in the embodiments of this application above. In some embodiments, the speaker assembly 1910 can include a bone conduction speaker assembly. The bone conduction speaker assembly can be located in the part of the temple 1933 that will contact the user's skin. In some embodiments, the eyeglass frame 1932 can include a nose bridge 1935 for supporting the eyeglass frame 1932 above the user's nose. The nose bridge 1935 can be provided with a bone conduction microphone 1920 as described in the embodiments of this application above. The nasal cavity, as the vibrating part when the user provides a voice signal, has a relatively high intensity of mechanical vibration. The advantage of placing the bone conduction microphone inside the nose bridge 1935 is that, on the one hand, it can increase the intensity of the mechanical vibration of the voice signal received by the bone conduction microphone 1920, and on the other hand, since the bone conduction microphone 1920 and the speaker assembly 1910 are placed in different positions on the glasses, the intensity of the first mechanical vibration generated when the sound wave is transmitted by the speaker assembly 1910 received by the bone conduction microphone 1920 is smaller, and the echo signal generated by the bone conduction microphone 1920 is smaller.

[0147] It should be noted that the glasses described in the above embodiments can be various types of glasses, such as sunglasses, nearsighted glasses, and farsighted glasses. In some embodiments, the glasses can also be glasses with VR (Virtual Reality) or AR (Augmented Reality) functions.

[0148] The beneficial effects that the embodiments of this application may bring include, but are not limited to: (1) setting the first angle formed by the vibration direction of the bone conduction microphone and the vibration direction of the echo signal source within a set angle range, thereby reducing the intensity of the vibration of the echo signal source received by the bone conduction microphone and reducing the intensity of the generated echo signal (i.e., the first signal); (2) setting the second angle formed by the vibration direction of the bone conduction microphone and the vibration direction of the speech signal source within a set angle range, thereby increasing the intensity of the vibration of the speech signal source received by the bone conduction microphone and increasing the intensity of the generated speech signal (i.e., the second signal); (3) controlling the clamping force on the acoustic input / output device and the user contact part within a certain range, so that the bone conduction microphone (3) The closer the contact with the user, the higher the intensity of the vibration of the received voice signal source (i.e., the intensity of the fourth mechanical vibration); (4) A damping structure is added between the bone conduction microphone and the housing of the speaker assembly to reduce the intensity of the received speaker assembly vibration (i.e., the intensity of the third mechanical vibration); (5) A damping structure is added between the vibrating element of the speaker assembly and the housing to reduce the impact of the vibration of the vibrating element on the housing, thereby reducing the intensity of the mechanical vibration generated by the housing, and ultimately reducing the intensity of the vibration of the speaker assembly received by the bone conduction microphone; (6) The bone conduction microphone is set closer to the vibrating part when the user provides the voice signal to increase the intensity of the vibration of the received voice signal source. It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced can be any one or a combination of the above, or any other possible beneficial effects.

[0149] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0150] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0151] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this application are not intended to limit the order of the processes and methods of this application. Although some currently considered useful embodiments of the invention have been discussed in the foregoing disclosure by way of various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, while the system components described above can be implemented by hardware devices, they can also be implemented solely by software solutions, such as installing the described system on existing servers or mobile devices.

[0152] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0153] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with terms such as "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximate values, which may be changed according to the characteristics required by individual embodiments. In some embodiments, numerical data should take into account specified significant digits and employ general methods of digit reservation. Although the numerical ranges and data used to confirm their breadth in some embodiments of this application are approximate values, in specific embodiments, such numerical values ​​are set as precisely as feasible.

[0154] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.

Claims

1. An acoustic input output device, characterized by, include: A loudspeaker assembly for transmitting sound waves by generating a first mechanical vibration; as well as A microphone is used to receive a second mechanical vibration generated when a voice signal source provides a voice signal. The microphone generates a first signal and a second signal respectively under the action of the first mechanical vibration and the second mechanical vibration. The loudspeaker assembly includes a vibrating element and / or a transmission element connected to the vibrating element, the vibrating element being used to convert a sound signal into a mechanical vibration signal to generate the first mechanical vibration; the transmission element being used to conduct the first mechanical vibration to transmit sound waves, wherein the acoustic input / output device further includes a vibration damping structure, the microphone being connected to the loudspeaker assembly through the vibration damping structure, the vibration damping structure comprising a vibration damping material with an elastic modulus of 0.01 MPa to 1000 MPa.

2. The acoustic input output device of claim 1, wherein, The speaker assembly is a bone conduction speaker assembly, which includes a housing and a vibrating element connected to the housing for generating a first mechanical vibration, and the microphone is directly or indirectly connected to the housing.

3. The acoustic input output device of claim 2, wherein, When a user wears the acoustic input / output device, the clamping force on the part of the acoustic input / output device that contacts the user is 0.1N~0.5N.

4. The acoustic input output device of claim 1, wherein, The thickness of the vibration damping structure is 0.5mm to 5mm.

5. The acoustic input-output device of claim 1, wherein, The first part of the microphone surface is used to conduct the second mechanical vibration, and the second part of the microphone surface is provided with the vibration damping structure and connected to the speaker assembly through the vibration damping structure.

6. The acoustic input output device of claim 5, wherein, The first portion of the microphone's surface is provided with a vibration transmission layer.

7. The acoustic input output device of claim 6, wherein, The elastic modulus of the material of the vibration transmission layer is greater than the second threshold.

8. The acoustic input-output device of claim 1, wherein, The speaker assembly includes a housing and a vibrating element, with a first connection between the housing and the vibrating element, and a second connection between the microphone and the housing, the first connection including a first damping structure.

9. The acoustic input output device of claim 8, wherein, The second connection includes a second vibration damping structure.

10. The acoustic input output device of claim 8, wherein, The mass of the vibration element is in the range of 0.005g to 0.3g.

11. The acoustic input output device of claim 8, wherein, When a user wears the acoustic input / output device, the clamping force on the part of the acoustic input / output device that contacts the user is 0.01N~0.05N.

12. The acoustic input-output device of claim 1, wherein, The loudspeaker assembly includes a first diaphragm and a second diaphragm, the first diaphragm and the second diaphragm vibrating in opposite directions.

13. The acoustic input-output device of claim 12, wherein, The loudspeaker assembly includes a housing, the housing including a first cavity and a second cavity, the first diaphragm and the second diaphragm being located in the first cavity and the second cavity, respectively; The first cavity has a first sound-permeable hole and a second sound-permeable hole on its side wall, and the second cavity has a third sound-permeable hole and a fourth sound-permeable hole on its side wall. The sound phase emitted by the first sound-permeable hole is the same as the sound phase emitted by the third sound-permeable hole, and the sound phase emitted by the second sound-permeable hole is the same as the sound phase emitted by the fourth sound-permeable hole.

14. The acoustic input-output device of claim 13, wherein, The first and third sound-permeable holes are disposed on the same side wall of the housing, the second and fourth sound-permeable holes are disposed on the same side wall of the housing, the first and second sound-permeable holes are disposed on non-adjacent side walls of the housing, and the third and fourth sound-permeable holes are disposed on non-adjacent side walls of the housing.

15. The acoustic input / output device according to claim 13, characterized in that, The loudspeaker assembly further includes a first magnetic circuit assembly and a second magnetic circuit assembly for forming a magnetic field, the first magnetic circuit assembly for causing the first diaphragm to vibrate, and the second magnetic circuit assembly for causing the second diaphragm to vibrate. The first cavity and the second cavity are connected, and the first magnetic circuit assembly and the second magnetic circuit assembly are directly or indirectly connected.

16. The acoustic input / output device according to claim 1, characterized in that, The voice signal source is the vibrating part of the user when the voice signal is provided. When the user wears the acoustic input / output device, the distance between the user's vibrating part and the microphone is less than a third threshold.

17. The acoustic input / output device according to claim 16, characterized in that, The microphone is located near at least one of the user's vocal cords, throat, mouth, or nasal cavity.

18. The acoustic input / output device according to claim 1, characterized in that, The acoustic input / output device also includes a fixing component for maintaining stable contact between the acoustic input / output device and the user, and the fixing component is fixedly connected to the speaker assembly.

19. The acoustic input / output device according to claim 18, characterized in that, The acoustic input / output device is a headset. The fixing component includes a headband and two earcups connected to both sides of the headband. The headband is used to fix the headset to the user's skull and to fix the two earcups to both sides of the user's skull. The microphone and the speaker assembly are respectively disposed in the two earcups.

20. The acoustic input / output device according to claim 19, characterized in that, The acoustic input / output device is a binaural over-ear headphone, and each earcup has a foam cover on the side that contacts the user, and the microphone is housed within the foam cover.

21. The acoustic input / output device according to claim 1, characterized in that, The ratio of the intensity of the second signal to the intensity of the first signal is greater than a threshold.

22. An acoustic input / output device, characterized in that, include: A loudspeaker assembly for transmitting sound waves by generating a first mechanical vibration; as well as A microphone is used to receive a second mechanical vibration generated when a voice signal source provides a voice signal. The microphone generates a first signal and a second signal under the action of the first mechanical vibration and the second mechanical vibration, respectively. The first angle formed by the vibration direction of the microphone and the direction of the first mechanical vibration and the second angle formed by the vibration direction of the microphone and the direction of the second mechanical vibration are respectively set within a set angle range so that within a certain frequency range, the speaker assembly includes a vibrating element and / or a transmission element connected to the vibrating element. The vibrating element is used to convert the sound signal into a mechanical vibration signal to generate the first mechanical vibration. The transmission element is used to conduct the first mechanical vibration to transmit sound waves.

23. The acoustic input / output device according to claim 22, characterized in that, The first included angle is within the range of 20 degrees to 90 degrees.

24. The acoustic input / output device according to claim 23, characterized in that, The first included angle includes 90 degrees.

25. The acoustic input / output device according to claim 22, characterized in that, The second included angle is within the range of 0 degrees to 85 degrees.

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