硅片处理设备及硅片处理方法
The silicon wafer processing equipment with integrated damage formation device realizes double-sided grinding and back-side damage treatment of silicon wafers, solving the problems of complexity and transport damage in external impurity removal equipment, improving production efficiency and reducing costs.
CN116765964BActive Publication Date: 2026-07-17XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
- Filing Date
- 2023-06-30
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing external impregnation equipment is complex and costly, and silicon wafers are easily damaged during transfer between different devices, resulting in low productivity.
Method used
Using silicon wafer processing equipment, double-sided grinding is performed through a hydrostatic support bearing device and a grinding wheel, and a damage layer is formed on the back side. The damage layer is formed by using an ejector or a laser emitter, and the damage formation device is integrated on the hydrostatic support device.
Benefits of technology
Simplify the process flow, reduce the number of equipment, lower the risk of damage to silicon wafers during transportation, and improve production efficiency.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116765964B_ABST
Abstract
本发明实施例公开了硅片处理设备及硅片处理方法，所述硅片处理设备包括：承载装置，所述承载装置用于沿径向方向从外周承载硅片；两个静压支撑装置，所述两个静压支撑装置分别设置在所述硅片的两侧，以用于通过流体静压以非接触的方式支撑所述硅片；两个磨轮，所述两个磨轮分别设置在所述硅片的两侧，以用于对所述硅片的正面和背面进行研磨；设置在所述两个静压支撑装置中的一个静压支撑装置上的损伤形成装置，所述损伤形成装置用于在所述硅片的背面上形成损伤层。
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