Ranging sensor and electronic device

Abstract

The application provides a ranging sensor and an electronic device. The ranging sensor comprises a substrate, a packaging shell, a first chip and a second chip. The packaging shell covers the substrate and forms a packaging space with the substrate. The packaging shell is provided with an entrance and an exit. The first chip and the second chip are a photosensitive chip and a light-emitting chip respectively. The first chip and the second chip are electrically connected to the substrate. The first chip is arranged on the substrate, and the second chip is arranged above the first chip. A photosensitive area of the photosensitive chip and a light-emitting area of the light-emitting chip are arranged separately along the surface of the first chip. The photosensitive area is arranged opposite to the entrance, and the light-emitting area is arranged opposite to the exit. The technical scheme can reduce the packaging size of the ranging sensor.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a ranging sensor and electronic device. Background Technology

[0002] Time-of-Flight (TOF) sensors are sensors that calculate distance based on the time / phase difference between pulse transmission and reception. They consist of two chips: a VCSEL (Vibration Scale Electron) chip and an ASIC (Application-Specific Integrated Circuit) chip. The VCSEL emits a circular array of laser pulses into the scene; upon reaching the target, these pulses are reflected to the SPAD (Spectrum Area Device) of the ASIC. The ASIC contains signal processing circuitry that processes the received signal and outputs the distance information. Typically, both the photosensitive and emission chips in a TOF sensor are mounted on a substrate and encapsulated in a housing. This means the planar package size of the ranging sensor is primarily limited by the mounting position and size of the two chips, resulting in a relatively large package size. Summary of the Invention

[0003] The main objective of this invention is to provide a ranging sensor and electronic device that aims to reduce the package size of the ranging sensor.

[0004] To achieve the above objectives, the present invention provides a ranging sensor, comprising:

[0005] substrate;

[0006] A packaging housing, which covers the substrate and encloses the substrate to form a packaging space, and the packaging housing has an inlet light port and an outlet light port; and

[0007] A first chip and a second chip, the first chip and the second chip being a photosensitive chip and a light-emitting chip respectively, both located in the packaging space and electrically connected to the substrate, the first chip being disposed on the substrate, and the second chip being disposed above the first chip;

[0008] The photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting chip are arranged at intervals along the surface of the first chip. The photosensitive area is arranged opposite to the light inlet, and the light-emitting area is arranged opposite to the light outlet.

[0009] In one embodiment of this application, the second chip and the first chip are spaced apart along the height direction.

[0010] In one embodiment of this application, the ranging sensor further includes a bracket disposed on the substrate, and the second chip is fixed to the bracket and disposed above the first chip.

[0011] In one embodiment of this application, the bracket is a circuit board and is electrically connected to the substrate, and the second chip is electrically connected to the bracket to be electrically connected to the substrate.

[0012] In one embodiment of this application, the bracket includes a support portion and two support portions disposed at both ends of the support portion. The support portion spans above the first chip, the second chip is fixed to the support portion, and the two support portions support the substrate.

[0013] In one embodiment of this application, the first chip is a photosensitive chip, and a first photosensitive part is provided in the photosensitive area of ​​the first chip. The second chip is a light-emitting chip and is disposed at intervals along the surface of the first chip and the first photosensitive part. The first photosensitive part is used to sense reflected light.

[0014] In one embodiment of this application, a baffle wall is provided within the packaging space. The baffle wall is located between the second chip and the first photosensitive part to divide the packaging space into a light-incident space communicating with the light-incident port and a light-emitting space communicating with the light-outcident port. The second chip is located in the light-emitting space, and the first photosensitive part is located in the light-incident space.

[0015] In one embodiment of this application, the photosensitive area is further provided with a second photosensitive part, which is located between the first photosensitive part and the second chip along the surface of the first chip. The second photosensitive part is used to sense the emitted light of the second chip to detect the light emission state of the second chip.

[0016] In one embodiment of this application, the barrier is fixedly connected to the packaging housing, and the barrier is bonded to the first chip with sealant.

[0017] In one embodiment of this application, the ranging sensor further includes a first filter element, which is disposed over the light inlet.

[0018] And / or, the ranging sensor further includes a second filter element, which is disposed over the light outlet;

[0019] And / or, the inner surface of the encapsulation housing is black.

[0020] This application also proposes an electronic device comprising a ranging sensor as described in any of the preceding claims, the ranging sensor comprising:

[0021] substrate;

[0022] A packaging housing, which covers the substrate and encloses the substrate to form a packaging space, and the packaging housing has an inlet light port and an outlet light port; and

[0023] A first chip and a second chip, the first chip and the second chip being a photosensitive chip and a light-emitting chip respectively, both located in the packaging space and electrically connected to the substrate, the first chip being disposed on the substrate, and the second chip being disposed above the first chip;

[0024] The photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting chip are arranged at intervals along the surface of the first chip. The photosensitive area is arranged opposite to the light inlet, and the light-emitting area is arranged opposite to the light outlet.

[0025] The technical solution of this invention allows the first chip and the second chip in the ranging sensor to be stacked along the height direction. The second chip is placed in the space above the first chip, thereby avoiding placing the first chip and the second chip side by side on the surface of the substrate. This improves the space utilization of the cavity above the first chip, reduces the size of the packaged ranging sensor, and makes it suitable for applications in more environments, increasing the application value of the product. At this time, the photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting chip are spaced apart along the surface of the first chip, preventing the second chip from blocking the light path of the first chip. This allows the ranging sensor to emit light out through the light outlet, and the reflected light can also normally illuminate the photosensitive area from the light inlet, enabling the ranging sensor to measure distance normally. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0027] Figure 1 This is a cross-sectional view of an embodiment of the ranging sensor of the present invention;

[0028] Figure 2 This is a structural diagram of an embodiment of the ranging sensor of the present invention with the encapsulation housing removed.

[0029] Explanation of icon numbers:

[0030] 100 Distance sensor 31 Photosensitive area 10 substrate 33 First Sensory Department 20 Encapsulation housing 35 Second photosensitive part 21 Packaging space 40 Second chip 211 Entering the space of light 50 support 213 Illuminated Space 51 Bearing section 23 light entrance 53 Support section 25 light outlet 60 sealant 27 retaining wall 70 First filter element 30 First chip 80 Second filter

[0031] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0033] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0034] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0035] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0036] This invention proposes a ranging sensor 100.

[0037] Combined with reference Figure 1 and Figure 2 In some embodiments of this application, the ranging sensor 100 includes:

[0038] substrate 10;

[0039] Encapsulation housing 20, which covers the substrate 10 and forms an encapsulation space 21 with the substrate 10, and the encapsulation housing 20 has a light inlet 23 and a light outlet 25; and

[0040] A first chip 30 and a second chip 40, the first chip 30 and the second chip 40 are respectively a photosensitive chip and a light-emitting chip, and both are located in the packaging space 21 and electrically connected to the substrate 10. The first chip 30 is disposed on the substrate 10, and the second chip 40 is disposed above the first chip 30.

[0041] The photosensitive area 31 of the photosensitive chip and the light-emitting area of ​​the light-emitting chip are arranged at intervals along the surface of the first chip 30. The photosensitive area 31 is arranged opposite to the light inlet 23, and the light-emitting area is arranged opposite to the light outlet 25.

[0042] The ranging sensor 100 proposed in this application refers to a TOF (Time of Flight) sensor, which is a sensor that calculates distance based on the time / phase difference between pulse transmission and reception. It includes a substrate 10 and a package housing 20, as well as a VCSEL light-emitting chip and an ASIC photosensitive chip electrically connected to the substrate 10 and disposed within the package housing 20. The ASIC chip also contains a signal processing circuit. The substrate 10 and the package housing 20 enclose a package space 21, which can reduce the mixing of external light with the light emitted by the light-emitting chip or prevent external light from affecting the sensitivity of the photosensitive chip. It can also protect the light-emitting chip and the photosensitive chip; at the same time, the package housing 20 has a light inlet 23 and a light outlet 25. With this configuration, the light-emitting chip can emit a circular array of laser pulses into the scene through the light outlet 25; after the light reaches the target, it is reflected and enters the package space 21 through the light inlet 23 and is directed to the photosensitive area 31 of the photosensitive chip. Then the photosensitive chip can process the received signal and output distance information; when the ranging sensor 100 is used, the substrate 10 can establish an electrical connection with the external circuit, receive electrical energy and transmit signals.

[0043] In this embodiment, the first chip 30 can be either a photosensitive chip or a light-emitting chip, and the corresponding second chip 40 is either the light-emitting chip or the photosensitive chip. The second chip 40 is stacked on top of the first chip 30, meaning either the light-emitting chip is placed above the photosensitive chip, or vice versa. The photosensitive area 31 and the light-emitting area are spaced apart along the surface of the first chip 30, thus preventing the second chip 40 from blocking the photosensitive area 31 or the light-emitting area on the first chip 30. This avoids the second chip 40 blocking the light path of the first chip 30, preventing the first chip 30 from sensing light or emitting light. This arrangement utilizes the space above the first chip 30 to place the second chip 40, avoiding the large space occupied by placing the first chip 30 and the second chip 40 side-by-side on the substrate 10, which would result in a larger package size for the ranging sensor 100.

[0044] Furthermore, the second chip 40 can be positioned above the first chip 30, either by fixing it to the first chip 30, fixing it to the top inner wall of the package housing 20, or, as in the following embodiment, fixing the second chip 40 with a bracket 50 so that the second chip 40 is positioned above the first chip 30. No limitation is made here. Secondly, the electrical connection between the first chip 30 and the substrate 10 can be achieved by wire bonding to fix the first chip 30 to the substrate 10 and electrically connecting it to the substrate 10, or by chip mounting methods such as soldering or bonding to fix the first chip 30 to the substrate 10 and electrically connecting it to the substrate 10. Similarly, the electrical connection between the second chip 40 and the substrate 10 can be achieved by wire bonding to connect the second chip 40 to the substrate 10, or, as in the following embodiment, electrically connecting the second chip 40 to a bracket 50 formed from a circuit board, and then electrically connecting the bracket 50 to the substrate 10, thereby electrically connecting the second chip 40 to the substrate 10 and positioning the second chip 40 above the first chip 30.

[0045] Therefore, it is understood that the technical solution of the present invention allows the first chip 30 and the second chip 40 in the ranging sensor 100 to be stacked along the height direction, and the second chip 40 to be placed in the space above the first chip 30, thereby avoiding placing the first chip 30 and the second chip 40 side by side on the surface of the substrate 10. This improves the space utilization of the cavity above the first chip 30, reduces the size of the packaged ranging sensor 100, and makes it suitable for applications in more environments, increasing the application value of the product. At this time, the photosensitive area 31 of the photosensitive chip and the light-emitting area of ​​the light-emitting chip are spaced apart along the surface of the first chip 30, avoiding the second chip 40 from blocking the light path of the first chip 30. This allows the ranging sensor 100 to emit light through the light outlet 25, and the reflected light can also normally irradiate the photosensitive area 31 from the light inlet 23, so that the ranging sensor 100 can measure distance normally.

[0046] Please refer to Figure 1 In some embodiments of this application, the second chip 40 and the first chip 30 are spaced apart along the height direction.

[0047] In this embodiment, the second chip 40 is disposed above the first chip 30 and spaced apart from the first chip 30 along the height direction, thereby preventing the second chip 40 from pressing against the first chip 30, avoiding mutual wear between the first chip 30 and the second chip 40, improving the safety of the ranging sensor 100 packaging process, and increasing the product packaging yield. The second chip 40 being higher than the first chip 30 can be achieved by fixing the second chip 40 to the top inner wall of the packaging housing 20 and then electrically connecting it to the substrate 10, or by providing a bracket 50 for fixing the second chip 40 as in the following embodiment; no limitation is made here.

[0048] Please refer to Figure 1 and Figure 2 In some embodiments of this application, the ranging sensor 100 further includes a bracket 50, which is disposed on the substrate 10, and the second chip 40 is fixed to the bracket 50 to be disposed above the first chip 30.

[0049] In this embodiment, a bracket 50 is provided in the ranging sensor 100. The bracket 50 is disposed on the substrate 10 and is used to support and fix the second chip 40, so that the second chip 40 is disposed above the first chip 30. At this time, the bracket 50 can be a column extending upward from the substrate 10, so that the side of the second chip 40 is connected to the column; or it can be a crossbeam extending upward from the top of the column towards the first chip 30, so that the second chip 40 is fixed to the crossbeam; or it can be a bridge-like structure spanning above the first chip 30 in the following embodiment, which is not limited here. Fixing the second chip 40 by the bracket 50 can avoid the first chip 30 directly bearing the second chip 40, which would cause mutual wear between the first chip 30 and the second chip 40, thus improving the safety of the packaging process; in addition, compared with fixing the second chip 40 to the packaging shell 20, fixing the second chip 40 to the bracket 50 disposed on the substrate 10 facilitates the electrical connection between the second chip 40 and the substrate 10.

[0050] In some embodiments of this application, the bracket 50 is a circuit board and is electrically connected to the substrate 10, and the second chip 40 is electrically connected to the bracket 50 to be electrically connected to the substrate 10.

[0051] In this embodiment, the support 50 is a circuit board, which fixes the second chip 40 on the support 50 and electrically connects it to the circuitry in the support 50. When the support 50 is fixed to the substrate 10, the support 50 and the substrate 10 are electrically connected and fixed by means of welding or conductive adhesive bonding, thereby making the second chip 40 and the substrate 10 electrically connected through the support 50. The electrical connection between the second chip 40 and the support 50 can be achieved by wire bonding to fix the second chip 40 to the support 50 and electrically connect it to the support 50, or by setting pads on the support 50 and fixing the second chip 40 to the support 50 and electrically connecting it to the support 50 by chip mounting methods such as welding or conductive adhesive bonding. This configuration avoids the problem of excessively long wires that are prone to breakage when using wire bonding between the second chip 40 and the substrate 10, thereby improving the fixing strength of the second chip 40 and the stability of the electrical connection between the second chip 40 and the substrate 10.

[0052] Please refer to Figure 1In some embodiments of this application, the bracket 50 includes a support portion 51 and two support portions 53 disposed at both ends of the support portion 51. The support portion 51 spans above the first chip 30, the second chip 40 is fixed to the support portion 51, and the two support portions 53 support the substrate 10.

[0053] In this embodiment, the bracket 50 is generally in the form of a bridge structure, including a support portion 51 spanning above the first chip 30 and support portions 53 at both ends of the support portion 51 for fixed connection with the substrate 10. This arrangement allows the bracket 50 to be stably fixed on the substrate 10 through the two support portions 53, improving the connection strength between the bracket 50 and the substrate 10, and also allows the second chip 40 to be stably positioned above the first chip 30, improving the overall structural stability.

[0054] Please refer to Figure 2 In some embodiments of this application, the first chip 30 is a photosensitive chip, and the photosensitive area 31 of the first chip 30 is provided with a first photosensitive part 33. The second chip 40 is a light-emitting chip and is disposed at intervals along the surface of the first chip 30 and the first photosensitive part 33. The first photosensitive part 33 is used to sense reflected light.

[0055] In this embodiment, the first chip 30 is a photosensitive chip, and a first photosensitive part 33 for sensing reflected light is provided on the photosensitive area 31 of the first chip 30. The second chip 40 is a light-emitting chip. This arrangement means that the light-emitting area is located near the top of the package housing 20 and is higher than the first photosensitive part 33. This arrangement avoids the light emitted directly from the light-emitting area being lower than the first photosensitive part 33 and being sensed by the first photosensitive part 33 when it passes through the height position of the first photosensitive part 33, thus avoiding the influence on the measurement results. Making the light-emitting area higher than the first photosensitive part 33 is beneficial to improving the measurement accuracy of the ranging sensor 100.

[0056] Please refer to Figure 1 In some embodiments of this application, the encapsulation space 21 is provided with a baffle 27, which is located between the second chip 40 and the first photosensitive part 33, so as to divide the encapsulation space 21 into a light-incident space 211 communicating with the light-incident port 23 and a light-emitting space 213 communicating with the light-outcident port 25. The second chip 40 is located in the light-emitting space 213, and the first photosensitive part 33 is located in the light-incident space 211.

[0057] In this embodiment, a baffle 27 is provided within the encapsulation space 21. The baffle 27 is positioned between the second chip 40 and the first photosensitive part 33, and is connected to the encapsulation housing 20 and the first chip 30 respectively, thereby dividing the encapsulation space 21 into an incident light space 211 and an emitting light space 213. The emitting light space 213 is connected to the emitting light port 25 and houses the second chip 40. The incident light space 211 is connected to the incident light port 23, and the first photosensitive part 33 is located in the incident light space 211. This arrangement uses the baffle 27 to isolate the first photosensitive part 33 and the second chip 40, preventing the light emitted directly from the second chip 40 from being sensed by the first photosensitive part 33 and affecting the measurement effect. It also prevents the light emitted from the ranging sensor 100 and the reflected light reflected to the ranging sensor 100 from interfering with each other, thereby improving the measurement accuracy of the ranging sensor 100.

[0058] In some embodiments, the photosensitive area 31 of the first chip 30 is further provided with a second photosensitive part 35 for detecting the light emission state of the second chip 40. The second photosensitive part 35 senses the light emitted by the second chip 40 to determine the light emission state of the second chip 40. At this time, the second photosensitive part 35 is also located in the light emission space 213 to avoid the reflected light being sensed by the second photosensitive part 35 and affecting the correct judgment of the light emission state of the second chip 40.

[0059] Please refer to Figure 2 In some embodiments of this application, the photosensitive area 31 is further provided with a second photosensitive part 35, which is located between the first photosensitive part 33 and the second chip 40 along the surface of the first chip 30. The second photosensitive part 35 is used to sense the emitted light of the second chip 40 to detect the light emission state of the second chip 40.

[0060] In this embodiment, a second photosensitive part 35 is provided on the photosensitive area 31 of the first chip 30, and the second photosensitive part 35 is closer to the second chip 40 than the first photosensitive part 33. It is used to sense the light intensity of the emitted light of the second chip 40, thereby judging the light emission state of the second chip 40 and performing feedback adjustment. If the light intensity is weak, the input power of the second chip 40 is increased to improve the light emission intensity of the second chip 40. If the light intensity is strong, the input power is appropriately reduced or other parameters are adjusted to ensure the stability of the light emission of the second chip 40 and ensure the measurement accuracy of the ranging sensor 100. Furthermore, the second photosensitive unit 35 is positioned away from the area where the first sensing unit is located and closer to the area where the second chip 40 is located, in order to minimize the impact of reflected light incident on the first sensing unit on the photosensitive effect of the second photosensitive unit 35, thereby avoiding affecting the correct judgment of the luminous state of the second chip 40. In some embodiments, the second chip 40 and the second photosensitive unit 35 can be isolated from the first photosensitive unit 33 by setting a barrier 27, thereby effectively preventing the light emitted from the ranging sensor 100 and the reflected light reflected to the ranging sensor 100 from interfering with each other, so that both the first sensing unit and the second photosensitive unit 35 can accurately sense the target light, improving the judgment and detection accuracy.

[0061] Please refer to Figure 1 In some embodiments of this application, the barrier 27 is fixedly connected to the packaging housing 20, and the barrier 27 is bonded to the first chip 30 by sealant 60.

[0062] In this embodiment, the barrier 27 is disposed inside the packaging housing 20. It can be integrally disposed with the packaging housing 20 or fixedly connected to the packaging housing 20 by welding, bonding or other means. The edge of the barrier 27 facing the surface of the first chip 30 is bonded and fixed to the first chip 30 by sealant 60, so as to effectively isolate and seal the light-emitting space 213 and the light-incident space 211, and prevent the light from the light-emitting space 213 and the light-incident space 211 from mutually transmitting and causing the emitted light and reflected light to affect each other.

[0063] Please refer to Figure 1 In some embodiments of this application, the ranging sensor 100 further includes a first filter 70, which covers the light inlet 23;

[0064] And / or, the ranging sensor 100 further includes a second filter 80, which covers the light outlet 25.

[0065] In this embodiment, a first filter 70 is provided over the light inlet 23. The first filter 70 mainly serves to filter light and prevent contamination by foreign objects. The first filter 70 only allows laser light of the required wavelength to pass through, preventing light of other wavelengths from passing through. This ensures that the light incident on the packaging space 21 and sensed by the photosensitive chip is only of the required wavelength, thereby effectively reducing crosstalk of the light signal received by the photosensitive chip, improving the sensing accuracy of the photosensitive chip and the measurement accuracy of the ranging sensor 100. In addition, it can block the light inlet 23 to prevent foreign objects from entering the packaging space 21 through the light inlet 23, affecting the transmission of light or causing damage to the substrate 10, the first chip 30, and the second chip 40 inside the packaging space 21, thus improving safety. In some embodiments, the first filter 70 is disposed on the inner wall of the packaging housing 20, which can protect the first filter 70.

[0066] Similarly, a second filter 80 is provided over the light outlet 25. The second filter 80 serves to filter light and prevent contamination by foreign objects. The second filter 80 only allows the laser of the required wavelength to pass through, and does not allow light of other wavelengths to pass through. This ensures that only the light of the required wavelength can pass through the second filter 80 and illuminate the target object for reflection, thereby avoiding the presence of light of other wavelengths in the reflected light. This effectively reduces crosstalk of the light signal received by the photosensitive chip, improves the sensing accuracy of the photosensitive chip and the measurement accuracy of the ranging sensor 100. In addition, it can block the light outlet 25 to prevent foreign objects from entering the packaging space 21 from the light outlet 25 and affecting the transmission of light or causing damage to the substrate 10, the first chip 30 and the second chip 40 in the packaging space 21, thereby improving the safety of use. In addition, in some embodiments, the second filter 80 is disposed on the inner wall of the packaging housing 20, which can protect the second filter 80. In some embodiments, the photosensitive area 31 of the photosensitive chip is also provided with a second photosensitive part 35 for detecting the light emission state of the light-emitting chip. The second photosensitive part 35 senses the light emitted by the light-emitting chip to determine the light emission state of the second chip 40. At this time, the light emitted by the light-emitting chip can be reflected by the second filter 80 to the second photosensitive part 35 and sensed by the second photosensitive part 35, so that the second photosensitive part 35 can determine the light emission state of the light-emitting chip.

[0067] In some embodiments of this application, the inner surface of the encapsulation housing 20 is black.

[0068] In this embodiment, the inner surface of the packaging shell 20 is black. This can be achieved by making the entire packaging shell 20 a black material, such as black resin, or by providing at least a black coating on the inner surface of the packaging shell 20. This reduces the reflectivity of the inner surface of the packaging shell 20 and prevents the light emitted from the light-emitting chip from being reflected by the inner surface of the packaging shell 20 in the packaging space 21 and illuminating the photosensitive area 31 of the photosensitive chip, which would affect the measurement results.

[0069] This application also proposes an electronic device, including a ranging sensor 100 as described in any of the foregoing embodiments. The specific structure of the ranging sensor 100 is as described in any of the foregoing embodiments and will not be repeated here. Since the electronic device proposed in this application applies all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought by all the foregoing technical solutions, which will not be repeated here.

[0070] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A ranging sensor, characterized in that, include: substrate; An encapsulation housing covers the substrate and forms an encapsulation space with the substrate. The encapsulation housing has a light inlet and a light outlet. as well as A first chip and a second chip, the first chip and the second chip being a photosensitive chip and a light-emitting chip respectively, both located in the packaging space and electrically connected to the substrate, the first chip being disposed on the substrate, and the second chip being disposed above the first chip; The photosensitive area of ​​the photosensitive chip and the light-emitting area of ​​the light-emitting chip are arranged at intervals along the surface of the first chip. The photosensitive area is arranged opposite to the light inlet, and the light-emitting area is arranged opposite to the light outlet. The first chip is a photosensitive chip, and the photosensitive area of ​​the first chip is provided with a first photosensitive part and a second photosensitive part. The second chip is a light-emitting chip, and is disposed along the surface of the first chip and spaced apart from the first photosensitive part. The first photosensitive part is used to sense reflected light. The second photosensitive part is located between the first photosensitive part and the second chip along the surface of the first chip. The second photosensitive part is used to sense the emitted light of the second chip to detect the light emission state of the second chip. The light emission state includes the light intensity of the emitted light, so as to increase the input power of the second chip when the light intensity is weak and decrease the input power when the light intensity is strong. The ranging sensor also includes a second filter element, which is disposed over the light outlet. A portion of the light emitted by the light-emitting chip can pass through the second filter element and illuminate the target object. A portion of the light emitted by the light-emitting chip can be reflected by the second filter element to the second photosensitive part for detection by the second photosensitive part.

2. The ranging sensor as described in claim 1, characterized in that, The second chip and the first chip are spaced apart along the height direction.

3. The ranging sensor as described in claim 2, characterized in that, The ranging sensor also includes a bracket, which is disposed on the substrate, and the second chip is fixed to the bracket and disposed above the first chip.

4. The ranging sensor as described in claim 3, characterized in that, The bracket is a circuit board and is electrically connected to the substrate. The second chip is electrically connected to the bracket so as to be electrically connected to the substrate.

5. The ranging sensor as described in claim 3, characterized in that, The bracket includes a support portion and two support portions disposed at both ends of the support portion. The support portion spans above the first chip, the second chip is fixed to the support portion, and the two support portions support the substrate.

6. The ranging sensor as described in claim 1, characterized in that, The packaging space is provided with a baffle wall, which is located between the second chip and the first photosensitive part, so as to divide the packaging space into a light-inlet space communicating with the light-inlet port and a light-emitting space communicating with the light-outlet port. The second chip is located in the light-emitting space and the first photosensitive part is located in the light-inlet space.

7. The ranging sensor as described in claim 6, characterized in that, The barrier is fixedly connected to the packaging shell, and the barrier is bonded to the first chip with sealant.

8. The ranging sensor as described in any one of claims 1 to 7, characterized in that, The ranging sensor further includes a first filter element, which is disposed over the light inlet. And / or, the inner surface of the encapsulation housing is black.

9. An electronic device, characterized in that, The electronic device includes a ranging sensor as described in any one of claims 1 to 8.

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