Backlight module and manufacturing method thereof

Abstract

A backlight module and a manufacturing method thereof are disclosed. The backlight module includes a cover plate, a light guide plate, a circuit board, a first reflective layer, and a light source. The cover plate has a light shielding area. The light guide plate is disposed below the cover plate and has a first opening opposite to the light shielding area. The circuit board is disposed below the light guide plate and includes a first substrate and a conductive layer. The conductive layer has a through hole. The first reflective layer is disposed between the light guide plate and the circuit board and has a second opening opposite to the first opening. The first substrate at least partially contacts the first reflective layer. The conductive layer is disposed between the first substrate and the first reflective layer. The first reflective layer has a recessed portion recessed into the through hole. The light source is disposed on the circuit board and accommodated in the first opening and the second opening. The light source contacts the conductive layer. Thus, the backlight module can achieve the gain of light quantity.

Description

Technical Field

[0001] This disclosure relates to a keyboard device, and more particularly to a backlight module for use in a keyboard device and a method for manufacturing the same. Background Technology

[0002] Traditional keyboards often have a rather monotonous and dull appearance, so computer peripheral manufacturers have developed backlit keyboards with excellent visual effects. Backlit keyboards have a backlight module.

[0003] While traditional keyboard backlight modules are simple in design, they no longer meet the market's demand for thinner designs. With the evolution of LED technology, some keyboard backlight modules use smaller light-emitting elements paired with light guide plates to achieve thinner designs. However, these light-emitting elements are typically front-facing, and the light must pass through a reflective layer to travel laterally before entering the light guide plate. Therefore, light loss during the turning process reduces the backlight module's luminous efficiency.

[0004] Therefore, how to propose a backlight module and its manufacturing method that can solve the above problems is one of the issues that the industry is currently eager to invest R&D resources to address. Summary of the Invention

[0005] In view of this, one purpose of this disclosure is to propose a backlight module that can solve the above problems and a method for manufacturing the same.

[0006] To achieve the above objectives, according to one embodiment of this disclosure, a backlight module includes a cover plate, a light guide plate, a circuit board, a first reflective layer, and a light source. The cover plate has a light-shielding area. The light guide plate is disposed below the cover plate and has a first opening opposite to the light-shielding area. The circuit board is disposed below the light guide plate and includes a first substrate and a conductive layer. The conductive layer has a through-hole. The first reflective layer is disposed between the light guide plate and the circuit board and has a second opening opposite to the first opening. The first substrate is at least partially in contact with the first reflective layer. The conductive layer is disposed between the first substrate and the first reflective layer. The first reflective layer has a recess recessed into the through-hole. The light source is disposed on the circuit board and accommodated in the first and second openings. The light source is in contact with the conductive layer.

[0007] In one or more embodiments disclosed herein, the backlight module further includes a second reflective layer. The second reflective layer is disposed on the circuit board and is in contact with the first reflective layer.

[0008] In one or more embodiments disclosed herein, the second reflective layer is located within the inner edge of the first opening.

[0009] In one or more embodiments disclosed herein, the first reflective layer and the second reflective layer are stacked within the inner edge of the first opening.

[0010] In one or more embodiments disclosed herein, the coefficient of thermal expansion of the first substrate is greater than the coefficient of thermal expansion of the first reflective layer.

[0011] In one or more embodiments disclosed herein, the circuit board further includes a second substrate. The second substrate is disposed and contacts the side of the first substrate away from the first reflective layer. The coefficient of thermal expansion of the first substrate is greater than that of the second substrate.

[0012] In one or more embodiments disclosed herein, the cover plate further includes a light-emitting area. A through-hole is located below the light-emitting area.

[0013] In one or more embodiments disclosed herein, the cover plate further has a reflective area located between the light-shielding area and the light source.

[0014] To achieve the above objectives, according to one embodiment of the present disclosure, a method for manufacturing a backlight module includes: placing a circuit board below a light guide plate, wherein the circuit board includes a first substrate and a conductive layer, and the light guide plate has a first opening; forming a through hole in the conductive layer; placing a first reflective layer between the light guide plate and the circuit board, such that the first substrate at least partially contacts the first reflective layer, and the conductive layer is located between the first substrate and the first reflective layer, wherein the first reflective layer has a second opening opposite to the first opening; forming a recess in the first reflective layer that is recessed into the through hole; placing a light source on the circuit board and accommodating it in the first opening and the second opening, such that the light source contacts the conductive layer; and placing a cover plate above the light guide plate, wherein the cover plate has a light-shielding area opposite to the first opening.

[0015] In one or more embodiments disclosed herein, the method of manufacturing a backlight module further includes: disposing a second reflective layer on a circuit board and connecting it to the first reflective layer.

[0016] In one or more embodiments disclosed herein, the cover plate further includes a light-emitting area. The cover plate is positioned above the light guide plate such that the light-emitting area is located above the through-hole.

[0017] In summary, in the backlight module disclosed herein, by partially embedding the reflective layer into the through-hole of the conductive layer to form a recess, the reflective layer can utilize the space of the recess for secondary reflection, thereby achieving an increase in light output. Furthermore, since the recess of the reflective layer is positioned directly opposite the light-emitting area of ​​the upper cover plate, the light output of the backlight module can be increased. In addition to the reflective layer below the light guide plate, another reflective layer is positioned below the light source located within the opening of the light guide plate. Therefore, the side light from the light source can be reliably reflected within the opening of the light guide plate before entering the light guide plate, thereby increasing the amount of light entering the light guide plate. By stacking the two reflective layers within the inner edge of the opening, the problem of the stacked double reflective layers increasing the overall thickness of the backlight module can be avoided. By employing a stacked structure with a small-large-small coefficient of thermal expansion on the circuit board, manufacturing or assembly precision issues of the backlight module caused by circuit board expansion and contraction can be avoided. Forming through-holes on the conductive layer of the circuit board makes it easier to control the amount of circuit board expansion and contraction.

[0018] The above description is only used to illustrate the problem to be solved by this disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of this disclosure will be described in detail in the following implementation method and related drawings. Attached Figure Description

[0019] To make the above and other objects, features, advantages and embodiments disclosed herein more apparent and understandable, the accompanying drawings are described below:

[0020] Figure 1 A perspective view of a keyboard device according to an embodiment of the present disclosure is provided.

[0021] Figure 2 A cross-sectional view of a backlight module according to an embodiment of the present disclosure is shown.

[0022] Figure 3 A cross-sectional view of a backlight module according to another embodiment of this disclosure is provided.

[0023] Figure 4 A cross-sectional view of a backlight module according to another embodiment of this disclosure is provided.

[0024] Figure 5 To illustrate a top view of a conductive layer according to an embodiment of this disclosure;

[0025] Figure 6 A cross-sectional view of a backlight module according to another embodiment of this disclosure is provided.

[0026] Figure 7 A flowchart illustrating a method for manufacturing a backlight module according to an embodiment of this disclosure is provided.

[0027] [Symbol Explanation]

[0028] 100: Keyboard device

[0029] 110: Base Plate

[0030] 120: Button assembly

[0031] 200, 200A, 200B, 200C: Backlight Module

[0032] 210, 210C: Cover plate

[0033] 210a: Plate body

[0034] 210b: Light-shielding layer

[0035] 210c: Reflective layer

[0036] 211: Shading area

[0037] 212: Lighting area

[0038] 213: Reflective Area

[0039] 220: Light guide plate

[0040] 221: First opening

[0041] 230, 230A, 230B: Circuit Boards

[0042] 231: First substrate

[0043] 232A, 232B: Conductive layers

[0044] 232a: Installation area

[0045] 232a1: Zone 1

[0046] 232a2: Second Zone

[0047] 232b: Non-polar region

[0048] 232b1: Through hole

[0049] 232c: Polar region

[0050] 233: Second substrate

[0051] 240, 240B: First reflective layer

[0052] 241: Second opening

[0053] 242: concave part

[0054] 250: Light source

[0055] 260: Second reflective layer

[0056] S101~S106: Steps Detailed Implementation

[0057] The following describes several embodiments of this disclosure with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, in some embodiments of this disclosure, these practical details are not essential. Furthermore, for the sake of simplicity, some known and conventional structures and elements will be shown in the drawings in a simple schematic manner.

[0058] Please refer to Figure 1 This is a perspective view illustrating a keyboard device 100 according to an embodiment of the present disclosure. Figure 1 As shown, in this embodiment, the keyboard device 100 includes a base plate 110, a plurality of key assemblies 120, and a backlight module 200 (labeled as...). Figure 2 The key assembly 120 is disposed above the base plate 110 and configured for user pressing. A backlight module 200 is disposed between the base plate 110 and the key assembly 120 and configured to emit light toward the key assembly 120, thereby making the keyboard device 100 a backlit keyboard. Furthermore, the keyboard device 100 of this embodiment can be an external keyboard for desktop computers (e.g., a PS / 2 interface keyboard or a USB interface keyboard) or an input device including keys, but is not limited thereto. In other words, the concept of the keyboard device 100 disclosed herein can be applied to any electronic product that uses pressing as an input method.

[0059] Please refer to Figure 2 This is a cross-sectional view illustrating a backlight module 200 according to an embodiment of the present disclosure. Figure 2 As shown, in this embodiment, the backlight module 200 includes a cover plate 210, a light guide plate 220, a circuit board 230, and a light source 250. The cover plate 210 has a light-shielding area 211 and a light-emitting area 212. The light guide plate 220 is disposed below the cover plate 210 and is vertically opposite to the light-emitting area 212 of the cover plate 210. The light guide plate 220 has a first opening 221, and the first opening 221 is vertically opposite to the light-shielding area 211 of the cover plate 210. The circuit board 230 is disposed below the light guide plate 220. The light source 250 is disposed on the circuit board 230. The light source 250 includes multiple light-emitting elements (e.g., red light-emitting elements, green light-emitting elements, and blue light-emitting elements), but this disclosure is not limited to this. In other embodiments, the light source 250 may also include only a single light-emitting element. In some embodiments, the light-emitting element may be, but is not limited to, a light-emitting diode (LED).

[0060] like Figure 2As shown, in this embodiment, the backlight module 200 further includes a first reflective layer 240 and a second reflective layer 260. The first reflective layer 240 is disposed between the light guide plate 220 and the circuit board 230. The first reflective layer 240 and the light-emitting area 212 of the cover plate 210 are vertically opposite each other. The second reflective layer 260 is disposed on the circuit board 230 and is in contact with the first reflective layer 240. Therefore, the side light from the light source 250 can be reflected upwards by the first reflective layer 240 and the second reflective layer 260, thereby increasing the amount of light entering the light guide plate 220. Furthermore, the side light from the light source 250 will not leak to the circuit board 230 from the contact point between the first reflective layer 240 and the second reflective layer 260.

[0061] like Figure 2 As shown, in this embodiment, the first reflective layer 240 has a second opening 241. The second opening 241 of the first reflective layer 240 is opposite to and adjacent to the first opening 221 of the light guide plate 220. The second reflective layer 260 is located within the inner edge of the first opening 221. Therefore, the side light from the light source 250 can be reflected by the second reflective layer 260 within the first opening 221 of the light guide plate 220 and then enter the light guide plate 220, thereby increasing the amount of light entering the light guide plate 220.

[0062] Looking further, such as Figure 2 As shown, the first reflective layer 240 and the second reflective layer 260 are stacked within the inner edge of the first opening 221. This allows the side light from the light source 250 to be more reliably reflected by the second reflective layer 260 into the light guide plate 220 within the first opening 221, and also avoids the problem of the stacked first reflective layer 240 and second reflective layer 260 increasing the overall thickness of the backlight module 200. In this embodiment, the outer edge of the second reflective layer 260 is stacked between the circuit board 230 and the first reflective layer 240, but this disclosure is not limited to this. In some other embodiments, the portion of the first reflective layer 240 adjacent to the inner edge of the second opening 241 is stacked between the circuit board 230 and the second reflective layer 260.

[0063] Please refer to Figure 3 This is a cross-sectional view illustrating a backlight module 200A according to another embodiment of this disclosure. Figure 3 As shown, in this embodiment, the backlight module 200A includes a cover plate 210, a light guide plate 220, a circuit board 230A, a first reflective layer 240, and a light source 250, wherein the cover plate 210, the light guide plate 220, the first reflective layer 240, and the light source 250 are identical to... Figure 2 The embodiments shown above provide further details on these components, which will not be repeated here. In other words, the backlight module 200A of this embodiment is a modified circuit board 230A.

[0064] Specifically, in this embodiment, the circuit board 230A includes a first substrate 231 and a conductive layer 232A. The first substrate 231 is at least partially in contact with the first reflective layer 240. The conductive layer 232A is disposed between the first substrate 231 and the first reflective layer 240. The coefficient of thermal expansion of the first substrate 231 is greater than that of the first reflective layer 240. Therefore, the expansion or contraction of the first substrate 231 can be suppressed by the first reflective layer 240. Furthermore, in this embodiment, the circuit board 230A further includes a second substrate 233. The second substrate 233 is disposed and contacts the side of the first substrate 231 away from the first reflective layer 240. The coefficient of thermal expansion of the first substrate 231 is greater than that of the second substrate 233. By forming a stacked structure with small-large-small coefficients of thermal expansion of the first reflective layer 240, the first substrate 231, and the second substrate 233, manufacturing or assembly accuracy problems of the backlight module 200A due to expansion or contraction of the circuit board 230A can be avoided.

[0065] In some embodiments, the material of the first substrate 231 comprises polyethylene terephthalate (PET), but this disclosure is not limited thereto. In some embodiments, the material of at least one of the first reflective layer 240 and the second substrate 233 comprises polyimide (PI), but this disclosure is not limited thereto.

[0066] In some embodiments, the material of the conductive layer 232A includes copper, but this disclosure is not limited thereto.

[0067] like Figure 3 As shown, in this embodiment, the conductive layer 232A has a mounting region 232a. The mounting region 232a is embedded in the first substrate 231. The mounting region 232a is disposed corresponding to the second opening 241 of the first reflective layer 240 and includes a first region 232a1 and a second region 232a2. The light source 250 is electrically connected to the first region 232a1. In some embodiments, Figure 3 The backlight module 200A shown may include Figure 2 The backlight module 200 shown has a second reflective layer 260, and the second reflective layer 260 is disposed in the second region 232a2.

[0068] Please refer to Figure 4 as well as Figure 5 . Figure 4 A cross-sectional view of a backlight module 200B according to another embodiment of this disclosure is shown. Figure 5 A top view is shown to illustrate a conductive layer 232B according to an embodiment of this disclosure. Figure 4 and Figure 5As shown, in this embodiment, the backlight module 200B includes a cover plate 210, a light guide plate 220, a circuit board 230B, a first reflective layer 240B, and a light source 250, wherein the cover plate 210, the light guide plate 220, and the light source 250 are the same as... Figure 3 The embodiments shown above provide further details on these components, which will not be repeated here. In other words, the backlight module 200B of this embodiment provides a modified first reflective layer 240B and a circuit board 230B.

[0069] Specifically, compared to Figure 3 The implementation method shown, Figure 4 The conductive layer 232B in the illustrated embodiment has a plurality of through holes 232b1 located below the light-emitting region 212 of the cover plate 210. Additionally, as... Figure 5 As shown, the conductive layer 232B includes a non-polar region 232b and a polar region 232c. The non-polar region 232b and the polar region 232c are electrically insulated. The polar region 232c forms multiple circuits to conduct current, and a via 232b1 is formed in the non-polar region 232b. With this structural configuration, the via 232b1 of the conductive layer 232B makes it easier to control the expansion and contraction of the circuit board 230B.

[0070] Furthermore, such as Figure 4 and Figure 5 As shown, the first reflective layer 240B has multiple recesses 242 that are respectively embedded in the through-holes 232b1 of the conductive layer 232B. Therefore, the surface of the first reflective layer 240B is not a smooth plane. By partially embedding the first reflective layer 240B into the through-holes 232b1 of the conductive layer 232B to form recesses 242, the first reflective layer 240B can utilize the space of the recesses 242 to perform a second reflection, thereby achieving an increase in light intensity. Furthermore, since the position of the recesses 242 of the first reflective layer 240B is directly opposite the light-emitting area 212 of the upper cover plate 210, the light emission of the backlight module 200B can be increased.

[0071] Please refer to Figure 6 This is a cross-sectional view illustrating a backlight module 200C according to another embodiment of this disclosure. Figure 6 As shown, in this embodiment, the backlight module 200C includes a cover plate 210C, a light guide plate 220, a circuit board 230B, a first reflective layer 240B, and a light source 250, wherein the light guide plate 220, the circuit board 230B, the first reflective layer 240B, and the light source 250 are the same as... Figure 4 The embodiments shown above provide further details on these components, which will not be repeated here. In other words, the backlight module 200C of this embodiment provides a modified cover plate 210C.

[0072] Specifically, in this embodiment, in addition to the light-shielding area 211 and the light-emitting area 212, the cover plate 210C further has a reflective area 213 located between the light-shielding area 211 and the light source 250. More specifically, the cover plate 210C includes a plate body 210a, a light-shielding layer 210b, and a reflective layer 210c. The plate body 210a covers the light guide plate 220. The light-shielding layer 210b is disposed on one side of the plate body 210a facing the light guide plate 220. The light-shielding area 211 is defined by the light-shielding layer 210b. The light-shielding layer 210b completely covers the first opening 221 of the light guide plate 220. The reflective layer 210c is disposed on one side of the plate body 210a facing the light guide plate 220 and covers the light-shielding layer 210b. The reflective area 213 is defined by the reflective layer 210c. With the aforementioned structural configuration, the strong front light (i.e., upward-emitted light) of the light source 250 can be reflected into side light, which can then be mixed again to improve the uniformity of the white light.

[0073] In some embodiments, the area of ​​the light-shielding layer 210b extending outward beyond the first opening 221 is more than 40% of the size of the first opening 221, but this disclosure is not limited thereto. This effectively prevents light emitted by the light source 250 from leaving through the upper opening of the first opening 221, thereby ensuring that light energy enters the light guide plate 220 through the inner wall of the first opening 221.

[0074] In some embodiments, the area of ​​the reflective layer 210c is more than twice the size of the first opening 221, but this disclosure is not limited thereto.

[0075] It should be noted that, Figure 2 , Figure 3 , Figure 4 and Figure 6 The different features of the embodiments shown can be flexibly combined in the same embodiment as long as they are not mutually exclusive.

[0076] Please refer to Figure 7 This is a flowchart illustrating a method for manufacturing a backlight module according to an embodiment of the present disclosure. Figure 7 As shown, the manufacturing method of the backlight module mainly includes steps S101 to S106. The following description can be used in conjunction with... Figure 4 The backlight module 200B shown is shown.

[0077] Step S101: Place the circuit board 230B below the light guide plate 220, wherein the circuit board 230B includes a first substrate 231 and a conductive layer 232B, and the light guide plate 220 has a first opening 221.

[0078] Step S102: Form a via 232b1 on the conductive layer 232B.

[0079] Step S103: The first reflective layer 240B is disposed between the light guide plate 220 and the circuit board 230B, such that the first substrate 231 is at least partially in contact with the first reflective layer 240B, and the conductive layer 232B is located between the first substrate 231 and the first reflective layer 240B, wherein the first reflective layer 240B has a second opening 241 opposite to the first opening 221.

[0080] Step S104: A recess 242 is formed on the first reflective layer 240B to fit into the through hole 232b1.

[0081] Step S105: Place the light source 250 on the circuit board 230B and accommodate it in the first opening 221 and the second opening 241, so that the light source 250 is in contact with the conductive layer 232B.

[0082] Step S106: Place the cover plate 210 above the light guide plate 220, wherein the cover plate 210 has a light-shielding area 211 opposite to the first opening 221.

[0083] In practical applications, the order of steps S101 to S106 can be flexibly adjusted according to actual needs.

[0084] In some embodiments, step S102 is performed earlier than step S101. In some embodiments, step S104 may be performed concurrently with step S103.

[0085] In some implementations, such as Figure 2 As shown, the manufacturing method of the backlight module further includes step S107.

[0086] Step S107: The second reflective layer 260 is disposed on the circuit board 230 and located within the inner edge of the first opening 221.

[0087] In some implementations, such as Figure 4 As shown, the conductive layer 232B has a mounting area 232a. The mounting area 232a is disposed corresponding to the second opening 241 of the first reflective layer 240B and includes a first area 232a1 and a second area 232a2. Step S105 is to electrically connect the light source 250 to the first area 232a1.

[0088] In some implementations, step S107 is performed earlier than step S105. Please refer to the following references. Figure 4 Step S107 is to set the second reflective layer 260 in the second region 232a2.

[0089] In some implementations, such as Figure 4 As shown, the cover plate 210 further includes a light-emitting area 212. Step S106 is to position the light-emitting area 212 above the through hole 232b1.

[0090] From the detailed description of the specific embodiments disclosed above, it is clear that in the backlight module of this disclosure, by partially embedding the reflective layer into the through-hole of the conductive layer to form a recess, the reflective layer can utilize the space of the recess to reflect light again, thereby achieving an increase in light output. Furthermore, since the position of the recess of the reflective layer is directly opposite the light-emitting area of ​​the upper cover plate, the light output of the backlight module can be increased. In addition to the reflective layer below the light guide plate, another reflective layer is provided below the light source located within the opening of the light guide plate. Therefore, the side light from the light source can be reliably reflected within the opening of the light guide plate before entering the light guide plate, thereby increasing the amount of light entering the light guide plate. By stacking the two reflective layers within the inner edge of the opening, the problem of the stacked double reflective layers increasing the overall thickness of the backlight module can be avoided. By using a stacked structure with a small-large-small coefficient of thermal expansion on the circuit board, manufacturing or assembly precision problems of the backlight module caused by circuit board expansion and contraction can be avoided. Forming through-holes on the conductive layer of the circuit board makes it easier to control the amount of circuit board expansion and contraction.

[0091] Although the present disclosure has been described above with reference to embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various modifications and alterations without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the scope defined in the appended claims.

Claims

1. A backlight module, characterized in that, Include: A cover plate, providing a light-shading area; A light guide plate is disposed below the cover plate and has a first opening opposite the light-shielding area; A circuit board is disposed below the light guide plate and includes a first substrate, a second substrate and a conductive layer. The conductive layer has a plurality of through holes. The conductive layer includes a non-polar region and a polar region. The non-polar region and the polar region are electrically insulated from each other, and the plurality of through holes are formed in the non-polar region. A first reflective layer is disposed between the light guide plate and the circuit board, and has a second opening opposite to the first opening. The first substrate is at least partially in contact with the first reflective layer. The conductive layer is disposed between the first substrate and the first reflective layer, and the first reflective layer has a plurality of recesses that are recessed into the plurality of through holes. A second reflective layer is disposed on the circuit board and connected to the first reflective layer, the second reflective layer being located within an inner edge of the first opening; and A light source is disposed on the circuit board and housed in the first opening and the second opening, and the light source is in contact with the conductive layer; The first reflective layer and the second reflective layer are stacked within the inner edge of the first opening. The thermal expansion coefficient of the first substrate is greater than that of the first reflective layer. The second substrate is disposed and contacts the side of the first substrate away from the first reflective layer. The thermal expansion coefficient of the first substrate is greater than that of the second substrate.

2. The backlight module according to claim 1, characterized in that, The cover plate further includes a light-emitting area, and the plurality of through holes are located below the light-emitting area.

3. The backlight module according to claim 1, characterized in that, The cover plate further has a reflective area located between the light-shielding area and the light source.

4. A method for manufacturing a backlight module, characterized in that, Include: A circuit board is disposed below a light guide plate, wherein the circuit board includes a first substrate, a second substrate and a conductive layer, the light guide plate has a first opening, and the coefficient of thermal expansion of the first substrate is greater than the coefficient of thermal expansion of the second substrate. Multiple vias are formed on the conductive layer, wherein the conductive layer includes a non-polar region and a polar region, the non-polar region and the polar region are electrically insulated, and the multiple vias are formed in the non-polar region. A first reflective layer is disposed between the light guide plate and the circuit board, such that the first substrate is at least partially in contact with the first reflective layer, and the conductive layer is located between the first substrate and the first reflective layer. The first reflective layer has a second opening opposite to the first opening. The coefficient of thermal expansion of the first substrate is greater than that of the first reflective layer. The second substrate is disposed and contacts the side of the first substrate away from the first reflective layer. Multiple recesses are formed on the first reflective layer to fit into the multiple through holes; A second reflective layer is disposed on the circuit board and is in contact with the first reflective layer. The second reflective layer is located within an inner edge of the first opening, and the first reflective layer and the second reflective layer overlap within the inner edge of the first opening. A light source is disposed on the circuit board and accommodated in the first opening and the second opening, such that the light source is in contact with the conductive layer; and A cover plate is placed above the light guide plate, wherein the cover plate has a light-shielding area opposite to the first opening.

5. The method for manufacturing a backlight module according to claim 4, characterized in that, The cover plate further includes a light-emitting area, and the cover plate is positioned above the light guide plate such that the light-emitting area is located above the plurality of through holes.

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